TWI235473B - Ball grid array package structure, heat slug structure, and laser mark rework method - Google Patents
Ball grid array package structure, heat slug structure, and laser mark rework method Download PDFInfo
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- TWI235473B TWI235473B TW093111199A TW93111199A TWI235473B TW I235473 B TWI235473 B TW I235473B TW 093111199 A TW093111199 A TW 093111199A TW 93111199 A TW93111199 A TW 93111199A TW I235473 B TWI235473 B TW I235473B
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- heat sink
- material layer
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- metal sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
1235473 五、發明說明（1) 發明所屬之技術領域1235473 V. Description of the invention (1) Technical field to which the invention belongs
本發明是有關於一種封裝、散熱構件及標記的重工方 法，且特別是有關於一種球腳格狀陣列封裝（BGA package )、散熱片（heat slug)及雷射標記的重工方法 (rework method ) 〇 先前技術The invention relates to a rework method for packaging, heat dissipation members and markings, and in particular to a BGA package, heat slug, and rework method for laser marking. 〇 Prior technology
近年來’隨著半導體製程技術的不斷成熟與發展，各 種南效能的電子產品不斷推陳出新，而電子產品的功能朝 向人性化與多功能等方面發展，然而電子產品内部均有各 種功能不一的積體電路（Integrated Circuit, 1C)元 件。在電子元件的製作過程中，積體電路封裝（IC packaging)扮演著相當重要的角色，而積體電路封裝型 態可大致區分為引腳插入型（pirl In Hole, PIH)與表面 黏著型（Surface Mount Technology, SMT)兩大類，其 中引腳插入型例如為雙邊引腳封裝（Dual In_i ineIn recent years, with the continuous maturity and development of semiconductor process technology, various electronic products with continuous performance have been continuously innovated, and the functions of electronic products have developed in terms of humanization and multi-function. However, there are various functions in electronic products. Body Circuit (Integrated Circuit, 1C) components. In the manufacturing process of electronic components, integrated circuit packaging (IC packaging) plays a very important role, and integrated circuit packaging types can be roughly divided into pin insertion type (pirl In Hole (PIH)) and surface adhesion type ( Surface Mount Technology (SMT) two types, of which the pin-insertion type is a double-sided package (Dual In_ine)
Package， DIP)與針陣列封裝（pin Grid Array, PGAPackage (DIP) and pin grid array (PGA)
)’而表面黏著型例如打線接合封裝（W丨r e b ο n d i n g Package，WB)、貼帶自動接合封裝（Taf)e Automatic Bonding， TAB)、覆晶接合（Fnp Chip， FC)與球腳格 狀陣列封裝（Ball Grid Array package, BGA)等型式， 且每種封裝形式均具有其特殊性與應用領域。 承I戶斤$ ’無論電子元件使用哪種封裝形式，最後均 需要在電f το件的表面上打上產品名稱或產品代號，而其 方法例如疋使用油墨印刷或雷射刻印（1 a s e r m a r k i n g) 'And surface-adhesive types such as wire bonding packages (W 丨 reb ο nding Package (WB), tape automatic bonding package (Taf) e Automatic Bonding (TAB), flip chip bonding (Fnp Chip, FC) and ball foot grid Array package (Ball Grid Array package, BGA) and other types, and each package has its specificity and application field. No matter which type of packaging is used for electronic components, the product name or product code must be stamped on the surface of the electrical component, and the method such as using ink printing or laser marking (1 a s e r m a r k i n g
12640TWF.PTD12640TWF.PTD
第7頁 1235473 五、發明說明（2) )。值得一提的是 刷的 但是 刻印 以雷 元件 使得 加以 發明 電子 使用 法是 射標 的功 這些 拋棄 内容 重工 射標 類散 裝， 材料 的重 封裝 形成 片材 其中 料層 有鑒 方法 記。 此外 熱片 另外 而球 層， 基於 工方 體具 元件可以 雷射刻印 採用雷射 記無法被 能仍屬正 功能相當 掉。 於此，本 ，其能夠 ，本發明 材料層， ，本發明 腳格狀陣 以使雷射 上述目的 法例如包 有外露之 ，當打印的 藉由融劑洗 的電子元件 破壞產品之 重新製作。 常且可用， 正常之可用 内容有錯誤時，使用油墨印 去油墨，並重新印刷即可， 卻無法重新刻印。由於雷射 表面，以形成雷射標記，所 此外，上述具有錯印之電子 但由於錯印所造成的瑕疵， 品幾乎都是以報廢的方式而 發明的目的就是在提供一種雷射標記的 一電子元件之一表面上，重新製作一雷 的另一目的是提供 以使雷射標記能夠 的又一目的是提供 列封裝具有 標記能夠重 或其他目的 括下列步驟 一種散熱片，其具有 重新被製作。 一種球腳格狀陣 散熱片，其具有類散 新被製 ，本發 。首先 且散熱 ，於散 散熱片， 有一第一雷射標記。然後 material layer 層係填平第一雷射 上表面。最後，於 料層 類散 具有 (pseudo 熱片材料 平坦的一 作。 