TWI222273B - Semiconductor device - Google Patents
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1222273 玖、發明說明 (發明說明應欽明:發明所屬之技術領域、先前技術、内容、實施方式及囫式簡單說明) 【發明所屬之^技術領域】 發明領域 本發明係有關於一種具有於比本身之電源電壓還高之 5電壓位階變換信號位階之介面之半導體裝置,特別是有關 於一種可在沒有經常性的電流消耗之情形下進行往較高電 壓位階之信號之位階變換之半導體裝置。 發明背景 10 可輸出比自己之電源電壓還高之電壓位階之信號之輸 出緩衝電路係揭示於如下所述之專利文獻丨。專利文獻i 中係如第15圖所示,使用在依序漸高之電壓位階之電源電 壓進行動作之4個中間轉換器,然後藉使輸出電壓〇υτ之 電壓位階由較低之電壓位階卿增大為依序漸高之電壓位 15 P白(VL1、VH1)、(VL2、VH2)、(VL3、VH3)、(VL3、 VDD2)而可知到在較高電壓位階之輸出信號㈤丁 20 在此中間轉換器之電源電壓中之電壓位階vL 1至 VL3 VH1至VH3係藉由電阻元件1〇5至ui將較高電壓 位階VDD2進行分壓而得者。 又,先前技術文件係如下所示。 公報 專利文獻1 ··日本專利公開公報特開平 10-22810 號 刖述專利文獻1所揭示之輸出緩衝電路係在可輸出輸 5 玖、發明說明 出仏號OUT之狀態下,藉由電阻元件105至111將電源電 壓VDD2進行分壓而得到應供給至中間轉換器之電壓位階 VL1至VL3、VH1至VH3。因此,輸入信號IN之邏輯位 階之遷移透過中間轉換器傳播之後,在中間轉換器之輸入 >輸出#唬之邏輯狀態則固定,雖然中間轉換器中不會消耗 電流,但由電源電壓VDD2通過電阻元件1〇5至1U則會 產生經常性的電流消耗。 利用到希望以可攜式機器等為首之低消耗電流動作之 技術領域時,則有經常性的電流消耗之問題。 本發明係為解決習知技術具有之問題而作成者。其目 的在於k供種在第1電源電壓動作之第〖電路群與較第 1電源電壓還高之電虔之第2電源動作之第2電路群 之間進行信號之連接時,在沒有經常性之電流消耗之情形 下進行位階變換之半導體裝置。1222273 发明 Description of the invention (The description of the invention should be made clear: the technical field to which the invention belongs, the prior art, the content, the embodiments, and the simple description of the invention) [Technical Field to which the invention belongs] The present invention relates to a kind of A semiconductor device with an interface having a power supply voltage of 5 voltage level conversion signal level, in particular, relates to a semiconductor device that can perform signal level conversion to a signal of a higher voltage level without frequent current consumption. BACKGROUND OF THE INVENTION 10 An output buffer circuit capable of outputting a signal of a voltage level higher than its own power supply voltage is disclosed in the patent document described below. In patent document i, as shown in Fig. 15, four intermediate converters are used which operate on the power supply voltage in the order of gradually increasing voltage levels, and then the lower voltage level is used to reduce the voltage level of the output voltage 〇υτ. Increase the voltage level in sequence to 15 P white (VL1, VH1), (VL2, VH2), (VL3, VH3), (VL3, VDD2) and we can see that the output signal at higher voltage levels is less than 20 The voltage levels vL 1 to VL3, VH1 to VH3 in the power supply voltage of this intermediate converter are obtained by dividing the higher voltage level VDD2 by the resistance elements 105 to ui. The prior art documents are shown below. Gazette Patent Document 1 · Japanese Patent Laid-Open Publication No. Hei 10-22810 describes the output buffer circuit disclosed in Patent Document 1 in a state where the output is 5 Ω, the invention description shows the number OUT, and the resistance element 105 is used. To 111, the power supply voltage VDD2 is divided to obtain voltage levels VL1 to VL3 and VH1 to VH3 to be supplied to the intermediate converter. Therefore, after the transition of the logic level of the input signal IN propagates through the intermediate converter, the logic state of the input > output # of the intermediate converter is fixed. Although no current is consumed in the intermediate converter, the power supply voltage VDD2 passes Resistive elements 105 to 1U cause regular current consumption. When a technology field in which a low current consumption operation such as a portable device is desired is used, there is a problem of frequent current consumption. The present invention has been made to solve the problems of the conventional technology. The purpose is to provide a signal connection between the second circuit group operated by the first power supply voltage and the second circuit group operated by the second power supply that is higher than the first power supply voltage. A semiconductor device that performs level conversion in the case of current consumption.
【明内容;J 發明之揭示 為達成前述目的,第i態樣之半導體裝置係具有在基 準電壓與第i電源電叙間進行動作作為電源之第ι電^ 2及在基準電壓與具有高於第i電源電麼之電愿位階之 第2電源㈣之間進行動作作為電源之第2電路群者,其 特试在於包含有··一第!導電型之電遷控制型高屋側元件 ’係在第2電路群之輸入段令進行前述第2電源電應之輪 出控制者;及一位階轉換電路’係由第!電路群往第2電 路群之介面’且在第!電源電麼與第2電源電屋之間進行 玖、發明說明 動作作為電源,並導通控制電壓控制型高壓側元件者;而 4位階轉換電路具有··一第丨導電型之電壓控制型第丨元 件,係設置於電壓控制型高壓側元件與第丨電壓電源之間 ,並在導通電壓控制型高壓側元件時,供給第丨電源電壓 者;及一第1導電型之電壓控制型第2元件,係設置於電 壓控制型高壓側元件與第2電壓電源之間,並在使電壓控 制型尚壓側元件為非導通時,供給第2電源電壓者。 在第1態樣之半導體裝置中,為了第i電路群與第2 電路群之間的轉換,可使用在第丨電源電壓與第2電源電 I之間進行動作之位階轉換電路。該位階轉換電路係藉為 第1導電型之電壓控制型元件之第丨及第2元件而供給第 1及第2電源電壓,且使為第丨導電型之電壓控制型元件 之第2電路群之高壓側元件為導通及非導通。 藉此,由於位階轉換電路並非對基準電壓電壓,而是 對第1電源電遷供給第2電源電壓而構成,因此施加之電 壓差會成為第1及第2電源電壓之間的電壓差。第2電源 電壓之電壓差可使用不能確保耐壓之構成元件而構成介面 。又’不須為了確保耐壓而藉按第1及第2電源電壓之比 例分配來作出中間的第3電源電壓。因此,不會有隨著電 源電壓之比例分配之電流消耗。 且’以第2電源電壓為基準電壓,因應供給之電壓位 階而控制導通及非導通之高壓側元件中不會有經常性的電 流消耗’而可在元件耐壓之範圍内供給第1及第2電源電 壓,且進行導通控制。 玖、發明說明 在此,由於設於位階轉換電路之第i及第2元件係由 與高壓側元件相同導電型之第1導電型所構成,因此位階 轉換電路可輕易地構成相對於基準電壓浮動之電壓之第i 及第2電源電壓之導通控制。 又,第2態樣之半導體裝置係在第丨態樣之半導體裝 置中,宜在前述電壓控制型第丨元件中與前述第丨電路群 連接。藉此,可使來自第1電路群之電壓信號不變地輸入 至位階轉換電路。 又,有關第3態樣之半導體裝置係在第丨或2態樣之 半導體裝置中,該位階轉換電路更包含有··一第i導電型 之電壓控制型第3元件,係設置於電壓控制型第2元件與 第1電源電壓之間,並當導通電壓控制型第2元件時,供 給第1電源電壓者;及一帛!導電型之電壓控制型第4元 件’係设置於電壓控制型第2元件與第2電源電壓之間, 並在使電壓控制型第2元件為非導通時,供給第2電源電 壓者。 有關第3悲樣之半導體裝置中,電壓控制型之第2元 件係藉電壓控制型之第3及第4元件供給第!及第2電源 電壓,且控制導通及非導通。在此,帛3及第4元件亦為 第1導電型,且作為位階轉換電路之構成元件而在第i電 源電壓與第2電源電壓之間進行動作。 又,有Μ 4態樣之半導體裝置係在帛3態樣之半導 體裝置中,該第4元件係因應由第1元件供給第1電源電 [而導通,亚因應由第2元件供給第2電源電壓而非導通 玖、發明說明 者。 藉此以第2電源電壓為基準進行電壓控制之第2及 第4元件不會有經常性之電流消耗而在元件耐壓之範圍内 ,在第1及第2電源電壓切換而進行導通及非導通地控制 〇 又,有關第5態樣之半導體裝置係在第3態樣之半導 體裳置中,該位階轉換電路宜在前述電壓控制型第3元件 中與前述第i電路群連接。藉此,可使來自第ι電路群之 電壓信號不變地輸入至位階轉換電路。 又,有關第6態樣之半導體裝置,係具有在第ι電源 之間進行動作之第!電路群、及在高於第丨電源電魔 、電尾位P白之第2電源電麼之間進行動作之第2電路群者 、’,其特徵在於包含有:一輸出PM〇s電晶體,係設置於前 述第2電路群之輸入段,且藉往閘極端子供給第i電源電 壓而導通,並進行第2電源電壓之輸出者;及一位階轉換 電路’係由第i電路群往第2電路群之介面,且在第ι電 源電麼與第2電源電屋之間進行動作作為電源,並導通控 制輸出PMOS電晶體者;其中該位階轉換電路具有··一第 1PM0S電晶體’係配置於由帛i電源電麼至輸出爾⑽電 曰曰體之間極端子之路徑内,並藉往閘極端子供給來自第1 電路群之g 1 #號而導通控制者,·一第2續〇8電晶體, ^配置於由第2電源電壓至輸出pM〇s電晶體之間極端子 之路彷内,並藉往閘極端子供給第丨電源電壓之第1信號 而‘通者’-帛3PM〇s電晶體,係配置於由第1電源電 1222273 玖、發明說明 壓至第2PM0S電晶體之閘極端子之路徑内,並藉往閘極 端子供給來自第1電路群之第2信號而導通控制者;及一 第4PM0S電晶體,係配置於由第2電源電壓至第2PM0S 電晶體之閘極端子之路徑内,並藉透過第1或第2PM0S 5 電晶體往閘極端子供給第1或第2電源電壓而成為導通或 非導通者;而前述第1及第3PM0S電晶體任一者之一端 係可導通地控制。 有關第6態樣之半導體裝置,係導通第1PM0S電晶 體,且供給第1電源電壓於輸出PMOS電晶體之閘極端子 10 及第4PMOS電晶體之閘極端子而導通兩電晶體。藉第 4PMOS電晶體之導通,可供給第2電源電壓至第2PMOS 電晶體之閘極端子,而第2PMOS電晶體為非導通。此時 ,第3PMOS電晶體為非導通。相反地,第1PMOS電晶體 為非導通且第3PMOS電晶體導通時,第2PMOS電晶體則 15 導通,且輸出PMOS電晶體及第4PMOS電晶體為非導通 〇 在此,各電晶體之端子間可直接耦合,又,亦可透過 具有電阻元件或二極體元件等降壓機能之電路要件連接。 只要為當供給第1電源電壓至閘極端子時,在閘極·源極 20 端子之間施加大於閾值電壓之電壓之構造即可。 又,由第1電路群供給之第1及第2信號之高位階電 壓除了可為第1電源電壓之外,亦可為對第1電源電壓昇 壓之電壓、或轉換位階成更高之電壓之電壓。在第1及第 2信號中之高位階電壓中,第1及第3PMOS電晶體為非導 10 1222273 玖、發明說明 通。 藉此,由於位階轉換電路係藉對第i電源電壓供給第 1電源電壓而非對基準電壓供給而構成,因此,施加之電 壓差則成為第1及第2電源電壓之間的電壓差。第!至第 5 4PM〇S電晶體不須確保第2電源電壓之耐壓,而可由更低 之耐壓元件構成。當轉換位階時,則不須藉按第丨及第2 電源電壓之比例分配而作出中間的第3電源電壓,而不會 有因比例分配產生之電流消耗。 又,有關第7態樣之半導體裝置係在第6態樣之半導 1〇體裝置中,該第1及第2信號宜為相互反相之邏輯信號。 藉此,可只導通第1及第3PM〇S電晶體中之一方。 又,有關第8態樣之半導體裝置係在第6態樣之半導 體裝置中,於閘極端子經常施加預定偏電壓之第丨及第 2NM0S電晶體,係在由第i及第3pM〇s電晶體至第2及 15第4PM〇S電晶體之路徑中,配置於輸出及第4PM0S電晶 體之閘極端+或往該閘極端子之分歧點為止之路徑内者。 有關第8態樣之半導體裝置中,當第1或第3pM〇s 電晶體藉第1或第2信號導通時,帛1及第2NM0S電晶 體則導通,且當第1或第3PM0S電晶體接收非導通之控 2〇制時’藉第1或第2信號使第1或第2NM〇s電晶體之没 極端子之電壓進行降壓再供給至第i或第3pM〇s電晶體 〇 藉此,當第1或第3PM〇s電晶體導通時,可對輸出 及第4PM0S電晶體之閘極端子、或第2pM〇s電晶體之閘 11 1222273 玖、發明說明 ..... - - 極编子仏給第1電源電壓,同時在非導通時,則供給業經 由第2電源電壓降壓之電壓於第J或第3pM〇s電晶體。 具有與輸出PMOS電晶體或第2及第4PM0S電晶體相同 閾值電壓而構成第1或第3PM0S電晶體時,亦可非導通 5地控制第1或第3PM0S電晶體。 又’有關第9態樣之半導體裝置係在第8態樣之半導 體裝置中,該第丨及第2NM〇s電晶體之閘極端子宜連接 於預定偏電壓源。此外,有關第1〇態樣之半導體裝置係在 第9怨樣之半導體裝置中,宜具有一電壓降壓部,係設置 10於由預定偏電壓源至前述第1及第2NM0S電晶體之閘極 端子之路徑内。而且,有關第11態樣之半導體裝置係在第 10態樣之半導體裝置中,電壓降壓部宜為二極體元件或二 極體所連接形成之電晶體,或者前述二極體元件與電晶體 之多段連接或組合連接者。又,有關第12態樣之半導體裝 15置係在第9〜11態樣中任一態樣之半導體裝置中,該預定偏 電壓源係由第2電源電壓或外部供給之電壓源。藉此,第 1及第2NMOS電晶體之閘極端子則施加適當之預定偏電壓 〇 又,有關第13態樣之半導體裝置係在第6態樣之半導 20體裝置中,該第1及第3PM〇s電晶體係具有較輸出PMOS 電sa體、第2PMOS電晶體、及第4PMOS電晶體還高之閾 值電壓。藉此,即使不設置第1及第2NMOS電晶體時, 不用拘泥於輸出PMOS電晶體或第2及第4PMOS電晶體 之導通’而可非導通地控制第1或第3p]VI〇s電晶體。又 12 1222273 玖、發明說明 ’具有第1及第2NM0S電晶體時,可更擴大預定偏電壓 之電壓範圍。 又’有關第14態樣之半導體裝置係在第6態樣之半導 體裝置中’更具有一用以控制第1及第3PM0S電晶體之 5 各自的閘極端子之電壓之閘極電壓控制部。 有關第14態樣之半導體裝置中,閘極電壓控制部係當 施加於第1或第3PM0S電晶體之汲極端子之第2電源電 壓大於第1電源電壓加上第1預定電壓之電壓時,則將第 1或第3PM0S電晶體之閘極端子之電壓設定於第2電源電 1〇壓,並當施加於第1或第3PM0S電晶體之汲極端子之第2 電源電壓小於第1電源電壓加上第丨預定電壓之電壓時, 則將第1或第3PM0S電晶體之閘極端子之電壓設定於第J 電源電壓。 藉此,當非導通控制第1或第3PM0S電晶體時,即 15使於没極端子直接施加第2電源電壓,亦可因應相對於第 1電源電壓之第2電源電壓之電壓值而控制施加於閘極端 子之電壓,並且非導通地維持第!或第3pM〇s電晶體。 且不會形成透過第!或第3PM〇s電晶體往第i電源電壓 之不必要的電流路徑,而可防止不必要之電流消耗。[Explicit content; J invention's disclosure In order to achieve the aforementioned purpose, the i-th semiconductor device has an i-th battery which operates between the reference voltage and the i-th power source ^ 2 and the reference voltage and The second power group of the i-th power source is willing to operate between the second power source ㈣ of the power level, and its special test is to include ... The conductive type electric-migration-controlled high-roof-side element ’is the input section of the second circuit group to perform the rotation control of the aforementioned second power supply; and the one-stage conversion circuit’ is the first! The interface of the circuit group to the second circuit group ’is at the first! The power supply unit and the second power supply house perform an operation as a power source, and the conduction voltage control type high-voltage side element is turned on; and the 4-level conversion circuit has a conductive type of voltage control type. The element is provided between the voltage-controlled high-voltage side element and the first voltage power source and supplies the first power voltage when the voltage-controlled high-voltage side element is turned on; and a voltage-controlled second element of the first conductivity type , Is provided between the voltage-controlled high-voltage side element and the second voltage power supply, and when the voltage-controlled high-voltage side element is made non-conducting, the second power supply voltage is supplied. In the first aspect of the semiconductor device, in order to switch between the i-th circuit group and the second circuit group, a level conversion circuit that operates between the first power supply voltage and the second power supply I can be used. The level conversion circuit supplies the first and second power supply voltages through the first and second elements of the voltage-controlled element of the first conductivity type, and makes the second circuit group of the voltage-controlled element of the first conductivity type. The high-side components are conductive and non-conductive. Accordingly, since the level conversion circuit is configured to supply the second power supply voltage to the first power supply instead of the reference voltage, the applied voltage difference becomes a voltage difference between the first and second power supply voltages. The voltage difference between the second power supply voltages can be used to configure the interface using components that cannot ensure the withstand voltage. In addition, in order to ensure the withstand voltage, it is not necessary to make an intermediate third power supply voltage by distributing the ratio of the first and second power supply voltages. Therefore, there is no current consumption that is distributed in proportion to the power supply voltage. In addition, "the second power supply voltage is used as the reference voltage, and there is no constant current consumption in the high-voltage side components that control conduction and non-conduction according to the supplied voltage level." 2 Power supply voltage, and conducting control.发明 Description of the invention Here, since the i-th and second elements provided in the level conversion circuit are composed of the first conductivity type having the same conductivity type as the high-voltage side element, the level conversion circuit can be easily configured to float relative to the reference voltage. Turn-on control of the i-th and second power supply voltages. The semiconductor device according to the second aspect is the semiconductor device according to the second aspect, and is preferably connected to the aforementioned circuit group in the aforementioned voltage-controlled type element. Thereby, the voltage signal from the first circuit group can be constantly input to the level conversion circuit. In addition, the third aspect of the semiconductor device is the semiconductor device of the first or second aspect, and the level conversion circuit further includes a voltage control type third element of the i-th conductivity type, which is provided for voltage control. Between the second type element and the first power supply voltage, and when the voltage control type second element is turned on, the first power supply voltage is supplied; and one! The conductive type voltage control type fourth element is provided between the voltage control type second element and the second power supply voltage, and when the voltage control type second element is made non-conductive, the second power supply voltage is supplied. In the third semiconductor device, the second element of the voltage control type is supplied by the third and fourth elements of the voltage control type! And the second power supply voltage, and controls conduction and non-conduction. Here, the third and fourth elements are also the first conductivity type, and operate as a constituent element of the level conversion circuit between the i-th power source voltage and the second power-source voltage. In addition, the semiconductor device having the M 4 aspect is a semiconductor device with the 3 aspect, and the fourth element is turned on in response to the supply of the first power source by the first element, and the second element is provided in the second power source by the second element. Voltage instead of conduction, inventor. With this, the second and fourth elements that perform voltage control based on the second power supply voltage will not have regular current consumption, and within the range of the withstand voltage of the element, the first and second power supply voltages are switched to conduct conduction and non-operation. On-ground control. The semiconductor device according to the fifth aspect is in the semiconductor device of the third aspect. The level conversion circuit is preferably connected to the i-th circuit group in the voltage-controlled third element. Thereby, the voltage signal from the first circuit group can be constantly input to the level conversion circuit. In addition, the semiconductor device according to the sixth aspect is the first one that operates between the first power source! The circuit group, and the second circuit group that operates between the second power source and the second power source, which are higher than the first power source, the power tail, and the white tail, are characterized by including: an output PM0s transistor , Is set in the input section of the aforementioned second circuit group, and is turned on by supplying the i-th power supply voltage through the gate terminal, and outputs the second power supply voltage; and the one-stage conversion circuit is from the i-th circuit group to The interface of the second circuit group, which operates between the first power source and the second power source as a power source, and turns on the control output PMOS transistor; wherein the level conversion circuit has a first PMOS transistor. It is located in the path from the power source to the output terminal, and the gate terminal is used to supply the g1 # number from the first circuit group to turn on the controller. 2continued transistor, which is placed in the path of the terminal from the second power supply voltage to the output pM0s transistor, and borrows the gate terminal to supply the first signal of the first power supply voltage. '-帛 3 PM〇s transistor, which is arranged by the first power supply 1222273 Explain the path to the gate terminal of the 2PM0S transistor, and to supply the second signal from the first circuit group by the gate terminal to turn on the controller; and a 4PM0S transistor, which is configured by the second power supply The voltage is in the path of the gate terminal of the 2PM0S transistor, and the first or second power supply voltage is supplied to the gate terminal through the first or 2PM0S 5 transistor to become conductive or non-conducting; Either terminal of the 3PM0S transistor can be controlled to be conductive. Regarding the sixth aspect of the semiconductor device, the first PMOS transistor is turned on, and the first power supply voltage is supplied to the gate terminal 10 of the output PMOS transistor and the gate terminal of the fourth PMOS transistor to turn on the two transistors. By turning on the fourth PMOS transistor, the second power supply voltage can be supplied to the gate terminal of the second PMOS transistor, and the second PMOS transistor is non-conductive. At this time, the third PMOS transistor is non-conductive. In contrast, when the first PMOS transistor is non-conducting and the third PMOS transistor is conducting, the second PMOS transistor is 15 conducting, and the output PMOS transistor and the fourth PMOS transistor are non-conducting. Here, the terminals of each transistor can be Directly coupled, or connected through circuit elements with voltage-reducing functions such as resistance elements or diode elements. It is only necessary to have a structure in which a voltage greater than a threshold voltage is applied between the gate and source 20 terminals when the first power source voltage is supplied to the gate terminal. In addition, the high-level voltages of the first and second signals supplied from the first circuit group may be the first power supply voltage, or may be a voltage that boosts the first power supply voltage, or a voltage that is converted to a higher level. The voltage. Among the high-order voltages in the first and second signals, the first and third PMOS transistors are non-conducting. 10 1222273 Accordingly, since the level conversion circuit is configured by supplying the first power supply voltage to the i-th power supply voltage instead of the reference voltage, the applied voltage difference becomes the voltage difference between the first and second power supply voltages. Number! It is not necessary to ensure the withstand voltage of the second power supply voltage to the 5th 4PM0S transistor, and it can be composed of a lower withstand voltage element. When switching levels, it is not necessary to make an intermediate third power supply voltage by proportionally distributing the first and second power supply voltages, and there is no current consumption due to the proportional distribution. Moreover, the semiconductor device according to the seventh aspect is the semiconductor body device of the sixth aspect, and the first and second signals are preferably logic signals which are mutually opposite. Thereby, only one of the first and third PMOS transistors can be turned on. The semiconductor device according to the eighth aspect is the semiconductor device according to the sixth aspect, and the first and second NMOS transistors with a predetermined bias voltage often applied to the gate terminal are connected to the i and 3 pMOS transistors. The path from the crystal to the 2nd and 15th 4PMOS transistors is arranged in the path between the output and the gate extreme + of the 4PM0S transistor or to the point where the gate terminal diverges. In the eighth aspect of the semiconductor device, when the first or third pM0s transistor is turned on by the first or second signal, the 帛 1 and second NMOS transistors are turned on, and when the first or third PM0S transistor receives When the non-conducting control is 20, the voltage of the non-terminal of the 1 or 2 NMOS transistor is reduced by the first or second signal and then supplied to the i or 3 pMOS transistor. When the 1st or 3PMMOS transistor is turned on, the output and the 4PM0S transistor's gate terminal or the 2pM0s transistor's gate 11 1222273 发明, description of the invention ... The editor gives the first power supply voltage, and at the same time, when the non-conduction, the supply industry steps down the voltage through the second power supply voltage to the Jth or 3pMOS transistor. When the first or third PM0S transistor is formed with the same threshold voltage as the output PMOS transistor or the second and fourth PM0S transistors, the first or third PM0S transistor can be controlled in a non-conductive manner. The semiconductor device according to the ninth aspect is the semiconductor device of the eighth aspect, and the gate terminals of the second and second NMOS transistors should be connected to a predetermined bias voltage source. In addition, the semiconductor device related to the tenth aspect is the ninth semiconductor device, and it is preferable to have a voltage step-down section, which is provided at a gate from a predetermined bias voltage source to the aforementioned first and second NMOS transistors. Within the path of the extremes. Moreover, the semiconductor device according to the eleventh aspect is the semiconductor device according to the tenth aspect, and the voltage step-down portion is preferably a diode element or a transistor formed by connecting the diodes, or the foregoing diode element and the electric element. Multi-segment connection or combination of crystals. The semiconductor device 15 in the twelfth aspect is the semiconductor device in any one of the ninth to eleventh aspects, and the predetermined bias voltage source is a second power source voltage or a voltage source externally supplied. Accordingly, the gate terminals of the first and second NMOS transistors apply appropriate predetermined bias voltages. Moreover, the semiconductor device in the thirteenth aspect is a semiconductor 20-body device in the sixth aspect. The third PMOS transistor system has a higher threshold voltage than the output PMOS transistor, the second PMOS transistor, and the fourth PMOS transistor. Therefore, even when the first and second NMOS transistors are not provided, the first or third p] VI0s transistor can be non-conductively controlled without being restricted to the conduction of the output PMOS transistor or the second and fourth PMOS transistors. . 12 1222273 发明, description of the invention ′ When the first and second NMOS transistors are provided, the voltage range of the predetermined bias voltage can be further expanded. In addition, the semiconductor device according to the 14th aspect is the semiconductor device according to the 6th aspect, and a gate voltage control unit for controlling the voltages of the respective gate terminals of the 5th and 1th PMMOS transistors is further provided. In the fourteenth aspect of the semiconductor device, when the gate voltage control unit is a voltage applied to the drain terminal of the first or third PM0S transistor greater than the voltage of the first power supply plus the first predetermined voltage, The voltage of the gate terminal of the first or third PM0S transistor is set to 10 volts of the second power source, and when the second power source voltage applied to the drain terminal of the first or third PM0S transistor is less than the first power source voltage When the voltage of the first predetermined voltage is added, the voltage of the gate terminal of the first or third PM0S transistor is set to the Jth power supply voltage. Therefore, when the first or third PM0S transistor is non-conductingly controlled, that is, the second power supply voltage is directly applied to the terminal without the 15 terminal, and the application can be controlled according to the voltage value of the second power supply voltage relative to the first power supply voltage. The voltage at the gate terminal and non-conducting to maintain the first! Or the 3 pMos transistor. And will not form through the first! Or the unnecessary current path of the 3PM0s transistor to the i-th power supply voltage can prevent unnecessary current consumption.
2〇 且’不用拘泥於輸出P刪電晶體或第2及第4PM0S 電晶體之間值電壓之異同,可非導通地控制第i或第 3PM0S電晶體。 又,有關第15、 之半導體裝置中,第 16態樣之半導體裝置係在第14態樣 1電源電塵加1敎電壓之電廢 13 玫、發明說明 ’宜為第1或第3PM0S電晶體由汲極端子側開始導通至 第1電源電壓側時之電壓。此時,第丨預定電壓宜為相當 於第1或第3PM0S電晶體之閾值電壓之電壓。 又,有關第17態樣之半導體裝置係在第14態樣之半 5導體裝置中,該閘極電壓控制部係設置於第1電路群與第 1或第3PM0S電晶體之閘極端子之間。 有關第17態樣之半導體裝置中,當將第i或第 3PM0S電晶體之閘極端子設定於第2電源電壓時,藉由第 1閘極電子控制部可阻止第2電源電壓由第夏或第3pm〇s 10電晶體之閘極端子朝第1電路群施加,並在將第丨或第 3PM0S f晶體之閘極端子設定於第i魏電壓時,可導通 第1電路群與第1或第3PM0S電晶體之閘極端子。 藉此,可阻止第2電源電壓施加於在第丨電源電壓進 行動作之第1電路群,且不會於第i電路群之構成元件施 15 加過電壓。 又,有關第18態樣之半導體裝置係在第17態樣之半 導體裝置中’該第1間極電壓控制部具有一第電 晶體,該第5PM0S電晶體係汲極端子及源極端子分別連 接於第1電路群側及第!或第3pM〇s電晶體之閑極端子 20側者。藉此,若導通第5PM〇s電晶體,第1或第咖⑽ 電晶體之閘極端子則設定於第i電源電壓,若為非導通, 設定於第1或第3PM0S電晶體之閘極端子之第2電源電 壓則不會施加於第1電路群。 又’有關第19態樣之半導體裝置係在第17態樣之半 14 1222273 玖、發明說明 5 導體裝置中’該第1閘極電壓控制部具有_第3讀⑽電 晶體,該帛3NM0S電晶體係汲極端子及源極端子分別連 接於第1電路群側及第1或第3觸S電晶體之閘極端子 倒’且間極端子連接於第! t源㈣者。藉此,即使於第 1或第3PM0S電晶體之閘極端子設定第2電源錢,施加 於第1電路群之電壓可限制在第〗電源電壓件減去第 3NM0S電晶體之閾值電壓之電壓以下,而不會於第^電路 群施加過電壓。 又,有M 2〇 H樣之半導體裝置録第ls g樣之半 ,導體裝置中,該閘極電麗控制部具有一第2間極電壓控制 部,係於第5PM0S電晶體之閘極端子設定電壓者。 有關第2G態樣之半導體裝置中,#第丨或第3ρΜ〇§ 電晶體之閘極端子設定於第2電源電壓時,可藉由第2問 極電壓控制部將第5觸s電晶體之閘極端子設定於第2 U電源電壓,並當第!或第3PM〇s電晶體之閘極端子設定 於第1電源電壓時,將第5PM0S電晶體之閘極端子設定 於低於開始導通第5PMQS f晶體之之電壓。藉此, 在第1電路群、與第i或第3PM〇s電晶體之間極端子之 間的導通控制可藉由第5PMQS t晶體進行。在此,有關 20第21態樣之半導體裝置係在第2()態樣之半導體裝置中, 開始導通之電廢宜為第1電源電壓減去相當於第5PM0S 電晶體之閾值電壓之電壓者。 又,有關第22態樣之半導體裝置係在第2〇態樣之半 導體裝置中’該第2閘極電壓控制部具有一第6PMOS電 15 1222273 玖、發明說明 晶體,該第6PM0S電晶體係源極端子及汲極端子分別連 接於第1或第3PM0S電晶體之汲極端子側及前述第 5PM0S電晶體之閘極端子側,且閘極端子連接於第1電源 電壓者。藉此,第2電源電壓為大於第1電源電壓加上第 5 6PM0S電晶體之閾值電壓之電壓時,可導通第6PM0S電 晶體,並可將第5PM0S電晶體之閘極端子設定於第2電 源電壓而為非導通。且可藉將第6PM0S電晶體之閾值電 壓加上第1或第3PM0S電晶體之閾值電壓,而可阻止第2 電源電壓由第1或第3PM0S電晶體之閘極端子朝第1電 10 路群施加。 有關第23態樣之半導體裝置係在第22態樣之半導體 裝置中,該第2閘極電壓控制部具有一第4PMOS電晶體 ,該第4PMOS電晶體係汲極端子及源極端子分別連接於 第1或第3PMOS電晶體之汲極端子側及第5PMOS電晶體 15 之閘極端子側,且閘極端子係藉前述第1或第2信號與其 同相信號來控制者。藉此,當施加於第1或第3PMOS電 晶體之汲極端子之第2電源電壓為小於第1電源電壓加上 第6PMOS電晶體之閾值電壓之電壓時,第6PMOS電晶體 為非導通。在該狀態下,由於第4NMOS電晶體為導通, 20 且施加於第5PMOS電晶體之閘極端子之電壓限制在施加 於第4NMOS電晶體之閘極端子之電壓減去閾值電壓之電 壓,因此可使第5PMSO電晶體導通。該狀態會持續至第 6PMOS電晶體導通為止,並在第6PMOS電晶體導通後為 非導通。 16 1222273 玖、發明說明 ,有關弟24態樣之半導體|置係在第23態樣之半 ,體裝置中,該第4NM0S電晶體之問極端子中,施加有 第1電源電遷或由第1電源電壓降壓之電壓。此外,有關 第25態樣之半導體裝置係在第24態樣之半導體裝置中, 更具有一電壓降壓部’係將第1或第2信號、或其同相信 號之電壓位階降壓之後輸出者。藉此,可將第ι或第2信 號、或其同相信號之較高電壓位階施加為帛1電路群之^ 作電源電壓,或可施加為由帛i電源電壓降壓之電壓。又 ’降壓電壓可透過電壓降壓部產生。 15 有關第26態樣之半導體裝置係在第2()態樣之半導體 裝置中’帛2閘極電壓控制部具有一第5NM〇s電晶體, 該第5NM0S 1:晶體係沒極端子及源極端子分別連接於第 5PM0S電晶體之閘極端子側及基準電壓,而閘極端子藉第 1或第2信號之反相信號而控制者。藉此,第1或第2作 號為低電壓位階之第i或第3PM0S電晶體不會導通,而 使第5PM0S電晶體導通。 又,有關第27態樣之半導體裝置係在第6、工8或22 怨樣之半導體裝置中,更具有一 N井電位控制部,係因應 第2電源電壓之電壓位階而設定當第2電源電壓施加於汲 2〇極端子時之第1、第3、第5及第6PM0S電晶體之N井電 位。 有關第27態樣之半導體裝置中,當第2電源電壓大於 第1電源電壓加上第2預定電壓之電壓時,可藉由n井電 位控制部將第1、第3、第5及第6PM0S電晶體之n井電 17 1222273 玖、發明說明 位設定於第2電源電壓,並在第2電源電壓小於第1電源 電壓加上第2預定電壓之電壓時,將N井電位設定於第1 電源電壓。 藉此,由於PMOS電晶體之N井電位係因應第2電源 5 電壓之電壓位階而設定適當的電壓,因此在特定的電壓位 階中,不會成為浮動之狀態。並可因應第2電源電壓之電 壓位階而設定N井電位,因此可常得安定之電路動作。 又,有關第28態樣之半導體裝置係在第27態樣之半 導體裝置中,該N井電位控制部係具有:一第8PM0S電 10 晶體,係源極端子連接於第1電源電壓,而汲極端子及後 閘極端子連接於N井者;一第9PMOS電晶體,係源極端 子係連接於第1或第3PMOS電晶體之汲極端子,而汲極 端子及後閘極端子連接於N井,且閘極端子連接於第1電 源電壓者;及一 PMOS電晶體控制部,係連接於第8PMOS 15 電晶體之閘極端子,並導通控制第8PMOS電晶體者。 有關第28態樣之半導體裝置中,當第9PMOS電晶體 之源極端子中之第2電源電壓大於第1電源電壓加上第2 預定電壓之電壓時,第9PMOS電晶體則導通且供給第2 電源電壓於N井。另一方面。第8PMOS電晶體可藉 20 PMOS電晶體控制部來控制。當第2電源電壓小於第1電 源電壓加上第2預定電壓之電壓時,第8PMOS電晶體則 導通且供給第1電源電壓於N井。 又,有關第29態樣之半導體裝置係在第28態樣之半 導體裝置中,第1電源電壓加上第2預定電壓之電壓係第 18 1222273 玖、發明說明 . ' .: .. . 9PM0S電晶體開始導通時之電壓。又,有關第3〇態樣之 半V體裝置係在第28怨樣之半導體裝置中,前述第2預定 電壓係相當於第9PM0S電晶體之閾值電壓之電壓。 藉此,第2電源電壓係第夏電源電壓加上第9pM〇s 5電晶體之閾值電壓之電壓,而N井電位係在第丨電源電壓 與第2電源電壓之間切換。 又,有關第33態樣之半導體裝置係在第6、18、或22 匕、樣之半導體裝置中’更具有一 N井電位控制部,該N井 電位控制部係將第2電源電壓施加於汲極端子時之第1、 ⑺第3、帛5及帛6PM〇s電晶體之μ電位設定於第2電源 電壓者。 有關第33態樣之半導體裝置中,當第2電源施加 於沒極端子時’可藉由Ν井電健制部將第丨、第3、第5 及第6PM0S電晶體之N井電位設定於第2電源電壓。 藉此,由於藉於PM0S電晶體之汲極端子施加第2電 源電壓’ N井電位設定於第2電源電|,因此在特定之電 壓位階中’不會成為浮動狀態。 、^ 關第34態樣之半導體裝置係在第33態樣之半 導體裝置中’前述N井電位控制部具有··一第8PM0S電 20晶體^源極端子係連接於第1電源電遷,沒極端子及後 s :山子連接於N井,^^極端子連接於第1或第3PM0S ^曰曰體之/及極端子;—帛9P刪電晶體,係源極端子連 ;A或第3PMQS電晶體之汲極端子,JL汲極端子及 1才而子連接於N井者;及—PMC)S電晶體控制部,係 19 1222273 玖、發明說明 連接於前述第9PM0S電晶體之閘極端子,並用以導通控 制第9PM0S電晶體者。 有關第34態樣之半導體裝置中,第9PM0S電晶體可 藉PMOS電晶體來控制。當於第1或第3PM0S電晶體之 5 汲極端子施加第2電源電壓時,可導通第9PM0S電晶體 且供給第2電源電壓於N井。 藉此,於第1或第3PM0S電晶體之汲極端子施加第2 電源電壓時,N井電位可於第2電源電壓變換。 又,有關第31態樣之半導體裝置係在第28態樣之半 1〇 導體裝置中,該PMOS電晶體控制部具有:一第6NMOS 電晶體,係源極端子連接於第8PMOS電晶體之閘極端子 ,汲極端子連接於第1或第3PMOS電晶體之汲極端子, 並於閘極端子施加第1電源電壓或低於第1電源電壓之預 疋電壓者,及一第10PMOS電晶體,係源極端子連接於第 15 1或第3PMOS電晶體之没極端子,沒極端子連接於前述第 8PMOS電晶體之閘極端子,閘極端子連接於前述第J電源 電壓,而後閘極端子則連接於N井者。 又,有關第35態樣之半導體裝置係在第34態樣之半 導體裝置中,該PMOS電晶體控制部具有··一第6NM〇s 20電晶體,係源極端子連接於第9PMOS電晶體之閘極端子 ,汲極端子連接於第1電源電壓,並於閘極端子施加施加 於第1或第3PMOS電晶體之汲極端子之電壓或低於該電 壓之預定電壓者;及一第10PMOS電晶體,係源極端子連 接於第1電源電壓,汲極端子連接於第9PM〇s電晶體之 20 1222273 玖、發明說明 閘極端子,閘極端子連接於第1或第3PM0S電晶體之沒 極端子,而後閘極端子則連接於N井者。 有關第31或35態樣之半導體裝置中,可藉由第 6NM0S電晶體,將令施加於第叉電源電遷或第卜第 5 3PM0S電晶體线極端子之電壓、或低於前述電壓之預定 電壓減去第6NM0S電晶體之閾值電壓之電屬為上限之電 壓,施加於第8或第9PM0S電晶體之閘極端子,且導通 第8或第9PM0S電晶體。另一方面,可藉由第i〇pM〇s 電晶體,而在第2電源電壓大於第i電源電壓加上間值電 1〇壓之電壓、或在第i電源電壓大於第2電源電壓加上闕值 電壓之電壓時,可導通第1〇PM〇S電晶體,並使第8或第 9PMOS電晶體為非導通。 又,有關第37態樣之半導體裝置係在第31或35態樣 之半導體裝置中,預定電壓以利用多數電源系統中之i個 15電源系統為佳。又,有關第38態樣之半導體裝置係在第 或35悲樣之半導體裝置中,宜具有一第2電壓降壓部 垓第2電壓降壓部係配置於第6NM〇s電晶體之閘極端 子與第1電源電壓或第1或第3PM〇s電晶體之汲極端子 之間,並使施加於第1電源電壓或第!或第3pM〇s電晶 2〇體之汲極端子之電壓位階降壓後,輸入預定電壓者。 6NMOS電晶 又,有關第32態樣之半導體裝置係在第31態樣之半 導體裝置中,或有關第36態樣之半導體裝置係在第35態 樣之半導體裝置中,該PMOS電晶體控制部更具有一第j 電壓降壓部,該第1電壓降壓部係連接於第 21 1222273 玖、發明說明 體之源極端子,並使來自該源極端子之電壓信號降壓後輸 入於第8或第9PM0S電晶體之閘極端子。 藉此,可進行第8或第9PM0S電晶體之導通控制, 且N井電位不會有浮動之狀態-此時,可於第8或第 5 9PM0S電晶體之閘極端子施加業經降壓之電壓,並可確實 地導通第8或第9PM0S電晶體。 圖式簡單說明 第1圖係顯示本發明之實施形態之電路圖。 第2圖係顯示用以防止構成位階轉換電路之PMOS電 10 晶體錯誤導通之第1方法之電路圖。 第3圖係顯示用以防止構成位階轉換電路之PMOS電 晶體錯誤導通之第2方法之電路圖。 第4圖係顯示用以防止構成位階轉換電路之PMOS電 晶體錯誤導通之第3方法之電路圖。 15 第5圖係顯示第4圖之第3方法的具體例者。 第6圖係顯示用以防止構成位階轉換電路之PMOS電 晶體錯誤導通之第4方法之電路圖。 第7圖係顯示第4方法中,PMOS電晶體PM5之閘極 端子電壓之特性者。 20 第8圖係顯示第4方法中,PMOS電晶體PM1之閘極 端子電壓之特性者。 第9圖係顯示第4方法中之N井電位控制部之第1具 體例之電路圖。 第10圖係顯示第4方法中之N井電位控制部之第2 22 1222273 玖、發明說明 具體例之電路圖。 第11圖係顯示第1及第2具體例之n井電位控制部 之井電位之切換者。 第12圖係顯示第4方法中之N井電位控制部之第3 5 具體例之電路圖。 第13圖係顯示第3具體例之N井電位控制部之井電 位之切換者。 第14圖係顯示實施形態之位階轉換電路中,用以驅動 NMOS電晶體NM51之低壓側之位階轉換部之電路圖。 ) 第15圖係顯示習知技術之位階轉換電路之電路圖。 I[實施方式3 發明實施之最佳形態 以下,就本發明之半導體裝置根據第丨圖至第14圖並 參照圖式詳細說明已具體化之實施形態。 第1圖係顯示有關適用本發明之半導體裝置之實施形 怨。包含有·一第1電路群3,係對基準電壓νπ供給第 1電源電壓VDD1且進行動作者;及一第2電路群5,係對 基準電壓VSS供給具有較第1電源電壓VDD還高之電壓 位階之第2電源電壓且進行動作者。 第1電路群3係要求高速之處理速度之電路部分。且 為適用於進行高機能化、高速化之電子機器領域之控制或 運算處理等之適合的電路部分。為了要實現高機能性、高 速性,一般係藉微細化進步之程序科技而實現。因此,反 向器閘131所例示之第1電路群3之構成元件係要求低電 23 玖、發明說明 壓動作m電源電壓VDD1則係適合該規格之低電源 Y…“構成第1電路群3之元件只要在低電源電壓之第1 S原電G VDD1中確保耐壓即可,而與第1電源電塵 VDD1相比,對於高電壓之第2電源電壓vDD2則不能確 保耐壓。此時,不能對這些元件施加第2 f源電M VDD2 電路群5係藉較南電源電壓之第2電源電壓 侧2進仃動作之電路部分。且,係適用於在既存之電源 電[體系中進打動作之機器等之控制部分、及預定電壓中 10進订動作之其他元件、裝置等之控制或驅動等之電路。這 些電路部份巾,與視高機能化及高速化為必要之第1電源 電[VDD1不同電壓值之第2電源電>1 VDD2係必要的。 •第2電源電壓VDD2與第1電源電壓VDD1相比為高 圖係顯示第1電路群3中具有第1電源電 之振巾田之輸入信號IN當作第2電路群5中具有| 電源電壓VDD2夕@ as β μ , 八 之振巾田之輸出信號0UT輸出之情況。在 輸4號IN在第i電路群3中,為進行控制處理及運 202 ′ And it is possible to control the i-th or 3rd PMOS transistor non-conductively without being stuck on the difference between the output voltage of the P transistor or the second and fourth PMOS transistor. Regarding the semiconductor devices of the 15th and 16th aspects, the semiconductor device of the 16th aspect is the electrical waste of the 14th aspect of the 1st power supply plus 1V of voltage. 13 Description of the invention 'It is preferable that the 1st or 3PM0S transistor The voltage when the drain terminal is turned on to the first power supply voltage side. At this time, the first predetermined voltage should be a voltage corresponding to the threshold voltage of the first or third PMOS transistor. The semiconductor device according to the seventeenth aspect is a half-conductor device of the fourteenth aspect, and the gate voltage control unit is provided between the first circuit group and the gate terminal of the first or third PM0S transistor. . In the 17th aspect of the semiconductor device, when the gate terminal of the i-th or 3PM0S transistor is set to the second power supply voltage, the first gate electronic control unit can prevent the second power supply voltage from being changed by the When the gate terminal of the 3pm0s 10 transistor is applied to the first circuit group, and when the gate terminal of the third or third PM0S f crystal is set to the i-th voltage, the first circuit group and the first or Gate terminal of the 3PM0S transistor. This prevents the second power supply voltage from being applied to the first circuit group operating at the first power supply voltage, and does not apply an overvoltage to the constituent elements of the i-th circuit group. The semiconductor device according to the eighteenth aspect is the semiconductor device according to the seventeenth aspect. The first inter-electrode voltage control unit has a first transistor, and the 5PM0S transistor system has a drain terminal and a source terminal connected respectively On the first circuit group side and the first! Or the 20th side of the free terminal of the 3pM0s transistor. Therefore, if the 5PM transistor is turned on, the gate terminal of the first or third transistor is set to the i-th power supply voltage. If it is non-conducting, it is set to the gate terminal of the first or 3PM0S transistor. The second power supply voltage is not applied to the first circuit group. "The semiconductor device of the 19th aspect is in the half of the 17th aspect 14 1222273", Invention Description 5 Conductor Device "The first gate voltage control unit has a _third read transistor, and the 3NM0S power The drain terminal and source terminal of the crystal system are connected to the side of the first circuit group and the gate terminal of the first or third S-transistor, respectively, and the intermediate terminal is connected to the first! tSource㈣ 者. With this, even if the second power source is set at the gate terminal of the first or third PM0S transistor, the voltage applied to the first circuit group can be limited to a voltage less than the threshold voltage of the third power source voltage element minus the threshold voltage of the 3NM0S transistor. Without overvoltage applied to the ^ th circuit group. In addition, there is a semiconductor device of the type M 2 0H recorded in the first half of the sample. In the conductor device, the gate electrode control section has a second inter-electrode voltage control section, which is connected to the gate terminal of the 5PM0S transistor. Set the voltage. In the semiconductor device related to the 2G aspect, when the gate terminal of the ## 丨 or 3ρΜ〇§ transistor is set to the second power supply voltage, the 5th transistor can be contacted by the second interrogator voltage control unit. The gate terminal is set at the 2 U power supply voltage and becomes the first! Or, when the gate terminal of the 3PM0s transistor is set to the first power supply voltage, the gate terminal of the 5PM0S transistor is set to a voltage lower than the voltage at which the 5PMQS f crystal starts to be turned on. Thereby, the conduction control between the terminals of the first circuit group and the i-th or 3 PM-transistor can be performed by the 5th PMQS t crystal. Here, the semiconductor device of the 20th and 21st aspects is the semiconductor device of the 2nd () aspect, and the electrical waste that starts to be turned on should be the voltage of the first power supply minus the threshold voltage of the 5PM0S transistor. . In addition, the semiconductor device according to the 22nd aspect is the semiconductor device according to the 20th aspect. The second gate voltage control unit includes a sixth PMOS power 15 1222273. A crystal of the invention, and a source of the 6PM0S transistor system. The terminal and the drain terminal are respectively connected to the drain terminal side of the first or 3PM0S transistor and the gate terminal side of the aforementioned 5PM0S transistor, and the gate terminal is connected to the first power supply voltage. Therefore, when the second power supply voltage is greater than the first power supply voltage plus the threshold voltage of the 5th 6PM0S transistor, the 6PM0S transistor can be turned on, and the gate terminal of the 5PM0S transistor can be set to the second power source. Voltage is non-conducting. And by adding the threshold voltage of the 6PM0S transistor to the threshold voltage of the 1 or 3PM0S transistor, the second power supply voltage can be prevented from going from the gate terminal of the 1 or 3PM0S transistor to the 10th circuit group of the 1st transistor Apply. The semiconductor device according to the twenty-third aspect is the semiconductor device according to the twenty-second aspect. The second gate voltage control unit has a fourth PMOS transistor, and the drain terminal and the source terminal of the fourth PMOS transistor system are respectively connected to The drain terminal side of the first or third PMOS transistor and the gate electrode side of the fifth PMOS transistor 15 are controlled by the aforementioned first or second signal and its in-phase signal. Accordingly, when the second power supply voltage applied to the drain terminal of the first or third PMOS transistor is a voltage smaller than the first power supply voltage plus the threshold voltage of the sixth PMOS transistor, the sixth PMOS transistor is non-conductive. In this state, since the 4NMOS transistor is on, 20 and the voltage applied to the gate terminal of the 5PMOS transistor is limited to the voltage applied to the gate terminal of the 4NMOS transistor minus the threshold voltage. Turn on the 5th PMSO transistor. This state continues until the 6th PMOS transistor is turned on, and becomes non-conductive after the 6th PMOS transistor is turned on. 16 1222273 发明. Description of the invention. The semiconductor in the 24th aspect | is placed in the half of the 23rd aspect. In the body device, the first power source of the 4NM0S transistor is applied with the first power transfer or the first 1 The voltage at which the supply voltage drops. In addition, the semiconductor device according to the twenty-fifth aspect is a semiconductor device according to the twenty-fourth aspect, and further includes a voltage step-down section, which outputs the voltage level of the first or second signal or its in-phase signal after being stepped down. By. Thereby, the higher voltage level of the first or second signal or its in-phase signal can be applied as the power supply voltage of the 帛 1 circuit group, or it can be applied as a voltage stepped down by the 电源 i power supply voltage. The step-down voltage can be generated through the voltage step-down section. 15 The semiconductor device according to the twenty-sixth aspect is the semiconductor device according to the second () aspect. The gate voltage control unit of the second aspect has a 5NMOS transistor, and the 5NMOS 1 has no terminals and sources. The terminals are respectively connected to the gate terminal side of the 5PM0S transistor and the reference voltage, and the gate terminal is controlled by the inverted signal of the first or second signal. Thereby, the i-th or the third PM0S transistor whose first or second operation is a low voltage level will not be turned on, and the fifth PM0S transistor will be turned on. In addition, the semiconductor device of the 27th aspect is the semiconductor device of the 6th, 8th, or 22nd aspect, and there is an N-well potential control unit, which is set as the second power source according to the voltage level of the second power source voltage. The N-well potential of the 1st, 3rd, 5th, and 6th PMOS transistor when the voltage is applied to the 20 terminal. In the twenty-seventh aspect of the semiconductor device, when the second power source voltage is greater than the first power source voltage plus the second predetermined voltage, the nth, third, fifth, and sixth PM0S can be controlled by the n-well potential control unit. The n-well power of the transistor 17 1222273 玖, the description of the invention is set to the second power supply voltage, and when the second power supply voltage is less than the first power supply voltage plus a second predetermined voltage, the N-well potential is set to the first power supply Voltage. Accordingly, since the potential of the N-well of the PMOS transistor is set to an appropriate voltage in accordance with the voltage level of the second power source 5 voltage, it does not become a floating state in a specific voltage level. The potential of the N-well can be set according to the voltage level of the second power supply voltage, so that the stable circuit can always be operated. The semiconductor device according to the twenty-eighth aspect is the semiconductor device according to the twenty-seventh aspect. The N-well potential control unit has an eighth PM0S electric 10 crystal. The source terminal is connected to the first power supply voltage, and The ninth terminal and the rear gate terminal are connected to the N well; a 9PMOS transistor, the source terminal is connected to the drain terminal of the first or third PMOS transistor, and the drain terminal and the rear gate terminal are connected to N And the gate terminal is connected to the first power supply voltage; and a PMOS transistor control section is connected to the gate terminal of the 8th PMOS 15 transistor and conducts control of the 8th PMOS transistor. In the twenty-eighth aspect of the semiconductor device, when the second power supply voltage in the source terminal of the ninth PMOS transistor is greater than the first power supply voltage plus a second predetermined voltage, the ninth PMOS transistor is turned on and supplied to the second The power supply voltage is in the N well. on the other hand. The 8th PMOS transistor can be controlled by the 20 PMOS transistor control section. When the second power source voltage is less than the first power source voltage plus the second predetermined voltage, the eighth PMOS transistor is turned on and the first power source voltage is supplied to the N-well. The semiconductor device according to the twenty-ninth aspect is the semiconductor device according to the twenty-eighth aspect. The voltage of the first power supply voltage plus the second predetermined voltage is eighteenth 1222273. 发明, Description of the invention...... 9PM0S 电The voltage at which the crystal starts to conduct. The semi-V body device in the 30th aspect is the semiconductor device in the 28th aspect, and the second predetermined voltage is a voltage equivalent to the threshold voltage of the 9PM0S transistor. Thereby, the second power supply voltage is the voltage of the first summer power supply voltage plus the threshold voltage of the 9 pM0s 5 transistor, and the N-well potential is switched between the first power supply voltage and the second power supply voltage. In addition, the semiconductor device according to the 33rd aspect is the semiconductor device of the 6, 18, or 22 d. The semiconductor device has an N-well potential control unit that applies a second power supply voltage to the The μ potential of the first, ⑺3, 35, and 帛 6PM0s transistors when the terminal is drained is set to the second power supply voltage. In the semiconductor device according to the 33rd aspect, when the second power source is applied to the non-polar terminal, the N-well potential of the third, third, fifth, and sixth PM0S transistors can be set to 2nd power supply voltage. Accordingly, since the second power supply voltage 'is applied to the second power supply voltage through the drain terminal of the PMOS transistor, the specific voltage level' does not become a floating state. ^ The semiconductor device of the 34th aspect is in the semiconductor device of the 33rd aspect. The aforementioned N-well potential control unit has an 8PM0S electric 20 crystal ^ source terminal connected to the first power source, Extreme terminal and rear s: Shanzi is connected to N well, ^^ extreme terminal is connected to the 1st or 3PM0S ^ said the body and / or the extreme terminal; 帛 9P delete the transistor, the source terminal is connected; A or 3PMQS The drain terminal of the transistor, the JL drain terminal and the first terminal are connected to the N well; and-PMC) S transistor control unit, 19 1222273 玖, the description of the invention is connected to the gate terminal of the aforementioned 9PM0S transistor And used to turn on and control the 9PM0S transistor. In the semiconductor device of the 34th aspect, the 9PM0S transistor can be controlled by a PMOS transistor. When the second power supply voltage is applied to the 5th drain terminal of the first or third PM0S transistor, the 9PM0S transistor can be turned on and the second power supply voltage can be supplied to the N well. Thereby, when the second power source voltage is applied to the drain terminal of the first or third PMOS transistor, the potential of the N-well can be converted to the second power source voltage. In addition, the semiconductor device according to the 31st aspect is the half 10th conductor device of the 28th aspect, and the PMOS transistor control section has a 6NMOS transistor, and the source terminal is connected to the gate of the 8th PMOS transistor. A terminal connected to the drain terminal of the first or the third PMOS transistor, and the gate terminal is applied with the first power supply voltage or a pre-voltage that is lower than the first power supply voltage, and a tenth PMOS transistor, The source terminal is connected to the 15th or 3rd PMOS transistor, the non-terminal is connected to the gate terminal of the aforementioned 8th PMOS transistor, the gate terminal is connected to the aforementioned J-th power supply voltage, and the rear gate terminal is Connected to N well. The semiconductor device according to the thirty-fifth aspect is the semiconductor device according to the thirty-fourth aspect. The PMOS transistor control section has a 6NMs 20 transistor, and the source terminal is connected to the ninth PMOS transistor. A gate terminal whose drain terminal is connected to the first power supply voltage, and a voltage applied to the drain terminal of the first or third PMOS transistor or a predetermined voltage lower than the voltage is applied to the gate terminal; and a 10th PMOS voltage Crystal, the source terminal is connected to the first power supply voltage, the drain terminal is connected to the 20PM of the 9PM transistor. 晶体, the description of the invention, the gate terminal, the gate terminal is connected to the first terminal of the 3PM0S transistor Terminal, and the rear gate terminal is connected to the N well. In the semiconductor device of the 31st or 35th aspect, the 6NM0S transistor can be used to cause the voltage applied to the terminal of the fork power supply or the 5th 3PM0S transistor line terminal, or a predetermined voltage lower than the aforementioned voltage. The voltage minus the threshold voltage of the 6NM0S transistor is the upper limit voltage, it is applied to the gate terminal of the 8th or 9PM0S transistor, and the 8th or 9PM0S transistor is turned on. On the other hand, by using the i0pM0s transistor, the voltage of the second power supply voltage greater than the i-th power supply voltage plus the intervening voltage of 10 or the i-th power supply voltage greater than the second power supply voltage plus When the voltage of the upper threshold voltage is turned on, the 10 PMOS transistor can be turned on, and the 8 or 9 PMOS transistor can be turned off. The semiconductor device according to the thirty-seventh aspect is the semiconductor device according to the thirty-first or thirty-fifth aspect, and the predetermined voltage is preferably the i 15 power supply system among most power supply systems. The semiconductor device according to the thirty-eighth aspect is a semiconductor device according to the thirty-third or thirty-fifth aspect, and it is preferable to have a second voltage step-down portion. The second voltage step-down portion is arranged at the gate end of the 6NM transistor. And the drain terminal of the first power supply voltage or the first or the third PMMOS transistor, and applied to the first power supply voltage or the first! Or, after the voltage level of the drain terminal of the 3pM0s transistor 20 is lowered, a predetermined voltage is input. 6NMOS transistor, the semiconductor device related to the 32nd aspect is included in the semiconductor device according to the 31st aspect, or the semiconductor device related to the 36th aspect is included in the semiconductor device according to the 35th aspect, the PMOS transistor control unit It also has a j-th voltage step-down section. The first voltage step-down section is connected to the source terminal of the 21st, 2222273th, invention description body, and the voltage signal from the source terminal is stepped down and input to the 8th. Or the gate terminal of the 9PM0S transistor. Thereby, the conduction control of the 8th or 9PM0S transistor can be performed, and the potential of the N well will not be in a floating state. At this time, the step-down voltage can be applied to the gate terminal of the 8th or 5th 9PM0S transistor. And can reliably turn on the 8th or 9PM0S transistor. Brief Description of the Drawings Fig. 1 is a circuit diagram showing an embodiment of the present invention. Fig. 2 is a circuit diagram showing the first method for preventing the PMOS crystal 10 constituting the level conversion circuit from being turned on incorrectly. Fig. 3 is a circuit diagram showing a second method for preventing erroneous conduction of the PMOS transistor constituting the level conversion circuit. Fig. 4 is a circuit diagram showing a third method for preventing erroneous conduction of the PMOS transistor constituting the level conversion circuit. 15 Figure 5 shows a specific example of the third method in Figure 4. Fig. 6 is a circuit diagram showing a fourth method for preventing erroneous conduction of the PMOS transistor constituting the level conversion circuit. Fig. 7 shows the characteristics of the gate terminal voltage of the PMOS transistor PM5 in the fourth method. 20 Figure 8 shows the characteristics of the gate terminal voltage of the PMOS transistor PM1 in the fourth method. Fig. 9 is a circuit diagram showing a first specific example of the N-well potential control section in the fourth method. Fig. 10 is a circuit diagram showing a specific example of the 22nd 2222273 of the N-well potential control unit in the fourth method, a description of the invention. Fig. 11 shows the switchover of the well potential of the n-well potential control unit of the first and second specific examples. Fig. 12 is a circuit diagram showing a 35th specific example of the N-well potential control section in the fourth method. Fig. 13 shows a switchover of the well potential of the N-well potential control section of the third specific example. Fig. 14 is a circuit diagram showing a level conversion section for driving the low-voltage side of the NMOS transistor NM51 in the level conversion circuit of the embodiment. ) FIG. 15 is a circuit diagram showing a level conversion circuit of the conventional technology. I [Embodiment 3 Best Mode for Carrying Out the Invention] A detailed description will be given below of a semiconductor device according to the present invention with reference to the drawings, and referring to the drawings. Fig. 1 is a diagram showing the implementation of a semiconductor device to which the present invention is applied. Contains a first circuit group 3 that supplies the first power supply voltage VDD1 to the reference voltage νπ and operates; and a second circuit group 5 that supplies the reference voltage VSS that is higher than the first power supply voltage VDD. The second power supply voltage of the voltage level is an operator. The first circuit group 3 is a circuit portion requiring high-speed processing speed. In addition, it is a suitable circuit part suitable for high-performance and high-speed electronic equipment control or arithmetic processing. In order to achieve high performance and high speed, it is generally realized by fine-grained and advanced program technology. Therefore, the components of the first circuit group 3 exemplified by the inverter gate 131 are required to have a low power of 23 发明. The invention explains that the voltage operation m power supply voltage VDD1 is a low power supply Y suitable for this specification ... "constitutes the first circuit group 3 The components only need to ensure the withstand voltage in the first S primary power G VDD1 of the low power supply voltage, and compared with the first power supply dust VDD1, the high voltage of the second power supply voltage vDD2 cannot ensure the withstand voltage. At this time, The 2nd source power M VDD2 circuit group 5 cannot be applied to these components. It is a part of the circuit that operates on the second power supply voltage side 2 which is lower than the south power supply voltage. Moreover, it is applicable to the existing power supply system. The control part of the moving machine, etc., and other elements, devices, etc. of the predetermined voltage in the predetermined voltage control or drive circuits. These circuit parts are necessary for the high-performance and high-speed operation of the first power supply. [The second power supply of different voltage values of VDD1> 1 VDD2 is necessary. • The second power supply voltage VDD2 is higher than the first power supply voltage VDD1. The figure shows that the first circuit group 3 has the first power supply. The input signal IN of the vibration field is taken as the second circuit group 5 There | power supply voltage VDD2 Xi @ as β μ, eight of the output signal of the transducer towel 0UT output fields in the input IN of No. 4 in the i-th circuit group 3, for the treatment and control operation 20.
處理等之結果信號。又,輸出信號OUT就如此朝半導體 置,外口 P輸出,而成為其他元件或裝置之驅動信號或控 之情況之外,亦可考慮當作« 2電路群5之輸入 號0 — 〜训八卟,刀、你具有 吟似峋丁, 第2電源電壓VDn? Μ & r« υΕ>2作為鬲壓側轉換器之PMOS 1 24 1222273 玖、發明說明 PM51、及一源極端子連接於基準電壓VSS作為低壓側轉 換器之NMOS電晶體NM51。由後述之位階轉換電路1輸 入信號於個別之閘極端子後,進行排他性地轉換控制。 PMOS電晶體PM51及NMOS電晶體NM51個別的汲極端 5 子係當作輸出%子OUT且連接於兩者之波極端子互相連接 之PMOS/NMOS 電晶體 PM/NM52之源極端子。 PMOS/NMOS電晶體PM52/NM52之閘極端子係連接於第1 電源電壓VDD1。 PMOS/NMOS 電晶體 PM52/NM52 係分別在 10 PMOS/NMOS電晶體PM51/NM51導通時導通。此時,非 導通之NMOS/PMOS電晶體NM52/PM52係於個別之汲極 端子施加第2電源電壓VDD2/基準電壓VSS並成為飽和特 性之偏壓狀態。因此,NMOS/PMOS電晶體NM51/PM51 之汲極端子中,分別由第1電源電壓VDD1施加NMOS電 15 晶體NM52之閾值電壓較低之電壓/由第1電源電壓VDD1 施加PMOS電晶體PM52之閾值電壓較高之電壓。藉此, 對基準電壓VSS施加第2電源電壓VDD2之第2電路群5 中,亦於 PMOS/NMOS 電晶體 PM51、52/NM51、52 只施 加第2電源電壓VDD2與第1電源電壓VDD1之間之差電 20 壓/第1電源電壓VDD1之電壓。 藉此,供給具有較高電壓值之第2電源電壓VDD2之 第2電路群5中亦可利用低耐壓電晶體構成。 再者,雖然實施形態中顯示耐壓確保用之電晶體係以 1段之PMOS/NMOS電晶體PM52/NM52構成之形態,但 25 1222273 玖、發明說明 亦可作成2段以上之多段構造。該形態宜構造成可適當地 調整施加於各MOS電晶體之閘極端子之電壓,且階段性地 轉換施加電壓。藉作成多段構造,在供給更高電壓之第2 電源電壓VDD2時,亦可利用低耐壓之電晶體構成電路。 5 設於第1電路群3與第2電路群5之間,並由第1電 源電壓VDD1往第2電源電壓VDD2進行信號之位階轉換 之電路係位階轉換電路1。 位階轉換電路1中,用以驅動控制高壓側轉換器之 PMOS電晶體PM51之閘極端子之電路係當作高壓側之仅 10 階轉換部4,且由4個PMOS電晶體PM1至PM4所構成 。PMOS電晶體PM1、PM3、及PM2、PM4之源極端子係 分別連接於第1電源電壓VDD1、及第2電源電壓VDD2 。PMOS電晶體PM4之閘極端子係連接於pM〇s電晶體 PM1及PM2之汲極端子,同時也連接於PM〇s電晶體 15 PM51之閘極端子(節點N3)。又,PM〇s電晶體pM2之閘 極子連接於PMOS電晶體PM3及PM4之沒極端子(節點 N4)。更進一步,PM〇s電晶體pM1之閘極端子(節點ni) 係連接於反向器閘131之輸出節點N1,而PMOS電晶體 PM3之閘極端子(節點N2)係連接於輸人信號以。 2〇 此外,用以驅動控制低壓側轉換器之NMOS電晶體 pm51之閘極端子之信號係相對於輸人信號IN而為業經變 換電壓位階之信號。且,由後述(第14圖)之低壓側之位階 轉換部6輸出。 輸入彳。唬IN為具有第1電源電壓VDD1之電壓位階 26 1222273 玖、發明說明 : ; ' - ·. - ;.. ‘ ‘ - ;; . . 之高位階信號時,節點N1藉反向器閘131成為具有基準電 壓VSS之電壓位階之低位階。輸入信號IN係朝PM〇s電 晶體PM3之閘極端子(節點N2)輸入,並供給第1電源電壓 VDD1於閘極端子。節點N1係連接於PMOS電晶體PM1 5之閘極端子(節點N1),且供給基準電壓VSS於閘極端子。 由於PMOS電晶體PM1之源極端子係連接於第1電源電壓 VDD1,因此PMOS電晶體PM1導通。 藉由PMOS電晶體PM1之導通,第1電源電壓VDD1 可供給至連接有其汲極端子之節點N3,並供給至PMOS電 10晶體PM4、PM51之閘極端子。由於PMOS電晶體PM4、 PM51之源極端子連接於第2電源電壓VDD2,因此在 PMOS電晶體PM4、PM51之閘極·源極端子之間會施加 第1及第2電源電壓VDD1、VDD2之電壓差。因此,以 第1及第2電源電壓VDD1、VDD2之電壓差大於PMOS 15 電晶體PM4、PM51之閾值電壓為條件,PMOS電晶體 PM4、PM51可導通。 藉由PMOS電晶體PM4之導通,可供給第2電源電壓 VDD2至連接其汲極端子之節點N4。藉此,PMOS電晶體 PM2為非導通,且第2電源電壓VDD2不會連接於透過 20 PMOS電晶體PM1供給第1電源電壓VDD1之節點N3。 又,由於節點N4係連接於PMOS電晶體PM3之汲極端子 ,因此PMOS電晶體PM3成為供給第1電源電壓VDD1至 閘極端子(節點N2),並供給第2電源電壓VDD2於汲極端 子之狀態。且,在閘極·汲極端子之間施加第1及第2電 27 1222273 玖、發明說, 源電壓VDD1、VDD2之電壓差。因此,以第1及第2電 源電壓VDD1、VDD2之電壓差小於PMOS電晶體PM3之 閾值電壓為條件,PMOS電晶體PM3為非導通。且第1電 源電壓VDD1不會連接於透過PMOS電晶體PM4供給第2 5 電源電壓VDD2之節點N4。 輸入信號IN為具有基準電壓VSS之電壓位階之低位 階信號時,施加之電壓位階會反轉而成為與前述相反之動 作狀態。 即,於閘極端子施加基準電壓VSS且導通PMOS電晶 10 體PM3,藉此,可於閘極端子施加第1電源電壓VDD1且 導通PMOS電晶體PM2。在此,第1及第2電源電壓 VDD1、VDD2之電壓差係大於PMOS電晶體PM2之閾值 電壓。由於供給第2電源電壓VDD2至節點N3,因此 PMOS電晶體PM4、PM51為非導通。藉此,第2電源電 15 壓VDD2不會供給至輸出端子OUT,而第2電源電壓 VDD2亦不會連接於透過PMOS電晶體PM3供給第1電源 電壓VDD1之節點N4。 又,於閘極·沒極端子之間施加第1及第2電源電壓 VDD1、VDD2之電壓差之PMOS電晶體PM1係以第1及 20 第2電源電壓VDD、VDD2之電壓差小於閾值電壓為條件 而為非導通。藉此,第1電源電壓VDD1不會連接於透過 PMOS電晶體PM2供給第2電源電壓VDD2之節點N3。 另一方面,NMOS電晶體NM51係藉由後述之(第14 圖)低壓側之位階轉換部6將與輸入信號IN同相之信號供 28 1222273 玖、發明說明義^… 給至閘極端子,而與PMOS電晶體PM51進行排他性之導 通控制。 藉PMOS電晶體PM51導通,可將第2電源電壓 VDD2供給於其汲極端子。若PMOS電晶體PM52亦具有 5 相同閾值電壓則可導通,並可供給第2電源電壓VDD2於 輸出端子OUT。在此,由於NMOS電晶體NM51為非導通 ,故可輸出具有第2電源電壓VDD2之電壓位階之輸出信 號 OUT。 在PMOS電晶體PM51為非導通之情況下,則導通 10 NMOS電晶體NM51,並供給基準電壓VSS於其汲極端子 。而NMOS電晶體NM52亦同樣地導通,並供給基準電壓 VSS於輸出端子OUT。 實施形態所示之位階轉換電路1中,若根據高壓側之 位階轉換部4,則由於第1電源電壓VDD1與第2電源電 15 壓VDD2之間的電壓差大於PMOS電晶體PM2、PM4、 PM51、PM52之閾值電壓,因此若藉第i及第2電源電壓 VDD1、VDD2控制閘極端子,則可作為導通及非導通。且 ,可藉PMOS電晶體輕易構成位階轉換部4。 當為了導通控制PMOS電晶體PM51,而將在基準電 2〇 壓VSS與第1電源電壓vDDl之間振盪之輸入信號IN進 行位階轉換成在第1電源電壓VDD1與第2電源電壓 VDD2之間振盪之信號時,則不會形成由第2電源電壓 VDD2往第1電源電壓VDD1之穩定的電流路徑。而且, 具有第1電源電壓VDD1與第2電源電壓VOD2之間的中 29 1222273 玖、發明說明 間電壓位階之第3電源電壓為非必要,也沒有伴隨著第i 及第2電源電壓VDD1、VDD2之分壓的經常性電流消耗Result signal of processing and so on. In addition, the output signal OUT is set to the semiconductor in this way, and the external port P is output, and becomes the driving signal or control of other components or devices. In addition, it can also be considered as the input number 0 of «2 circuit group 5 — ~ training eight Porch, knife, and you have the same power, VDn? Μ & r «υΕ > 2 PMOS 1 24 1222273 as a voltage-side converter, description of the invention PM51, and a source terminal connected to the reference The voltage VSS is used as the NMOS transistor NM51 of the low-side converter. After the signal is input to the individual gate terminals by the level conversion circuit 1 described later, exclusive conversion control is performed. The individual drain terminals of the PMOS transistor PM51 and NMOS transistor NM51 are used as the source terminals of the PMOS / NMOS transistor PM / NM52, which are output terminals and the wave terminals connected to the two are connected to each other. The gate terminal of the PMOS / NMOS transistor PM52 / NM52 is connected to the first power supply voltage VDD1. PMOS / NMOS transistors PM52 / NM52 are turned on when 10 PMOS / NMOS transistors PM51 / NM51 are turned on. At this time, the non-conducting NMOS / PMOS transistors NM52 / PM52 are biased to saturation characteristics by applying a second power supply voltage VDD2 / reference voltage VSS to individual drain terminals. Therefore, among the drain terminals of the NMOS / PMOS transistor NM51 / PM51, the voltage of the lower threshold voltage of the NMOS transistor 15 is applied by the first power supply voltage VDD1, and the threshold of the PMOS transistor PM52 is applied by the first power supply voltage VDD1. Higher voltage. Therefore, in the second circuit group 5 in which the second power supply voltage VDD2 is applied to the reference voltage VSS, only the second power supply voltage VDD2 and the first power supply voltage VDD1 are applied to the PMOS / NMOS transistors PM51, 52 / NM51, and 52. The difference is 20 volts / the voltage of the first power supply voltage VDD1. As a result, the second circuit group 5 that supplies the second power supply voltage VDD2 having a relatively high voltage value can also be configured using a low-withstand voltage crystal. Furthermore, although the transistor system used for ensuring the withstand voltage is shown in the embodiment as a one-stage PMOS / NMOS transistor PM52 / NM52, 25 1222273 发明, description of the invention can also be made into a multi-stage structure with two or more stages. This form should be structured such that the voltage applied to the gate terminals of the MOS transistors can be appropriately adjusted and the applied voltage can be switched in stages. By adopting a multi-stage structure, when a second power supply voltage VDD2 of a higher voltage is supplied, a circuit with a low withstand voltage can also be used. 5 is a level conversion circuit 1 which is provided between the first circuit group 3 and the second circuit group 5 and performs level conversion of a signal from the first power supply voltage VDD1 to the second power supply voltage VDD2. In the level conversion circuit 1, the circuit for driving and controlling the gate terminal of the PMOS transistor PM51 of the high-side converter is regarded as only the 10-stage conversion section 4 on the high-side, and is composed of four PMOS transistors PM1 to PM4. . The source terminals of the PMOS transistors PM1, PM3, and PM2 and PM4 are connected to the first power supply voltage VDD1 and the second power supply voltage VDD2, respectively. The gate terminal of the PMOS transistor PM4 is connected to the drain terminals of the pMOS transistor PM1 and PM2, and is also connected to the gate terminal of the PMMOS transistor 15 PM51 (node N3). The gate of the PMMOS transistor pM2 is connected to the terminals (node N4) of the PMOS transistors PM3 and PM4. Furthermore, the gate terminal (node ni) of the PMMOS transistor pM1 is connected to the output node N1 of the inverter gate 131, and the gate terminal (node N2) of the PMOS transistor PM3 is connected to the input signal to . 2 In addition, the signal used to drive the gate terminal of the NMOS transistor pm51, which is used to control the low-side converter, is a signal that has undergone a change in voltage level relative to the input signal IN. Then, it is output from the low-level-side level conversion section 6 (see Fig. 14). Enter 彳. F1 is the voltage level 26 with the first power supply voltage VDD1 26 1222273 发明, description of the invention:; '-·.-; ..' '-;;.., Node N1 by inverter gate 131 becomes The lower level with the voltage level of the reference voltage VSS. The input signal IN is input to the gate terminal (node N2) of the PM3 transistor PM3, and a first power supply voltage VDD1 is supplied to the gate terminal. The node N1 is connected to the gate terminal (node N1) of the PMOS transistor PM1 5 and supplies a reference voltage VSS to the gate terminal. Since the source terminal of the PMOS transistor PM1 is connected to the first power supply voltage VDD1, the PMOS transistor PM1 is turned on. By turning on the PMOS transistor PM1, the first power supply voltage VDD1 can be supplied to the node N3 connected to its drain terminal, and to the gate terminals of the PMOS transistor PM4 and PM51. Since the source terminals of the PMOS transistors PM4 and PM51 are connected to the second power supply voltage VDD2, the first and second power supply voltages VDD1 and VDD2 are applied between the gate and source terminals of the PMOS transistors PM4 and PM51. difference. Therefore, on the condition that the voltage difference between the first and second power supply voltages VDD1 and VDD2 is larger than the threshold voltages of the PMOS 15 transistors PM4 and PM51, the PMOS transistors PM4 and PM51 can be turned on. By turning on the PMOS transistor PM4, the second power supply voltage VDD2 can be supplied to the node N4 connected to its drain terminal. As a result, the PMOS transistor PM2 is non-conductive, and the second power supply voltage VDD2 is not connected to the node N3 that supplies the first power supply voltage VDD1 through the 20 PMOS transistor PM1. In addition, since the node N4 is connected to the drain terminal of the PMOS transistor PM3, the PMOS transistor PM3 becomes the first power supply voltage VDD1 to the gate terminal (node N2), and the second power supply voltage VDD2 is supplied to the drain terminal. status. In addition, the first and second electrical voltages are applied between the gate and drain terminals. 27 1222273 (invention), the voltage difference between the source voltages VDD1 and VDD2. Therefore, on the condition that the voltage difference between the first and second power supply voltages VDD1 and VDD2 is smaller than the threshold voltage of the PMOS transistor PM3, the PMOS transistor PM3 is non-conductive. In addition, the first power supply voltage VDD1 is not connected to the node N4 that supplies the second 5 power supply voltage VDD2 through the PMOS transistor PM4. When the input signal IN is a low-level signal having a voltage level of the reference voltage VSS, the applied voltage level is reversed and becomes an operation state opposite to the foregoing. That is, the reference voltage VSS is applied to the gate terminal and the PMOS transistor PM3 is turned on, whereby the first power supply voltage VDD1 can be applied to the gate terminal and the PMOS transistor PM2 is turned on. Here, the voltage difference between the first and second power supply voltages VDD1 and VDD2 is larger than the threshold voltage of the PMOS transistor PM2. Since the second power supply voltage VDD2 is supplied to the node N3, the PMOS transistors PM4 and PM51 are non-conductive. Thereby, the second power supply voltage VDD2 will not be supplied to the output terminal OUT, and the second power supply voltage VDD2 will not be connected to the node N4 that supplies the first power supply voltage VDD1 through the PMOS transistor PM3. In addition, the PMOS transistor PM1 that applies the voltage difference between the first and second power supply voltages VDD1 and VDD2 between the gate and the non-terminals is based on the voltage difference between the first and 20 second power supply voltages VDD and VDD2 being less than the threshold voltage as Condition is non-conducting. Thereby, the first power supply voltage VDD1 is not connected to the node N3 which is supplied with the second power supply voltage VDD2 through the PMOS transistor PM2. On the other hand, the NMOS transistor NM51 supplies the signal in the same phase as the input signal IN to the gate terminal 12 through the low-level step conversion section 6 described later (Fig. 14). Exclusive conduction control with PMOS transistor PM51. By turning on the PMOS transistor PM51, the second power supply voltage VDD2 can be supplied to its drain terminal. If the PMOS transistor PM52 also has the same threshold voltage, it can be turned on, and a second power supply voltage VDD2 can be supplied to the output terminal OUT. Here, since the NMOS transistor NM51 is non-conducting, an output signal OUT having a voltage level of the second power supply voltage VDD2 can be output. In the case where the PMOS transistor PM51 is non-conducting, the 10 NMOS transistor NM51 is turned on, and a reference voltage VSS is supplied to its drain terminal. The NMOS transistor NM52 is also turned on in the same manner, and a reference voltage VSS is supplied to the output terminal OUT. In the level conversion circuit 1 shown in the embodiment, if the level conversion section 4 on the high voltage side is used, the voltage difference between the first power supply voltage VDD1 and the second power supply voltage 15 VDD2 is larger than the PMOS transistors PM2, PM4, and PM51. , PM52 threshold voltage, so if the gate terminal is controlled by the i and second power supply voltages VDD1, VDD2, it can be used as conducting and non-conducting. Moreover, the level conversion section 4 can be easily constituted by a PMOS transistor. In order to turn on and control the PMOS transistor PM51, the input signal IN that oscillates between the reference voltage 20 VSS and the first power supply voltage vDD1 is level-converted to oscillate between the first power supply voltage VDD1 and the second power supply voltage VDD2. When the signal is transmitted, a stable current path from the second power supply voltage VDD2 to the first power supply voltage VDD1 is not formed. In addition, the middle power supply voltage between the first power supply voltage VDD1 and the second power supply voltage VOD2 is 29 1222273. The third power supply voltage of the voltage range of the invention is not necessary, and it is not accompanied by the i and second power supply voltages VDD1 and VDD2. Recurrent current consumption
又,由於並非是對基準電壓VSS而是在第1電源電壓 5 VDD1與第2電源電壓VDD2之間構成電路,因此施加之 電壓差係第1及第2電源電壓VDD1、VDD2之間的電壓 差。為第1至第4PM0S電晶體之PMOS電晶體PM1至 PM4之電晶體不須確保第2電源電壓VDD2之耐壓,而可 由低耐壓之元件構成。In addition, since the circuit is formed between the first power supply voltage 5 VDD1 and the second power supply voltage VDD2 instead of the reference voltage VSS, the applied voltage difference is the voltage difference between the first and second power supply voltages VDD1 and VDD2. . The PMOS transistors PM1 to PM4, which are the first to fourth PM0S transistors, do not need to ensure the withstand voltage of the second power supply voltage VDD2, and can be composed of low withstand voltage components.
10 更進一步,為第2電路群5之輸入段之PMOS/NMOS10 Further, PMOS / NMOS for the input section of the second circuit group 5
電晶體PM51/NM51中,·設有 PMOS/NMOS電晶體 PM52/NM52作為供耐壓確保用之電晶體,且各電晶體 PM51、52/NM51、52中,只施加第2電源電壓VDD2與第 1電源電壓VDD1之差電壓/第1電源電壓VDD1之電壓, 15 而可由低耐壓之元件構成。 在這些低耐壓之MOS電晶體中,閘極氧化膜厚亦較薄 ,而可達到電路動作之高速化。 在此,當導通PMOS電晶體PM2或PM4且於節點N3 或節點4供給第2電源電壓VDD2時,必須藉PMOS電晶 2〇 體PM1或PM3來切斷由節點N3或N4往第1電源電壓 VDD1之路徑。如下說明作為該方法之第1至第4方法。 第2圖係顯示第1方法。即PMOS電晶體PM1、PM3 係由與PMOS電晶體PM2、PM4、PM51、PM52相異之構 造的電晶體所構成之形態。非導通地控制PMOS電晶體 30 1222273 玖、發明說明 PM1或PM3時,一般係藉來自第1電路群3之信號於閘極 端子中施加第1電源電壓VDD1。為了要切斷施加於汲極 端子之第2電源電壓VDD2,PMOS電晶體PM1、PM3之 閾值電壓則必須當作較第1及第2電源電壓VDD1、VDD2 5 之電壓差還高之閾值電壓。只要由具有較高之閾值電壓之 電晶體代替構成PMOS電晶體之PM2、PM4、PM51、 PM52之電晶體所構成即可。 第3圖係顯示第2方法。即PMOS電晶體PM1、PM3 係由與PMOS電晶體PM2、PM4、PM51、PM52相同之電 10 晶體所構成之形態。PMOS電晶體PM1、PM3之閘極端子( 節點Nl、N2)中,連接有電壓位階之轉換電路LS。來自第 1電路群3之信號係透過轉換電路LS輸入至閘極端子。非 導通地控制PMOS電晶體PM1、PM3時,則供給高於第1 電源電壓VDD1之電壓位階VH之信號於閘極端子。若設 15 定轉換電路LS以使第2電源電壓VDD2與電壓位階VH 之間的電壓差小於閾值電壓,則可在於汲極端子施加第2 電源電壓VDD2時,非導通地維持PMOS電晶體PM1、 PM3。 第4圖係顯示第3方法。第3方法係在PMOS電晶體 20 PM1與PM2之間/PM3與PM4之間,配置有NMOS電晶 體NM1/NM2之構造。PMOS電晶體PM1/PM3之汲極端子 係連接於NMOS電晶體NM1/NM2之源極端子(節點 3A/4A),而PMOS電晶體PM2/PM4之汲極端子係連接於 NMOS電晶體NM1/NM2之汲極端子(節點3/4)。共通地供 31 1222273 玖、發明說明 給預定偏電壓VG於NMOS電晶體NM1、NM2之閘極端 子。除了偏壓電壓VB直接地供給之外,亦可作成透過電 壓降壓部7供給之構造。 電壓降壓部7係如第5圖所示之構造。在第2電源電 5 壓VDD2與NMOS電晶體NM1、NM2之閘極端子之間, 配置有以預定段數連接以二極體連接之NMOS電晶體之降 壓部71。第2電源電壓VDD2降低由降壓部71降低之降 壓電壓VDN後則供給於閘極端子(VG=VDD2 — VDN)。 除了降壓部71之外,只要為如接合二極體或電阻元件等可 10 進行降壓或分壓之構造即可適用,更進一步亦可作成將這 些適當組合之構造。 回到第4圖說明具體之動作。PMOS電晶體PM1導通 時,供給第1電源電壓VDD1於節點3A。此時之NNi〇S 電晶體NM1之閘極端子電壓VG則必須是加上第1電源電 15壓VDD1後為在NMOS電晶體NM1之閾值電壓VthNl以 上之電壓(VG — VDD1 ^ VthNl)。藉此,NMOS電晶艨 NM1則導通並供給第1電源電壓VDD於節點3。藉此, PMOS電晶體PM4、PM51可導通。 PMOS電晶體PM1為非導通時,節點3中則透過 20 PM〇s電晶體PM2供給第2電源電壓VDD2。此時’ NMOS電晶體NM1係在飽和領域中進行動作。於節點3A 則有由閘極端子電壓VG減去閾值電壓VthNl之電壓 -VthNl)供給。為了要使PM〇s電晶體pM1維持在非導通 ’則要求供給至節點3A之電壓(VG — VthNl)與供給多 32 1222273 玖、發明1明 PMOS電晶體PM1之閘極端子(節點N1)之第1電源電壓 VDD1之間的電壓差要小於PMOS電晶體PM1之閾值電壓 VthPl ( (VG—VthNl) —VVD1< VthPl)。 PMOS電晶體PM3與NMOS電晶體NM2亦進行相同 5 之動作。 根據第4圖之方法(3),若滿足Among the transistors PM51 / NM51, PMOS / NMOS transistors PM52 / NM52 are provided as transistors for ensuring withstand voltage, and only the second power supply voltage VDD2 and the first are applied to each of the transistors PM51, 52 / NM51, and 52. The difference between the 1 power supply voltage VDD1 / the voltage of the first power supply voltage VDD1, 15 can be composed of a low withstand voltage device. Among these low-withstand voltage MOS transistors, the gate oxide film thickness is also thinner, and the circuit operation can be accelerated. Here, when the PMOS transistor PM2 or PM4 is turned on and the second power supply voltage VDD2 is supplied at the node N3 or node 4, the PMOS transistor 20 body PM1 or PM3 must be used to cut off the node N3 or N4 to the first power supply voltage. The path of VDD1. The first to fourth methods of this method will be described below. Figure 2 shows the first method. That is, the PMOS transistors PM1 and PM3 are formed by transistors different from the PMOS transistors PM2, PM4, PM51, and PM52. Non-Conductive Control of PMOS Transistor 30 1222273 发明, Description of Invention In the case of PM1 or PM3, the first power supply voltage VDD1 is generally applied to the gate terminal by a signal from the first circuit group 3. In order to cut off the second power supply voltage VDD2 applied to the drain terminal, the threshold voltages of the PMOS transistors PM1 and PM3 must be regarded as a threshold voltage higher than the voltage difference between the first and second power supply voltages VDD1 and VDD2 5. As long as a transistor having a higher threshold voltage is used instead of the transistors PM2, PM4, PM51, PM52 constituting the PMOS transistor, it is sufficient. Figure 3 shows the second method. That is, the PMOS transistors PM1 and PM3 are composed of the same transistors as the PMOS transistors PM2, PM4, PM51, and PM52. To the gate terminals (nodes N1, N2) of the PMOS transistors PM1 and PM3, a voltage level conversion circuit LS is connected. The signal from the first circuit group 3 is input to the gate terminal through the conversion circuit LS. When the PMOS transistors PM1 and PM3 are non-conductively controlled, a signal of a voltage level VH higher than the first power supply voltage VDD1 is supplied to the gate terminal. If 15 switching circuits LS are set so that the voltage difference between the second power supply voltage VDD2 and the voltage level VH is smaller than the threshold voltage, the PMOS transistor PM1 can be maintained non-conductively when the second power supply voltage VDD2 is applied to the drain terminal. PM3. Figure 4 shows the third method. The third method is a structure in which NMOS transistors NM1 / NM2 are arranged between the PMOS transistor 20 between PM1 and PM2 / between PM3 and PM4. The drain terminal of the PMOS transistor PM1 / PM3 is connected to the source terminal of the NMOS transistor NM1 / NM2 (node 3A / 4A), and the drain terminal of the PMOS transistor PM2 / PM4 is connected to the NMOS transistor NM1 / NM2. Drain terminal (node 3/4). Common supply 31 1222273 玖, description of the invention Give a predetermined bias voltage VG to the gate terminals of the NMOS transistors NM1, NM2. Instead of supplying the bias voltage VB directly, a structure in which the bias voltage VB is supplied through the voltage step-down section 7 may be used. The voltage step-down section 7 has a structure as shown in FIG. 5. Between the second power supply voltage VDD2 and the gate terminals of the NMOS transistors NM1 and NM2, a step-down portion 71 connected to the NMOS transistor connected by a diode in a predetermined number of stages is arranged. The second power supply voltage VDD2 is supplied to the gate terminal (VG = VDD2 — VDN) when the step-down voltage VDN lowered by the step-down section 71 is reduced. In addition to the voltage reduction section 71, a structure capable of reducing or dividing the voltage, such as bonding a diode or a resistance element, can be applied, and a structure in which these are appropriately combined can also be used. Returning to Fig. 4, the specific operation will be described. When the PMOS transistor PM1 is turned on, the first power supply voltage VDD1 is supplied to the node 3A. At this time, the gate terminal voltage VG of the NNi0S transistor NM1 must be a voltage higher than the threshold voltage VthNl of the NMOS transistor NM1 (VG — VDD1 ^ VthNl) after the first power supply voltage VDD1 is added. Accordingly, the NMOS transistor NM1 is turned on and supplies the first power supply voltage VDD to the node 3. With this, the PMOS transistors PM4 and PM51 can be turned on. When the PMOS transistor PM1 is non-conducting, the second power supply voltage VDD2 is supplied to the node 3 through the 20 PM 0s transistor PM2. At this time, the 'NMOS transistor NM1 operates in the saturation region. At the node 3A, a voltage -VthNl) is subtracted from the gate terminal voltage VG minus the threshold voltage VthNl). In order to keep the PM0s transistor pM1 in a non-conducting state, it is required to supply a voltage (VG — VthNl) to the node 3A and a supply voltage of 32 1222273 玖. Invention of the PMOS transistor PM1 gate terminal (node N1) The voltage difference between the first power supply voltage VDD1 is smaller than the threshold voltage VthPl ((VG-VthNl) -VVD1 < VthPl) of the PMOS transistor PM1. PMOS transistor PM3 and NMOS transistor NM2 also perform the same operation. According to the method (3) in Figure 4, if
VthNl ^ VG- VDD1 < VthPl + VthNl ...(1) (VthN2 ^ VG — VDD1 < VthP3 + VthN2) 之條件,則可控制PMOS電晶體PM1、PM3之導通、非導 10 通。上述之條件(1)係 偏電壓VB為第2電源電壓VDD2,且作為閘極端子 VG直接施加時(VG=VDD2),係 VthN 1 S VDD2 — VDD1 < VthP 1 + VthN 1。 第2電源電壓VDD2透過降壓電壓部71接受降壓電壓 15 VDN之降壓且作為閘極端子施加時(VG= VDD2 —VDN), 則為VthNl ^ VG- VDD1 < VthPl + VthNl ... (1) (VthN2 ^ VG — VDD1 < VthP3 + VthN2) can control the conduction and non-conduction of PMOS transistors PM1 and PM3. The above condition (1) is that the bias voltage VB is the second power supply voltage VDD2, and when directly applied as the gate terminal VG (VG = VDD2), it is VthN 1 S VDD2 — VDD1 < VthP 1 + VthN 1. When the second power supply voltage VDD2 receives a step-down voltage of 15 VDN through the step-down voltage section 71 and is applied as a gate terminal (VG = VDD2-VDN), it is
VthN 1 + VDN $ VDD2 — VDD1 < VthP 1 + VthN 1 + VDN。 更進一步,若有第1及第2電源電壓VDD1、VDD2 以外之其他電壓源時,亦可考慮使用其他電壓源。 20 在此,藉使用電壓降壓部71或其他電壓源,若可將閘 極端子電壓VG設定較低,則可使用具有較低閾值電壓 VthNl之NMOS電晶體。且可擴大可適用作為NMOS電晶 體NM1、NM2之電晶體的種類。 PMOS電晶體PM1、PM3為非導通時,則有由第1電 33 1222273 玖、發明說明 源電壓VDD1降壓之電壓供給於PMOS電晶體PM1或 PM3。具有與PMOS電晶體PM2、PM4、PM51相同閾值 電壓而構成PMOS電晶體PM1、PM3時,亦可將PMOS電 晶體PM1、PM3控制為非導通。VthN 1 + VDN $ VDD2 — VDD1 < VthP 1 + VthN 1 + VDN. Furthermore, if there are voltage sources other than the first and second power supply voltages VDD1 and VDD2, other voltage sources may be considered. 20 Here, by using the voltage step-down section 71 or other voltage source, if the gate terminal voltage VG can be set lower, an NMOS transistor with a lower threshold voltage VthNl can be used. In addition, the types of transistors that can be used as the NMOS transistors NM1 and NM2 can be expanded. When the PMOS transistors PM1 and PM3 are non-conducting, a voltage stepped down by the first transistor 33 1222273 发明, description of the invention is supplied to the PMOS transistor PM1 or PM3. When the PMOS transistors PM1 and PM3 have the same threshold voltage as the PMOS transistors PM2, PM4, and PM51, the PMOS transistors PM1 and PM3 can be controlled to be non-conductive.
5 又,第1至第3方法中任一者之情況若具有比PMOS 電晶體PM2、PM4、PM51之閾值電壓還高之閾值電壓而 構成PMOS電晶體PM1、PM3,則可輕易進行PMOS電晶 體PM1、PM3之非導通之控制。尤其,具有NMOS電晶體 NM1、NM2時,可將偏電壓VB之電壓範圍更加擴大。 1〇 第6圖顯示第4方法,即,因應供給至PMOS電晶體 PM1、PM3之汲極端子之電壓來控制閘極端子之電壓之構 造。組合之後亦進行N井電位之調整。PMOS電晶體PM1 、PM3可分別具有相同之電路構造。 首先,說明閘極電壓控制部11。在PMOS電晶體PM1 15 之閘極端子(節點N1A)與汲極端子(節點N3)之間,連接有 閘極端子連接於第1電源電壓VDD1之PMOS電晶體PM7 。第2電源電壓VDD2之閾值電壓高於第1電源電壓 VDD1時,具有供給第2電源電壓VDD2於PMOS電晶體 PM1之閘極端子(節點N1A),且使PMOS電晶體PM1維持 2〇 在非導通之機能。 又,來自第1電路群之信號透過PMOS/NMOS電晶體 PM5/NM3輸入至PMOS電晶體PM1之閘極端子(節點 N1A)。NMOS電晶體NM3之閘極端子係連接有第1電源 電壓VDD1。PMOS電晶體PM5之閘極端子(節點N11)係 34 1222273 玖、發明說明 透過第1電源電壓VDD1連接於閘極端子之PMOS電晶體 PM6、與於閘極端子(節點N13)輸入來自第1電路群之信號 或其同相信號之NMOS電晶體NM4,而連接於PMOS電 晶體PM1之〉及極端子(節點N3)。 5 在此,NM〇S電晶體NM4之閘極端子(節點N13)中, 除了輸入具有第1電源電壓VDD1之高位階信號之外,亦 可考慮輸入透過降壓電路B11降壓之信號作為第1電路群 之信號。 再者,閘極端子(節點Nil)係透過NMOS電晶體NM5 10 連接於基準電壓VSS。NMOS電晶體NM5之閘極端子中, 來自第1電路群之信號係藉反向器閘IU反轉而輸入。 來自第1電路群之信號為低位階時,信號必須透過 PMOS/NMOS電晶體PM5/NM3供給至PMOS電晶體PM1 之閘極端子(節點N1A)。就NMOS電晶體NM3而言,由 15 於閘極端子連接於第1電源電壓VDD1,因此輸入之信號 相對於第1電源電壓VDD1若為NMOS電晶體NM3之閾 值電壓以下之電壓位階則可導通。 就PMOS電晶體PM5而言,閘極端子係透過 PMOS/NMOS電晶體PM6/NM4而連接於節點N3。就 20 NMOS電晶體NM4而言,由於在閘極端子輸入低位階之信 號而為非導通。PMOS電晶體PM6亦藉閘極端子連接於第 1電源電壓VDD、與節點N3隨著PMOS電晶體PM1之導 通而於第1電源電壓VDD1移行而成為非導通,然後來自 卽點N3之路徑被切斷。相對於此,NMOS電晶體NM5中 35 1222273 玖、發明說明 ,由於輸入業經在閘極端子反轉之高位階信號而導通。藉 此,PMOS電晶體PM5亦導通。且於節點N1A供給低位 階之信號,並導通PMOS電晶體PM1。 來自第1電路群之信號為低位階時,節點N3之電壓 5 位階可藉PMOS電晶體PM2之導通而上昇至第2電源電壓 VDD2。 第7、8圖顯示相對於供給於節點N3之第2電源電壓 VDD2之電壓位階,節點N1A、節點Nl 1之電壓位階之特 性。在此,由於NMOS電晶體NM5係供給低位階電壓於 10 閘極端子故為非導通。又,PMOS電晶體PM1、PM6、 PM7則係具有相同閾值電壓VthP者。且,以供給第1電 源電壓VDD1之電壓位階於節點N13者作說明。 若節點N3之電壓V(N3)小於第1電源電壓VDD1加 上PMOS電晶體PM6之閾值電壓VthP之電壓(V(N3)< 15 VDD +VthP),PMOS電晶體PM6為非導通時,NMOS電 晶體NM4在飽和領域導通。因此,於節點Nil供給第1 電源電壓VDD1減去NMOS電晶體NM4之閾值電壓VthN 之電壓(V(N11) = VDD1 —VthN)(第7圖之⑴)。在此,若 NMOS電晶體NM4具有較PMOS電晶體PM5還深之閾值 20 電壓VthN,PMOS電晶體PM5則導通。5 In the case of any of the first to third methods, if the PMOS transistors PM1 and PM3 are formed with threshold voltages higher than the threshold voltages of the PMOS transistors PM2, PM4, and PM51, the PMOS transistors can be easily performed. Non-conduction control of PM1 and PM3. In particular, when the NMOS transistors NM1 and NM2 are provided, the voltage range of the bias voltage VB can be further expanded. 10 Fig. 6 shows the fourth method, that is, the construction of controlling the voltage of the gate terminals in response to the voltages supplied to the drain terminals of the PMOS transistors PM1 and PM3. After the combination, the potential of the N well was adjusted. The PMOS transistors PM1 and PM3 can each have the same circuit structure. First, the gate voltage control unit 11 will be described. Between the gate terminal (node N1A) and the drain terminal (node N3) of the PMOS transistor PM1 15, a PMOS transistor PM7 having a gate terminal connected to the first power supply voltage VDD1 is connected. When the threshold voltage of the second power supply voltage VDD2 is higher than the first power supply voltage VDD1, it has a gate terminal (node N1A) that supplies the second power supply voltage VDD2 to the PMOS transistor PM1, and keeps the PMOS transistor PM1 at 20 to be non-conductive Function. The signal from the first circuit group is input to the gate terminal (node N1A) of the PMOS transistor PM1 through the PMOS / NMOS transistor PM5 / NM3. The gate terminal of the NMOS transistor NM3 is connected to a first power supply voltage VDD1. The gate terminal (node N11) of the PMOS transistor PM5 is 34 1222273. Description of the invention The PMOS transistor PM6 connected to the gate terminal through the first power supply voltage VDD1 and the input to the gate terminal (node N13) are from the first circuit. The NMOS transistor NM4 of the group signal or its in-phase signal is connected to the PMOS transistor PM1 and its terminal (node N3). 5 Here, in addition to the input of the high-level signal having the first power supply voltage VDD1 in the gate terminal (node N13) of the NMOS transistor NM4, it is also considered to input the signal stepped down by the step-down circuit B11 as the first Signal of 1 circuit group. The gate terminal (node Nil) is connected to the reference voltage VSS through the NMOS transistor NM5 10. In the gate terminal of the NMOS transistor NM5, the signal from the first circuit group is input by the inverter gate IU inversion. When the signal from the first circuit group is at a low level, the signal must be supplied to the gate terminal (node N1A) of the PMOS transistor PM1 through the PMOS / NMOS transistor PM5 / NM3. For the NMOS transistor NM3, the gate terminal is connected to the first power supply voltage VDD1, so the input signal can be turned on if the voltage level below the threshold voltage of the NMOS transistor NM3 is relative to the first power supply voltage VDD1. For PMOS transistor PM5, the gate terminal is connected to node N3 through PMOS / NMOS transistor PM6 / NM4. As for the 20 NMOS transistor NM4, it is non-conducting because a low-level signal is input to the gate terminal. The PMOS transistor PM6 is also connected to the first power supply voltage VDD through the gate terminal, and the node N3 moves to the first power supply voltage VDD1 and becomes non-conductive as the PMOS transistor PM1 is turned on, and then the path from the point N3 is cut. Off. In contrast, the NMOS transistor NM5 35 1222273 玖, invention description, because the input industry is turned on by the high-level signal inverted at the gate terminal. As a result, the PMOS transistor PM5 is also turned on. A low-level signal is supplied to the node N1A, and the PMOS transistor PM1 is turned on. When the signal from the first circuit group is at a low level, the voltage of the node N3 at the 5 level can be raised to the second power supply voltage VDD2 by the conduction of the PMOS transistor PM2. Figures 7 and 8 show the characteristics of the voltage level of the node N1A and the node N11 with respect to the voltage level of the second power supply voltage VDD2 supplied to the node N3. Here, the NMOS transistor NM5 is non-conducting because it supplies a low-level voltage to the 10 gate terminal. In addition, the PMOS transistors PM1, PM6, and PM7 are those having the same threshold voltage VthP. In addition, a description will be given assuming that the voltage level of the first power supply voltage VDD1 is at the node N13. If the voltage V (N3) of the node N3 is less than the voltage of the first power supply voltage VDD1 plus the threshold voltage VthP of the PMOS transistor PM6 (V (N3) < 15 VDD + VthP), when the PMOS transistor PM6 is non-conducting, NMOS The transistor NM4 is turned on in the saturation region. Therefore, the node Nil is supplied with the first power supply voltage VDD1 minus the threshold voltage VthN of the NMOS transistor NM4 (V (N11) = VDD1-VthN) (⑴ in Fig. 7). Here, if the NMOS transistor NM4 has a threshold voltage VthN that is deeper than the PMOS transistor PM5, the PMOS transistor PM5 is turned on.
上述之說明中,雖已以供給第1電源電壓VDD1作為 節點N13之電壓V(N13)作說明,但電壓V(N13)亦可當作 透過降壓電路B11降壓之電壓。此時,節點Nil會供給降 壓更低之電壓(V(N13) — VthN )(第7圖之(II)),與PMOS 36 1222273 玖、發明說明 電晶體PM5之閾值電壓相比,NMOS電晶體NM4之閾值 電壓為相同或較低時,亦可使PMOS電晶體PM5導通。 又’ PMOS電晶體PM7亦為非導通,且不會有供給於 節點N3之第2電源電壓VDD供給至節點N1A。 5 因此,於PMOS電晶體PM1之閘極端子(節點N1A), 則透過PMOS電晶體PM5由第1電路群供給高位階之信號 。通常,該信號係具有第1電源電壓VDD1之電壓位階(第 8圖)。PMOS電晶體PM1施加於閘極•汲極端子之間的電 壓差係小於閾值電壓而維持在非導通。且不會形成由節點 10 N3往第1電源電壓VDD1之電流路徑。 若節點N3之電壓V(N3)在第1電源電壓VDD加上 PMOS電晶體PM6之閾值電壓VthP之電壓以上(v(N3)g VDD + VthP),PMOS電晶體PM6則施加在閾值電壓VthP 以上之電壓且加以導通,而節點Nl 1則與節點N3導通 15 (V(N11) = V(N3))(第7圖)。電壓V(N11)則成為第2電源電 壓VDD2,且PMOS電晶體M5則成為非導通。另一方面 ,具有相同閾值電壓VthP之PMOS電晶體PM7則導通, 而節點N1A則與節點N3導通(V(N1A) = V(N3))(第8圖) 。電壓V(N1 A)則成為第2電源電壓VDD2。PMOS電晶體 2〇 PM1之閘極端子與汲極端子為相同電位且維持在非導通。 且不會有由節點N3往第1電源電壓VDD1之電流路徑形 如上所述,若根據第4方法中之閘極電壓控制部11( 第6圖),當PMOS電晶體PM1(PM3)為非導通時,即使於 37 1222273 玖、發明說明 汲極端子(節點N3(N4))直接施加第2電源電壓VDD2 ,亦 可因應相對於第1電源電壓VDD1之第2電源電壓VDD2 之電壓值,切換成施加於閘極端子(節點N1A)之電壓,而 PMOS電晶體PM1(PM3)則維持在非導通。且不會有由汲 5 極端子(節點N3(N4))朝第1電源電壓VDD1之不需要的電 流路徑形成,而可防止不需要之電流消耗。施加於閘極端 子(節點N1A)之電壓之切換係,若使PMOS電晶體PM6、 PM7之閾值電壓VthP與PMOS電晶體PM1(PM3)相同,則 藉由汲極端子(節點N3(N4))之電壓,可使PMOS電晶體 10 PM1(PM3)以由汲極端子開始導通至第1電源電壓側的電壓 來進行切換。 又,PMOS電晶體PM1(PM3)之非導通之維持係與 PMOS 電晶體 PM1(PM3)及 PMOS 電晶體 PM2、PM4、 PM51之閾值電壓之異同無關而可安定地進行。 15 來自第1電路群之信號之節點N1A之傳播控制係可藉 PMOS電晶體PM5之導通控制來進行。供給至節點N1A 之第2電源電壓VDD2不會藉使PMOS電晶體PM5為非導 通而施加於第1電路群。更進一步,藉NMOS電晶體NM3 之飽和領域動作,施加於第1電路群之電壓則限制於第1 20 電源電壓VDD1減去閾值電壓之電壓而不會施加過電壓。 其次,說明N井電位限制部9。如第6圖所示,位階 轉換電路1中,高壓側之位階轉換部4及閘極電壓控制部 11之電源電壓係第1電源電壓VDD1,一般N井電位亦使 第1電源電壓進行偏壓。然而,PMOS電晶體PM1(PM3) 38 1222273 玖、I明說明 . 、PM5至7在供給第2電源電壓VDD2至Nia時,由於 第1電源電壓VDD1與第2電源電壓VDD2之間的電壓差 ,故會有順方向電流由p型之汲極端子向N井Nw透過業 經順偏壓之接面流動。為了避免該流動,必須控制n井電 5 位。 第9圖所示之第1具體例之N井電位控制部9a具有 :一 PMOS電晶體PM8A,係源極端子連接於第丨電源電 壓VDD1,汲極端子及後閘極端子連接於N井Nw者;及 一 PMOS電晶體PM9A,係源極端子連接於閘極端子, 10汲極端子及後閘極端子連接於N井NW,且閘極端子連接 於第1電源電壓VDD1者。 PMOS電晶體PM8A係精連接於閘極端子(節點pi)之 PMOS電晶體控制部而控制導通、非導通。 PMOS電晶體控制部具有NMOS電晶體NM6A、 15 PMOS電晶體PM10A,而且視需要設置第1電壓降壓部91 。NMOS電晶體NM6A係,汲極端子連接於節點N3、源 極端子透過第1電壓降壓部91連接於PMOS電晶體PM8A 之閘極端子(節點P1 )、閘極端子則連接於第1電源電壓 VDD1。PMOS電晶體PM10A係,源極端子連接節點N3、 20 汲極端子連接PMOS電晶體PM8A之閘極端子、後閘極端 子連接於N井NW,閘極端子則連接於第1電源電壓 VDD1 ° 第1電壓降壓部91係將來自NMOS電晶體NM6A之 源極端子之電壓降壓,然後供給至PMOS電晶體PM8A之 39 1222273 玖、發明說明 閘極端子(節點P1)。 第9圖係顯示合併第1電壓降壓部91之具體例。具體 例(A)係串聯預定數量之二極體進行降壓。藉適當地設定二 極體之預定數量,在導通PMOS電晶體PM8A時,則供給 5 第1電源電壓VDD1減去閾值電壓之電壓以下之電壓至 PMOS電晶體PM8A之閘極端子(節點P1)。具體例(B)係藉 電阻元件將NMOS電晶體NM6A之源極端子之電壓進行分 壓。若適當地設定分壓比,則可供給第1電源電壓VDD1 減去閾值電壓之電壓以下之電壓於PMOS電晶體PM8 A之 10 閘極端子(節點P1)。 第10圖所示之第2具體例之N井電位控制部9B係有 關PMOS電晶體控制部,且設有第2電壓降壓部92以取 代第1具體例9A(第9圖)之第1電壓降壓部91。 PMOS電晶體控制部中,NMOS電晶體NM6B係源極 15 端子直接連接於PMOS電晶體PM8B之閘極端子(節點P1) ,同時閘極端子透過第2電壓降壓部92而連接於第1電源 電壓VDD1。 第2電壓降壓部92係將第1電源電壓VDD1進行降壓 ,且將NMOS電晶體NM6B之閘極端子進行偏壓。藉此, 20 可輸出業經於NMOS電晶體NM6B之源極端子適當地降壓 之電壓,並供給至節點P1。 第10圖所示之第2電壓降壓部92之具體例係與第1 電壓降壓部91之具體例相同。藉串聯預定數量之二極體( 具體例(A)),又藉由電阻元件將第1電源電壓VDD1進行 40 1222273 玖、發明說明 分壓(具體例(B))而可得到業經降壓之電壓。 第11圖顯示在N井電位控制部9A、9B(第9、10圖) 中’對於節點N3之電壓γ(Ν3),N井NW之電位V(NW) 之切換波形與PMOS電晶體PM8A之閘極端子電壓V(P1) 5 。第11圖中,則舉NMOS/PMOS電晶體之閾值電壓略為 相等之情況(VthN与Vthp)為例。 電壓V(N3)若在第i電源電壓VDD1加上閾值電壓 VthP 之電壓以上(V(V3) ^ vdDI + VthP),PMOS 電晶體 PM10A、PM10B則導通,且使電壓ν(Ρ1)進行偏壓成電壓 10 V(N3),並當作第2電源電壓VDD2,而PMOS電晶體 PM8A、PM8B則為非導通。另一方面,PMOS電晶體 PM9A、PM9B為導通,且N井電位V(NW)成為電壓 V(N3)。即,成為第2電源電壓VDD2。 電壓V(N3)若降壓成小於第1電源電壓VDD1加上閾 15 值電壓 VthP 之電壓時(V(N3)<VDDl + VthP),貝J PMOS 電晶體PM9A、PM10A、PM9B、PM10B為非導通。另一 方面,NMOS電晶體NM6A、NM6B則導通。 在電壓V(N3)降壓成NMOS電晶體NM6A、NM6B之 閘極端子之電壓減去閾值電壓VthN之電壓之前,由於 20 NMOS電晶體NM6A、NM6B進行飽和動作,因此源極端 子之電壓則大略固定成由閘極端子之電壓減去閾值電壓 VthN之電壓。若再降壓,NMOS電晶體NM6A、NM6B會 進行線形動作而導通,而電壓V(N3)則照常輸出至NMOS 電晶體NM6A、NM6B之源極端子。 41 1222273 玖、發明說明 • ' - . , ' 在此,供給於NMOS電晶體NM6A、NM6B之閘極端 子之電壓係第1電源電壓VDD1(第9圖)、或由第1電源電 壓VDD1降壓之電壓(第1〇圖)。該電壓係直接地(第10圖) 或進行降壓後(第9圖),供給於PMOS電晶體PM8A、 5 PM8B之閘極端子(節點P1)。沒有第1及第2降壓部91、 92時,則以第1電源電壓VDD1減去NMOS電晶體NM6A 、NM6B之閾值電壓VthN之電壓為上限,且設定節點P1 之電壓V(P1)。 NMOS電晶體NM6A、NM6B與PMOS電晶體PM8A 10 、PM8B之閾值電壓略為相等時,PMOS電晶體PM8A、 PM8B之閘極·源極之間的電位差會施加在閾值電壓VthP 以上,且導通而供給第1電源電壓VDD1於N井NW。 又,即使NMOS電晶體NM6A、NM6B與PMOS電晶 體PM8A、PM8B之閾值電壓相異時,亦可藉設有第1或 15 第2電壓降壓部91、92中至少一方,而可充分地使節點 P1之電壓V(P1)進行降壓,且使PMOS電晶體PM8A、 PM8B導通。 第12圖所示之第3具體例之N井電位控制部9C在第 1、第2具體例9A、9B(第9、10圖)中,係藉PMOS電晶 20 體控制部來控制PMOS電晶體PM8A、PM8B,並使PMOS 電晶體PM9A、PM9B之閘極端子連接於第1電源電壓 VDD1之連接關係為反相之構造。即,使NMOS電晶體 NM6C及PMOS電晶體PM10C設於PMOS電晶體PM9C 之閘極端子(節點P2)與第1電源電壓VDD1之間,並將 42 1222273 玖、發明說明 NMOS電晶體NM6C之閘極端子連接於節點N3。又, PMOS電晶體PM8C、PM10C之閘極端子係連接於節點N3 。此時,第1電壓降壓部91、第2電壓降壓部92可作成 與第1、第2具體例9A、9B相同之連接。即,第1電壓 5 降壓部91可設於NMOS電晶體NM6C與節點P2之間。第 2電壓降壓部92係可連接於NMOS電晶體NM6C之閘極 端子與節點N3之間。 有關第3具體例9C,係於第13圖顯示表示對於電壓 V(N3)之N井電位V(NW)及節點P2之電壓V(P2)之關係之 10 波形。未設置第1、第2電壓降壓部91、92時,電壓 V(N3)係小於第1電源電壓VDD1加上閾值電壓VthN之電 壓,且NMOS電晶體NM6C進行飽和動作。PMOS電晶體 PM9C之閘極端子(節點P2)之電壓V(P2)係供給電壓V(N3) 減去閾值電壓VthN之電壓。在NMOS/PMOS之兩閾值電 15 壓略為相等(VthN与VthP)之條件下,PMOS電晶體PM9C 則導通,且令N井電位V(NW)為電壓V(N3)。由於此時之 電壓V(N3)為第2電源電壓VDD2,因此N井電位V(NW) 亦為第2電源電壓VDD2。 當電壓V(N3)大於第1電源電壓VDD1加上閾值電壓 20 VthN之電壓時,NMOS電晶體NM6C係進行線形動作。 且,供給第1電源電壓VDD1至PMOS電晶體PM9C之閘 極端子(節點P2)。然後PMOS電晶體PM9C則導通,且供 給電壓V(N3),即第2電源電壓VDD2至N井NW。 再者,由於設置第1、第2電壓降壓部91、92時之作 43 1222273 玖、發明_明 ^ ^ ^ ^ y 用·效果與第1、第2具體例9A、9B之情況相同,因此 以下省略說明。在此,若根據由第1電壓降壓部91降下電 壓之效果,電壓V(N3)為大於第1電源電壓VDD1加上閾 值電壓VthN之電壓者的情況下,將電壓V(P2)設定在業經 5 由第1電源電壓VDD1透過第1電壓降壓部91降壓之電壓 位階(第13圖、(II)),且,若根據由第2電壓降壓部92降 下電壓之效果,則電壓V(P2)係設定在第1電源電壓VDD1 減去業經由第2電壓降壓部降壓之電壓位階且再減去閾值 電壓VthN之電壓位階(第13圖、(I))。 10 如以上所述,根據N井電位控制部之第1、第2具體 例(第9、10圖)、及第3具體例(第12圖),若設置第1電 壓降壓部91,則可使由NMOS電晶體NM6A至NM6C之 源極端子輸出之電壓降壓。 若設置第2電壓降壓部92,在NMOS電晶體NM6A 15 至NM6C中,可使施加於閘極端子之預定電壓由第1電源 電壓VDD1降壓,並可使進行飽和動作之源極端子之電壓 值進行降壓。 供給至節點PI、P2之電壓可藉第1或第2電壓降壓 部91、92降壓至第1電源電壓VDD1減去閾值電壓VthN 20 及降壓電壓之電壓。更進一步,由於第1降壓部91進行之 降壓成為固定電壓值,因此NMOS電晶體NM6A至NM6C 在進行線形動作之領域中,亦可進行預定電壓之降壓。 若同時設置第1電壓降壓部91與第2電壓降壓部92 ,則加算各自之降壓,並在PMOS電晶體PM8A、PM8B、 44 1222273 玖、發明說明—吣 PM9C導通時,可使施加於閘極端子(節點PI、P2)之電壓 V(P1)、V(P2)有效地降壓。即使第1電壓降壓部91與第2 電壓降壓部92係同時設置兩者或分別單獨設置亦可達到同 樣之效果。 5 PMOS 電晶體 PM1(PM3)、PM5 至 PM7 之 N 井 NW 之 電位 V(NW)係因應施加於節點 N3(N4)之電壓 V(N3)(V(N4))而控制。若 V(N3)(V(N4))<VDDl + VthP 時 於第 1 電源電壓 VDDl,V(N3)(V(N4))2VDDl + vthP 時 於電壓V(N3)(V(N4))不斷地進行偏壓。藉此,N井NW不 10 會成為浮動狀態。又,在與汲極端子的接面之間亦不會施 加順偏壓。因此,當由第1電路群3往第2電路群5轉換 位階時,可確實地設定N井NW之電位V(NW),同時亦不 會有不必要之順偏壓電流流通。而可以低消耗電流得到安 定之電路動作。 15 第14圖係顯示實施形態之位階轉換電路1中,低壓側 之位階轉換部6之具體例。係使具有第1電源電壓VDD1 之振幅之輸入信號IN轉換位階成具有偏電壓VB之振幅之 信號。 輸入信號IN輸入至由PMOS電晶體PM62及NMOS 20 電晶體NM62構成之反向器閘與NMOS電晶體61之閘極 端子。反向器閘之輸出端子係連接於NMOS電晶體NM63 之閘極端子。NMOS電晶體NM61、NM63係源極端子連接 於基準電壓VSS,同時汲極端子分別連接於PMOS電晶體 PM61、PM63之汲極端子。PMOS電晶體PM61、PM63之 45 1222273 玖、發明說明 閘極端子互相與其他電晶體之汲極端子連接,且源極端子 同時視需要而透過降壓部71而連接於偏電壓VB。且由 PMOS電晶體PM63與NMOS電晶體NM63之連接點輸出 業經位階轉換之信號。 5 又,輸入低位階之輸入信號IN。藉導通NMOS電晶體 NM61並使PMOS電晶體PM63之閘極端子電壓當作基準 電壓VSS,可導通PMOS電晶體PM63。又,由反向器閘 反轉之低位階信號係輸入至NMOS電晶體NM63之閘極端 子,且NMOS電晶體NM63為非導通。因此,輸出之信號 10 係透過PMOS電晶體PM63而成為偏電壓VB或其降壓電 壓。在此,輸出之信號係輸入於PMOS電晶體PM61之閘 極端子並使PMOS電晶體PM61為非導通。 輸入信號IN係輸入基準電壓VSS之低位階信號。該 情況是NMOS電晶體NM61為非導通且切斷由PMOS電晶 15 體PM63之閘極端子往基準電壓VSS之路徑。另一方面, 由於由反向器閘反轉之高位階信號輸出之信號輸入至 NMOS電晶體NM63之閘極端子,因此NMOS電晶體 NM63為導通。因此,輸出之信號係透過NMOS電晶體 NM63成為基準電壓VSS。輸出之信號則輸入至PMOS電 20 晶體PM61之閘極端子並導通PMOS電晶體PM61,且非 導通地維持PMOS電晶體PM63。 輸出之信號之高位階係偏電壓VB或其降壓電壓。並 藉將該電壓位階當作高於第1電源電壓VDD1之電壓位階 ,NMOS電晶體NM51之閘極端子成為深度地偏壓之狀態 46 1222273 ,而可期待伴隨著驅動能力提高之高速動作。 產業上之可利用性 根據本發明,可提供一種半導體裝置,當在第1電源 電壓進行動作之第1電路群與在高於第1電源電壓之第2 5 電源電壓動作之第2電路群之間進行信號之轉換時,藉設 置有可以第1電源電壓與第2電源電壓所挾帶之電源進行 動作之位階轉換電路,而不會有經常性的電流消耗並可進 行位階轉換。 L圖式簡單說明3 10 第1圖係顯示本發明之實施形態之電路圖。 第2圖係顯示用以防止構成位階轉換電路之PMOS電 晶體錯誤導通之第1方法之電路圖。 第3圖係顯示用以防止構成位階轉換電路之PMOS電 晶體錯誤導通之第2方法之電路圖。 15 第4圖係顯示用以防止構成位階轉換電路之PMOS電 晶體錯誤導通之第3方法之電路圖。 第5圖係顯示第4圖之第3方法的具體例者。 第6圖係顯示用以防止構成位階轉換電路之PMOS電 晶體錯誤導通之第4方法之電路圖。 20 第7圖係顯示第4方法中,PMOS電晶體PM5之閘極 端子電壓之特性者。 第8圖係顯示第4方法中,PMOS電晶體PM1之閘極 端子電壓之特性者。 第9圖係顯示第4方法中之N井電位控制部之第1具 47 1222273 玖、發明說明 體例之電路圖。 第10圖係顯示第4方法中之N井電位控制部之第2 具體例之電路圖。 第11圖係顯示第1及第2具體例之N井電位控制部 5 之井電位之切換者。In the above description, although the supply of the first power supply voltage VDD1 has been described as the voltage V (N13) of the node N13, the voltage V (N13) can also be used as the voltage stepped down by the step-down circuit B11. At this time, the node Nil will supply a lower voltage (V (N13)-VthN) ((II) in Fig. 7). Compared with the threshold voltage of the transistor PM5 of PMOS 36 1222273 (invention description), NMOS When the threshold voltage of the crystal NM4 is the same or lower, the PMOS transistor PM5 can also be turned on. Also, the PMOS transistor PM7 is also non-conducting, and the second power supply voltage VDD supplied to the node N3 is not supplied to the node N1A. 5 Therefore, at the gate terminal (node N1A) of the PMOS transistor PM1, a high-order signal is supplied from the first circuit group through the PMOS transistor PM5. Usually, this signal has the voltage level of the first power supply voltage VDD1 (Fig. 8). The voltage difference between the gate and drain terminals of the PMOS transistor PM1 is less than the threshold voltage and remains non-conductive. And a current path from the node 10 N3 to the first power supply voltage VDD1 will not be formed. If the voltage V (N3) of the node N3 is higher than the voltage of the first power supply voltage VDD plus the threshold voltage VthP of the PMOS transistor PM6 (v (N3) g VDD + VthP), the PMOS transistor PM6 is applied above the threshold voltage VthP Voltage and turn on, and the node Nl 1 and the node N3 are turned on 15 (V (N11) = V (N3)) (Figure 7). The voltage V (N11) becomes the second power supply voltage VDD2, and the PMOS transistor M5 becomes non-conductive. On the other hand, the PMOS transistor PM7 with the same threshold voltage VthP is turned on, and the node N1A is turned on with the node N3 (V (N1A) = V (N3)) (Figure 8). The voltage V (N1 A) becomes the second power supply voltage VDD2. The gate and drain terminals of the PMOS transistor 20 PM1 are at the same potential and remain non-conductive. And there will be no current path from node N3 to the first power supply voltage VDD1. As described above, if the gate voltage control unit 11 (Figure 6) in the fourth method, when the PMOS transistor PM1 (PM3) is not When turned on, even if the second power supply voltage VDD2 is directly applied to the drain terminal (node N3 (N4)) at 37 1222273 发明, the invention description, it can be switched according to the second power supply voltage VDD2 relative to the first power supply voltage VDD1. The voltage applied to the gate terminal (node N1A) is maintained, while the PMOS transistor PM1 (PM3) remains non-conductive. In addition, no unnecessary current path is formed from the drain 5 terminal (node N3 (N4)) to the first power supply voltage VDD1, and unnecessary current consumption can be prevented. The switching system of the voltage applied to the gate terminal (node N1A), if the threshold voltage VthP of the PMOS transistor PM6 and PM7 is the same as that of the PMOS transistor PM1 (PM3), the drain terminal (node N3 (N4)) is used. This voltage allows the PMOS transistor 10 PM1 (PM3) to switch from the voltage at which the drain terminal is turned on to the first power supply voltage side. In addition, the non-conduction maintenance of the PMOS transistor PM1 (PM3) can be performed stably regardless of the similarities and differences between the threshold voltages of the PMOS transistor PM1 (PM3) and the PMOS transistor PM2, PM4, and PM51. 15 The propagation control of the node N1A of the signal from the first circuit group can be performed by the conduction control of the PMOS transistor PM5. The second power supply voltage VDD2 supplied to the node N1A is not applied to the first circuit group by making the PMOS transistor PM5 non-conductive. Furthermore, by operating in the saturation field of the NMOS transistor NM3, the voltage applied to the first circuit group is limited to the voltage of the 20th power supply voltage VDD1 minus the threshold voltage without applying an overvoltage. Next, the N-well potential limiter 9 will be described. As shown in FIG. 6, in the level conversion circuit 1, the power supply voltage of the high-level side level conversion section 4 and the gate voltage control section 11 is the first power supply voltage VDD1. Generally, the potential of the N-well also biases the first power supply voltage. . However, the PMOS transistor PM1 (PM3) 38 1222273 (1) and (1) indicate that when PM5 to 7 are supplied with the second power supply voltage VDD2 to Nia, due to the voltage difference between the first power supply voltage VDD1 and the second power supply voltage VDD2, Therefore, a forward current flows from the p-type drain terminal to the N well Nw through the forward-biased junction. In order to avoid this flow, 5 bits of n-well power must be controlled. The N-well potential control unit 9a of the first specific example shown in FIG. 9 has a PMOS transistor PM8A, the source terminal of which is connected to the first power supply voltage VDD1, and the drain terminal and the rear gate terminal are connected to N-well Nw. And a PMOS transistor PM9A, the source terminal is connected to the gate terminal, the 10 drain terminal and the rear gate terminal are connected to the N well NW, and the gate terminal is connected to the first power supply voltage VDD1. The PMOS transistor PM8A is precisely connected to the PMOS transistor control section of the gate terminal (node pi) to control conduction and non-conduction. The PMOS transistor control section includes an NMOS transistor NM6A and 15 PMOS transistor PM10A, and a first voltage step-down section 91 is provided as necessary. NMOS transistor NM6A series, the drain terminal is connected to node N3, the source terminal is connected to the gate terminal (node P1) of the PMOS transistor PM8A through the first voltage step-down section 91, and the gate terminal is connected to the first power supply voltage VDD1. PMOS transistor PM10A series, the source terminal is connected to nodes N3 and 20, the drain terminal is connected to the gate terminal and the rear gate terminal of PMOS transistor PM8A are connected to the N well NW, and the gate terminal is connected to the first power supply voltage VDD1 ° 1 The voltage step-down section 91 is to step down the voltage from the source terminal of the NMOS transistor NM6A, and then supply it to 39 1222273 of the PMOS transistor PM8A. 发明 Description of the gate terminal (node P1). FIG. 9 shows a specific example in which the first voltage step-down unit 91 is incorporated. A specific example (A) is a step-down step in which a predetermined number of diodes are connected in series. By appropriately setting the predetermined number of diodes, when the PMOS transistor PM8A is turned on, a voltage equal to or lower than the threshold voltage of the first power supply voltage VDD1 minus the threshold voltage is supplied to the gate terminal (node P1) of the PMOS transistor PM8A. The specific example (B) divides the voltage of the source terminal of the NMOS transistor NM6A by a resistance element. If the voltage division ratio is appropriately set, a voltage lower than the threshold voltage of the first power supply voltage VDD1 minus the threshold voltage of the PMOS transistor PM8 A (node P1) can be supplied. The N-well potential control section 9B of the second specific example shown in FIG. 10 is a PMOS transistor control section, and a second voltage step-down section 92 is provided instead of the first specific example 9A (FIG. 9). Voltage step-down section 91. In the PMOS transistor control section, the 15 terminals of the NMOS transistor NM6B series source are directly connected to the gate terminal (node P1) of the PMOS transistor PM8B, and the gate terminal is connected to the first power supply through the second voltage step-down section 92 Voltage VDD1. The second voltage step-down unit 92 steps down the first power supply voltage VDD1 and biases the gate terminal of the NMOS transistor NM6B. With this, 20 can output the voltage appropriately reduced by the source terminal of the NMOS transistor NM6B and supply it to the node P1. A specific example of the second voltage step-down section 92 shown in FIG. 10 is the same as a specific example of the first voltage step-down section 91. By connecting a predetermined number of diodes in series (specific example (A)), and using a resistance element to perform the first power supply voltage VDD1 of 40 1222273 玖, the invention description divides the voltage (specific example (B)) to obtain a reduced voltage Voltage. Fig. 11 shows the switching waveforms of the potential γ (N3) of the node N3, the potential V (NW) of the NW NW and the PMOS transistor PM8A in the N-well potential control sections 9A and 9B (Figs. 9 and 10). Gate voltage V (P1) 5. In Figure 11, the case where the threshold voltages of NMOS / PMOS transistors are slightly equal (VthN and Vthp) is taken as an example. If the voltage V (N3) is equal to or higher than the i-th power supply voltage VDD1 plus the threshold voltage VthP (V (V3) ^ vdDI + VthP), the PMOS transistors PM10A and PM10B are turned on and the voltage ν (P1) is biased. The voltage is 10 V (N3), and it is regarded as the second power supply voltage VDD2. The PMOS transistors PM8A and PM8B are non-conductive. On the other hand, the PMOS transistors PM9A and PM9B are turned on, and the N-well potential V (NW) becomes the voltage V (N3). That is, it becomes the second power supply voltage VDD2. If the voltage V (N3) is reduced to a voltage smaller than the first power supply voltage VDD1 plus the threshold voltage VthP (V (N3) < VDDl + VthP), the P9 transistor PM9A, PM10A, PM9B, PM10B is Non-conducting. On the other hand, the NMOS transistors NM6A and NM6B are turned on. Before the voltage V (N3) is reduced to the voltage of the gate terminals of the NMOS transistors NM6A and NM6B minus the voltage of the threshold voltage VthN, since the 20 NMOS transistors NM6A and NM6B perform the saturation operation, the voltage of the source terminal is roughly It is fixed to a voltage obtained by subtracting the threshold voltage VthN from the voltage of the gate terminal. If the voltage is reduced again, the NMOS transistors NM6A and NM6B will conduct a linear action and turn on, and the voltage V (N3) will be output to the source terminals of the NMOS transistors NM6A and NM6B as usual. 