TWI254508B - Thin gate oxide output driver - Google Patents
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1254508 五、發明說明(1) 與相關申請案之對照 [0001]本申請案主張以下美國申請案之優先權:案 號10/317,240,申請日為2002年12月11日。 [0 0 0 2 ]本申請案與下列同在申請中之美國專利中請 案有關,都具有相同的申請日、申請人與發明人。 台灣 申請曰 DOCKETNUMBER 申請案號 92 1 1 75 1 7 92/ 6/27 CNTR:20 0 7可保護縮小驅動元 件之閘極氧化層的 數位電位轉換器 【發明所屬之技術領域】 [0 0 0 3 ]本發明係有關用於耦接至以高電位運作之外 部兀,的縮小驅動元件,尤指一薄氧化層輸出驅動器,其 包括氧化層於高電位不易崩潰之縮小p通道元件,以及不 易產生熱載子注入效應(hot carrier injectiQn 之縮小N通道元件。 【先前技術】 [0 0 0 4 ]隨著積體電路設計和製程技術多年來的發 展,工作電壓有隨著元件尺寸往下調整的趨勢。超大型積1254508 V. INSTRUCTIONS INSTRUCTIONS (1) RELATED TO RELATED APPLICATIONS [0001] This application claims priority to the following U.S. Application Serial No. 10/317,240, filed on Dec. 11, 2002. [0 0 0 2 ] This application is related to the following U.S. patents in the same application, having the same filing date, applicant and inventor. Taiwan Application 曰DOCKETNUMBER Application No. 92 1 1 75 1 7 92/ 6/27 CNTR: 20 0 7 Digital potential converter capable of protecting the gate oxide layer of the reduced drive element [Technical Field of the Invention] [0 0 0 3 The present invention relates to a reduced driving element for coupling to an external cymbal operating at a high potential, and more particularly to a thin oxide output driver comprising a reduced p-channel element whose oxide layer is not easily collapsed at a high potential, and which is less prone to Hot carrier injection effect (reduced N-channel component of hot carrier injectiQn. [Prior Art] [0 0 0 4] With the development of integrated circuit design and process technology over the years, the operating voltage has been adjusted downward with component size. Trend. Super large product
第7頁 1254508 五、發明說明(2)Page 7 1254508 V. Description of invention (2)
UcalinoO h — 2 為',在尺寸與電壓的縮小UcalinoO h — 2 is ', in size and voltage reduction
元件必需___ /居於領先。因此,運作於低電壓的VLSI 面轉接至外部元件,如輸出入(I/O)元件 之類的 而此種元件之缩小藉# 但是,外部元件的並不如VLSI元件那麼大。 因此許多現有的於VLSI元件的核心電壓, β 7百小V L S I 7〇件有挺祉f两、# α么 加I/O信號電壓振幅,使豆可=2電昼轉換電路’以增 元件。 使,、了項利地耦接至高電壓的外部 [0005]近幾年來,VLSI元件 下降,以致於在草此伴、、下^ \ 丁 /、工作電壓都往 &杜夕入& AA ,、二月况下,對於作為耦接至高電壓外邱 二L小p通道元件而言,若同樣的高電位用來 發生閘極氧化層的崩•。由於這二 ^ pa .. 田土縮小,其閘極氧化層變得很薄,所以— 其閘極處於數位電壓範圍之最低電壓(如〇伏 乂、右 :至高電壓(如3. 3伏特)’則源極至閘極、;守源 道至閘極電壓VCG和汲極至閘極電壓VDG ς ^ ’通 閘極氧化層的崩潰電壓,稱為Vbr⑽。 邻都“超過 [〇〇—〇6]例如,現今VLSI元件以018微米製程 因在典型兀件中,閘極氧化層的厚度大約A 知本八技藝者可知,二氧化石夕⑻W的崩潰電壓約為=俠熟 特么/刀(V/CM),而將閘極電壓限制在大約崩产佶 、 之6山〇是恰當的。因此,對於〇 . i 8微米元件而言貝一、百分 的崩潰臨界值V_約為2. 4伏特。〇. 18微米元二—=適當 VDDH.8伏特(相對於接地之〇伏特),戶斤以其邏輯^又運為^於 五 核心電位 發明說明(3) 伏特而邏輯”〇"為0伏特。因此, 極氧化層崩潰的問題。 [〇m]VLSI元件的縮 外部運作於較高電位( 70仵奴皆 (CMOS)元件。直社果(广3.丄伏特)之互補式金 至3. 3伏特,而同時二’將〇. 18微米P通道輸 :补通道70件的閘極氧化層。已知的浐屮: 運作係將位於核心電位的邏輯;出電 I:::到足以導通?通道元件,且高到:: 用的[::』出雖二?電壓縮小電路所提供 碰到相關在三態匯流排施加高電 巧相關的問題,像是當 至低電位時。如此卢、# 、、兀仵破關閉且 疊之-部份閑極氧:;:Γ斤述’與?型汲極 域的氧化層崩潰層被把以過量電壓,因而 峰於^ 0,009 ]另一個問題,則是由於熱載子注 生於Ifg小驅動元件 發生於呈右4- : t 通道部分的問豸。熱載 電壓的重ί::;ΐ和i1閉極氧化層之N通道元 些受限制的載子會改變於乳 低所提供的、電:::應在縮小心道元件 i來排除,但此種方式並不能應 卜,並沒有閘 必、需耦接至 氧半導體 出元件拉高 如此極可能 I縮小電 f至外部元件 電位。此中 止閑極氧化 K;保護,習 壓時,仍會 匯流排被拉 擴散區域重 導致重疊區 入效應而發 子注入效應 件中。在高 化層中。這 件效能與時 中可藉由降 用於縮小驅 五、發明說明(4) 動元件需要耦接至高電壓的情形,因為此時 不能降低。 I捉供的電壓 [0 0 1 0 ]因此所需要的是,提供一種於關閉時可 閘極氧化層崩潰的縮小驅動元件。此外,4需要 = 驅動兀件免於由高電壓重複切換所導致的熱載子注2 應’以使其效能不會與時倶減。 > 【發明内容】 小P通道元 一具有高電 一閘極,可 時,會使第 具有一汲極 間,並具有 有一電位, 縮小P通道 於該輸出節 [0012] 含串接之第 和第二縮小 點,且耦接 源具有'一南 件具有一汲極和一源極,耦接於一 位的高電壓源之間。第一縮小 一拉尚信號’當此拉高信號被拉向高^位 一縮小P通道元件關閉。第二縮小p通 和;源極,耦接於第一節點和 ;,接至-靜態電壓源。此靜心;呈 叮:弟-縮小P通道元件被關閉時 第”、 70件之閑極氧化層崩潰。該N通道元二弟: 點和-參考電壓源之間。、、几件則耦接 本發明提供一輸出驅動電路之 通道元件,接至串接之第包一 於-i:電壓、ΐί 元件輕接於-第-節 電位。該=之間。此第-電壓 二通道70件則耦接於該輪出端和一 [0011]本發明提供一縮小輸出驅動器 包括第-與第二、通道元件和-n通道元件第一其缩 第10頁 1254508 五、發明說明⑸ 一 ί =源之間。“種組態中,第-縮小p通道元件具Components must be ___ / lead. Therefore, the VLSI surface operating at a low voltage is switched to an external component such as an input/output (I/O) component and the like. However, the external component is not as large as the VLSI component. Therefore, many of the existing core voltages of VLSI components, β 7 small V L S I 7 components have quite a f, # α, plus I / O signal voltage amplitude, so that beans can = 2 electric 昼 conversion circuit ' to increase components. In the past few years, the VLSI components have dropped so that they are in the grass, and the operating voltage is going to & Du Xi into & AA In the case of February, the same high potential is used to generate the breakdown of the gate oxide layer as a coupling to the high voltage. As the soil shrinks, the gate oxide layer becomes very thin, so its gate is at the lowest voltage in the digital voltage range (such as 〇 乂, right: to high voltage (such as 3.3 volts)' Then the source to the gate, the source voltage to the gate voltage VCG and the drain to the gate voltage VDG ς ^ 'the breakdown voltage of the gate oxide layer, called Vbr (10). The neighbors are "more than [〇〇 -〇6 For example, today's VLSI components are manufactured in a 018 micron process. In a typical device, the thickness of the gate oxide layer is about A. It is known to those skilled in the art that the breakdown voltage of the dioxide (8) W is about == V/CM), and it is appropriate to limit the gate voltage to approximately 6 〇, which is the collapse threshold of the 〇. i 8 micron component. . 4 volts. 〇. 18 micron two - = appropriate VDDH. 8 volts (relative to the ground volts), the household jin with its logic ^ and shipped to the five core potential invention description (3) volt and logic "〇 " is 0 volts. Therefore, the problem of the collapse of the polar oxide layer. [〇m] The external portion of the VLSI device operates at a higher potential ( 70 仵 slaves (CMOS) components. The direct complement of the fruit (Guangzhou 3. volts) to 3. 3 volts, while the second 'will 〇. 18 micron P channel transmission: 70 channels of gate oxidation Layer. Known 浐屮: The operation system will be at the core potential logic; the power out I::: is sufficient to conduct the channel components, and is as high as:: [::』 is used, although the voltage reduction circuit provides I have encountered problems related to the application of high-tech in the three-state busbars, such as when it is low. So Lu, #,, 兀仵 关闭 且 且 且 叠 叠 叠 叠 部份 部份 部份 部份 部份 部份 部份 部份 部份 部份 部份 部份 部份 部份 部份 部份 部份 部份 部份The oxide layer collapsed with the ?