明提出一種雷射 ，提供一封裝體 片外露的一表面 熱片上形成一類 for heat slug 標記，且類散熱 類散熱片材料層 列封 熱片 標記 ，而 上已 散熱 )， 片材 之上Page 7 1235473 V. Description of Invention (2)). It is worth mentioning that it is brushed but engraved with a lightning element to make it invented. The electronic use method is the work of shooting targets. These discarded contents are reworked. Shooting targets are in bulk. The repackaging of the materials into a sheet. In addition to the thermal film and the ball layer, the industrial body-based components can be laser-marked. The laser mark cannot be used, which can still be a positive function. At this point, Ben, which can be the material layer of the present invention, the foot lattice of the present invention, so that the above-mentioned purpose method of the laser includes, for example, exposed electronic components, when printed electronic components washed with a flux destroy the product, and can be remade. Always and available. Normally available. If there is an error in the content, use ink to remove the ink and reprint it. However, it cannot be reprinted. Because the laser surface forms a laser mark, in addition, the above-mentioned electrons with misprints but defects caused by misprints are almost all scrapped. The purpose of the invention is to provide a laser mark. On the surface of one of the electronic components, another purpose of remaking a laser is to provide a laser marking capable. Another purpose is to provide a column package with a marking capable of heavy or other purposes. A heat sink including the following steps is provided. . The utility model relates to a ball-foot lattice array heat sink, which has a new type of dispersion and is newly produced. First of all, the heat sink has a first laser mark on the heat sink. The material layer then fills the top surface of the first laser. Finally, the material layer has a (pseudo heat sheet material flat work). A laser is proposed to provide a surface heat sheet exposed on the package sheet to form a type of for heat slug mark, and a layer of heat sink-like heat sink material. The heat-seal sheet is marked while the heat has been dissipated), on top of the sheet
12640TWF.PTD 第8頁 1235473 五、發明說明（3) 表面上形成一第二雷射標記。 依照本發明較佳實施例所述之雷射標記的重工方法， 上述之在散熱片上形成類散熱片材料層之前例如可先對散 熱片之表面進行研磨。 依照本發明較佳實施例所述之雷射標記的重工方法’ 上述之散熱片例如包括一金屬片（metal slug)，以及包 覆金屬片之一表面鑛層（surface coating)，而類散熱 片材料層的形成方法例如包括：於散熱片上形成一類金屬 片材料層(pseudo material layer for metal slug)， 以及於類金屬片材料層上形成一類表面鍍層材料層 (pseudo material layer for surface coating ) ° 基於上述目的或其他目的，本發明提出一種散熱片， 其例如包括一散熱片本體與一類散熱片材料層。其中，散 熱片本體的一表面上已形成有一第一雷射標記。此外，類 散熱片材料層係配置於散熱片本體之表面上，其中類散熱 片材料層係填平第一雷射標記，且具有平坦的一上表面。 依照本發明較佳實施例所述之散熱片，上述之散熱片 本體例如包括一金屬片與一表面鑛層，其中表面鑛層包覆 金屬片。 依照本發明較佳實施例所述之散熱片，上述之類散熱 片材料層例如包括一類金屬片材料層與一類表面鍍層材料 層。其中，類金屬片材料層係配置於散熱片本體之表面 上，而類表面鍍層材料層係配置於類金屬片材料層上。 依照本發明較佳實施例所述之散熱片，上述之類散熱12640TWF.PTD Page 8 1235473 5. Description of the invention (3) A second laser mark is formed on the surface. According to the laser marking rework method according to the preferred embodiment of the present invention, the surface of the heat sink may be polished, for example, before the heat sink-like material layer is formed on the heat sink. According to the laser marking rework method according to the preferred embodiment of the present invention, the above-mentioned heat sink includes, for example, a metal slug, and a surface coating covering a metal sheet, and the like The forming method of the material layer includes, for example, forming a pseudo material layer for metal slug on the heat sink, and forming a pseudo material layer for surface coating on the metal-like sheet material layer. For the above or other purposes, the present invention provides a heat sink, which includes, for example, a heat sink body and a type of heat sink material layer. A first laser mark has been formed on a surface of the heat sink body. In addition, the heat sink-like material layer is disposed on the surface of the heat sink body, wherein the heat sink-like material layer fills the first laser mark and has a flat upper surface. According to the heat sink according to the preferred embodiment of the present invention, the above heat sink body includes, for example, a metal sheet and a surface mineral layer, wherein the surface mineral layer covers the metal sheet. According to the heat sink according to the preferred embodiment of the present invention, the above-mentioned heat sink material layer includes, for example, a metal sheet material layer and a surface plating material layer. Among them, the metal-like sheet material layer is disposed on the surface of the heat sink body, and the surface-like plating material layer is disposed on the metal-like sheet material layer. According to the heat sink according to the preferred embodiment of the present invention, the above-mentioned heat sink or the like
12640TWF.PTD 第9頁 1235473 五、發明說明（4) 片材料層之上表面例如具有一第二雷射標記。 * 基於上述目的或其他目的，本發明提出一種球腳格狀 陣列封裝，其例如包括一封裝基材、一晶片、多個焊球、 一散熱片本體、一類散熱片材料層與一封裝膠體 (molding compound)。其中，封裝基材具有一第一表面 以及一第二表面，而晶片係配置於封裝基材之第一表面 上。此外，這些焊球係配置於封裝基材之第二表面上，而 焊球係透過封裝基材與晶片電性連接。另外，散熱片本體 係配置於晶片上，且散熱片本體的一表面上已形成有一第 一雷射標記。再者，類散熱片材料層係配置於散熱片本體 之表面上，而類散熱片材料層係填平第一雷射標記，且類 _ 散熱片材料層具有平坦的一上表面。封裝膠體係配置於封 裝基材之第一表面上，且封裝膠體係包覆晶片與散熱片本 體，並暴露出類散熱片材料層之上表面。 依照本發明較佳實施例所述之球腳格狀陣列封裝，上 述之散熱片本體例如包括一金屬，μι與一表面鍍層，其中表 . 面鑛層係包覆金屬片。 依照本發明較佳實施例所述之球腳格狀陣列封裝，上 述之類散熱片材料層例如包括一類金屬片材料層與一類表 面鍍層材料層。其中，類金屬片材料層係配置於散熱片本 體之表面上，而類表面鍍層材料層係配置於類金屬片材料 φ 層上。 依照本發明較佳實施例所述之球腳格狀陣列封裝，上 述之類散熱片材料層之上表面例如具有一第二雷射標記。12640TWF.PTD Page 9 1235473 5. Description of the invention (4) The upper surface of the sheet material layer has, for example, a second laser mark. * Based on the above or other purposes, the present invention provides a ball-foot grid array package, which includes, for example, a packaging substrate, a wafer, a plurality of solder balls, a heat sink body, a type of heat sink material layer, and a packaging gel ( molding compound). The packaging substrate has a first surface and a second surface, and the chip is disposed on the first surface of the packaging substrate. In addition, these solder balls are disposed on the second surface of the packaging substrate, and the solder balls are electrically connected to the chip through the packaging substrate. In addition, the heat sink body is disposed on the wafer, and a first laser mark has been formed on one surface of the heat sink body. Furthermore, the heat sink-like material layer is disposed on the surface of the heat sink body, and the heat sink-like material layer fills the first laser mark, and the heat sink-like material layer has a flat upper surface. The sealant system is disposed on the first surface of the packaging substrate, and the sealant system covers the wafer and the heat sink body, and exposes the upper surface of the heat sink-like material layer. According to the ball-foot grid array package according to the preferred embodiment of the present invention, the above-mentioned heat sink body includes, for example, a metal, a μm, and a surface plating layer, wherein the surface mineral layer is coated with a metal sheet. According to the ball-foot grid array package according to the preferred embodiment of the present invention, the above-mentioned heat sink material layer includes, for example, a type of metal sheet material layer and a type of surface plating material layer. Among them, the metal-like sheet material layer is disposed on the surface of the heat sink body, and the surface-like plating material layer is disposed on the metal-like sheet material φ layer. According to the ball-foot grid array package according to the preferred embodiment of the present invention, the upper surface of the heat sink material layer or the like has a second laser mark, for example.
