TWI240947B - Pumping system of load lock chamber and operating method thereof - Google Patents
Pumping system of load lock chamber and operating method thereof Download PDFInfo
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1240947 五、發明說明(1) 發明所屬之技術領域 本發明是有關於一種半導體製程的真空(vacuum)系 、、充且特另丨疋有關於裝載室(load lock chamber)之抽氣 (pumping)系統及其操作方法。 先前技術 ^在半導體的製程中,有許多的製程是必須在降壓或 =織熱放電(gl/w discharge)的環境中執行,例如是磊 晶成長、化學氣相沈積法(CVD,常壓化學氣相沈積法 (A P C V D )除外)、餘刻(e t c h丨n g )、物理氣相沈積法(包括 蒸鍵、濺鏟)、離子植入(i〇n implantati〇n)等。因此在 從事上述製程的機器中必須裝設真空系統。 一般而言’在真空系統中通常會裝設一裝載,室(1〇ad lock chamber) ’ 用以使製程室(pr〇cess chamber)保持 真空’以降低污染並縮短製程週期。其中此裝載室之一 側係連接至所欲操作之製程的製程室,且此裝載室藉由 一條單獨的前置管路(f〇re Hne)連接至一粗抽泵^⑽忌]^ pump)。在進行製程時,首先係將晶圓放入裝載室,然後 藉由粗抽泵抽出裝載室中的空氣,使裝載室由大氣壓 Utmosphere, ATM)開始降壓,當裝載室到達一定真空 後’打開連接裝載室與製程室的閥門以將晶圓送到製程 室’再接著進行後續的製程。 請參照第1圖,第1圖所繪示為習知一種抽氣系統連 接至一裝載室的示意圖。其中此抽氣系統至少包括粗抽 泵1〇2、抽氣管路1〇4與隔離閥“^。抽氣管路104之兩端1240947 V. Description of the invention (1) The technical field to which the invention belongs The present invention relates to a vacuum system for a semiconductor process, and particularly to pumping of a load lock chamber System and method of operation. Prior technology ^ In the semiconductor manufacturing process, there are many processes that must be performed in a step-down or gl / w discharge environment, such as epitaxial growth, chemical vapor deposition (CVD, atmospheric pressure). Except for chemical vapor deposition (APCVD), etch, ng, physical vapor deposition (including vapor bonding, sputtering spatula), ion implantation (ion implantation) and so on. Therefore, a vacuum system must be installed in the machine engaged in the above process. Generally speaking, a load is usually installed in a vacuum system, and a 10ad lock chamber is used to maintain a vacuum in the process chamber to reduce pollution and shorten the process cycle. One side of the loading chamber is connected to the process chamber of the process to be operated, and the loading chamber is connected to a rough pump by a separate front line (fore Hne) ^ ⑽ 忌] pump ). During the manufacturing process, first the wafer is placed in the loading chamber, and then the air in the loading chamber is drawn out by a rough pump, so that the loading chamber starts to depressurize from atmospheric pressure (Utmosphere, ATM). When the loading chamber reaches a certain vacuum, it is opened. Valves that connect the loading chamber to the process chamber to send wafers to the process chamber 'and then proceed to subsequent processes. Please refer to Fig. 1. Fig. 1 shows a schematic diagram of a conventional suction system connected to a loading chamber. The extraction system includes at least a rough extraction pump 102, an extraction line 104, and an isolation valve "^. Both ends of the extraction line 104
10245pif.ptd 第5頁 1240947 五、發明說明(2) 係個別連接至裝載室1 〇 〇與粗抽泵1 〇 2,以使裝載室1 〇 〇中 的氣體能夠經由抽氣管路1 〇 4被抽出。並且隔離閥1 〇 6係 配置於抽氣管路1 0 4上,用以控制抽氣管路丨〇 4的開閉。 當進行抽氣製程時,首先係將晶圓(未圖示)放入裝 載至1 0 0,然後打開隔離閥1 〇 β,並藉由粗抽泵1 〇 2經由抽 ^官路104抽出裝載室1〇〇中的空氣,以使裝載室由大氣 壓(atmosphere, ATM)開始降壓,當裝載室1〇()到達一定 真空後’打開連接裝載室1 0 0與製程室(未圖示)的閥門以 將晶圓送到製程室,再接著進行後續的製程。 J而、在上述藉由粗抽泵抽出裝載室中之空氣的步 驟中並/又有對抽氣速度進行任何的控制,亦即是當啟 動,抽泵進订抽氣時,就會以粗抽泵所提供的抽,氣速度 進行抽氣。在使裝載室由大氣壓開始降壓的初始 (1 η 1 γ a 1 )階段,此過快的抽氣速度將會使得裝載室中產 生空氣擾流(air turbulent),進而引發產生粒子 (particle)的問題。並且,隨著製程線寬的逐漸縮小, 此粒子問題將會變得更形嚴重。