TW560233B - Cut-plate grind-edge machine of circuit board and cut-plate grind-edge method - Google Patents
Cut-plate grind-edge machine of circuit board and cut-plate grind-edge method Download PDFInfo
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- TW560233B TW560233B TW91132140A TW91132140A TW560233B TW 560233 B TW560233 B TW 560233B TW 91132140 A TW91132140 A TW 91132140A TW 91132140 A TW91132140 A TW 91132140A TW 560233 B TW560233 B TW 560233B
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Abstract
Description
560233 五、發明說明(1) 【發明範圍】 本發明「電路板之裁板磨邊機及裁板磨邊方法 ,尤 指利用一種機具可將電路板之四個側邊,以兩相對^之方 式,藉兩道連貫程序進行裁板與磨邊之方法者。 ~ 【習用背景】 電路板於產製過程中,需將四個側邊的尺寸依需束進 行裁板與磨邊。長久以來一直沒有理想實用的電路二裁板 與磨邊機,可以提供全自動化的方式進行高效率之加工程 序,導致產能一直無法提升;又因未能全面自動化,人^ 成本無法降低,連帶使得廠家競爭力無法提升。 發明人有鑑於此,為改善現有缺失,特研發成本案, 期能藉本案之提出,俾提供一種理想、實用的「電路板之 裁板磨邊機及裁板磨邊方法」,以提高產業競爭力。 【發明目的】 本案目的在於:提供一種「電路板之裁板磨邊機及裁 板磨邊方法」,其可就電路板之四個側邊,提供一種理想 實用的裁板與磨邊之機具和方法。 【實施例】 茲就本發明「電路板之裁板磨邊機及裁板磨邊方法」 之實施方法,及其所產生之功效,配合圖式,舉一本案之 較佳實施例詳細說明如下:560233 V. Description of the invention (1) [Scope of the invention] The present invention "cutting and edge-cutting machine for circuit boards and edge-cutting methods for cutting boards, especially the use of a machine that can move the four sides of the circuit board in two opposite directions. Method, the method of cutting and edging by two consecutive procedures. ~ [Practical background] In the production process of the circuit board, the dimensions of the four sides need to be cut and edging as required. For a long time There has been no ideal and practical circuit board two cutting board and edger, which can provide a fully automated way to carry out high-efficiency processing procedures, which has led to the failure to increase production capacity. Due to the failure to fully automate, the cost cannot be reduced, which has led to competition among manufacturers. In view of this, the inventor has developed a cost case to improve the existing shortcomings, and hopes to use the proposal of this case to provide an ideal and practical "cutting machine and cutting method for cutting board" To improve industrial competitiveness. [Objective of the Invention] The purpose of this case is to provide a "cutting and edging machine for circuit boards and a method for cutting and edging", which can provide an ideal and practical cutting and edging machine for the four sides of a printed circuit board. And methods. [Embodiment] The implementation method of the "board edging machine and method for edging of a circuit board" of the present invention and the effect produced by it are described in detail with reference to the preferred embodiment of the present case as follows. :
560233 五、發明說明(2) 【實施例】 首請參閱第一圖所示,係為本案之立體外觀參考圖, 再請配合第二圖,本案係於一基座1上,設置包括有第一 輸送機構2、第二輸送機構3、第一夾壓機構4、第二夾 壓機構5、第一裁板磨邊機構6、第二裁板磨邊機構7、 旋轉機構8與搬移機構9等,其中: 第一輸送機構2 ,可在基座1上進行滑移,其具有 升、降功能,其上設有若干吸盤2 1 ; 第二輸送機構3 ,可在基座1上進行滑移,結構與第 一輸送機構2相同,亦具有升、降功能;該第二輸送機構 3與第一輸送機構2對應於基座1上之滑移,兩者間係呈 等距離關係; 第一夾壓機構4 ,對應分設於基座1上適當處兩側, 其主要係由壓合裝置4 1與固定裝置4 2所組成,該壓合 裝置4 1具有上、下之升、降功能,而固定裝置42則呈 固定狀態; 第二夾壓機構5 ,結構第一夾壓機構4相同,對應分 設於基座1上適當處兩側,其主要係由壓合裝置5 1與固 定裝置5 2所組成,該壓合裝置5 1具有上、下之升、降 功能,而固定裝置5 2則呈固定狀態; 第一裁板磨邊機構6 ,係由裁板裝置6 1與磨邊裝置 6 2所組成,該兩第一裁板磨邊機構6係對應分設於基座 1上適當處兩側,特別是在兩第一夾壓機構4外側緣,該560233 V. Description