12640TWF.PTD 第10頁 1235473 五、發明說明（5) 在本發明較佳實施例所述之球腳格狀陣列封裝中’球 腳格狀陣列封裝例如更包括多個凸塊’其係配置於晶片與 封裝基材之間，以電性連接於晶片與封裝基材之間。 在本發明較佳實施例所述之球腳格狀陣列封裝中’球 腳格狀陣列封裝例如更包括多個焊線，其係配置於封裝基 材之第一表面上，以電性連接於晶片與封裝基材之間。 基於上述，本發明之雷射標記的重工方法，將類散熱 片材料層覆蓋於散熱片之第一雷射標記上，並在類散熱片 材料層上製作第二雷射標記，因此本發明之雷射標記的重 工方法能夠克服並解決習知因為雷射錯印所造成的瑕疵品 無法被更正而必須報廢的問題。此外，本發明之散熱片具 有一類散熱片材料層與一第一雷射標記，而類散熱片材料 層係覆蓋第一雷射標記上，因此作業人員能夠重新在類散 熱片材料層上形成一第二雷射標記，以克服並解決習知因 雷射錯印使得上述之已具有一第一雷射標記之外觀上有瑕 疵的產品，得以更正為具有正確之一第二雷射標記之外觀 上無瑕疵的產品，以使外觀上有瑕疵但功能仍然相當正常 之瑕疵品，不用被視為報廢品，以降低產生成本。另外， 本發明之球腳格狀陣列封裝具有散熱片，且散熱片具有一 類散熱片材料層與一第一雷射標記，而類散熱片材料層係 覆蓋第一雷射標記上，因此，同上所述，作業人員能夠在 散熱片之表面上重新形成一第二雷射標記，進而降低報廢 品的數量，以降低產生成本。 為讓本發明之上述和其他目的、特徵和優點能更明顯12640TWF.PTD Page 10 1235473 V. Description of the invention (5) In the ball pin grid array package described in the preferred embodiment of the present invention, the ball pin grid array package includes multiple bumps, for example. The chip and the packaging substrate are electrically connected between the chip and the packaging substrate. In the ball-foot grid array package described in the preferred embodiment of the present invention, for example, the ball-foot grid array package further includes a plurality of bonding wires, which are arranged on the first surface of the packaging substrate and are electrically connected to Between the chip and the packaging substrate. Based on the above, the laser marking rework method of the present invention covers the first heat sink material layer on the heat sink-like material layer, and makes the second heat sink material layer on the heat sink-like material layer. The laser marking rework method can overcome and solve the problem that the defective products caused by laser misprints cannot be corrected and must be scrapped. In addition, the heat sink of the present invention has a kind of heat sink material layer and a first laser mark, and the heat sink-like material layer covers the first laser mark, so the operator can form a new heat sink material layer on the heat sink-like material layer again. The second laser mark to overcome and solve the problem of the conventional laser marking, which makes the above-mentioned products with a first laser mark defective in appearance, and can be corrected to have the correct appearance of the second laser mark. Defective products, so that defective products that are defective in appearance but still function normally are not considered as scrap products to reduce costs. In addition, the ball-foot grid array package of the present invention has a heat sink, and the heat sink has a type of heat sink material layer and a first laser mark, and the heat sink-like material layer covers the first laser mark. Therefore, the same as above As mentioned above, the operator can re-form a second laser mark on the surface of the heat sink, thereby reducing the number of scrapped products and reducing the cost. To make the above and other objects, features, and advantages of the present invention more apparent
12640TWF.PTD 第11頁 1235473 五、發明說明（6) 易懂，下文特舉一較佳實施例，並配合所附圖式，作詳細 · 說明如下。 實施方式 第1 A圖至第1 D圖繪示依照本發明較佳實施例之雷射標 記的重工方法的剖面流程圖。請參照第1 A圖至第1 C圖，本 實施例之雷射標記的重工方法包括下列步驟。首先，提供 一封裝體100，而封裝體100具有外露之一散熱片110，且 散熱片110外露的一表面ll〇a上已形成有一第一雷射標記 1 2 0。然後，於散熱片1 1 0上形成一類散熱片材料層1 3 0 (如第1 B圖所示），其中類散熱片材料層1 3 0係用以填平 第一雷射標記120，且類散熱片材料層130具有平坦的一上 <1 表面130a。最後，於類散熱片材料層130之上表面130a上 形成一第二雷射標記1 4 0 (如第1 C圖所示），如此即完成 雷射標記的重工動作。此外，在散熱片11 0上形成類散熱 片材料層1 3 0之前，更可例如對於散熱片11 0之表面進行研 ‘ 磨，以便於後續所形成之類散熱片材料層1 3 0能夠完全覆 . 蓋第一雷射標記1 2 0，並降低上述製程後所形成之結構的 厚度。 請參照第1 D圖，在本發明之雷射標記重工方法中，類 散熱片材料層1 3 0的形成方法例如包括下列步驟。首先， 於散熱片130上形成一類金屬片材料層132，以及於類金屬鲁 片材料層132上形成一類表面鍍層材料層134對於上述之雷 射標記的重工方法所形成之結構，本發明提出一種散熱 片，其詳述如後。