-type bungee domain is biased with an excess voltage, thus peaking at ^ 0,009] Another problem is that the hot carrier is injected into the Ifg small drive element occurs in the right 4-: t channel portion The question of the hot load voltage is :::; ΐ and the n-channel of the i1 closed-pole oxide layer. Some restricted carriers will change in the low-supply, electricity::: should be in the reduction of the heart element i To exclude, but this way can not be met, and there is no gate, need to be coupled to the oxygen semiconductor out of the component to pull up so it is possible to reduce the power f to the outside Element potential. This suspends the idle pole oxidation K; protection, when the pressure is applied, the busbar is still pulled by the diffusion region to cause the overlap zone effect and the hair is injected into the effector. In the high layer, this performance and time Can be used to reduce the drive, the invention description (4) the dynamic component needs to be coupled to the high voltage, because it can not be reduced at this time. I capture the voltage [0 0 1 0] Therefore, what is needed is to provide a The reduced drive element that can break the gate oxide when it is turned off. In addition, 4 needs to be = the drive element is protected from the high-voltage repeated switching caused by the hot carrier Note 2 should be such that its performance will not be reduced with time. < SUMMARY OF THE INVENTION [Summary] A small P channel element has a high power and a gate. When possible, the first phase has a drain and has a potential. The P channel is reduced in the output section [0012] And a second reduction point, and the coupling source has a 'one south member having a drain and a source coupled between the one-bit high voltage source. The first reduction is a pull-up signal 'When this pull-up signal is pulled high, a reduced P-channel component is turned off. The second reduced p-pass; the source, coupled to the first node and ;, connected to the -static voltage source. This meditation; 叮 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 缩小 缩小 缩小 缩小 缩小 缩小 缩小 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The invention provides a channel component of an output driving circuit, which is connected to the first package of the -i: voltage, and the component is lightly connected to the -th node potential. The = first voltage of the second channel 70 Coupling to the wheeled end and a [0011] the present invention provides a reduced output driver comprising first and second, channel elements and -n channel elements, first of which is reduced on page 10, 1254508. 5, invention description (5) Between. "In the configuration, the first-reduced p-channel component
有一 :以接收一拉高信號,而第二縮小Ρ通道元件則I 分別接至一靜態電壓。每一 Ν通道元件具有閑極^ 刀別接收第一和第二拉低信號。 括一 ^01、3^ ^發明提供一積體電路(ic)之實施例,其包 核心電奐器和-縮小驅動元件。該 源和一參考電壓源所界定之-較低電壓 二:::電:轉換器接收第-拉高和拉低信號,並分 信號係操作於一 第二拉高和拉低 元件,轉接於一第— = : =第-和第二縮小p通道 出端之間。縮小驅動元件包於該第一電壓源和一輸 出端和該參考電壓源之間。^通道凡件接於該輸 極,搞接至一靜態電壓,通道元件具有-閘 避免第-縮小Ρ通道元件態電壓具有一電位,可 [〇m]該^^通道極氧化層崩潰。 N通道元件,耦接於該輸:匕合串接之第-和第二縮小 一縮小N通道元件具有一門搞而、和—參考電壓源之間。該第 第二縮小N通道元件則具右丄以接收第二拉低信號,而該 [0015]本發明之其—閘極以接收第一拉低信號。 說明書的其餘部分和圖干&特敛、利益及優點,在參閱本 α不後’將可更加清楚。One: to receive a pull-up signal, and the second to narrow-channel component I is connected to a static voltage. Each of the channel elements has an idle pole that receives the first and second pull down signals. Including a ^01, 3^^ invention provides an embodiment of an integrated circuit (ic) that includes a core driver and a reduced drive component. The source and a reference voltage source are defined - a lower voltage two::: electricity: the converter receives the first pull-up and pull-down signals, and the split signal system operates on a second pull-up and pull-down component, and the switch In the first - = : = between the first and the second narrow p channel. The reduced drive component is packaged between the first voltage source and an output and the reference voltage source. ^ Channel is connected to the input, connected to a static voltage, and the channel element has a - gate to avoid the first-reduced Ρ channel element state voltage has a potential, which can [〇m] the ^ ^ channel pole oxide layer collapse. The N-channel component is coupled to the input: the first and the second reduction of the series connection, and the reduction of the N-channel component has a gate and a reference voltage source. The second reduced N-channel component has a right chirp to receive a second pull-down signal, and the gate of the present invention receives the first pull-down signal. The rest of the description and the enthusiasm, benefits and advantages of the drawings will be more clearly seen in the reference to this article.
12545081254508
五、發明說明(6) 【實施方式】 [〇 〇 2 1 ]以下的說明,係在一特定實施例及其必要條 t Γ脈絡下而提供,可使一般熟習此項技術者能夠利用本 毛月然而’各種對該較佳實施例所作的修改,對熟習此 項技術者而言乃係顯而易見,並且,在此所討論的二般原 理亦可應用至其他實施例。因此,本發明並不限於此處 所展示與敘述之特定實施例,而是具有與此處所揭露之原 理與新穎特徵相符之最大範圍。、V. DESCRIPTION OF THE INVENTION (6) [Embodiment] [〇〇2 1 ] The following description is provided in the context of a specific embodiment and its necessary strips, so that those skilled in the art can utilize the present hair. However, various modifications to the preferred embodiment are apparent to those skilled in the art, and the principles discussed herein may be applied to other embodiments. Therefore, the invention is not limited to the specific embodiments shown and described herein. ,
一 [0 0 2 2 ]本案發明人已注意到,有需要使用縮小驅動 =件’其須具有高輸出電壓,如驅動三態(tri—state)匯 流排此類元件所使用的,但又不能容許高輸入電位,這些 電2係於元件關閉時施加於其重疊之閘極部分。發明人亦 /主思到’有需要避免縮小N通道驅動元件於高電壓的重複 切換下所產生之熱載子注入效應。因此,發明人提出一種 縮小驅動兀件’其包括一拉高(pu 1卜up)部分,於關閉時 不易於高電位產生閘極氧化層崩潰;其亦包括一拉低 (pull-down)部分,於高電壓的重複切換時不易產生熱載 子注入效應,如下文圖一至圖四的部份所述。 [0 0 2 3 ]圖一係為包含有一核心電路丨〇1、一電壓轉換 電路1 0 3、一縮小驅動元件丨〇 5及一,’外部,,元件丨〇 7之系統 100的簡化方塊圖。核心電路1〇1係經由第一電壓源〇儿接 收功率’此第一電壓源信號具有相對於共同或參考電壓源 信號REF之一電位或電壓量,而參考電壓源信號REF亦被送[0 0 2 2 ] The inventor of the present invention has noticed that there is a need to use a reduced drive = piece 'which must have a high output voltage, such as driving a tri-state bus bar for such components, but not A high input potential is allowed, which is applied to the overlapping gate portions when the component is turned off. The inventor also thought that there is a need to avoid shrinking the hot carrier injection effect of the N-channel driving element under repeated switching of high voltage. Therefore, the inventors propose a reduction drive member that includes a pull-up portion that does not easily generate a gate oxide breakdown at high potential when closed; it also includes a pull-down portion The hot carrier injection effect is not easily generated at the repeated switching of high voltage, as described in the following figures 1 to 4. [0 0 2 3 ] FIG. 1 is a simplified block of a system 100 including a core circuit 丨〇1, a voltage conversion circuit IO3, a reduced drive element 丨〇5, and an 'external' component 丨〇7. Figure. The core circuit 101 receives power from the first voltage source. The first voltage source signal has a potential or voltage relative to the common or reference voltage source signal REF, and the reference voltage source signal REF is also sent.
