593955 玖、發明說明：593955 发明, Description of invention:
【發明所屬之技術領域I 本發明是有關於一種熱管，特別是指一種薄板式熱管 與其製造方法。 ^ 5【先前技術】 10 15[Technical Field to which the Invention belongs I. The present invention relates to a heat pipe, and more particularly, to a thin plate heat pipe and a method for manufacturing the same. ^ 5 [prior art] 10 15
如圖1所不，是公告第510490號「熱管結構」，為製 造该熱官10係先建構_具有一開放口（圖未示）與界定出 -内腔t ιοί的金屬t空基f 1〇2，再將適量的工作流體 W3自該開放口注入該中空基管1〇2後，使該中空基管1⑽ 抽真空後封口（即密封該中空基管j〇2之開放口）。As shown in Figure 1, it is Announcement No. 510490 "Heat Pipe Structure", which was constructed first for the manufacture of the thermal system 10_ with an open mouth (not shown) and a metal t-space base f 1 defining the inner cavity t ιο 〇2, and then inject an appropriate amount of working fluid W3 into the hollow base pipe 102 from the open port, and then the hollow base pipe 1⑽ is evacuated and sealed (ie, the open port of the hollow base pipe j02 is sealed).
但實際上，當該熱管1〇之圓管面貼置在一發溫源上 (例如- CPU (圖未示）之頂平面”夺，僅可形成小面積 的傳溫面’而有傳温效果不佳之缺慽；再者，另—種使用 :式，是將多數熱管10垂設在一如圖2所示之散熱轉片組 合體2G之-底座201内，藉該底座2G1之底平面2〇2貼置 在如圖3所示之CPU 3〇上的偌大接觸表面積，以加大傳 溫面，如此，雖可解決前述之傳溫面不足的缺點，但實際 該CPU 30之熱溫係先藉導熱效果較差之底座傳溫 再透過導熱效果佳的熱管1G散溫，而仍存有傳溫效果不= 另外，參閱圖4所示，為—傳統平板式熱管4()，4 妙板式熱，40貼置在該CPU 3〇上進行傳熱動作時，雖 本身具有傳溫迅速與制較大傳溫表面積來加速熱傳 政果，但貫際上，卻存有厚度較大而不符『輕、薄』之 20 一十面對筆5己型電腦·.··等強調輕巧攜帶之數位設備而 有不適用於上述數位設備之内部空間中的缺點，相 對限縮其實用價值。 【發明内容】 5 目此’本發明之目的，是在提供-種薄板式熱管之製 造方法。 -且本發明之另一目的，是在提供一種符合「輕、薄、 钮、小」特性而具高實用價值的薄板式熱管。 X月之溥板式熱管之製造方法，適用於金屬薄板， 1〇 包含下列步驟： ()裁刀薄板·將二金屬薄板裁切成可相對結合的一上 薄板與一下薄板； 著材(料）Γ佈接者材料：在任一薄板之相對周緣位置塗佈接 15 Φ 合薄板:使該上薄板與該下薄板固結成-形成有 中二腔室的薄板組合體； ==薄板:使該接著材料封合該上薄板與下薄板; 填工作〜、除乱作業.在該薄板組合體之中空腔室内充 、Μ 、除氣’使該中空腔室呈真空狀態；及 2〇 (F)封口作業。 工作：：及本：明之薄板式熱管，包含-薄板組合體、- -上薄板與-下薄板、一由==包括相對應結合的 出的中办_〜 ^上4板與該下薄板包覆界定 〜至，該下薄板具有多數貫穿形成的穿孔，該上 6 593955 溥板具有一位於該上薄板之周邊的外環部、一受該外環部 圍繞且凸隆形成的凸部，及多數對應固結在該下薄板之穿 孔的卡塊，該凸部具有多數凹陷形成的凹槽，該凹槽之底 部恰可卡抵於該下薄板之一頂面，而形成一支撐結構。該 5工作流體是充填在該薄板組合體之中空腔室内。該毛細結 構疋形成於§亥薄板組合體之中空腔室内。 *此外，本發明之薄板式熱管，包含一薄板組合體、二 側蓋、-工作流體及一毛細結構。該薄板組合體為擠壓成 型之-體式結構體，並包括一界定出一中空腔室的板體、 10位於該板體之兩相反側的一前開放端與—後開放端，及一 垂設在該中空腔室内的支樓結構，該支揮結構是由多數支 樓肋條組構成。該二侧蓋是分別密封在該薄板組合體之前 開放端=後開放端。該工作流體是充填在該薄板組合體之 中空腔室内。該毛細結構是形成於該薄板組合體之中空腔 15 室内。 【實施方式】 有關本發月之刖述及其他技術内容、特點與功效，在 以下配合參考圖式之四較佳實施例的詳細說明中，將可清 楚的明白。 隹提出詳細說明之前，要 中’類似之元件’是以相同標號來^示 :閱圖5、6、7所示’本發明之薄板式熱管丄之第 較佳貫施例，是包合 嘀 人 細結構。疋…4板組合體2、-工作流體3、- 20 593955 5 該薄板組合體2包括相對應結合的一矩形下薄板21 與一上薄板22、一由該下薄板21與該上薄板22包覆界定 出的中空腔室23、一斜切45。的角隅24，及一裝設在該 下薄板2 1與上薄板22之間，且位於該角隅24並連通該中 空腔至23的充填除氣管25。該下薄板21具有多數貫穿形 成的穿孔211。該上薄板22具有一位於該上薄板22之周 邊的外環部221、一受該外環部221圍繞且凸隆形成的凸 部222，及多數對應鉚接在該下薄板21之穿孔21丨的卡塊 223 „亥外1衣部221恰可抵接在該下薄板21之一頂面212。 10 該凸部222具有多數凹陷形成的凹槽2221，該凹槽2221 之底部恰可卡抵於該下薄板21之頂面212,而形成一支撐 結構。藉該充填除氣管25而可充填工作流體3於該中空腔 室23内，與除氣使該中空腔室23呈真空狀態。 該工作流體3為傳統具有過熱蒸發、料還原特性之 1 5机體，是充填在該薄板組合體2之中空腔室U内。 該毛細結構是形成於該薄板組合體2之中空腔室23 内:在本實施例中該毛細結構為多數形成在該下薄板η 2面的直條溝槽4、亦可為複式交又溝槽（圖未示），或 置放在該中空腔室23内的金屬網（圖未示）。 ，參_ 8所^在實務上，當該充填除氣管Μ完 成除氟動作後，係利用一夾 A 、 灭/、5先夾扁該充填除氣管25， 口山-裁剪機具6剪斷經夾合加工作業所產生的一扁 鳊部（即封嘴部位），並於f .、 密閉 万斷後鈿予封口密閉；該封口 為如圖9所示之雷射裝置予以焊接密閉， 20 593955 或利用點膠⑯、閉。在此值得_提的是，藉該薄板組合體2 =角隅24的設計，可使經夾、剪、封口密閉後之充填除氣 管25,維持該薄板式熱管κ外觀平整度與不虞被外力碰 斷提高空間排列的實用性。重要的是，該薄板組合體 5 ^目則的厚度可達到1.2mm以下（請參閱附件），而具『輕、 薄』之設計，可適用於筆記型電腦·...等數位設備中，極且 實用價值。此外參閱圖6、7所示，當將本發明之薄板式：'， 管1之一底平面U貼置在一 CPU (圖未示）上時，亦可.- 在遠離該底平面U的側邊設置多數散熱鱗片（圖未示），φ· 10 以輔助散熱。 參閱圖10所示，本發明之薄板式熱管1，之第二較佳 實施例’其不同於第一較佳實施例的地方在於：該薄板組 合體2’未設有如圖6所示之充填除25，但其上薄板 15 20 22具有-位於該凸部222之中央位置的除氣孔224,及一 位於侧邊的充填孔（圖未示）。