TW558657B - Adjustable optical fiber attenuator and method for producing the same - Google Patents

Abstract

An adjustable optical fiber attenuator comprises a side polishing optical fiber, a temperature controller, and thermo-optic material. The side polishing optical fiber has a polishing face, which is obtained by fastening a silicon chip to an optical fiber and polishing a portion of the cladding of the optical fiber. Furthermore, the thermo-optic material covers on the polishing face of the side polishing optical fiber. The temperature controller alters the refractive index of the thermo-optic material in order to adjust the intensity of the optical signal transmitted in the side polishing optical fiber.

Description

558657

The present invention relates to a tunable optical fiber attenuator for a tunable optical fiber attenuator made using a side-milled optical fiber. BACKGROUND OF THE INVENTION: It is particularly relevant. In the use of optical fiber communication systems, the optical signal needs to be increased by a fan to prevent the optical signal from decaying or even disappearing. The autumn optical amplifier has different functions for different wavelengths of optical signals. Therefore, the optical fiber communication system uses optical attenuators to modulate the same optical intensity for the optical signals. The previously known optical attenuators can be roughly divided into the following four types. For example, mechanically modulated optical attenuators [refer to Nigel Cockroft's publication in WDM SOLUTIONS in June 2001, Arrayed-based; offer compact signal control ”], micro-electro-mechanical optical attenuators [Reference B · B arber et al. Published in IEEEP hot ο nics T ech η ο 1 〇gy Letters, vol. 10, No. 9, Sep. 1 998, published, a

Fiber Connectorized MEMS Variable Optical Attenuator〃], Planar Light Wave Line Attenuator [Ref. T · Kawai et al., Electronics Letters, vol. 34, No. 3, Feb · 1998, ', PLC type compact variable optical attenuator for photonic transport network 7 /] and liquid crystal modulation optical attenuator [Refer to Hirabayashi et al., IEEE Photonics Technology Letters, vol. 13, No. 5, May 2001, published Optical Optical Fiber Variable-Attenuator Arrays Using Polymer-Network Liquid Crystal "] 0 However, these four different optical attenuators are coupled to other optical components

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The problem is easily caused by coupling. ^ Then 'U.S. Patent No. 6,205,280 discloses another optical attenuator. It uses a glass substrate or a quartz substrate as a substrate for grinding an optical fiber 'to form a side-ground optical fiber. However, the interact ion length of the side-milled fiber disclosed by this method is only about 1 mm, which makes the sensitivity of optical attenuators made in this way poor. In addition, the patented side-grinded fiber requires a long time and more manpower to complete; and the function of making such an optical attenuator needs to be improved, which is another problem to be solved. U.S. Patent No. 5,809,188 discloses a side-grinding method 'which has significant differences to the invention of an optical attenuator. SUMMARY OF THE INVENTION In view of this, in order to improve the disadvantages of the prior art and the difficulties encountered, the main purpose of the present invention is to provide an adjustable optical fiber attenuator. It has a side-grinded optical fiber, a temperature controller, and a thermo-optic material. Among them, the side-grinded optical fiber is obtained by grinding a part of the optical shell of the optical fiber after a fiber is fixed by a stone chip. obtain. The refractive index of the thermally induced refractive index changing material is changed by a temperature controller, and the intensity of the optical signal transmitted in the side-milled optical fiber is modulated. According to the above object, one feature of the present invention is that a stone fiber wafer for polishing optical fibers is disposed on a temperature controller and a side-grinded fiber is fixed on the silicon wafer, and a thermally induced refractive index change material is disposed on a polishing surface of the side-grinded fiber. … Another feature of the present invention is that the side-grinded optical fiber is disposed on the temperature controller and a silicon wafer for grinding the optical fiber covers the side-grinded optical fiber, and a thermally induced fold change material is formed on the polishing surface of the side-grinded fiber and the temperature controller. between.

558657 V. Description of the invention (3) Another feature of the present invention is that after the side-grinded optical fiber is separated from the silicon wafer, the polishing surface of the side-grinded optical fiber is set on a temperature controller and a thermally induced refractive index changing material.