12640TWF.PTD Page 11 1235473 5. Description of the Invention (6) It is easy to understand. The following gives a detailed description of a preferred embodiment and the accompanying drawings for detailed explanations. Embodiments Figs. 1A to 1D show cross-sectional flowcharts of a method for reworking a laser mark according to a preferred embodiment of the present invention. Please refer to FIGS. 1A to 1C. The laser marking rework method of this embodiment includes the following steps. First, a package body 100 is provided, and the package body 100 has an exposed heat sink 110, and a first laser mark 1220 has been formed on an exposed surface 110a of the heat sink 110. Then, a heat sink material layer 1 3 0 is formed on the heat sink 1 10 (as shown in FIG. 1B), wherein the heat sink material layer 13 is used to fill the first laser mark 120, and The heat sink-like material layer 130 has a flat upper surface <1 surface 130a. Finally, a second laser mark 1 40 (as shown in FIG. 1C) is formed on the upper surface 130a of the heat sink-like material layer 130, so that the rework operation of the laser mark is completed. In addition, before the heat sink-like material layer 130 is formed on the heat sink 110, for example, the surface of the heat sink 110 can be ground, so that the subsequent heat sink material layer 130 can be completely formed. Cover. Cover the first laser mark 1 2 0 and reduce the thickness of the structure formed after the above process. Referring to FIG. 1D, in the laser marking rework method of the present invention, the method for forming the heat sink-like material layer 130 includes, for example, the following steps. First, a type of metal sheet material layer 132 is formed on the heat sink 130, and a type of surface plating material layer 134 is formed on the metal-like sheet material layer 132. The structure formed by the above-mentioned laser marking rework method is provided. The heat sink is described in detail later.
12640TWF.PTD 第12頁 1235473 五、發明說明（7) 請參照第2圖’其繪示依照本發明較佳實施例之散熱 片的剖面示意圖。散熱片200例如包括一散熱片本體21〇與 一類散熱片材料層230。其中，散熱片本體2 1()的一表面 210a上已形成有一第一雷射標記22〇。此外，類散熱片材 料層230係配置於散熱片本體21〇之表面210a上，其中類散 =1材料層2 3 0係用以填平第一雷射標記2 2 〇，且具有平坦 23η上表面23〇a。另外，在類散熱片材料層230之上表面 a上’可選擇性地製作一第二雷射標記2 4 〇。 覆金所述，散熱片本體21〇例如包括一金屬片212與包 如是之一表面鍍層214，其中金屬片212之材質例 質例如，其他導熱性質良好的金屬，而表面鍍層214之材 散熱片松，或其他具有抗氧化與抗腐姓之金屬。再者’類 面鍍層松料層2 3 〇例如包括一類金屬片材料層2 3 2與一類表 熱片本體2層2 34。其中，類金屬片材料層2 3 2係配置於散 置於1員金之表面21〇&上，而類表面鍍層材料層234係配 _表面鲈ΐ片材料層232上。另外，類金屬片材料層232與 料層23〇之曰材料層234之材質例如為膠體，且類散埶片材 材料層23〇 ί質與散熱片本體2 1〇之材質相近，而類散熱片 迷之散熱jy 9如具有導電性與導熱性。此外，對於具有上 狀障列封徒或適用於上述之雷射標記的重工方法之球腳格 請參其詳細說明如後。 格狀^歹，j Ϊ第3圖，其繪示依照本發明較佳實施例之球腳 包括〜封# f之剖面示意圖。球腳格狀陣列封裝3 0 0例如 、土材310、一晶片320、多個焊球33〇、一散熱12640TWF.PTD Page 12 1235473 5. Description of the invention (7) Please refer to FIG. 2 ′, which shows a schematic cross-sectional view of a heat sink according to a preferred embodiment of the present invention. The heat sink 200 includes, for example, a heat sink body 21 and a heat sink material layer 230. A first laser mark 22 has been formed on a surface 210a of the heat sink body 21 (). In addition, the heat sink-like material layer 230 is disposed on the surface 210a of the heat sink body 21o, where the scatter = 1 material layer 2 3 0 is used to fill the first laser mark 2 2 0 and has a flat surface 23η. Surface 23〇a. In addition, a second laser mark 24 can be selectively formed on the surface a of the heat sink-like material layer 230 '. As mentioned in the gold coating, the heat sink body 21 includes, for example, a metal plate 212 and a surface plating layer 214. The material of the metal plate 212 is, for example, other metals with good thermal conductivity, and the surface plated 214 is a heat sink. Pine, or other metals with