第12頁 五、發明說明(7) 至核心電路101。一功率源或電壓源(圖中未顯示)產生一 來源電壓於VDDL和REF之間。VDDL和REF共同決定第一或較 低電壓範圍(VDDL-REF),便於提供功率給核心電路1〇1内 的70件。核心電路1 0 1產生一或多個邏輯信號或數位信 號’以提供給一或多個電位轉換電路丨03之各別輸入端。 此處、數位π是指元件以類似一開關的方式運作,此開關 具有多個分離的操作點,各操作點係關聯於不同的邏輯狀 態且/或電位。 [0 0 2 4 ]在前述實施例中,核心電路丨〇 1設定一拉高信 號PU和一拉低信號PD,以送至電壓轉換電路1〇3之各別輸 入端。PU和PD信號係用來驅動一外部三態匯流排至三種狀 悲之一,此三種狀態包括一高邏輯狀態(於ρυ信號設定 時)’ 一低邏輯狀態(於PD信號設定時),及一第三狀態(當 PU與PD信號皆未設定時)。PU和PD信號各自皆有位於或接 近REF電位之第一邏輯狀態,以及位於或接近VDDL電位之 苐一邏輯狀態。這些邏輯狀態通常被稱為邏輯壹或、、1 以及邏輯零或、、〇 ” 。此處正邏輯或負邏輯皆可採用,因 此任一個邏輯狀態1或〇都可能對應到REF或VDDL。電壓轉 換電路103耦接至VDDL和REF,可提供功率給内部的數位電 路,以致能PU與PD信號之邏輯狀態的偵測,下文會進一步 說明。 [0 0 2 5 ]電壓轉換電路1 〇 3設定一對邏輯信號或數位 信號PUPB和PDN,其係送入縮小驅動元件1〇5各別的輸入 端。PUPB信號係反映pu信號的邏輯狀態,而pdn信號則反Page 12 V. Description of the invention (7) to the core circuit 101. A power or voltage source (not shown) produces a source voltage between VDDL and REF. VDDL and REF together determine the first or lower voltage range (VDDL-REF) to provide power to 70 of the core circuit 1〇1. The core circuit 101 generates one or more logic signals or digital signals 'to provide respective inputs to one or more of the potential conversion circuits 丨03. Here, the digit π means that the component operates in a manner similar to a switch having a plurality of separate operating points, each operating point being associated with a different logic state and/or potential. [0 0 2 4 ] In the foregoing embodiment, the core circuit 丨〇 1 sets a pull-up signal PU and a pull-down signal PD to be supplied to respective input terminals of the voltage conversion circuit 1〇3. The PU and PD signals are used to drive an external tri-state bus to one of three modes, including a high logic state (when the ρυ signal is set), a low logic state (when the PD signal is set), and A third state (when neither PU nor PD signals are set). The PU and PD signals each have a first logic state at or near the REF potential and a first logic state at or near the VDDL potential. These logic states are commonly referred to as logic 壹 or , , , and logic zero or , 〇 ”. Here either positive or negative logic can be used, so any logic state 1 or 〇 may correspond to REF or VDDL. The conversion circuit 103 is coupled to VDDL and REF to provide power to the internal digital circuit to enable detection of the logic states of the PU and PD signals, as further described below. [0 0 2 5 ] Voltage Conversion Circuit 1 〇 3 Setting A pair of logic signals or digital signals PUPB and PDN are sent to the respective input terminals of the reduced drive elements 1 to 5. The PUPB signal reflects the logic state of the pu signal, while the pdn signal is inverted.
第13頁 五、發明說明(8) 映PD #號的邏輯狀態。需注意的是,此處"B„附加在信號 名稱或輸入/出(I/O)接腳後’係表示邏輯上的否定,代表 ,反相或互補的信號或I /〇接腳具有相反的邏輯狀離。例 如,PUPB信號是PUP信號的邏輯互補信號(圖中未顯示), 而PUP信號則具有與PU信號相同的邏輯狀態。由於⑼”信 號控制P通道元件,其可能被組態為具有如pu信號的 邏輯狀態。Page 13 V. Invention Description (8) The logical state of the PD ##. It should be noted that here "B„ is appended to the signal name or the input/output (I/O) pin' to indicate a logical negation, representing, inverting or complementary signal or I/〇 pin has The opposite logic is. For example, the PUPB signal is a logically complementary signal of the PUP signal (not shown), and the PUP signal has the same logic state as the PU signal. Since the (9) signal controls the P-channel component, it may be grouped. The state is a logic state with a signal such as pu.
4 %小驅動兀件105係轉接於第二電壓源VDDH “ 一 a ’而此兩者決定了第二或高電壓範圍(VDDH_ 々VDDH * RFfV p广或電壓源(圖中未顯示)產生-來源電壓 於VDDH和REF之間。VDDH的大小比”儿高,盥 :的=範圍也比與VDDL相關的第-電壓範圍來得 ΐ負ΐ^ΓΓ·™Η兩者皆為正,不過本發明則使 用負電/1源。%小驅動元件1〇5產生一邏 出信號0DS給耦接至VDDH和REF之外部元件} 广5 輸 |〇〇27] 0DS信號運作於第二電壓 具有第一和第二邏輯狀離〇盥丨,i 圓此電£乾圍 ,的電位。由於正邏“負1邏輯皆各可自:用電,位4係:為/_或 狀悲1或0都可能會對應到REF或VDDH ^固邏輯 核心電路1()1而言是屬於 =件107相對於 具 第二狀悲,當其並未被設定至邏輯〇或丨狀自t ^ ’、 如,若PUPB被拉高而ΡηΜ ; κ 7 利次1狀恶%。例 出為第三狀:皮拉低:則縮小驅動元件m的輪 έ將0DS # 5虎設定至邏輯狀態〇或The 4% small driving element 105 is switched to the second voltage source VDDH "a" and the two determine the second or high voltage range (VDDH_ 々 VDDH * RFfV p wide or voltage source (not shown) - The source voltage is between VDDH and REF. The size ratio of VDDH is higher than the range of the voltage range that is higher than the range of voltages associated with VDDL. Both ΐ^ΓΓ·TMΗ are positive, but this The invention uses a negative/1 source. The % small drive element 1〇5 generates a logic signal 0DS for the external components coupled to VDDH and REF} 宽5 〇〇 〇〇 27] 0DS signal operates at the second voltage with the first And the second logic is away from the 〇盥丨, i round this electric charge, the potential of the power. Because the positive logic "negative 1 logic can be from: electricity, bit 4: for /_ or sorrow 1 or 0 May correspond to REF or VDDH ^ solid logic core circuit 1 () 1 is a = 107 relative to the second form of sadness, when it is not set to logic 丨 or 丨 shape from t ^ ', eg, If PUPB is pulled high and ΡηΜ; κ 7 is less than 1%. The example is the third shape: Pila low: the rim of the drive element m is reduced to set the 0DS #5 tiger to the logic state〇
第14頁 J254508 五、發明說明(9) (如;:排2兀件i Μ可能包含其他的驅動器或類似元件 、如匯流排驅動哭,闰山丄 丨丁 輪出為第三狀離時,回未顯示),當縮小驅動元件105的 0的信號設定為邏輯二=提供的驅動器皆可能另外將 杜彳n R—、科狀悲0或1。以這種方式,縮小驅動元 输 70件可能於幾種情形下暴露於高電位,像是當 縮::動:件105的輸出為第三狀態,而0DS信號被 π件拉低時。 1 ρπ b在運作上,會希望將核心電路101所設定之 ’、仏狁的^邏輯貢訊,經由ODS信號傳送至外部元件 ;PnM?tPD信號藉由電壓轉換電路103,分別轉換成PUPB 和PDN#號。縮小驅動元件1〇5傳送pupB*pDN信號之邏輯 =至ODS信號。外部元件1〇7在設計上,係利用電位定義 =弟二電壓範圍VDDH-REF内之邏輯信號來運作,此高電壓 乾圍VDDH-REF大於第一或較低電壓範圍VDDL —ref。因此, 外部兀件107必須被驅動至高於pu與抑信號的電位,以便 於邏輯切換。VDDH被送至電位轉換電路1〇3與縮小驅動元 件1 05 ’使該兩者能運作在此高電麼範圍内。縮小驅動元 件105配合PUPB與PDN信號的切換,在整個高電壓範圍内切 換ODS信號,以驅動外部元件丨〇7的輸入端。 [ 0029 ] PUPB信號操作於以VDDH電位為基礎的電壓轉 換範圍内,且適合驅動縮小驅動元件1〇5的輸入端。此 壓轉換範圍並未涵蓋整個高電壓範圍,因此ρϋρΒ信號3 一 電壓轉換數位信號。尤其,電壓轉換電路1〇3會在人於一 中間電位(ΙΝΤ)和VDDH電位間的電壓轉換範圍,來=換一Page 14 J254508 V. Description of invention (9) (eg;: row 2 element i Μ may contain other drivers or similar components, such as bus line drive crying, when the mountain is out of the third position, Back to not shown), when the signal of the 0 of the reduced drive element 105 is set to logic two = the provided driver may additionally be a rhododendron, or a sorrow of 0 or 1. In this manner, the reduced drive element 70 may be exposed to a high potential in several situations, such as when the output of the member 105 is in the third state and the 0DS signal is pulled low by the π element. 