另一方面,如果為了避 免擾流問題而使用抽氣速率較低的粗抽泵,則會造成產 率(throughput)的降低。 發明内容 因此’本發明的目的在提供一種裝載室之抽氣系統 及其操作方法’能夠避免於抽氣過程中在裝載室中產生 擾流,引發粒子問題。 本發明的另一目的在提供一種裝載室之抽氣系統及10245pif.ptd Page 5 1240947 V. Description of the invention (2) It is separately connected to the loading chamber 1 00 and the rough suction pump 1 102 so that the gas in the loading chamber 1 00 can be discharged through the suction line 1 04 Withdraw. And the isolation valve 106 is arranged on the suction line 104, and is used to control the opening and closing of the suction line 104. When the pumping process is performed, the wafer (not shown) is first loaded to 100, then the isolation valve 1 〇β is opened, and the load is pulled out by the rough suction pump 1 〇2 through the pumping official road 104. The air in the chamber 100, so that the loading chamber begins to depressurize from atmospheric pressure (ATM). When the loading chamber 10 () reaches a certain vacuum, the connection between the loading chamber 100 and the process chamber (not shown) is opened. The valve is used to send the wafer to the process chamber, and then the subsequent process. J. In the above step of extracting the air in the loading chamber by the rough pump and / or any control of the suction speed, that is, when the pump is started and the suction is set, the rough The pumping speed provided by the pump is used for pumping. During the initial (1 η 1 γ a 1) stage where the loading chamber is depressurized from atmospheric pressure, this excessively fast pumping speed will cause air turbulent in the loading chamber, which will cause particles The problem. And, as the process line width gradually decreases, this particle problem will become more serious. On the other hand, if a rough pump with a lower suction rate is used to avoid the problem of turbulence, the throughput will be reduced. SUMMARY OF THE INVENTION Therefore, the object of the present invention is to provide a suction system of a loading chamber and a method for operating the same, which can avoid generating turbulence in the loading chamber during the pumping process and causing particle problems. Another object of the present invention is to provide a suction system of a loading chamber and
1240947 五、發明說明(3) 其操作方法,能夠使用較快的抽氣速率進行抽氣,以確 保半導體製程的產率不至於下降。 本發明提出一種裝載室之抽氣系 載室中之氣體,此系統至少係由一粗 管路、一第一隔離閥、一第二抽氣管 統, 抽泵 適用於抽取裝 、一第一抽氣 第 與一空氣流量調節器所構成。其中第 係分別連接裝載室與粗抽泵,第一隔 抽氣管路,第二抽氣管路係配置於第 一抽氣管路,第二隔離閥係配置於第 空氣流量調節器係配置於第二抽氣管 本發明提出一種裝載室之抽氣系 用於抽取裝載室中之氣體,此方法係 (低速的抽氣速率)開始抽氣,然後將 至一第二抽氣速率(高速抽氣速率)進 抽氣速率大於第一抽氣速率,且以第 時間大於以第一^抽氣速率抽氣的時間 而且,在抽氣系統係由上述粗抽 路、第一隔離閥、第二抽氣管路、第 量調節器所構成時,此抽氣系統的操 持第一隔離閥為關閉狀態,接著開啟 開啟第二隔離閥,然後再啟動粗抽泵 第一抽氣速率進行抽氣,且在將第一 二抽氣速率時開啟第一隔離閥,以使 氣速率繼續進行抽氣。 抽 離閥 二抽 路。 氣管 係配 隔離閥 氣管 二隔離閥 路之兩端 置於第一 兩端之第 路,以及 統的操作方法,適 抽'氣速率 速率切換 其中第二 率抽氣的 以一 第一 行抽 二抽 第 抽氣 氣, 氣速 泵、第一 二隔離閥 作方法係 空氣流量 ,以使抽 抽氣速率 抽氣系統 抽氣管 與空氣流 為首先保 調節器並 氣糸統以 切換為第 以第二抽1240947 V. Description of the invention (3) The operation method can use a faster pumping rate for pumping to ensure that the yield of the semiconductor process does not decrease. The present invention proposes a gas extraction system of a loading chamber. The system is composed of at least a thick pipeline, a first isolation valve, and a second extraction pipe system. The extraction pump is suitable for extraction installation, a first extraction Composed of