[go: up one dir, main page]

TWI248908B - Electronic component container - Google Patents

Electronic component container Download PDF

Info

Publication number
TWI248908B
TWI248908B TW91111187A TW91111187A TWI248908B TW I248908 B TWI248908 B TW I248908B TW 91111187 A TW91111187 A TW 91111187A TW 91111187 A TW91111187 A TW 91111187A TW I248908 B TWI248908 B TW I248908B
Authority
TW
Taiwan
Prior art keywords
electronic component
resin
belt
parts
styrene
Prior art date
Application number
TW91111187A
Other languages
Chinese (zh)
Inventor
Tetsuo Fujimura
Takeshi Miyakawa
Mikio Shimizu
Satoshi Yokoyama
Masanori Higano
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000372433A external-priority patent/JP2002173194A/en
Priority claimed from JP2001158455A external-priority patent/JP4001468B2/en
Priority claimed from JP2001207442A external-priority patent/JP2003020097A/en
Priority claimed from JP2001317981A external-priority patent/JP3789343B2/en
Priority claimed from JP2002091019A external-priority patent/JP4068375B2/en
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Application granted granted Critical
Publication of TWI248908B publication Critical patent/TWI248908B/en

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Wrappers (AREA)

Abstract

In order to prevent impairment due to static electricity in a container for an electronic component, generation of static electricity itself has to be inhibited. The peeling static electrification amount of a cover tape should be from -9 to +9 nC when the cover tape has a surface electric resistivity of at least 10<11> Omega, or it should be from -3 to +3 nC when the cover tape has a surface electric resistivity of less than 10<11> Omega. In a carrier tape body, a side of a cover tape which faces an electronic component should have a composition containing a resin on the positive polarity side and a resin on the negative polarity side relative to a side of the electronic component which faces the cover tape in the series of frictional electrification. For the surface of a container to be in contact with an electronic component, a material which is less likely to generate static electricity should be employed. A material close to a molding compound for en electronic component in the series of frictional electrification may be employed for the surface of a packaging container to be in contact with an electronic component. Otherwise, a positive polarity side one and a negative polarity side one in the series of frictional electrification may be used together.

