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TWI234257B - Heat sink structure and chip package structure thereof - Google Patents

Heat sink structure and chip package structure thereof Download PDF

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Publication number
TWI234257B
TWI234257B TW092117783A TW92117783A TWI234257B TW I234257 B TWI234257 B TW I234257B TW 092117783 A TW092117783 A TW 092117783A TW 92117783 A TW92117783 A TW 92117783A TW I234257 B TWI234257 B TW I234257B
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TW
Taiwan
Prior art keywords
heat dissipation
patent application
arched elastic
item
scope
Prior art date
Application number
TW092117783A
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Chinese (zh)
Other versions
TW200501366A (en
Inventor
Meng-Jen Wang
Original Assignee
Advanced Semiconductor Eng
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Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW092117783A priority Critical patent/TWI234257B/en
Priority to US10/710,269 priority patent/US20040261979A1/en
Publication of TW200501366A publication Critical patent/TW200501366A/en
Application granted granted Critical
Publication of TWI234257B publication Critical patent/TWI234257B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink structure for a chip package unit is provided. The heat sink is composed of a heat spreader and at least one arcuate spring. The spreader has a top surface and a base surface covered over the chip package unit and the arcuate spring is located between the base surface of the spreader and the chip package unit. Therefore, the arcuate spring can touch the back of a chip on the chip package unit.

Description

Ϊ234257Ϊ234257

之技術 且特別是有關於一種 ^發明是有關於一種散熱結構 泮片接觸式散熱結構。 I 各，，^ 年來， 部線路 散熱效 理器、 移除此 能，使 知技術 表面， 扇（f an 電子元 氣環境 片之内 糸統的 中央處 夠迅速 生的熱 作，習 元件之 散熱風 地吸收 界的大 ^ 著積體電路（Integrated Ciauit，1(：)曰 处2集度（integration)不斷地攀升，曰曰 :也相對要求提高。一般而言，個人$ ”之 北橋晶片及繪圖晶片等電子元件中， ，電子元件之I C晶片於高速運作時，其^ 得I c晶片於高速運作時仍能長期維持^ 乃是利用散熱器（Heat Sink)直接接觸電子 以提供較大的散熱面積，並配合系統内部之 )所提供的冷卻氣流，使得散熱器能夠迅速 件所產生的熱能，並快速地將熱能散逸至外 =1圖繪不習知一種晶片封裝結構之散熱結構的示意 =。明參考第1圖，晶片封裝結構1 〇〇例如為一 1列（BGA)式晶片封裝結構，其中晶片1〇2係以覆^上格 ip-chlp bonding)的方式配置於封裝基板1〇4之頂面 上，並且晶片1 〇 2係與封裝基板丨〇 4電性連接。此外，散熱 板1 1 0配置於晶片封裝結構丨〇 〇之上，且散熱板丨丨〇之底面 1 2對應接觸晶片1 〇 2之背面，用以迅速地吸收晶片J 〇 2所 產生之熱此’且政熱板110之頂面114例如垂直配置多個散 熱縛片（fin)140。另外，導熱膠（thermal paste)12〇黏著The technology is particularly related to a heat sink structure. A fin contact heat sink structure. I have, for ^ years, removed the line cooling effector, removed this function, so that the technical surface, fan (fan an electronic energy environment film in the center of the internal system of the system can generate heat quickly, learn the heat dissipation of components The integration of integrated circuits (Integrated Ciauit, 1 (:), and 2 integrations in the wind and ground absorption world continues to rise, saying: they are relatively more demanding. In general, the personal $ ”Northbridge chip and Among electronic components such as graphics chips, when IC chips of electronic components are operated at high speed, they can obtain long-term maintenance when IC chips are operated at high speed. ^ The heat sink is used to directly contact the electrons to provide a larger The heat dissipation area, combined with the cooling airflow provided by the system, enables the heat sink to quickly generate the heat energy generated and quickly dissipate the heat energy to the outside. Figure 1 illustrates the heat dissipation structure of a chip packaging structure. =. Refer to FIG. 1 for details. The chip package structure 100 is, for example, a 1-row (BGA) type chip package structure, in which the chip 102 is arranged on the package substrate 1 in a manner of overlaying ip-chlp bonding. 〇4 on the top surface, and the chip 102 is electrically connected to the package substrate 丨 〇4. In addition, the heat dissipation plate 1 10 is arranged above the chip packaging structure 丨 〇〇, and the bottom surface 1 of the heat dissipation plate 丨 丨2 corresponds to the back surface of the contact wafer 1 〇2 to quickly absorb the heat generated by the wafer J 〇2, and the top surface 114 of the political heat plate 110 is, for example, a plurality of fins 140 arranged vertically. In addition, heat conduction 12 (thermal paste) adhesion

1234257 __案號92117783_年月曰 修正_ 五、發明說明（2) 於散熱板1 1 〇之底面1 1 2與晶片1 0 2之背面之間，其中導熱 膠1 2 0例如為熱固性之矽膠材料、因此必須經過嚴密的控 制程序來加熱、固化導熱膠1 2 0，並維持在特定的溫度控 制下，以確保導熱膠1 2 0之接合性良好。然而，導熱膠1 2 0 仍會降低熱傳導之效率，尤其當導熱膠120的厚度愈厚 時，其熱傳導的效率相對愈差。 另一方面，導熱膠1 2 0之成本高、且必須經過加熱、 固化等繁瑣之過程，因而使得組裝的過程無法簡化、方 便。此外，一旦導熱膠1 2 0黏著固化後，就無法再將散熱 板1 1 0與晶片封裝結構1 0 0分開，對於組裝之重工性 (rework)均會造成不方便。 發明内容 因此，本發明的目的就是在提供一種散熱結構，其中 散熱板透過彈片接觸的方式，緊密組裝於晶片封裝結構之 上，以簡化組裝的過程，且彈片之熱傳導性高，不會降低 熱傳導的效率。 為達本發明之上述目的，本發明提出一種散熱結構， 適用於一晶片封裝結構上，此散熱結構主要係由一散熱板 以及至少一拱形彈片所構成。散熱板具有一頂面以及對應 之一底面，散熱板之底面係覆蓋於晶片封裝結構之上。此 外，拱形彈片配置於散熱板之底面，而拱形彈片之端部對 應連接於底面之兩側，且拱形彈片之中間區域相對遠離底 面，且適於接觸晶片封裝結構之晶片背面。 依照本發明的較佳實施例所述，上述之散熱板之材質1234257 __Case No. 92117783_ Revised Year of the Month _ V. Description of the invention (2) Between the bottom surface 1 1 2 of the heat sink 1 1 0 and the back surface of the wafer 102, where the thermally conductive adhesive 1 2 0 is, for example, thermosetting Silicone materials, therefore, must undergo a strict control process to heat and cure the thermally conductive adhesive 120, and maintain it under a specific temperature control to ensure that the thermally conductive adhesive 120 has good bonding. However, the thermal conductive adhesive 120 will still reduce the efficiency of thermal conduction, especially when the thickness of the thermal conductive adhesive 120 is thicker, the thermal conduction efficiency is relatively worse. On the other hand, the thermal conductive adhesive 120 has a high cost and must be subjected to tedious processes such as heating and curing, so that the assembly process cannot be simplified and convenient. In addition, once the thermally conductive adhesive 120 is adhered and cured, the heat dissipation plate 110 cannot be separated from the chip packaging structure 100, which will cause inconvenience to the rework of the assembly. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a heat dissipation structure in which a heat dissipation plate is tightly assembled on a chip packaging structure through a contact manner of an elastic sheet, so as to simplify the assembly process, and the thermal conductivity of the elastic sheet is high, and the thermal conductivity is not reduced. s efficiency. In order to achieve the above object of the present invention, the present invention provides a heat dissipation structure suitable for a chip package structure. The heat dissipation structure is mainly composed of a heat dissipation plate and at least one arched elastic piece. The heat dissipation plate has a top surface and a corresponding bottom surface. The bottom surface of the heat dissipation plate covers the chip packaging structure. In addition, the arched elastic sheet is disposed on the bottom surface of the heat sink, and the ends of the arched elastic sheet are correspondingly connected to both sides of the bottom surface, and the middle area of the arched elastic sheet is relatively far away from the bottom surface, and is suitable for contacting the back surface of the chip of the chip packaging structure. According to the preferred embodiment of the present invention, the material of the above heat sink is