41 1222273 发明, description of the invention • '-.,' Here, the voltage supplied to the gate terminal of the NMOS transistor NM6A, NM6B is the first power supply voltage VDD1 (Figure 9), or the voltage is stepped down by the first power supply voltage VDD1. Voltage (Figure 10). This voltage is supplied to the gate terminals (node P1) of the PMOS transistor PM8A, 5 PM8B directly (Figure 10) or after voltage reduction (Figure 9). When the first and second step-down sections 91 and 92 are not provided, the threshold voltage VthN of the NMOS transistors NM6A and NM6B minus the first power supply voltage VDD1 is set as the upper limit, and the voltage V (P1) of the node P1 is set. When the threshold voltages of the NMOS transistors NM6A, NM6B and PMOS transistors PM8A 10 and PM8B are slightly equal, the potential difference between the gate and source of the PMOS transistors PM8A and PM8B will be applied above the threshold voltage VthP, and will be turned on to supply the first 1 Power supply voltage VDD1 in N well NW. In addition, even if the threshold voltages of the NMOS transistors NM6A and NM6B and the PMOS transistors PM8A and PM8B are different, at least one of the first or 15 second voltage step-down sections 91 and 92 can be provided, which can fully make use of The voltage V (P1) of the node P1 is stepped down, and the PMOS transistors PM8A and PM8B are turned on. The N-well potential control unit 9C of the third specific example shown in FIG. 12 is the first and second specific examples 9A and 9B (FIGS. 9 and 10). The crystal PM8A and PM8B have a structure in which the connection relationship between the gate terminals of the PMOS transistors PM9A and PM9B and the first power supply voltage VDD1 is inverted. That is, the NMOS transistor NM6C and the PMOS transistor PM10C are set between the gate terminal (node P2) of the PMOS transistor PM9C and the first power supply voltage VDD1, and 42 1222273 玖, invention description NMOS transistor NM6C gate terminal The child is connected to node N3. The gate terminals of the PMOS transistors PM8C and PM10C are connected to the node N3. At this time, the first voltage step-down section 91 and the second voltage step-down section 92 can be connected in the same manner as in the first and second specific examples 9A and 9B. That is, the first voltage 5 step-down section 91 may be provided between the NMOS transistor NM6C and the node P2. The second voltage step-down section 92 is connected between the gate terminal of the NMOS transistor NM6C and the node N3. Regarding the third specific example 9C, FIG. 13 shows a waveform showing the relationship between the N-well potential V (NW) of the voltage V (N3) and the voltage V (P2) of the node P2. When the first and second voltage step-down sections 91 and 92 are not provided, the voltage V (N3) is lower than the first power supply voltage VDD1 plus the threshold voltage VthN, and the NMOS transistor NM6C performs a saturation operation. The voltage V (P2) of the gate terminal (node P2) of the PMOS transistor PM9C is the voltage of the supply voltage V (N3) minus the threshold voltage VthN. Under the condition that the two threshold voltages of NMOS / PMOS are slightly equal (VthN and VthP), the PMOS transistor PM9C is turned on, and the N-well potential V (NW) is the voltage V (N3). Since the voltage V (N3) at this time is the second power supply voltage VDD2, the N-well potential V (NW) is also the second power supply voltage VDD2. When the voltage V (N3) is greater than the voltage of the first power supply voltage VDD1 plus a threshold voltage of 20 VthN, the NMOS transistor NM6C performs a linear operation. The first power supply voltage VDD1 is supplied to the gate terminal (node P2) of the PMOS transistor PM9C. Then, the PMOS transistor PM9C is turned on, and a voltage V (N3) is supplied, that is, the second power supply voltage VDD2 to the N-well NW. In addition, since the operation of the first and second voltage step-down sections 91 and 92 is 43 1222273 发明, invention _ Ming ^ ^ ^ ^ y The use and effect are the same as those of the first and second specific examples 9A and 9B. Therefore, the description is omitted below. Here, if the voltage V (N3) is greater than the first power supply voltage VDD1 plus the threshold voltage VthN according to the effect of the voltage reduction by the first voltage step-down section 91, the voltage V (P2) is set to The industry level 5 is a voltage level stepped down by the first power supply voltage VDD1 through the first voltage step-down section 91 (Fig. 13, (II)), and if the voltage is dropped by the second voltage step-down section 92, the voltage V (P2) is set to the voltage level at which the first power supply voltage VDD1 is subtracted from the voltage level stepped down by the second voltage step-down section and then the threshold voltage VthN is subtracted (Fig. 13, (I)). 10 As described above, according to the first and second specific examples (Figures 9 and 10) and the third specific example (Figure 12) of the N-well potential control section, if the first voltage step-down section 91 is provided, The voltage output from the source terminal of the NMOS transistor NM6A to NM6C can be stepped down. If the second voltage step-down section 92 is provided, in the NMOS transistors NM6A 15 to NM6C, the predetermined voltage applied to the gate terminal can be stepped down by the first power supply voltage VDD1, and the source terminal for saturation operation can be reduced. The voltage value is stepped down. The voltage supplied to the nodes PI and P2 can be stepped down to the voltage of the first power supply voltage VDD1 minus the threshold voltage VthN 20 and the step-down voltage by the first or second voltage step-down sections 91 and 92. Furthermore, since the step-down performed by the first step-down section 91 becomes a fixed voltage value, the NMOS transistors NM6A to NM6C can also perform a step-down step of a predetermined voltage in the field of linear operation. If the first voltage step-down section 91 and the second voltage step-down section 92 are provided at the same time, the respective step-down voltages are added, and when the PMOS transistor PM8A, PM8B, 44 1222273 玖, invention description-吣 PM9C can be turned on, it can be applied The voltages V (P1) and V (P2) at the gate terminals (nodes PI and P2) are effectively reduced. The same effect can be achieved even if the first voltage step-down section 91 and the second voltage step-down section 92 are both provided simultaneously or separately. 5 PMOS transistor PM1 (PM3), PM5 to PM7, the potential V (NW) of the N well NW is controlled by the voltage V (N3) (V (N4)) applied to the node N3 (N4). If V (N3) (V (N4)) < VDDl + VthP is the first power supply voltage VDD1, V (N3) (V (N4)) 2VDDl + vthP is the voltage V (N3) (V (N4)) Constantly biased. As a result, N well NW will become floating. Also, no forward bias is applied between the interface with the drain terminal. Therefore, when the level is switched from the first circuit group 3 to the second circuit group 5, the potential V (NW) of the N well NW can be set reliably, and no unnecessary forward bias current flows. A stable circuit operation can be obtained with low current consumption. 15 FIG. 14 shows a specific example of the low-level step conversion section 6 in the step conversion circuit 1 of the embodiment. The input signal IN having the amplitude of the first power supply voltage VDD1 is converted into a signal having the amplitude of the bias voltage VB. The input signal IN is input to the inverter terminal composed of the PMOS transistor PM62 and the NMOS 20 transistor NM62 and the gate terminal of the NMOS transistor 61. The output terminal of the inverter gate is connected to the gate terminal of the NMOS transistor NM63. The source terminals of NMOS transistors NM61 and NM63 are connected to the reference voltage VSS, and the drain terminals are connected to the drain terminals of PM61 and PM63, respectively. 45 1222273 of PMOS transistors PM61 and PM63 发明, description of the invention The gate terminals are connected to the drain terminals of other transistors, and the source terminals are also connected to the bias voltage VB through the step-down portion 71 as necessary. And the connection point of the PMOS transistor PM63 and the NMOS transistor NM63 outputs the level-converted signal. 5 Also, input a low-level input signal IN. By turning on the NMOS transistor NM61 and using the gate terminal voltage of the PMOS transistor PM63 as the reference voltage VSS, the PMOS transistor PM63 can be turned on. In addition, the low-level signal inverted by the inverter gate is input to the gate terminal of the NMOS transistor NM63, and the NMOS transistor NM63 is non-conductive. Therefore, the output signal 10 passes through the PMOS transistor PM63 and becomes the bias voltage VB or its step-down voltage. Here, the output signal is input to the gate terminal of the PMOS transistor PM61 and makes the PMOS transistor PM61 non-conductive. The input signal IN is a low-level signal to which the reference voltage VSS is input. In this case, the NMOS transistor NM61 is non-conductive and cuts off the path from the gate terminal of the PMOS transistor PM63 to the reference voltage VSS. On the other hand, since the signal output by the high-level signal inverted by the inverter gate is input to the gate terminal of the NMOS transistor NM63, the NMOS transistor NM63 is turned on. Therefore, the output signal is transmitted to the reference voltage VSS through the NMOS transistor NM63. The output signal is input to the gate terminal of the PMOS transistor PM61 and turns on the PMOS transistor PM61, and the PMOS transistor PM63 is kept non-conductive. The high level of the output signal is the bias voltage VB or its step-down voltage. By taking this voltage level as a voltage level higher than the first power supply voltage VDD1, the gate terminal of the NMOS transistor NM51 becomes deeply biased 46 1222273, and high-speed operation with an increase in driving capability can be expected. INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a semiconductor device which operates between a first circuit group operating at a first power supply voltage and a second circuit group operating at a second 5 power supply voltage higher than the first power supply voltage. In order to perform signal conversion between phases, a level conversion circuit capable of operating with the power source carried by the first power supply voltage and the second power supply voltage is provided, and there is no frequent current consumption and level conversion can be performed. Brief description of the L diagram 3 10 FIG. 1 is a circuit diagram showing an embodiment of the present invention. Fig. 2 is a circuit diagram showing a first method for preventing the PMOS transistor constituting the level conversion circuit from being turned on incorrectly. Fig. 3 is a circuit diagram showing a second method for preventing erroneous conduction of the PMOS transistor constituting the level conversion circuit. 15 Fig. 4 is a circuit diagram showing a third method for preventing erroneous conduction of the PMOS transistor constituting the level conversion circuit. FIG. 5 shows a specific example of the third method in FIG. 4. Fig. 6 is a circuit diagram showing a fourth method for preventing erroneous conduction of the PMOS transistor constituting the level conversion circuit. 20 Figure 7 shows the characteristics of the gate terminal voltage of the PMOS transistor PM5 in the fourth method. Fig. 8 shows the characteristics of the gate terminal voltage of the PMOS transistor PM1 in the fourth method. Fig. 9 is a circuit diagram showing the first 47 1222273 of the N-well potential control section in the fourth method, and a description of the invention. Fig. 10 is a circuit diagram showing a second specific example of the N-well potential control section in the fourth method. Fig. 11 shows the switching of the well potential of the N-well potential control unit 5 of the first and second specific examples.
第12圖係顯示第4方法中之N井電位控制部之第3 具體例之電路圖。 第13圖係顯示第3具體例之N井電位控制部之井電 位之切換者。 10 第14圖係顯示實施形態之位階轉換電路中,用以驅動 NMOS電晶體NM51之低壓側之位階轉換部之電路圖。 第15圖係顯示習知技術之位階轉換電路之電路圖。 【圖式之主要元件代表符號表】 1.. .位階轉換電路Fig. 12 is a circuit diagram showing a third specific example of the N-well potential control section in the fourth method. Fig. 13 shows a switchover of the well potential of the N-well potential control section of the third specific example. 10 FIG. 14 is a circuit diagram showing a level conversion section for driving the low-voltage side of the NMOS transistor NM51 in the level conversion circuit of the embodiment. FIG. 15 is a circuit diagram showing a level conversion circuit of the conventional technology. [The main components of the diagram represent the symbol table] 1... Level conversion circuit
11.. .閘極電壓控制部 3…第1電路群 4…高壓側位階轉換部 5···第2電路群 6…健側位階轉換部 7.. .電壓降壓部 71···降壓部 9,9A-C...N井電位控制部 91…第1電壓降壓部 92…第2電壓降壓部 48 1222273 玖、發明說明 105〜111…電阻元件 B11...降壓電路 111,131…反向器閘 IN...輸入信號 LS...電壓位準之轉換電路11. ..Gate voltage control section 3 ... 1st circuit group 4 ... High-voltage side level conversion section 5 ... 2nd circuit group 6 ... Healthy side level conversion section 7 .... Voltage step-down section 71 ... Voltage section 9,9A-C ... N-well potential control section 91 ... First voltage step-down section 92 ... Second voltage step-down section 48 1222273 玖, Description of the invention 105 ~ 111 ... Resistance element B11 ... Step-down circuit 111, 131 ... inverter gate IN ... input signal LS ... voltage level conversion circuit
Nl-4, N11,N13, N1A,N3A-4A,NP1 〜P2···節點 NM1 〜5, NM6A4C,NM51 〜52, NM61 〜63…NMOS 電晶體 NW...N 井 OUT...輸出信號 PM1 〜7,PM8AC,PM9A-C,PM10A-C,PM51 〜52,PM61^63...PMOS 電晶 體 VB...偏電壓 VDD1...第1電源電壓 VDD2...第2電源電壓 VDN…降壓電壓 VH1〜3...高電壓位階 VL1〜3...低電壓位階 VSS...基準電壓 49Nl-4, N11, N13, N1A, N3A-4A, NP1 ~ P2 ·· Nodes NM1 ~ 5, NM6A4C, NM51 ~ 52, NM61 ~ 63 ... NMOS transistor NW ... N well OUT ... output signal PM1 ~ 7, PM8AC, PM9A-C, PM10A-C, PM51 ~ 52, PM61 ^ 63 ... PMOS transistor VB ... bias voltage VDD1 ... first power supply voltage VDD2 ... second power supply voltage VDN … Buck voltage VH1 ~ 3 ... High voltage level VL1 ~ 3 ... Low voltage level VSS ... Reference voltage 49
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