TWI256877B - Thermal interface material and method of making the same - Google Patents
Thermal interface material and method of making the sameInfo
- Publication number
- TWI256877B TWI256877B TW94112036A TW94112036A TWI256877B TW I256877 B TWI256877 B TW I256877B TW 94112036 A TW94112036 A TW 94112036A TW 94112036 A TW94112036 A TW 94112036A TW I256877 B TWI256877 B TW I256877B
- Authority
- TW
- Taiwan
- Prior art keywords
- thermal interface
- tips
- interface material
- carbon nanotubes
- matrix
- Prior art date
Links
Landscapes
- Carbon And Carbon Compounds (AREA)
Abstract
The present invention discloses a thermal interface material and a method of making the same. The thermal interface material includes a matrix and numbers of carbon nanotubes embedded in the matrix. The matrix includes a first surface and an opposite second surface. The carbon nanotubes extend from the first surface to the second surface, and their tips protrude out of at least one of the two surfaces which has a phase change material layer formed thereon. The tips elastically bend in the phase change material layer. In operation, the elastic tips of carbon nanotubes happen spring so as to form a pressure on surfaces contacting with the tips. This results in a preferable contact between the thermal interfaces and a lower heat resistance. Thus, the thermal interface material can achieve lower heat resistance and high heat-conducting efficiency even though it is subjected to a lower packing pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94112036A TWI256877B (en) | 2005-04-15 | 2005-04-15 | Thermal interface material and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94112036A TWI256877B (en) | 2005-04-15 | 2005-04-15 | Thermal interface material and method of making the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI256877B true TWI256877B (en) | 2006-06-11 |
| TW200637475A TW200637475A (en) | 2006-10-16 |
Family
ID=37614813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94112036A TWI256877B (en) | 2005-04-15 | 2005-04-15 | Thermal interface material and method of making the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI256877B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8764681B2 (en) | 2011-12-14 | 2014-07-01 | California Institute Of Technology | Sharp tip carbon nanotube microneedle devices and their fabrication |
| TWI451541B (en) * | 2006-06-29 | 2014-09-01 | Intel Corp | Method for measuring temperature in a microelectronic integrated circuit package, microelectronic component and computing system |
| US8976507B2 (en) | 2011-03-29 | 2015-03-10 | California Institute Of Technology | Method to increase the capacitance of electrochemical carbon nanotube capacitors by conformal deposition of nanoparticles |
| US9050444B2 (en) | 2007-07-10 | 2015-06-09 | California Institute Of Technology | Drug delivery and substance transfer facilitated by nano-enhanced device having aligned carbon nanotubes protruding from device surface |
| US9115424B2 (en) | 2010-04-07 | 2015-08-25 | California Institute Of Technology | Simple method for producing superhydrophobic carbon nanotube array |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI419274B (en) * | 2008-09-05 | 2013-12-11 | Zhen Ding Technology Co Ltd | Packaging substrate and packaging structure |
| TWI447064B (en) * | 2009-08-10 | 2014-08-01 | Hon Hai Prec Ind Co Ltd | Heat sink structure and system for using the same |
| KR20160002427U (en) | 2013-11-05 | 2016-07-11 | 그라프텍 인터내셔널 홀딩스 인코포레이티드 | A graphite article |
| US10182514B2 (en) | 2016-06-27 | 2019-01-15 | International Business Machines Corporation | Thermal interface material structures |
| US11037860B2 (en) | 2019-06-27 | 2021-06-15 | International Business Machines Corporation | Multi layer thermal interface material |
| US11774190B2 (en) | 2020-04-14 | 2023-10-03 | International Business Machines Corporation | Pierced thermal interface constructions |
-
2005
- 2005-04-15 TW TW94112036A patent/TWI256877B/en active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI451541B (en) * | 2006-06-29 | 2014-09-01 | Intel Corp | Method for measuring temperature in a microelectronic integrated circuit package, microelectronic component and computing system |
| US9028142B2 (en) | 2006-06-29 | 2015-05-12 | Intel Corporation | Integrated microelectronic package temperature sensor |
| US9050444B2 (en) | 2007-07-10 | 2015-06-09 | California Institute Of Technology | Drug delivery and substance transfer facilitated by nano-enhanced device having aligned carbon nanotubes protruding from device surface |
| US9115424B2 (en) | 2010-04-07 | 2015-08-25 | California Institute Of Technology | Simple method for producing superhydrophobic carbon nanotube array |
| US8976507B2 (en) | 2011-03-29 | 2015-03-10 | California Institute Of Technology | Method to increase the capacitance of electrochemical carbon nanotube capacitors by conformal deposition of nanoparticles |
| US8764681B2 (en) | 2011-12-14 | 2014-07-01 | California Institute Of Technology | Sharp tip carbon nanotube microneedle devices and their fabrication |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200637475A (en) | 2006-10-16 |
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