of the invention (2) [Example] First, please refer to the first figure, which is a reference view of the three-dimensional appearance of this case, and then please cooperate with the second figure. This case is on a base 1, and the installation includes the first A conveying mechanism 2, a second conveying mechanism 3, a first clamping mechanism 4, a second clamping mechanism 5, a first cutting board edging mechanism 6, a second cutting board edging mechanism 7, a rotating mechanism 8 and a moving mechanism 9 Etc. Among them: the first conveying mechanism 2 can slide on the base 1 and it has the function of raising and lowering, and there are several suction cups 2 1; the second conveying mechanism 3 can slide on the base 1 The structure is the same as that of the first conveying mechanism 2, and it also has the function of raising and lowering. The second conveying mechanism 3 and the first conveying mechanism 2 correspond to the sliding movement on the base 1. The two are in an equal distance relationship. A clamping mechanism 4 correspondingly arranged on both sides of the appropriate place on the base 1 is mainly composed of a crimping device 41 and a fixing device 4 2. The crimping device 41 has an upward and a downward lifting and lowering. Function, while the fixing device 42 is in a fixed state; the second clamping mechanism 5 has the same structure as the first clamping mechanism 4, It should be located on both sides of the base 1 at appropriate places. It is mainly composed of a pressing device 5 1 and a fixing device 5 2. The pressing device 51 has the functions of raising and lowering, and the fixing device 5 2 is in a fixed state; the first cutting plate edging mechanism 6 is composed of the cutting plate device 61 and the edging device 62, and the two first cutting plate edging mechanisms 6 are respectively arranged on the base 1. Where appropriate, especially on the outer edges of the two first clamping mechanisms 4,
560233 五、發明說明(3) 第一裁板磨邊機構6可平行於基座1進行滑移; 第二裁板磨邊機構7 ,係由裁板裝置γ丄與磨邊裝置 7 2所組成,讜兩第二裁板磨邊機構7係對應分設於基座 1上適當處兩側,特別是在兩第二夾壓機構5外側緣,該 第二裁板磨邊機構7可平行於基座1進行滑移; 旋轉機構8 ’懸吊於基座1上之兩第一夾壓機構 中央頂部,其底面81設有吸盤82,且其=㈡ 轉功能; 义560233 V. Description of the invention (3) The first cutting board edging mechanism 6 can slide parallel to the base 1; the second cutting board edging mechanism 7 is composed of the cutting board device γ 丄 and the edging device 72 The two second cutting board edging mechanisms 7 are correspondingly located on both sides of the base 1 at appropriate places, especially on the outer edges of the two second clamping mechanisms 5. The second cutting board edging mechanism 7 can be parallel to The base 1 slides; the rotating mechanism 8 ′ is suspended from the center top of the two first clamping mechanisms on the base 1, the bottom surface 81 is provided with a suction cup 82, and its = ㈡ rotation function;
搬移機構9 ’懸吊於基座1上之兩第二夾壓機 中央頂部,其底面9 i設有吸盤9 2,底面9心:的 降’且該底面9 1可利用滑執9 3達成滑移目的。The moving mechanism 9 'is suspended from the center top of the two second crimping machines on the base 1. The bottom surface 9 i is provided with a suction cup 9 2 and the bottom surface 9 is centered. The bottom surface 9 1 can be achieved by sliding the handle 9 3 Slip purpose.
請配合第三圖,當電路板9 9擺置於第一輸送機構2 上時,其上若干吸盤2 1將提供吸力以便吸住電路板9 9 ’第二輸送機構2將於基座上i滑移,直到第一失壓 構4處停止,此時第一夾壓機構4之壓合裝置4 1未與固 定裝置4 2壓合,其間形成空間可供電路板9 9之兩;|則 穿越’此時之電路板9 9高度因第一輸送機構2而略較固 疋裝置4 2稍南’如第四圖’令第一輸送機構2下降高产 並解除吸盤2 1之吸力,可將電路板9 9擺置於固定裝2 42上,即如第五圖所示;再令壓合裝置4 1下壓,^可 將電路板9 9夾壓於壓合裝置4 1與固定裝置4 2之間沐 ’如第六圖所示;11由驅動第-裁板磨邊機 置6 2依序^路板9 9外緣,可使裁板裝置6 1與磨邊裝 、十斜電路板9 9之兩對應側邊進行裁板與磨邊Please cooperate with the third figure. When the circuit board 9 9 is placed on the first conveying mechanism 2, a plurality of suction cups 2 1 thereon will provide suction to attract the circuit board 9 9 'and the second conveying mechanism 2 will be on the base i Slide until the first pressure loss structure 4 stops, at this time, the pressing device 41 of the first clamping mechanism 4 is not pressed with the fixing device 42, and a space is formed between the two of the circuit boards 9 9; then Crossing 'the height of the circuit board 9 9 at this time is slightly higher than that of the fixed device due to the first conveying mechanism 2 4 2 slightly south' as shown in the fourth figure, so that the first conveying mechanism 2 is lowered in high yield and the suction force of the suction cup 21 is released, and the The circuit board 9 9 is placed on the fixing device 2 42, as shown in the fifth figure; then the pressing device 41 is pressed down, and the circuit board 9 9 can be sandwiched between the pressing device 4 1 and the fixing device 4 2 between the two as shown in the sixth figure; 11 is driven by the first-cutting board edging machine 6 2 in sequence ^ road board 9 9 outer edge, the cutting board device 61 can be installed with edging, ten inclined circuit The two sides of the plate 9 9 are cut and edged.
第7頁 560233 五、發明說明(4) 作業,如第七圖;而後第一裁板磨邊機構6回歸原位,如 第八圖;令壓合裝置4 1上升,電路板9 9形成僅置放於 固定裝置4 2上,如第九圖;再令旋轉機構8下降,利用 其底面8 1之吸盤8 2吸力吸引電路板9 9 ,使致電路板 9 9被吸附於底面8 1處連接,令旋轉機構8上升並旋轉 九十度角,此時電路板9 9亦被懸空旋轉九十度,如第十 圖;令第一輸送機構2與第二輸送機構3同步於基座1上 滑移,使致第二輸送機構3恰好位移到旋轉機構8正下 方,如第十一圖與第十二圖,此時第一輸送機構2歸位承 接下一塊剛送入的電路板9 9 1 ;經將旋轉機構8下降, 可將電路板9 9置放於第二輸送機構3上,此時第一輸送 機構2亦已承接下一塊剛送入的電路板9 9 1 (電路板9 9 1代表下一塊進行處理之電路板),如第十三圖;令旋 轉機構8上升,並使第二輸送機構3之吸盤3 1吸引住電 路板9 9 ,如第十四圖;而後同步位移第一輸送機構2與 第二輸送機構3 ,使致第一輸送機構2移靠到第一夾壓機 構4處,而第二輸送機構3移靠到第二夾壓機構5處,如 第十五圖所示(此時之第一輸送機構2後續動作與前述相 同循環);令第二輸送機構3下降高度並解除吸盤3 1之 吸力,可將電路板9 9擺置於固定裝置5 2上,即如第十 六圖所示;再令壓合裝置5 1下壓,便可將電路板9 9夾 壓於壓合裝置5 1與固定裝置5 2之間並形成固定狀態, 如第十七圖所示;藉由驅動第二裁板磨邊機構7滑移於電 路板9 9外緣,可使裁板裝置7 1與磨邊裝置7 2依序針Page 7 560233 V. Description of the invention (4) Operation, as shown in the seventh figure; then the first cutting board edging mechanism 6 returns to its original position, as shown in the eighth figure; the pressing device 41 is raised, and the circuit board 9 9 is formed only Place it on the fixing device 4 2 as shown in the ninth figure; then lower the rotating mechanism 8 and suck the circuit board 9 9 with the suction pad 8 2 of the bottom surface 8 1 to attract the circuit board 9 9 to the bottom surface 8 1 The connection causes the rotating mechanism 8 to rise and rotate at a 90-degree angle. At this time, the circuit board 99 is also suspended and rotated 90 degrees, as shown in the tenth figure; the first conveying mechanism 2 and the second conveying mechanism 3 are synchronized with the base 1 The upper slide causes the second conveying mechanism 3 to be displaced just below the rotating mechanism 8 as shown in Figures 11 and 12. At this time, the first conveying mechanism 2 returns to the next circuit board 9 just fed in. 9 1; After the rotating mechanism 8 is lowered, the circuit board 9 9 can be placed on the second conveying mechanism 3. At this time, the first conveying mechanism 2 has also received the next circuit board 9 9 1 (circuit board) 9 9 1 represents the next circuit board to be processed), as shown in the thirteenth figure; the rotating mechanism 8 