The material covers the abrasive surface of the side-grinded optical fiber. According to this feature, a groove can be formed in the temperature controller to provide a polished optical fiber. P Another feature of the present invention is that after the side-grinded optical fiber is separated from the silicon wafer, the polished surface of the milled optical fiber is set in a set of tubes and the thermally induced refractive index change material is filled into the sleeve; after that, the sleeve is fixed to the temperature controller on. According to another aspect of the present invention, it has a first side abrasive disc, a second silicon wafer groove, and a positioning groove, a bit groove; wherein the position of the first bit groove is also vacant in the first and second grooves. In the hole. The purpose is to propose an optical fiber, a second side mill and a positioning object. The first—and the first broken wafer has a groove that coincides with the second groove. The first and the second 'are positioned on the adjustable optical fiber attenuator fiber, a first silicon crystalline silicon wafer has a first ~ a second groove and another ~, and the two sides of the ground optical fiber are respectively arranged two The coincidence of the positioning grooves is determined to be in accordance with the above-mentioned object. One feature of the present invention is the intensity of the optical signal transmitted between the first silicon wafer and the second silicon wafer when a relative movement occurs between the second silicon wafer. A description of the embodiment of the first side-grinding optical fiber: The material of the directional chemical etching of the preferred embodiment of the present invention, such as the semiconductor type, uses a square substrate. In the present invention, the bottom of the wafer is used as the bottom of the polished optical fiber. ‘,’, The base for fixing and polishing optical fibers

0498-7474TWF (N); Jasper.ptd Page 6 558657 V. Description of the invention (4) The integrated circuit manufacturing method is used to form a mask 20 with a narrow and wide width line pattern on a silicon wafer to form a narrow and wide width silicon wafer. Line pattern. Here, select the (100) direction surface of the silicon wafer base. FIG. 2A schematically shows a longitudinal cross-sectional view of the Shi Xi wafer substrate; and FIG. 2B schematically shows a cross-sectional view of the silicon wafer substrate. Further, a V-shaped groove 51 having a curvature R is formed using the directional chemical etching characteristics of the silicon wafer 50. In Figure 2A, the semiconductor etching technology can form a long curvature radius !? Y-shaped grooves, such as R = 1000 cm, make the side-grinded fiber have a long and effective working length. In FIG. 2B, the v-concave has an opening angle θ: 70.53. . In addition, the integrated circuit manufacturing method can be used to manufacture several V-shaped grooves with the same or different specifications at one time. Figure 3 shows that the optical fiber is fixed in a V-shaped groove with a longitudinal 9-section profile. The concave shape has physical effect—capillary effect. Λ characteristic ° Add glue to both ends of the M-shaped groove 51. The groove 51 will use the capillary action and the surface to "absorb into the v-shaped groove 51. Further, the v-shaped groove 51 is uniformly covered with this glue 60. The glue 60 has a light intensity equivalent to that of the optical fiber 100". A (cladding) 110 is a liquid with a similar refractive index. Then, & glue 60 is fixed in the V-shaped groove 51-the first fiber 100 is used by the curly master to change the V-shaped groove. The rate is small. + After the weekly optical fiber is polished, it forms a large area of action

In addition, the optical fiber 丨 〇〇 can also be set at V and the surface force, so that the use of hair at both ends, the field action can be attracted to the optical fiber i 〇 〇

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The space between the V-shaped groove 51 and the V-shaped groove 51 is shown in FIG. 3. Furthermore, referring to FIG. 3, at both ends of the v-shaped groove 51 of the silicon wafer, light f 1 00 retains a plastic protective case 80. The plastic protective cover 80 can prevent the optical fiber 100 from being broken due to stress during the polishing process. Fig. 4 is a schematic view showing a branch direction of a polished optical fiber fixed in a V-shaped groove. Further, the optical fiber ((: 1 & (1 (1 丨 1 ^) 11) of the optical fiber 100 protruding from the silicon substrate plane protruding from the v-shaped groove 51 is polished until the polished surface of the optical fiber 100 and the second-type groove 51 The silicon substrate has a height of 50 °. As shown in Figure 4, after polishing: the optical core 200 of the optical fiber 200 is very close to the polished surface 2 of the optical fiber 200. Figure 5A is based on the subtractor. The summary sheet 50 is set in the slot. Then the top cover can be applied to the thermo-emissivity change material. Figure 5B. The package of the adjustable material will gradually be self-developed. The second example is a temperature control. The hot-side grinding light controller 10 and material 30 are optical fiber attenuation efficiencies that can be modulated on a surface-by-milling basis. Example 1 of the present invention shows an adjustable fiber attenuation = shown in Figure 5A. Silicon with a V-shaped groove The crystallizer 10 has a side grinding optical fiber 200 fixed to a V-shaped concave refractive index changing material 30 formed on a silicon wafer 50 fibers, and a polishing surface 21 5 (see FIG. 4). In addition, a temperature sensor 40 "Thermal bending temperature. Ϊΐ 'Ϊ shows in summary the thermally induced refractive index change when the temperature of the package-300 ^ ® / ware controller is reduced." The optical signal transmitted in the optical fiber regresses, and the temperature is controlled by the temperature controller. The intensity of the optical signal transmitted in the fiber is shown in Fig. 6A, which shows an adjustable optical fiber attenuation according to an example of the present invention.