Description

1248908 A7 _____ B7_ 五、發明説明（1 ) 技術領域 本發明係有關電子零件之容器，尤其是載帶。 (請先閱讀背面之注意事項再填寫本頁) 先行技術 I C、二極體、液晶、電容器等電子零件之容器，有 卡槽、模壓載帶（亦簡稱載帶）、盤、袋、盛器、泡棉等 。容器係用於電子零件之收藏、保管、搬運等。例如，模 壓載帶係將電子零件收藏於其凹袋部，以護帶封蓋成爲載 帶體。要將電子零件安裝於基板時，剝開護帶取出電子零 件以供使用。電子零件中之I C，所謂晶片之積體電路， 係以環氧樹脂等封裝。I C易帶靜電，嚴重時可導致積體 電路之破壞。靜電可因經包裝之電子零件運送中之振動（ 摩擦）產生，亦可於載帶之護帶剝離時產生。 經濟部智慧財產局員工消費合作社印製 電子零件之容器大都具導電性，乃爲電子零件與容器 之接觸、摩擦所生靜電之去除。所生電荷均勻分布於容器 中即不易產生電位差。爲賦予電子零件容器導電性，係使 用混有具導電性之金屬材料、碳纖、碳黑之樹脂。亦可於 容器表面塗布含碳黑等之導電塗料，賦予導電性。這些容 器因導電性具接地作用靜電可以逸散。但是，如此仍無法 完全防止靜電之弊害。尤以隨電子零件之高度積體化，內 部配線微細化，電子零件更易受靜電影響。 靜電亦引起其它問題。由於靜電，電子零件附著於容 器，有時難以取出。載帶之蓋材護帶，其剝離以取出電子 零件時，電子零件因靜電而有塵粒附著，會自載帶飛出。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） &quot; ~ U -4- 1248908 A7 B7 五、發明説明（3) 亦可使與電子零件接觸之包裝容器表面及電子零件之 封裝劑於帶電列相近，或使用帶電列之正及負材質。例如 ，偏二氟乙烯聚合物及丙烯酸酯系聚合物帶電列完全不同 ’其所成之包裝容器與電子零件接觸、摩擦，於零件表面 產生之靜電少。 抑制靜電之產生，即可抑制靜電之弊害。可防零件之 附著於包裝容器，可防對靜電敏感之電子零件受到靜電破 壞。 圖面之簡單說明 第1圖至第4圖係有關實施例2 2至2 5，及比較例 7至1 4。第1圖例示使用圓柱量測帶電量之方法。 第2圖例示使用收藏零件量測帶電量之方法。 第3圖示用於帶電試驗之盤。 第4圖示用於帶電試驗之載帶。1係斜面，電子零件 經此滑下。2係量測帶電量之片材。3係樹脂圓柱。4係 法拉第箱。5係電子零件。 經濟部智慧財產局員工消費合作社印製 第5圖係摩擦試片。 第6圖係I C盤。6係用於摩擦試驗，底面有小孔之 I C袋。7係用於摩擦試驗，底面有大孔之I C袋。8係 用於摩擦試驗，底面無孔之I C袋。9係固定I C用之細 小棱條。 主要元件對照表 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） ；&gt; - 6 - 1248908 A7 ___ B7_ 五、發明説明（6) (請先閲讀背面之注意事項再填寫本頁) 聚碳酸酯可用碳酸二甲酯、碳酸二乙酯等脂族碳酸酯 與2，2 -雙（4 一羥基苯基）丙烷所成之雙酚A型聚碳 酸酯等芳族系聚碳酸酯，或含聚對酞酸乙二醇酯、聚對酞 酸丁二醇酯不及5 0重量％之混合物。 聚酯主要係用聚酸酞酸乙二醇酯。這些可單獨使用， 亦可多數混合使用。這些片材之加工爲模壓帶，可用真空 成形法、壓空成形法等已知方法。 使表面電阻値在所示範圍，可用碳黑、無機塡料混入 樹脂，或以無機塡料分散成之導電塗料或電子傳導性高分 子塗被。 護帶之密封劑以由苯乙烯系共聚物及/或乙烯系共聚 物所成者爲佳。 苯乙烯系共聚物可用苯乙烯系單體與共軛二烯系單體 之共聚物，高衝擊強度聚苯乙烯等。苯乙烯系單體有鄰甲 基苯乙烯、對甲基苯乙烯、對三級丁基苯乙烯、α -曱基 苯乙烯等，共軛二烯系單體可用1 ，3 -丁二烯、1 ，3 —戊二烯、1 ，3 —己二烯、2 -甲基戊二烯等。 經濟部智慧財產局員工消費合作社印製 乙烯系共聚物可用諸如乙烯- 1 - 丁烯之乙烯一 ^ _ 烯烴共聚物、乙烯-醋酸乙烯酯共聚物、乙烯-丙烯酸丁 酯、乙烯-苯乙烯共聚物、乙烯-馬來酸酐-丙烯酸酯共 聚物之類的具乙烯單元之共聚物。這些可單一或多種混合 使用。 護帶者，其收藏面側之表面傾斜3 0度，以環氧樹脂 封裝之28毫米見方MQFP型IC(例如’NEC公司 夺纸張尺度適用中.國國家標準（CNS ) Α4規格（210Χ297公釐） 1248908 A7 _____ B7 五、發明説明（7 ) (請先閲讀背面之注意事項再填寫本頁) 製2 8DMQF P型I C)滑落2 5 0毫米時，摩擦帶電 s-〇.3至+0·3奈庫命者即適用於本發明。使用如 此之護帶，可抑制因護帶與收藏物摩擦而產生靜電。 使剝離帶電量在特定範圍之有效方法有，各以熱塑性 樹脂中帶電列相近者用於護帶及模壓帶之密封部份。帶電 列大爲不同之熱塑性樹脂用於護帶及模壓帶時，剝離護帶 之際所生靜電多，帶電量高。倂用帶電列上比用於護帶更 正側之熱塑性樹脂，及更負側之熱塑性樹脂於模壓帶，亦 係有效方法。反之，倂用帶電列上比用於模壓帶之熱塑性 樹脂更正側之熱塑性樹脂，及更負側之熱塑性樹脂於護帶 ，亦係有效方法。 抗靜電劑之塗布 經濟部智慧財產局員工消費合作社印製 護帶及模壓帶可塗以抗靜電劑，以塗佈於護帶爲佳。 此乃顧及模壓帶之袋內，抗靜電劑之塗佈雖可用噴霧法， 但乾燥耗時加工成本高，並有抗靜電劑與導線接腳擦拭脫 落之危險性。惟上述亦不在否定本發明之於模壓帶塗布抗 靜電劑。本發明中亦可於模壓帶塗布抗靜電劑，收藏易受 靜電破壞之電子零件時即値得採用。 抗靜電劑以用烷基二乙醇醯胺、聚氧化乙烯烷基胺、 烷基二乙醇胺等非離子型，烷基磷酸鹽、烷基磺酸鹽等之 陰離子型，三烷基苯甲銨鹽、四烷銨鹽等陽離子型，烷基 甜菜鹼、烷基咪唑鐵甜菜鹼等兩性離子型爲佳，其中以兩 性離子型爲特佳。又高分子型抗靜電劑可用聚氧化乙烯等 梦張尺錢用中國國家標準（⑽）A4規格（2Η)Χ297公~~7 1248908 A7 B7 五、發明説明（8 ) 聚醚型，含四級銨鹼之丙烯酸酯共聚物等之四級銨鹽型， 羰甜菜鹼接枝共聚物等之甜菜鹼型亦可使用。 (請先閲讀背面之注意事項再填寫本頁) 這些抗靜電劑之塗布厚度，以乾燥後在2 _ 0微米以 下爲佳。太厚則以護帶熱封於模壓帶時之封帶過程中，抗 靜電劑與各種導線接腳擦拭累積於後者表面，進而落於收 藏物上造成污染而不佳。這些抗靜電劑之塗布方法，有鏡 面、凹版輥塗機、噴霧等習知方法。 以帶電列控制靜電 載帶之護帶於剝離時產生靜電之抑制，可使護帶朝向 電子零件之面含有對電子零件朝向護帶之面的帶電列上易 於正側帶電之樹脂，及易於負側帶電之樹脂。 帶電列乃物質互相摩擦時從易帶正電之物質到易帶負 電之物質之依序排列。物質之帶電極性隨摩擦對象而變， 帶電列正側之物質與負側物質相擦時，正側物質帶正電， 負側物質帶負電。該順序以工作函數、費米能階說明時， 費米能階高者在帶電列之正側，低者在負側。 經濟部智慧財產局員工消費合作社印製 半導體等電子零件因與其收藏包裝材料振動，摩擦等 帶靜電，其電荷在構裝於基板等之際傳導經導線，焊球則 產生電流’造成閘極氧化膜、層間絕緣膜因短路之熱破壞 ，絕緣膜破壞等之E S D (靜電放電）破壞。因此，使電 子零件本身不帶電，乃避免E S D破壞之要務。 半導體等電子零件朝向護帶之面即所謂模塑樹脂，係 使用甲酚淸漆系、雙酚A系環氧樹脂及胺系硬化劑。這些 土紙張尺度適财關家辟（CNS ) A4規格（21GX297公釐) ' 4 Η -11- 1248908 A7 _ B7 五、發明説明（9) (請先閲讀背面之注意事項再填寫本頁) 模塑樹脂中，通常更添加有結晶氧化矽、熔融氧化矽等塡 料。此外’爲促進環氧樹脂之硬化反應，有咪唑、磷化合 物硬化促進劑等之添加。除如此之低壓傳遞成形法以外， 可藉澆鑄法、塗被法、浸塗法、鑄封法、粉體塗裝法使用 聚矽氧、酚樹脂。 模塑樹脂之主流環氧樹脂，係位於帶電列居間位置之 樹脂’正側樹脂有苯乙條系聚合物、聚碳酸酯、壓克力係 樹脂等，負側樹脂則有聚乙烯系樹脂、聚氯乙烯樹脂等。 壓克力系樹脂有丙烯酸、甲基丙烯酸之甲酯、乙酯、 正丁酯及2 —乙基丁酯、2 —乙基己酯、辛酯、甲氧基乙 酯、乙氧基乙酯、3 -乙氧基丙酯、己酯、環己酯、癸酯 等或這些之共聚物，乙烯-醋酸乙烯酯共聚物等。 聚乙烯系樹脂有聚乙烯，及丙烯、丁烯、己烯等有側 鏈之碳原子數（C數）3以上之α -烯烴與乙烯之共聚物 ’超低密度聚乙烯，直鏈狀低密度聚乙烯等。 經濟部智慧財產局員工消費合作社印製 含帶電列正側之樹脂及負側之樹脂不僅如上之方法， 亦可用具彼等構造之共聚物、接枝物。如此之樹脂有例如 ’將苯乙烯鏈接枝聚合於聚乙烯鏈等之接枝共聚物。 帶電列正側樹脂及負側樹脂之重量比，以7 7 : 2 3 至2 3 ·· 7 7爲合適。此時各種抗氧化劑等安定劑以其目 的量添加可不對本發明造成任何影響。當然，亦可倂用習 知方法之以包裝材等之帶電作保護而使表面電阻率下降。 本發明之護帶，較佳者係使用其朝向電子零件之面與 電子零件，以3 0 0來回/分鐘，振幅5毫米之振動施行 土紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） -12- 1248908 A7 B7 五、發明説明（10) (請先閲讀背面之注意事項再填寫本頁} 1分鐘後，電子零件側之靜電壓在± 1 0 0 0伏特以下者 。在此’電子零件指收藏於載帶體之電子零件，或環氧樹 脂製封裝劑2 8毫米見方之M Q F ρ型I C (例如， NEC公司製28DMQFP)。 使用偏二氟乙燒聚合物及丙燃酸酯系聚合物之容器 如上將護帶剝離時所產生之靜電，其防止至關重要。 因而收藏電子零件之底帶其材質亦極重要。 與電子零件接觸之包裝容器表面，宜使用與封裝劑在 帶電列上相近者，或帶電列之正側者及負側者。例如，若 含偏二氟乙儲聚合物及丙儲酸酯系聚合物，則可降低包裝 容器與電子零件因接觸、摩擦而於零件表面產生之帶電量 〇 經濟部智慧財產局員工消費合作社印製 偏一氣乙燦聚合物及丙爆酸酯系聚合物帶電列大有不 同，並且二聚合物易於以任何比例混摻。因此藉其混摻比 率之調整’可得帶電列近於構成所收藏之電子零件的封裝 劑之樹脂成分之組成，可抑制電子零件與包裝容器因接觸 、摩擦而起之帶電。 偏一赢乙燦聚合物係以偏一截乙燒爲主要成分之聚合 物’有單聚物及共聚物。共聚物有例如偏二氟乙烯一四氟 乙烯-六氟丙烯系共聚物，偏二氟乙烯一六氟丙燒系共聚 物等。 丙烯酸酯系聚合物係以丙烯酸酯爲主要成分之聚合物 ，有其單聚物及共聚物。丙烯酸酯有例如丙烯酸酯、甲基 ........π I ”叫 e 一 π-Τ· \ Ii、v3 ； a 分况价 ' ZJLU A 厶夕 / 仏、度； r&gt; ? ri -13- 1248908 經濟部智慧財產局員工消費合作社印製 烯聚合物混 ，亦可與壓 系聚合物之 後，以雙軸 制。偏二氟 之確立手法 斜面，片材 機溶劑去除 酮等水溶性 量以法拉第 聚合物及丙 可求出偏二 帶電列。構 烯酸酯系聚 愈相近。 子化空氣， 烯聚合物與 面，由上部 溶劑除電之 方法。本方 丙烯酸酯亦 丙烯酸曱酯 摻而較佳。 克力系橡膠 混摻方法， 擠出機熔融 乙儲聚合物 有，如第1 上之電荷以 後，從斜面 有機溶劑除 箱量測之方 烯酸酯系聚 氟乙烯聚合 成電子零件 合物之混摻 酒精、丙酮 丙烯酸酯系 滑下經離子 零件，產生 法中，電子 A7 五、發明説明（11) 丙烯酸酯等，本發明中亦包含巴豆酸酯。這些 可一種以上倂用。丙烯酸酯系聚合物中，甲基 聚合物因可於任意比率與偏二氟乙 爲使丙烯酸酯系聚合物具衝擊強度 混摻。 偏二氟乙烯聚合物與丙烯酸酯 可用亨謝爾機、轉鼓機作機械混合 混練之方法等一般手法，無特殊限 及丙烯酸酯系聚合物可用市售品。 電子零件對包裝容器之帶電列 圖以構成電子零件之樹脂片材作成 離子化空氣酒精、丙酮等水溶性有 上部滾下經離子化空氣、酒精、丙 電之樹脂圓柱，於圓柱產生之電荷 法。以同樣方法，使用偏二氟乙烯 合物以各種比率混摻所成之片材， 物與丙烯酸酯系聚合物之比率及其 之樹脂，與偏二氟乙烯聚合物及丙 物圓柱之帶電量愈接近，則帶電列 另一方法係如第2圖，於經離 等水溶性有機溶劑除電，偏二氟乙 聚合物以各種比率之混摻物所成平 化空氣，酒精、丙酮等水溶性有機 於零件之電荷量以法拉第箱量測之 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) -14 - 1248908 A7 B7 五、發明説明（12) 零件帶電量絕對値小之偏二氟乙烯及丙烯酸酯系聚合物之 混摻比率，與零件之帶電列相近。 (請先閲讀背面之注意事項再填寫本頁) 本包裝容器接觸電子零件之表面含偏二氟乙烯聚合物 及丙烯酸酯系聚合物，其中以經3 〇 〇次摩擦後於電子零 件產生之帶電量在1奈庫侖以下者爲佳，〇 · 8奈庫侖以 下者更佳。該範圍內，可更有效防止電子零件因靜電而於 包裝容器表面附著、脫離，及收藏電子零件時因靜電而受 害受損。使3 0 〇次摩擦電子零件所生帶電量在1奈庫侖 以下’較佳者爲〇 . 8奈庫侖以下，可調整偏二氟乙烯聚 合物及丙燦酸酯系聚合物之比率，使對電子零件依上述方 法所得帶電列與電子零件一致。 亦可賦予包裝容器表面固有電阻値1 〇2至1 歐 經濟部智慧財產局員工消費合作社印製 姆/□之導電性。此可有效去除產生於包裝容器表面之靜 電。賦予方法無特殊限制，有例如於聚合物添加鋼纖維、 鋁纖維、黃銅纖維、銅纖維、不銹鋼纖維等金屬纖維、導 電氧化鈦、氧化鋅等金屬氧化物，碳纖、鎳等金屬表面被 覆處理之碳纖，碳黑、石墨粉、金屬被覆玻纖等電子傳導 性物質之方法，添加非離子系、陽離子系、陰離子系、甜 菜鹼系界面活性劑，以及高分子量聚醚醯胺等之永久抗靜 電劑等離子電導性物質之方法。或於表面以碳微粉塗布， 以聚吡咯等高分子系導電材料作塗布處理，亦可賦予導電 與零件接觸之表面全體均含偏二氟乙烯聚合物及丙烯 酸酯系聚合物爲較佳，但亦可僅使主要部份，或多有接觸 矢紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -15- 1248908 A 7 _ B7_ 五、發明説明（13) (請先閲讀背面之注意事項再填寫本頁) 之部份係如此。本發明之包裝容器即包括如此之容器。電 子零件所接觸之包裝容器表面含偏二氟乙烯聚合物及丙烯 酸酯系聚合物者，意指接觸部份或全部係如此。當然，此 時接觸部份之全部含偏二氟乙烯聚合物及丙烯酸酯系聚合 物，則於防止靜電產生係爲較佳。 不與零件接觸之表面亦含偏二氟乙烯聚合物及丙烯酸 酯系聚合物，於本發明不造成任何問題。本發明之包裝容 器包括如此之容器。不與零件接觸之表面包含容器之外裝 以及全面。 摩擦帶電量低之樹脂 電子零件之谷器宜用’與電子零件接觸部份與電子零 件摩擦時少有靜電產生之材質。具體而言，如第5圖之樹 脂組成物成形品與電子零件以6 0 0轉/分鐘之速度摩擦 5分—後’電子零件所生帶電量之絕對値係在1奈庫命以 下，較佳者爲0.8奈庫侖以下。 經濟部智慧財產局員工消費合作社印製 如此之樹脂組成物有例如，含丙烯酸酯系聚合物、苯 乙烯系聚合物及導電性賦予材料之組成物。對丙燒酸酯系 聚合物5 0至2重量份，及苯乙烯系聚合物5 〇至9 8重 量份之合計1 0 0重量份，含導電性賦予材料i至5 〇重 量份之樹脂組成物爲較佳。 含丙烯酸酯系聚合物、聚苯醚、苯乙烯系聚合物及導 電性賦予材料之樹脂組成物亦佳。對丙烯酸酯系聚合物 5 0至2重量份，及聚苯醚與苯乙烯系聚合物5 〇至9 8 ^紙張尺度適用中國國家標準（CNS ) A4規格（21(^297公釐) '--- ^ -16- 1248908 五、發明説明（Μ) 重量份，合計1 〇 〇重量份，含導電性賦予材料i至5 〇 重量份之樹脂組成物更佳。 電子零件可係實際收藏於使用如上樹脂組成物之包裝 谷器者’亦可係本發明實施例中所用I C。帶電量之絕對 値愈小，愈能防靜電之害。 摩察時電子零件之帶電量絕對値若低，樹脂組成物之 組成即無特殊限制。適用者有，丙烯酸酯系聚合物及苯乙 燒系聚合物中添加導電性賦予材料者，或丙烯酸酯系聚合 物及聚苯醚與苯乙烯系聚合物中添加導電性賦予材料者。 丙烯酸酯系聚合物，與苯乙烯系聚合物及聚苯醚之帶電列 大有不问’而追些聚合物卻易於混摻。因此，調整這些聚 合物之混摻比率，可得帶電列接近構成所收藏之電子零件 的封裝材料之樹脂成分之帶電列組成物，可抑制電子零件 與包裝容器因接觸、摩擦而起之帶電。 丙烯酸酯系聚合物，以甲基丙烯酸甲酯聚合物與苯乙 烯系聚合物之混摻爲佳。爲使丙烯酸酯系聚合物具衝擊強 度，亦可混摻壓克力系橡膠。 聚苯醚係含化1之構造單元一個以上之單聚物或共聚 物，亦可係其混摻物。化1式中η係5以上之整數，R i 至R4各係選自氫、鹵素、烴基及含鹵烴氧基等。這些構 造單元之代表例有，1 ，4 —苯醚、2，6 —二甲基—1 ，4 一苯醚、2，6 —二乙基—1 ，4 —苯醚、2 —甲基 —6 —乙基—1 ，4 —苯醚、2，6 —二苯基—1 ，4一 苯醚等。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） ·Γ&gt; , ,4 (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -17- 1248908 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（15)1248908 A7 _____ B7_ V. INSTRUCTION DESCRIPTION (1) TECHNICAL FIELD The present invention relates to containers for electronic parts, particularly carrier tapes. (Please read the precautions on the back and fill out this page.) First, the electronic components of ICs, diodes, liquid crystals, capacitors, etc., have card slots, molded carrier tapes (also referred to as carrier tapes), plates, bags, containers, Foam, etc. Containers are used for the collection, storage, and transportation of electronic components. For example, a molded carrier tape collects electronic components in its pockets and a cover tape as a carrier tape. To mount the electronic components on the base unit, peel off the belt and take out the electronic parts for use. In the electronic parts, I C, the integrated circuit of the wafer, is encapsulated by epoxy resin or the like. I C is easy to carry static electricity, which can cause damage to the integrated circuit in severe cases. Static electricity can be generated by vibration (friction) in the transport of packaged electronic components, or when the carrier tape is peeled off. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the consumer cooperatives. The containers of electronic components are mostly conductive, which is the removal of static electricity generated by the contact and friction between electronic components and containers. The charge generated evenly distributed in the container is less likely to cause a potential difference. In order to impart conductivity to the electronic component container, a resin in which a conductive metal material, carbon fiber, or carbon black is mixed is used. A conductive coating containing carbon black or the like may be applied to the surface of the container to impart conductivity. These capacitors can escape due to the grounding of the conductive ground. However, this still does not completely prevent the harm of static electricity. In particular, with the high integration of electronic components, the internal wiring is fine, and electronic components are more susceptible to static electricity. Static electricity also causes other problems. Due to static electricity, electronic components are attached to the container and sometimes difficult to remove. When the cover tape of the carrier tape is peeled off to take out the electronic components, the electronic components are dusty due to static electricity, and they fly out of the carrier tape. This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) &quot; ~ U -4- 1248908 A7 B7 V. Invention description (3) It can also enclose the surface of packaging containers and electronic components in contact with electronic components. The agent is similar to the charged column, or the positive and negative materials of the charged column are used. For example, the vinylidene fluoride polymer and the acrylate polymer have a completely different electrification column. The packaging container formed by the container is in contact with the electronic component and rubbed, and the static electricity generated on the surface of the component is small. By suppressing the generation of static electricity, the harmful effects of static electricity can be suppressed. It prevents the parts from adhering to the packaging container and protects the electronic parts that are sensitive to static electricity from static electricity. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 to Fig. 4 relate to Examples 2 to 2 5 and Comparative Examples 7 to 14. Fig. 1 illustrates a method of measuring the amount of charge using a cylinder. Figure 2 illustrates a method of measuring the amount of charge using a favorite part. Figure 3 shows a disk for a live test. Figure 4 shows the carrier tape used for the charging test. 1 series bevel, electronic parts slide down. The 2 series measures the sheet with the charge. 3 series resin cylinder. 4 series Faraday box. 5 series electronic parts. Printed by the Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperatives. Figure 5 is a friction test piece. Figure 6 is an I C disk. The 6 series is used for the friction test, and the I C bag with small holes on the bottom. The 7 series is used for the friction test, and the I C bag has a large hole on the bottom. 8 series I C bag for friction test with no holes on the bottom. 9 series fixed fine ribs for I C. The main components are compared with the Chinese National Standard (CNS) A4 specification (210X 297 mm); &gt; - 6 - 1248908 A7 ___ B7_ V. Invention description (6) (Please read the notes on the back and fill in the form) Page) Polycarbonate Polycarbonate such as bisphenol A type polycarbonate formed from aliphatic carbonate such as dimethyl carbonate or diethyl carbonate and 2,2-bis(4-hydroxyphenyl)propane The ester, or a mixture comprising polyethylene terephthalate or butylene terephthalate less than 50% by weight. The polyester is mainly composed of polyethylene glycol phthalate. These can be used alone or in combination. These sheets are processed into a molded belt, and a known method such as a vacuum forming method or a pressure forming method can be used. The surface resistance is 値 in the range shown, and may be mixed with a carbon black or an inorganic mash, or a conductive coating or an electron conductive high molecular dispersion dispersed with an inorganic mash. The sealant for the belt is preferably composed of a styrene copolymer and/or a vinyl copolymer. The styrene copolymer may be a copolymer of a styrene monomer and a conjugated diene monomer, a high impact polystyrene or the like. The styrene monomer may be o-methyl styrene, p-methyl styrene, p-terphenyl styrene or α-mercapto styrene, and the conjugated diene monomer may be 1,3-butadiene. 1 , 3 - pentadiene, 1,3-hexadiene, 2-methylpentadiene, and the like. Ministry of Economic Affairs, Intellectual Property Bureau, Staff and Consumer Cooperatives, printing ethylene copolymers, such as ethylene- 1 - butene, ethylene- _ olefin copolymer, ethylene-vinyl acetate copolymer, ethylene-butyl acrylate, ethylene-styrene copolymer a copolymer having an ethylene unit such as an ethylene-maleic anhydride-acrylate copolymer. These can be used in single or multiple combinations. The belt protector has a surface that is inclined at 30 degrees on the side of the collection side and is 28 mm square MQFP type IC encapsulated in epoxy resin (for example, 'NEC's paper size is applicable to the national standard (CNS) Α4 specification (210Χ297 public) PCT) 1248908 A7 _____ B7 V. Inventive Note (7) (Please read the note on the back and fill out this page) 2 2DMQF P-type IC) When sliding down 250mm, frictionally charged s-〇.3 to +0 • 3 Nakusaku is applicable to the present invention. The use of such a belt can suppress the generation of static electricity due to friction between the belt and the collectible. An effective method for making the stripping charge amount to a specific range is to use a sealing portion of the tape and the molded tape in a similar vicinity in the thermoplastic resin. When the thermoplastic resin is used for the belt and the molded belt, the static electricity is generated when the belt is peeled off, and the amount of electricity is high. It is also an effective method to use a thermoplastic resin on the charged row than the thermoplastic resin on the positive side of the tape and a thermoplastic resin on the more negative side in the molded tape. On the other hand, it is also an effective method to use a thermoplastic resin on the positive side of the thermoplastic resin for the molded tape and a thermoplastic resin on the negative side. Coating of Antistatic Agents Printed by the Ministry of Economic Affairs, Intellectual Property Bureau, and the Consumer Cooperatives. The protective tape and molded tape can be coated with an antistatic agent, preferably coated on a protective tape. This is a bag that takes into account the molded tape. Although the antistatic agent can be applied by a spray method, the drying time is high, and the antistatic agent and the wire pins are wiped off. However, the above does not negate the present invention by applying an antistatic agent to a molded tape. In the present invention, an antistatic agent can also be applied to the molded tape, and the electronic component which is easily damaged by static electricity can be used. The antistatic agent is an anionic type such as alkyl diethanolamine, polyoxyethylene alkylamine or alkyldiethanolamine, an alkylating group, an alkylsulfonate or the like, and a trialkylbenzylammonium salt. A cationic type such as a tetraalkylammonium salt, a zwitterionic type such as an alkylbetaine or an alkylimidazolium iron betaine is preferred, and a zwitterionic type is particularly preferred. The polymer type antistatic agent can be used in the Chinese national standard (10) A4 size (2Η) Χ 297 ～~7 1248908 A7 B7 5. Inventive description (8) Polyether type, including four grades A quaternary ammonium salt type such as an ammonium base acrylate copolymer or a betaine type such as a carbonyl betaine graft copolymer can also be used. (Please read the precautions on the back and fill out this page.) The thickness of these antistatic agents should be less than 2 _ 0 microns after drying. If it is too thick, the antistatic agent and various wire pins will be accumulated on the surface of the latter during the sealing process when the tape is heat-sealed in the molding tape, and then fall on the storage to cause contamination. The coating method of these antistatic agents is a conventional method such as a mirror surface, a gravure roll coater, and a spray. The control tape for controlling the electrostatic carrier tape with the electrified row can suppress the static electricity generated during the peeling, and the tape can be directed toward the surface of the electronic component, and the resin on the charged column facing the surface of the electronic component is easy to be positively charged, and is easy to be negative. Side charged resin. The charged column is arranged in order from the positively charged substance to the easily negatively charged substance when the substances rub against each other. The polarity of the substance changes with the friction object. When the substance on the positive side of the charging column rubs against the negative side material, the positive side material is positively charged and the negative side material is negatively charged. When the order is described by the working function and the Fermi level, the Fermi level is higher on the positive side of the live line and the lower is on the negative side. The Ministry of Economic Affairs, the Intellectual Property Office, the employee consumption cooperative, printed semiconductors and other electronic components are electrostatically charged due to vibration and friction of their packaging materials. The charge is transmitted through the wires when they are mounted on the substrate, and the solder balls generate currents, causing gate oxidation. The film or the interlayer insulating film is destroyed by heat of a short circuit and ESD (electrostatic discharge) such as breakage of the insulating film. Therefore, making the electronic parts themselves uncharged is a priority to avoid E S D damage. The electronic component such as a semiconductor is directed to the surface of the tape, that is, a so-called molding resin, and a cresol paint system, a bisphenol A epoxy resin, and an amine curing agent are used. These soil paper scales are suitable for the consumer (CNS) A4 specification (21GX297 mm) ' 4 Η -11- 1248908 A7 _ B7 V. Invention description (9) (Please read the note on the back and fill out this page) In the plastic resin, a material such as crystalline cerium oxide or molten cerium oxide is usually added. Further, in order to promote the hardening reaction of the epoxy resin, there is added an imidazole, a phosphorus compound hardening accelerator or the like. In addition to such a low-pressure transfer molding method, polyfluorene oxide or a phenol resin can be used by a casting method, a coating method, a dip coating method, a potting method, or a powder coating method. The main epoxy resin of the molding resin is a resin located at the intermediate position of the electrified column. The positive side resin includes a styrene-based polymer, a polycarbonate, an acrylic resin, and the negative-side resin has a polyethylene resin. Polyvinyl chloride resin, etc. Acrylic resin is acrylic acid, methyl methacrylate, ethyl ester, n-butyl ester and 2-ethylbutyl ester, 2-ethylhexyl ester, octyl ester, methoxyethyl ester, ethoxyethyl ester , 3-ethoxypropyl ester, hexyl ester, cyclohexyl ester, decyl ester, etc. or a copolymer of these, an ethylene-vinyl acetate copolymer or the like. Polyethylene-based resin, polyethylene, and copolymers of α-olefin and ethylene having a side chain of 3 or more carbon atoms (C number), such as propylene, butene, and hexene, are ultra-low-density polyethylene, and have a low linear shape. Density polyethylene, etc. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumers' Cooperatives. The resin containing the positive side of the electrified column and the resin on the negative side are not only the above methods, but also copolymers and grafts of their structure. Such a resin is, for example, a graft copolymer obtained by polymerizing a styrene chain branch to a polyethylene chain or the like. The weight ratio of the positive side resin and the negative side resin of the charging row is suitably 7 7 : 2 3 to 2 3 ·· 7 7 . At this time, the addition of various stabilizers such as antioxidants in their intended amounts does not have any influence on the present invention. Of course, it is also possible to reduce the surface resistivity by the protection of the electrification of the packaging material or the like by a conventional method. The protective tape of the present invention preferably uses the surface facing the electronic component and the electronic component, and applies the Chinese National Standard (CNS) Α4 specification (210Χ297 public) with a vibration of 300 round/minute and an amplitude of 5 mm. PCT) -12- 1248908 A7 B7 V. INSTRUCTIONS (10) (Please read the notes on the back and fill out this page.) After 1 minute, the static voltage on the side of the electronic parts is less than ±100 volts. 'Electronic parts are electronic parts that are housed in a carrier tape, or an epoxy resin encapsulant of 28 mm square MQF p-type IC (for example, 28DMQFP manufactured by NEC Corporation). Use of difluoroethane-fired polymer and cyanic acid The storage of the ester polymer as above is the static electricity generated when the protective tape is peeled off, and its prevention is essential. Therefore, the material of the bottom tape of the electronic component is also extremely important. The surface of the packaging container that is in contact with the electronic component should be used with an encapsulant. If it is close to the electrified column, or the positive side of the electrified row and the negative side. For example, if the difluoroethylene storage polymer and the cyanate ester polymer are contained, the contact between the packaging container and the electronic component can be reduced. Rubbing The amount of electricity generated on the surface of the part is different from that of the Ministry of Economic Affairs, the Intellectual Property Office, the Consumer Cooperative, and the printed polymer of the propylene-based polymer and the propylene-fluoride polymer. The two polymers are easily mixed in any proportion. The adjustment of the blending ratio can obtain a composition of the resin component which is close to the encapsulating agent constituting the electronic component to be collected, and can suppress the electrification of the electronic component and the packaging container due to contact and friction. The polymer having a partial cross-cutting Ethylene as a main component has a monomer and a copolymer. The copolymer is, for example, a vinylidene fluoride-tetrafluoroethylene-hexafluoropropylene copolymer, a vinylidene fluoride-hexafluorosilane. A propylene-based copolymer, etc. The acrylate-based polymer is a polymer containing acrylate as a main component, and has a monomer and a copolymer. The acrylate has, for example, an acrylate or a methyl group. I ” e π Τ Τ \ I I I I I Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Can also be combined with pressure system After that, it is a biaxial system. The method of setting the slope of the difluoride, the solvent of the sheet machine to remove the water-soluble amount such as ketone, and the Faraday polymer and C can be used to determine the partial two-charged column. Air, olefin polymer and surface, the method of removing electricity by the upper solvent. The acrylate of the acrylate is also preferably mixed with yttrium acrylate. The method of blending the ruthenium rubber, the melted polymer of the extruder, as shown in the first After the charge, the senoate-based polyvinyl fluoride polymerized from the slanted organic solvent is decomposed into an electronic component to be mixed with alcohol, and the acetone acrylate is slipped under the ion-based part. In the production method, the electron A7 V. (11) Acrylates and the like, and crotonate is also contained in the present invention. These can be used more than one. In the acrylate-based polymer, the methyl polymer can be blended with an impact strength of the acrylate-based polymer at any ratio and with difluoroethylene. Vinylidene fluoride polymer and acrylate can be used in the general method such as the Henschel machine and the drum machine for mechanical mixing and kneading. There are no special restrictions and acrylate polymers are commercially available. The charging diagram of the electronic component to the packaging container is made of a resin sheet constituting the electronic component, and is made of ionized air alcohol, acetone, etc., and a resin cylinder which is rolled up by ionized air, alcohol, and propylene, and is generated by a cylinder. . In the same manner, using a vinylidene fluoride compound in various ratios, the ratio of the material to the acrylate polymer and the resin thereof, and the amount of the vinylidene fluoride polymer and the propylene cylinder The closer it is, the other method of charging is as shown in Fig. 2. In addition to the electrolysis of the water-soluble organic solvent, the difluoroethylene polymer is flattened with air in various ratios, and water-soluble organic such as alcohol or acetone. The amount of charge on the part is measured by the Faraday box. The Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the note on the back and fill out this page) -14 - 1248908 A7 B7 V. Invention Note (12) The blending ratio of vinylidene fluoride and acrylate polymer with a very small amount of parts is similar to the charged column of the part. (Please read the precautions on the back and fill out this page.) The surface of the packaging container that contacts the electronic components contains vinylidene fluoride polymer and acrylate polymer, which is charged by electronic components after 3 times of rubbing. The amount below 1 nanocoulomb is better, and the following is better. In this range, it is possible to more effectively prevent electronic parts from being attached to and detached from the surface of the packaging container due to static electricity, and damage due to static electricity when collecting electronic parts. The charge amount of the 30-times friction electronic component is less than 1 nanocoulomb. The preferred one is 〇. 8 nanocoulomb or less, and the ratio of the vinylidene fluoride polymer and the propionate polymer can be adjusted. The electrified column obtained by the above method according to the above method is identical to the electronic component. It can also give the surface of the packaging container an inherent resistance of 〇1 〇2 to 1 ohm. The Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative, prints the conductivity of M/□. This effectively removes static electricity generated on the surface of the packaging container. The method of imparting is not particularly limited, and for example, a metal fiber such as a steel fiber, an aluminum fiber, a brass fiber, a copper fiber, or a stainless steel fiber, a metal oxide such as a conductive titanium oxide or a zinc oxide, or a metal surface such as carbon fiber or nickel is coated. Carbon fiber, carbon black, graphite powder, metal coated glass fiber and other electronic conductive materials, non-ionic, cationic, anionic, betaine surfactants, and high molecular weight polyetheramine A method of electrostatically conducting a plasma-conducting substance. Or the surface is coated with carbon micropowder, coated with a polymer conductive material such as polypyrrole, or the surface of the surface in contact with the conductive material is preferably a vinylidene fluoride polymer or an acrylate polymer. It can also be used only for the main part, or the contact paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -15- 1248908 A 7 _ B7_ V. Invention description (13) (Please read the back This is the part of the note. The packaging container of the present invention includes such a container. The surface of the packaging container to which the electronic component is in contact with the vinylidene fluoride polymer and the acrylate polymer means that part or all of the contact is so. Of course, in this case, all of the contact portion containing the vinylidene fluoride polymer and the acrylate polymer are preferred to prevent static electricity generation. The surface which is not in contact with the part also contains a vinylidene fluoride polymer and an acrylate-based polymer, and does not cause any problem in the present invention. The packaging container of the present invention includes such a container. Surfaces that are not in contact with the part contain the container and are fully assembled. Resin with low frictional charge The bar of the electronic component should be used when there is less static electricity when the contact between the electronic component and the electronic component is rubbed. Specifically, as shown in Fig. 5, the resin composition molded article and the electronic component are rubbed by 5 minutes at a speed of 600 rpm - after that, the absolute amount of charge generated by the electronic component is less than 1 Nakuhide. The best is below 0.8 nakulun. The resin composition of the Intellectual Property Office of the Ministry of the Economy is printed, for example, a composition containing an acrylate polymer, a styrene polymer, and a conductivity imparting material. 50 to 2 parts by weight of the propionate polymer, and 100 parts by weight of the styrene polymer 5 to 98 parts by weight, and the resin composition containing the conductivity imparting material i to 5 parts by weight The object is preferred. A resin composition containing an acrylate polymer, a polyphenylene ether, a styrene polymer, and a conductivity imparting material is also preferable. 50 to 2 parts by weight of the acrylate-based polymer, and 5 to 9 8 ^ of the polyphenylene ether and styrene-based polymer. The Chinese National Standard (CNS) A4 specification (21 (^297 mm) '- -- ^ -16- 1248908 V. INSTRUCTIONS (Μ) Parts by weight, in total, 1 part by weight, preferably containing a conductive composition of i to 5 parts by weight of the resin composition. The electronic parts may be actually stored in the use. The packaging of the resin composition as described above can also be used in the embodiment of the present invention. The absolute amount of the charge is smaller, and the more resistant to static electricity. The charge of the electronic parts during the Mocha is absolutely low, the resin The composition of the composition is not particularly limited. It is suitable for those in which an acryl-based polymer and a styrene-based polymer are added with a conductivity imparting material, or an acrylate-based polymer and a polyphenylene ether and a styrene-based polymer. Adding a conductivity-imparting material. The acrylate-based polymer has a large difference from the charged column of the styrene-based polymer and the polyphenylene ether, and the polymer is easily mixed. Therefore, the blending of these polymers is adjusted. Rate, the electrified column is close to the structure The charged column composition of the resin component of the packaging material of the electronic component of the collection can suppress the charging of the electronic component and the packaging container due to contact and friction. Acrylate polymer, with methyl methacrylate polymer and benzene The blending of the vinyl polymer is preferred. In order to impart impact strength to the acrylate polymer, an acrylic rubber may be blended. Polyphenylene ether contains one or more monomers or copolymers of structural units. Further, it may be a blended product thereof. In the formula 1, the η is an integer of 5 or more, and each of R i to R 4 is selected from the group consisting of hydrogen, halogen, a hydrocarbon group, a halogen-containing hydrocarbon group, etc. Representative examples of these structural units are 1 , 4-phenylene ether, 2,6-dimethyl-1,4-phenylene ether, 2,6-diethyl-1,4-phenylene ether, 2-methyl-6-ethyl-1,4- Phenyl ether, 2,6-diphenyl-1,4-phenylene ether, etc. This paper scale applies to Chinese National Standard (CNS) A4 specification (210X 297 mm) ·Γ&gt; , , 4 (Please read the back of the note first) Matters to fill out this page) Order Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Print -17-1248908 Ministry of Economics Intellectual Property Bureau employee consumption cooperative printed A7 B7 V. Invention description (15)