1 ρπ b is in operation, it is desirable to transmit the logical tribute set by the core circuit 101 to the external component via the ODS signal; the PnM?tPD signal is converted into PUPB by the voltage conversion circuit 103, respectively. PDN# number. The reduced drive element 1〇5 transmits the logic of the pupB*pDN signal to the ODS signal. The external component 1〇7 is designed to operate with a logic signal within the potential definition = PMOS voltage range VDDH-REF, which is greater than the first or lower voltage range VDDL - ref. Therefore, the external element 107 must be driven to a potential higher than the pu and the assertion signal to facilitate logic switching. VDDH is supplied to the potential conversion circuit 1〇3 and the reduced drive element 105' to enable the two to operate within this high voltage range. The reduced drive element 105 cooperates with the switching of the PUPB and PDN signals to switch the ODS signal over the entire high voltage range to drive the input of the external component 丨〇7. [0029] The PUPB signal operates within a voltage conversion range based on the VDDH potential and is suitable for driving the input terminal of the reduced drive element 1〇5. This voltage conversion range does not cover the entire high voltage range, so the ρϋρΒ signal 3 - voltage converts the digital signal. In particular, the voltage conversion circuit 1〇3 will have a voltage conversion range between an intermediate potential (ΙΝΤ) and a VDDH potential, and
睡 第15頁 1254508 五、發明說明(10) PUPB信號。INT電位的大小高於REF,並且其值之選取是要 使電壓轉換範圍VDDH-I NT不會超出縮小驅動元件105内之 縮小P通道元件的崩潰電壓。更具體來說,當PUPB信號被 驅動至INT電位時,ODS信號可被驅動至VDDH的電位,而不 會在縮小驅動元件1 〇 5之P通道元件導通時,造成其閘極氧 化層崩潰的危險。 [0 0 3 0 ]此處提出P D N信號的幾個實施例。一般而 言,PDN信號被送至縮小驅動元件1 〇5内之至少一N通道元 件,其中縮小驅動元件1 0 5係作為一拉低元件。在一實施 例中,當PDN信號被拉高時,〇DS信號被拉低,而當PDN信 號被拉低時,ODS信號為第三狀態或被拉高,係依PUPB信 號之狀態而定。PDN信號可運作整個VDDH-REF的高電壓範 圍。如下文會進一步說明的,PDN信號可包含多個信號或 與另一 5虎結合,以某種方式使一或多個N通道元件降低 或消除熱載子注入效應。這對具有短通道和薄閘極氧化層 的縮小N通道元件特別有利。 [0 0 3 1 ]在一實施例中,電壓轉換電路丨〇 3係依照一 相關的美國專利申請案(Docket CNTR· 20 0 7 )來實施,其標 題為DIGITAL LEVEL SHIFTER FOR MAINTAINING GATE OXIDE INTEGRITY OF SCALED DRIVER DEVICES,該案和本 申睛案具有相同的申晴曰、申請人與發明人,此處納入。 在納入的相關申請案中所描述之數位電位轉換器,其提高 邏輯0的電位’以用於一高電壓輸出驅動器的輸入端。使 用相關申請案之數位電位轉換器具有幾個效益。第一,此Sleep Page 15 1254508 V. Invention Description (10) PUPB signal. The magnitude of the INT potential is higher than REF, and its value is selected such that the voltage conversion range VDDH-I NT does not exceed the breakdown voltage of the reduced P-channel component in the reduced drive element 105. More specifically, when the PUPB signal is driven to the INT potential, the ODS signal can be driven to the potential of VDDH without causing the gate oxide layer to collapse when the P-channel component of the driving element 1 〇5 is turned on. Danger. [0 0 3 0 ] Several embodiments of the P D N signal are presented herein. In general, the PDN signal is sent to at least one N-channel component within the reduced drive component 1 , 5, wherein the reduced drive component 105 is used as a pull-down component. In one embodiment, the 〇DS signal is pulled low when the PDN signal is pulled high, and the ODS signal is pulled to the third state or pulled high when the PDN signal is pulled low, depending on the state of the PUPB signal. The PDN signal can operate over the high voltage range of VDDH-REF. As will be further explained below, the PDN signal can include multiple signals or be combined with another 5 Tiger to somehow reduce or eliminate hot carrier injection effects in one or more N-channel components. This is particularly advantageous for reduced N-channel components having short channels and thin gate oxide layers. [0 0 3 1 ] In one embodiment, the voltage conversion circuit 丨〇 3 is implemented in accordance with a related US patent application (Docket CNTR 207), entitled DIGITAL LEVEL SHIFTER FOR MAINTAINING GATE OXIDE INTEGRITY OF SCALED DRIVER DEVICES, which has the same Shen Qingyi, applicant and inventor, is included here. The digital potential converter described in the incorporated application incorporates the potential of a logic zero for the input of a high voltage output driver. The digital potential converter using the relevant application has several benefits. First, this
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五、發明說明(11) 數位電位轉換器完全以數位元 中’如下文所進一步說明的。第内_入:一個積體電路(ic)V. INSTRUCTIONS (11) The digital potential converter is fully described in the 'bits' as explained below. Intra-in: an integrated circuit (ic)
幾個操作於所選定之電壓範圍U位電位轉換器提供 #uPDN^ .. , ^ Ab 4 τ乾W中的^娩,以共同執行PUPB 聞彳。旒的功能,如下文所進—步說明的。 L 〇 0 3 2 ]然而要注意的是,雷 何適用的電壓轉換電路來實施轉換。電路103可依照任 可依照使用類比與數位電路的習^ ^壓轉換電路103 在i古插卜主r ^ ]白用電壓轉換電路來實施。 雷故 ^ -r* 產生邏輯上的偏壓給數位 電路。然而,類比元件體積大且耗 3 1 件的應用,因此需分開且/或於外部實作。 [00曰33] >前所述’積體電路設計和製程技術的進 ^使传工作電壓隨著元件尺寸縮小而往下調整。例如, 核心電路1〇1可能是整合進一顆1C的 亡夕处收" 频i L的VLS I兀件,而我們希 差此將此顆1C直接耦接到外部元件丨〇7。在一 , 電壓轉換電路103係、實作為上述所納入美國#利申請案之 數位轉換電路,而數位轉換電路1〇3和縮小驅動元件1〇5皆 整合進相同的I c 1 0 9,如同核心電路丨〇 i。再者,核心電 路101、電位轉換電路103和縮小驅動元件1〇5皆使用相同 的電路縮小技術來實作,可使構成這些電路的\通道與p通 道元件都具有相當薄的閘極氧化層。以此方式,IC 1 〇 g包 括了數個外部的來源接腳或端子,用以耦接至個別的電壓 源’如圖所示。 [〇 〇 3 4 ]值得注意的是,本發明並不限於前述的實施Several U-potential converters operating in the selected voltage range provide #uPDN^.. , ^ Ab 4 τ dry W in the W, to jointly perform the PUPB. The function of 旒 is described in the following paragraphs. L 〇 0 3 2 ] However, it should be noted that the applicable voltage conversion circuit is used to implement the conversion. The circuit 103 can be implemented in accordance with the analog voltage conversion circuit 103 using analog and digital circuits. Thunder ^ -r* generates a logical bias to the digital circuit. However, analog components are bulky and consume 31 components and therefore need to be separated and/or externally implemented. [00曰33] > The previously described 'integrated circuit design and process technology' make the transmission voltage down as the component size shrinks. For example, the core circuit 1〇1 may be a VLS I component integrated into a 1C's sequel to the frequency I L, and we would like to directly couple this 1C to the external component 丨〇7. In one, the voltage conversion circuit 103 is implemented as the digital conversion circuit incorporated in the above-mentioned U.S. application, and the digital conversion circuit 1〇3 and the reduced drive element 1〇5 are integrated into the same I c 1 0 9, The core circuit 丨〇i. Furthermore, the core circuit 101, the potential conversion circuit 103, and the reduced drive element 1〇5 are all implemented using the same circuit reduction technique, so that the \channel and p-channel elements constituting these circuits have a relatively thin gate oxide layer. . In this manner, IC 1 〇 g includes several external source pins or terminals for coupling to individual voltage sources as shown. [〇 〇 3 4 ] It is worth noting that the present invention is not limited to the foregoing implementation.