is raised, and the second conveying mechanism 3 The sucker 31 attracts the circuit board 9 9 as shown in the fourteenth figure; and then simultaneously shifts the first conveying mechanism 2 and the second conveying mechanism 3 so that the first conveying mechanism 2 moves to the first clamping mechanism 4. The second conveying mechanism 3 moves to the second pinch mechanism 5 as shown in FIG. 15 (at this time, the subsequent movement of the first conveying mechanism 2 is the same as that described above); the second conveying mechanism 3 is lowered in height and After releasing the suction force of the sucker 31, the circuit board 9 9 can be placed on the fixing device 5 2 as shown in the sixteenth figure; and then the pressing device 51 can be pressed to clamp the circuit board 9 9 A fixed state is formed between the crimping device 51 and the fixing device 52, as shown in FIG. 17; by driving the second cutting board edging mechanism 7 to slide on the outer edge of the circuit board 9 9, the cutting can be performed. Plate device 7 1 and edging device 7 2
560233 五、發明說明(5) 對電路板9 9之剩餘兩對應側邊進行裁板與磨邊作業,即 如第十八圖所示;經第二裁板磨邊機構7歸位,如第十九 圖;再令壓合裝置5 1上升,電路板9 9形成僅置放於固 定裝置5 2上,如第二十圖;復令搬移機構9下降,利用 其底面9 1之吸盤9 2吸力吸引電路板9 9 ,使致電路板 9 9被吸附於底面9 1處連接,並令搬移機構9上升並旋 轉九十度角,即如第二十一圖;當該電路板9 9被吸附於 搬移機構9之底面9 1後,第一輸送機構2與第二輸送機 構3將再次歸位以進行下一次的承接作業,而電路板9 9 則是被搬移機構9藉由滑執9 3外送至末外端處,如第二 十二圖,如此即完成一塊電路板9 9四側邊之裁板與磨邊 處理流程。 由上可知,本案在處理電路板9 9四側邊之裁板與磨 邊,是採用兩道程序,每次處理兩個對應邊的方式進行, 加上整體設計係採連續不間斷式進料與出料方式,每一組 機構都持續保持在運作狀態,可獲致相當良好的運作效 率〇 再請配合第二十三圖,係為本案第一裁板磨邊機構6 中之裁板裝置6 1的具體實施態樣,該裁板裝置6 1 ,係 由兩片圓片形裁刀6 1 1 、6 1 2交錯排列平行設置,其 可就電路板9 9進行裁板作用;至於第二裁板磨邊機構7 之結構亦為相同。 第二十四圖,係在揭示磨邊裝置6 2之具體實施態 樣,利用一與電路板9 9等高之旋轉刀具6 2 1即可達成560233 V. Description of the invention (5) The cutting and edging operations are performed on the remaining two corresponding sides of the circuit board 9 9 as shown in the eighteenth figure; Nineteen pictures; the pressing device 51 is raised again, and the circuit board 9 9 is formed to be placed only on the fixing device 5 2, as shown in the twentieth picture; the order of the moving mechanism 9 is lowered, and the sucker 9 2 of its bottom surface 9 1 is used Suction attracts the circuit board 9 9 so that the circuit board 9 9 is attracted to the bottom surface 9 and connected, and the moving mechanism 9 is raised and rotated at a ninety degree angle, as shown in the twenty-first figure; when the circuit board 9 9 is After being adsorbed on the bottom surface 91 of the moving mechanism 9, the first conveying mechanism 2 and the second conveying mechanism 3 will be returned to the next receiving operation, and the circuit board 9 9 is moved by the moving mechanism 9 through the slide 9 3 Delivery to the outer end, as shown in Figure 22, so that the cutting and edging process of the four sides of a circuit board 9 9 is completed. As can be seen from the above, this case uses two procedures to process the cutting and edging of the four sides of the circuit board 9 9, and the two corresponding sides are processed each time. In addition, the overall design uses continuous uninterrupted feeding. With the method of discharge, each group of institutions continues to be in operation, and can obtain a very good operating efficiency. Please cooperate with the twenty-third figure, which is the cutting device 6 in the first cutting edge grinding mechanism 6 of the case. In a specific embodiment of 1, the cutting device 6 1 is formed by two disc-shaped cutting blades 6 1 1 and 6 1 2 staggered and arranged in parallel, which can perform a cutting function on the circuit board 9 9. As for the second The structure of the cutting board edging mechanism 7 is also the same. The twenty-fourth figure is to reveal the specific implementation of the edging device 62, which can be achieved by using a rotary cutter 6 2 1 with the same height as the circuit board 9 9
560233 五、發明說明(6) 磨邊之作用,特別是該刀具6 2 1具有特定之凹槽結構 者;至於第二裁板磨邊機構7之結構亦為相同。 綜上所述,本案「電路板之裁板磨邊機及裁板磨邊方 法」,其具有突破性之優點,極為實用,已突顯其實用價 值,且其未曾公開或揭露於國内外之文獻與市場上,確實 完全符合發明專利之各要件,爰依法申請專利,懇請 鈞 局詳查,並早日賜准,以勵創新,至感德便。560233 5. Description of the invention (6) The function of edging, especially that the cutter 6 2 1 has a specific groove structure; as for the structure of the second cutting plate edging mechanism 7 is the same. To sum up, the "cutting and edging machine for cutting circuit boards of this case" has breakthrough advantages, is extremely practical, has highlighted its practical value, and has not been disclosed or disclosed in domestic and foreign literature It is in full compliance with the various elements of the invention patent on the market. It applies for a patent in accordance with the law, and I urges the Bureau to examine it in detail and give it early to encourage innovation.
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560233 圖式簡單說明 【圖示說明 第一圖 第二圖 第三圖 第四圖 第五圖 第六圖 弟七圖 第八圖 第九圖 第十圖 第十一圖 第十二圖 第十三圖 第十四圖 第十五圖 第十六圖 第十七圖 第十八圖 第十九圖 第二十圖 第二十一圖 係為本發明之立體外觀圖。 係為本發明裁板磨邊機之内部結構側視圖 係為本發明電路板送入第一輸^機構之禾 係為本發明輸送機構位移之示意圖。 係為本發明輸送機構放下電路板之示意圖 係為本發明夾壓機構下壓電路板時之示意 係為本發明裁板磨邊機構動作時之示意圖。 係為本發明旋轉機構下移之示意圖。 係為本發明夾壓機構上升時之示意圖。 係為本發明旋轉機構吸取電路板並上升且旋轉之 示意圖。 係為本發明輸送機構位移之示意圖 係為本發明搬移機構位移之示意圖 係為本發明前後兩塊電路板分別置放於 機構上之示意圖。 係為本發明旋轉機構上升之示意圖。 係為本發明兩輸送機構位移時之示意圖 係為本發明輸送機構放下電路板之示意 係為本發明夾壓機構下壓電路板之示意 係為本發明裁板磨邊機構動作時之示意 係為本發明旋轉機構下降之示意圖。〜 係為本發明夾壓機構上升之示^圖 意圖 圖 雨輸送 圖 圖 圖 係為本發明搬移機構吸取電路板並上升且旋560233 Brief description of the drawings [Illustration of the first picture, the second picture, the third picture, the fourth picture, the fifth picture, the sixth picture, the seventh picture, the eighth picture, the ninth picture, the eleventh picture, the twelfth picture, the thirteenth picture The fourteenth figure, the fifteenth figure, the sixteenth figure, the seventeenth figure, the nineteenth figure, the twentieth figure, and the twenty-first figure are perspective views of the present invention. It is a side view of the internal structure of the cutting and edging machine of the present invention. It is a schematic diagram of the displacement of the conveying mechanism of the present invention. It is a schematic diagram when the circuit board is lowered by the conveying mechanism of the present invention. It is a schematic diagram when the circuit board is pressed down by the clamping mechanism of the present invention. It is a schematic diagram of the rotating mechanism of the present invention moving down. It is a schematic diagram when the pinch mechanism of the present invention rises. It is a schematic view of the rotating mechanism sucking the circuit board of the present invention, rising and rotating. It is a schematic diagram of the displacement of the conveying mechanism of the present invention. It is a schematic diagram of the displacement of the moving mechanism of the present invention. It is a schematic diagram of two circuit boards placed on the mechanism before and after the invention. It is a schematic diagram of the ascent of the rotating mechanism of the present invention. It is a schematic diagram when the two conveying mechanisms of the present invention are displaced. It is a schematic diagram of the conveying mechanism of the present invention lowering the circuit board. It is a schematic diagram of pressing the circuit board by the clamping mechanism of the present invention. It is a schematic system of the cutting board edging mechanism of the present invention. It is a schematic diagram of the lowering of the rotating mechanism of the present invention. ~ This is a diagram showing the rise of the clamping mechanism of the present invention.