丙烯酸酯系聚合物及I 7 @ w &amp; 口切及本乙烯系聚合物之混合比率，以 對丙烯酸酯系聚合物5〇至2重量份、苯乙烯系聚合物 9 8至5 0重量份爲佳，以對關酸酯系聚合物4 〇至 10重量份、苯乙稀系聚合物6(D至9請量份爲更佳。 含丙烯酸酯系聚合物、苯乙烯系聚合物及聚苯醚時， 其混合比率較佳者爲對丙烯酸酯系聚合物5 〇至2重量份 、苯乙烧及聚苯醚合◦重量份，更佳者係對丙 烧酸醋系聚合物4 0至1 Q重量份、#乙稀系聚合物及聚 苯醚合計6 0至9 0重量份。丙烯酸酯系聚合物之比率加 大時，與電子零件摩擦時於電子零件產生之電荷量加大而 不佳。 樹脂組成物以具表面固有電阻値1 〇 i 2歐姆/ □以 下之導電性爲佳，因此宜含導電性賦予材料。表面固有電 阻値局’則所生靜電不易去除。容器之低電阻化，對包裝 容器表面所生靜電之去除有效。導電性賦予材料係添加於 樹脂組成物可提升導電性者，其種類無特殊限制。有例如 鋼纖維、鋁纖維、黃銅纖維、銅纖維、不銹鋼纖維等金屬 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） &gt; *&quot;18- (請先閲讀背面之注意事項再填寫本頁)The mixing ratio of the acrylate-based polymer and the I 7 @ w &amp; mouth-cutting and the present vinyl-based polymer is 5 to 2 parts by weight of the acrylate-based polymer, and 98 to 50 parts by weight of the styrene-based polymer. Preferably, it is preferably 4 to 10 parts by weight of the ester acid ester-based polymer and styrene-based polymer 6 (D to 9 parts are more preferred. Acrylate-based polymer, styrene-based polymer, and poly In the case of phenyl ether, the mixing ratio thereof is preferably 5 〇 to 2 parts by weight of the acrylate-based polymer, the benzene ethene and the polyphenylene ether conjugate weight, and more preferably the acrylic acid vinegar polymer 40 When the ratio of the acrylate polymer is increased, the amount of charge generated in the electronic component is increased when the ratio of the acrylate polymer is increased to 1 to 10 parts by weight, and the total amount of the acrylate polymer and the polyphenylene ether is 60 to 90 parts by weight. The resin composition preferably has a surface specific resistance of 〇1 〇i 2 ohm/□ or less, and therefore it is preferable to contain a conductivity imparting material. The surface inherent resistance is not easily removed. Low resistance, effective in removing static electricity generated on the surface of packaging containers. Conductivity imparting materials The addition of the resin composition can improve the conductivity, and the type thereof is not particularly limited. For example, steel, aluminum fiber, brass fiber, copper fiber, stainless steel fiber, etc. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297). *) *&quot;18- (Please read the notes on the back and fill out this page)

1248908 A7 B7 五、發明説明（16) (請先閲讀背面之注意事項再填寫本頁) 纖維、導電性氧化鈦、氧化鋅等金屬氧化物、碳纖、以鎳 等金屬作表面被覆處理之碳纖、碳黑、石墨粉、金屬被覆 玻纖等’非離子、陽離子、陰離子、甜菜鹼系界面活性劑 ’以及局分子量聚醚酯醯胺系等永久抗靜電劑等之離子傳 導性物質。 樹脂組成物之製造方法無特殊限制。可用例如丙烯酸 酯系聚合物、苯乙烯系聚合物及聚苯醚之混摻方法，以亨 謝爾機、轉鼓機作機械混合後，以雙軸擠出機熔融混練。 經濟部智慧財產局員工消費合作社印製 使包裝容器表面含偏二氟乙烯聚合物及丙烯酸酯系聚 合物之方法亦可應用於包裝容器以外，總之可減少靜電之 害。例如’樹脂製之零件易帶靜電，其表面以最適化組成 之偏一氟乙烯聚合物及丙烯酸酯系聚合物組成物被覆，即 可防靜電。此時若能滿足強度等之必要物性，零件本身亦 可由偏二氟乙烯聚合物及丙烯酸酯系聚合物製成。如此之 零件因與摩擦對象之帶電列可予調整，本身不易帶電，可 防靜電之害，以抗靜電劑塗布之方法不過係一時之防帶電 而已’其效果不比以上方法。組合如偏二氟乙烯聚合物及 丙烯酸酯系聚合物之帶電列大不相同但卻相溶之聚合物， 即可達如本發明之對靜電之效果。 本發明除容器之組成少有靜電產生，並使與電子零件 接觸之表面粗化，可減少電子零件與容器接觸所產生之靜 電。容器表面J I S B - 0601所規定之Ra係在 〇 . 5微米以上，1微米以上爲較佳，且/或J I S B 一 〇 6 0 1所規定之Rma X在5微米以上，1 〇微米以 -19 夹紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1248908 A7 _— _ B7___ 五、發明説明（17) 上爲較佳。若Ra在〇.5微米以上，Rmax在5微米 以上’摩擦時電子零件與其容器之接觸面積減少，可抑制 電子零件表面之帶電。 (請先閲讀背面之注意事項再填寫本頁} 賦予電子零件容器特定表面粗度之方法無特殊限制。 例如以射出成形製造電子零件容器之盤時，藉射出成形所 用模具表面粗度之調整，即可調整成形品，電子零件容器 之表面粗度。 以片材製作容器時，事先調整片材表面粗度，即可使 成形品電子零件容器之表面粗化。片材表面粗度調整方法 無特殊限制，有片材之製膜時，所擠出熔融樹脂之夾送輥 使用含砂之橡膠輥之方法。有使用經噴砂處理表面形成凹 凸之輥作爲夾送輥之方法。有使用雕刻輥之方法。有製膜 後之片材於線上或另作再加熱，以橡膠輥及/或噴砂處理 輥、雕刻輥夾送之方法。 經濟部智慧財產局員工消費合作社印製 有電子零件容器成形後，以噴砂處理形成表面凹凸之 方法。載帶之製作時可將製膜之片材加熱，以模具作模塞 助壓成形等方法，此時模具可先以噴砂處理等形成凹凸。 盤、盛器等之以熔融樹脂射入模具內製作時，模具可先以 噴砂處理等形成凹凸。電子零件容器表面粗度加大，可減 少電子零件與容器之接觸面積，結果即可壓低摩擦時電子 零件之帶電電壓。 使表面凹凸之其它方法有，於成形後電子零件容器片 材表面，以含球形氧化矽等細粉之塗料用棒塗機等塗布， 於表面形成凹凸之方法。於塗料配合抗靜電劑，或碳微粉 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -20- 1248908 A7 ___ _ _ B7 五、發明説明（18) '聚吼咯等導電化劑，同時賦予抗靜電、導電性亦可。 (請先閲讀背面之注意事項再填寫本頁) 上述電子零件容器可用熱塑性樹脂製造，熱塑性樹脂 之種類無特殊限制。較佳者爲耐衝撃強度良好之聚氯乙烯 、聚乙烯、聚丙烯、苯乙烯單聚樹脂、橡膠改質聚苯乙烯 系樹脂，以及具耐熱性之聚苯醚系樹脂、聚碳酸酯系樹脂 、聚酯系樹脂等。這些樹脂可係隨機共聚樹脂、嵌段共聚 樹脂’或接枝共聚樹脂。熱塑性樹脂可用一種以上。 電子零件容器亦可由使用熱塑性樹脂之電子零件包裝 用片材製造。 經濟部智慧財產局員工消費合作社印製 電子零件容器可賦予表面電阻値爲1 〇2至1 〇 12歐 姆之導電性。此具去除所生靜電之效果。其方法無特殊限 制’有例如在無損於熱塑性樹脂表面粗度之範圍內，添加 鋼纖維、鋁纖維、黃銅纖維、銅纖維、不銹鋼纖維等金屬 纖維、導電性氧化鈦、氧化鋅等金屬氧化物、碳纖、金屬 被覆處理碳纖、碳黑、石墨粉、金屬被覆玻纖等電子傳導 性物質之方法，及添加非離子系、陽離子系、陰離子系、 甜菜鹼系界面活性劑，以及高分子量聚醚系等永久抗靜電 劑之離子傳導性物質於熱塑性樹脂之方法。或於表面塗布 碳微粉，以聚吡咯等高分子系導電材料塗布處理，賦予導 電性亦可。電子零件包裝用片材亦同。 除上述以外，可於包裝容器表面以抗靜電劑塗布。此 具去除所生靜電之效果。抗靜電劑有非離子系、陽離子系 、陰離子系、甜菜鹼系之一般抗靜電劑。其塗布方法可用 例如凹版塗布法、輥塗法、浸塗法、噴霧法等已知方法。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -21 - 1248908 A7 ____ B7 五、發明説明（19) 必要時可於片材塗布面施以電暈放電處理，或以其它塗劑 作底塗處理。電子零件包裝用片材亦同。 (請先閲讀背面之注意事項再填寫本頁) 包裝容器可予多層化。包裝容器與零件接觸之表面亦 可將不同樹脂於厚度方向層合而多層化。藉此可變化折曲 強度、拉伸強度、剛性等。其方法無特殊限制，有例如使 用多數擠出成形機，將熔融樹脂以設在擠出機與模頭間之 送料機構多層化後，由T模擠出形成多層片材之方法，以 多數擠出成形機，將熔融樹脂由多支管式模頭擠出而多層 化之方法，經製膜之各片材再度加熱軟化後多層化之方法 等。而射出成形品更可用多層成形之手法。 經濟部智慧財產局員工消費合作社印製 用於電子零件容器之樹脂，可添加其它成分。會加大 因與電子零件摩擦所生帶電電壓者應避免添加，或少量添 加。其它成分有例如滑石、雲母、氧化矽、氧化鋁、鈦酸 鉀晶鬚、氧化鈣等金屬氧化物、碳酸鈣、碳酸鎂、矽酸鈣 、玻纖、玻璃片、玻璃珠等塡料。亦可添加非碳纖維、鋼 纖維、鋁纖維、黃銅纖維、銅纖維、不銹鋼纖維等金屬纖 纖、碳纖、金屬被覆碳纖、碳黑、石墨粉、金屬被覆玻纖 等導電性物質。其添加可使樹脂具導電性。電子零件容器 具導電性不成任何問題，乃較佳形態之一。此時可僅使與 電子零件接觸之部份導電化，或以二層以上之構造，不與 電子零件直接接觸之層亦具導電性。 電子零件容器及樹脂，在無損於本發明目的之範圍， 亦可配合以強化材料、發泡劑、滑劑、抗氧化劑、防紫外 線劑、偶合劑、阻然劑、三氧化銻等阻燃助劑、耐熱安定 夺紙張尺度適用中.國國家標準（CNS ) A4規格（210X297公釐） -22- 1248908 A7 B7 五、發明説明（2(| 劑、著色劑。 (請先閲讀背面之注意事項再填寫本頁) 本發明中包裝容器意指包裝電子零件之容器。有例如 卡槽、載帶、盤、袋、盛器等。這些可藉射出成形，或將 電子零件包裝用片材以壓製成形法、真空成形法、壓空成 形法等已知方法形成載帶、盤等電子零件容器之形狀而得 ，或以異型擠出得卡槽形狀。更可用吹塑法，由模頭熔融 擠出製作膠膜，該膜以熱熔合或粘合劑形成袋狀物製成袋 。這些容器主要用於電子零件之收藏、保管、搬運，亦可 用於這些零件的構裝之際。 電子零件有I c、電阻、電容器、電感、電晶體、二 極體、L E D (發光二極體）、液晶、壓電元件電阻器、 濾波器、晶體振盪器、晶體諧振器、連接器、開關、可變 電阻、繼電器等。I C之形式無特殊限制，有例如S〇P 、HEMT、SQFP、BGA、CSP、S〇J、 QFP、PLCC等。對靜電敏感之I C、LED、液晶 等，本發明之包裝容器尤爲適用。 經濟部智慧財產局員工消費合作社印製 片材、包裝容器之製作方法無特殊限制，可用射出成 形法，將片材以真空成形、壓空成形、壓製成形等已知片 材成形法，以例如擠出機作T模成形、壓延成形、溶劑澆 鑄法等。使用多數樹脂時，可將必要時用轉鼓機或捏合機 等混合之原料，以單軸或雙軸擠出機熔融混練擠出，經布 拉本德機熔融混練等所得樹脂，用上述方法製成片材。 實施例 杰紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -23- 1248908 A7 B7 五、發明説明（21) 實施例1至1 7及比較例1至3係有關上述剝離帶電 少之載帶體。 (請先閲讀背面之注意事項再填寫本頁) 實施例1至1 7 於厚2 5微米之◦- P ET膜之單面施以底塗處理， 擠出熔融低密度聚乙烯使厚度爲1 5微米，得厚4 0微米 之膜。於該膜之聚乙烯側，以表1至表6之樹脂熔融擠出 成1 5微米厚層合。並於實施例4至6、1 0至1 2、 15至17。實施例1至3、7至9、13、14以烷基 甜菜鹼系抗靜電劑於兩面塗布成厚度0.1微米。 比較例1至3 使用比較例1至3之樹脂及模壓帶，比較例2、3以 烷基甜菜鹼系抗靜電劑於兩面塗布成厚度0 · 1微米以外 ，如同實施例施行。 護膜表面電阻値之量測 經濟部智慧財產局員工消費合作社印製 切取1 0公分X 1 0公分之試片’於溫度2 3°C，相 對濕度5 0 %之環境下以6 0秒量測。 剝離帶電量之量測 使用寬2 4毫米，袋距1 6毫米之模壓帶’及長3 2 毫米，寬0 . 5毫米之封帶，以密封時間0 · 4秒熱封寬 21.5毫米之膜。該載帶體用SIMCO公司製除電裝 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨〇X 297公釐） -24- 經濟部智慧財產局員工消費合作社印製 1248908 A 7 ___ _B7 __ 五、發明説明（22) 置將帶電量降至〇±〇 . 01奈庫侖，以剝離角度170 至1 8 0度，剝離速度3 0 0毫米/分鐘剝開1 1 2毫米 ，該膜以E T S公司製之法拉第箱量測電荷量。這些量測 係在溫度2 3 °C，相對濕度2 0 ± 3 %之環境下施行。 剝離帶電壓之量測 如同剝離帶電量之量測製成載帶體，以相同條件剝離 °量測係於剝離點起剝開1 0毫米處，於膜上方5 0毫米 之點用基恩斯公司製帶電壓量測儀（S K 2 0 0 )非接觸 爲之。 摩擦帶電量之量測 製成之膜固定於傾斜3 0度之面，膜上以N E C公司 製2 8毫米見方之MQFP型I C滑落2 5 0毫米，落下 處以E T S公司製設有法拉第箱之裝置，量測該I c所生 之電荷量。 杰紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)1248908 A7 B7 V. INSTRUCTIONS (16) (Please read the precautions on the back and fill out this page) Metal oxides such as fibers, conductive titanium oxide, and zinc oxide, carbon fibers, and carbon fibers coated with metals such as nickel. An ion-conducting substance such as a non-ionic, cationic, anionic or betaine-based surfactant such as carbon black, graphite powder or metal-coated glass fiber, or a permanent antistatic agent such as a polyether ester amide or a urethane. The method for producing the resin composition is not particularly limited. For example, an acrylate polymer, a styrene polymer, and a polyphenylene ether can be mixed by a Henschel machine or a rotary drum machine, and then melt-kneaded in a twin-screw extruder. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumers' Cooperatives. The method of containing the vinylidene fluoride polymer and the acrylate polymer on the surface of the packaging container can also be applied to the packaging container, and in the end, the static electricity can be reduced. For example, 'resin-made parts are easily electrostatically charged, and the surface thereof is coated with a composition of a vinylidene fluoride polymer and an acrylate-based polymer having an optimum composition, that is, it is antistatic. In this case, if the necessary physical properties such as strength are satisfied, the parts themselves can be made of a vinylidene fluoride polymer and an acrylate polymer. Such a part can be adjusted due to the charging column of the rubbing object, and it is not easy to be charged by itself, and it can prevent static electricity. The method of applying the antistatic agent is not only anti-charged for a while. The effect is not higher than the above method. The combination of a vinylidene fluoride polymer and an acrylate-based polymer having a large but differently charged polymer can achieve the effect of static electricity as in the present invention. In the present invention, the composition of the container is less likely to generate static electricity, and the surface in contact with the electronic component is roughened, thereby reducing the static electricity generated by the contact of the electronic component with the container. The Ra content of the container surface JISB - 0601 is preferably 5 μm or more, preferably 1 μm or more, and/or the Rma X specified by JISB 〇 601 is 5 μm or more, 1 〇 μm to -19 clips. The paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1248908 A7 __ _ B7___ V. The invention description (17) is preferred. If Ra is above 5 μm and Rmax is 5 μm or more, the contact area between the electronic component and the container is reduced, and the charging of the surface of the electronic component can be suppressed. (Please read the precautions on the back and fill out this page.) There is no special restriction on the method of giving the surface thickness of the electronic component container. For example, when the disk of the electronic component container is manufactured by injection molding, the surface roughness of the mold for injection molding is adjusted. The surface roughness of the molded article and the electronic component container can be adjusted. When the container is made of a sheet, the surface roughness of the sheet can be adjusted in advance to roughen the surface of the molded electronic component container. There is a special method for forming a film of a sheet, and a method of using a rubber roller containing sand to form a pinch roller for extruding a molten resin. There is a method of using a roller having a surface formed by blasting as a pinch roll. The method comprises the steps of: forming a film after the film is formed on the wire or by reheating, using a rubber roller and/or a sandblasting roller and an engraving roller. The Ministry of Economic Affairs, the Intellectual Property Bureau, the employee consumption cooperative, has printed the electronic component container. After that, the surface irregularities are formed by sand blasting, and the film-forming sheets can be heated during the production of the carrier tape, and the mold can be used as a plug-assisted pressure forming method. The mold may be formed by blasting or the like. When the molten resin is injected into the mold, the mold may be formed by sandblasting or the like. The surface of the electronic component container is increased in thickness, and the electronic parts and containers can be reduced. As a result, the contact voltage can be used to lower the charging voltage of the electronic component during the friction. Other methods for making the surface irregularities include coating the surface of the electronic component container sheet with a bar coating machine containing a fine powder such as spherical cerium oxide. , Method for forming irregularities on the surface. Suitable for Chinese anti-static agent or carbon micropowder. The Chinese National Standard (CNS) A4 specification (210X297 mm) -20- 1248908 A7 ___ _ _ B7 5. Invention Description (18 ) 'Electrochemical agent such as polyfluorene, and antistatic and conductive properties are also available. (Please read the back note and fill out this page.) The above electronic parts container can be made of thermoplastic resin, and the type of thermoplastic resin is not particularly limited. Preferred are polyvinyl chloride, polyethylene, polypropylene, styrene monopoly resin, rubber modified polystyrene series with good impact resistance. The resin is a heat-resistant polyphenylene ether resin, a polycarbonate resin, a polyester resin, etc. These resins may be a random copolymer resin, a block copolymer resin, or a graft copolymer resin. The thermoplastic resin may be used alone or in combination. The electronic component container can also be manufactured from sheets for packaging electronic parts using thermoplastic resins. The Ministry of Economic Affairs, Intellectual Property Office, and the Consumer Cooperatives printed electronic parts container can impart a surface resistance of 1 〇 2 to 1 〇 12 ohms. The effect of the generated static electricity is removed. The method is not particularly limited. For example, metal fibers such as steel fiber, aluminum fiber, brass fiber, copper fiber, and stainless steel fiber are added in a range that does not impair the surface roughness of the thermoplastic resin, and conductive oxidation is performed. Metal oxides such as titanium and zinc oxide, carbon fiber, metal coated carbon fiber, carbon black, graphite powder, metal coated glass fiber, and other electronic conductive materials, and nonionic, cationic, anionic, and betaine interfaces Active agent, and ion-conducting substance of permanent antistatic agent such as high molecular weight polyether in thermoplastic tree The method. Alternatively, carbon fine powder may be applied to the surface and coated with a polymer conductive material such as polypyrrole to impart conductivity. The sheets used for packaging electronic parts are also the same. In addition to the above, it may be coated with an antistatic agent on the surface of the packaging container. This has the effect of removing static electricity generated. The antistatic agent is a general antistatic agent of a nonionic, cationic, anionic or betaine system. The coating method can be, for example, a known method such as a gravure coating method, a roll coating method, a dip coating method, or a spray method. This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -21 - 1248908 A7 ____ B7 V. Invention description (19) Corona discharge treatment can be applied to the coated surface of the sheet if necessary, or other coating The agent is applied as a primer. The sheets used for packaging electronic parts are also the same. (Please read the notes on the back and fill out this page.) The packaging container can be multi-layered. The surface of the packaging container in contact with the part may also be laminated and multilayered in the thickness direction. Thereby, the flexural strength, tensile strength, rigidity, and the like can be changed. The method is not particularly limited, and for example, a method of forming a multilayer sheet by extruding a molten resin into a multi-layer sheet by a T-die by using a multi-die extrusion machine and multi-layering a feeding mechanism provided between the extruder and the die A molding machine, a method in which a molten resin is extruded from a manifold mold and multi-layered, a method in which each sheet of the film is heated and softened, and then multilayered. The injection molded article can be formed by a multi-layer forming method. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumers' Cooperative, the resin used in the electronic parts container, and other ingredients can be added. It will increase the amount of electrified voltage generated by friction with electronic parts, and should be added or added in small amounts. Other components include metal oxides such as talc, mica, cerium oxide, aluminum oxide, potassium titanate whisker, calcium oxide, calcium carbonate, magnesium carbonate, calcium silicate, glass fiber, glass flakes, glass beads, and the like. Conductive materials such as non-carbon fiber, steel fiber, aluminum fiber, brass fiber, copper fiber, stainless steel fiber, metal fiber, carbon fiber, metal-coated carbon fiber, carbon black, graphite powder, and metal-coated glass fiber may also be added. The addition allows the resin to be electrically conductive. It is one of the preferred forms that the electronic component container has no problem in electrical conductivity. In this case, only a portion in contact with the electronic component may be made conductive, or a layer having two or more layers, and the layer not in direct contact with the electronic component may be electrically conductive. The electronic component container and the resin may be blended with a reinforcing material, a foaming agent, a slip agent, an antioxidant, an ultraviolet shielding agent, a coupling agent, a resisting agent, a antimony trioxide, etc., without departing from the object of the present invention. Agent, heat stable and stable paper size applicable. National Standard (CNS) A4 specification (210X297 mm) -22- 1248908 A7 B7 V. Invention description (2 (| Agent, colorant. (Please read the back note first) Fill out this page again) The packaging container in the present invention means a container for packaging electronic parts, such as a card slot, a carrier tape, a tray, a bag, a container, etc. These can be formed by injection molding, or the sheet for packaging electronic parts can be formed by pressing. A known method such as a method, a vacuum forming method, or a pressure forming method is used to form a shape of an electronic component container such as a carrier tape or a disk, or a shape of a card slot is extruded by a profile, and can be melt extruded by a die by a blow molding method. Making a film made of a heat-fusible or adhesive-formed bag. These containers are mainly used for the collection, storage, and handling of electronic parts, and can also be used for the construction of these parts. c, electricity Resistor, capacitor, inductor, transistor, diode, LED (light emitting diode), liquid crystal, piezoelectric element resistor, filter, crystal oscillator, crystal resonator, connector, switch, variable resistor, relay Etc. The form of the IC is not particularly limited, and there are, for example, S〇P, HEMT, SQFP, BGA, CSP, S〇J, QFP, PLCC, etc. The electrostatically sensitive IC, LED, liquid crystal, etc., the packaging container of the present invention is particularly Applicable to the Ministry of Economic Affairs, the Intellectual Property Bureau, the Consumer Cooperatives, the production method of printing sheets and packaging containers, without any special restrictions, the injection sheet forming method, the sheet forming method such as vacuum forming, pressure forming, press forming, etc. For example, an extruder can be used for T-die molding, calender molding, solvent casting, etc. When a large amount of resin is used, a raw material mixed by a drum machine or a kneader or the like can be melt-kneaded in a uniaxial or twin-screw extruder if necessary. Extrusion, the resulting resin by melt-blending and so on by Brabender, and made into a sheet by the above method. Example Jie Paper Scale Applicable to Chinese National Standard (CNS) A4 Specification (210X297 mm) -23- 1248908 A7 B7 (Invention) (21) Examples 1 to 17 and Comparative Examples 1 to 3 are related to the above-described tape carrier having less peeling electrification. (Please read the back note first and then fill in this page) Examples 1 to 1 7 2 5 micron ◦ - one side of the P ET film is subjected to a primer treatment, and the molten low density polyethylene is extruded to a thickness of 15 μm to obtain a film having a thickness of 40 μm. On the polyethylene side of the film, The resins of 1 to 6 were melt extruded into a 15 μm thick laminate and were used in Examples 4 to 6, 10 to 12 2, 15 to 17. Examples 1 to 3, 7 to 9, 13, 14 were alkane. The base betaine antistatic agent was applied to both sides to a thickness of 0.1 μm. Comparative Examples 1 to 3 Using the resins and molded tapes of Comparative Examples 1 to 3, Comparative Examples 2 and 3 were coated on both sides with an alkylbetaine antistatic agent. The thickness is 0 · 1 μm, as in the embodiment. The surface resistance of the film is measured by the Ministry of Economic Affairs. The Intellectual Property Bureau employee consumption cooperative prints a test piece of 1 0 cm X 1 0 cm at a temperature of 2 3 ° C and a relative humidity of 50% in an environment of 60 seconds. Measurement. The stripping power was measured using a width of 24 mm, a molded belt with a distance of 16 mm and a length of 3 2 mm, a width of 0.5 mm, and a sealing time of 0 · 4 seconds. . The carrier tape is manufactured by SIMCO Co., Ltd. The size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (2丨〇X 297 mm) -24- Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1248908 A 7 ___ _B7 __ V. INSTRUCTIONS (22) Set the charge amount to 〇±〇. 01Nikulun, stripping angle 170 to 180 degrees, peeling speed 300 mm/min stripping 112 cm, the film is ETS The company's Faraday box measures the amount of charge. These measurements were carried out at a temperature of 23 ° C and a relative humidity of 20 ± 3 %. The stripping voltage is measured as the stripping power. The strip is measured by the same conditions. The stripping is performed under the same conditions. The measuring system is peeled off at a distance of 10 mm from the peeling point, and is made by Keyence at a point of 50 mm above the film. The voltage measuring instrument (SK 2 0 0) is non-contact. The film produced by measuring the amount of frictional charge is fixed at a slope of 30 degrees, and the MQFP type IC made by NEC Corporation is 8 mm square, which is slid down by 250 mm. The device is equipped with a Faraday box made by ETS. The amount of charge generated by the I c is measured. Jay paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) (please read the notes on the back and fill out this page)

-25- 1248908 B7 五、發明説明（23) 經濟部智慧財產局員工消費合作社印製 表 1 實施例1 實施例2 實施例3 所用樹脂 苯乙烯一丁二 烯共聚物 乙烯-丙烯酸 乙酯及乙烯一 醋酸乙烯酯共 聚物（1 : 1 混摻物） 苯乙烯一丁二 烯共聚物及乙 烯-馬來酸酐 -丙烯酸酯共 聚物（1 : 1 混摻物） 抗靜電處理 無 Μ Μ ^\\\ 表面電阻値歐姆 1 0 1 4 1014 1 0 1 4 模壓帶 苯乙烯系樹脂 A 苯乙烯系樹脂 A 苯乙烯系樹脂 A 剝離帶電量奈庫侖 一 8 + 6 -5 剝離帶電量伏特 -18 0 0 + 15 0 0 -10 0 0 剝離帶電量奈庫侖 + 0.25 -0.27 + 0.21 表 2 實施例4 實施例5 實施例6 所用樹脂 苯乙烯—丁二 烯共聚物 乙烯-丙烯酸 乙酯及乙烯一 醋酸乙烯酯共 聚物（1 : 1 混摻物） 苯乙烯一丁二 烯共聚物及乙 烯-馬來酸酐 -丙烯酸酯共 聚物（1 : 1 混摻物） 抗靜電處理 有 有 有 表面電阻値歐姆 1 0 1 0 1 0 9 1 0 9 模壓帶 苯乙烯系樹脂 A 苯乙烯系樹脂 A 苯乙烯系樹脂 A 剝離帶電量奈庫侖 0.01 -0.4 0.00 剝離帶電量伏特 -2 0 -6 3 + 6 剝離帶電量奈庫侖 + 0.08 -0.27 -0.1 (請先閲讀背面之注意事項再填寫本頁) 、r 本紙張又度適用中國國家標準（CNS ) A4規格（210X297公釐） -26- 1248908 A7 B7 五、發明説明（24) 表 3 實施例7 實施例8 實施例9 所用樹脂 苯乙烯-丁二烯共聚 物 乙烯一丙烯酸乙酯及 乙烯一醋酸乙烯酯共 聚物（1:1混摻物 ) 苯乙儲-丁二烯共聚 物及乙烯-馬來酸酐 -丙烯酸酯共聚物（ 1:1混摻物） 抗靜電處理 Μ J \ \Λ te j\w 無 表面電阻値歐姆 1 0 1 4 1014 1 0 1 4 模壓帶 苯乙烯系樹脂Β 苯乙烯系樹脂Β 苯乙烯系樹脂Β 剝離帶電量奈庫侖 -4.4 + 3.6 -4.5 剝離帶電量伏特 -9 8 0 + 7 8 0 2 8 0 表 4 實施例1 0 實施例1 1 實施例1 2 所用樹脂 苯乙烯-丁二烯共聚 物 乙烯一丙烯酸乙酯及 乙烯一醋酸乙烯酯共 聚物（1 : 1混摻物 ) 苯乙烯一丁二烯共聚 物及乙烯-馬來酸酐 -丙烯酸酯共聚物（ 1:1混摻物） 抗靜電處理 有 有 有 表面電阻値歐姆 1 〇10 1 09 1 09 模壓帶 苯乙烯系樹脂Β 苯乙烯系樹脂Β 苯乙烯系樹脂Β 剝離帶電量奈庫侖 + 0.04 -0.29 + 0 · 0 0 剝離帶電量伏特 + 8 -6 -3 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 表 5 實施例1 3 實施例1 4 實施例1 5 所用樹脂 苯乙烯-丁二烯共聚 苯乙烯一丁二烯共聚 苯乙烯一丁二烯共聚 物及乙烯-馬來酸酐 物及乙烯-馬來酸酐 物及乙烯一馬來酸酐 -丙烯酸酯共聚物（ -丙烯酸酯共聚物（ -丙烯酸酯共聚物（ 1:1混摻物） 1:1混摻物） 1:1混摻物） 抗靜電處理 Μ j \ \\ 紐 ^\\\ 表面電阻値歐姆 1 014 1014 1 09 模壓帶 聚碳酸酯A 聚碳酸酯Β 聚碳酸酯A 剝離帶電量奈庫侖 -8.4 -8.8 -0.89 剝離帶電量伏特 -3 9 0 -2 9 0 -15 0 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 27- 1248908 A7 —------ 五、發明説明（25) ^ 6 ---------- 實施例1 6 實施例17 _ 所用樹脂 苯乙烯-丁二烯共聚物及乙烯-馬來酸酐-丙烯酸酯共聚物（1 :1混摻物） 苯乙烯一丁二烯共聚物及乙烯一 馬來酸酐一丙烯酸酯共聚物（1 :1混摻物） 抗靜電處理 有 有 查菌電阻値歐姆 1 09 1 09 帶 碳酸酯B mm ' 剝離帶電量奈庫侖 一 0 · 5 3 -2 · 6 帶電量伏特 -4 1-13 0 表 7 比較例1 比較2 比較例3 所用樹脂 苯乙烯-丁二烯共聚 物及乙烯-馬來酸酐 一丙烯酸酯共聚物（ 1:1混摻物） 苯乙烯-丁二烯共聚 物及乙烯-馬來酸酐 -丙烯酸酯共聚物（ 1:1混摻物） 聚酯系熱壓合型粘合 劑 抗靜電處理 表面電阻値歐姆 無 1 014 有 1 09 W -- 1 〇10 1 壓帶 聚氯乙烯系樹脂 聚氯乙烯系樹脂 苯乙烯系樹脂A 剝_帶電量奈庫侖 剝離帶電量伏特 剝離帶電量奈庫侖 + 19 + 3 3 0 0 + 12 + 2 6 0 0 + 12 + 2 8 0 0 一1 · 1 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 實施例1至1 7，比較例1至3所用原料如下。 所用樹脂： 苯乙烯—丁二烯共聚物：Denkaclialene ( 7 〇重量份 )及Denka STR1250 ( 3 0重量份）之混摻物。 乙烯—馬來酸酐一丙烯酸酯共聚物：日本Polyolefin ET-1 84M。 乙烯—丙烯酸乙酯：日本Unicar公司製〇卩〇了 — 6 16 9° 乙烯—醋酸乙烯酯共聚物：日本Unicar公司製 N U C 3 4 6 0 。 本紙張尺度逍用中國國家標準（CNS ) A4規格（210X297公釐） ：&gt; ；&gt; Γ 1248908 A7 _ B7__ 五、發明説明（26) 聚酯系熱壓合型粘合劑：大日精化公司製Seikaddain T (護帶）。 (請先閲讀背面之注意事項再填寫本頁) 苯乙烯系樹脂A : Denkaclialene片材之成形品（片 材表面固有電阻爲10 14歐姆/□)。 苯乙嫌系樹脂B : Denkathermo片材E C之成形品（ 片材表面固有電阻爲105歐姆/□)。 聚碳酸酯A :帝人化成公司製L 1 2 5 0擠出成形爲 厚〇 _ 3毫米，再以E D G公司模壓成形機製作成形品。 聚碳酸酯B:帝人化成公司製L1250事先以 Denka乙炔黑熔融混合，再擠出成形爲厚〇 · 3毫米，以 E D G公司模壓成形機製作成形品。 聚酯：Denka APET片材之成形品。 電子零件於實施例之載帶收藏、搬運、轉送後剝去護 帶亦少有靜電產生，可防電子零件附著於護帶，並能防止 電子零件之靜電破壞。 實施例1 8至2 1及比較例4至6係有關以帶電列控 制靜電之例。 經濟部智慧財產局員工消費合作社印製 實施例1 8至2 1 厚2 5微米之雙軸延伸P E T膜單面作氨酯系底塗處 理，擠出厚1 5微米之熔融低密度聚乙烯，得厚4 0微米 之膜。於該膜之聚乙烯側，以表8之樹脂熔融擠出成厚度 3 0微米層合。 夺紙張尺度適用中國國家標準（CNS ) A4規格（210X29?公釐） 29 - 1248908 A7 B7 五、發明説明（27) 比較例4至6 除用表9之樹脂以外’如同實施例1 8至2 1施行。 帶電壓之量測 使護帶之表8所列樹脂面朝上，除電至帶電壓 ±0.03千伏之NEC公司製28毫米見方MQFP型 I C以導線朝上搭載，以振幅寬5毫米，3 0 0來回/分 鐘振動1分鐘後，用絕緣體鑷子取出電子零件量測帶電壓 (非接觸，用基恩斯公司製帶電壓量測儀s K 2 0 0 ) ，以η = 1 〇行之。表中記載量測平均之絕對値。 (請先閲讀背面之注意事項再填寫本頁) 表 8 實施例18 實施例19 實施例20 實施例21 所用樹脂 苯乙烯_丁二烯隨機共聚 物 50重量份 C6直鏈低密度聚乙烯 50重量份 苯乙烯-丁二烯隨 機共聚物 75重量份 C6直鏈低密度聚 乙烯 25重量份 乙烯-接枝苯乙烯 聚合物 100重量份 乙烯-丙烯酸乙酯 30重量份 苯乙烯-丁二烯隨 機共聚物 30重量份 低密度聚乙烯 40重量份 零件之帶 電壓 伏特 200 900 300 450 -訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） -30- 1248908 A7 B7 夂、發明説明（28) 表 9 比較例4 比較例 所用樹脂 苯乙烯·丁二 烯隨機共聚物 5 〇重量份 高衝擊強度聚 苯乙烯 5 〇重量份 一苯 乙烯-丁二 烯隨機共聚物 1 0 0重量份 乙烯-醋酸乙 烯酯共聚物 1 〇 〇重量份 零件之帶電壓 伏特 2200 1900 1800 一請先閲讀背面之注意事項存填寫本貢) 經濟部智慧財產局員工消費合作社印製 實施例1 8至2 1，比較例4至6所用原料如下。 苯乙烯一丁二烯隨機共聚物：Denkaclialene (苯乙烯 含量8 5重量％ )。 c 6直鏈低密度聚乙烯：日本Poly chem公司製 Carnel KC570S 〇 乙烯-接枝苯乙烯聚合物：日本油脂公司製Mo dip er All 00 (乙烯含量70重量％)。 乙烯—丙烯酸乙酯：日本Unicar公司製N U C 6 2 2 1° 低密度聚乙烯：東曹公司製Petrocene 2 0 3。 高衝擊強度聚苯乙烯：Denka HIE6 (苯乙烯含量9 2 重量％ )。 乙烯—醋酸乙烯酯共聚物：日本Uni car公司製 N U C 3 7 5 0。 實施例2 2至3 3，比較例7至1 8係有關使用偏二 氟乙烯聚合物及丙烯酸酯系聚合物之容器之例。各量測 六紙張尺度逍用中國國家標準（〇灿）八4規格（21〇\297公着） -31 - 1248908 A7 B7 五、發明説明（2弓 依以下條件爲之。 帶電電荷量：使用Electro-Tech System公司奈庫侖 (請先閱讀背面之注意事項再填寫本頁) 計及法拉第箱’量測電子零件及圓柱之帶電電荷量。離子 化器：使用SIMC〇公司AEROSTAT PC。 振盪機：使用東京理科器機公司、Queto Mixer&quot;。 實施例2 2 偏—*截乙傭聚合物（KYNAR公司製，商品名： 7 2 0 ) 7 5重量份，及丙烯酸酯系聚合物聚甲基丙烯酸 甲酯（三菱Rayon公司製，商品名：AcrypetG) 2 5重 量份以亨謝爾混合機混摻，以池貝機械公司製雙軸擠出機 熔融混練擠出，製作混練物。該混練物再以單軸擠出機熔 融混練，經T模製成厚5 0微米之膜。將膜張貼於第2圖 所示角度3 0度之斜面上，膜表面以用離子化器離子化之 空氣噴吹去除電荷。 經濟部智慧財產局員工消費合作社印製 之後，同樣用離子化器去除作爲電子零件的I C ( MQFP型，28毫米見方）之電荷後，使其滑下量測 I C之帶電電荷，得〇 . 〇2奈庫侖。因而使用該組成之 混練物，以射出成形製作第3圖所示，I C盛載用盤狀物 。將I C盛載於此盤，用振盪機以振動速率6 0 0次/分 鐘，摩擦3 0秒，量測I C之摩擦表面所生之電荷量。結 果列於表1 0，帶電電荷量極低，僅0 . 2 3奈庫侖。 實施例2 3 32 表紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1248908 A7 B7 五、發明説明（30) (請先閲讀背面之注意事項再填寫本頁) 偏一截乙儲聚合物（KYNAR公司，商品名： 720) 75重量份，與丙烯酸酯系聚合物聚甲基丙烯酸 甲酯（三菱Rayon公司製，商品名：Acrypet G) 2 5重 量份所成之混練物，及聚對酞酸乙二醇酯（Unitica公司 製）以擠出機擠出’藉送料機構法層合法，製膜成偏二氟 乙烯與甲基丙烯酸甲酯之混摻物，及聚對酞酸乙二醇酯所 成之厚0·5毫米之雙層膜。 該膜一片疊合於偏二氟乙儀與聚甲基丙嫌酸甲酯混摻 物所成之面’二邊_部熱溶合製成袋狀物。袋中放入_^顆 I C (MQFP ’ 28毫米見方），用振盪機以振動速率 6 0 0次/分鐘，於3 0秒摩擦3 0 〇次，測量〗C所生 電荷量。結果列於表10，帶電電荷量低，僅〇 . 15奈 庫命。 實施例2 4 經濟部智慧財產局員工消費合作社印製 偏二氟乙烯聚合物（KYNAR公司，商品名： 720) 30重量份，與丙烯酸酯系聚合物聚甲基丙儲酸 甲酯（三菱Rayon公司製，Acrypet G) 7 0重量份如同 實施例2 2熔融混練成混練物後，再熔化經τ模擠出製作 厚5 0微米之膜。將膜張貼於第1圖所示角度2 〇度之斜 面上，膜表面以用離子化器離子化之空氣噴吹去除電荷。 之後，同樣將用離子化器去除電荷之鐵M龍製圓柱（ 0 2 5毫米X 2 5毫米高）由斜面上部滾下，量測產生於 鐵氟龍圓柱之電荷量，得-0.35奈庫侖。以同樣方法 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 雜 -33 1248908 A 7 __ B7__ 五、發明説明（31) (請先閲讀背面之注意事項再填寫本頁) 製作聚苯乙烯之厚0.3毫米之片材，張貼於斜面上，用 離子化器去除電荷之鐵氟龍製圓柱由斜面上部滾下，量測 鐵氟龍圓柱所生之電荷量，得- 0 . 3 3奈庫侖。偏二氟 乙烯聚合物與聚甲基丙烯酸甲酯之混合樹脂經擠出製成厚 0 . 5毫米之片材後，以壓製成形法製作第4圖所示之載 帶狀物。載帶之袋內盛載聚苯乙烯樹脂（10毫米X1〇 毫米X3毫米），用振盪機以振動速率600次/分鐘， 於3 0秒摩擦3 0 0次，量測所收藏聚苯乙烯之電荷量。 結果列於表1 0，帶電電荷量低如一 0 . 3 4奈庫侖。 實施例2 5 經濟部智慧財產局員工消費合作社印製 偏二氟乙烯聚合物（KYNAR公司，商品名7 2 0 )70重量份，與丙烯酸酯聚合物聚甲基丙儲酸甲酯（三 菱Rayon公司製，Aery pet G) 3 0重量份以如同實施例 2 2之方法熔融混練成混練物後，再度熔化經τ模擠出， 製成厚5 0微米之膜。將膜張貼於如第1圖之角度2 〇度 之斜面上，膜表面以用離子化器離子化之空氣噴吹去除電 荷。之後，同樣用離子化器去除電荷之鐵氟龍製圓柱（0 2 5毫米X 2 5毫米高）由斜面上部滾下，量測產生於鐵 氟龍圓柱之電荷量，得-〇.14奈庫侖。 另外’使用購得之聚氯乙烯2毫米厚片材，貼於斜面 上，由斜面上部滾下用離子化器去除電荷後之鐵氟龍圓柱 ，量測產生於鐵氟龍圓柱之電荷量，得一 〇 . 1 2奈庫侖 。偏二氟乙烯聚合物及聚甲基丙烯酸甲酯之混合樹脂擠出 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） &quot; -34- 1248908 A7 B7 五、發明説明（32) (請先閲讀背面之注意事項再填寫本頁) 成厚〇·5毫米之片材後，以壓製成形法製成第4圖之載 帶狀物。載帶之袋內放入聚氯乙烯樹脂（1 〇毫米X 1 〇 毫米X2毫米），用振盪機以振動速率600次/分鐘， 於3 0秒摩擦3 0 0次，量測所收藏之聚氯乙烯樹脂所產 生之電荷量。結果列於表10，帶電電荷量低如0 . 30 奈庫侖。 比較例7 爲與實施例2 2比較，以樹脂原料偏二氟乙烯聚合物 (KYNAR公司製，商品名7 2 0)射出成形，製作如 同實施例2 2之第3圖所示盤狀物。用振盪機以振動速率 6 0 0次/分鐘摩擦3 0秒，量測於I C產生之電荷量。 結果列於表11 ，帶電電荷量高達1·53奈庫侖。 比較例8 經濟部智慧財產局員工消費合作社印製 爲與實施例2 2比較，樹脂原料甲基丙烯酸甲酯樹脂 (三菱Rayon公司製，商品名Aery pet G)以射出成形製 作如同實施例2 2之盤。之後，用振盪機以振動速率 6 0 0次/分鐘摩擦3 0秒，量測產生於I C之電荷量。 結果列於表1 1 ，帶電電荷量高達- 2 · 0 6奈庫侖。 比較例9 爲與實施例2 3比較，聚乙烯樹脂（日本Polychem 公司製，商品名Novate )及聚對酞酸乙二醇酯（Unitica 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -35- 1248908 A7 B7 五、發明説明（33) (請先閲讀背面之注意事項再填寫本頁) 公司製）用二台擠出機共擠出，經送料機構製成雙層厚 5 0微米之膜。該膜二片以聚乙烯面相向疊合，三邊經熱 熔合製成袋狀物。該袋中放入I C，以如同實施例2 3之 方法摩擦，量測產生於I C之電荷量。結果列於表1 1， 帶電電荷量高達1.21奈庫侖。 比較例1 0 爲與實施例2 3比較，甲基丙烯酸甲酯與苯乙烯之隨 機共聚樹脂（電氣化學工業公司製，商品名TX)及聚對 酞酸乙二醇酯（Unitica公司製）用二台擠出機共擠出， 經送料機構法製作厚5 0微米之膜。該膜二片以甲基丙烯 酸甲酯與聚苯乙烯隨機共聚樹脂面相向疊合，三邊經熱熔 合製成袋狀物。該袋中放入I C，以如同實施例2 3之方 法摩擦，量測I C之帶電電荷量。結果列於表1 1，帶電 電荷量高達一 1 . 49奈庫侖。 比較例1 1 經濟部智慧財產局員工消費合作社印製 爲與實施例2 4比較，聚丙烯樹脂（Sanaroma公司 製）擠出成厚〇 . 5毫米之片材後，經壓製成形法製成第 4圖所示之載帶狀物。載帶之袋內放入聚苯乙烯成形物（ 10毫米X 10毫米X 3毫米），以如同實施例2 4之方 法摩擦’量測產生於所收藏之聚苯乙烯之電荷量。結果列 於表11 ，帶電電荷量高達1.72奈庫侖。 $纸張尺度適用中國國家榡準（CNS ) A4規格（210X297公釐） 1248908 A 7 B7 五、發明説明（34) 比較例1 2 (請先閲讀背面之注意事項再填寫本頁) 爲與實施例2 4比較，聚對酸酸乙二醇酯（Unitica 公司製）擠出製成厚0 . 5毫米之片材後，經壓製成形法 製作如第4圖之載帶狀物。載帶之袋內放入聚苯乙烯樹脂 成形物（10毫米Χίο毫米X 3毫米），以如同實施例 2 4之方法摩擦，量測產生於所收藏之聚苯乙烯之電荷量 。結果列於表1 1 ，帶電電荷量高達一 1 · 24奈庫侖。 比較例1 3 爲與實施例2 5比較，聚丙烯樹脂（Sanaroma公司 製）擠出製成厚0 . 5毫米之片材後，以壓製成形法製成 如第4圖之載帶狀物。載帶之袋內放入聚氯乙烯成形物（ 10毫米乂10毫米\2毫米），如同實施例25摩擦， 量測產生於所收藏之聚氯乙烯之電荷量。結果列於表1 1 ，帶電電荷量高達一1.41奈庫侖。 比較例1 4 迻齊郎智慧时4¾員工消費合作社印製 爲與實施例2 5比較，聚對酞酸乙二醇酯樹脂（ Unitica公司製）擠出成厚0 . 5毫米之片材，以壓製成 形法製成第4圖所示之載帶狀物。載帶之袋內放入聚氯乙 烯樹脂成形物（10毫米xlO毫米x2毫米），如同實 施例2 4摩擦，量測產生於所收藏之聚氯乙烯之電荷量。 結果列於表1 1 ，帶電電荷量高達一 2 · 2 9奈庫侖。 本紙張尺度適用中國國家標準（CNS〉A4規格（210X297公釐） Λ Λ *4 Η -37- 1248908 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（35) 表 10 包裝容器形狀 包裝容器樹脂 內包零件 帶電量 實施例 盤 PVDF:75 I c 0.23nC 22 PMMA:25 實施例 袋 PVDF:75 I c 0. 1 5nC 23 PMMA:25 實施例 載帶 PVDF.30 聚苯乙烯 -0.34nC 24 PMMA:70 實施例 載帶 PVDF:70 聚氯乙烯 0.30nC 25 PMMA:30 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -38- 1248908 A7 —--______ B7 五、發明説明（36) 表 — 包裝容器形狀 包裝容器樹脂 內包零件 帶電量 比較例 盤 PVDF: 100 1C 1 .53nC 比較例 盤 PMMA: 100 1C -2.06nC 比較例 袋 PE:100 1C 1.21nC 比較例 袋 MMA-St 1C -1.49nC 1〇 共重合樹脂：100 比較例 載帶 PP:100 聚苯乙烯 1.72nC 比較例 載帶 PET:100 聚苯乙儲 -1.24nC _L2 比較例 載帶 PP:100 聚氯乙烯 -1.4 1 nC 13 比較例 載帶 PET:100 聚氯乙烯 -2.29nC 14 由實施例2 2至2 5及比較例7至1 4可知，與電子 零件接觸之包裝容器內面使用偏二氟乙烯聚合物與丙烯酸 酯系聚合物之混摻物，並調整其混摻比率至與電子零件之 帶電列一致，即可減少因包裝容器與電子零件之接觸，摩 擦而產生於零件表面之帶電量。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） ：&gt; .Λ Γ .-：* Η Γλ (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -39- 經濟部智慧財產局員工消費合作社印製 1248908 A7 _ B7 _ 五、發明説明（37) 實施例2 6至3 3，比較例1 5至1 8係有關摩擦帶 電少之樹脂之例。表面電阻値係如下量測。-25- 1248908 B7 V. INSTRUCTIONS (23) Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperatives Printed Table 1 Example 1 Example 2 Example 3 Resin Styrene-Butadiene Copolymer Ethylene-Ethyl Acrylate and Ethylene Monovinyl acetate copolymer (1:1 blend) Styrene-butadiene copolymer and ethylene-maleic anhydride-acrylate copolymer (1:1 blend) Antistatic treatment without flaw Μ ^\\ \ Surface resistance 値 ohm 1 0 1 4 1014 1 0 1 4 Molded tape styrene resin A styrene resin A styrene resin A Stripping charge Nykron - 8 + 6 -5 Stripping charge volts -18 0 0 + 15 0 0 -10 0 0 stripping charge necoron + 0.25 -0.27 + 0.21 Table 2 Example 4 Example 5 Example 6 Resin styrene-butadiene copolymer ethylene-ethyl acrylate and ethylene-vinyl acetate Ester copolymer (1:1 blend) Styrene-butadiene copolymer and ethylene-maleic anhydride-acrylate copolymer (1:1 blend) Antistatic treatment has surface resistance 値 ohm 1 0 1 0 1 0 9 1 0 9 Molded belt Styrene Resin A Styrene Resin A Styrene Resin A Stripping Charge Necolun 0.01 -0.4 0.00 Stripping Charge Volt-2 0 -6 3 + 6 Stripping Charge Necolun + 0.08 -0.27 -0.1 (Please Read the precautions on the back page and fill in this page), r This paper is again applicable to China National Standard (CNS) A4 specification (210X297 mm) -26- 1248908 A7 B7 V. Invention description (24) Table 3 Example 7 Example 8 Example 9 Resin styrene-butadiene copolymer ethylene ethyl acrylate and ethylene-vinyl acetate copolymer (1:1 blend) Benzene storage-butadiene copolymer and ethylene-maleic anhydride -Acrylate copolymer (1:1 blend) Antistatic treatment Μ J \ \Λ te j\w No surface resistance 値 ohm 1 0 1 4 1014 1 0 1 4 Molded with styrene resin 苯乙烯 Styrene resin苯乙烯 Styrene resin 剥离 Stripping charge Nykron - 4.4 + 3.6 -4.5 Stripping charge volts -9 8 0 + 7 8 0 2 8 0 Table 4 Example 1 0 Example 1 1 Example 1 2 Resin styrene used -butadiene copolymer ethylene ethyl acrylate and ethylene monoacetic acid Vinyl ester copolymer (1:1 blend) Styrene-butadiene copolymer and ethylene-maleic anhydride-acrylate copolymer (1:1 blend) Antistatic treatment has surface resistance 値 ohm 1 〇10 1 09 1 09 Molded with styrene resin 苯乙烯 Styrene resin 苯乙烯 Styrene resin 剥离 Stripping charge Nyclon + 0.04 -0.29 + 0 · 0 0 Stripping charge volts + 8 -6 -3 (please Read the notes on the back page and fill out this page. Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperatives Printed Table 5 Example 1 3 Example 1 4 Example 1 5 Resin Styrene-Butadiene Copolystyrene Butadiene Copolystyrene-butadiene copolymer and ethylene-maleic anhydride and ethylene-maleic anhydride and ethylene-maleic anhydride-acrylate copolymer (-acrylate copolymer (-acrylate copolymer (1: 1 mixed admixture) 1:1 mixed admixture) 1:1 mixed admixture) antistatic treatment Μ j \ \\ New ^\\\ Surface resistance 値 ohm 1 014 1014 1 09 Molded tape with polycarbonate A polycarbonate聚碳酸酯 Polycarbonate A stripping charge nacolun -8.4 -8.8 -0.89 stripping Charge volts - 3 9 0 -2 9 0 -15 0 This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) 27- 1248908 A7 —------ V. Description of invention (25) ^ 6 ---------- Example 1 6 Example 17 _ Resin styrene-butadiene copolymer and ethylene-maleic anhydride-acrylate copolymer (1:1 blend) styrene Butadiene copolymer and ethylene-maleic anhydride-acrylate copolymer (1:1 blend) Antistatic treatment has anti-bacterial resistance 値 Ohm 1 09 1 09 with carbonate B mm ' Stripping charge Nylon One 0 · 5 3 -2 · 6 Charge volts - 4 1-13 0 Table 7 Comparative Example 1 Comparison 2 Comparative Example 3 Resin styrene-butadiene copolymer and ethylene-maleic anhydride monoacrylate copolymer ( 1:1 mixed admixture) Styrene-butadiene copolymer and ethylene-maleic anhydride-acrylate copolymer (1:1 blend) Polyester thermocompression adhesive antistatic surface resistance値Ohm no 1 014 1 09 W -- 1 〇 10 1 Pressure belt PVC resin Polyvinyl chloride resin Styrene resin A Stripping _ with charge Lun stripping with volts stripping with charge Nyclon + 19 + 3 3 0 0 + 12 + 2 6 0 0 + 12 + 2 8 0 0 1 1 · 1 (please read the notes on the back and fill out this page) Intellectual Property Bureau Staff Consumer Cooperatives Printed Examples 1 to 7 7. The materials used in Comparative Examples 1 to 3 were as follows. Resin used: Styrene-butadiene copolymer: a blend of Denkaclialene (7 parts by weight) and Denka STR 1250 (30 parts by weight). Ethylene-maleic anhydride monoacrylate copolymer: Japan Polyolefin ET-1 84M. Ethylene-ethyl acrylate: Manufactured by Unicar, Japan — 6 16 9° Ethylene-vinyl acetate copolymer: N U C 3 4 6 0 manufactured by Unicar Corporation of Japan. The paper size is based on the Chinese National Standard (CNS) A4 specification (210X297 mm): &gt;;&gt; Γ 1248908 A7 _ B7__ V. Description of invention (26) Polyester thermocompression bonding adhesive: Days Refine The company's Seikaddain T (guard belt). (Please read the precautions on the back and fill out this page.) Styrene Resin A: A molded article of Denkaclialene sheet (the surface specific resistance of the sheet is 10 14 ohm/□). A styrene resin B: a molded article of Denkathermo sheet E C (the sheet surface specific resistance was 105 ohm/□). Polycarbonate A: L 1 2 50 manufactured by Teijin Chemicals Co., Ltd. was extruded into a thickness of _ 3 mm, and a molded article was produced by an E D G press molding machine. Polycarbonate B: L1250 manufactured by Teijin Chemical Co., Ltd. was melt-mixed in advance with Denka acetylene black, and then extruded into a thickness of 3 mm, and a molded article was produced by an E D G press molding machine. Polyester: A molded article of Denka APET sheet. In the embodiment, the tape is stripped and removed after being carried, transported, and transferred, and static electricity is generated. The electronic component is prevented from adhering to the tape and the electrostatic breakdown of the electronic component is prevented. Examples 1 to 2 1 and Comparative Examples 4 to 6 are examples in which static electricity is controlled by a charged column. Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed Example 1 8 to 2 1 A 2 μm thick biaxially stretched PET film is coated on one side as a urethane primer, and a 150 μm thick molten low density polyethylene is extruded. A film of 40 microns thick is obtained. On the polyethylene side of the film, the resin of Table 8 was melt extruded into a thickness of 30 μm. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X29? mm) 29 - 1248908 A7 B7 V. Inventive Note (27) Comparative Examples 4 to 6 Except the resin of Table 9 'Like Example 18 to 2 1 implementation. With the voltage measurement, the resin listed in Table 8 of the belt is facing up, and the 28 mm square MQFP type IC manufactured by NEC Co., Ltd. with a voltage of ±0.03 kV is mounted with the wire facing upwards, with an amplitude of 5 mm wide, 3 0 After vibrating for 1 minute at 0/minute, the voltage of the electronic component was measured with an insulator tweezers (non-contact, with a voltage measuring instrument s K 2 0 0 manufactured by Keyence), and η = 1 was performed. The table shows the absolute 量 of the measurement average. (Please read the note on the back and then fill out this page) Table 8 Example 18 Example 19 Example 20 Example 21 Resin styrene-butadiene random copolymer 50 parts by weight C6 linear low density polyethylene 50 weight Styrene-butadiene random copolymer 75 parts by weight C6 linear low density polyethylene 25 parts by weight ethylene-graft styrene polymer 100 parts by weight ethylene-ethyl acrylate 30 parts by weight styrene-butadiene random copolymerization 30 parts by weight of low-density polyethylene 40 parts by weight of parts with voltage volts 200 900 300 450 - Ministry of Economic Affairs Intellectual Property Bureau employees consumption cooperatives printed paper scale applicable to China National Standard (CNS) Α 4 specifications (210X297 mm) - 30- 1248908 A7 B7 夂, invention description (28) Table 9 Comparative Example 4 Comparative Example Resin styrene-butadiene random copolymer 5 〇 parts by weight high impact strength polystyrene 5 〇 parts by weight styrene-butyl Alkene random copolymer 100 parts by weight ethylene-vinyl acetate copolymer 1 〇〇 parts by weight with voltage volts 2200 1900 1800 Please read the following notes Fill in this tribute) Ministry of Economic Affairs Intellectual Property Office employees consumer cooperatives printed Example 1 8-2 1, Comparative Example 4-6 as the raw material used. Styrene-butadiene random copolymer: Denkaclialene (styrene content 85 wt%). c 6 linear low-density polyethylene: Carnel KC570S, manufactured by Polychem, Japan 〇 Ethylene-grafted styrene polymer: Mo dip er All 00 (ethylene content 70% by weight) manufactured by Nippon Oil & Fats Co., Ltd. Ethylene-ethyl acrylate: N U C 6 2 2 1° manufactured by Unicar, Japan Low-density polyethylene: Petrocene 2 0 3 manufactured by Tosoh Corporation. High impact polystyrene: Denka HIE6 (styrene content 92% by weight). Ethylene-vinyl acetate copolymer: N U C 3 7 5 0 manufactured by Uni Car, Japan. Example 2 2 to 3 3, and Comparative Examples 7 to 18 are examples of containers using a vinylidene fluoride polymer and an acrylate-based polymer. The measurement of six paper scales using the Chinese national standard (〇灿) eight 4 specifications (21〇\297 public) -31 - 1248908 A7 B7 V. Invention description (2 bow according to the following conditions. Charged charge: use Electro-Tech System's Nai Kulun (please read the back note first and then fill out this page) Take into account the Faraday box 'measure the charged charge of electronic parts and cylinders. Ionizer: use SIMC〇 company AEROSTAT PC. Oscillator: Using Tokyo Technician Co., Ltd., Queto Mixer&quot;. Example 2 2 Partial-*-cutting agent polymer (manufactured by KYNAR, trade name: 7 2 0) 7 5 parts by weight, and acrylate-based polymer polymethyl methacrylate Ester (manufactured by Mitsubishi Rayon Co., Ltd., trade name: AcrypetG) 25 parts by weight was blended by a Henschel mixer, and melt-kneaded and extruded by a twin-screw extruder manufactured by Chiba Machinery Co., Ltd. to prepare a kneaded product. The shaft extruder is melt-kneaded, and a film of 50 μm thick is formed by a T-die. The film is attached to the inclined surface of the angle of 30 degrees shown in Fig. 2, and the surface of the film is sprayed with air ionized by an ionizer. Charge. Ministry of Economic Affairs After the production bureau employee consumption cooperative printed, the ion of the IC ( MQFP type, 28 mm square), which is an electronic component, was also removed by an ionizer, and then it was slid down to measure the charged charge of the IC, which was obtained. 〇2Nakulun Therefore, using the kneaded material of this composition, the IC-loaded disk is shown in Fig. 3 by injection molding. The IC is carried on the disk, and the vibration is performed at a vibration rate of 6,000 times/min with a oscillating machine. 0 seconds, measure the amount of charge generated by the friction surface of the IC. The results are shown in Table 10. The charged charge is extremely low, only 0.23 necolun. Example 2 3 32 Table paper scale applies to Chinese national standard (CNS) A4 size (210X297 mm) 1248908 A7 B7 V. Invention description (30) (Please read the note on the back and fill out this page) Partially stored polymer (KYNAR, trade name: 720) 75 parts by weight And the acrylate-based polymer polymethyl methacrylate (manufactured by Mitsubishi Rayon Co., Ltd., trade name: Acrypet G), 25 parts by weight of the kneaded product, and polyethylene terephthalate (manufactured by Unitica Co., Ltd.) Extruder extrusion 'borrowing mechanism law layering, film making a mixture of vinylidene fluoride and methyl methacrylate, and a double film of 0. 5 mm thick formed by polyethylene terephthalate. The film is laminated on a difluoroethane instrument and a poly The surface of the methyl propylene succinate methyl ester blend is made into a bag. The _^ IC (MQFP '28 mm square) is placed in the bag, and the vibration rate is obtained by a oscillating machine. 600 times / minute, rubbing 3 0 times in 30 seconds, measuring the amount of charge generated by C. The results are shown in Table 10. The amount of charged charge is low, only 〇. 15奈 库命. Example 2 4 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed vinylidene fluoride polymer (KYNAR, trade name: 720) 30 parts by weight, with acrylate polymer polymethyl methacrylate (Mitsubishi Rayon) Company made, Acrypet G) 70 parts by weight as in Example 2 2 melt-kneaded into a kneaded material, and then melted and extruded through a τ die to form a film having a thickness of 50 μm. The film was placed on the slope of the angle 2 所示 degree shown in Fig. 1, and the surface of the film was sprayed with air ionized by an ionizer to remove electric charges. After that, the iron of the M-long cylinder (0 2 5 mm X 2 5 mm high), which is also removed by an ionizer, is rolled off from the slant surface, and the amount of charge generated in the Teflon cylinder is measured to obtain -0.35 nanocolon. . In the same way, the paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) Miscellaneous-33 1248908 A 7 __ B7__ V. Invention description (31) (Please read the note on the back and fill out this page) A sheet of 0.3 mm thick styrene is attached to the inclined surface, and the Teflon cylinder is removed by an ionizer to roll off the inclined surface, and the amount of charge generated by the Teflon cylinder is measured to obtain -0.3. 3 necolun. The mixed resin of the vinylidene fluoride polymer and the polymethyl methacrylate was extruded to form a sheet having a thickness of 0.5 mm, and then the carrier tape shown in Fig. 4 was produced by press molding. The bag of the carrier tape is filled with polystyrene resin (10 mm X1 〇 mm X 3 mm), and the vibration is performed at a vibration rate of 600 times/min with a oscillating machine at 300 times per minute for 30 times. The amount of charge. The results are shown in Table 10, and the amount of charged charge is as low as 0.34 nikol. Example 2 5 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative printed vinylidene fluoride polymer (KYNAR, trade name 7 2 0) 70 parts by weight, with acrylate polymer polymethyl methacrylate (Mitsubishi Rayon) The company, Aery pet G) 30 parts by weight was melt-kneaded into a kneaded material in the same manner as in Example 2, and then melted again by a τ die to form a film having a thickness of 50 μm. The film was applied to a slope of an angle of 2 degrees as shown in Fig. 1, and the surface of the film was sprayed with air ionized by an ionizer to remove the charge. After that, the Teflon cylinder (0 2 5 mm X 2 5 mm high), which is also removed by an ionizer, is rolled down from the slant surface, and the amount of charge generated in the Teflon cylinder is measured. coulomb. In addition, 'the commercially available polyvinyl chloride 2 mm thick sheet was attached to the inclined surface, and the Teflon cylinder was removed by the ionizer to remove the electric charge from the inclined surface. The amount of charge generated in the Teflon cylinder was measured. Get a trip. 1 2 Necolun. Mixed resin of vinylidene fluoride polymer and polymethyl methacrylate extruded paper size applicable to China National Standard (CNS) A4 specification (210X297 mm) &quot; -34- 1248908 A7 B7 V. Invention description (32) (Please read the precautions on the back and fill out this page.) After forming a sheet of 5 mm thick, the carrier tape of Figure 4 is formed by press molding. Put the polyvinyl chloride resin (1 〇 mm X 1 〇 mm X 2 mm) into the bag of the carrier tape, and use a oscillating machine to vibrate at 600 times/min, rubbing 300 times at 30 seconds, and measure the collected poly. The amount of charge produced by the vinyl chloride resin. The results are shown in Table 10, and the amount of charged charge is as low as 0.30 nikol. Comparative Example 7 In the same manner as in Example 2, a resin material of a vinylidene fluoride polymer (manufactured by KYNAR Co., Ltd., trade name: 7 2 0) was injection-molded, and a disk-like material as shown in Fig. 3 of the same Example 2 was produced. The amount of charge generated by I C was measured by shaking with a oscillating machine at a vibration rate of 600 times/min for 30 seconds. The results are shown in Table 11, with a charged charge of up to 1.53 nanocoulomb. Comparative Example 8 Printed by the Ministry of Economic Affairs, the Intellectual Property Office, and the employee's consumer cooperative. In comparison with Example 2, the resin raw material methyl methacrylate resin (trade name: Aery pet G, manufactured by Mitsubishi Rayon Co., Ltd.) was produced by injection molding as in Example 2 2 The disk. Thereafter, it was rubbed with a oscillating machine at a vibration rate of 600 times/min for 30 seconds, and the amount of charge generated at I C was measured. The results are shown in Table 1 1 and the charged charge is as high as -2 · 0 6 nanocoulomb. Comparative Example 9 In comparison with Example 23, a polyethylene resin (manufactured by Polychem Corporation of Japan, trade name Novate) and polyethylene terephthalate (Unitica paper size applicable to China National Standard (CNS) A4 specification (210X297) PCT) -35- 1248908 A7 B7 V. INSTRUCTIONS (33) (Please read the note on the back and fill out this page) The company system is coextruded with two extruders and made into a double layer thickness by the feeding mechanism. 0 micron film. The two sheets of the film are laminated with the polyethylene faces facing each other, and the three sides are thermally fused to form a bag. I C was placed in the bag, rubbed in the same manner as in Example 23, and the amount of charge generated in I C was measured. The results are shown in Table 1. The charged charge is as high as 1.21 nanocoulomb. Comparative Example 1 0 A random copolymer resin of methyl methacrylate and styrene (manufactured by Electric Chemical Industry Co., Ltd., trade name: TX) and polyethylene terephthalate (manufactured by Unitica Co., Ltd.) were used in comparison with Example 23. Two extruders were co-extruded, and a film of 50 μm thick was produced by a feeding mechanism method. The two sheets of the film were laminated with a surface of a random copolymer of methyl methacrylate and polystyrene, and three sides were thermally fused to form a bag. I C was placed in the bag, and the amount of charged charge of I C was measured by rubbing as in the method of Example 23. The results are shown in Table 1. The charged charge is as high as 1.49 nacolun. Comparative Example 1 1 The Ministry of Economic Affairs, the Intellectual Property Office, and the Employees' Consumer Cooperative were printed in the same manner as in Example 2, and the polypropylene resin (manufactured by Sanaroma Co., Ltd.) was extruded into a thick sheet. After 5 mm of the sheet, it was produced by press molding. Figure 4 shows the carrier tape. A polystyrene molded article (10 mm X 10 mm X 3 mm) was placed in a bag of the carrier tape, and the amount of charge generated in the collected polystyrene was measured by rubbing as in the method of Example 24. The results are shown in Table 11, with a charged charge of up to 1.72 nanocoulomb. $ Paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) 1248908 A 7 B7 V. Invention description (34) Comparative example 1 2 (Please read the back note before completing this page) Example 2 4 Comparative, polyethylene terephthalate (manufactured by Unitica Co., Ltd.) was extruded to form a sheet having a thickness of 0.5 mm, and a carrier tape as shown in Fig. 4 was produced by press molding. A polystyrene resin molded article (10 mm οίο mm X 3 mm) was placed in a bag of the carrier tape, and rubbed in the same manner as in Example 24 to measure the amount of charge generated in the collected polystyrene. The results are shown in Table 1 1 and the charged charge is as high as 1 · 24 nanocoulomb. Comparative Example 1 3 In comparison with Example 25, a polypropylene resin (manufactured by Sanaroma Co., Ltd.) was extruded to obtain a sheet having a thickness of 0.5 mm, and then a carrier tape as shown in Fig. 4 was produced by press molding. A polyvinyl chloride molded article (10 mm 乂 10 mm \ 2 mm) was placed in a bag of the carrier tape, and the amount of charge generated from the collected polyvinyl chloride was measured as in Example 25. The results are shown in Table 1 1 with a charged charge of up to 1.41 nanocoulomb. Comparative Example 1 4 When the Sense of Wisdom was moved, the employee consumption cooperative was printed as compared with Example 25, and a polyethylene terephthalate resin (manufactured by Unitica Co., Ltd.) was extruded into a sheet having a thickness of 0.5 mm. The carrier tape shown in Fig. 4 was produced by press molding. A polyvinyl chloride resin molded article (10 mm x 10 mm x 2 mm) was placed in a bag of the carrier tape, and the amount of charge generated from the collected polyvinyl chloride was measured as in Example 24. The results are shown in Table 1 1 , with a charged charge of up to 2 · 2 9 necoules. This paper scale applies to the Chinese national standard (CNS>A4 specification (210X297 mm) Λ Λ *4 Η -37- 1248908 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed A7 B7 V. Invention description (35) Table 10 Packaging container shape Packaging Container Resin Including Parts Charge Example Disk PV: 75 I c 0.23nC 22 PMMA: 25 Example bag PVDF: 75 I c 0. 1 5nC 23 PMMA: 25 Example carrying PVDF.30 Polystyrene -0.34 nC 24 PMMA: 70 Example Carrying PVDF: 70 Polyvinyl Chloride 0.30nC 25 PMMA: 30 (Please read the back note first and then fill out this page) This paper scale applies to Chinese National Standard (CNS) A4 specification (210 X 297) -38- 1248908 A7 —--______ B7 V. INSTRUCTIONS (36) TABLE — Packaging Container Shape Packaging Container Resin In-Package Parts Charge Comparison Disk PV: 100 1C 1 .53nC Comparative Example PMMA: 100 1C -2.06nC Comparative bag PE: 100 1C 1.21nC Comparative bag MMA-St 1C -1.49nC 1〇 Co-coincidence resin: 100 Comparative example carrier tape PP: 100 Polystyrene 1.72nC Comparative example Carrier tape PET: 100 Polyphenylene B -1.24nC _L2 Comparative Example Carrier Tape PP: 100 Polyvinyl Chloride-1.4 1 nC 13 Comparative Example Carrier Tape PET: 100 Polyvinyl Chloride-2.29nC 14 From Examples 2 to 2 5 and Comparative Examples 7 to 14 The inner surface of the packaging container in contact with the electronic component is mixed with a vinylidene fluoride polymer and an acrylate polymer, and the mixing ratio thereof is adjusted to be consistent with the electrification column of the electronic component, thereby reducing the packaging container and the electron. The contact between the parts and the friction generated by the surface of the parts. This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm): &gt; .Λ Γ .-:* Η Γλ (Please read the back Note: Please fill out this page) Printed by the Ministry of Economic Affairs, Intellectual Property Bureau, Staff and Consumer Cooperatives -39- Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumer Cooperatives, Printing 1248908 A7 _ B7 _ V. Invention Description (37) Example 2 6 to 3 3 Comparative Example 1 5 to 18 are examples of resins having less frictional charge. The surface resistance enthalpy is measured as follows.