1254508 五、發明說明(12) 例丄亦即電壓轉換電路丨〇3和縮小驅動元件1〇5 程貫作且/或在同一顆ic上,如同核心電路101。實=衣 :個電路可以分開實作,而不會脫離本發明的精神;:範 圍。例如,若電壓轉換電路1〇3是以習用的方法 =能實作在IC 109上,或者至少會包含在IC、i〇9上叮所 ::=供之類比部分。不過,以類似的製造技 或製造在同一顆K上,有明顯的優點,就:Ϊ 悉本技藝者所熟知的。 ^ 3热 [ 00 3 5 ]在一更具體的實施例中,lc 米製程製造咖元件,其包括具有厚度約4〇二? 氧:導體⑽)元件。例如,核心電路;(Π可能Ϊ =處理=,需要將尺寸和電壓做最大程度的縮小。 的閑極氧化層崩潰電大約為“伏 imr 而言,—般為u伏特,卿-般是〇 ΐί”;既;:於核心電路101之最大電位低於崩潰 電壓甚多,就不需擔心氧化層會崩潰。 [0 0 3 6 ]在此具體實施例中,外% 的c:元件,所以彻是。伏特時,二^ ί ::田Γ、驅動元件105包括〇.18微米的P通道與N通 路103使PUPB信號運作於大約u 。凡。電壓轉換電 W約為U伏特。在此具體實施::和3:二特之間,而 2. 3伏特,因為整合於IC i 09之縮 電堅轉換鞄圍約為 元件的閘極不會降至m伏特以H、f動兀件105的P通道 既然2. 3伏特低於崩潰1254508 V. INSTRUCTION DESCRIPTION (12) For example, the voltage conversion circuit 丨〇3 and the reduced drive element 1〇5 are processed and/or on the same ic as the core circuit 101. Real = clothing: a circuit can be implemented separately without departing from the spirit of the invention;: range. For example, if the voltage conversion circuit 1〇3 is implemented on the IC 109 in a conventional manner, or at least included in the IC, i〇9, the ::= for analogy. However, with similar manufacturing techniques or manufacturing on the same K, there are significant advantages: Ϊ are well known to those skilled in the art. ^ 3 Heat [00 3 5 ] In a more specific embodiment, the lc meter process manufactures a coffee element that includes a thickness of about 4 〇 2? Oxygen: conductor (10)) component. For example, the core circuit; (Π Ϊ = processing =, the size and voltage need to be minimized. The idle oxide layer collapses electricity is about "volts irr, - u volt, qing - is 〇 Ϊ́ί"; both;: The maximum potential of the core circuit 101 is much lower than the breakdown voltage, there is no need to worry that the oxide layer will collapse. [0 0 3 6 ] In this embodiment, the outer % of the c: component, so The volts, the volts, the ^, 驱动, the drive element 105 include the 18.18 micron P channel and the N path 103 to operate the PUPB signal at approximately u. The voltage conversion power W is approximately U volts. Specific implementation:: and 3: between two special, and 2.3 volts, because the integration of the IC i 09 is reduced, the gate of the component is not reduced to m volts to H, f moving components 105 P channel since 2. 3 volts below crash
第18胃 1254508 五、發明說明(13) "" ' ' ' · — 電壓VBRGX(約2.4伏特),縮小p通道元件於導通時幾乎就不 會有閘極氧化層崩潰的風險。如下文進一步所述,縮小驅 動元件105係組態為在元件導通且〇DS信號拉至〇伏特時, 避免類似閘極氧化層崩潰的狀況。18th stomach 1254508 V. Invention description (13) "" ' ' ' · — Voltage VBRGX (about 2.4 volts), there is almost no risk of breakdown of the gate oxide layer when the p-channel component is turned on. As further described below, the reduced drive element 105 is configured to avoid conditions like a gate oxide collapse when the component is turned on and the 〇DS signal is pulled to 〇V.
[0 0 3 7 ]圖二為依據先前技術實施之習用縮小驅動元 件2 0 〇的詳細示意圖。此習用縮小驅動元件2 〇 〇係用以說 明’若其作為圖一之縮小驅動元件丨〇 5,所會產生之閘極 氧化層崩潰的問題。縮小驅動元件2〇〇包括一p通道元件 201,其汲極2 0 5耦接至一對應的N通道元件2 0 3。汲極205 會形成ODS信號。p通道元件2〇1包括一p型基底2〇7、一N型 井區域(N-WELL) 20 9以及一對P型擴散區域(P+) 211和213。 一閘極絕緣層215位於N型井區域20 9上方,並與p型區域 2 11和2 1 3分別重疊於重疊區域2 1 2和2 1 4,如圖所示。汲極 20 5和源極219分別連接至P型區域2 11和213,而閘極221則 連接至閘極絕緣層2 1 5。一 N型區域(N + ) 2 2 3位於N型井區域 209上,而且有一 N型井端子225連接到N型井區域 223 °VDDH耦接至源極219和N型井端子22 5 °PUPB信號被送 至閘極221,而PDN信號則被送至N通道元件2 0 3 〇PUPB和 PDN信號合力控制習用的縮小驅動元件2〇〇,以驅動0DS信 號進入三種狀態其中之一,如前述對三態元件所定義的。 [0 0 38 ]如前所述,PUPB信號係由電壓轉換電路1 〇3 提供,並維持在VDDH-I NT的電壓轉換範圍内。此電壓轉換 範圍可防止送至閘極2 21之導通電壓降低至會損壞閘極層 2 1 5之氧化層的電位,而此種損壞係由於過大的源極至閘[0 0 3 7] FIG. 2 is a detailed schematic diagram of a conventional reduced drive element 20 〇 according to the prior art implementation. This conventional reduction of the driving element 2 is used to illustrate the problem that if the gate electrode layer 5 is reduced as the driving element 图 5 of Fig. 1, the gate oxide layer collapses. The reduced drive element 2A includes a p-channel element 201, the drain of which is coupled to a corresponding N-channel element 203. The drain 205 will form an ODS signal. The p-channel element 2〇1 includes a p-type substrate 2〇7, an N-type well region (N-WELL) 20 9 and a pair of P-type diffusion regions (P+) 211 and 213. A gate insulating layer 215 is located over the N-well region 209 and overlaps the p-type regions 2 11 and 2 1 3 with the overlap regions 2 1 2 and 2 1 4, respectively, as shown. The drain 20 5 and the source 219 are connected to the P-type regions 2 11 and 213, respectively, and the gate 221 is connected to the gate insulating layer 2 15 . An N-type region (N + ) 2 2 3 is located on the N-well region 209, and an N-type well terminal 225 is connected to the N-well region 223 ° VDDH is coupled to the source 219 and the N-well terminal 22 5 °PUPB The signal is sent to the gate 221, and the PDN signal is sent to the N-channel component 2 0 3 〇PUPB and the PDN signal is used to control the conventional reduced drive component 2〇〇 to drive the 0DS signal into one of three states, as described above. Defined for three-state components. [0 0 38] As described above, the PUPB signal is supplied from the voltage conversion circuit 1 〇3 and maintained within the voltage conversion range of VDDH-I NT. This voltage conversion range prevents the turn-on voltage supplied to the gate 2 21 from being lowered to the potential of the oxide layer of the gate layer 2 15 , which is due to an excessive source to gate.
第19頁 1254508 〜 -----—--- - 五、發明說明(14) " " ------- 極或通道至閘極電壓所導致。不過,汲極2〇5可被任何所 耦接的元件(如外部元件丨〇7或任何其他圖未顯示的匯流排 疋件)或甚至N通道元件2〇3拉低至REF電位。當汲極2〇5被 拉至REF電位的同時,若PUPB信號被設定至高電位vddh而 使P通道元件201關閉,則重疊區域212承受了高電位 (JDDH-REF)。此高電位會導致重疊區域212中之氧化層崩 潰,即使閘極絕緣層215之大部分閘極氧化層只會看^^型 井2 0 9的電位,其與閘極221的電位一樣是VDDfi[。 » [ 0 0 3 9 ]圖三為依據本發明實施之縮小驅動元件3〇〇 的範例電路圖。縮小驅動元件3〇〇可作為圖一之縮小驅動 兀件105,以避免閘極氧化層崩潰。ρυρΒ信號被送至一第 P通道兀件P2的閘極。P2的源極耦接至VDDH而?2的汲極 則耦接至一節點301,節點3〇1亦耦接至一第二?通道元件 P1的源極。P通道元件P1與P2的N型井都耦接到vddh。” 閘極耦接到一靜態電壓(sv),而?1的汲極和N通道元件Μ] 於、、中間即點3 0 3耦接,此中間節點3〇3可形成〇DS信號。 通這元件20 3接收PDN信號,並受PDN信號所控制。 欣點^1〇4〇]如圖所示,P1係以串接的組態,與P2耦接於 即,其中P1的閘極連接至具有一靜態電位之sv。 電位係一選取之適當電位’以使ρι的汲極被外部元 或可能是N通道元件2〇3拉低至〇伏特時,變成導通 r悲。當P1的源極電壓降到一保護電位(PVL)時,P1便 始關閉。此保護電位定義為靜態電位(sv)與一臨界電位^ (TL)之和,如PVL = SV + TL。當pupB信號被拉低時,的 1254508 五、發明說明(15) 串接電路組態如一拉高元件般運作而拉高〇Ds 護P1和P2兩者的輸出端免於承受過高的閘極 ^並保 對VDDH約3. 3伏特而REF約〇伏特之〇. 18微米製化層_電壓。 言’所選取之S V具有约1伏特之靜態電位。 、元件而 [ 0 04 1 ]當PUPB信號被拉高而使?2關閉時, 通。當ODS信號被拉低,像是降到REF電位(如 \導 節點301 (P2的汲極和pi的源極)放電,並 、盼, 位PVL。對則1伏特而腳約〇伏特之 臣品界電位約0.5伏特,以使節點3〇1被拉低至約ι而。,Page 19 1254508 ~ --------- - V. Invention Description (14) "" ------- Extreme or channel to gate voltage. However, the drain 2〇5 can be pulled down to the REF potential by any coupled component (e.g., external component 丨〇7 or any other busbar component not shown) or even N-channel component 2〇3. While the drain 2〇5 is pulled to the REF potential, if the PUPB signal is set to the high potential vddh and the P channel element 201 is turned off, the overlap region 212 is subjected to a high potential (JDDH-REF). This high potential causes the oxide layer in the overlap region 212 to collapse, even though most of the gate oxide layer of the gate insulating layer 215 only looks at the potential of the well 2, which is the same as the potential of the gate 221 is VDDfi. [. » [0 0 3 9] FIG. 3 is an exemplary circuit diagram of the reduced drive element 3A implemented in accordance with the present invention. The reduction of the driving element 3 can be used as the reduction driving element 105 of Fig. 1 to avoid the collapse of the gate oxide layer. The ρυρΒ signal is sent to the gate of a P-channel element P2. Is the source of P2 coupled to VDDH? The pole of 2 is coupled to a node 301, and the node 3〇1 is also coupled to a second? The source of channel element P1. The N-wells of P-channel components P1 and P2 are coupled to vddh. The gate is coupled to a static voltage (sv), and the drain of the ?1 and the N-channel component are coupled to the center, that is, the point 3 0 3 , and the intermediate node 3〇3 can form the 〇DS signal. This component 20 3 receives the PDN signal and is controlled by the PDN signal. Happen point ^1〇4〇] As shown in the figure, P1 is connected in series with P2, where the gate of P1 is connected. To a sv with a static potential. The potential is chosen to be the appropriate potential' so that the 汲 of the ρι is turned down to 〇V by the external element or possibly the N-channel element 2〇3, becoming a conduction r. When the source of P1 When the pole voltage drops to a protection potential (PVL), P1 is turned off. This protection potential is defined as the sum of the static potential (sv) and a critical potential ^ (TL), such as PVL = SV + TL. When the pupB signal is pulled Low time, 1254508 V. Invention description (15) The serial circuit configuration works as a pull-up component and pulls the output of both D1 and P2 to avoid excessively high gates and protects against VDDH. About 3. 3 volts and REF about 〇 volts. 18 micron layer _ voltage. The selected SV has a static potential of about 1 volt. Components and [ 0 04 1] When the PUPB signal is pulled high and ?2 is turned off, it is turned on. When the ODS signal is pulled low, it is like dropping to the REF potential (such as the conduction node 301 (P2's drain and pi source) discharge, and Hope, bit PVL. For 1 volt and the foot of the volts, the product potential is about 0.5 volts, so that the node 3〇1 is pulled down to about ι.
^為π的閘極維持在sv信號的電位,節點3()1只能放電至 PVL的電位,以致於當P1的源極達到pvL時,ρι合 至 閉。當P1關閉時,P1與P2的串接組態可保護p2曰。哥 極連到高電壓源VDDH,且當Ρ2關閉時,Ρ2的閘極電位亦原為 V D D Η。然而,在ρ 2關閉時,ρ 2的汲極只會降到保護電位… PVL。以此種方式,可知SV的選取,是用來在ρ2關閉時, 防^其閘極氧化層的崩潰。Ρ1亦可免於承受過大的氧化層 電壓,此因pi只會承受一閘極至汲極電壓Vgd(sv—REF),; 對0· 18微米製程而言,當sv約1伏特且REF約〇伏特時,sV REF即約為1伏特。 〇 [ 0 0 4 2 ]圖四為依據本發明之另一實施例實作之縮小 $動7L件40 0的電路圖,其中縮小驅動元件4〇〇係耦接至電 =轉換電路1 〇 3之一示範實施例。縮小驅動元件4 〇 〇可另外 ^為圖一之縮小驅動元件1 〇 5,以防止閘極氧化層崩潰及 …载子注入效應。圖四中與縮小驅動元件3 〇〇所用元件類^ The gate of π is maintained at the potential of the sv signal, and the node 3()1 can only be discharged to the potential of PVL, so that when the source of P1 reaches pvL, ρ is closed to close. When P1 is turned off, the serial configuration of P1 and P2 protects p2曰. The gate is connected to the high voltage source VDDH, and when Ρ2 is turned off, the gate potential of Ρ2 is also V D D Η. However, when ρ 2 is turned off, the drain of ρ 2 will only drop to the protection potential... PVL. In this way, it can be seen that the selection of SV is used to prevent the collapse of the gate oxide layer when ρ2 is turned off. Ρ1 can also be protected from excessive oxide voltage, because pi will only withstand a gate to drain voltage Vgd (sv-REF); for 0. 18 micron process, when sv is about 1 volt and REF is about At volts, sV REF is about 1 volt. 〇 [ 0 0 4 2 ] FIG. 4 is a circuit diagram of a reduction of the moving 7L piece 40 0 according to another embodiment of the present invention, wherein the reduced driving element 4 is coupled to the electric=conversion circuit 1 〇3 An exemplary embodiment. Reducing the drive element 4 〇 〇 can additionally reduce the drive element 1 〇 5 for Figure 1 to prevent gate oxide breakdown and ... carrier injection effects. Figure 4 and the components used to reduce the drive component 3 〇〇
1254508 五、發明說明(16) -- 似的元件,具有相同的參考標號。電壓轉換電路1〇3包含 一對數位電位轉換電路401和4〇3,兩者皆依照前述所納入 之美國專利申請案來實施。每一數位電位轉換電路4〇1和 401皆參考至VDDL、VDDH及REF,並包含一第一階段4〇5和 一第二階段407。對每一數位電位轉換電路4〇1和4〇3來 說,第一階段405有一對互補的輸入端IN*INB,以接收一 對相對應的互補輸入信號,其邏輯狀態的電位係介於vdd i REF之間。第一階段4〇5會配合輸入信號的切換,於ddl 和一中間電位如INT之間,切換互補輸出端〇UT1和〇UT1B之 一對相對應的數位輸出信號。第一階段4〇5的輸出端〇υτι 和OUT1B之輸出信號,分別被送至第二階段4〇7的輸入端⑺ 和Ι^Β。第二階段4〇7的互補輸出端〇UT2和〇UT2B會配合輸 入信號的切換,各自於VDDH和中間電位INT之間進行切 換。 [ 0 043 ]如圖所示,數位電位轉換電路4〇ι之第一階 段405接收一互補信號對pu,並於對應之第二階段4〇7的 OUT2B輪出端提供PUPB信號。此處需注意正或負邏輯皆須 考慮到。對正邏輯來說,PU信號對包含送至第一階段4〇5 輸入端IN的PU信號,以及送至輸入端ΙΝβ的互補信號ρυβ。 4電位轉換電路4 〇 3之第一階段4 〇 5接收互補信號對p d, 二中該1號對PD類似於信號對PU,像是其包含了pD信號和 口互補信號PDB。送至輸入端IN之?11信號係用來作為pM信 號,其在VDDL和REF的電位間切換。第一階段的輪出端 UT1形成一PDNS信號,其為PDN信號經過電壓限制或電壓1254508 V. INSTRUCTIONS (16) -- Like components, having the same reference numerals. The voltage conversion circuit 101 includes a pair of digital potential conversion circuits 401 and 4, 3, both of which are implemented in accordance with the aforementioned U.S. Patent Application. Each of the digital potential conversion circuits 4〇1 and 401 references to VDDL, VDDH, and REF, and includes a first stage 4〇5 and a second stage 407. For each of the digital potential conversion circuits 4〇1 and 4〇3, the first stage 405 has a pair of complementary input terminals IN*INB for receiving a pair of corresponding complementary input signals, the logic state of which is between Between vdd i REF. The first stage 4〇5 cooperates with the switching of the input signal to switch a pair of corresponding digital output signals of the complementary output terminals 〇UT1 and 〇UT1B between ddl and an intermediate potential such as INT. The output signals of the output terminals 〇υτι and OUT1B of the first stage 4〇5 are sent to the input terminals (7) and Ι^Β of the second stage 4〇7, respectively. The complementary outputs 〇UT2 and 〇UT2B of the second stage 4〇7 cooperate with the switching of the input signals, and each switches between VDDH and the intermediate potential INT. [0 043] As shown, the first stage 405 of the digital potential conversion circuit 4 receives a complementary signal pair pu and provides a PUPB signal at the OUT2B round of the corresponding second stage 4〇7. It should be noted here that both positive and negative logic must be considered. For positive logic, the PU signal pair contains the PU signal sent to the input stage IN of the first stage 4〇5, and the complementary signal ρυβ sent to the input terminal ΙΝβ. 4 The first stage of the potential conversion circuit 4 〇 3 4 〇 5 receives the complementary signal pair p d , the second pair of PD is similar to the signal pair PU, as if it contains the pD signal and the port complementary signal PDB. Send to the input IN? The 11 signal is used as a pM signal that switches between the potentials of VDDL and REF. The first stage of the round-trip UT1 forms a PDNS signal, which is the voltage limit or voltage of the PDN signal.
第22頁 1254508 五、發明說明(17) 轉換而形成。尤其,PDNS信號係配合PDN信號的切換,於 V^DL和INT電位之間進行切換。第二階段4〇7則組態為配合 第一階段4 0 5之電壓限制輸出的切換,而切換其輸出。 [ 0044 ]縮小驅動元件4〇〇包含p通道元件?1和?2,兩 者以實質上等同於縮小驅動元件3〇〇之?1和?2的方式,耦 =於節點301,此兩者亦耦接於几㈣和節點3〇3之間,其中 節點303可形成ODS信號。n通道元件203則以串接組態的N 通道元件N1和N2代替。N通道元件N2具有耦接至節點303的 及極、搞接至N通道元件n 1之汲極的源極以及接收mns信 號的閘極。N1則具有耦接到REF的源極和接收pM信號的閘 極。N1和N2的N型井耦接到其各別的源極,因而N1的N型井 會耗接到REF,N2的N型井會耦接至N1的汲極。 一 [〇 〇 4 5 ]串接的N通道元件N 1和N 2共同組成縮小驅動 元件400之一拉低階段。在一實施例中,N1和…係具有相 當短的通道和薄閘極氧化層之縮小元件。串接元件N2可用 來排除由於高電位之切換而產生於N1之熱載子注入效應。 如岫所述,熱載子效應通常發生在具有非常短的通道和薄 閘極氧化層的N通道元件。在高電壓的重複切換下,載子 會加速以致於落入氧化層中。這些受限制的載子會改變元 件的臨界值,並使元件效能與時倶減。在串接組態中,N2 閘極的邏輯狀恶疋隨著N1閘極而變,因為驅動n 2閘極的 PDNS信號是隨著驅動N1閘極的PDN信號而變。在圖示的實 施例中,驅動N2閘極的電壓限制信號PDNS之下限約為中貝間 電位INT,而非REF電位。N2可用來保護N1,因為在〇DS信Page 22 1254508 V. Description of invention (17) Formed by conversion. In particular, the PDNS signal is switched between V^DL and INT potential in conjunction with switching of the PDN signal. The second stage, 4〇7, is configured to switch the output of the voltage-limited output of the first stage 405. [0044] The reduced drive element 4〇〇 contains a p-channel element? 1 and? 2, the two are essentially equivalent to reducing the drive component 3? 1 and? The mode of 2 is coupled to node 301, which is also coupled between several (four) and node 3〇3, wherein node 303 can form an ODS signal. The n-channel component 203 is replaced by a series of configured N-channel components N1 and N2. The N-channel element N2 has a source coupled to the node 303, a source connected to the drain of the N-channel element n 1 , and a gate receiving the mns signal. N1 has a source coupled to the REF and a gate receiving the pM signal. The N-type wells of N1 and N2 are coupled to their respective sources, so the N-type well of N1 is consumed by REF, and the N-type well of N2 is coupled to the drain of N1. A [通道 〇 4 5 ] series connected N-channel elements N 1 and N 2 together form a pull-down phase of the reduced drive element 400. In one embodiment, N1 and ... have a relatively short channel and a thin gate oxide thinning element. The series element N2 can be used to eliminate the hot carrier injection effect generated by N1 due to the switching of the high potential. As described, the hot carrier effect typically occurs in N-channel components with very short channels and thin gate oxide layers. At repeated switching of high voltages, the carriers are accelerated so as to fall into the oxide layer. These restricted carriers change the critical value of the component and reduce component performance. In a tandem configuration, the logic of the N2 gate is a function of the N1 gate because the PDNS signal driving the n 2 gate is a function of the PDN signal driving the N1 gate. In the illustrated embodiment, the lower limit of the voltage limit signal PDNS for driving the N2 gate is about the mid-between potential INT, not the REF potential. N2 can be used to protect N1 because the 〇DS letter
第23頁 1254508 五、發明說明(18) 號由高電壓VDDH切換到REF電位的瞬間,N2和N1元件的整 體動作如同一電阻分壓器(resist〇r divider),可避免N1 發生熱載子效應。高電壓負載則分散κΝ1和⑽。 [ 0 046 ]當PDN信號被拉至REF而使N1關閉時,驅動N2 閘極電壓之PDNS信號便降至中間電位INT,以保護N2免受 ODS信號於匯流排上的暫態變化。由於傳輸線的效應,〇ds 信號的電壓可能會降到REF電位以下。例如,當N1被關閉 且N2閘極具有一不同的VDDL電位時,若節點3〇3有一 變化將N2的閘極拉至REF電位以下,則N2將會承受一可= ^大之閘極至通道電壓。避免的做法収,tNi被關閉 a寸,將N2的閘極電壓降低至INT電位,以防止因匯济 暫悲變化而產生過大的閘極至通道電壓。 [〇〇47]需注意的是,雖然此處是參照〇18微米元件 及其相關電位,來解說本發明如何解決驅動元件 的相關問題,但相同的解決方幸一— Η Λ, ^ /iL 像可應用於較大及鲂/丨、 的…$是因為閘極氧化層崩潰 = 程有關,也與元件的應用’亦即元件 ;;=件衣以過 電壓要求,密切相關。因此,本& ,、他元件的 不發明亚不限於Π 1 β他止-件及其相關電位,而可應用於任何一你卜18斂未兀 電壓的技術。亚且,電壓源信號可能有不 性,以界定一特定製程之任何可杏 2電位和極Page 23 1254508 V. Invention Description (18) At the moment when the high voltage VDDH is switched to the REF potential, the overall operation of the N2 and N1 components is the same resistor divider (resist〇r divider) to avoid the hot carrier of N1. effect. The high voltage load is dispersed by κΝ1 and (10). [0 046] When the PDN signal is pulled to REF and N1 is turned off, the PDNS signal driving the N2 gate voltage is reduced to the intermediate potential INT to protect N2 from the transient change of the ODS signal on the bus. Due to the effects of the transmission line, the voltage of the 〇ds signal may drop below the REF potential. For example, when N1 is turned off and the N2 gate has a different VDDL potential, if there is a change in node 3〇3 to pull the gate of N2 below the REF potential, then N2 will withstand a gate that can be = ^ Channel voltage. Avoid the practice, tNi is turned off a inch, the gate voltage of N2 is reduced to INT potential to prevent excessive gate-to-channel voltage due to temporary changes in the economy. [〇〇47] It should be noted that although the reference to the 18 micron element and its associated potential is used herein to explain how the invention solves the related problems of the driving element, the same solution is fortunately - Η Λ, ^ /iL image It can be applied to larger and 鲂/丨, ...$ is because the gate oxide layer collapses = process related, and also with the application of the component 'that is, the component;; = the clothing is closely related to the overvoltage requirement. Therefore, this & , the non-invention of its components is not limited to Π 1 β 止 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The voltage source signal may be indeterminate to define any apricot potential and pole for a particular process.