air and an air flow regulator. The first system is connected to the loading chamber and the rough suction pump, the first air-extraction pipeline, the second air-exhaust pipeline are arranged on the first air-exhaust pipeline, and the second isolation valve is disposed on the second air flow regulator system and disposed on the second Extraction pipe The present invention proposes a pumping system of the loading chamber for pumping the gas in the loading chamber. This method (low-speed pumping rate) starts pumping, and then reaches a second pumping rate (high-speed pumping rate). Intake and extraction rate is greater than the first extraction rate, and the first time is greater than the time to extract at the first extraction rate. Also, in the extraction system, the rough extraction path, the first isolation valve, and the second extraction line are used. When the first volume regulator is constructed, the first isolation valve of the pumping system is closed, then the second isolation valve is opened and then the first pumping rate of the rough pump is started to pump, and the first The first isolation valve is opened at one or two pumping rates so that the pumping rate continues. Evacuation valve second pump. The air pipe is equipped with an isolation valve. Two ends of the two isolation valve circuits are placed on the first two ends of the circuit, and a unified operation method. The pumping rate is switched between the second rate and the second rate. The first method of pumping air, the air speed pump, and the first and second isolation valve are the air flow rate, so that the pumping rate and the air flow of the pumping system and the air flow are the first to maintain the regulator and the system to switch to the first and second. Pump
10245pif.ptd 第7頁 1240947 五、發明說明(4) 由上述可知,由於本發明之抽氣系統係在以高速抽 · 氣速率進行抽氣的抽氣管路上,另外裝設一條管徑較小 . 的抽氣管路,在開始抽氣的初期,係使被抽取的氣體流 經管徑較小的抽氣管路,並藉由管徑較小的抽氣管路與 配置其上的空氣流量調節器以對空氣流量/抽氣速率進行 良好的控制,因此能夠調整至較低的抽氣速率下以進行 , 初期的抽氣,而能夠避免在裝載室中產生擾流,進而避 免因擾流所產生之粒子污染的問題。 ' 而且,由於避免產生擾流所操作的第一抽氣速率(低 速抽氣)的時間並不長,且於抽氣步驟的其餘時間皆維持 在第二抽氣速率(高速抽氣)的狀態,因此整體而言能夠 ί. 維持在高速的抽氣速率進行抽氣,從而維持產率不至於 降低。甚或可以使用抽氣速率更大的粗抽泵並配合上述 之低速抽氣的操作,以在避免擾流所致之粒子污染的情 況下,進一步的提高產率。 為讓本發明之上述目的、特徵和優點能更明顯易 懂,下文特舉一較佳實施例,並配合所附圖式,作詳細 說明如下: 實施方式 第2圖所繪示為本發明較佳實施例之一種抽氣系統連 接至一裝載室的示意圖。請參照第2圖,本實施例的抽氣 系統係適用於抽取裝載室2 0 0中的空氣,至少包括粗抽泵 202、抽氣管路(pumping line)204、抽氣管路隔離閥 (isolation valve)206、抽氣管路208、抽氣管路隔離閥10245pif.ptd Page 7 1240947 V. Description of the invention (4) As can be seen from the above, since the pumping system of the present invention is based on a pumping pipe for pumping at a high-speed pumping rate, a small pipe diameter is additionally installed. In the initial stage of starting the pumping, the pumped gas flows through the pumped pipe with a smaller diameter, and the pumped pipe with a smaller diameter and an air flow regulator arranged thereon The air flow / exhaust rate is well controlled, so it can be adjusted to a lower exhaust rate for the initial exhaust, and can avoid turbulence in the loading chamber, and then avoid the turbulence caused by the turbulence. The problem of particle contamination. 