於實務上，是先利用一充填 機（圖未示）t充填針灌注該卫作流體（圖未示）於該薄But in fact, when the round tube surface of the heat pipe 10 is placed on a heating source (for example, the top plane of the CPU (not shown), only a small area of the heat transfer surface can be formed.) The lack of good results; in addition, another use: type, is to place most of the heat pipe 10 in the heat sink rotor assembly 2G-base 201 shown in Figure 2, borrow the bottom plane of the base 2G1 The large contact surface area of the CPU 30 placed on the CPU 30 shown in FIG. 3 to increase the temperature transmission surface. In this way, although the aforementioned shortcomings of the temperature transmission surface can be solved, the actual thermal temperature of the CPU 30 It is based on the heat transfer effect of the base with poor thermal conductivity, and then the 1G heat pipe with good thermal conductivity is used to disperse the temperature, but there is still a temperature transfer effect. In addition, see Figure 4 for the traditional flat heat pipe 4 (), 4 wonderful For plate heat, when 40 is placed on the CPU 30 for heat transfer, although it has a rapid temperature transfer and a large surface area to accelerate the heat transfer, it has a large thickness in general. Does not conform to the "light and thin" 20 ten-face pen 5 type computer ..... emphasis on lightweight portable digital devices, but not applicable to the above The shortcomings in the internal space of digital equipment are relatively limited in their practical value. [Summary of the Invention] 5 The purpose of the present invention is to provide-a method of manufacturing a thin plate heat pipe.-And another object of the present invention, It is to provide a thin-plate heat pipe with high practical value that conforms to the characteristics of "light, thin, button, small". The manufacturing method of the X-ray plate heat pipe is suitable for thin metal plates. 10 includes the following steps: () Knife Sheets · Cut two metal sheets into an upper sheet and a lower sheet that can be relatively combined; Material (material) Γ Closure material: Coat 15 Φ at the opposite peripheral edge position of any sheet It is consolidated with the lower sheet to form a sheet assembly with a middle two chamber; == sheet: the bonding material is used to seal the upper sheet and the lower sheet; filling work ~, chaos removing operation. Hollow in the sheet assembly The filling, M, and degassing of the chamber make the hollow chamber in a vacuum state; and 20 (F) sealing operations. Work :: and this: Mingzhi thin plate heat pipe, including -sheet combination,--upper sheet and- Lower sheet, one by == including phase The central office to be combined should be bounded by the upper 4 plate and the lower plate. The lower plate has most of the perforations formed therethrough. The upper 6 593955 cymbal plate has an outer ring located on the periphery of the upper plate. Part, a convex part surrounded by the outer ring part and formed by convexity, and most of the perforated clamping blocks corresponding to the lower sheet consolidated, the convex part has a groove formed by most depressions, and the bottom of the groove is just It clicks against the top surface of one of the lower sheets to form a supporting structure. The 5 working fluid