11180twfl.ptc 第7頁 1234257 __案號92117783_年月日 修正_ 五、發明說明（3) 例如選自鋁、銅及該等之合金，而拱形彈片之兩端例如銲 接於散熱板之底面上’或以干涉欲合方式、鉚接方式或鎖 固的方式將拱形彈片之端部固定於散熱板之底面上。 本發明因採用彈片接觸式散熱結構，因此在組裝上不 需經過加熱、固化等過程，因而簡化組裝之過程並提高生 產效能。此外，拱形彈片與晶片封裝結構的接觸良好，且 其熱傳導的效率高，因此相對提高熱傳導之效率。 為讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下： 實施方式 請參考第2圖，其繪示本發明一較佳實施例之一種晶 片封裝結構之散熱結構的示意圖。散熱結構2 1 0主要係由 熱傳導性佳之金屬材質（例如純銅、銅合金或鋁合金等）所 製成，至少包括一散熱板220以及一拱形彈片230。其中， 本實施例藉由拱形彈片2 3 0用以取代習知之導熱膠，而拱 形彈片2 3 0不需經過加熱、固化等過程，因而簡化組裝之 過程並提高生產效能。此外，晶片封裝結構2 0 0例如為一 典型之球格陣列（BGA )式晶片封裝結構，其中晶片2 0 2係以 覆晶接合的方式配置於封裝基板2 04之頂面（即第一面） 上，並且晶片2 0 2例如藉由凸塊（未繪示）與封裝基板2 0 4電 性連接。當然，本發明之散熱結構亦可適用於其他類型之 覆晶封裝結構中。 如第2圖所示，在組裝方面，散熱板220之底面222例11180twfl.ptc Page 7 1234257 __Case No. 92117783_ Year, month, and day of amendment_ 5. Description of the invention (3) For example, selected from aluminum, copper, and alloys thereof, and the two ends of the arched dome are welded to the heat sink The bottom surface 'or the end of the arched elastic piece is fixed on the bottom surface of the heat sink in an interference fit manner, a riveting manner or a locking manner. Because the invention adopts a spring contact heat dissipation structure, it does not need to go through processes such as heating and curing during assembly, thereby simplifying the assembly process and improving production efficiency. In addition, the arched elastic sheet has good contact with the chip package structure, and its heat conduction efficiency is high, so the heat conduction efficiency is relatively improved. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below in conjunction with the accompanying drawings for detailed description as follows: For an implementation, please refer to FIG. 2, which A schematic diagram of a heat dissipation structure of a chip packaging structure according to a preferred embodiment of the present invention is shown. The heat dissipation structure 210 is mainly made of a metal material with good thermal conductivity (for example, pure copper, copper alloy, or aluminum alloy), and includes at least a heat dissipation plate 220 and an arched elastic piece 230. Among them, in this embodiment, the arched elastic sheet 230 is used to replace the conventional thermally conductive adhesive, and the arched elastic sheet 230 does not need to undergo processes such as heating and curing, thereby simplifying the assembly process and improving production efficiency. In addition, the chip package structure 200 is, for example, a typical ball grid array (BGA) type chip package structure, in which the chip 202 is arranged on the top surface (ie, the first surface) of the package substrate 20 in a flip-chip bonding manner. ), And the chip 202 is electrically connected to the package substrate 204 by a bump (not shown), for example. Of course, the heat dissipation structure of the present invention can also be applied to other types of flip-chip packaging structures. As shown in Figure 2, in terms of assembly, 222 cases of the bottom surface of the heat sink 220

11180twfl.ptc 第8頁 Q2117783 1234257 _案號一 五、發明說明（4) 如具有一組十鉤224、226，固定於底面222之側緣，且卡 鉤2 2 4、2 2 6甸下，伸並扣合於晶片封裝結構2 〇 〇之封裝基 板2 0 4的底面（即第二面）上。此外，拱形彈片2 3 〇配置於散 熱板2 2 0之底面2 2 2 ’而拱形彈片2 30例如與散熱板22〇 一體 成型。在較隹情況下，可先將一金屬彈片之兩端彎曲成拱 形彈片2 3 0的形狀之後，再以銲接（we iding)的方式固定於 散熱板220之底面2 2 2，或是以干涉嵌合的方式，在散熱板 2 2 0的邊緣配置卡合溝槽（未繪示），使拱形彈片2 3 〇之兩端 2 3 4扣合或卡合於散熱板2 2 0之底面2 2 2上，或是以鉚·接或 螺鎖的方式使供形彈片2 3 0之兩端234鎖固於散埶板22〇之 底面2 2 2上。如此，拱形彈片2 3 0之端部2 34可固定連接於 散$板2 2 0之底面2 2 2上，且拱形彈片23〇之中間區域2 3 2相 對^離散熱板2 2 0之底面2 2 2，但相對靠近並接觸晶片2〇2 之背面，用以迅速地吸收晶片2 0 2所產生之埶能。因此， 當拱形彈片2 3 0之中間區域2 3 2接觸到晶片2〇2之背面時， 在容許之彈性變形範圍内，將使拱形彈片2 3 〇之表面與晶 片2 0 2之背面緊密接觸，並形成良好的接觸狀態，以使晶 片2 0 2所產生之熱能，能快速地經由拱形彈片2 3 〇傳導至散 熱板2 2 0，再由散熱板2 2 〇之表面散逸到外界空氣中。