578447 玖、發明說明 【發明所屬之技術領域】 本發明是有關於一種靜電防護裝置，且特別是有關於 一種孔洞結構的靜電放電防護結構。 【先前技術】 一般電子設備，如顯示器、筆記型電腦、手機等，容 易被靜電放電（electrostatic discharge，ESD)破壞而影響 機器或系統設備的正常工作狀態。靜電放電現象所引發的 瞬間電位相當大，且因現今1C元件設計更趨縮小化，導 致可能引起靜電放電破壞的靜電位也隨之降低，在實際應 用上’某些高速元件在靜電位為3 0V時就可能被打壞。 造成靜電放電的原因係因為帶電荷物體會形成一電 場’該電場使附近的氣體電離而產生放電的現象。不論是 導體或非導體都會產生及累積電荷，通常電阻值越低的物 質’其靜電散逸的速度越快，不易累積電荷，反之，電阻 值越高的物質，其靜電散逸的速度越慢，容易累積很高的 電荷。因此，非導體更是容易累積靜電荷。一般人造聚合 物，如塑膠，因為具有南絕緣、南電阻的特性，其更能夠 蓄積靜電荷至相當長的一段時間。 對於非導體物質，避免其大量累積電荷的方法是將其 表面塗佈抗靜電物質，如碳粉、抗靜電劑或金屬薄膜層， 使非導體物質的表面形成導電層將其累積的電荷分散至 6 578447 他處。或是在非導體物質的製造過程中加入碳粉、抗靜電 =、金屬粉末或金屬纖維等，使非導體物質成為抗:電二 質或導電性物質。 靜電放電的防護方法中，接地是最有效且經濟的方 法。蓄積在物體上的電荷，會在一次放電中將能量完全釋 放’這是造成靜電放電破壞的最主要原因。其防護的方 法’就是將所有物體連接在一起，然後接地，並保持低的 接地電阻’使物體上的電荷能夠迅速地向大地散逸，避免 引起靜電放電的危害。 靜電放電的種類可分為直接靜電放電（direct E§D)和 間接靜電放電（indirect ESD)兩種。其中直接靜電放電依 其放電方式的不同又可分為接觸放電（c〇ntact discharge) 及空中放電（air discharge)。間接放電亦可分為水平耦合 面（horizontal coupling plane，HCP)和垂直耦合面（vertical coupling plane，VCP) 〇 為了避免靜電放電損傷電子元件，各種抵抗靜電放電 的軟體與硬體便因應而生。為提高電子設備本身抵抗靜電 的能力，讓系統能夠在穩定的狀態下工作，一般废商都會 在電子設備出廠前對其外殼進行一 ESD測試，以確保該 電子設備具有一定的抵抗靜電的能力。一般ESD測試之 環境為：溫度在15°C到35°C ;相對濕度在30%到60%之 間；大氣壓力在 68 Kpa(680 mbar)到 106 Kpa(1060mbar) 間。因此，ESD測試也是按照靜電放電的方式進行測試程 7 578447 序’測試該殼體是否能在各種不同靜電放電的情況下，依 然能夠有效的抵抗靜電。 第1A圖是習知筆記型電腦的外觀示意圖。請參照第 1A圖，筆記型電腦100之機體部分可分為機殼上蓋ι〇2 以及機體104。通常來說，為了達到減輕筆記型電腦之重 里以及減少製造成本的目的，機殼上蓋1〇2通常使用人造 聚合物，如塑膠等材質來製作。機體1〇4上具有喇队114, 為一電子元件，機殼上蓋102對應於喇114的位置具有 喇队輸出埠112，以利喇叭i 14發聲。 第1B圖係繪示第1A圖之機殼上蓋之背面示意圖。 請參照第1B圖，由於機殼上蓋1〇2之材質為塑膠等非導 體材質，因此其表面容易累積電荷。習知解決機殼上蓋 102累積電荷問題的方法係在其内層表面加上一層導電 材質薄膜122,例如喷上一層導電漆等，使機殼上蓋1〇2 表面上的電荷能夠迅速地向大地散逸，避免引起靜電放電 的危害。 然而，機殼上蓋102上的喇叭輸出埠j丨2為一孔洞結 構’通常具有密而多的孔洞，以利喇叭發聲。此種結構會 使導電漆在喷灑時向外溢出至機殼上蓋1〇2之外層表 面。因此，習知在喇叭輸出埠112之内層通常都不加上導 電材質薄膜122,以避免導電材質薄膜122,例如導電漆 等溢出而影響筆記型電腦100的外觀。而由於喇叭輸出= 112之内層缺乏導電材質薄膜122,因此在筆記型電腦⑽ 8578447 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to an electrostatic protection device, and more particularly to an electrostatic discharge protection structure with a hole structure. [Previous technology] General electronic equipment, such as displays, notebook computers, mobile phones, etc., are easily damaged by electrostatic discharge (ESD) and affect the normal working state of the machine or system equipment. The instantaneous potential caused by the electrostatic discharge phenomenon is quite large, and the current 1C component design is becoming smaller. As a result, the electrostatic potential that may cause electrostatic discharge damage is also reduced. In practical applications, 'some high-speed components have an electrostatic potential of 3 It may be damaged at 0V. The cause of electrostatic discharge is the phenomenon that a charged object forms an electric field, which ionizes nearby gas and causes a discharge. Whether it is a conductor or a non-conductor, it will generate and accumulate charges. Generally, the lower the resistance value, the faster the static electricity will dissipate, and the more difficult it is to accumulate charge. On the other hand, the higher the resistance value, the slower the static electricity will dissipate. Build up a very high charge. Therefore, non-conductors are more likely to accumulate static charges. Generally, artificial polymers, such as plastic, have the characteristics of south insulation and south resistance, and they can accumulate static charges for a relatively long period of time. For non-conducting substances, the method to avoid the accumulation of a large amount of charge is to coat the surface with antistatic substances, such as carbon powder, antistatic agents or metal thin film layers. 6 578447 elsewhere. Or add carbon powder, antistatic powder, metal powder or metal fiber in the manufacturing process of non-conducting substances, so that non-conducting substances become anti-electrical or conductive substances. Among electrostatic discharge protection methods, grounding is the most effective and economical method. The electric charge accumulated on the object will completely release the energy in one discharge. This is the most important cause of electrostatic discharge damage. The method of protection 'is to connect all objects together, then ground them, and keep the grounding resistance low, so that the charges on the objects can quickly dissipate to the ground, avoiding the danger of electrostatic discharge. There are two types of electrostatic discharge: direct electrostatic discharge (direct E§D) and indirect electrostatic discharge (indirect ESD). Among them, direct electrostatic discharge can be divided into contact discharge and air discharge according to the different discharge methods. Indirect discharge can also be divided into horizontal coupling plane (HCP) and vertical coupling plane (VCP). In order to prevent electrostatic discharge from damaging electronic components, various types of software and hardware resisting electrostatic discharge are created. In order to improve the ability of the electronic equipment to resist static electricity and allow the system to work in a stable state, general waste dealers perform an ESD test on the casing of the electronic equipment before leaving the factory to ensure that the electronic equipment has a certain ability to resist static electricity. The general ESD test environment is: the temperature is 15 ° C to 35 ° C; the relative humidity is between 30% and 60%; the atmospheric pressure is between 68 Kpa (680 mbar) and 106 Kpa (1060mbar). Therefore, the ESD test is also performed in accordance with the electrostatic discharge test procedure. Procedure 7 578447 Tests whether the case can effectively resist static electricity under various electrostatic discharge conditions. FIG. 1A is a schematic diagram of the appearance of a conventional notebook computer. Referring to FIG. 1A, the body portion of the notebook computer 100 can be divided into a casing top cover 102 and a body 104. Generally speaking, in order to reduce the weight of notebook computers and reduce manufacturing costs, the casing cover 102 is usually made of artificial polymers, such as plastic. The body 104 is provided with a radium 114, which is an electronic component. The housing cover 102 has a radium output port 112 corresponding to the position of the ra 114, so that the speaker i 14 can sound. FIG. 1B is a schematic diagram showing the back of the case cover of FIG. 1A. Please refer to Figure 1B. Since the material of the housing cover 102 is a non-conductive material such as plastic, it is easy to accumulate charges on its surface. A known method to solve the problem of accumulated charge on the upper case cover 102 is to add a layer of conductive material film 122 to its inner surface, such as spraying a layer of conductive paint, so that the charges on the surface of the upper case 102 can quickly dissipate to the ground. To avoid the danger of causing electrostatic discharge. However, the speaker output port j2 on the casing upper cover 102 is a hole structure. It usually has dense and many holes to facilitate the sound of the speaker. This structure will cause the conductive paint to spill out to the outer surface of the casing top cover 102 when sprayed. Therefore, it is known that a conductive material film 122 is not usually added to the inner layer of the speaker output port 112 to prevent the conductive material film 122, such as conductive paint, from overflowing and affecting the appearance of the notebook computer 100. And because the inner layer of speaker output = 112 lacks a conductive material film 122, so in a laptop ⑽ 8
出廠前的ESD測試中’似輸出埠112往往無法通過ESD 【發明内容】 因此本毛曰月#目的京尤是在提供一種洞結構的靜電 放電防護結構，用以#呈羽A ， 再用以改善習知電子元件之孔洞結構的靜電 放電問題。 根據本發明之上述目的，提出一種孔洞結構的靜電放 電防護結構。本發明在電子設備之孔洞結構以及電子元件 之間加入—多孔導電材質層，此多孔導電材質層為-導 體’與電子設備之外殼内層的導電材質薄膜相接觸，將孔 洞結構因缺乏導電材質薄膜而累積的電荷分散至他處’以 防止”亥孔洞結構累積電荷造成靜電放電而破壞該電子元 件。 依照本發明一較佳實施例，本發明之多孔導電材質層 為一導電布，為一具有多個微小孔洞的金屬纖維梭織物。 在另一較佳實施例中，多孔導電材質層亦可為一金屬薄 膜，金屬薄膜的材質可選擇鋁、銅或其他加工容易且導電 性良好的金屬，以利分散多孔結構所累積的電荷。 此外，可在多孔導電材質層以及電子元件之間再加入 一多孔塑膠材質層，利用其硬度較高且成本便宜的特點， 給予多孔導電材質層所需要的支撐。再者，亦可在多孔導 電材質層以及電子元件之間加入一濾網結構，來過濾由外 578447 界散播進入的灰塵，以保護該電子元件。 由上述本發明較佳實施例可知，應用本發明可解決習 知當外殼之孔洞結構的内層不具有導電材質薄膜時，容易 發生靜電放電的問題。本發明僅需要在孔洞結構以及電子 元件之間多加入一多孔導電材質層，利用多孔導電材質層 與外殼内層的導電材質薄膜相接觸來將孔洞結構所累積 的電荷分散。並且，利用額外再加入的多孔塑膠材質層， 使得本發明所利用的多孔導電材質層，如導電布或金屬薄 膜之厚度不需太厚，來減少製造成本。因此，本發明為一 種有效且便宜的靜電放電防護結構。 【實施方式】 為了改善習知電子元件之孔洞結構的靜電放電問 題’本發明提出一種孔洞結構的靜電放電防護結構。 本發明在電子設備之孔洞結構以及電子元件之間加 入一多孔導電材質層，此多孔導電材質層為一導體，與電 子設備之外殼内層的導電材質薄膜相接觸，將孔洞結構因 缺乏導電材質薄膜而累積的電荷分散至他處，以防止該孔 洞結構累積電荷造成靜電放電而破壞該電子元件。以下利 用第2A-2D圖並配合第1A-1B圖來說明本發明之孔洞結 構的靜電放電防護結構。 请參照第2A圖，其繪示依照本發明一較佳實施例的 示意圖。在此實施例中，在喇叭114以及喇叭輪出璋i 12 578447 之間所加入的多孔導電材質層為一導電布202，導電布 . 2〇2與機殼上蓋102之内層的導電材質薄膜ι22接觸，將 . 制队輸出埠11 2所累積的電荷分散至他處，以防止喇σ八輸 出谭112累積電荷造成靜電放電而破壞喇0八丨丨4或甚至整 台筆記型電腦1〇〇。第2Β圖則繪示筆記型電腦運用第2Α 圖之實施例之外觀示意圖。 導電布202可為一金屬纖維梭織物，使用金屬纖維為 導電材料並作為緯紗，以熱可塑性聚酯（ρΕΤ)纖維作為經 _ 紗。由實驗可知’金屬纖維梭織物之電磁屏蔽效應以及靜 電電位差衰減值隨著織物密度之增加而增加，因此可依照 靜電放電防護的規袼要求來挑選適合的金屬纖維梭織物 作為靜電放電防護的材質。再者，導電布2〇2為一具有多 個微小孔洞的結構，因此不會影響喇叭丨14的正常操作。 在另一較佳實施例中，在喇〇八丨14以及喇队輸出埠 112之間加入的多孔導電材質層為一金屬薄膜。金屬薄膜 的材質可選擇鋁、鋼或其他加工容易且導電性良好的金 · 屬：以利分散喇叭輸出_ i 12所累積的電荷。此外，在金 屬薄膜上也可製作複數個孔洞，以利喇叭11 4聲音的傳 遞。 由於本發明在電子元件以及其所對應的孔洞結構之 間所加入的夕孔導電材質層’如導電布202，其成本較 貴，-般會選用較薄的厚度以節省成本，如此卻會造成$ 電布202之支撐不夠而有固定不易的問題。因此，在又一 11 578447 較佳實施例中，多孔塑膠材質層綱之材f為聚醋薄膜 (mylar)’其成本便宜m易，可依需要裁減成所· 的形狀，並在其中打洞，以符合本發明所需。 而 而本發明另一較佳實施例所使用之金屬薄膜，其厚度 原本就很薄，因此亦可在金屬薄膜以及電子元件之門力入 此多孔塑膠材質層204’如帛2C圖所示，使金屬二膜 夠良好地固定住。如此，使金屬薄膜能與機殼上蓋In the ESD test before leaving the factory, it seems that the output port 112 often fails to pass the ESD. [Abstract] Therefore, this Mao Jingyue # aims to provide a hole-shaped electrostatic discharge protection structure, which is used for # 映 羽 A, and then used to Improve the electrostatic discharge problem of the hole structure of conventional electronic components. According to the above object of the present invention, an electrostatic discharge protection structure with a hole structure is proposed. The invention adds a porous conductive material layer between the hole structure of the electronic device and the electronic component. The porous conductive material layer is a conductor that is in contact with the conductive material film of the inner layer of the electronic device casing, and the hole structure is lacking of the conductive material film. And the accumulated charge is dispersed elsewhere to prevent “Hai ’s hole structure from accumulating charges and causing electrostatic discharge to damage the electronic component. According to a preferred embodiment of the present invention, the porous conductive material layer of the present invention is a conductive cloth, which has a Metal fiber woven fabric with multiple tiny holes. In another preferred embodiment, the porous conductive material layer may also be a metal film, and the material of the metal film may be selected from aluminum, copper, or other metals that are easy to process and have good conductivity. In order to disperse the accumulated charge of the porous structure. In addition, a porous plastic material layer can be added between the porous conductive material layer and the electronic component, which takes advantage of its high hardness and low cost to give the porous conductive material layer the required In addition, a filter can also be added between the porous conductive material layer and the electronic components. Structure to filter the dust scattered from the outer 578447 boundary to protect the electronic component. According to the above-mentioned preferred embodiments of the present invention, it can be known that applying the present invention can solve the conventional problem when the inner layer of the hole structure of the shell does not have a conductive material film, The problem of electrostatic discharge is easy to occur. The present invention only needs to add a porous conductive material layer between the hole structure and the electronic component, and uses the porous conductive material layer to contact the conductive material film of the inner layer of the shell to charge the accumulated charges in the hole structure. Moreover, the additional porous plastic material layer is used so that the thickness of the porous conductive material layer used in the present invention, such as conductive cloth or metal film, does not need to be too thick to reduce the manufacturing cost. Therefore, the present invention is effective And an inexpensive electrostatic discharge protection structure. [Embodiment] In order to improve the electrostatic discharge problem of the hole structure of the conventional electronic component, the present invention proposes a hole-structured electrostatic discharge protection structure. The present invention relates to a hole structure of an electronic device and an electronic component. A porous conductive material layer is added between the porous conductive materials. The mass layer is a conductor that is in contact with the conductive material film on the inner layer of the housing of the electronic device. The charge accumulated in the hole structure due to the lack of the conductive material film is dispersed elsewhere to prevent the accumulated charge from the hole structure from causing electrostatic discharge to destroy the electron. The components are described below with reference to Figures 2A-2D and Figures 1A-1B to illustrate the electrostatic discharge protection structure of the hole structure