表面電阻値：成形品表面以3 0毫米間隔設置之藤倉 化成公司之銀膏塗布、銀膏間之電阻値，用Advantest公 司 R83 40ULTRA HIGH RESISTANCE METER 量 SU ο 實施例2 6 丙烯酸酯系聚合物聚甲基丙烯酸甲酯（三菱Rayon 公司製，商品名Aery pet MD) 20重量份，苯乙烯聚合 物聚苯乙烯（東洋苯乙烯公司製，商品名Toy 〇 sty rol MW-Z ) 8 0重量份，及導電性賦予材料碳黑（電氣化學 工業公司製，商品名Denka Acetylene Black粒狀）2 2 重量份以轉鼓混合機混摻，用池貝機械公司製0 4 5毫米 同向旋轉型雙軸擠出機熔融混練擠出製作混練物。該混練 物用射出成形機製作如5圖之摩擦試片。該成形品上盛載 電子零件，用離子化器除電之I C (日本電氣公司製， V25 Microprocessor 2 8 毫米見方），Queto Mixer 上以 6 0 0轉/分鐘之速度摩擦5分鐘。摩擦終止後以鑷子夾 起I C，投入法拉第箱中量測於I c所產生之電荷量。結 果列於表1 2，帶電電荷量低如0 · 2 5奈庫侖。 實施例2 7 實施例2 6之成形品上盛載電子零件，用離子化器除 本紙張尺度逍用中國國家標準（CNS ) A4規格（210X297公釐） 4? -40- (請先閱讀背面之注意事項再填寫本頁)Surface resistance 値: The surface of the molded article was placed at a spacing of 30 mm, and the silver paste coating of the Fujikura Kasei Co., Ltd., the resistance between the silver pastes, and the amount of the R83 40ULTRA HIGH RESISTANCE METER by the Advantest company. Example 2 6 Acrylate-based polymer polymerization Methyl methacrylate (manufactured by Mitsubishi Rayon Co., Ltd., trade name: Aery pet MD) 20 parts by weight, styrene polymer polystyrene (manufactured by Toyo Styrene Co., Ltd., trade name Toy sty rol MW-Z) 80 parts by weight, And the conductivity imparting material carbon black (manufactured by Denki Kagaku Kogyo Co., Ltd., trade name Denka Acetylene Black granular material) 2 2 parts by weight was mixed by a tumbler mixer, and the 245 mm co-rotating biaxial extrusion was made by Chiba Machinery Co., Ltd. The machine is melted and kneaded and extruded to produce a kneaded material. The kneaded material was produced into a friction test piece as shown in Fig. 5 by an injection molding machine. The molded article was loaded with electronic components, and I C (manufactured by Nippon Electric Co., Ltd., V25 Microprocessor 2 8 mm square) was removed by an ionizer, and rubbed at a speed of 600 rpm for 5 minutes on a Queto Mixer. After the termination of the friction, I C is clamped with tweezers, and the amount of charge generated by I c is measured in the Faraday cage. The results are shown in Table 12. The charged charge is as low as 0 · 25 nanocoulomb. Example 2 7 Example 2 The molded article contains 6 electronic components, and the size of the paper is removed by an ionizer. The Chinese National Standard (CNS) A4 specification (210X297 mm) 4? -40- (Please read the back first) Note on this page)