is filled in the cavity in the sheet assembly. The capillary structure is formed in the cavity in the § sheet assembly. * In addition, the thin-plate heat pipe of the present invention includes a thin-plate assembly, two side covers, a working fluid, and a capillary structure. The thin-plate assembly is an extruded-body structure and includes a hollow cavity that defines a hollow cavity. A plate body, 10 a front open end and a rear open end located on two opposite sides of the plate body, and a branch structure hanging in the hollow cavity, the branch structure is composed of a plurality of branch building rib groups . The two side covers are respectively sealed before the thin plate assembly. Open end = rear open end. The working fluid is filled in the hollow cavity of the thin plate assembly. The capillary structure is formed in a cavity 15 in the sheet assembly. [Embodiment] The description of this month and other technical contents, features and effects will be clearly understood in the following detailed description of the fourth preferred embodiment with reference to the drawings.之前 Before the detailed description is made, the "similar elements" are indicated by the same reference numerals: see Figures 5, 6, and 7 "The thin plate heat pipe of the present invention is the preferred embodiment of the embodiment", which is included. People fine structure.疋 ... 4 plate assembly 2, -working fluid 3,-20 593955 5 The thin plate assembly 2 includes a rectangular lower sheet 21 and an upper sheet 22, which are correspondingly combined, and a package formed by the lower sheet 21 and the upper sheet 22. A hollow cavity 23 is defined by the cover, and an oblique cut 45 is formed. And a filling degassing tube 25 installed between the lower sheet 21 and the upper sheet 22 and located at the corner 24 and communicating with the hollow cavity to 23. The lower sheet 21 has a plurality of through holes 211 formed therethrough. The upper sheet 22 has an outer ring portion 221 located on the periphery of the upper sheet 22, a convex portion 222 surrounded by the outer ring portion 221 and protruding, and a plurality of corresponding holes 21 riveted to the lower sheet 21. The clamping block 223 „The outer clothing portion 221 can abut on one of the top surfaces 212 of the lower sheet 21. 10 The convex portion 222 has a recess 2221 formed by a plurality of depressions, and the bottom of the recess 2221 can just abut against The top surface 212 of the lower sheet 21 forms a supporting structure. By filling the degassing tube 25, the working fluid 3 can be filled in the hollow chamber 23, and the degassing makes the hollow chamber 23 in a vacuum state. The fluid 3 is a conventional 15 body with superheated evaporation and material reduction characteristics, and is filled in the hollow chamber U in the thin plate assembly 2. The capillary structure is formed in the hollow chamber 23 in the thin plate assembly 2: In this embodiment, the capillary structure is a plurality of straight grooves 4 formed on the η 2 side of the lower sheet, and may also be a double cross groove (not shown), or placed in the hollow cavity 23. Metal mesh (not shown). See _ 8 ^ In practice, when the filling degassing tube M completes the defluorination action After that, the filling and degassing tube 25 is first clamped with a clip A, extinguish / 5, and Koushan-cutting machine 6 cuts a flat crotch (ie, the sealing part) generated by the clamping processing operation, and f . After sealing, the seal is sealed; the seal is welded and sealed by the laser device as shown in Figure 9, 20 593955, or closed by using glue. Here it is worth mentioning that the thin plate assembly 2 = The design of the corners 24 can fill the degassing tube 25 after being clamped, cut and sealed, and maintain the appearance flatness of the thin-plate heat pipe κ and avoid being broken by external forces to improve the practicality of the spatial arrangement. It is important that the The thickness of the thin plate assembly can reach 1.2mm or less (see attachment), and it has a "light and thin" design, which can be applied to digital devices such as notebook computers ... and it is extremely practical. In addition, referring to Figs. 6 and 7, when the thin plate type of the present invention: ', a bottom plane U of the tube 1 is attached to a CPU (not shown), it can also be-at a distance from the bottom plane U Many heat sink scales (not shown) are set on the side, φ · 10 to assist heat dissipation. See Figure 10, The second preferred embodiment of the invented thin-plate heat pipe 1 differs from the first preferred embodiment in that the thin-plate assembly 2 'is not provided with filling 25 as shown in FIG. 15 20 22 has a degassing hole 224 at the center of the convex portion 222 and a filling hole (not shown) on the side. In practice, a filling machine (not shown) is first used to fill the needle. Infuse the Weizuo fluid (not shown) in the thin
板組合體2,之中空腔室（圖未示）内，再利用一除氣機（圖 未示）接合於該除氣孔224後，進行除氣作業。當然亦可 先除氣再充填工作流體。最後利用—雷射裝置（圖未示> 焊接密閉該除氣孔224或利用點膠方式密閉該除氣孔 224，以獲致封口氣密效果。 管7之第三 一工作流體 參閱圖11、12所示，本發明之薄板式熱 較佳實施例，包含一薄板組合體8、二側蓋9、 3及毛細結構。 9 593955 搭配參閱圖13所示，該薄板組合體8為擠壓成型之 一體式金屬結構體，並包括一界定出一中空腔室811的板 體8卜位於該板體8 1之兩相反側的一前開放端82與一後 開放端83、一垂設在該中空腔室811内的支撐結構，及一 5連通該中空腔室811的充填除氣管85，該支撐結構是由多 數支撐肋條84組構成。 該側蓋9包括一圓凹部91，及一遠離該圓凹部91的 、 連接部92。該二側蓋9之連接部92是分別套接固定在該' 薄板組合體8之前開放端82與後開放端83後，再利用一 _ 10雷射裝置（圖未不）焊接密閉該連接部92與該開放端82、 83之間隙、或利用一磨擦焊接頭（圖未示）以磨擦焊方式 密閉上述之間隙，亦可先置放適量之接著材料於上述間隙 後利用一高溫爐（圖未示）溶焊密閉之，以獲致封 效果。前述之充填除氣管85係穿社 、在 丁牙、、Ό隹其中一側蓋9後伸入 15 該中空腔室811中。 * ^工作流體3為傳統具有過熱蒸發、遇冷還原特性之 體’是充填在該薄板組合體8之中空腔室8ιι内。 該毛細結構是形成於該薄板組合 〇體8之中空腔室811 内。在本貫施例中該毛細結構為多數 20 811 开^成在该中空腔室 8 11之表面的直條溝槽4，亦可為旎彳丄 ^ L 為複式父又溝槽（圖未示）。 由上述構件組成，可使本發明 『舳⑦ '明之溥板式熱f 7符合 釭、缚』之設計，而可適用於筆記型電 中，極具實用價值。 ·.·.專數位設備 參閱圖14所示，本發明之镇妃4、4 4板式熱管7’之第四較佳 10 593955 實施例，其不同於第三較佳實施例的地方在於：該薄板組 合體8 ’未設有如圖12所示之充填除氣管85，而另設有一 位於中央位置且連通該中空腔室（圖未示）的除氣孔86, 及一位於側邊的充填孔（圖未示）。其除氣方式與圖1〇所 示之除氣孔224雷同，且充填工作流體與封口方式亦屬雷 同，所以在此不再贅述。 如圖15所示，為製造如圖5、10所示之薄板式熱管 的方法，包含下列步驟120〜170 : 10In the plate assembly 2, a deaerator (not shown) is connected to the deaeration hole 224 in a hollow cavity (not shown), and then a deaeration operation is performed. Of course, it is also possible to degas before filling the working fluid. Finally, a laser device (not shown) is used to seal the degassing hole 224 by welding or to close the degassing hole 224 by dispensing, so as to obtain a sealing airtight effect. The third working fluid of the tube 7 is shown in FIGS. 11 and 12. As shown, the thin plate thermal preferred embodiment of the present invention includes a thin plate assembly 8, two side covers 9, 3, and a capillary structure. 