anti-oxidation and anti-corrosion names. Furthermore, the 'type surface-coated loose material layer 2 3 0 includes, for example, a type of metal sheet material layer 2 3 2 and a type of surface heat sheet body 2 layer 2 34. Among them, the metal-like sheet material layer 2 3 2 is disposed on the surface of a gold member 21 0 & and the surface-like plating material layer 234 is provided on the surface bass sheet material layer 232. In addition, the material of the metal-like sheet material layer 232 and the material layer 23 is referred to as a colloid, and the material of the loose-like sheet material layer 23 is similar to the material of the heat sink body 2 10, and the heat is similar to heat. The heat dissipation jy 9 of the film fan has electrical and thermal conductivity. In addition, for ball grids with the above barriers or heavy engineering methods applicable to the above laser markings, please refer to their detailed descriptions below. Lattice ^ 歹, j Ϊ Figure 3, which illustrates a schematic cross-sectional view of a ball foot including ~ seal #f according to a preferred embodiment of the present invention. Ball-foot grid array package 3 0 0, for example, earth material 310, a wafer 320, multiple solder balls 33, a heat sink
1235473 五、發明說明（8) 片本體340、一類散熱片材料層35〇、一封裝膠體36〇與多 個凸塊370。其中，封裝基材31〇具有一第一表面31〇a以及 一第二表面310b，而晶片320係配置於封裝基材310之第一 表面3 1 0 a上。此外，這些焊球3 3 〇係配置於封裝基材3丨〇之 第二表面310b上，而凸塊370係配置於晶片320與封裝基材 3^ 0之間’以電性連接於晶片3 2 〇與封裝基材3丨〇之間，且 焊球3 3 0係透過封裝基材31 〇與凸塊37〇，而與晶片32〇電性 連接。 散熱片本體340係配置於晶片32〇上，而散熱片本體 3 4 0的一表面34〇a上已形成有一第一雷射標記342。此外， 類散熱片材料層3 5 0係配置於散熱片本體34〇之表面34〇a 上’而類散熱片材料層3 5 〇係用以填平第一雷射標記3 4 2。 其中’類散熱片材料層350具有平坦的一上表面35〇a，而 類$熱片材料層35〇之上表面35〇a例如具有一第二雷射標 另外，封裝勝體3 6 0係配置於封裝基材310之第一 廿^上^’而封裳膠體3 6〇係包覆晶片3 2 0與散熱片本體 3 4 0 ’並暴路出類散熱片材料層3 5 0之上表面3 5 0 a。 之細邱ΐ 2述’對於散熱片本體3 40與類散熱片材料層350 爯瞽^ 了如第2圖與第2圖之放大區域所示），在此不 夕κ 2 ^ i /卜’在本實施例中，在類表面鍍層材料層3 5 0 珠i冬&亦可選擇性地製作一第二雷射標記3 5 2。 焊玻i η你丨1、、、曰第3圖，封裝基材3 1 〇例如是印刷電路板，而 baU ) 1复是錫錯焊球、無錯焊球（lead free solder 5 導電焊球。此外，封裝膠體3 6 0例如是環氧1235473 V. Description of the invention (8) The sheet body 340, a type of heat sink material layer 35o, a packaging gel 36o, and a plurality of bumps 370. The packaging substrate 310 has a first surface 31a and a second surface 310b, and the chip 320 is disposed on the first surface 310 of the packaging substrate 310. In addition, the solder balls 3 3 0 are disposed on the second surface 310b of the packaging substrate 3, and the bumps 370 are disposed between the wafer 320 and the packaging substrate 3 ^ 0 to be electrically connected to the wafer 3 Between 20 and the packaging substrate 3, 0, and the solder ball 3 3 0 is electrically connected to the chip 32, through the packaging substrate 31, and the bump 37. The heat sink body 340 is disposed on the chip 32o, and a first laser mark 342 has been formed on a surface 34a of the heat sink body 340. In addition, the heat sink-like material layer 350 is disposed on the surface 34oa of the heat sink body 34o, and the heat sink-like material layer 350 is used to fill the first laser mark 3 4 2. Among them, the heat sink-like material layer 350 has a flat upper surface 350a, and the heat sink-like material layer 350a has an upper surface 35oa, for example, a second laser mark. In addition, the package body 3 6 0 It is disposed on the first substrate ^ of the packaging substrate 310, and the seal colloid 3 600 is a cladding wafer 3 2 0 and the heat sink body 3 4 0 ′ and is exposed above the heat sink-like material layer 3 5 0. Surface 3 5 0 a. The details of Qiu Qiu 2 describe 'For the heat sink body 3 40 and the heat sink-like material layer 350 (as shown in the enlarged area of Figure 2 and Figure 2), here 夕 2 ^ i / bu' In the present embodiment, a second laser mark 3 5 2 can also be selectively formed on the surface-like coating material layer 3 50 0 i &. Solder glass i η, 1, 3, and 3, the packaging substrate 3 1 〇 is, for example, a printed circuit board, and baU) 1 is a tin free solder ball, lead free solder 5 conductive solder ball In addition, the encapsulant 3 60 is, for example, epoxy