1248908 A7 B7 五、發明説明（38) 電之 I C ( Texas Instrument 公司製， (請先閲讀背面之注意事項再填寫本頁) 丁 MS320C32PCM40 MPU Microcontroller 2 8毫米見方），於Queto Mixer上以6 0 0轉/分鐘之 速度摩擦5分鐘。摩擦終止後，以鑷子夾起投入法拉第箱 中薰測產生於I C之電荷量。結果列於表1 2，帶電電荷 量低如0.34奈庫侖。 實施例2 8 實施例2 6之成形品上盛載電子零件，用離子化器除 電之1C (日立公司製，HD6475368CP10 MPU Microcontroller 2 8 毫米，於 Queto Mixer 上以 6 0 0轉/分鐘之速度摩擦5分鐘。摩擦終止後以鑷子夾 起投入法拉第箱中，量測產生於I C之電荷量。結果列於 表1 2，帶電電荷量低如0 . 3 1奈庫侖。 實施例2 9 經濟部智慧財產局員工消費合作社印製 丙烯酸酯系聚合物聚甲基丙烯酸甲酯（三菱Rayon 公司製，商品名Aery pet MD ) 40重量份，苯乙烯系聚 合物聚苯乙烯（東洋苯乙烯公司製，商品名Toyostyrol MW-Z ) 6 0重量份，及導電性賦予材料碳黑（電氣化學 工業公司製，商品名Denka Acetylene Black粒狀）2 2 重量份以轉鼓混合機混摻，用池貝機械公司製0 4 5毫米 同向旋轉型雙軸擠出機熔融混練擠出製作混練物。該混練 物用射出成形機製成如第5圖之摩擦試片。 本紙張尺度逍用中國國家標準（CNS ) A4規格（210X297公釐） 只48 -41 - 1248908 A7 __ B7_ 五、發明説明（39) (請先閲讀背面之注意事項再填寫本頁) 該成形品上盛載電子零件，用離子化器除電之I C ( 曰本電氣公司製，V 2 5 Microprocessor 2 8毫米見方） ，於Queto Mixer上以6 0 0轉/分鐘之速度摩擦5分鐘 。摩擦終止後以鑷子夾取I C投入法拉第箱中量測產生於 I C之電荷量。結果列於表1 2，帶電電荷量低如 —0 · 3 3奈庫侖。 實施例3 0 丙烯酸酯系聚合物橡膠改質壓克力樹脂（三菱Rayon 公司製，商品名Acrypet HBS000) 3 0重量份，苯乙烯 系聚合物高衝擊性聚苯乙烯（東洋苯乙烯公司製，商品名 Toyostyrol HI-U2 — 301U) 70 重量份，及導電 性賦予材料碳黑（電氣化學工業公司製，商品名Denka Acetylene Black粒狀）2 2重量份以轉鼓混合機混摻， 用池貝機械公司製0 4 5毫米同向旋轉型雙軸擠出機熔融 混練製成混練物。該混練物用射出成形機製成如第5圖之 摩擦試片。 經濟部智慧財產局員工消費合作社印製 該成形品上盛載電子部品，用離子化器除電之I C ( 日本電氣公司製，V 2 5 Microprocessor 2 8毫米見方） ’於Queto Mixer上以6 0 0轉/分鐘之速度摩擦5分鐘 。摩擦終止後以鑷子夾取I C投入法拉第箱中量測產生於 I C之電荷量。結果列於表1 3，帶電電荷量低如 一 0 · 1 9奈庫侖。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 4¾ -42- 1248908 A 7 B7 五、發明説明（40) 實施例3 1 (請先閲讀背面之注意事項再填寫本頁) 丙烯酸酯系聚合物橡膠改質壓克力樹脂（三菱Rayon 公司製，商品名Acrypet HBS000 ) 3 0重量份，苯乙烯 系聚合物高衝擊性聚苯乙烯（東洋Styrene公司製，商品 名 Toyostyrol HI— U2 — 301U) 70 重量份，及 導電性賦予材料碳纖（東邦1248908 A7 B7 V. INSTRUCTIONS (38) Electric IC (manufactured by Texas Instrument Co., Ltd. (please read the note on the back and fill out this page) Ding MS320C32PCM40 MPU Microcontroller 2 8 mm square), on the Queto Mixer, 6 0 0 Rub at a speed of 5 minutes. After the friction is terminated, the amount of charge generated by I C is measured by pulling the tweezers into the Faraday cage. The results are shown in Table 12. The charged charge is as low as 0.34 necoule. Example 2 8 Example 2 The molded article was filled with an electronic component, and the 1C was removed by an ionizer (HD6475368CP10 MPU Microcontroller, manufactured by Hitachi, Ltd., 8 mm, rubbed on a Queto Mixer at a speed of 600 rpm. 5 minutes. After the friction is terminated, it is put into the Faraday cage with a pair of tweezers, and the amount of charge generated in the IC is measured. The results are shown in Table 12. The charged charge is as low as 0.31 yakulun. Example 2 9 Ministry of Economics Employees' Consumers' Cooperatives printed the acrylate polymer polymethyl methacrylate (manufactured by Mitsubishi Rayon Co., Ltd. under the trade name Aery pet MD) 40 parts by weight, styrene polymer polystyrene (manufactured by Toyo Styrene Co., Ltd., 60 parts by weight of the Toyistyrol MW-Z) and the conductivity imparting material carbon black (manufactured by Denki Kagaku Co., Ltd., trade name Denka Acetylene Black) 2 2 parts by weight mixed with a drum mixer, manufactured by Chiba Machinery Co., Ltd. The 0 4 5 mm co-rotating twin-screw extruder was melt-kneaded and extruded to prepare a kneaded material. The kneaded material was formed into a friction test piece as shown in Fig. 5 by an injection molding machine. (CNS) A4 size (210X297 mm) Only 48 -41 - 1248908 A7 __ B7_ V. Description of invention (39) (Please read the note on the back and fill out this page) This molded product contains electronic parts and uses ions. The IC for removing the power (V 2 5 Microprocessor 2 8 mm square) was rubbed on the Queto Mixer for 5 minutes at 600 rpm. After the friction was terminated, the IC was taken into the Faraday cage with the tweezers. The measurement is based on the amount of charge generated by the IC. The results are shown in Table 12. The amount of charged charge is as low as -0 · 3 3 neCoule. Example 3 0 Acrylate-based polymer rubber modified acrylic resin (Mitsubishi Rayon Corporation 30 parts by weight, styrene-based polymer high impact polystyrene (manufactured by Toyo Styro Co., Ltd., trade name Toyostyrol HI-U2 - 301U) 70 parts by weight, and conductivity imparting material carbon black (manufactured by Denki Chemical Co., Ltd., trade name Denka Acetylene Black) 2 2 parts by weight was mixed with a tumbler mixer, and kneaded by a 504 mm co-rotating twin-screw extruder manufactured by Chiba Machinery Co., Ltd. The mixture In the injection molding machine, the friction test piece as shown in Fig. 5. The Ministry of Economic Affairs, the Intellectual Property Office, and the Consumer Cooperatives Co., Ltd. printed the IC on the molded product, and the IC was removed by the ionizer (made by Nippon Electric Co., Ltd., V 2 5 Microprocessor 2 8 mm square) ' Rub on the Queto Mixer for 5 minutes at 600 rpm. After the friction is terminated, the amount of charge generated by I C is measured by taking the I C into the Faraday cage. The results are shown in Table 13. The charged charge is as low as 0.19 mecolum. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) 43⁄4 -42-1248908 A 7 B7 V. Invention description (40) Example 3 1 (Please read the back note and then fill out this page) Acrylic Ester-based polymer rubber modified acrylic resin (manufactured by Mitsubishi Rayon Co., Ltd., trade name Acrypet HBS000) 30 parts by weight, styrene-based polymer high impact polystyrene (manufactured by Toyo Styrene Co., Ltd., trade name Toyostyrol HI-U2 — 301U) 70 parts by weight, and conductive material carbon fiber (Dongbang