9 593955 As shown in FIG. 13, the thin plate assembly 8 is an extruded body. Metal structure, and includes a plate 8 defining a hollow chamber 811, a front open end 82 and a rear open end 83 located on two opposite sides of the plate 81, and a hanging in the hollow cavity. A support structure in the chamber 811 and a filling and degassing tube 85 communicating with the hollow chamber 811. The support structure is composed of a plurality of supporting ribs 84. The side cover 9 includes a circular recess 91 and a distance away from the circular recess 91. ， 连接 部 92. The connection portions 92 of the two side covers 9 are respectively socketed and fixed at the front open end 82 and the rear open end 83 of the thin sheet assembly 8, and then use a _10 laser device (not shown in the figure) ) Welding to seal the gap between the connecting portion 92 and the open ends 82, 83, or A friction welding head (not shown) is used to seal the above gap by friction welding. Alternatively, an appropriate amount of adhesive material can be placed in the above gap and then sealed by a high temperature furnace (not shown) to obtain the sealing effect. The above-mentioned filling and degassing tube 85 is worn through the company, and covers 9 on one side of the teeth, and then extends 15 into the hollow chamber 811. * ^ The working fluid 3 is a traditional one with superheated evaporation and cold reduction characteristics. The body 'is filled in the hollow cavity 8m of the thin plate assembly 8. The capillary structure is formed in the hollow cavity 811 of the thin plate assembly 0. In the present embodiment, the capillary structure is mostly 20 811 Kelvin ^ The straight grooves 4 formed on the surface of the hollow chamber 8 11 may also be 旎 彳 丄 ^ L is a double parent groove (not shown). Composed of the above components, the present invention "舳 ⑦ 'Mingzhi's plate-type heat f 7 is in line with the design of the 釭, binding', and can be applied to notebook type electricity, which is of great practical value...... The fourth preferred 10 593955 embodiment of the 4-plate heat pipe 7 'is different from the third The preferred embodiment is that the thin plate assembly 8 ′ is not provided with a filling degassing pipe 85 as shown in FIG. 12, and another degassing hole 86 is provided at a central position and communicates with the hollow chamber (not shown), And a filling hole (not shown) located on the side. The degassing method is the same as that of the degassing hole 224 shown in Figure 10, and the filling working fluid and the sealing method are also the same, so I will not repeat them here. As shown in FIG. 15, the method for manufacturing a thin plate heat pipe as shown in FIGS. 5 and 10 includes the following steps 120 to 170: 10
步驟120為裁切金屬薄板：將二金屬薄板裁切成可相 對結合的一下薄板21與一上薄板22。 步驟130為塗佈接著材料：在該下薄板21之頂面周 緣位置塗佈接著材料（圖未示）。Step 120 is cutting a metal sheet: two metal sheets are cut into a lower sheet 21 and an upper sheet 22 which can be relatively combined. Step 130 is applying a bonding material: a bonding material (not shown) is applied on the peripheral edge position of the top surface of the lower sheet 21.
步驟140為固結薄板：使該下薄板21與該上薄板u 固結成-形成有如圖7所示之中空腔t 23的薄板組合體 Y。在本實施例中該下薄板21與該上薄板22為鉚接固定。 $中空腔室23形成有-毛細結構；在本實施例中該毛細結 構為^數形成在該下薄板21之表面的直條溝槽4、亦可為 複式交叉溝槽（圖未示），或為-置放在該中空 的金屬網（圖未示）。 内 20 -υ ’「τ θ ’ar 碌卜薄； ”該上薄板22 ;在本實施例中，可利用一雷射裝置（ 示）或-高溫爐（圖未示）使該接著材料溶焊密閉該 板2 1與該上薄板22之間隙。 人 步驟16〇為充填、除氣作案：在 牧”茨缚板組合體2 11 593955 空腔室23内充填工作流體、 空狀態。在實務上，兮中允…、 ^空腔室23呈真 該中二腔室23可先充填工作& 氣，或先除氣再充填工作流體。如圖5 ^ =除 1係利用該充填除氣f 25 $ > & 之溥板式熱管 ^ 進行充填、除氣作掌。而园μ 所示之薄板式熱管丨，則利爾#从 菜而圖10 鱼兮上…， 於側邊的充填孔（圖未示）， —二板22之除氣孔224分別進行充填、除氣作業。 步驟1 7 0為封口作章··你 卜 空腔室23怪維持真空狀態二：圖；：氣作業後之中 10 -如為！閉如圖5所示之充填除氣管25，係利用 剪機16二 5^扁該充填除氣管25,再以一裁 6剪斷經夾合加工作業所產生的一扁平封 15 即封嘴部位），並於剪斷後施.予封口密閉；該封口密閉方 式為利用為如圖9所示之雷射裝i i⑼予以焊接 利用點膠密閉。 5 20 另外，參閱圖16所示，為密閉如圖1〇所示之除氣孔 224,可利用一封口機構11〇達成，該封口機構"〇包含一 套接在該除氣孔224上的腔室U1、一設置在該腔室^ 之頂部的玻璃112、一設置在該腔室丨丨丨之底部的〇型環 二3、一位於該腔室ln上方的雷射裝置114，及位於該腔 室111之兩相對外側的一球體供給裝置丨15與一除氣裝置 116。使用時，該除氣裝置116透過該腔室U1對該薄板組 合體2’之中空腔室（圖未示）除氣後，該球體供給裝置 將送出一金屬球i i 5 i卡抵定位在該除氣孔224上，最後利 12 用該雷射裝置U4焊接密閉該除氣孔224，達到封〇氣密 效果。於實務上亦可利用一注膠裝置（圖未示）灌膠^ 該除氣孔224，達到封口氣密效果。 此外，為密閉如圖1〇所示之除氣孔224，亦可利用一 5夾扁該除氣孔224的夾具（圖未示），再利用一雷射裝置（圖 未不）毛出n旎罝之雷射光在該除氣孔224之變形部位 士二而可同時掃斷、溶接該變形部位的末端段，達到封口 氣也效果。或利用一廢爲該除氣孔224的治具（圖未示）， 再利用-雷射裝置桿接密閉該除氣孔以，達到封 10 效果。 虱在 准以上所述者，僅為本發明之四較佳實施例而已，合 ，此限定本發明實施之範圍，即大凡依本發明申請： 匕也 月㈢内谷所作之簡單的等效變化與修飾， 15 I應仍屬本發明專利涵蓋之範圍内。 、牛疋本發明之薄板式熱管的側視圖。 【圓式簡單說明】 ^是9公告第510490號「熱管結構」之-剖視圖； 圖 20 說明2Γ公告，510490號「熱管結構」之一使用示意 夕數熱管垂設在—散熱鰭片組合體之一底座； 圖 二月：公告第510490號「熱管結構」之-使用示意 :散熱鰭片組合體之一底座貼置在—CPU上； 板式教-疋傳統平板式熱管的一使用示意圖，說明該平 板式熱官貼置在—CPU上進行傳熱動作； 圖5是本發明之薄板式熱管之第一較佳實施例的-立 13 體分解圖，說明一 板與一充填除氣管 薄板組合體至少包括一上薄板、一下薄 圖6是該第-較佳實施例的一立體外觀圖； 圖7疋圖6中沿線7_7的一組合剖視圖； 5 |^| 8 Η + 疋"亥第一較佳實施例之一除氣加工的使用示意 圖疋"亥弟較佳實施例於封口密閉加工的一使用示 意圖； 圖1 〇疋本發明之薄板式熱管之第二較佳實施例的一 10立體分解圖’說明一薄板組合體至少包括_上薄板與一下 薄板’該上薄板具有一除氣孔； 圖11疋本發明之薄板式熱管之第三較佳實施例的一 立體分解圖，說明該薄板式熱管至少包含一薄板組合體、 二蓋板及一除氣充填管，該薄板組合體為擠壓成型之一體 15 式金屬結構體； 圖12是該第三較佳實施例的一立體外觀圖； 圖13是圖12中沿線13-n的一組合剖視圖，說明該 薄板組合體之一中空腔室的表面形成有多數直條溝槽； 圖14是本發明之薄板式熱管之第四較佳實施例.的一 20立體外觀圖，說明一薄板組合體之一板體具有一除氣孔； 圖15是本發明之薄板式熱管之製造方法的一較佳實 施例的一流程圖；及 圖16是該薄板式熱管之製造方法之較佳實施例的一 動作示意圖，說明一上薄板之除氣孔，可利用一封口機構 14 593955 達成封口密閉效果，該封口機構包含一腔室、一玻璃、一 0型環、一雷射裝置、一球體供給裝置與一除氣裝置。 5 10 15 20 15 593955 【圖式之主要元件代表符號簡單說明】 1 薄板式熱管 11 底平面 Γ 薄板式熱管 2 薄板組合體 V 薄板組合體 5 21 下薄板 211 穿孔 212 頂面 22 上薄板 221 外環部 222 凸部 2221 凹槽 223 卡塊 224 除氣孔 23 中空腔室 10 24 角隅 25 充填除氣管 3 工作流體 4 直條溝槽 5 夾具 6 裁剪機具 7 薄板式熱管 7， 薄板式熱管 8 薄板組合體 8， 薄板組合體 15 81 板體 811 中空腔室 82 前開放端 83 後開放端 84 支撐肋條 85 充填除氣管 86 除氣孔 9 側蓋 91 圓凹部 92 連接部 20 100 雷射裝置 110 封口機構 111 腔室 112 玻璃 113 0型環 114 雷射裝置 115 球體供給裝置 1151 金屬球 116 除氣裝置 16Step 140 is to consolidate the thin plates: the lower thin plate 21 and the upper thin plate u are consolidated to form a thin plate assembly Y having a hollow cavity t 23 as shown in FIG. 7. In this embodiment, the lower sheet 21 and the upper sheet 22 are fixed by riveting. The hollow cavity 23 is formed with a capillary structure; in this embodiment, the capillary structure is a straight groove 4 formed on the surface of the lower sheet 21, or a double cross groove (not shown). Or-placed in the hollow metal mesh (not shown).