558657 V. Description of the invention (6) Schematic diagram of the subtractor. As shown in FIG. 6A, 'the stone evening # piece 50 having the V-shaped groove is set on a temperature controller 10, wherein the side-grinded optical fiber 200 is fixed in the V-shaped groove and the V-shaped groove faces the temperature Controller 1 〇. Next, a thermally induced refractive index change material 30 is formed between the side-grinded optical fiber 200 and the temperature controller 10, and covers the polishing surface 21 5 of the side-grinded optical fiber 200 (see FIG. 4). In addition, a temperature sensing element 40 can be provided on the temperature controller 10 to sense the temperature of the thermally induced refractive index change material. FIG. 6B is a perspective view schematically showing the use of a package 300-shaped tunable optical fiber attenuator. As the temperature of the temperature controller decreases, the refractive index of the thermally induced refractive index changing material gradually increases. Optical signal transmitted in side-grinded fiber = gradually output from the polished surface and attenuate. Furthermore, by controlling the proper temperature with a thermostat, the intensity of the optical signal transmitted in the side-milled optical fiber can be modulated. Example 3, Figure 7A is a schematic diagram showing an adjustable optical fiber attenuator according to Example 3 of the present invention. An organic solvent or an etching liquid such as sulfuric acid is used to separate the side-milled optical fiber 200 from the v-shaped groove 51. For example, the eighty-eighth optical fiber 200 is set at a temperature of 枇】 η μ, pulled from ^ ^] m u ^ λ control state 10. Then, the thermally induced refractive index change is 21 millimeters / r; / on the controller 10, and covers the polished surface of the side-grinded fiber 2000. The Λ can be set on the temperature controller 10-the temperature sensing element 40 'senses ", The temperature of the refractive index change material 3Q. Figure 7B is a transparent 4+ package adjustable optical fiber J minus g: ground display-package 3. The refractive index of the material is reduced by one or two. At the same time, the thermally induced refractive index change will gradually be output from the grinding surface. Η: The learning of the loss is further reduced, and the temperature is controlled by the thermostat.

657 Ⅴ. Description of the invention (7) Degree 'can modulate the intensity of the optical signal transmitted in the side-grinding domain. Subtractor: =? According to Example 4 of the present invention: • The adjustable optical fiber attenuation d! First ’uses an organic solvent or rotten liquid, such as ίΐ / η ίΐί to separate the optical fiber from the V-groove 51. As shown in Figure 8A, Wen. Two ΠΠ Ϊ a groove 15 and side-grinded the optical fiber 20. Set in a thermostat slot 15. That is, a thermally induced refractive index change material 30 is formed on the surface 10 and covers the polishing surface 215 of the side-grinded optical fiber 200. In addition, a temperature sensing element 40 may be further provided to sense the temperature of the thermally induced refractive index change material 30. τ Figure 8B is a perspective view, which schematically shows that when using a package 300 iLl mode fiber attenuation 11 ° # temperature controller to reduce temperature, the thermally induced refractive index becomes pus, and ①t? refractive index gradually increases. The optical signal transmitted in the side-milled fiber = attenuates gradually from the polished surface output. Furthermore, by controlling a suitable temperature with a temperature controller, the intensity of the optical signal transmitted in the side-milled optical fiber can be modulated. Example five

FIG. 9A is a schematic diagram showing an adjustable optical fiber attenuation device according to Example 5 of the present invention < First, using an organic solvent or an etching liquid such as sulfuric acid, the side-grinded optical fiber 200 is separated from the ytterbium type · groove 51. As shown in FIG. ^, The side-milled optical fiber 200 is set in a set of tubes 400, and the polishing surface 215 is completely placed in the sleeve 400. The thermo-induced refractive index change material 30 is filled in the sleeve 400, and the polishing surface 215 of the side-grinded optical fiber 2000 is completely covered with the thermo-induced refractive index change material 30 on the other side. The sleeve 30 and the side-milled optical fiber 200 are set on the temperature controller 10. In addition, a temperature sensing element can be set on the temperature controller 丨 〇