'Moreover, because the first pumping rate (low-speed pumping) operated to avoid turbulence is not long, and the second pumping rate (high-speed pumping) is maintained for the rest of the pumping step Therefore, as a whole, it is possible to maintain the high-speed pumping rate for pumping, thereby maintaining the productivity. It is even possible to use a rough pump with a higher pumping rate in conjunction with the low-speed pumping operation described above to further increase the yield while avoiding particle contamination caused by turbulence. In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below and described in detail with the accompanying drawings as follows: Embodiment 2 FIG. A schematic diagram of a preferred embodiment of an extraction system connected to a loading chamber. Please refer to FIG. 2. The air extraction system of this embodiment is suitable for extracting air in the loading chamber 200, and includes at least a rough extraction pump 202, a pumping line 204, and an isolation valve. 206, extraction line 208, extraction line isolation valve
10245pif.ptd 第8頁 1240947 五、發明說明(5) 210與空氣流量調節器(311^1(^『6£11131:〇1')212。 抽氣管路2 0 4之兩端係個別連接至裝載室2 〇 〇與粗抽 泵202 ’以使裝載室2〇〇中的氣體能夠經由抽氣管路2〇4被 抽出,其中抽氣管路2 0 4所使用的管徑尺寸,例如是一般 工業上所經$使用的尺寸而為4英对至6英11寸。 抽氣管路隔離閥2 〇 6係配置於抽氣管路2 〇 4上,藉由 抽氣管路隔離閥2 0 6的開閉,用以控制氣體是否經抽9氣管 0 4而被排出。其中此抽氣管路隔離閥2 〇 6例如是使用 氣動閥(pneumatic valve) 〇10245pif.ptd Page 8 1240947 V. Description of the invention (5) 210 and air flow regulator (311 ^ 1 (^ 『6 £ 11131: 〇1 ') 212. The two ends of the exhaust pipe 2 0 4 are individually connected to Loading chamber 2000 and rough suction pump 202 'so that the gas in the loading chamber 2000 can be extracted through the suction pipe 204, and the diameter of the pipe used for the suction pipe 204 is, for example, general industrial The size used above is from 4 inches to 6 inches and 11 inches. The extraction line isolation valve 2 06 is arranged on the extraction line 2 04. With the opening and closing of the extraction line isolation valve 2 06, It is used to control whether the gas is exhausted through the exhaust pipe 0. The exhaust line isolation valve 2 0 is, for example, a pneumatic valve.
抽氣管路2 0 8的兩端點2 1 4、2 1 6係個別配置於抽氣;I 路隔離閥2 0 6兩側之抽氣管路2 0 4上,其中端點214係配】 於裝載室2 0 0與抽氣管路隔離閥2〇6之間的抽氣管.路2〇4 上,且端點2 1 6係配置於抽氣管路隔離閥2 〇 6與粗抽泵2 〇丨 之間的抽氣管路2 04上,用以使氣體亦能夠由接近裝載室 2〇〇側的端點214分流經過抽氣管路2〇8,再於接近粗抽 202/則的端點216合流至抽氣管路2〇4而將氣體排出,其寸 路2 0 8所使用的管徑尺寸係小於抽氣管路2〇4所使 用的官徑尺寸,其例如是1英吋左右。 抽氣管路隔離閥2 1 0係配置於抽氣管路2〇8上,藉由The two end points 2 1 4 and 2 1 6 of the exhaust line 2 0 8 are individually configured for exhaust; the I line isolation valve 2 0 6 is on the exhaust lines 2 0 4 on both sides, of which the end point 214 is equipped. The exhaust pipe between the loading chamber 2 0 0 and the extraction line isolation valve 2 06 is located on the road 2 0 0 and the end point 2 1 6 is arranged at the extraction line isolation valve 2 0 6 and the rough extraction pump 2 〇 丨On the suction line 204 between them, the gas can also be diverted from the end point 214 near the 200 side of the loading chamber through the suction line 208, and then merged at the end point 216 near the rough extraction 202 / then. The gas is exhausted to the exhaust pipe 204, and the size of the pipe diameter used in the inch path 208 is smaller than the official diameter size used in the exhaust pipe 204, which is, for example, about 1 inch. The extraction line isolation valve 2 0 is arranged on the extraction line 208.