内 20 -υ '“τ θ' ar thin plate;” the upper sheet 22; in this embodiment, a laser device (shown) or a high temperature furnace (not shown) can be used to melt and weld the bonding material The gap between the plate 21 and the upper sheet 22 is sealed. Step 16: Filling and degassing crimes: Fill working chamber 2 2 593955 with empty working chamber 23 filled with working fluid and empty state. In practice, Xizhongyun ..., ^ empty chamber 23 is true The second and second chambers 23 can be filled with working & gas first, or degassed first and then filled with working fluid. As shown in Figure 5 ^ = 1 except the filling and degassing f 25 $ > & Degassing for the palm. And the thin plate heat pipe shown in the garden μ 丨, Lier #From the dish and Figure 10 fish on… Filling holes (not shown) on the side, —the degassing holes of the second plate 22 224 Filling and degassing operations respectively. Step 170. Sealing and sealing ... You can use the cavity 23 to maintain the vacuum state. Second: Picture ;: After gas operation 10-If yes, close it as shown in Figure 5. The filling and degassing tube 25 is made by using a shearing machine 16 to 5 ^ to flatten the filling and degassing tube 25, and then a cut 6 is used to cut a flat seal 15 produced by the clamping process (that is, the sealing part), and applied after cutting .Pre-sealing; The method of sealing is to use a laser device as shown in Fig. 9 to weld and seal it with glue. 5 20 In addition Referring to FIG. 16, in order to close the degassing hole 224 shown in FIG. 10, it can be achieved by using a sealing mechanism 11. The sealing mechanism “includes a set of chambers U1 connected to the degassing hole 224. A glass 112 provided on the top of the chamber ^, an O-ring 2 provided on the bottom of the chamber 丨 丨 丨 3, a laser device 114 located above the chamber ln, and a laser device 114 located on the chamber 111 A ball supply device 15 and a degassing device 116 at two opposite outer sides. In use, the degassing device 116 passes through the chamber U1 to degas the hollow chamber (not shown) of the thin plate assembly 2 ', The sphere supply device will send out a metal ball ii 5 i card to be positioned on the degassing hole 224, and finally, the laser device U4 is used to weld and seal the degassing hole 224, so as to achieve the airtight effect. It can also be practical. A glue injection device (not shown) is used to fill the glue ^ the deaeration hole 224, to achieve a sealed airtight effect. In addition, in order to seal the deaeration hole 224 shown in Fig. 10, a 5 clip can also be used to flatten the deaeration hole 224 Fixture (not shown), and then use a laser device (not shown) to produce n 旎 罝 lightning The light on the deformed part of the deaeration hole 224 can be simultaneously scanned and welded at the end of the deformed part to achieve sealing effect. Or use a jig (not shown) for the deaeration hole 224, and then A laser device rod is used to close the degassing hole to achieve the effect of sealing 10. The above mentioned lice are only the four preferred embodiments of the present invention. Therefore, this defines the scope of implementation of the present invention, that is, the general Application according to the present invention: The simple equivalent changes and modifications made by the dagger are also within the scope of the invention patent. Side view of the thin plate heat pipe of the present invention. [Circular type brief explanation] ^ is a cross-sectional view of "Heat Pipe Structure" No. 9 510490; Figure 20 illustrates 2Γ Bulletin. One of the "Heat Pipe Structures" No. 510490 shows how to use the heat pipe on the heat sink fin assembly. A base; Figure February: Announcement No. 510490 of "Heat Pipe Structure"-Use Illustration: One base of the heat sink fin assembly is placed on the -CPU; a plate-type teaching-a traditional flat-plate heat pipe usage diagram, explaining the The flat-type thermal valve is placed on the CPU for heat transfer. Figure 5 is an exploded view of the first preferred embodiment of the thin-plate type heat pipe of the present invention, illustrating a 13-body exploded view, illustrating a plate and a filled degassing plate combination Including at least an upper sheet and a lower sheet FIG. 6 is a perspective view of the first preferred embodiment; FIG. 7 to FIG. 6 is a combined sectional view along line 7_7; 5 | ^ | 8 Η + 疋 " Schematic diagram of the use of degassing processing in one of the preferred embodiments 疋 " A schematic diagram of the use of the Haidi preferred embodiment in sealing and sealing processing; Figure 10 疋 10 of the second preferred embodiment of the thin plate heat pipe of the present invention An exploded view 'illustrates a thin plate group The combination includes at least an upper sheet and a lower sheet. The upper sheet has a degassing hole; FIG. 11 is a perspective exploded view of a third preferred embodiment of the sheet heat pipe of the present invention, illustrating that the sheet heat pipe includes at least one sheet combination Body, two cover plates and a degassing filling tube, the thin plate assembly is an extruded one-piece 15-type metal structure; FIG. 12 is a perspective view of the third preferred embodiment; FIG. 13 is a view of FIG. 12 A combined cross-sectional view along line 13-n illustrates that a plurality of straight grooves are formed on the surface of a hollow chamber of the thin-plate assembly; FIG. 14 is a 20-dimensional view of a fourth preferred embodiment of the thin-plate heat pipe of the present invention. An external view illustrating a plate body of a thin plate assembly having a degassing hole; FIG. 15 is a flowchart of a preferred embodiment of a method for manufacturing a thin plate heat pipe of the present invention; and FIG. 16 is a manufacture of the thin plate heat pipe A schematic diagram of the operation of a preferred embodiment of the method, illustrating the degassing hole of a thin plate. A sealing mechanism 14 593955 can be used to achieve the sealing effect. The sealing mechanism includes a chamber, a glass, a 0-ring, and a laser. Device, a sphere supply device and a degassing device. 5 10 15 20 15 593955 [Simplified description of the main symbols of the drawings] 1 Thin-plate heat pipe 11 Bottom plane Γ Thin-plate heat pipe 2 Thin-plate assembly V Thin-plate assembly 5 21 Lower sheet 211 Perforation 212 Top surface 22 Upper sheet 221 outside Ring 222 Convex 2221 Groove 223 Block 224 Degassing hole 23 Hollow chamber 10 24 Corner 25 Filling degassing tube 3 Working fluid 4 Straight groove 5 Fixture 6 Cutting machine 7 Sheet heat pipe 7 Sheet heat pipe 8 Sheet Combination 8, Thin plate combination 15 81 Plate 811 Hollow chamber 82 Front open end 83 Rear open end 84 Support ribs 85 Filling the degassing tube 86 Degassing hole 9 Side cover 91 Round recess 92 Connection part 20 100 Laser device 110 Sealing mechanism 111 Chamber 112 Glass 113 0-ring 114 Laser device 115 Ball supply device 1151 Metal ball 116 Degassing device 16