Tenux公司製，商品名 Η T A — C 6 ) 1 2重量份以轉鼓混合機混摻，用池貝機 械公司製0 4 5毫米同向旋轉型雙軸擠出機熔融混練擠出 製作混練物。該混練物用射出成形機製成如第5圖之摩擦 試片。 該成形品上盛載電子零件，用離子化器除電之I C ( 日本電氣公司製，V 2 5 Microprocessor 2 8毫米見方） ，於Queto Mixer上以6 0 0轉/分鐘之速度摩擦5分鐘 。摩擦終止後以鑷子夾起I C投入法拉第箱中量測產生於 I C之電荷量。結果列於表1 3，帶電電荷量低如 一 0 _ 5 4奈庫侖。 實施例3 2 經濟部智慧財產局員工消費合作社印製 丙烯酸酯系聚合物聚甲基丙烯酸甲酯樹脂（三菱 Rayon公司製，商品名Aery pet MD ) 3 0重量份，聚苯 醚樹脂（三菱 Engineering Plastics 公司製，Upiace YPX-100L) 40重量份，及苯乙·系聚合物高衝 擊強度聚苯乙烯（東洋Styrene公司製，商品名 Toyostyrol HI — U2 — 301U) 30 重量份，及導電 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） :&gt;r.〇 - 43 - 1248908 A7 _ B7 五、發明説明（41) (請先閲讀背面之注意事項再填寫本頁) 性賦予材料碳黑（電氣化學工業公司製，商品名Denka Acetylene Black粒狀）2 2重量份以轉鼓混合機混摻， 用池貝機械公司製0 4 5毫米同向旋轉型雙軸擠出機熔融 混練製作混練物。 該混練物用射出成形機製成如第5圖之摩擦試片。該 成形品上盛載電子零件，用離子化器除電之I C (日本電 氣公司製，V 2 5 Microprocessor 2 8毫米見方），於 Queto Mixer上以6 0 0轉/分鐘之速度摩擦5分鐘。摩 擦完後以鑷子夾取I C投入法拉第箱中，量測產生於I C 之電荷量。結果列於表1 3，帶電電荷量低如一 0 . 5 1 奈庫侖。 實施例3 3 經濟部智慧財產局員工消費合作社印製 丙烯酸酯系聚合物聚甲基丙烯酸甲酯樹脂（三菱 Rayon公司製，商品名AcrypetMD) 3 0重量份，苯乙 烯系聚合物高衝擊強度聚苯乙烯（東洋Styrene公司製， 商品名 Toyostyrol HI— U2 — 301U) 70 重量份 ，及導電性賦予材料碳黑（電氣化學工業公司製，商品名 Denka Acetylene Black粒狀）2 2重量份以轉鼓混合機 混摻，用池貝機械公司製0 4 5毫米同向旋轉型雙軸擠出 機熔融混練擠出製成混練物。 該混練物用射出成形機製成如第6圖之電子零件容器 I C盤。該盤之袋中盛載電子零件，用離子化器除電之 I C (日本電氣公司製，v 2 5 Microprocessor 2 8毫米 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） &quot; &quot;~ Μ -44- 1248908 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（ 見方）’用另一 I C盤作蓋，於QuetoMixer上以6 0 〇 轉/分鐘之速度摩擦5分鐘。而I C袋內四邊之微小棱條 之間隔影響I C之振幅，該微小棱條之間隔爲2 8 . 3毫 米。摩擦完後以鑷子夾起I C，投入法拉第箱中量測產生 於各I C之電荷量。結果列於表1 3，帶電電荷量在 一〇.24至一〇.82奈庫侖之範圍，1C帶電量之絕 對値低。 比較例1 5 爲與實施例2 6比較，苯乙烯系聚合物高衝擊強度聚 苯乙烯（東洋Styrene公司製，商品名Toyostyrol Η I — U2-301U)100重量份，及導電性賦予材料碳黑 (電氣化學工業公司製，商品名Denka Acetylene Black 粒狀）2 2重量份以轉鼓混合機混摻，如同實施例2 6量 測I C之摩擦帶電量。結果列於表1 4，帶電電荷量爲 1 . 5 7奈庫侖。 比較例1 6 爲作比較，低密度聚乙烯樹脂（日本P〇lychem公司 製，商品名NovatecLD) 1 〇 〇重量份，導電性賦予材 料碳黑（電氣化學工業公司製，商品名Denka Acetylene B1 a c k ) 2 5重量份以轉鼓混合機混摻，如同實施例2 6 量測I C之摩擦帶電量。結果列於表1 4，帶電電荷量高 達2 . 3 5奈庫侖。 (請先閲讀背面之注意事項再填寫本頁) 裝· 訂 線 本紙張尺度適用中.國國家標準（CNS ) A4規格（21〇x297公釐） -45- 1248908 Α7 Β7 五、發明説明（矽比較例1 7 爲作比較，高密度聚乙烯樹脂（日本p〇lychem公司 製’商品名Novatec HD ) 1 〇 〇重量份，導電性賦予材 料碳纖（東邦Tenux公司製，商品名htA — C 6 ) 1 2重量份以轉鼓混合機混摻，如同實施例2 6量測I C 之摩擦帶電量。結果列於表1 4，帶電電荷量高達6 . 8 7奈庫侖。 比較例1 8 爲與實施例3 3比較，聚苯乙烯樹脂（東洋styrene 公司製，商品名Toyostyrol MW-2 ) 80重量份，苯乙烯 及丁二烯之嵌段共聚物（J SR公司製，商品名TR - 2 0 0 3 ) 2 0重量份，及導電性賦予材料碳黑（電氣化 學工業公司製，商品名Denka Acetylene Black粒狀） 2 4重量份以轉鼓混合機混摻，如同實施例3 3作I C ( 盤成形，量測I C之摩擦帶電量。結果列於表1 4，帶電 電荷量在1 · 3 3至1 · 79奈庫侖之範圍。 裝-- (請先閲讀背面之注意事項再填寫本頁) 訂 線- 經濟部智慧財產局員工消費合作社印製 本紙張又度適用中國國家標準（CNS ) A4規格（210X297公釐） 1248908 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（44) 表 12 實施例26 實施例27 實施例28 實施例29 丙烯酸酯系聚合物 苯乙烯系聚合物 導電性賦予劑 PMMA.20 PS:80 CB:22 ΡΜΜΑ:20 PS:80 CB:22 PMMA:20 PS:80 CB:22 PMMA:40 PS:60 CB:22 樹脂成形品 摩擦試片 摩擦試片 摩擦試片 摩擦試片 電子零件種類 1C · 1 1C · 2 1C · 3 1C · 1 表面電阻値（歐姆） 6·4χ 105 6.4xl03 6.4x 105 5.9x 105 電子零件之帶電電荷量 (奈庫侖） .0.25 0.34 0.31 -0.33 表1 3、1 4中各符號意義如下。 PMMA:聚甲基丙烯酸甲酯。 P S :聚苯乙烯。 HIPS:高衝擊強度聚苯乙烯。 C B :碳黑。 IC· 1:IEC 公司 V25 Microprocessor 〇 I C · 2 : Texas Instrument 公司 TMS320C32PCM40MPU Microprocessor ° I C · 3 :日立公司 HD6475368CP10MPU Microcontroller 〇 表1 3之實施例3 3，表1 4之比較例1 8 ’係第6 圖盤之3袋中IC帶電量之量測。 (1 )第6圖1之袋中I C之帶電電荷量 (2) 第6圖2之袋中IC之帶電電荷量 (3) 第6圖3之袋中IC之帶電電荷量 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） ：&gt; Γ Λ (請先閲讀背面之注意事項再填寫本頁)Manufactured by Tenux Co., Ltd., trade name Η T A — C 6 ) 1 2 parts by weight was mixed by a tumbler mixer, and melt-kneaded and extruded by a 0. 5 mm co-rotating twin-screw extruder manufactured by Chiba Machinery Co., Ltd. to prepare a kneaded product. The kneaded material was formed into a friction test piece as shown in Fig. 5 by an injection molding machine. The molded article was charged with an electronic component, and I C (manufactured by Nippon Electric Co., Ltd., V 2 5 Microprocessor 2 8 mm square) was removed by an ionizer, and rubbed on a Queto Mixer at a speed of 600 rpm for 5 minutes. After the friction is terminated, the amount of charge generated by I C is measured by clamping the I C into the Faraday cage with the tweezers. The results are shown in Table 13. The charged charge is as low as 0 _ 5 4 necoule. Example 3 2 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed Acrylate Polymer Polymethyl methacrylate Resin (Mitsubishi Rayon, trade name Aery pet MD) 30 parts by weight, polyphenylene ether resin (Mitsubishi Engineering) 40 parts by weight of Plastics, Upiace YPX-100L), and styrene-based polymer high impact polystyrene (manufactured by Toyo Styrene Co., Ltd., trade name Toyostyrol HI - U2 - 301U) 30 parts by weight, and conductive paper scale Applicable to China National Standard (CNS) A4 specification (210X297 mm): &gt;r.〇- 43 - 1248908 A7 _ B7 V. Invention description (41) (Please read the note on the back and fill out this page) Carbon black (manufactured by Denki Kagaku Co., Ltd., trade name Denka Acetylene Black) was blended by a tumbler mixer and melt-kneaded by a 504 mm co-rotating twin-screw extruder manufactured by Chiba Machinery Co., Ltd. Mixtures. The kneaded material was formed into a friction test piece as shown in Fig. 5 by an injection molding machine. The molded article was charged with an electronic component, and I C (manufactured by Nippon Electric Co., Ltd., V 2 5 Microprocessor 2 8 mm square) was removed by an ionizer, and rubbed on a Queto Mixer at a speed of 600 rpm for 5 minutes. After rubbing, I C is taken into the Faraday cage with a tweezers, and the amount of charge generated at I C is measured. The results are shown in Table 13. The charged charge is as low as 0.51 nikol. Example 3 3 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed Acrylate Polymer Polymethyl methacrylate Resin (Mitsubishi Rayon, trade name AcrypetMD) 30 parts by weight, styrene polymer high impact strength Styrene (trade name: Toyostyrol HI-U2 - 301U, manufactured by Toyo Styrene Co., Ltd.) 70 parts by weight, and conductive material carbon black (manufactured by Denki Kagaku Co., Ltd., trade name Denka Acetylene Black) 2 2 parts by weight The mixer was mixed and melt-kneaded and extruded using a 045 mm co-rotating twin-screw extruder manufactured by Chibei Machinery Co., Ltd. to prepare a kneaded product. The kneaded material was formed into an electronic component container I C disk as shown in Fig. 6 by an injection molding machine. The electronic bag is contained in the bag, and the IC is removed by ionizer (made by Nippon Electric Co., Ltd., v 2 5 Microprocessor 2 8 mm paper size applies to China National Standard (CNS) A4 specification (210X297 mm) &quot;&quot;~ Μ -44- 1248908 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (see side) 'Use another IC disk cover, rub on the QuetoMixer at 6 0 rpm / 5 minutes The interval between the tiny ribs on the four sides of the IC bag affects the amplitude of the IC. The interval between the micro ribs is 28.3 mm. After the rubbing, the IC is clamped by the tweezers, and the measurement is made in the Faraday cage. The amount of charge is shown in Table 13. The charged charge is in the range of 〇.24 to 〇.82 奈库伦, and the absolute charge of 1C is extremely low. Comparative Example 1 5 is styrene compared with Example 26. 100 parts by weight of a polymer high impact strength polystyrene (trade name: Toyostyrol Η I - U2-301U, manufactured by Toyo Styrene Co., Ltd.), and a conductive imparting material carbon black (manufactured by Electric Chemical Industry Co., Ltd., trade name Denka Acetylene Black) ) 2 2 weight The mixture was mixed with a tumbler mixer, and the frictional charge amount of the IC was measured as in Example 26. The results are shown in Table 14. The charge amount was 1.57 nacorun. Comparative Example 1 6 For comparison, low density poly Vinyl resin (manufactured by P〇lychem Co., Ltd., trade name NovatecLD) 1 〇〇 by weight, conductivity imparting material carbon black (manufactured by Denki Kagaku Co., Ltd., trade name Denka Acetylene B1 ack ) 2 5 parts by weight mixed with a drum mixer Incorporation, as in Example 2 6 , the frictional charge of the IC was measured. The results are shown in Table 14. The charge amount is up to 2.3 μN Coulomb. (Please read the back note first and then fill out this page.) Loading and setting This paper scale is applicable to the national standard (CNS) A4 specification (21〇x297 mm) -45- 1248908 Α7 Β7 5. Invention description (矽Comparative example 1 7 For comparison, high density polyethylene resin (Japan p〇 Lychem company's 'trade name Novatec HD' 1 〇〇 by weight, conductivity imparting material carbon fiber (made by Toho Tensu Co., Ltd., trade name htA - C 6 ) 12 parts by weight mixed with a tumbler mixer, as in Example 2 6 Measure the frictional charge of the IC. Results In Table 14, the amount of charged charge was as high as 6.7 7 coulomb. Comparative Example 1 8 is a polystyrene resin (manufactured by Toyo Styrene Co., Ltd., trade name Toyostyrol MW-2), 80 parts by weight, benzene, compared with Example 3 A block copolymer of ethylene and butadiene (trade name: TR - 2 0 0 3 manufactured by J SR Co., Ltd.) 20 parts by weight, and a conductivity imparting material carbon black (manufactured by Electric Chemical Industry Co., Ltd., trade name Denka Acetylene Black) 2) parts by weight were blended by a tumbler mixer, as in Example 3 3 for IC (disk forming, measuring the frictional charge of the IC). The results are shown in Table 14. The charged charge is in the range of 1 · 3 3 to 1 · 79 nanocoulombs. Installation -- (Please read the notes on the back and fill out this page) Ordering - Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Print this paper and apply Chinese National Standard (CNS) A4 specification (210X297 mm) 1248908 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed A7 B7 V. Inventive Note (44) Table 12 Example 26 Example 27 Example 28 Example 29 Acrylate Polymer Styrene Polymer Conductivity Additive PMMA.20 PS: 80 CB: 22 ΡΜΜΑ: 20 PS: 80 CB: 22 PMMA: 20 PS: 80 CB: 22 PMMA: 40 PS: 60 CB: 22 Resin molded article Friction test piece Friction test piece Friction test piece Friction test piece Electronic part type 1C · 1 1C · 2 1C · 3 1C · 1 Surface resistance 値 (ohms) 6·4χ 105 6.4xl03 6.4x 105 5.9x 105 Charged charge of electronic parts (Nyclon) .0.25 0.34 0.31 -0.33 Table 1 3, 1 The meanings of the symbols in 4 are as follows. PMMA: Polymethyl methacrylate. P S : polystyrene. HIPS: High impact polystyrene. C B : carbon black. IC·1: IEC Corporation V25 Microprocessor 〇IC · 2 : Texas Instrument Company TMS320C32PCM40MPU Microprocessor ° IC · 3 : Hitachi HD6475368CP10MPU Microcontroller 〇 Table 1 3 Example 3 3, Table 1 4 Comparative Example 1 8 'System 6 The measurement of the amount of IC power in the 3 bags of the disk. (1) The charged charge of the IC in the bag of Figure 6 (2) The charged charge of the IC in the bag of Figure 6 (3) The charged charge of the IC in the bag of Figure 6 is applicable to China. National Standard (CNS) A4 Specification (210 X 297 mm): &gt; Γ Λ (Please read the notes on the back and fill out this page)

47- 1248908 Α7 Β7 五、發明説明（45) 表 實施例30 實施例31 實施例32 實施例33 丙烯酸酯系聚合物 橡膠改質壓克 橡膠改質壓克 PMMA:30 ΡΜΜΑ:30 力測旧0 力樹脂:30 HIPS:30 HIPS:70 苯乙烯系聚合物 HIPS:70 HIPS:70 40 - 聚苯醚 - - CB:22 CB:22 導電性賦予劑 CB:22 碳纖:12 樹脂成形品 摩擦試片 摩擦試片 摩擦試片 IC盤 電子零件種類 1C· 1 1C· 1 1C· 1 IC· 1 表面電阻値 9.1x 104 1.8x 103 5.9x 104 7.3x 104 (歐姆） 電子零件之帶電電 -0.19 -0.54 -0.51 (1)-0.48 荷量 (2)-0.24 (奈庫命） (3)-0.82 (請先閲讀背面之注意事項再填寫本頁) 表 14 比較例15 比較例16 比較例17 比較例18 丙烯酸酯系聚合物 - - - - 苯乙烯系聚合物 HIPS: 100 - - PS:80 低密度聚乙烯 - 100 - 鋪 高密度聚乙烯 - - 100 - 苯乙烯-丁二烯嵌段 - - - 20 聚合物 導電性賦予劑 CB:22 CB:25 碳纖:12 CB:24 樹脂成形品 摩擦試片 摩擦試片 摩擦試片 IC盤 電子零件種類 1C· 1 1C· 1 1C· 1 IC· 1 表面電阻値 1·5χ 105 1.5χ 106 3.7χ 105 3·2χ ΙΟ5 (歐姆） 電子零件之帶電電 1.57 2.35 6.87 (1)1.33 荷量 (2)1.63 (奈庫侖） (3)1.79 經濟部智慧財產局員工消費合作社印製 實施例3 4至4 1及比較例1 9至2 4係有關表面經 粗化之容器之例。 實施例3 4至3 9 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -48- 1248908 A7 ______B7_ 五、發明説明（46) (請先閱讀背面之注意事項再填寫本頁) 樹脂用聚乙烯系接枝共聚樹脂（日本油脂公司製，商 品名Modiper)作原料，以田邊機械公司製0 4 〇毫米單 軸擠出機經寬5 5 0毫米之模頭擠出，以經噴砂處理之金 屬輥及聚矽氧橡膠輥夾送製膜成厚3 0 0微米之片材。其 中藉噴砂粗度之改變製作實施例3 4至3 9中具各種表面 粗度之片材。 之後裁切該片材，經加熱、真空成形製作如第3圖之 載帶。該載帶之表面粗度用觸針式表面粗度量測器東京精 密公司製Surfcom，於標準長度2 . 5毫米量測R a及 Rmax。該載帶貼合於金屬板，以離子化空氣噴吹除電後 ，將電子零件經離子化空氣除電之I C ( M Q F P 27 X 2 7 )放入載帶之袋中，以3 0 0來回/分鐘之速度作 電子零件與載帶之500來回摩擦。此時之ic，爲正確 量測產生於封裝之電壓，其導線予以切斷，同處所以絕緣 膠帶封塞使用。 經濟部智慧財產局員工消費合作社印製 之後’以絕緣性聚縮醛製鑷子取出，量測摩擦面所生 之摩擦帶電電壓。結果列於表1 5，具該表面粗度之摩擦 試片與I C之摩擦，幾無可見之帶電電壓上升。而帶電電 壓之量測係用基恩斯公司製帶電電壓量測儀S Κ - 〇 3 0 及 S Κ — 2 0 0。 實施例4 0 樹脂使用聚苯乙烯樹脂（電氣化學工業公司製，商品 名Clialene )，如同實施例3 4製作載帶，並同如實施例 ¥紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） — ' -49 - 1248908 A7 _ B7 _ __ 五、發明説明（47) 3 4評估表面粗度、摩擦帶電量。結果列於表1 5、 Clialene製摩擦試片與I C之摩擦當中幾無可見之帶電電 壓上升。 實施例4 1 樹脂使用聚苯乙烯單聚物（東洋Styrene公司製， Toyostyrol G P — 1 )，以東芝2 2 0噸射出成形機製成 如第4圖之盤狀物。其中成形模具表面經噴砂處理加大表 面粗度。使用該成形品，如同實施例3 4量測與I C之摩 擦帶電量。結果列於表1 5，幾無可見之I C摩擦表面之 帶電電壓上升。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 表 1 5 試驗種類 Ra Rmax 帶電電壓 (千伏） 實 施 例 34 PE 系 接枝樹 脂 0 .8 6. 7 0. 8 實 施 例 35 PE 系 接枝樹 脂 1 .2 9. 9 0. 8 實 施 例 36 PE 系 接枝樹 脂 1 , ,8 24 .5 0. 3 實 施 例 37 PE 系 接枝樹 脂 2, 0 15 .4 -1 .1 實 施 例 38 PE 系 接枝樹 脂 4 ‘ 9 52 .7 1 . 3 實 施 例 39 PE 系 接枝樹 脂 5, 0 42 .4 1 · 1 實 施 例 40 PS樹脂 1 , 1 7. 7 0. 0 實 施 例 41 PS樹脂 8, ,2 79 .2 0. 2 七紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -50- 1248908 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（48) 比較例1 9至2 1 爲與實施例3 4至3 9比較，樹脂用聚乙烯系接枝共 聚樹脂（日本油脂公司製，商品名Modiper)作原料，以 田邊機械公司製0 4 0毫米單軸擠出機經5 5 〇毫米寬之 模頭擠出，以金屬光澤輥及聚矽氧橡膠輥夾送，製膜成厚 3 0 0微米之片材。其中改變輥溫製作比較例1 9至2 1 之表面粗度之片材。 之後’將該片材加熱經真空成形製成第3圖之載帶狀 物。該載帶之表面粗度用觸針式表面粗度量測器，東京精 密公司製Surfcom，於標準長度2 · 5毫米量測R a及 Rmax，得Ra不及〇 . 5微米，Rmax不及5微米。然後 ，如同實施例3 4作I C與載帶之摩擦。結果列於表1 6 ，具該表面粗度之摩擦試片與I C摩擦當中，可觀察到 I C之摩擦表面有數千伏之帶電電壓。 比較例2 2 爲與實施例4 0比較，用聚苯乙烯系樹脂（電氣化學 工業公司製，商品名Clialene )作原料，如同比較例1 9 製膜成厚3 0 0微米之片材’製成載帶狀物。之後，如同 實施例3 4作I C之摩擦試驗。結果列於表丨6，具該表 面粗度之摩擦試片與I C之摩擦，於I c之摩擦表面可觀 察到數千伏之帶電電壓。 比較例2 3 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 5ΛΜ -51 - (請先閲讀背面之注意事項再填寫本頁)47- 1248908 Α7 Β7 V. Inventive Description (45) Table Example 30 Example 31 Example 32 Example 33 Acrylate-based polymer rubber modified gram rubber modified press PMMA: 30 ΡΜΜΑ: 30 force measurement old 0 Resin: 30 HIPS: 30 HIPS: 70 Styrene polymer HIPS: 70 HIPS: 70 40 - Polyphenylene ether - - CB: 22 CB: 22 Conductivity imparting agent CB: 22 Carbon fiber: 12 Resin molded article friction test piece Friction test piece Friction test piece IC disk Electronic parts type 1C· 1 1C· 1 1C· 1 IC· 1 Surface resistance 値9.1x 104 1.8x 103 5.9x 104 7.3x 104 (ohm) Electro-electric parts -0.19 -0.54 -0.51 (1)-0.48 Charge (2)-0.24 (Nikeku) (3)-0.82 (Please read the notes on the back and fill out this page) Table 14 Comparative Example 15 Comparative Example 16 Comparative Example 17 Comparative Example 18 Acrylate Polymer - - - - Styrene Polymer HIPS: 100 - - PS: 80 Low Density Polyethylene - 100 - High Density Polyethylene - - 100 - Styrene-Butadiene Block - - - 20 Polymer conductivity imparting agent CB: 22 CB: 25 Carbon fiber: 12 CB: 24 Resin molded article Friction test piece Friction test piece Test chip IC disk electronic parts type 1C· 1 1C· 1 1C· 1 IC· 1 Surface resistance 値1·5χ 105 1.5χ 106 3.7χ 105 3·2χ ΙΟ5 (ohm) Electrical parts with electric parts 1.57 2.35 6.87 (1) 1.33 Charge (2) 1.63 (Nykron) (3) 1.79 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed Example 3 4 to 4 1 and Comparative Example 1 9 to 2 4 Examples of containers with roughened surfaces . Example 3 4 to 3 9 This paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) -48- 1248908 A7 ______B7_ V. Invention description (46) (Please read the note on the back and fill out this page) A polyethylene-based graft copolymer resin (manufactured by Nippon Oil & Fats Co., Ltd., trade name Modiper) was used as a raw material, and was extruded through a 550 mm wide die by a 0 4 mm single-axis extruder manufactured by Tanabe Machinery Co., Ltd. The blasted metal roll and the polyoxyethylene rubber roll are sandwiched and formed into a sheet having a thickness of 300 μm. Among them, sheets having various surface roughnesses in Examples 3 to 3 9 were produced by the change in the thickness of the blasting. Thereafter, the sheet was cut, and a carrier tape as shown in Fig. 3 was produced by heating and vacuum forming. The surface roughness of the carrier tape was measured by a stylus type surface measuring device, Surfcom, manufactured by Tokyo Seimi Co., Ltd., and R a and Rmax were measured at a standard length of 2.5 mm. The carrier tape is attached to a metal plate, and after being ionized and blown by the ionized air, the IC ( MQFP 27 X 2 7 ) for removing the electronic components by ionized air is placed in a bag of the carrier tape at 300 round trips per minute. The speed is used to rub the electronic parts back and forth with the carrier tape 500. At this time, the ic is correctly measured by the voltage generated in the package, and the wires are cut off, and the same place is used for sealing the insulating tape. After printing by the Ministry of Economic Affairs' Intellectual Property Office and the Consumer Cooperatives, the scorpion was taken out with insulating polyacetal and the frictional electrification voltage generated by the friction surface was measured. The results are shown in Table 15. The friction between the friction test piece having the surface roughness and I C showed that there was no visible increase in the charged voltage. The measuring voltage of the charged voltage is measured by a charged voltage measuring instrument manufactured by Keynes Co., Ltd. S Κ - 〇 3 0 and S Κ - 2 0 0. Example 40 A resin was used as a resin (manufactured by Electric Chemical Industry Co., Ltd., trade name Clialene), and a carrier tape was produced as in Example 34, and the same as the paper size of the example, the Chinese National Standard (CNS) A4 specification (210X297) was applied. PCT) — ' -49 - 1248908 A7 _ B7 _ __ V. INSTRUCTIONS (47) 3 4 Evaluate surface roughness and frictional charge. The results are shown in Table 1. 5. There is no visible increase in the charged voltage among the friction between the Clialene friction test piece and the I C. Example 4 1 Resin A polystyrene monomer (Toyostyrol G P-1, manufactured by Toyo Styrene Co., Ltd.) was used, and a disk shape as shown in Fig. 4 was produced in a Toshiba 220 ton injection molding machine. The surface of the forming mold is sandblasted to increase the surface roughness. Using this molded article, the charge amount of I C was measured as in Example 34. The results are shown in Table 15. The electrification voltage of the I C friction surface with no visible visible rise. (Please read the notes on the back and fill out this page.) Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Printed Table 1 5 Test Type Ra Rmax Charged Voltage (kV) Example 34 PE-based Graft Resin 0 .8 6. 7 0. 8 Example 35 PE-based graft resin 1. 2 9. 9 0. 8 Example 36 PE-based graft resin 1 , , 8 24 .5 0. 3 Example 37 PE-based graft resin 2, 0 15 .4 -1 .1 Example 38 PE-based graft resin 4' 9 52 .7 1 . 3 Example 39 PE-based graft resin 5, 0 42 .4 1 · 1 Example 40 PS resin 1, 1 7. 7 0. 0 Example 41 PS resin 8,, 2 79 .2 0. 2 Seven paper scale applicable to China National Standard (CNS) A4 specification (210X297 mm) -50-1248908 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing A7 B7 V. Inventive Note (48) Comparative Example 1 9 to 2 1 In comparison with Examples 34 to 39, a polyethylene-based graft copolymer resin (manufactured by NOF Corporation, trade name Modiper) was used as a raw material. The 0 40 mm single-axis extruder made by Tanabe Machinery Co., Ltd. was extruded through a 5 5 mm wide die with a metallic gloss roll. Polyethylene oxide silicon rubber pinch roller, made into a thick film sheet 300 microns. The sheet having the surface roughness of Comparative Examples 1 9 to 2 1 was produced by changing the roll temperature. Thereafter, the sheet was heated and vacuum-formed to form a carrier tape of Fig. 3. The surface roughness of the carrier tape is measured by a stylus type surface roughness measuring instrument, Surfcom, manufactured by Tokyo Precision Co., Ltd., and R a and Rmax are measured at a standard length of 2 · 5 mm, and Ra is less than 5 μm, and Rmax is less than 5 μm. . Then, as in Example 34, the friction between I C and the carrier tape was used. The results are shown in Table 16. In the friction test piece with the surface roughness and I C friction, it can be observed that the friction surface of I C has a charged voltage of several thousand volts. Comparative Example 2 2 In comparison with Example 40, a polystyrene resin (manufactured by Electric Chemical Industry Co., Ltd., trade name Clialene) was used as a raw material, and a film of a thickness of 300 μm was formed as in Comparative Example 19. Loaded ribbon. Thereafter, a friction test of I C was carried out as in Example 34. The results are shown in Table 6, the friction between the friction test piece having the surface roughness and I C , and the charged voltage of several thousand volts was observed on the friction surface of I c . Comparative Example 2 3 The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 5ΛΜ -51 - (Please read the note on the back and fill out this page)