Li管路Λ離閥210的開閉,以控制氣體是否流經抽氣管 08。其中此抽氣管路隔離閥21〇例如是使用氣動閥。 王氣流量調節器212係配置於抽氣管路2〇8上,用以 ,,以及調節流經抽氣管路2〇8的氣體流量。其中此空氣 机里調節器2 1 2係能夠任意配置於抽氣管路隔離閥2 i 〇與The Li pipe Λ is opened and closed from the valve 210 to control whether the gas flows through the suction pipe 08. The exhaust line isolation valve 21 is a pneumatic valve, for example. The king gas flow regulator 212 is arranged on the exhaust pipe 208, and is used to adjust the gas flow through the exhaust pipe 208. Among them, the regulator 2 1 2 in the air machine can be arbitrarily arranged in the exhaust line isolation valve 2 i 〇 and
l〇245pi f.ptd 第9頁 1240947 五、發明說明(6) 端點2 1 6之間的抽氣管路2 〇 8上,亦或是端點2 1 4與抽氣管 路隔離閥2 1 0之間的抽氣管路2 0 8上,並且此空氣流量調 節器2 1 2例如是可以使用節流閥(t hr 〇 111 e v a 1 v e ),以節 流閥的使用為例,係能夠藉由調整節流閥的位置(其可調 段數例如是具有3 0段,從第〇段到第3 0段為從關到全 開),進而調整空氣流量的大小。 粗抽泵2 0 2係與抽氣管路2 0 4連接,用以提供抽氣的 驅動力以將裝載室200中的氣體經由抽氣管路204或是抽 氣管路2 0 8而抽出。其中此粗抽泵2 0 2例如是使用機械泵 (mechanical pump) 〇l〇245pi f.ptd Page 9 1240947 V. Description of the invention (6) The exhaust line 2 08 between the end points 2 1 6 or the end valve 2 1 4 and the exhaust line isolation valve 2 1 0 Between the exhaust pipe 2 0 8 and the air flow regulator 2 1 2 can use a throttle valve (t hr 111 111 eva 1 ve), for example, the use of a throttle valve can be used by Adjust the position of the throttle (the number of adjustable segments is, for example, 30 segments, from 0 to 30, from closed to fully open), and then adjust the air flow. The rough extraction pump 202 is connected to the extraction line 204, and is used to provide a driving force for extraction to extract the gas in the loading chamber 200 through the extraction line 204 or the extraction line 208. The rough pump 2 0 2 is, for example, a mechanical pump.
而且,依照實際製程設備的不同,裝載室2 0 0更可以 連接至製程所相對應的製程室(process chamber,,未繪 示),以使晶圓在裝載室2 0 0完成降壓或是抽真空步驟 後,進一步送至製程室以進行後續的製程。 請繼續參照第2圖,本發明較佳實施例之裝載室之抽 氣系統的操作方法如下所述。 於起始狀態下,隔離閥2 0 6、2 1 0與空氣流量調節器 2 1 2都是處於關閉的狀態。 接著打開空氣流量調節器2 1 2至所需要的流量大小 (段數)並打開隔離閥2 1 0,然後,啟動粗抽泵2 〇 2以開始 進行抽氣的步驟,此時裝載室2 0 0中的氣體係經由連接裝 載室2 0 0與端點2 1 4間的抽氣管路2 0 4、端點2 1 4、抽氣管 路2 0 8、端點216與端點216與連接粗抽泵2 0 2間的抽氣管 路2 0 4而由粗抽泵2 0 2抽出。其中打開空氣流量調節器2 j 2In addition, according to the actual process equipment, the loading chamber 2000 can be connected to a process chamber (not shown) corresponding to the process, so that the wafer can be depressurized or loaded in the loading chamber 2000. After the evacuation step, it is further sent to the process chamber for subsequent processes. Please continue to refer to FIG. 2. The operation method of the suction system of the loading chamber according to the preferred embodiment of the present invention is as follows. In the initial state, the isolation valves 206, 2 10 and the air flow regulator 2 1 2 are closed. Then open the air flow regulator 2 1 2 to the required flow rate (number of segments) and open the isolation valve 2 1 0. Then, start the rough pump 2 0 2 to start the extraction process. At this time, the loading chamber 2 0 The gas system in 0 is connected to the loading chamber 2 0 0 and the end point 2 1 4 through the extraction line 2 0 4, the end point 2 1 4, the extraction line 2 0 8, the end point 216 and the end point 216 and the connection between the rough The suction line 2 0 between the suction pumps 202 is drawn by the rough suction pump 202. Which opens the air flow regulator 2 j 2
