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TWD109781S1 - 半導體元件 - Google Patents

半導體元件

Info

Publication number
TWD109781S1
TWD109781S1 TW093300927F TW93300927F TWD109781S1 TW D109781 S1 TWD109781 S1 TW D109781S1 TW 093300927 F TW093300927 F TW 093300927F TW 93300927 F TW93300927 F TW 93300927F TW D109781 S1 TWD109781 S1 TW D109781S1
Authority
TW
Taiwan
Prior art keywords
design
long rectangular
figures
new style
stepped
Prior art date
Application number
TW093300927F
Other languages
English (en)
Inventor
上土居博
石原利哉
Original Assignee
東芝股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝股份有限公司 filed Critical 東芝股份有限公司
Publication of TWD109781S1 publication Critical patent/TWD109781S1/zh

Links

Abstract

【物品用途】;本創作是一種半導體元件之新式樣設計，該半導體元件具有由階狀長矩形立方體所構成之外觀形狀。;【創作特點】;如各圖所示，本創作基本上為一長矩形之立方體，四周之側邊顯示有階狀落差，上半部稍大而下半部稍小；如第1圖及第3圖，該下半部之四個表面上均各設有兩個水平排列的長矩形狀物；配合參考第5圖之底視圖，在下半部之底面兩端設有兩個突起的矩形腳座；第6、7圖則分別顯示本創作之橫斷面與縱斷面之內部構造；總體觀之，本創作雖是一種機能性的電子元件，但卻能顯示出屬於高科技元件之精緻感與俐落的表面設計，誠為一前所未見之新式樣設計。
TW093300927F 2003-08-27 2004-02-23 半導體元件 TWD109781S1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003024879 2003-08-27

Publications (1)

Publication Number Publication Date
TWD109781S1 true TWD109781S1 (zh) 2006-03-21

Family

ID=35695296

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093300927F TWD109781S1 (zh) 2003-08-27 2004-02-23 半導體元件

Country Status (2)

Country Link
US (1) USD514074S1 (zh)
TW (1) TWD109781S1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4301071B2 (ja) * 2004-05-07 2009-07-22 株式会社村田製作所 シールドケース付き電子部品およびその製造方法
TWD161897S (zh) 2013-02-08 2014-07-21 晶元光電股份有限公司 發光二極體之部分
USD847102S1 (en) 2013-02-08 2019-04-30 Epistar Corporation Light emitting diode
USD778847S1 (en) * 2014-12-15 2017-02-14 Kingbright Electronics Co. Ltd. LED component
USD778846S1 (en) * 2014-12-15 2017-02-14 Kingbright Electronics Co. Ltd. LED component

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2501638Y2 (ja) * 1991-11-25 1996-06-19 船井電機株式会社 プリント基板装着用シ―ルド板
DE69315907T2 (de) * 1992-07-27 1998-04-16 Murata Manufacturing Co Elektronisches Vielschichtbauteil, Verfahren zur dessen Herstellung und Verfahren zur Messung seiner Charakteristiken
USD383063S (en) * 1993-02-10 1997-09-02 Koenig Gerald L Container with cover
US5559676A (en) * 1995-06-07 1996-09-24 Gessaman; Martin J. Self-contained drop-in component
US6377464B1 (en) * 1999-01-29 2002-04-23 Conexant Systems, Inc. Multiple chip module with integrated RF capabilities
USD444132S1 (en) 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6734536B2 (en) * 2001-01-12 2004-05-11 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
JP4171218B2 (ja) * 2002-01-23 2008-10-22 三菱電機株式会社 表面実装モジュール
JP3942457B2 (ja) * 2002-02-27 2007-07-11 Ｎｅｃエレクトロニクス株式会社 電子部品の製造方法
USD475355S1 (en) 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device

Also Published As

Publication number Publication date
USD514074S1 (en) 2006-01-31

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