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TWD116594S1 - Heat sink - Google Patents

Heat sink

Info

Publication number
TWD116594S1
TWD116594S1 TW095300393F TW95300393F TWD116594S1 TW D116594 S1 TWD116594 S1 TW D116594S1 TW 095300393 F TW095300393 F TW 095300393F TW 95300393 F TW95300393 F TW 95300393F TW D116594 S1 TWD116594 S1 TW D116594S1
Authority
TW
Taiwan
Prior art keywords
design
shaped component
gap
main body
heat
Prior art date
Application number
TW095300393F
Other languages
Chinese (zh)
Inventor
歐蘇利文麥克
洛特艾利克
Original Assignee
摩勒克斯公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 摩勒克斯公司 filed Critical 摩勒克斯公司
Publication of TWD116594S1 publication Critical patent/TWD116594S1/en

Links

Abstract

【物品用途】本物品係一種用以散熱諸如電腦、遊戲控制台等電子裝置之發熱元件之散熱器。【創作特點】如圖所示，本創作係由一數量不等且上方向內凹之平板平行排列所形成的長方形本體、一以略偏角度貫穿本體的U形構件及一具有向前後側外延伸之似ㄩ形構件的底部所構成。由俯視圖觀之，U形構件穿過的平板上方形成缺口，且接近U形構件轉彎部分的缺口較大。整體而言，本創作造形獨特美觀、且式樣新穎具獨創性，實為一特殊且實用之新式樣設計。上述說明僅供輔助瞭解本創作而非用以限制其內容；理應明瞭，新式樣係以圖面所示者為準。[Item Purpose] This item is a heat sink used to dissipate heat from heat-generating components of electronic devices such as computers and game consoles. [Design Features] As shown in the figure, this design is composed of a rectangular main body formed by a number of parallel plates that are concave on the top, a U-shaped component that penetrates the main body at a slightly biased angle, and a bottom with a ㄩ-shaped component that extends outward to the front and rear. From a top view, a gap is formed above the plate through which the U-shaped component passes, and the gap is larger near the bend of the U-shaped component. Overall, this design is unique and beautiful in shape, and its style is novel and original. It is indeed a special and practical new style design. The above description is only to assist in understanding this design and is not used to limit its content; it should be understood that the new style is based on that shown in the drawing.

TW095300393F 2005-08-04 2006-01-24 Heat sink TWD116594S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/235,693 USD533145S1 (en) 2005-08-04 2005-08-04 Heat sink

Publications (1)

Publication Number Publication Date
TWD116594S1 true TWD116594S1 (en) 2007-04-21

Family

ID=37480948

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095300393F TWD116594S1 (en) 2005-08-04 2006-01-24 Heat sink

Country Status (2)

Country Link
US (1) USD533145S1 (en)
TW (1) TWD116594S1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD123600S1 (en) * 2007-08-03 2008-07-01 華信精密股份有限公司 Cooler
USD579423S1 (en) * 2007-11-19 2008-10-28 Foxconn Technology Co., Ltd. Heat sink
USD594014S1 (en) 2008-01-28 2009-06-09 Johnson Controls Technology Company Graphical user interface for a display screen
USD594013S1 (en) 2008-01-28 2009-06-09 Johnson Controls Technology Company Graphical user interface for a display screen
US20090284933A1 (en) * 2008-05-15 2009-11-19 Edison Opto Corporation Combination type heat dissipation module
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020056544A1 (en) * 1999-07-23 2002-05-16 Kaveh Azar Heat sink with radial shape
US20010030039A1 (en) * 2000-03-10 2001-10-18 Showa Aluminum Corporation Aluminum-copper clad member, method of manufacturing the same, and heat sink
USD453744S1 (en) * 2001-05-11 2002-02-19 Foxconn Precision Components Co., Ltd. Heat sink
US6698511B2 (en) * 2001-05-18 2004-03-02 Incep Technologies, Inc. Vortex heatsink for high performance thermal applications
MY126022A (en) * 2001-06-15 2006-09-29 Wong Chee Tieng Heat sink
US6711016B2 (en) * 2002-05-07 2004-03-23 Asustek Computer Inc. Side exhaust heat dissipation module
USD487885S1 (en) * 2003-03-14 2004-03-30 Datech Technology Co., Ltd. Heat pipe heat sink assembly
CN2664184Y (en) * 2003-11-17 2004-12-15 鸿富锦精密工业（深圳）有限公司 Heat sink
CN2746523Y (en) * 2004-08-06 2005-12-14 东莞莫仕连接器有限公司 Heat sink assembly
CN2736925Y (en) * 2004-09-15 2005-10-26 鸿富锦精密工业（深圳）有限公司 Heat sink
US7180740B2 (en) * 2004-09-30 2007-02-20 Datech Technology Co., Ltd. Method and apparatus for side-type heat dissipation

Also Published As

Publication number Publication date
USD533145S1 (en) 2006-12-05

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