此 外，為了增加散熱板之散熱面積，散熱板22〇之頂面還可 設計成波浪狀，或垂直配置多個散熱鰭片（f in)24〇。 請參考第3圖，其繪示本發明另一較佳實施例之一種 散熱結構的俯視示意圖。拱形彈片3 3 〇排成一「十」字狀 之結構，其中間之交叉區域3 3 2相對遠離散熱板32〇之底面11180twfl.ptc Page 8 Q2117783 1234257 _Case No.15. Description of the invention (4) If there is a set of ten hooks 224, 226, fixed to the side edge of the bottom surface 222, and the hook 2 2 4, 2, 2 6 6 Extend and buckle on the bottom surface (ie, the second surface) of the package substrate 2004 of the chip package structure 2000. In addition, the arched elastic pieces 2 30 are arranged on the bottom surface 2 2 2 ′ of the heat radiating plate 2 2 0, and the arched elastic pieces 2 30 are integrally formed with the heat sink 22 2, for example. In a relatively difficult situation, the two ends of a metal dome can be bent into the shape of a dome dome 230 before being fixed to the bottom surface 2 2 2 of the heat sink 220 by welding, or In the interference fitting method, an engaging groove (not shown) is arranged on the edge of the heat sink 2 2 0, so that both ends 2 3 4 of the arched elastic sheet 2 3 0 are fastened or engaged with the heat sink 2 2 0 On the bottom surface 2 2 2, the two ends 234 of the supply elastic sheet 2 3 0 are fastened to the bottom surface 2 2 2 of the loose plate 22 by means of riveting, joining or screwing. In this way, the end portion 2 34 of the arched elastic sheet 2 3 0 can be fixedly connected to the bottom surface 2 2 2 of the loose sheet 2 2 0, and the middle area 2 3 2 of the arched elastic sheet 23 2 is opposite to the discrete thermal plate 2 2 0 The bottom surface 2 2 2 is relatively close to and in contact with the back surface of the wafer 202 to quickly absorb the energy generated by the wafer 202. Therefore, when the middle region 2 3 2 of the arched spring 2 3 0 contacts the back of the wafer 2 0 2, the surface of the arched spring 2 3 0 and the back of the wafer 2 2 will be made within the allowable elastic deformation range. Make close contact and form a good contact state, so that the thermal energy generated by the wafer 202 can be quickly conducted to the heat sink 2 2 0 through the arched elastic sheet 2 3 0, and then dissipated from the surface of the heat sink 2 2 0 Outside air. In addition, in order to increase the heat dissipation area of the heat dissipation plate, the top surface of the heat dissipation plate 22 can also be designed to be wavy, or a plurality of heat dissipation fins (in) can be vertically arranged. Please refer to FIG. 3, which illustrates a schematic top view of a heat dissipation structure according to another preferred embodiment of the present invention. The arched elastic pieces 3 3 0 are arranged in a "ten" shape, and the intersecting area 3 3 2 is relatively far away from the bottom surface of the heat sink 32 0

11180twfl.ptc 第9頁 1234257 _案號92117783_年月日 修正_ 五、發明說明（5) 3 2 2，且對應接觸晶片封裝結構（未繪示）之晶片表面，而 拱形彈片330之四個端部334分別固定連接於底面322之四 個側邊區域上（或四個角落區域上），其連接的方式同上所 述。同樣，當拱形彈片3 3 0之中間區域3 3 2接觸到晶片之背 面時，在容許之彈性變形範圍内，將使拱形彈片2 3 0之表 面與晶片之背面緊密接觸，並形成良好的接觸狀態，以使 晶片所產生之熱能，能更快速地經由拱形彈片3 3 0傳導至 散熱板3 2 0，再由散熱板3 2 0之表面散逸到外界空氣中。當 然，拱形彈片2 3 0之端部亦可設計成3個、5個或6個含以 上，並且呈放射狀分佈且固定連接於底板之周圍表面，以 增加拱形彈片與散熱板之接觸面積，並增加熱傳導之效 能。 由上述說明可知，散熱結構係以至少一拱形彈片對應 接觸晶片封裝結構的表面，而散熱板不需再藉由導熱膠之 黏著，即可輕易地組裝於晶片封裝結構之上，因而簡化組 裝之過程並提高生產之效能。此外，拱形彈片之材質例如 為金屬，其熱傳導性優於習知之導熱膠，尤其在高壓以及 高溼度的伺服器之工作環境下，習知之導熱膠的導熱效果 將下降，而拱形彈片卻仍能保持良好的導熱效果。另外， 習知導熱膠會隨著使用時間而逐漸老化，而拱形彈片相對 於導熱膠不易產生質變，且具有較長的使用壽命，並且散 熱結構與晶片封裝結構還可重新分開，有利於組裝上之重 工性。 綜上所述，本發明之散熱結構具有下列優點：11180twfl.ptc Page 9 1234257 _Case No. 92117783_ Year, Month and Day Amendment _ V. Description of the invention (5) 3 2 2 and corresponding to the surface of the wafer that contacts the chip package structure (not shown), and the arched spring piece 330-4 The end portions 334 are respectively fixedly connected to the four side regions (or the four corner regions) of the bottom surface 322, and the connection methods are the same as described above. Similarly, when the middle region 3 3 2 of the arched elastic sheet 3 3 0 contacts the back surface of the wafer, the surface of the arched elastic sheet 2 3 0 will be in close contact with the back surface of the wafer within the allowable elastic deformation range and form a good shape. Contact state, so that the thermal energy generated by the wafer can be more quickly conducted to the heat sink 3 2 0 through the arched elastic sheet 3 3 0, and then dissipated into the outside air from the surface of the heat sink 3 2 0. Of course, the ends of the arch springs 230 can also be designed as three, five, or six or more, and are radially distributed and fixedly connected to the surrounding surface of the base plate to increase the contact between the arch springs and the heat sink. Area and increase the effectiveness of heat transfer. From the above description, it can be known that the heat dissipation structure contacts the surface of the chip packaging structure with at least one arched elastic sheet, and the heat dissipation plate can be easily assembled on the chip packaging structure without the need of adhesion by a thermally conductive adhesive, thereby simplifying the assembly. Process and improve production efficiency. In addition, the material of the arched elastic sheet is, for example, metal, and its thermal conductivity is better than that of the conventional thermal conductive adhesive. Especially in the working environment of a high pressure and high humidity server, the thermal conductivity of the conventional thermal conductive adhesive will decrease, but the arched elastic sheet will Can still maintain good thermal conductivity. In addition, it is known that the thermal conductive adhesive will gradually deteriorate with the use of time, and the arched elastic sheet is not easy to undergo qualitative change with respect to the thermal conductive adhesive, and has a long service life, and the heat dissipation structure and the chip packaging structure can be separated again, which is advantageous for assembly. The heavy industry. In summary, the heat dissipation structure of the present invention has the following advantages:

11180twfl.ptc 第10頁 1234257 _案號92117783_年月日 修正_ 五、發明說明（6) (1)在組裝上，不需利用黏著導熱膠的方式固定散熱 板，因此不需經過加熱、固化等繁瑣之過程，因而使得組 裝的過程簡化、方便。 (2 )利用拱形彈片接觸的方式，可將散熱板緊密組裝 於晶片封裝結構之上，且拱形彈片之熱傳導性良好，故可 提高熱傳導的效率。 (3 )散熱結構與晶片封裝結構藉由卡固結構（例如卡 鉤）相扣合，且兩者還可重新分開，有利於組裝上之重工 性。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作些許之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。11180twfl.ptc Page 10 1234257 _Case No. 92117783_ Year, Month and Day Amendment _ V. Description of the Invention (6) (1) In assembly, it is not necessary to fix the heat sink with a thermally conductive adhesive, so it does not need to be heated and cured. And other tedious processes, so that the assembly process is simplified and convenient. (2) The arched spring contact can be used to tightly assemble the heat sink on the chip packaging structure, and the arched spring has good thermal conductivity, so the efficiency of thermal conduction can be improved. (3) The heat dissipating structure and the chip packaging structure are fastened by a fastening structure (such as a hook), and the two can be separated again, which is beneficial to the reworkability in assembly. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some changes and retouch without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application.