1248908 A7 _ B7 五、發明説明（49) 爲與實施例4 1比較，樹脂用苯乙烯單聚物（東洋 Styrene公司製，商品名Toyostyrol G P — 1 )，以東芝 (請先閲讀背面之注意事項再填寫本頁) 2 2 0噸射出成形機成形爲第4圖之盤狀物。此時成形模 具表面經平滑化’粗度低。使用該成形品，如同實施例 34，量測與I C之摩擦帶電量。結果列於表，可觀 察到IC摩擦表面有數千伏之帶電電壓。 比較例2 4 對樹脂橡膠改質聚苯乙燃（東洋Styrene公司製，商 品名 Toyostyrol HI— U2 — 301U) 1〇〇 重量份 添加碳黑（電氣化學工業公司製，商品名Denka Acetylene Black ) 2 5重量份，以轉鼓機混合後，用池貝 機械公司製雙軸擠出機P C Μ - 4 5熔融混練成導電性混 練物。該導電性混練物由輔助擠出機（田邊機械公司製， 0 4 0毫米單軸擠出機）擠出，另一方面橡膠改質聚苯乙 烯（東洋 Styrene 公司製，Toyostyrol Η 1 — U 2 — 3 0 1 U ) ••苯乙烯—丁二烯共聚樹脂（JSR公司製， 經濟部智慧財產局員工消費合作社印製 商品名TR — 2000)以100 : 5之重量比混合由主 擠出機（0 4 0毫米單軸擠出機）擠出，經送料機構法將 導電混練物二表層層合於非導電性之橡膠改質聚苯乙烯樹 脂芯層，製作三層厚3 0 0微米之片材。此時夾送輥因用 金屬光澤輥及聚矽氧橡膠輥，得表面粗度低之三層片材。 該片材之表面電阻値以三菱化學製Rolesta Η P量測，結 果爲1 0 5歐姆。 t( CNS ) Λ4^ ( 21〇X297^ ) 一 52 _ 經濟部智慧財產局員工消費合作社印製 1248908 A7 __B7__ 五、發明説明（50) 之後將該片材加熱，真空成形製成第3圖之載帶狀物 。然後如同實施例3 4作I C之摩擦試驗。結果列於表 1 6，具該表面粗度之摩擦試片與I C之摩擦當中，I C 之摩擦表面可觀察到有數千伏之帶電電壓。 表 試驗種類 Ra Rmax 帶電電壓 (千伏） 比較例1 9 PE系接枝樹脂 0.25 3.2 8.0 比較例2 0 PE系接枝樹脂 0.26 2.2 8.7 比較例2 1 PE系接枝樹脂 0.30 3.0 8.2 比較例22 PS樹脂 0.30 2.7 9.7 比較例23 PS樹脂 0.11 1.2 7.6 比較例24 PS系三層片材 0.3 1 2.3 3.9 由實施例可知，加大電子零件包裝用片材之表面粗度 ，因內包之電子零件與包裝用片材，或電子包裝品摩擦， 於電子零件之摩擦表面所生之帶電電壓可予降低。 產業上之利用可能性 根據本發明，因於收藏之電子零件所接觸之護帶、底 帶等之包裝容器內面使用特定之樹脂，與護帶、底帶接觸 摩擦所致，產生於電子零件表面之帶電量絕對値可予壓低 。並因使與電子零件接觸之表面粗化，電子零件與容器接 夺紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） (請先閲讀背面之注意事項再填寫本頁)1248908 A7 _ B7 V. Inventive Note (49) For comparison with Example 4, a styrene monomer for resin (manufactured by Toyo Styrene Co., Ltd., trade name Toyostyrol GP-1), Toshiba (please read the back note) Fill in this page again) The 2 2 0 ton injection molding machine is formed into the disk of Figure 4. At this time, the surface of the forming mold is smoothed and the thickness is low. Using this molded article, as in Example 34, the triboelectric charge amount with I C was measured. The results are shown in the table, and it is observed that the IC friction surface has a charged voltage of several thousand volts. Comparative Example 2 4 Resin-modified polystyrene (manufactured by Toyo Styrene Co., Ltd., trade name Toyostyrol HI-U2 - 301U) Carbon black (manufactured by Denki Acei Co., Ltd., trade name Denka Acetylene Black) was added in 1 part by weight. After 5 parts by weight, the mixture was mixed by a rotary drum machine, and melt-kneaded into a conductive kneaded material using a twin-screw extruder PC Μ - 4 5 manufactured by Chiba Machinery Co., Ltd. The conductive kneaded material was extruded by an auxiliary extruder (manufactured by Tanabe Machinery Co., Ltd., a 40 mm single-axis extruder), and rubber modified polystyrene (Toyostyrol Η 1 - U 2 manufactured by Toyo Styrene Co., Ltd.) — 3 0 1 U ) •• Styrene-butadiene copolymer resin (manufactured by JSR, Inc., Ministry of Economic Affairs, Intellectual Property Bureau, Staff Cooperatives, trade name TR—2000) is mixed by a main extruder at a weight ratio of 100:5. (0 40 mm single-axis extruder) extrusion, two layers of conductive kneaded material were laminated on a non-conductive rubber modified polystyrene resin core layer by a feeding mechanism method to make a three-layer thickness of 300 μm Sheet. At this time, the pinch rolls were obtained by using a metallic gloss roll and a polyoxygen rubber roll to obtain a three-layer sheet having a low surface roughness. The surface resistance of the sheet was measured by Rollsta Η P by Mitsubishi Chemical, and the result was 105 ohms. t( CNS ) Λ4^ ( 21〇X297^ ) a 52 _ Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1248908 A7 __B7__ V. Invention description (50) After heating the sheet, vacuum forming into the third figure Carrier tape. Then, as in Example 34, the friction test of I C was performed. The results are shown in Table 16. In the friction between the friction test piece having the surface roughness and I C , a charged voltage of several thousand volts was observed on the friction surface of I C . Table test type Ra Rmax Charge voltage (kV) Comparative Example 1 9 PE-based graft resin 0.25 3.2 8.0 Comparative Example 2 0 PE-based graft resin 0.26 2.2 8.7 Comparative Example 2 1 PE-based graft resin 0.30 3.0 8.2 Comparative Example 22 PS resin 0.30 2.7 9.7 Comparative Example 23 PS resin 0.11 1.2 7.6 Comparative Example 24 PS-based three-layer sheet 0.3 1 2.3 3.9 It is known from the examples that the surface roughness of the sheet for electronic component packaging is increased, and the electronic components contained therein are included. The friction voltage generated on the friction surface of the electronic component can be reduced by rubbing with the packaging sheet or the electronic package. INDUSTRIAL APPLICABILITY According to the present invention, a special resin is used for the inner surface of a packaging container such as a protective tape or a bottom tape which is in contact with the electronic component of the collection, and is caused by friction between the protective tape and the bottom tape, and is generated in the electronic component. The amount of electricity on the surface is absolutely low. And because the surface in contact with the electronic parts is roughened, the electronic parts and containers are taken up by the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page)

-53- 1248908 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（51) 觸產生之靜電可予減少。藉此，可控制電子零件所受靜電 之害。因可防零件之附著於包裝容器，零件構裝於基板時 工作性不致惡化。並且，可防對靜電敏感之電子零件之爲 靜電所破壞。 而本發明所揭示之內容，於此引用、援用於曰本提出 申請之特願200 1 — 1 5845 5號（申請曰期 2001.5.28)，特願 2001 - 207442 號 (申請日期2 0 0 1 . 7 · 9 )，特願2 0 〇 1 — 317981 號（申請曰期 2001. 10· 16)，及 特願2002 — 91019號（申請日期2002 . 3 · 2 8 )所揭示之說明書全部內容。 ^紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ^ - 54 - (請先閱讀背面之注意事項再填寫本頁)-53- 1248908 Printed by the Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative A7 B7 V. Invention Description (51) The static electricity generated by the touch can be reduced. Thereby, it is possible to control the electrostatic charge of the electronic component. Since the parts can be prevented from adhering to the packaging container, the workability is not deteriorated when the parts are mounted on the substrate. Moreover, it is possible to prevent electrostatic damage to electronic components that are sensitive to static electricity. However, the content disclosed in the present invention is hereby incorporated by reference to the Japanese Patent Application No. 200 1 - 1 5845 5 (application deadline 2001.5.28), and the special request 2001-207442 (application date 2 0 0 1) 7 · 9 ), the full content of the instructions disclosed in the special request 2 0 〇 1 - 317981 (application for the period 2001. 10 · 16), and the special request 2002-91019 (application date 2002. 3 · 28). ^The paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) ^ - 54 - (Please read the notes on the back and fill out this page)

Claims (1)

I24890&amp;JJ] A8 Bcl ___補无 I_ D8__ 六、申請專利範圍 1 第91111187號專利申請案 中文申請專利範圍修正本 民國94年3月25日修正 1 · 一種載帶體，其係具有連續之收藏電子零件之袋 之模壓帶以護帶密封之載帶體，其特徵爲：護帶以剝離角 度1 7 0至1 8 0度，剝離速度3 0 0毫米/分鐘剝離 1 1 2毫米時之護帶之剝離帶電量係當護帶之表面電阻値 爲10 11歐姆以上時爲一 9至+ 9奈庫侖，當護帶之表 面電阻値未達1 0 11歐姆時爲一 3至+ 3奈庫侖，其中 面向護帶之部份之模壓帶主要含有苯乙烯系聚合物、聚碳 酸酯、聚酯及乙烯系共聚物中任一種以上，面向模壓帶之 護帶部份主要含有苯乙烯系共聚物及/或乙烯系共聚物。 2 ·如申請專利範圍第1項之載帶體，其中剝離護 帶時之，護帶之剝離帶電壓係當護帶之表面電阻値爲1 〇 1 1歐姆以上時’爲一1·9至+1·9千伏，護帶之表面 電阻値未達1011歐母時，爲一 〇 · 2至+0 · 2千伏 經濟部智慧財產局員工消費合作社印製 ’其中面向護帶之部份的模壓帶主要含有苯乙烯系聚合物 、聚碳酸酯、聚酯及乙烯系共聚物中任一種以上，面向模 壓帶之護帶部份主要含有苯乙嫌系共聚物及/或乙嫌系共 聚物。 3 . —種載帶體，其特徵爲：所用之護帶其收藏側之 表面以3 0度傾斜’使環氧樹脂封裝劑之2 8毫米見方 本紙張尺度適用中國國家摞準（CNS ) A4規格（210X297公釐） &quot; ---- 1248908 A8 B8 C8 D8 六、申請專利範圍 2 MQFP型I C滑落2 5 0毫米時，摩擦帶電量在 —0 . 3至+0 . 3奈庫侖。 (請先閲讀背面之注意事項再填寫本頁) 4·一種載帶體，其特徵爲：護帶面向電子零件之面 含有，對電子零件朝向護帶之面之帶電列，易於正側帶電 之樹脂及易於負側帶電之樹脂。 5 .如申請專利範圍第4項之載帶體，其係將面向 護帶之電子零件之面與電子零件，以3 0 〇來回/分鐘， 振幅5毫米振動1分鐘時電子零件側之帶電壓爲 ± 1 0 0 0伏特以下。 6 . —種電子零件之包裝容器，其特徵爲：與電子零 件接觸之包裝容器表.面，含偏二氟乙烯聚合物及丙烯酸酯 系聚合物。 7 ·如申請專利範圍第6項之包裝容器，其經3 0 0 次摩擦於電子零件產生之帶電量在1奈庫侖以下。 8·—種電子零件之包裝容器體，其特徵爲：使用如 申請專利範圍第6項或7項之包裝容器。 經濟部智慧財產局員工消費合作社印製 9 · 一種電子零件包裝用樹脂組成物，其特徵爲：·以 6 0 0轉/分鐘之速度摩擦5分鐘，於摩擦對象所生帶電 量之絕對値在1奈庫侖以下。 1 〇 ·如申請專利範圍第9項之電子零件包裝用樹脂 組成物，其中對丙烯酸酯系聚合物5 〇至2重量份及苯乙 燒系聚合物5 0至9 8重量份之合計1 〇 〇重量份，含導 電性賦予材料1至5 0重量份。 1 1 · 一種電子零件容器，其特徵爲：使用如申請專 -2- 1248908 A8 B8 C8 D8 六、申請專利範圍 3 利範圍第9項或1 0項之樹脂組成物。 12 · —種電子零件之包裝容器體，其特徵爲··使用 如申請專利範圍第9項或1 0項之樹脂組成物之包裝容器 〇 13 . —種電子零件容器，其特徵爲：與電子零件接 觸部份之表面粗度係J I S B — 0601之Ra在 0 . 5微米以上及/或Rmax在5微米以上。 1 4 ·如申請專利範圍第1 3項之電子零件容器，其 具備下述1至5之一以上要件·· 1 .表面含熱塑性樹脂， 2 ·表面電阻値在1 02至1 012歐姆之範圍， 3. 表面有抗靜電劑， 4. 表面有導電性物質， 5 .厚方向成多層構造。 1 5 ·如申請專利範圍第1 4項之電子零件容器，其 中導電性物質係碳黑或聚吡咯。 16 · —種電子零件包裝b片材，其特徵爲：表面粗 度係J I S B - 0601之Ra在〇 · 5微米以上及/ 或Rm a X在5微米以上。 1 7 ·如申請專利範圍第1 6項之電子零件包裝用片 材，其具備下述1至5之一以上要件·· 1 ·表面含熱塑性樹脂， 2 ·表面電阻値在1 〇2至1 〇12歐姆之範圍， 3 ·表面有抗靜電劑， (請先聞讀背面之注意事項再填寫本頁) 訂 •ΙΛ. 經濟部智慧財產局員工消費合作社印製 本紙尺度適用中國國家梂準（CNS ) A4規格（210X297公釐） ~ 1248908 A8 B8 C8 _ D8 六、申請專利範圍 4 4.表面有導電性物質， 5·厚方向成多層構造。 1 8 ·如申請專利範圍第1 6項之電子零件包裝用片 材，其中導電性物質係碳黑或聚D[t咯。 · 19 . 一種電子零件容器，其特徵爲··具有使用如申 請專利範圍第1 6項至1 8項中任一項之電子零件包裝用 片材，而表面粗度係JIS 8-0601之尺3在 0·5微米以上及/或Rmax在5微米以上之與電子零 件接觸之部份。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -4- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）I24890&amp;JJ] A8 Bcl ___补无I_D8__ VI. Patent application scope 1 Patent application No. 91111187 Patent application amendments revised in the Republic of China on March 25, 1994 1 · A carrier tape, which has continuous The carrier belt of the electronic component bag is sealed with a belt seal, which is characterized in that the belt is separated by a peeling angle of 170 to 180 degrees, and the peeling speed is 300 mm/min. The stripping power of the belt is a 9 to +9 nanocoulomb when the surface resistance of the belt is 10 11 ohms or more, and 3 to + 3 when the surface resistance of the belt is less than 10 11 ohms. Coulomb, wherein the part of the belt for the belt is mainly composed of at least one of a styrene polymer, a polycarbonate, a polyester, and a vinyl copolymer, and the belt portion facing the mold belt mainly contains a styrene copolymer. And/or a vinyl copolymer. 2 · If the carrier tape of the scope of claim 1 is removed, when the tape is peeled off, the peeling tape voltage of the tape is when the surface resistance of the tape is 〇1 1 ohm or more. +1·9 kV, when the surface resistance of the belt is less than 1011 Europa, it is 1〇·2 to +0 · 2 kV Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 'part of the belt The molding belt mainly contains at least one of a styrene polymer, a polycarbonate, a polyester, and a vinyl copolymer, and the belt portion facing the molding belt mainly contains a styrene-based copolymer and/or an ethylene copolymer. Things. 3. A carrier tape body characterized in that the surface of the belt used on the side of the collection is inclined at 30 degrees 'to make the epoxy resin encapsulant 28 mm square paper size applicable to China National Standard (CNS) A4 Specifications (210X297 mm) &quot; ---- 1248908 A8 B8 C8 D8 VI. Patent application scope 2 When the MQFP type IC slides down 250 mm, the frictional charge is -0.3 to +0.3 nacolun. (Please read the precautions on the back and then fill out this page.) 4. A carrier tape, which is characterized in that the protective tape is facing the surface of the electronic component, and the electrified column of the electronic component facing the surface of the protective tape is easy to be charged on the positive side. Resin and resin that is easily charged on the negative side. 5. The carrier tape of the fourth application patent scope, which is to face the electronic parts of the belt and the electronic parts, with a voltage of 30 rpm, an amplitude of 5 mm, and a voltage of 1 minute. It is ±1 0 0 volts or less. 6. A packaging container for an electronic component, characterized in that the surface of the packaging container in contact with the electronic component comprises a vinylidene fluoride polymer and an acrylate polymer. 7 · If the packaging container of the scope of claim 6 is rubbed into the electronic parts by 300 times, the amount of charge generated is less than 1 nanocolon. 8. A packaging container body for an electronic component, characterized in that: a packaging container as claimed in claim 6 or 7 is used. Ministry of Economic Affairs, Intellectual Property Bureau, Staff and Consumer Cooperatives Printed 9 · A resin composition for electronic parts packaging, characterized by: · Rubbing at a speed of 600 rpm for 5 minutes, the absolute amount of electricity generated by the friction object 1 Nykron below. (1) The resin composition for electronic component packaging according to the ninth application, wherein 5 〇 to 2 parts by weight of the acrylate-based polymer and 50 to 98 parts by weight of the styrene-based polymer are 1 〇 The weight-containing portion contains 1 to 50 parts by weight of the conductive imparting material. 1 1 · An electronic component container characterized by using a resin composition as claimed in the application specification -2- 1248908 A8 B8 C8 D8 6. Patent application 3 Scope 9 or 10. 12) A packaging container body for an electronic component, characterized in that: a packaging container 使用13 using a resin composition as claimed in claim 9 or 10; an electronic component container characterized by: The surface roughness of the contact portion of the part is JISB - 0601, Ra is 0.5 μm or more and/or Rmax is 5 μm or more. 1 4 · The electronic parts container of claim 13 of the patent scope, which has one or more of the following requirements 1 to 5 · 1 . The surface contains a thermoplastic resin, 2 · The surface resistance 値 is in the range of 102 to 1 012 ohms 3. There is an antistatic agent on the surface, 4. There is a conductive substance on the surface, and 5. The thickness direction is multi-layered. 1 5 . The electronic component container of claim 14 of the patent application, wherein the conductive material is carbon black or polypyrrole. 16 - An electronic component package b sheet characterized by having a surface roughness of J I S B - 0601 of Ra of 5 μm or more and/or Rm a X of 5 μm or more. 1 7 · For the sheet for packaging electronic parts according to Clause 16 of the patent application, it has one or more of the following requirements 1 to 5 · 1 · Surface contains thermoplastic resin, 2 · Surface resistance 値 at 1 〇 2 to 1 〇12 ohm range, 3 ·Antistatic agent on the surface, (please read the back note first and then fill out this page) Order • ΙΛ. Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed paper scale applicable to China National Standard ( CNS ) A4 size (210X297 mm) ~ 1248908 A8 B8 C8 _ D8 VI. Patent scope 4 4. Conductive substances on the surface, 5. Thick layered into a multi-layer structure. 1 8 · For the electronic component packaging sheet of claim 16 of the patent application, wherein the conductive material is carbon black or poly D[t. 19. An electronic component container characterized by having a sheet for packaging electronic parts according to any one of claims 16 to 18, and having a surface roughness of JIS 8-0601 3 A portion in contact with an electronic component that is above 0.5 μm and/or has an Rmax of 5 μm or more. (Please read the notes on the back and fill out this page.) Printed by the Consumer Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs -4- This paper scale applies the Chinese National Standard (CNS) A4 specification (210X297 mm)
TW91111187A 2000-12-07 2002-05-27 Electronic component container TWI248908B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000372433A JP2002173194A (en) 2000-12-07 2000-12-07 Electronic parts container
JP2001158455A JP4001468B2 (en) 2001-05-28 2001-05-28 Carrier tape body
JP2001207442A JP2003020097A (en) 2001-07-09 2001-07-09 Packaging container
JP2001317981A JP3789343B2 (en) 2001-10-16 2001-10-16 Cover tape
JP2002091019A JP4068375B2 (en) 2002-03-28 2002-03-28 Resin composition for packaging electronic parts

Publications (1)

Publication Number Publication Date
TWI248908B true TWI248908B (en) 2006-02-11

Family

ID=37429386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91111187A TWI248908B (en) 2000-12-07 2002-05-27 Electronic component container

Country Status (1)

Country Link
TW (1) TWI248908B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI491700B (en) * 2008-11-12 2015-07-11 Denki Kagaku Kogyo Kk Cover tape
TWI742017B (en) * 2015-11-23 2021-10-11 美商3M新設資產公司 Multi-layer cover tapes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI491700B (en) * 2008-11-12 2015-07-11 Denki Kagaku Kogyo Kk Cover tape
TWI742017B (en) * 2015-11-23 2021-10-11 美商3M新設資產公司 Multi-layer cover tapes

Similar Documents

Publication Publication Date Title
US7455896B2 (en) Electronic component container
JP5474930B2 (en) Cover film
CN102171109B (en) Cover tape
EP2695735B1 (en) Cover film
CN101426697A (en) Cover film
TWI437043B (en) A conductive resin composition, and a conductive sheet using the same
EP2145838A1 (en) Electronic component packing body
JP6117098B2 (en) Cover tape
CN100415614C (en) container for electronic components
TWI248908B (en) Electronic component container
CN1326921C (en) Electroconductive resin composition
US7364778B2 (en) Container for an electronic component
JP4899593B2 (en) Cover tape for packaging electronic parts
WO2005102860A1 (en) Cover tape, and carrier tape system for packing electronic component
JP2008273602A (en) Cover film
JP2012030897A (en) Cover tape for packaging electronic component
JP2005146069A (en) Resin composition, molded product thereof and composite resin sheet
JP4068375B2 (en) Resin composition for packaging electronic parts
JP3992462B2 (en) Thermoplastic resin sheet
JP4087241B2 (en) Method for applying antistatic agent and cover tape
JP2003128132A (en) Cover tape
JP4215564B2 (en) Sheets and films using vinylidene fluoride polymer and acrylate polymer
JP3669899B2 (en) Electronic component container
JP4731805B2 (en) Adhesive film
JP5166386B2 (en) Conductive material for packaging electronic parts

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees