TWD164333S - 用於電子元件之散熱器 - Google Patents
用於電子元件之散熱器Info
- Publication number
- TWD164333S TWD164333S TW103300653F TW103300653F TWD164333S TW D164333 S TWD164333 S TW D164333S TW 103300653 F TW103300653 F TW 103300653F TW 103300653 F TW103300653 F TW 103300653F TW D164333 S TWD164333 S TW D164333S
- Authority
- TW
- Taiwan
- Prior art keywords
- radiator
- electronic device
- design description
- item usage
- usage
- Prior art date
Links
Abstract
【物品用途】;;【設計說明】
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013017936 | 2013-08-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD164333S true TWD164333S (zh) | 2014-11-21 |
Family
ID=54353103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103300653F TWD164333S (zh) | 2013-08-06 | 2014-02-05 | 用於電子元件之散熱器 |
Country Status (2)
Country | Link |
---|---|
US (1) | USD742337S1 (zh) |
TW (1) | TWD164333S (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1643634S (zh) * | 2018-12-28 | 2020-10-12 | ||
JP1662414S (zh) | 2019-09-12 | 2020-06-29 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD467559S1 (en) * | 2001-02-23 | 2002-12-24 | Zalman Tech Co., Ltd., | Radiator for heat generating components in electronic equipment |
USD496338S1 (en) * | 2003-03-10 | 2004-09-21 | Asia Vital Components Co., Ltd. | Double-winged radiator for central processing unit |
US7068509B2 (en) * | 2004-02-03 | 2006-06-27 | Hewlett-Packard Development Company, L.P. | Small form factor cooling system |
US7002799B2 (en) * | 2004-04-19 | 2006-02-21 | Hewlett-Packard Development Company, L.P. | External liquid loop heat exchanger for an electronic system |
US6997247B2 (en) * | 2004-04-29 | 2006-02-14 | Hewlett-Packard Development Company, L.P. | Multiple-pass heat exchanger with gaps between fins of adjacent tube segments |
TWI274985B (en) * | 2005-07-08 | 2007-03-01 | Asustek Comp Inc | Extendable cooling apparatus |
US20070125523A1 (en) * | 2005-12-01 | 2007-06-07 | Bhatti Mohinder S | Low profile liquid cooled server heat sink |
US7957132B2 (en) * | 2007-04-16 | 2011-06-07 | Fried Stephen S | Efficiently cool data centers and electronic enclosures using loop heat pipes |
JP5651991B2 (ja) * | 2010-05-10 | 2015-01-14 | 富士通株式会社 | ラジエータ及びそれを備えた電子機器 |
JP6228730B2 (ja) * | 2012-09-07 | 2017-11-08 | 富士通株式会社 | ラジエータ、電子装置及び冷却装置 |
USD714235S1 (en) * | 2012-09-07 | 2014-09-30 | Fujitsu Limited | Radiator for electronic device |
JP6127416B2 (ja) * | 2012-09-07 | 2017-05-17 | 富士通株式会社 | 電子機器 |
-
2014
- 2014-02-05 TW TW103300653F patent/TWD164333S/zh unknown
- 2014-02-06 US US29/481,551 patent/USD742337S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD742337S1 (en) | 2015-11-03 |
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