第14頁 1235473 五、發明說明（9) 樹S旨（e ρ ο X y )或其他吸濕性低且抗腐#性高的塑膠。另 外，凸塊3 7 0例如是金凸塊（g 〇 1 d b u m p )、錫錯凸塊 (solder bump)或其他導電凸塊。值得一提的是’本實 施例之球腳格狀陣列封裝3 0 0採用凸塊3 7 0，使得晶片3 2 0 與封裝基材3 1 0電性連接。換言之，晶片3 2 0與封裝基材 310是採用覆晶接合（flip chip)的方式。當然本發明並 不限定使用覆晶接合的方式，亦可使用打線接合（w i r e bonding)的方式或其他接合方式，使得晶片320與封裝基 材3 1 0電性連接，以下對於打線接合方式進行說明。 請參照第4圖，其繪示依照本發明另一較佳實施例之 球腳格狀陣列封裝之剖面示意圖。本實施例與上述實施例 相似，其不同之處在於：本實施例之球腳格狀陣列封裝 400具有多個焊線470，其配置於封裝基材310之第一表面 3 1 0 a上，以電性連接於晶片3 2 0與封裝基材3 1 0之間。 綜上所述，本發明之球腳格狀陣列封裝、散熱片及其 雷射標記的重工方法具有下列優點： 一、 本發明之雷射標記的重工方法係將類散熱片材料 層覆蓋於散熱片之第一雷射標記上，以使雷射標記能夠有 重新製作的可能性，進而降低報廢品的數量以及生產成 本0 二、 本發明之雷射標記的重工方法中，可於類散熱片 材料層上進一步製作第二雷射標記，以確實克服並解決習 知因雷射標記錯誤無法更正該錯誤的問題。 三、 本發明中，類散熱片材料層具有導電性與導熱Page 14 1235473 V. Description of the invention (9) Tree S purpose (e ρ ο X y) or other plastics with low hygroscopicity and high corrosion resistance #. In addition, the bump 370 is, for example, a gold bump (g 〇 1 d b um p), a solder bump, or other conductive bumps. It is worth mentioning that 'the ball-foot grid array package 3 0 of this embodiment uses bumps 3 7 0, so that the chip 3 2 0 is electrically connected to the packaging substrate 3 1 0. In other words, the chip 3 2 0 and the packaging substrate 310 are flip-chip bonded. Of course, the present invention is not limited to a flip-chip bonding method, and a wire bonding method or other bonding methods may also be used, so that the chip 320 is electrically connected to the packaging substrate 3 10. The wire bonding method is described below. . Please refer to FIG. 4, which is a schematic cross-sectional view of a ball-foot grid array package according to another preferred embodiment of the present invention. This embodiment is similar to the above embodiment, except that the ball-foot grid array package 400 of this embodiment has a plurality of bonding wires 470 that are disposed on the first surface 3 1 0 a of the packaging substrate 310. It is electrically connected between the chip 3 2 0 and the packaging substrate 3 1 0. To sum up, the rework method of the ball-foot grid array package, the heat sink and the laser mark of the present invention has the following advantages: 1. The rework method of the laser mark of the present invention is to cover the heat sink-like material layer with heat radiation The first laser mark of the film can make the laser mark have the possibility of remaking, thereby reducing the number of scrap products and the production cost. 2. In the method of rework of the laser mark of the present invention, it can be used as a heat sink. A second laser mark is further made on the material layer to truly overcome and solve the problem that the conventional laser mark cannot be corrected due to the wrong laser mark. 3. In the present invention, the heat sink-like material layer has electrical conductivity and thermal conductivity
12640TWF.PTD 第15頁 1235473 五、發明說明（ίο) 性，與散熱片之材料性質相近，且類散熱片材料層在製作 上容易，故成本負擔並不大。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。12640TWF.PTD Page 15 1235473 5. Description of the invention (ίο), similar to the material properties of the heat sink, and the heat sink-like material layer is easy to manufacture, so the cost burden is not large. Although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be determined by the scope of the attached patent application.
12640TWF.PTD 第16頁 1235473 圖式簡單說明 第1 A圖至第1 D圖繪示依照本發明較佳實施例之雷射標 記的重工方法的剖面流程圖。 第2圖繪示依照本發明較佳實施例之散熱片的剖面示 意圖。 第3圖繪示依照本發明較佳實施例之球腳格狀陣列封 裝之剖面示意圖。 第4圖繪示依照本發明另一較佳實施例之球腳格狀陣 列封裝之剖面示意圖。 【圖式標示說明】 1 0 0 :封裝體 1 1 0 :散熱片 110a 、210a 、340a ：表面 120、220 :第一雷射標記 1 3 0、2 3 0 :類散熱片材料層 130a 、 230a 、 350a :上表面 1 32、2 3 2 :類金屬片材料層 134、234 :表面鍍層材料層 140、240、352 :第二雷射標記 2 0 0 :散熱片 21 0、3 4 0 :散熱片本體 2 1 2 :金屬片 2 1 4 :表面鍍層 3 0 0、4 0 0 :球腳格狀陣列封裝 3 1 0 :封裝基材12640TWF.PTD Page 16 1235473 Brief Description of Drawings Figures 1A to 1D show cross-sectional flowcharts of the rework method for laser marking according to the preferred embodiment of the present invention. Fig. 2 is a schematic sectional view of a heat sink according to a preferred embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of a ball-foot grid array package according to a preferred embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of a ball-foot grid array package according to another preferred embodiment of the present invention. [Schematic description] 1 0 0: package body 1 1 0: heat sinks 110a, 210a, 340a: surface 120, 220: first laser mark 1 3 0, 2 3 0: heat sink-like material layers 130a, 230a , 350a: upper surface 1 32, 2 3 2: metal sheet-like material layers 134, 234: surface plating material layers 140, 240, 352: second laser mark 2 0 0: heat sink 21 0, 3 4 0: heat dissipation Sheet body 2 1 2: Metal sheet 2 1 4: Surface plating 3 0, 4 0 0: Ball-shaped grid array package 3 1 0: Packaging substrate
12640TWF.PTD 第17頁 1235473 圖式簡單說明 3 1 Oa :第一表面 31 Ob :第二表面 320 :晶片 3 3 0 :焊球 3 6 0 :封裝膠體 3 7 0 :凸塊 4 7 0 :焊線 画圓1_12640TWF.PTD Page 17 1235473 Brief description of the drawing 3 1 Oa: first surface 31 Ob: second surface 320: wafer 3 3 0: solder ball 3 6 0: encapsulant 3 7 0: bump 4 7 0: solder Line Drawing Circle 1_
12640TWF.PTD 第18頁12640TWF.PTD Page 18
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| TW093111199A TWI235473B (en) | 2004-04-22 | 2004-04-22 | Ball grid array package structure, heat slug structure, and laser mark rework method |
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| TW093111199A TWI235473B (en) | 2004-04-22 | 2004-04-22 | Ball grid array package structure, heat slug structure, and laser mark rework method |
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| EP3834227B1 (en) * | 2018-10-30 | 2024-09-04 | Yangtze Memory Technologies Co., Ltd. | Ic package |
| KR102554692B1 (en) | 2019-02-18 | 2023-07-12 | 양쯔 메모리 테크놀로지스 씨오., 엘티디. | Integrated structure and formation method |
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