558657 V. Description of the invention (8) " 一 " '-4 0 ′ Induces the temperature of the thermally induced refractive index change material 3 〇. Figure 9B is a perspective view schematically showing the use of a package to package an adjustable optical attenuator. As the temperature of the temperature controller decreases, the refractive index of the thermally induced refractive index material gradually increases. Optical signal transmitted in side-grinded fiber = gradually output from the polished surface and attenuate. Furthermore, the temperature is controlled by a thermostat.

The temperature can be adjusted to the intensity of the optical signal transmitted in the side-milled fiber. Example 6 Figures X_ and 10A are cross-sectional views of an adjustable optical fiber reducer according to Example 6 of the present invention. As shown in FIG. 10A, the two silicon wafers 50, 50 'having ¥ -shaped grooves are overlapped, and the two v-shaped grooves 5, 51 are also overlapped with each other. Therefore, the polishing surface 215 of the first side polished fiber 200 and the polishing surface 215 of the second side polished fiber 200, which are respectively provided in the two V-shaped grooves 5 丨 and 5 丨, are also mutually overlapped. In Example 6 of the embodiment of the present invention, the two silicon wafers M and 50 ′ have two positioning grooves 52 and 52, respectively, which are formed in synchronism with the ¥ -shaped grooves by using the integrated circuit manufacturing method. The two positioning grooves 52 and 52 also overlap each other to form a cavity 53, and a certain 60 is set in the cavity 53. View ^ Figure 10B is a perspective view that schematically illustrates the adjustable optical fiber attenuator of Example 6. When a relative movement between the two silicon wafers in the X or Y direction is generated by a mechanical device (not shown), the intensity of the optical signal transmitted in the first can be modulated. ^ In the embodiment of the present invention, the thermally induced refractive index changing material can be selected from products manufactured by Nye Optical Products, such as model CK-433, OCF-466, 0C-431A-LVP, or a mixture thereof.

558657 V. Description of the invention (9) Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make the invention without departing from the spirit and scope of the present invention. Changes and retouching, so the protection scope of the present invention shall be determined by the scope of the appended patent application.

0498-7474TWF (N); Jasper.ptd Page 12 558657 Brief description of the drawings In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, an example is given below, with additional drawings, to make The detailed description is as follows: FIG. 1 is a schematic diagram showing a mask pattern for making grooves according to the present invention. FIG. 2A is a schematic diagram showing a longitudinal cross-sectional view of a silicon wafer. FIG. 2B is a schematic diagram showing a silicon wafer. A cross-sectional view of the wafer; FIG. 3 is a longitudinal perspective view showing that the optical fiber is fixed in the V-shaped groove; FIG. 4 is a cross-sectional view showing that the optical fiber is fixed in the V-shaped groove; Example 1 of the invention, showing a schematic diagram of a tunable optical fiber attenuation spring, FIG. 5B is a perspective view, which schematically shows the use of a package to package the tunable optical fiber attenuator; FIG. 6A is according to the present invention Example 2 shows a schematic diagram of a tunable optical fiber attenuator. FIG. 6B is a perspective view showing the use of a package to package the tunable fiber attenuator. FIG. 7A shows a third example of the present invention. Showing a dimmable light Figure 7B is a schematic view of a fiber attenuator. Figure 7B is a perspective view, which shows the use of a package to package an adjustable fiber attenuator. Figure 8A shows an adjustable fiber attenuator according to Example 4 of the present invention. Schematic diagram of the device; v Figure 8B is a perspective view, which schematically shows the use of a package to package

0498-7474TWF (N); Jasper.ptd Page 13 558657 The diagram illustrates the adjustable optical fiber attenuator early; Figure 9A shows an outline of an adjustable optical fiber attenuator according to Example 5 of the present invention; FIG. 9B is a perspective view schematically showing the use of a package to package an adjustable optical fiber attenuator; FIG. 10A is a cross-sectional view of an adjustable optical fiber attenuator according to Example 6 of the present invention; f FIG. 10B is a perspective view, which schematically illustrates the adjustable optical fiber agricultural subtractor of Example 6. Explanation of symbols: 10 ~ Temperature controller; 20 ~ Photomask; 3〇 ~ Thermally-induced refractive index changing material; 40 ~ Temperature sensing element; 50 ~ Si substrate; 51, 51 '~ V-shaped groove; 5 2, 5 2 '~ positioning groove; 53 ~ cavity; 0 ~ groove angle; 60 ~ glue; 70 ~ positioning object; 80 ~ plastic protective shell; 100 ~ fiber; 110, 210 ~ light shell;