第11頁 560233 圖式簡單說明 轉之示意圖。 第二十二圖:係為本發明送出電路板之示意圖。 第二十三圖:係為本發明裁板裝置之結構示意圖。 第二十四圖:係為本發明磨邊裝置之結構示意圖。 【圖號說明】 1 :基座 2 1 ··吸盤 4 :第一夾壓機構 4 2 :固定裝置 5 1 :壓合裝置 6 :第一裁板磨邊機構 6 1 1 :裁刀 6 2 :磨邊裝置 7 :第二裁板磨邊機構 7 2 :磨邊裝置 8 1 :底面 9 :搬移機構 9 2 :吸盤 9 9 :電路板 2 :第一輸送機構 3 ·第二輸送機構 4 1 :壓合裝置 5 ·第二夾壓機構 5 2 :固定裝置 6 1 :裁板裝置 612:裁刀 6 2 1 :刀具 7 1 :裁板裝置 8 ·旋轉機構 8 2 :吸盤 9 1 :底面 9 3 :滑軌 991:下一塊電路板Page 11 560233 Schematic description of the diagram. Figure 22: Schematic diagram of a circuit board sent out according to the present invention. Figure 23: Schematic diagram of the panel cutting device of the present invention. Figure 24: Schematic diagram of the edging device of the present invention. [Illustration of drawing number] 1: Base 2 1 ·· Sucker 4: First clamping mechanism 4 2: Fixing device 5 1: Pressing device 6: First cutting board edging mechanism 6 1 1: Cutting knife 6 2: Edge grinding device 7: Second cutting plate edge grinding mechanism 7 2: Edge grinding device 8 1: Bottom surface 9: Moving mechanism 9 2: Suction cup 9 9: Circuit board 2: First conveying mechanism 3 · Second conveying mechanism 4 1: Pressing device 5 · Second clamping mechanism 5 2: Fixing device 6 1: Cutting plate device 612: Cutting knife 6 2 1: Knife 7 1: Cutting plate device 8 · Rotating mechanism 8 2: Sucker 9 1: Bottom surface 9 3 : Slide 991: Next circuit board
第12頁Page 12
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91132140A TW560233B (en) | 2002-10-30 | 2002-10-30 | Cut-plate grind-edge machine of circuit board and cut-plate grind-edge method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91132140A TW560233B (en) | 2002-10-30 | 2002-10-30 | Cut-plate grind-edge machine of circuit board and cut-plate grind-edge method |
Publications (2)
Publication Number | Publication Date |
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TW560233B true TW560233B (en) | 2003-11-01 |
TW200407059A TW200407059A (en) | 2004-05-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW91132140A TW560233B (en) | 2002-10-30 | 2002-10-30 | Cut-plate grind-edge machine of circuit board and cut-plate grind-edge method |
Country Status (1)
Country | Link |
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TW (1) | TW560233B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107185896A (en) * | 2016-10-28 | 2017-09-22 | 旭东机械(昆山)有限公司 | Board edge cleaning system |
-
2002
- 2002-10-30 TW TW91132140A patent/TW560233B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107185896A (en) * | 2016-10-28 | 2017-09-22 | 旭东机械(昆山)有限公司 | Board edge cleaning system |
Also Published As
Publication number | Publication date |
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TW200407059A (en) | 2004-05-01 |
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