of the present invention. Please refer to Figure 2A, which illustrates a schematic diagram according to a preferred embodiment of the present invention. In this embodiment, the porous conductive material layer added between the horn 114 and the horn wheel 12i 12 578447 is a conductive cloth 202, which is in contact with the conductive material film ι22 on the inner layer of the casing upper cover 102. Disperse the charge accumulated in the output port 11 2 of the production team to other places to prevent the accumulated charge from the output of La σ 8 output Tan 112 from causing electrostatic discharge to damage La 0 丨 丨 4 or even the entire notebook computer 100. Figure 2B is a schematic diagram showing the appearance of the notebook computer using Figure 2A. The conductive cloth 202 may be a metal fiber woven fabric. The metal fiber is used as a conductive material as the weft yarn, and the thermoplastic polyester (ρΕΤ) fiber is used as the warp yarn. It can be known from experiments that the electromagnetic shielding effect of metal fiber woven fabrics and the attenuation value of electrostatic potential difference increase with the increase of fabric density. Therefore, according to the requirements of electrostatic discharge protection regulations, a suitable metal fiber woven fabric can be selected as the material for electrostatic discharge protection. . Furthermore, the conductive cloth 202 has a structure having a plurality of minute holes, and therefore does not affect the normal operation of the speaker 14. In another preferred embodiment, the porous conductive material layer added between La 08/14 and La 12 output port 112 is a metal thin film. The material of the metal thin film can be selected from aluminum, steel, or other metal that is easy to process and has good conductivity. · Metal: In order to disperse the accumulated charge of the speaker output _ i 12. In addition, several holes can be made in the metal film to facilitate the transmission of the sound of the speaker 114. Since the conductive material layer such as conductive cloth 202 added between the electronic component and the corresponding hole structure of the present invention is more expensive, generally a thinner thickness is used to save costs, but this will cause $ Electric cloth 202 has insufficient support and is not easy to fix. Therefore, in another preferred embodiment of 11 578447, the material f of the porous plastic material layer is a mylar film, which is cheap and easy to cut, and can be cut into the shape as required, and punched in it. To meet the needs of the present invention. And the metal thin film used in another preferred embodiment of the present invention has a very thin thickness, so the porous plastic material layer 204 'can also be inserted into the metal thin film and the gate of the electronic component as shown in Fig. 2C. Make the second metal film hold well. In this way, the metal film can be connected with the upper cover of the cabinet.
之内層的導電材質薄膜122保持接觸’以分散剩叭輸出琿 1 1 2所累積的電荷。The conductive thin film 122 of the inner layer is kept in contact 'to disperse the charge accumulated in the remaining output 珲 1 1 2.