l〇245pif.ptdl〇245pif.ptd
1240947 五、發明說明(7) 以開始進行抽氣的步驟,例如是能夠緩慢的打開空氣流 量調節器2 1 2至一定流量大小(段數),以使之到達一定的 壓力。 由於在本發明之抽氣系統中,所使用的抽氣管路2 0 8 管徑係小於抽氣管路的管徑2 0 4,並藉由控制空氣流量調 節器2 1 2 ,而能夠對於從裝載室2 0 0抽氣的空氣流量/抽氣 速率進行良好的控制,因此,係能夠以較低的空氣流量/ 抽氣速率進行抽氣,進而避免在抽氣製程初期於製程室 2 0 0中產生擾流的問題。1240947 V. Description of the invention (7) To start the pumping step, for example, the air flow regulator 2 1 2 can be slowly opened to a certain flow size (number of segments) so that it reaches a certain pressure. Because in the extraction system of the present invention, the diameter of the extraction pipe 2 0 8 used is smaller than the diameter of the extraction pipe 2 0 4 and can be controlled by the air flow regulator 2 1 2 The air flow rate / exhaust rate of the room 2000 exhaust is well controlled, so the system can extract air at a lower air flow rate / exhaust rate, thereby avoiding being in the process room 200 at the beginning of the exhaust process The problem of spoiling.
接著,在到達一定的壓力之後,例如是在裝載室2 0 0 的氣壓開始小於3 0 0托時,全開空氣流量調節器21 2,其 後,再將抽氣管路隔離閥2 0 6開啟,此時經由抽氣管路 2 0 4的抽氣步驟將會取代經由抽氣管路2 0 8的抽氣步驟, 而進行與習知相同的高速抽氣製程。由於在前述步驟中 達成避免擾流發生的目的後,就將全部的隔離閥打開, 以使抽氣速度由低速抽氣切換為高速抽氣以完成抽氣製 程,而且,由於高速的時間較低速抽氣長,且在變成高 速抽氣後便維持高速抽氣至抽氣步驟結束,因此,整體 而言,此抽氣步驟係在能夠避免擾流發生的情況下,亦 能夠使抽氣步驟維持高速的抽氣速率,進而使產率不至 於降低。 於上述較佳實施例中,係以抽取裝載室中的氣體進 行降壓或是抽真空以做說明,然而本發明之抽氣系統及 其操作方法並不限定於此,亦可以應用於例如是製程室Then, after a certain pressure is reached, for example, when the air pressure in the loading chamber 200 starts to be less than 300 Torr, the air flow regulator 21 2 is fully opened, and then the exhaust line isolation valve 2 06 is opened. At this time, the pumping step through the pumping line 204 will replace the pumping step through the pumping line 208, and the same high-speed pumping process as the conventional one will be performed. After the purpose of avoiding turbulence is achieved in the foregoing steps, all the isolation valves are opened, so that the extraction speed is switched from low-speed extraction to high-speed extraction to complete the extraction process, and because the high-speed time is low The high-speed pumping is long, and after the high-speed pumping, the high-speed pumping is maintained to the end of the pumping step. Therefore, as a whole, this pumping step is able to avoid the occurrence of turbulence and make the pumping step Maintain high-speed pumping rate, so that the yield will not be reduced. In the above-mentioned preferred embodiments, the gas in the loading chamber is extracted for depressurization or evacuation for illustration. However, the air extraction system and operation method of the present invention are not limited to this, and can also be applied to, for example, Process room
10245pif.ptd 第11頁 124094知 五、發明說明(8) 等其他任何需 綜上所述 速率進行抽氣 抽氣管路,在 管徑較小的抽 置其上的空氣 良好的控制, 初期的抽氣, 免因擾流所產 而且,由 不長,且於抽 態,因此整體 氣,從而能夠 速率更大的粗 避免擾流所致 率〇 雖然本發 用以限定本發 之精神和範圍 明之保護範圍 要降壓 ,由於 的抽氣 開始抽 氣管路 流量調 因此能 而能夠 生之粒 於避免 氣步驟 而言能 維持產 抽泵並 之粒子 或是抽 本發明 管路上 氣的初 ,並藉 節器, 夠調整 避免在 子污染 產生擾 的其餘 夠維持 率不至 配合上 污染的 真空 之抽 ,另 期, 由管 以對 至較 裝載 的問 流所 時間 高速 於降 述之 情況 明已以一較佳實施 明,任何熟習此技 内,當可作各種之 當視後附之申請專 的腔體。 氣糸統係在以而速抽氣 外裝設一條管徑較小的 係使被抽取的氣體流經 徑較小的抽氣管路與配 空氣流量/抽氣速率進行 低的抽氣速率下以進行 室中產生擾流,進而避 題。 操作的低速抽氣時間並 皆維持在高速抽氣的狀 的抽氣速率以進行抽 低。甚或可以使用抽氣 低速抽氣的操作,以在 下,進一步的提高產 例揭露如上,然其並非 藝者,在不脫離本發明 更動與潤飾,因此本發 利範圍所界定者為準。10245pif.ptd Page 11 124094 Know five. Description of the invention (8) and any other need to sum up the above-mentioned rate of extraction air extraction pipeline, the smaller the diameter of the air placed on it is well controlled, the initial extraction Qi is free from disturbance and is not long and is in a pumping state, so the overall Qi can be more coarse and avoid the rate of disturbance. Although this hair is used to limit the spirit and scope of the hair, The protection range needs to be reduced in pressure. Because the pumping starts to adjust the flow rate of the pumping pipeline, it can produce particles. In terms of avoiding the gas step, it can maintain the particles produced by the pumping pump or pump the gas on the pipeline of the present invention. The controller can be adjusted to avoid disturbances caused by sub-pollution, and the remaining maintenance rate can not be matched with the pumping of the contaminated vacuum. In addition, it is clear that the time from the pipe to the loading of the interrogation flow is faster than the derating. A better practice shows that anyone familiar with this technique can be used as a special cavity attached to the application. The gas system is equipped with a smaller diameter outside the pumping system at a faster speed, so that the extracted gas flows through the smaller diameter of the suction pipe and the air flow rate / extraction rate is low. Turbulence is generated in the progress room, and the problem is avoided. The low-speed pumping time of the operation is maintained at the high-speed pumping speed for pumping down. It is even possible to use the operation of low-speed air extraction. In the following, to further improve the product disclosure as described above, but it is not an artist, without departing from the changes and retouching of the present invention, so the scope of the present invention shall prevail.
10245pif.ptd 第12頁 1240947 圖式簡單說明 第1圖所繪示為習知一種抽氣系統連接至一裝載室的 示意圖。 第2圖所繪示為本發明另一較佳實施例之一種抽氣系 統連接至一裝載室的示意圖。 圖式標示說明: 1 00、2 0 0 :裝載室 1 0 2、2 0 2 :粗抽泵 104、108、204 :抽氣管路 1 0 6、2 0 6、2 1 0 :隔離閥 2 1 2 :空氣流量調節閥 2 1 4、2 1 6 :端點10245pif.ptd Page 12 1240947 Brief Description of Drawings Figure 1 shows a schematic diagram of a conventional suction system connected to a loading chamber. FIG. 2 is a schematic diagram of an extraction system connected to a loading chamber according to another preferred embodiment of the present invention. Description of diagrams: 1 00, 2 0 0: loading chamber 1 0 2, 2 0 2: rough pump 104, 108, 204: suction line 1 0 6, 2 0 6, 2 1 0: isolation valve 2 1 2: Air flow regulating valve 2 1 4, 2 1 6: End point
10245pif.ptd 第13頁10245pif.ptd Page 13
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CN104241174B (en) * | 2013-06-14 | 2017-09-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | The blowing method of film magazine chamber, plasma processing device and film magazine chamber |
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