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TW577586U - Liquid cooling device - Google Patents

Liquid cooling device

Info

Publication number
TW577586U
TW577586U TW092201190U TW92201190U TW577586U TW 577586 U TW577586 U TW 577586U TW 092201190 U TW092201190 U TW 092201190U TW 92201190 U TW92201190 U TW 92201190U TW 577586 U TW577586 U TW 577586U
Authority
TW
Taiwan
Prior art keywords
cooling device
liquid cooling
liquid
cooling
Prior art date
Application number
TW092201190U
Other languages
Chinese (zh)
Inventor
Hsieh-Kun Lee
Lei Li
Cheng-Tien Lai
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW092201190U priority Critical patent/TW577586U/en
Priority to US10/636,844 priority patent/US20040140084A1/en
Publication of TW577586U publication Critical patent/TW577586U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW092201190U 2003-01-22 2003-01-22 Liquid cooling device TW577586U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092201190U TW577586U (en) 2003-01-22 2003-01-22 Liquid cooling device
US10/636,844 US20040140084A1 (en) 2003-01-22 2003-08-06 Heat dissipating device with forced coolant and air flow

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092201190U TW577586U (en) 2003-01-22 2003-01-22 Liquid cooling device

Publications (1)

Publication Number Publication Date
TW577586U true TW577586U (en) 2004-02-21

Family

ID=32710233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092201190U TW577586U (en) 2003-01-22 2003-01-22 Liquid cooling device

Country Status (2)

Country Link
US (1) US20040140084A1 (en)
TW (1) TW577586U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI860791B (en) * 2023-07-21 2024-11-01 緯穎科技服務股份有限公司 Cooling module, electronic system and control method thereof

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050099774A1 (en) * 2003-11-06 2005-05-12 Kyu Sop Song Semiconductor chip cooling module with fin-fan-fin configuration
JP4549759B2 (en) * 2004-07-08 2010-09-22 富士通株式会社 Cooling module
CN100499090C (en) * 2004-07-31 2009-06-10 鸿富锦精密工业（深圳）有限公司 Liquid cooling thermolysis device
GB2419463A (en) * 2004-10-25 2006-04-26 Elan House Ltd Heat sink
WO2006111941A2 (en) * 2005-04-22 2006-10-26 Ferrotec (Usa) Corporation High efficiency fluid heat exchanger and method of manufacture
CN100444368C (en) * 2005-08-03 2008-12-17 富准精密工业(深圳)有限公司 Integrated liquid cooling heat abstractor
CN103629851A (en) * 2013-12-04 2014-03-12 中国科学院光电技术研究所 Air-cooling and liquid-cooling dual-purpose radiator
CN104936412A (en) * 2014-03-18 2015-09-23 鸿富锦精密工业(武汉)有限公司 Heat radiating device
CN106793704A (en) * 2017-01-09 2017-05-31 广东黑拍师光电有限公司 Liquid cooling integrated apparatus and liquid cooling method
US10199308B2 (en) * 2017-04-24 2019-02-05 Dynatron Corporation Liquid-cooled heat sink
CN107731765B (en) * 2017-11-16 2020-02-07 安徽祥博传热科技有限公司 Integrated liquid cooling radiator
JP2020109781A (en) * 2018-12-28 2020-07-16 日本電産株式会社 Cooling apparatus
CN217523124U (en) * 2021-10-08 2022-09-30 春鸿电子科技(重庆)有限公司 Water cooling head

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
DE19643717A1 (en) * 1996-10-23 1998-04-30 Asea Brown Boveri Liquid cooling device for a high-performance semiconductor module
US6223810B1 (en) * 1998-03-31 2001-05-01 International Business Machines Extended air cooling with heat loop for dense or compact configurations of electronic components
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US5940270A (en) * 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
US6263957B1 (en) * 2000-01-13 2001-07-24 Lucent Technologies Inc. Integrated active cooling device for board mounted electric components
US6431260B1 (en) * 2000-12-21 2002-08-13 International Business Machines Corporation Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof
TW543828U (en) * 2001-07-12 2003-07-21 Foxconn Prec Components Co Ltd Assembly of heating-tube heat sink
TW531634B (en) * 2002-03-08 2003-05-11 Ching-Feng Wang Counter flow type heat exchanger with integrally formed fin and tube
US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device
US6702002B2 (en) * 2002-06-03 2004-03-09 Chin-Wen Wang Hydronic pump type heat radiator
US6655449B1 (en) * 2002-11-08 2003-12-02 Cho-Chang Hsien Heat dissipation device by liquid cooling

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI860791B (en) * 2023-07-21 2024-11-01 緯穎科技服務股份有限公司 Cooling module, electronic system and control method thereof

Also Published As

Publication number Publication date
US20040140084A1 (en) 2004-07-22

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees