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TW584268U - Integrated hest sink module - Google Patents

Integrated hest sink module

Info

Publication number
TW584268U
TW584268U TW092201943U TW92201943U TW584268U TW 584268 U TW584268 U TW 584268U TW 092201943 U TW092201943 U TW 092201943U TW 92201943 U TW92201943 U TW 92201943U TW 584268 U TW584268 U TW 584268U
Authority
TW
Taiwan
Prior art keywords
hest
integrated
sink module
sink
module
Prior art date
Application number
TW092201943U
Other languages
English (en)
Inventor
Tzung-Shi Yu
Hung Jang
Original Assignee
Micro Star Int Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro Star Int Co Ltd filed Critical Micro Star Int Co Ltd
Priority to TW092201943U priority Critical patent/TW584268U/zh
Priority to US10/461,470 priority patent/US6906922B2/en
Publication of TW584268U publication Critical patent/TW584268U/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW092201943U 2003-01-30 2003-01-30 Integrated hest sink module TW584268U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092201943U TW584268U (en) 2003-01-30 2003-01-30 Integrated hest sink module
US10/461,470 US6906922B2 (en) 2003-01-30 2003-06-16 Integrated heat-dissipating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092201943U TW584268U (en) 2003-01-30 2003-01-30 Integrated hest sink module

Publications (1)

Publication Number Publication Date
TW584268U true TW584268U (en) 2004-04-11

Family

ID=32769304

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092201943U TW584268U (en) 2003-01-30 2003-01-30 Integrated hest sink module

Country Status (2)

Country Link
US (1) US6906922B2 (zh)
TW (1) TW584268U (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050121172A1 (en) * 2003-12-03 2005-06-09 Rotys Inc. Composite heatsink for cooling of heat-generating element
US7288839B2 (en) * 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
TWI260966B (en) * 2004-10-28 2006-08-21 Quanta Comp Inc Heat dissipation device
JP4655987B2 (ja) * 2006-04-19 2011-03-23 株式会社豊田自動織機 電子機器
CN100518475C (zh) * 2006-06-02 2009-07-22 富准精密工业(深圳)有限公司 散热装置
CA2573941A1 (en) 2007-01-15 2008-07-15 Coolit Systems Inc. Computer cooling system
US8289714B2 (en) * 2008-01-04 2012-10-16 APlus Mobile Inc. Ruggedized computer and aspects thereof
DE112011101959B4 (de) * 2010-06-07 2016-11-24 Mitsubishi Electric Corporation Wärmesenke und Verfahren zu deren Herstellung
US20120293952A1 (en) * 2011-05-19 2012-11-22 International Business Machines Corporation Heat transfer apparatus
CN103249275A (zh) * 2012-02-07 2013-08-14 鸿富锦精密工业（深圳）有限公司 散热系统
US8728240B2 (en) * 2012-05-02 2014-05-20 Msp Corporation Apparatus for vapor condensation and recovery
US9773718B2 (en) * 2013-08-07 2017-09-26 Oracle International Corporation Winged heat sink
CN110413079B (zh) 2018-04-28 2022-09-09 伊姆西Ip控股有限责任公司 用于扩展卡的热沉、包括热沉的扩展卡和相关制造方法
CN111722676B (zh) * 2019-03-20 2024-04-30 可可若器(北京)信息技术有限公司 一种基于微节点的高密度分布式数据库专用装置
CN111682282B (zh) * 2020-05-27 2023-08-08 风帆（扬州）有限责任公司 一种高效散热蓄电池
CN111712100B (zh) * 2020-06-03 2022-08-09 餐道信息科技有限公司 一种第三方外卖平台对接数据处理系统
CN113381365A (zh) * 2021-06-24 2021-09-10 江苏宏鹏电气科技有限公司 一种防护等级高的密集型母线槽
CN113747284B (zh) * 2021-09-01 2022-08-09 无锡杰夫电声股份有限公司 一种可降低使用时voc值的音箱
CN114007388B (zh) * 2021-11-02 2024-09-03 北京三明捷信息科技有限公司 一种具有散热功能的控制台
CN114269114B (zh) * 2021-12-14 2025-01-21 国网河南省电力公司电力科学研究院 一种基于工控协议的安全识别方法及装置
CN114361745A (zh) * 2022-01-21 2022-04-15 合肥讯立通讯科技有限公司 一种5g通信陶瓷滤波器
CN118632479B (zh) * 2024-05-29 2024-11-29 重庆科技大学 一种计算机网络隔离装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2959506B2 (ja) * 1997-02-03 1999-10-06 日本電気株式会社 マルチチップモジュールの冷却構造
US6091603A (en) * 1999-09-30 2000-07-18 International Business Machines Corporation Customizable lid for improved thermal performance of modules using flip chips
US6763881B1 (en) * 2000-02-18 2004-07-20 Agilent Technologies, Inc. Thermally matched gradient heat sink
US6396693B1 (en) * 2000-08-24 2002-05-28 Ming Fa Shih Heat sink
US6330906B1 (en) * 2000-11-13 2001-12-18 Chuan Sheng Corporation, Inc. Heat sink with flanged portions and spaced apart metal radiating fins
US6832410B2 (en) * 2002-04-23 2004-12-21 Hewlett-Packard Development Company, L.P. High performance cooling device with side mount fan
US6711016B2 (en) * 2002-05-07 2004-03-23 Asustek Computer Inc. Side exhaust heat dissipation module

Also Published As

Publication number Publication date
US6906922B2 (en) 2005-06-14
US20040150952A1 (en) 2004-08-05

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Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model