TWI227823B - Flexible heat sink fin set and heat sink - Google Patents

Abstract

The invention relates to a flexible heat sink fin set and a heat sink. The heat sink fin set includes a plurality of continuously latched and arranged fins, in which each fin is installed with at least a latch structure to be mutually latched and form a heat sink fin set, in which at least a part of the latch structure is flexible and bendable, and each fin forms into a sheet edge corresponding to one end of the latch structure thereof, so that the heat sink fin set can be deformed towards the center of curvature of the sheet edge and form into a curved heat sink fin set. The heat sink includes a curved heat conductive base and the above-mentioned heat sink fin set, which can be arranged in a curve shape. The heat sink fin set is bent in compliance with the curve shape of the heat conductive base so that the heat sink fin set is mounted on the curve face.

Description

1227823 V. Description of the invention (1) The heat sink of the present invention, especially the conductive base, is pressed to increase the speed of the electronic element to maintain a large area of heat dissipation. However, it is necessary to increase the mechanical processing time. It is thin and can be used for heat generation. However, in order to make the fins strong and not dense, the heat of the curved surface of the heat conduction base is In use, the obvious reason is that aluminum commonly used today is fixed and shaped, and its volume is most convenient for continuous stacking of higher fins. Since the stack of chips is loosened after being fastened, so it is made this way, so for the conductive base, it can be seen from the above that it is inconvenient to the inventor and relates to a flexible and bendable heat dissipation fin group And refers to a heat radiating fin group applied to the fins with a curved surface arrangement or having a curved surface and a heat sink provided with the heat radiating fin group. The rapid upgrade in the computer industry has increased the operation of electronic components, and the heat generated by them has also increased. Therefore, the components can continue to operate at the temperature allowed by them. On the surface, it can increase the bulk extrusion and die-casting heat sinks. Due to the limitation, it can improve the heat dissipation ability of the electronic components that respond to high heat generation, but it makes the weight of the heat dissipation fin group stacked accordingly. It is a lighter buckling method to increase its heat dissipation area, so its heat dissipation ability is also better when it is a component. In the way of stacking, the heat dissipation fin group can often make the heat dissipation fin group on the overall structure. In the past, it has been emphasized that the stability of the fastening method and the heat dissipation fin group can only be applied to a general flat surface. The heat dissipation fin group must be arranged in a curved shape or obviously cannot be used. The above-mentioned conventional heat dissipation fin group has a deficiency in practice, and can be improved. I feel that the above defects can be improved.

Page 4 1227823 V. Description of the invention (2) Study and cooperate with the above-mentioned missing radiating fin group of the present invention. The thermal fin group can be self-conducting on the conductive base, and is arranged in the ring with a better dispersion density and improved heat dissipation. Efficiency In order to achieve the transport cycle of each single fin of the flexible heat dissipation fin, a reasonable design and an effective improvement invention have finally been proposed. The main purpose is to provide a flexible bendable and heat sink, which uses a flexible bend to disperse to form a curved shape or cooperate with the heat of the curved surface to form a curved fin group. A heat sink; the heat dissipation fin group on the surface of the heater has a small resistance between the fins, so it can help improve the heat transfer effect, and can dissipate the fins, and each of the fins is a thermal fin The thermal fins are arranged while the heat dissipation fins are set to the technical inner fins group. The ore fins and photo sets can be used to achieve the group's scattered groups; the fins are formed, and the fins are arranged in the song. At least one of the film sets is provided, and for the above-mentioned heater facing the board, each of the two is engaged with the hot surface. Responsibility review refers to the purpose, including many,-^ The present invention provides a continuous structure of several pieces of the card to match the center of curvature of the engaging structure at least the edge of the engaging structure, the present invention includes a piece of The heat dissipation fin on the conductive structure of the conductive structure is deformed at the forming end of the flexible base. The heat provided on the surface includes a multi-arranged array of fins that snap on each other and the component has a plate edge; A curved conductive base and a plurality of scattered pieces are provided with a small-fit structure, which is flexible, and the curved surfaces of at least one part of the seat are continuously bent to engage with each other, so that the heat dissipation fin member Can further understand the characteristics of the present invention and the following detailed description and drawings of the present invention, but

Page 5 1227823 _; _ 5. Description of the invention (3) The drawings are provided for reference and explanation only, and are not intended to limit the present invention. Please refer to the first diagram, the second diagram, and the third diagram, which are three-dimensional schematic diagrams of the fins of the heat dissipation fin group and the fastening structure of the heat dissipation fin group according to the present invention, respectively. ^ Each piece of fin is a series of fins with a large number of hairs. Included in an exclusive package, the hot-continuous pieces of the stacked fin stack of the square group are interspersed with fins that can be bent by the thermal bending system. ^ _ The graphic fin flexure has an isomorph with the hrv ^ gd. There are two kinds of fins, one of which is to be connected, and one of which is to buckle one card. Each of the THs must be connected to the card, and the card C can be borrowed from 1 to 1 *. Close the card, combine the card and the card, as shown in the above picture. The first and the first group and the second picture of the two fins are hot, and the scattered A is a group of pictures. Read the T-H. The basal end is folded together. Bending 1—I. Outer fin of marginal piece. Ο 1 distant piece. 1 fin. 1—I. One with a base package. It can be reduced by one to 1 and 1—t. One ο other 1— < fins can be finned with 2 ο 1 Y "1Ti 丄 1 hole base mother base should ,, 2 ίφ— ΊΧ its 1-1 •, hole rH female 1-1 with arms set extension On the extension

Left arm 1—I extend 1 to 1 to arm 0. Extension and extension are connected to the buckle card system. The operation is to square the buckle and punch through the card 1—I of 1 ± 1 1 arm 1 and the extension of the hole and the mother ο 1 τ —X IX

rH 2 extends 1 the 1 in the hole, the mother is shown in the buckle A card picture as always, can be hooked also card or one; yes} set a slightly convex type division side application side these two C right inside Into a 5 shape 1 end 1 front block 3 cards 1 1 1 set the hole convex buckle on the 2 «/ 1—I 0〇IX 1 hole 1-a female hole on the buckle additional 4 open ^ ~ _ on 1 1 hook 1—I card 1—I ’s arm is extended to extend the phase, and the card and arm are extended to extend 2 5, 1-1 1-1 and IX T- < ·, the mother card of the hole block is connected to it when it is inserted— ^ With the same connection 1-1, the upper arm 5 of the buckle 1 reaches the extension 1 to extend 1, and the blocks are matched with each other. The interlocking phase 3 and 4 1 are rH 1-- Ί × holes.

Page 6 1227823 V. Description of the invention (4) Establish a vertical cutting elasticity to facilitate the buckle. Please also refer to the main system so that the parts of the card can be cards, or the base 1 1 In addition, each of the fins 1 The edge of the plate 1 2. If it has a flexible characteristic, it must be set at the same center with different curvatures if it bends at the center. Otherwise, etc., to stabilize the strength between the fins and reduce the solitary degree of contact (figure omitted). Resistance, and further improvement, please refer to the diagram of the fifth heater and heat source for the flexible heat dissipation. The present invention refers to the operation of the lifting slot 1 16 and the fourth figure and the combined structure 1. The combined structure 10 and the extension 0 are opposite to the size of the heat dissipating shape, meanwhile the bending is half and the bending shape is 10, Thermal resistance; or deflection one to enable the base arm 1 1 extending at least 1 of the fourth figure 1 to be engaged by the film sets, the diameters of which may be fan-shaped at the same time, and the angles The hook arm 1 1 114 1 is more shown by A. The scatter has a torsion 0 or extension seat 1 1 1 and a structure 1 Zhao piece 1 1 faces the fin 1, and the outer edge of the scatter fin is added to the scatter fin. Sheet 1 has better flexibility. The thermal fin group is 1-shaped, and the outriggers 1 1 1 are all flexible. One side of 1 is formed with a card with a 0 card edge and a card with a plate edge of 0 to make the heat dissipation structure 1 1 1 2 The fin group may be provided with a bent portion 14 at the top. The structure of the hot fin group 1 may also have a streamlined cooling airflow direction to reduce the cooling efficiency. With the above-mentioned structural composition, a flexible fin set according to the present invention can be obtained. The figure, the sixth exploded schematic diagram and the seventh diagram are respectively a scatter diagram, a combined schematic diagram, and a usage state diagram of the present invention for a heat sink with a curved fin group. The heat sink 2 includes a heat conducting base 20 and a heat sink. Fin group 1; of which

Page 7 1227823 V. Description of the invention (5) The heat dissipation fin group 1 is as described above, so it will not be repeated here. The heat conduction base 20 can be extruded from a material with good thermal conductivity, and can also be a plate heat pipe, a loop heat pipe, or a general wound heat pipe, etc., and the shape of the end cut surface can be circular, oval, or Those with rounded corners; an accommodating space 2 1 is provided on the heat-conducting base 20 to form an inner wall 2 2 with a curved surface on the heat-conducting base 20, and the above-mentioned heat-dissipating fin group 1 is matched The curved surface of the inner wall 22 is curved. At the same time, the heat dissipation fin group 1 is set in the accommodating space 21, and then the outer edge of the heat dissipation fin group 1 is glued, welded, tightly fitted, and the like. The folded portion 14 is joined with the inner wall 22 of the heat-conducting base 20, so that the heat-dissipating fin_group 1 can be set on a curved surface. · The bottom of the heat conducting base 20 is a heating surface 23, which is used to contact a heating source 3 to help the heating source 3 to dissipate heat; or it can also precede the heating surface 2 3 A heat diffusing element 24 with a high thermal conductivity is set at the bottom, and the heat diffusing element 24 is brought into contact with a heat source 3, so as to improve the heat diffusion and heat transfer effect through the heat diffusing element 24, and the heat diffusing element 2 4 It can be made of copper or aluminum with good heat conduction effect or plate heat pipe. In addition, a heat conduction plate 25 can be connected to each edge 12 of the heat dissipation fin group 1 to increase the uniformity of the cooling airflow distribution, and to make the temperature distribution of the heat dissipation ® fin group 1 more even; In addition, a heat conducting post 2 6 may also be provided between the heat conducting plate 25 and the heat receiving surface 23. The heat conducting post 2 6 _: is perpendicular to the inner wall 22 of the heat conducting plate 25 and the heat conducting base 20. To make the temperature distribution of the heat sink 2 more uniform.

Page 8 1227823 V. Description of the invention (6) The end surface can be arranged on a flexible wind and the other end is provided with a fan 2 for heat dissipation efficiency. That is to say, the present invention has a bendable and bendable heat dissipation fin group. The curved surface of the heat conduction base is combined with a bend to form a bender with a density arranged between each of the fins, and the heat dissipation can be improved. In addition, the heat conduction base 20 has one end of one of the channels 27, and the flexible air channel 27 28 is formed by the fan 28 to increase heat dissipation, and is composed of the structure described above to radiate heat from the curved fin group Device. Therefore, by virtue of the flexibility of the present invention, the heat sink fin group and the heat conduction base heat sink fin group heat sink can be arranged in a fan-shaped curved shape or matching by themselves; The heat dissipation fin group has a small flow resistance and contributes to the enhancement of the heat transfer effect. As mentioned above, the present invention can indeed achieve the intended purpose of use, to solve the lack of knowledge, and because of its novelty and progress, It fully complies with the requirements for the application for an invention patent, and applied in accordance with the Patent Law. Please check and grant the patent in this case in order to protect the rights of the inventor. However, the above are only the preferred and feasible embodiments of the present invention, and the patent scope of the present invention is not limited by this. Therefore, any equivalent structural changes made by using the description and drawings of the present invention are included in the same reason. Within the scope of the invention, Chen Ming was together.

Page 9 1227823 Brief description of the drawings The first diagram The first diagram A The second diagram The third diagram The fourth diagram The fourth diagram A The fifth diagram The sixth diagram The seventh diagram is a perspective view of the fins of the heat dissipation fin set of the present invention. This is the enlarged detail view of Part A of the first picture. It is a perspective view of the fastening structure of the heat dissipation fin group according to the present invention. It is a schematic plan view of the heat dissipation fin group of the present invention. It is a schematic side view of the heat dissipation fin group of the present invention. It is an enlarged view of part A of the fourth figure. It is a decomposition diagram of the radiator and the heat source of the present invention. It is a schematic diagram of a combination of a radiator and a heat source according to the present invention. It is a schematic diagram of the use state of the radiator and the heat source of the present invention. Explanation of symbols: [Invention] 1 Radiating fin group buckle structure extension arm buckle 卡 L card block plate edge folded portion 1 0 fin 11 1 1 10 base 111 112 female hole 113 114 hook 115 116 slot 12 13 Bending radius 14 2 Radiator heat-conducting base receiving space

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Claims (1)

1227823 VI. Application Patent Scope 1. A flexible and bendable radiating fin group including a plurality of fins arranged in a continuous engagement, each of which is provided with at least one engaging structure, which is formed by snapping on each other. A heat dissipation fin group, wherein at least one part of each of the engaging structures is flexible, and each of the fins forms a plate edge with respect to one end of the engaging structure; thereby, the heat radiating fin group can face the center of curvature of the plate edge It is bent and deformed everywhere to form a group of radiating fins which can be arranged in a fan-shaped curved surface. 2. The flexible and bendable heat-dissipating fin group according to item 1 of the scope of the patent application, wherein each of the fins is provided with a folded portion at an outer edge thereof. / 3. The flexible and bendable heat dissipation fin group as described in item 1 of the scope of patent application, wherein each of the fins has a streamlined arc or a deflection angle. 4. The flexible and bendable radiating fin group according to item 1 of the scope of patent application, wherein the engaging structure includes at least a base formed by bending the outer edge of the fin, and a base formed by the base An extension arm extending forward away from one end of the fin, and a female hole is provided at the joint between the base and the fin, so that the extension arm of the other fin can be inserted as a snap connection. 5. The flexible and bendable heat-dissipating fin set according to item 4 of the scope of the patent application, wherein the base is a flexible part of the engaging structure. 6. The flexible and flexible heat dissipation and fin set as described in item 4 of the scope of patent application, wherein the extension arm is a flexible part of the engaging structure / 〇 ^ 7, as in the scope of patent application, item 4 The flexible and bendable heat dissipation fin group, wherein the base and the extension arm are both engaging structures with flexibility Page 12 1227823_ Six, the scope of the patent application. 8. The flexible and bendable heat dissipation fin set according to item 4 of the scope of patent application, wherein a hook is protruded at the outer side of the extension arm to be snapped into the female hole. 9. The flexible and bendable heat sink sheet set as described in item 4 of the scope of the patent application, wherein the extension arm is provided with a buckle hole, the front end of the buckle hole forms an opposite hook, and the female hole is convexly arranged. A clamping block, so that the hook is locked on the clamping block. 10. The flexible and bendable heat dissipation fin group as described in item 4 of the scope of patent application, wherein the extension arm is provided with a slot. 1 1. A heat sink having a curved heat dissipation fin group, comprising: a heat conductive base having a curved surface; and a heat dissipation fin group including a plurality of fins arranged in a continuous engagement arrangement, each of which is provided with at least one The engaging structure is formed by snapping on each other, and at least one part of each of the engaging structures is flexible, so that the heat sinking slab chip group matches the curved surface of the heat conduction base, and the heat sinking fin group is set on the On the surface. 12. The heat sink having a curved heat dissipation fin group as described in item 11 of the scope of the patent application, wherein the heat conduction base may be a plate heat pipe, a broken circuit heat pipe, or a general wound heat pipe. 13. The heat sink with a curved fin group as described in item 11 of the scope of the patent application, wherein the shape of the end section of the heat conduction base may be circular, oval or rectangular with rounded corners. 1 4 、 With curved heat sink fins as described in item 11 of the scope of patent application Page 13 1227823_ 6. The heat sink of the patent application group, wherein the heat conduction base is provided with an accommodation space for the heat dissipation fin group to be arranged therein. 15. The heat sink with a curved heat dissipation fin set according to item 11 of the scope of patent application, wherein the bottom of the heat conduction base is a heating surface. 16. The heat sink with a curved heat dissipation fin group as described in item 15 of the scope of the patent application, wherein the bottom of the heating surface is further provided with a heat diffusion element 17 7. The heat dissipation device 18 of the application group Radiating edge up 19, such as the arc of thermal line of the application group 20, such as the heat-sink engaging structure guide plate of the application group 2 1, such as the cooling room of the application group is set up 2 2, such as the heat of the application group Item 16 of the patent range, wherein the item of item 11 of the thermal diffusion element patent, wherein the heat dissipation fin is provided with a fold. The scope of the patent No. 11 device, wherein the heat dissipation fin is inclined or inclined at an angle. The device according to item 11 of the patent, wherein a plate edge is formed at one end of the heat dissipation fin, and the curved heat dissipation fin is a plate heat pipe. Each of the fins having a curved heat dissipation fin group is described above, and each of the fins having a curved heat dissipation fin group is described. Each of the plate edges is associated with a curved heat sink fin device described in item 20 of the heat transfer patent range, wherein the heat transfer plate and a heat transfer post at the bottom of the heat transfer base. The curved heat dissipation fin device according to item 11 of the patent scope, wherein the engaging structure of the heat dissipation fin group includes at least Page 14 1227823 6. Scope of patent application-a base bent by the outer edge of the binding piece, and an extension arm extending forward from the end of the base away from one end of the piece, and the base is connected to the fin A female hole is provided for the extension arm of the other fin to penetrate as a snap connection. The heat sink with a curved fin group as described in item 22 of the patent application scope, wherein the base is It is a flexible part of the engaging structure. 24. The heat sink having a curved heat dissipation fin set according to item 22 of the scope of the patent application, wherein the extension arm is a flexible part of the engaging structure. 25. The heat sink having a curved heat dissipation fin group as described in item 22 of the scope of the patent application, wherein the base and the extension arm are both flexible parts of the engaging structure. 26. The heat sink with a curved heat dissipation fin set according to item 22 of the scope of the patent application, wherein a hook is protruded at the outer side of the extension arm to be snapped into the female hole. 27. The heat sink with a curved fin group as described in item 22 of the scope of the patent application, wherein the extension arm is provided with a buckle hole, the front end of the buckle hole forms an opposite hook, and the female hole is convex on the female hole. A clamping block is provided so that the hook can be locked on the clamping block. 28. The heat sink with a curved heat dissipation fin group according to item 22 of the scope of the patent application, wherein the extension arm is provided with a cutout. 29. The heat sink having a curved heat dissipation fin group as described in item 11 of the scope of patent application, further comprising a flexible air duct and a fan, the air duct Page 15 1227823 Page 16