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TWD220529S - 記憶體模組(二) - Google Patents

記憶體模組(二) Download PDF

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Publication number
TWD220529S
TWD220529S TW110306518F TW110306518F TWD220529S TW D220529 S TWD220529 S TW D220529S TW 110306518 F TW110306518 F TW 110306518F TW 110306518 F TW110306518 F TW 110306518F TW D220529 S TWD220529 S TW D220529S
Authority
TW
Taiwan
Prior art keywords
design
memory module
case
chain line
point chain
Prior art date
Application number
TW110306518F
Other languages
English (en)
Inventor
黃瓊篁
Original Assignee
芝奇國際實業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝奇國際實業股份有限公司 filed Critical 芝奇國際實業股份有限公司
Priority to TW110306518F priority Critical patent/TWD220529S/zh
Priority to US29/791,102 priority patent/USD1005296S1/en
Publication of TWD220529S publication Critical patent/TWD220529S/zh

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Abstract

【物品用途】;本設計物品是記憶體模組。;【設計說明】;本設計的特點在於:記憶體模組整體外觀展現出簡潔、大方且富於獨特視覺美感之意象。;圖式中以虛線所揭露之區域為本案不主張設計之部分。;圖式中所揭露之一點鏈線係界定本案所欲主張之範圍,該一點鏈線為本案不主張設計之部分。

Description

記憶體模組(二)
本設計物品是記憶體模組。
本設計的特點在於:記憶體模組整體外觀展現出簡潔、大方且富於獨特視覺美感之意象。
圖式中以虛線所揭露之區域為本案不主張設計之部分。
圖式中所揭露之一點鏈線係界定本案所欲主張之範圍,該一點鏈線為本案不主張設計之部分。
TW110306518F 2021-11-30 2021-11-30 記憶體模組(二) TWD220529S (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW110306518F TWD220529S (zh) 2021-11-30 2021-11-30 記憶體模組(二)
US29/791,102 USD1005296S1 (en) 2021-11-30 2021-12-29 Computer memory module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110306518F TWD220529S (zh) 2021-11-30 2021-11-30 記憶體模組(二)

Publications (1)

Publication Number Publication Date
TWD220529S true TWD220529S (zh) 2022-08-11

Family

ID=88758097

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110306518F TWD220529S (zh) 2021-11-30 2021-11-30 記憶體模組(二)

Country Status (2)

Country Link
US (1) USD1005296S1 (zh)
TW (1) TWD220529S (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1053190S1 (en) * 2022-05-30 2024-12-03 ShenZhen ORICO Technologies Co., Ltd. Hard disk drive

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD211316S (zh) 2020-07-31 2021-05-01 香港商艾思科有限公司 記憶體模組散熱座

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USD348469S (en) * 1992-01-27 1994-07-05 At&T Bell Laboratories Electronics cabinet door
USD394845S (en) * 1996-09-24 1998-06-02 Motorola, Inc. Front panel with perforations for infrastructure equipment
USD482691S1 (en) * 2002-07-26 2003-11-25 Hewlett-Packard Development Company, L.P. Server blade
USD637157S1 (en) * 2010-10-18 2011-05-03 Apple Inc. Electronic device
USD660810S1 (en) * 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD733145S1 (en) * 2014-03-14 2015-06-30 Kingston Digital, Inc. Memory module
USD771043S1 (en) * 2015-05-12 2016-11-08 Hypr Corp Biometric payment gateway device
USD782417S1 (en) * 2016-04-20 2017-03-28 Chyng Hong Electronic Co., Ltd. Back panel for power supply
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader
TWI672988B (zh) * 2016-10-07 2019-09-21 芝奇國際實業股份有限公司 記憶體裝置及其組裝方法
TWD189068S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189071S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189067S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
USD997161S1 (en) * 2020-09-10 2023-08-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD964947S1 (en) * 2021-06-03 2022-09-27 Kingston Digital, Inc. Heat sink for memory module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD211316S (zh) 2020-07-31 2021-05-01 香港商艾思科有限公司 記憶體模組散熱座

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Publication number Publication date
USD1005296S1 (en) 2023-11-21

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