11180twfl.ptc 第11頁 1234257 __案號92117783_年月日 修正_ 圖式簡單說明 第1圖繪示習知一種晶片封裝結構之散熱結構的示意 圖。 第2圖繪示本發明一較佳實施例之一種晶片封裝結構 之散熱結構的示意圖。 第3圖繪示本發明另一較佳實施例之一種散熱結構的 俯視示意圖。 【圖式標示說明】 1 0 0、2 0 0 :晶片封裝結構 1 0 2 、2 0 2 :晶片 1 0 4、2 0 4 :封裝基板 1 1 0、2 2 0、3 2 0 :散熱板 112 、 222 、 322 :底面 1 1 4、2 2 4 :頂面 120 :導熱膠 1 4 0、2 4 0 :散熱鰭片 2 1 0 :散熱結構 226 、228 :卡鉤 2 3 0、3 3 0 :拱形彈片 2 3 2 、3 3 2 ·•中間區域 234、334 :端部11180twfl.ptc Page 11 1234257 __Case No. 92117783_ Modification _ Brief Description of Drawings Figure 1 shows a schematic diagram of the heat dissipation structure of a conventional chip packaging structure. FIG. 2 is a schematic diagram illustrating a heat dissipation structure of a chip packaging structure according to a preferred embodiment of the present invention. FIG. 3 is a schematic top view of a heat dissipation structure according to another preferred embodiment of the present invention. [Illustration of Graphical Symbols] 1 0 0, 2 0 0: Chip package structure 1 2 2 2 0 2: Chip 1 0 4, 2 0 4: Package substrate 1 1 0, 2 2 0, 3 2 0: Heat sink 112, 222, 322: bottom surface 1 1 4, 2 2 4: top surface 120: thermal conductive adhesive 1 4 0, 2 4 0: heat dissipation fin 2 1 0: heat dissipation structure 226, 228: hook 2 3 0, 3 3 0: Arched shrapnel 2 3 2, 3 3 2Middle area 234, 334: End

11180twf1.ptc 第12頁11180twf1.ptc Page 12

Claims (1)

1234257 __案號92117783_年月日 修正_ 六、申請專利範圍 1 . 一種散熱結構，適用於一晶片封裝結構，至少包 括： 一散熱板，具有一頂面以及一底面，該底面適於覆蓋 在該晶片封裝結構之上；以及 至少一拱形彈片，配置於該底面上，該拱形彈片之端 部對應連接該底面，且該拱形彈片之中間區域相對遠離該 底面，並對應接觸該晶片封裝結構之表面。 2 ·如申請專利範圍第1項所述之散熱結構，更包括複 數個卡鉤，其一端固定於該底面之周緣上，而另一端延伸 至該晶片封裝結構，並扣合該晶片封裝結構。 3 .如申請專利範圍第1項所述之散熱結構，其中該散 熱板之材質係包括鋁合金、純銅以及銅合金其中之一。 4 ·如申請專利範圍第1項所述之散熱結構，其中該拱 形彈片係與該散熱板一體成型。 5.如申請專利範圍第1項所述之散熱結構，其中該拱 形彈片之端部係銲接於該底面上。 6 ·如申請專利範圍第1項所述之散熱結構，其中該拱 形彈片之端部係鉚接於該底面上。 7 ·如申請專利範圍第1項所述之散熱結構，其中該拱 形彈片之端部係鎖固於該底面上。 8.如申請專利範圍第1項所述之散熱結構，其中該散 熱板周緣具、有複數個卡合溝槽，適於使該拱形彈片之端部 嵌入該些卡合溝槽。 9 · 一種散熱結構，適用於一晶片封裝結構，至少包1234257 __Case No. 92117783_ Year, Month and Day Amendment_ 6. Application Patent Scope 1. A heat dissipation structure suitable for a chip package structure, including at least: a heat sink having a top surface and a bottom surface, the bottom surface is suitable for covering Above the chip package structure; and at least one arched elastic sheet is disposed on the bottom surface, an end of the arched elastic sheet is correspondingly connected to the bottom surface, and a middle region of the arched elastic sheet is relatively far away from the bottom surface and contacts the corresponding surface Surface of the chip package structure. 2 · The heat dissipation structure described in item 1 of the scope of patent application, further comprising a plurality of hooks, one end of which is fixed to the peripheral edge of the bottom surface, and the other end extends to the chip packaging structure and is buckled to the chip packaging structure. 3. The heat dissipation structure according to item 1 of the scope of patent application, wherein the material of the heat dissipation plate includes one of aluminum alloy, pure copper, and copper alloy. 4. The heat dissipation structure according to item 1 of the scope of patent application, wherein the arched elastic sheet is integrally formed with the heat dissipation plate. 5. The heat dissipation structure according to item 1 of the scope of patent application, wherein the end of the arched elastic piece is welded to the bottom surface. 6. The heat dissipation structure according to item 1 of the scope of patent application, wherein the end of the arched elastic piece is riveted to the bottom surface. 7. The heat dissipation structure according to item 1 of the scope of patent application, wherein the end of the arched elastic piece is locked on the bottom surface. 8. The heat dissipation structure according to item 1 of the scope of patent application, wherein the periphery of the heat dissipation plate is provided with a plurality of engaging grooves, and is suitable for embedding the ends of the arched elastic pieces into the engaging grooves. 9 · A heat dissipation structure suitable for a chip package structure, at least 11180twfl.ptc 第13頁 1234257 _案號92117783_年月日 修正_ 六、申請專利範圍 括： 一散熱板，具有一頂面以及一底面，該底面適於覆蓋 在該晶片封裝結構之上； 複數個散熱鰭片，配置於該頂面上；以及 至少一拱形彈片，配置於該底面上，該拱形彈片之端 部對應連接該底面，且該些拱形彈片之中間區域相對遠離 該底面，並對應接觸該晶片封裝結構之表面。 1 0 .如申請專利範圍第9項所述之散熱結構，更包括複 數個卡鉤，其一端固定於該底面之周緣上，而另一端延伸 至該晶片封裝結構，並扣合該晶片封裝結構。 1 1 .如申請專利範圍第9項所述之散熱結構，其中該散 熱板周緣具有複數個卡合溝槽，適於使該拱形彈片之端部 欲入該些卡合溝槽。 1 2. —種晶片封裝結構，至少包括： 一封裝基板，具有一第一面以及一第二面； 一晶片，配置於該基板之該第一面上並與該基板電性 連接；以及 一散熱結構，覆蓋於該晶片上，具有一散熱板以及至 少一拱形彈片，該散熱板具有一頂面以及一底面，而該拱 形彈片配置於該底面上，且該拱形彈片之端部對應連接該 底面之周緣，並且該拱形彈片之中間區域相對遠離該底 面，並對應接觸該晶片之表面，該散熱板還具有複數個卡 鉤，其一端固定於該底面之周緣上，而另一端延伸至該基 板之該第二面，並扣合於該第二面之表面上。11180twfl.ptc Page 13 1234257 _Case No. 92117783_ Year, Month, and Day Amendment_ 6. The scope of patent application includes: a heat sink with a top surface and a bottom surface, the bottom surface is suitable to cover the chip package structure; a plurality of Heat-dissipating fins are disposed on the top surface; and at least one arched elastic sheet is disposed on the bottom surface, an end portion of the arched elastic sheet is correspondingly connected to the bottom surface, and a middle region of the arched elastic sheets is relatively far from the bottom surface. And correspondingly contact the surface of the chip packaging structure. 10. The heat dissipation structure described in item 9 of the scope of patent application, further comprising a plurality of hooks, one end of which is fixed on the peripheral edge of the bottom surface, and the other end extends to the chip packaging structure and is buckled to the chip packaging structure. . 1 1. The heat dissipation structure according to item 9 of the scope of the patent application, wherein the periphery of the heat dissipation plate has a plurality of engaging grooves, which are adapted to make the ends of the arched elastic pieces enter the engaging grooves. 