此外，由於一般電子元件，例如喇叭114等，通常為 了防塵需要會加上濾網，因此本發明亦可在多孔導電材質 層202以及剩口八114之間加上-濾網結構2〇6，如第2D 圖所示，來過濾由外界散播進入的灰塵，以保護喇队ιΐ4。In addition, since general electronic components, such as the speaker 114, are usually added with a filter for dust prevention, the present invention can also add a filter structure 206 between the porous conductive material layer 202 and the remaining openings 114. As shown in Figure 2D, filter the dust from the outside to protect the team.
由上述本發明較佳實施例可知，應用本發明可解決習 知s外喊之孔洞結構的内層不具有導電材質薄膜時，容易 發生靜電放電的問題。本發明僅需要在孔洞結構以及電子 元件之間多加入一多孔導電材質層，利用多孔導電材質層 與外设内層的導電材質薄膜相接觸來將孔洞結構所累積 的電荷分散。並且，利用額外再加入的多孔塑膠材質層， 使知本發明所利用的多孔導電材質層，如導電布或金屬薄 膜之厚度不需太厚，來減少製造成本。因此，本發明為一 種有效且便宜的靜電放電防護結構。 雖然本發明已以一較佳實施例揭露如上，然其並非用 12 ^ /8447 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作各種之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、和優點能更明 顯易1ϊ，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下： =1B圖係繪示第1A圖之機殼上蓋之背面示意圖。 圖係、9不依照本發明一較佳實施例的示意圖。 外觀示Γ圖圖料示筆記型電腦運用第2A圖之實施例之 圖。第2C圖係繪示依照本發明另一較佳實施例的示意 圖。 圖騎不依照本發明又-較佳實施例的示意 【元件代表符號簡 100 : 102 ： 單說明 】 筆記型電腦 機殼上蓋 13 578447 104 :機體 112 :喇。八輸出埠 114 : σ刺口八 122 :導電材質薄膜 202 :導電布 204 :多孔塑膠材質層 206 :濾網結構It can be known from the above-mentioned preferred embodiments of the present invention that the application of the present invention can solve the problem that electrostatic discharge is liable to occur when the inner layer of the conventional hole structure without a conductive material film is used. The present invention only needs to add a porous conductive material layer between the hole structure and the electronic component, and use the porous conductive material layer to contact the conductive material film of the inner layer of the peripheral device to disperse the accumulated charge of the hole structure. In addition, the additional porous plastic material layer is used, so that the thickness of the porous conductive material layer used in the present invention, such as a conductive cloth or a metal film, need not be too thick to reduce the manufacturing cost. Therefore, the present invention is an effective and inexpensive electrostatic discharge protection structure. Although the present invention has been disclosed as above with a preferred embodiment, it does not limit the present invention with 12 ^ / 8447. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Retouching, so the scope of protection of the present invention shall be determined by the scope of the attached patent application. [Brief description of the drawings] In order to make the above and other objects, features, and advantages of the present invention more obvious and easy, a preferred embodiment is given below, and in conjunction with the attached drawings, the detailed description is as follows: = 1B It is a schematic diagram showing the back of the case cover of FIG. 1A. Figure 9 is a schematic diagram of a preferred embodiment of the present invention. Appearance Figure Γ The figure shows an example in which the notebook computer uses Figure 2A. Fig. 2C is a schematic diagram showing another preferred embodiment of the present invention. The figure does not follow the schematic diagram of the preferred embodiment of the present invention. [Element representative symbols: 100: 102: Single description] Notebook computer case cover 13 578447 104: body 112: la. Eight output ports 114: σ bayonet eight 122: conductive material film 202: conductive cloth 204: porous plastic material layer 206: filter structure