0498-7474TWF (N); Jasper.ptd Page 14 558657 Brief description of the diagram 1 2 0, 2 2 0 ~ core center; 2 0 0, 2 0 0 '~ side-grinded fiber; 215, 215' ~ polished surface; 3 0 0 ~ package. Page 15 0498-7474TWF (N); Jasper.ptd

Claims (1)

Groove; first, the surface is angry, and the refractive index is changed by the above refractive index 2. It also includes the controller 3. It also includes the heat-induced 4. The bit glue protects the 5 shell and 558657 6. The scope of patent application The adjustable optical fiber attenuator includes: a (100) broken chip in a plane direction, a ^ v-shaped side-grinded fiber with a predetermined curvature half pinch, which is set in the V-shaped groove of the above-mentioned Shi Xi wafer and includes and covers the A light shell of the light core, wherein the light shell has a grinding surface which is located in the v-shaped groove; a thermally induced refractive index changing material covering the grinding of the side-grinded optical fiber by changing the temperature of the thermally induced refractive index changing material The refractive index of the thermally-induced change material can be changed; and a W temperature controller combined with the above silicon wafer, wherein when an optical signal is transmitted in the side-grinded optical fiber, the temperature controller is used to control the refraction of the thermally-induced folding material. Rate, attenuating the optical signal to the required value = 11. The adjustable optical fiber attenuator X described in item 1 of the patent scope, a temperature sensing element, is set at the temperature of the temperature controller. The temperature can be adjusted as described in item s i of Shen Qing's patent. A packaged case ′ bears the above-mentioned thermostat, Shi Xi wafer, and H ’refractive index changing material. Side-milled optical fiber The adjustable optical fiber attenuator described in item 1 of the mr range: at both ends of the γν groove, the side-mode optical fiber further includes: a plastic adjustable optical fiber attenuator, which includes: :: 2 fiber 'It contains-the light core and the ~ light, dual-surface-polished surface covering the light core, where the side-grinded fiber is ~~ Shui I sun m 16th 558657 Sixth, the scope of patent application-a fixed associate A v-shaped groove with a predetermined radius of curvature is issued, and after obtaining the polished surface, it is separated from the silicon wafer and then said, "inside the film = thermally induced refractive index change material, covering the above side grinding; surface , By changing the refractive index of the ground refractive index changing material of the thermoacoustic fiber of the thermally induced refractive index changing material; and a changing the thermally induced temperature controller, which is combined with the above-mentioned side-grinded optical fiber, wherein the number ♦ is in the above When transmitting in a side-milled optical fiber, the temperature controller is used to suppress the refractive index of the optical signal and change the refractive index of the material to attenuate the optical signal and the above-mentioned thermal intensity. The required strength 6. The adjustable optical fiber luxury, ,, and w as described in item 5 of the patent application range further include a temperature sensing element, which is set at the temperature controller to double the temperature generated by the controller. The temperature is controlled. 7. The adjustable optical fiber attenuator as described in item 5 of the scope of the patent application, further comprising a package housing that bears the temperature controller, side-milled optical fiber, and emissivity change material. 8. The tunable optical fiber attenuator according to item 5 of the scope of patent application, further comprising a set of tubes, the sleeve surrounding the side-grinded optical fiber and its abrasive surface, and the thermally-induced refractive index change material filled in the sleeve. 9. The adjustable optical fiber attenuator according to item 5 of the scope of the patent application, wherein the temperature controller has a groove for setting the side-grinded optical fiber. ι. The adjustable optical fiber attenuator according to claim 8 in the patent application scope, wherein the temperature controller has a groove for setting the sleeve. 