1 2. A chip packaging structure including at least: a package substrate having a first surface and a second surface; a chip disposed on the first surface of the substrate and electrically connected to the substrate; and The heat dissipation structure covers the chip and has a heat dissipation plate and at least one arched elastic piece, the heat dissipation plate has a top surface and a bottom surface, and the arched elastic piece is arranged on the bottom surface, and an end portion of the arched elastic piece Corresponding to the peripheral edge of the bottom surface, and the middle area of the arched elastic piece is relatively far away from the bottom surface and correspondingly contacts the surface of the chip, the heat sink also has a plurality of hooks, one end of which is fixed on the peripheral edge of the bottom surface, and the other One end extends to the second surface of the substrate and is fastened on the surface of the second surface. 11180twfl.ptc 第14頁 1234257 __案號 92117783_年月日__ 六、申請專利範圍 1 3 .如申請專利範圍第1 2項所述之晶片封裝結構，其 中該晶片係以覆晶方式與該封裝基板電性連接，且該拱形 彈片係與該晶片之背面接觸。 1 4 .如申請專利範圍第1 2項所述之晶片封裝結構，其 中該散熱板之材質係包括鋁合金、純銅以及銅合金其中之 ——* 〇 1 5.如申請專利範圍第1 2項所述之晶片封裝結構，其 中該拱形彈片係與該散熱板一體成型。 1 6.如申請專利範圍第1 2項所述之晶片封裝結構，其 中該拱形彈片之端部係銲接於該底面上。 1 7.如申請專利範圍第1 2項所述之晶片封裝結構，其 中該拱形彈片之端部係鉚接於該底面上。 1 8.如申請專利範圍第1 2項所述之晶片封裝結構，其 中該拱形彈片之端部係鎖固於該底面上。 1 9.如申請專利範圍第1 2項所述之晶片封裝結構，其 中該散熱板周緣具有複數個卡合溝槽，適於使該拱形彈片 之端部嵌入該些卡合溝槽。11180twfl.ptc Page 14 1234257 _Case No. 92117783_ Year Month Date__ VI. Patent Application Range 1 3. The chip package structure described in item 12 of the patent application range, where the wafer is flip-chip The package substrate is electrically connected, and the arched elastic sheet is in contact with the back surface of the chip. 14. The chip package structure as described in item 12 of the scope of patent application, wherein the material of the heat dissipation plate includes one of aluminum alloy, pure copper and copper alloy-* 〇1 5. As item 12 of the scope of patent application In the chip packaging structure, the arched elastic sheet is integrally formed with the heat sink. 16. The chip package structure according to item 12 of the scope of the patent application, wherein the ends of the arched dome are soldered to the bottom surface. 1 7. The chip packaging structure according to item 12 of the scope of the patent application, wherein the ends of the arched elastic pieces are riveted to the bottom surface. 1 8. The chip packaging structure according to item 12 of the scope of patent application, wherein the end of the arched elastic piece is locked on the bottom surface. 19. The chip packaging structure according to item 12 of the scope of the patent application, wherein the periphery of the heat sink has a plurality of engaging grooves, which are suitable for embedding the ends of the arched elastic pieces into the engaging grooves. 11180twfl.ptc 第15頁11180twfl.ptc Page 15
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CN101826492B (en) * 2010-04-29 2012-11-28 南通富士通微电子股份有限公司 Chip-suspension-type packaging heat dissipation improved structure of semiconductor
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