Ref可被轉換至非零的電位,而其二、電、上範圍。例如’ 換’以定出理想的或適當的電壓 二責電:者轉 程、應用情形和相對電位而$,r二广貝電壓係依據製 乂保4縮小驅動元件之閘Ref can be converted to a non-zero potential, while its second, electrical, and upper ranges. For example, 'change' to determine the ideal or appropriate voltage. The two responsibilities: the converter, the application situation and the relative potential, and the voltage is based on the system.
第24頁 1254508 五、發明說明(19) 極氧化層。 [0 0 4 8 ] 雖然本發明已參照特定較佳實施例而詳細解 說’但其他變化的實施例亦有可能慮及。例如,特定的電 位與/或電壓範圍依元件類型或製造過程而可不同。〇·18 微米元件的相關電位已在示範的實施例中作說明,而熟知 此技藝者亦可了解到,本發明可應用在相關於相同或不同 電位之較小與較大的元件。正邏輯或負邏輯亦有考慮 到。Ρ通道和Ν通道元件可分別實作為pM〇s和關〇8元件,如 熟悉該技藝者所熟知的PM〇s和㈣㈧電晶體。Page 24 1254508 V. INSTRUCTIONS (19) Polar oxide layer. [0 0 4 8 ] While the invention has been described in detail with reference to the particular preferred embodiments, For example, a particular potential and/or voltage range may vary depending on the component type or manufacturing process. The associated potential of the 〇18 micron element has been described in the exemplary embodiments, and it is also well known to those skilled in the art that the present invention can be applied to smaller and larger elements associated with the same or different potentials. Positive or negative logic is also considered. The Ρ channel and Ν channel elements can be implemented as pM 〇 s and 〇 8 elements, respectively, as is well known to those skilled in the art of PM 〇 s and ( iv ) ( VIII ) transistors.
[ 0 049 ]再者,一般M〇s類型元件的閘極氧化層崩潰 現象不只與元件製浩> 士 此说ϋ # * 過私有關,也與元件的應用,包括元 件所要耦接之其他元件 她 仵的電壓要求,密切相關。 已,f不能以之者,僅為本發明之較佳實施例而 申請專利範圍所作之均::之範圍。大凡依本發明 專利涵蓋之範圍内,雙主化/修飾,皆應仍屬於本發明 是所至禱。 "月貝番查委員明鑑,並祈惠准,[0 049] Furthermore, the breakdown of the gate oxide layer of the general M〇s type component is not only related to the component system, but also to the application of the component, including the components to be coupled. The voltage requirements of her components are closely related. It is to be understood that the scope of the patent application is only the scope of the invention. In the scope of the patents covered by this invention, dual mastering/modification should still belong to the present invention. "月贝番查委明鉴, and pray for the right,
第25頁 1254508 圖式簡單說明[0016] 配合下列說 [0017] 包含有依據 壓轉換電路[0018] 件的詳細示[0019] 例電路圖; [0020] 驅動兀件的 壓轉換電路 本發明之前述與其它目的、特徵及優點,在 明及所附圖示後’將可獲得更好的理解: 圖一係為一系統的簡化方塊圖,其甲此 本發明之一實施例所實作之一核心電路、— 與一縮小驅動元件,以及一 ”外部”元件—電 圖二為依據先前技術實施之習用縮’ 意圖; I動 、圖三為依據本發明實施之縮小驅動元 以及 1千 圖四為依據本發明之另„實施例 電路圖,其中此縮小驅動元件係 之縮小 之一示範實施例。 至圖 統 元 的範 電 圖號說明: 100 系統 101 103 電位轉換器 105 107 外部元件 109 200 縮小驅動元件 201 203 N通道元件 205 207 p型基底 209 211 P型區域 212 213 P型區域 214 215 閘極絕緣層 219 221 閘極 223 核心電路 銜百小驅動元件1C p通道元件 沒極 N型井區域 重疊區域 重疊區域 源極 N型區域 1254508 圖式簡單說明 225 N型井端子 300 縮小驅動元件 301 節點 303 中間節點 400 縮小驅動7L件 401 數位電位轉換電路 403 數位電位轉換電路 405 第一階段 407 第二階段Page 25 1254508 Brief Description of the Drawings [0016] In conjunction with the following [0017] A detailed diagram [0019] including a voltage conversion circuit [0018] is included; [0020] a voltage conversion circuit for driving the device And other objects, features and advantages will be better understood from the following description. FIG. 1 is a simplified block diagram of a system which is one of the embodiments of the present invention. The core circuit, and a reduced drive component, and an "external" component - the second diagram is based on the prior art implementation of the prior art; I move, Figure 3 is a reduced drive element and 1 thousand Figure 4 implemented in accordance with the present invention It is a circuit diagram of another embodiment according to the present invention, wherein an exemplary embodiment of the reduction of the drive element is reduced. The description of the figure to the figure is: 100 System 101 103 Potential converter 105 107 External component 109 200 Zoom out Drive element 201 203 N-channel element 205 207 p-type substrate 209 211 P-type region 212 213 P-type region 214 215 gate insulation layer 219 221 gate 223 core circuit hundred small drive Element 1C p channel element no pole N type well area overlap area overlap area source N type area 1254508 Brief description of the diagram 225 N type well terminal 300 reduction drive element 301 node 303 intermediate node 400 reduction drive 7L piece 401 digital potential conversion circuit 403 Digital potential conversion circuit 405 first stage 407 second stage
第27頁Page 27
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US10/317,240 US6870407B2 (en) | 2002-06-18 | 2002-12-11 | Thin gate oxide output drive |
Publications (2)
Publication Number | Publication Date |
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TW200410490A TW200410490A (en) | 2004-06-16 |
TWI254508B true TWI254508B (en) | 2006-05-01 |
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TW92117518A TWI254508B (en) | 2002-12-11 | 2003-06-27 | Thin gate oxide output driver |
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TW (1) | TWI254508B (en) |
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KR101989571B1 (en) * | 2012-06-27 | 2019-06-14 | 삼성전자주식회사 | output driver for high voltage and wide range voltage operation and data output driving circuit using the same |
TWI489744B (en) * | 2013-06-03 | 2015-06-21 | Richtek Technology Corp | AC to DC power converter control circuit |
US10027321B2 (en) | 2014-12-12 | 2018-07-17 | Mediatek Inc. | I/O driving circuit and control signal generating circuit |
TWI548217B (en) * | 2015-03-05 | 2016-09-01 | 華邦電子股份有限公司 | Output circuit |
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US6040708A (en) * | 1997-01-02 | 2000-03-21 | Texas Instruments Incorporated | Output buffer having quasi-failsafe operation |
US6373282B1 (en) * | 1999-08-20 | 2002-04-16 | Ati International Srl | Single gate oxide cascaded output buffer stage and method |
US6407579B1 (en) * | 2000-01-20 | 2002-06-18 | Koninklijke Philips Electronics N.V. | Fast high voltage level shifter with gate oxide protection |
-
2003
- 2003-06-27 TW TW92117518A patent/TWI254508B/en not_active IP Right Cessation
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CN1306612C (en) | 2007-03-21 |
TW200410490A (en) | 2004-06-16 |
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