11. An adjustable optical fiber attenuator comprising: a first silicon chip, including in a direction of the first silicon chip (100) 0498-7474TWF (N); Jasper.ptd On page 17, the scope of the patent application includes a first eccentric tooth groove of a first-side grinding surface with a radius of curvature, a position groove, and a first y-shaped recess # ti, wherein the first The ground fiber on one side is fixed to the -V: the first: the ground surface is located in the -V-shaped groove; the second side im / groove, another positioning groove, and- In the groove and $ 第 a | / 中 4 第 —The side-grinded optical fiber is fixed, and the side of the flute-6M is located on the second grinding surface of the second v-groove ^ μ = stone The first silicon wafer is combined with the first silicon wafer to make the first cavity; and the first polishing surface overlaps and the two positioning grooves form a hollow and a first: ㈡; and is disposed in the cavity so that the first and second pieces can Relative movement along the direction of the hole axis, where the relative motion between the second and upper silicon chip and the second silicon wafer occurs, < /, 12 _ the intensity of the optical signal transmitted in the first side mill fiber F Step: · A method for manufacturing an adjustable optical fiber attenuator, which includes forming a predetermined radius of curvature on A V-shaped ΰ 疋 ΰ 罕 罕 ΰ Han flat diameter is divided into two * 3 water holes to fix an optical fiber in the ¥ -shaped groove, and the nine fibers are larger than the surface of the silicon wafer; = 2 the light of the above optical fiber The shell is close to the core inside the above-mentioned optical fiber. You m-plane and make the polished surface and the surface of the silicon wafer be spleen μ Γ ..., so that the refractive index change material covers the above-mentioned polished surface; the silicon wafer described in 13 and a temperature control Combined into the device • The tunable optical fiber attenuation described in Item 12 of the scope of patent application Page 18 558657 VI. The manufacturing method of the application # ^ '' ----, further includes the following steps: to use the capillary action to adsorb the center of the v-shaped groove from both ends of the v-shaped groove by capillary action, so that the above-mentioned glue The optical fiber is disposed in the V-shaped groove and is attached to the V-shaped groove. ^ 14. The manufacturing method of the tunable optical fiber attenuation as described in Item 12 of the scope of the patent application, further comprising the following steps: setting the optical fiber in the V-shaped groove; and using the capillary to effect the glue from the V-type. The two ends of the groove attract the center of the V-shaped groove, so that the glue adheres to the gap between the v-shaped groove and the optical fiber. 15: According to the tunable optical fiber attenuation test described in Item 12 of the scope of the patent application, the manufacturing method, wherein the V-shaped groove is formed on the crystal plane in the direction of the above-mentioned Shi Xi doo) plane. 16. A method for manufacturing an adjustable optical fiber attenuator, comprising the following steps: forming a V-shaped groove with a predetermined radius of curvature on a crystal plane in the (100) plane direction of a silicon wafer; and using a glue to bind an optical fiber It is fixed in the V-shaped groove, and the optical fiber protrudes from the surface of the silicon wafer; σ grinds the optical shell of the optical fiber to near the core of the optical fiber and forms the polished surface on the side with eight abrasive surfaces, so that The polished surface is at the same height as the surface of the stone ridge; the 7th slice uses a liquid to separate the side-grinded optical fiber from the silicon wafer; 0498-7474TWF (N); Jasper.ptd p. 19 558657 Covering the polishing surface with a thermo-induced refractive index change material; and combining the side-grinded optical fiber with a temperature controller ', wherein the polishing surface is located on the temperature controller. 17. The method for manufacturing an adjustable optical fiber attenuator as described in item 16 of the scope of the patent application, further comprising the following steps: the capillary is used to adsorb the glue from both ends of the V-shaped groove to the V-shaped groove by capillary action. The center, so that the glue is attached to the V-shaped groove; and the stomach is provided with the optical fiber in the V-shaped groove. 18. The manufacturing method of the tunable optical fiber attenuator according to item 16 of the scope of patent application, further comprising the following steps: setting the optical fiber in the V-shaped groove; and applying the glue from the V-shaped groove by capillary action. Both ends are attracted to the center of the V-shaped groove, so that the glue adheres to the gap between the V-shaped groove and the optical fiber. 19 • The method for manufacturing an adjustable optical fiber attenuator according to item 6 of the patent application scope, further comprising the following steps: forming a groove on the temperature controller; and fixing the side-grinded optical fiber to the groove Inside the slot. 20. The manufacturing method of the tunable optical fiber attenuator according to item 6 of the patent application scope, further comprising the following steps: surrounding the side-grinded optical fiber and its polishing surface with a set of tubes; and changing the thermally induced refractive index The material is filled in the sleeve. 21 · A method for manufacturing an adjustable optical fiber attenuator, including the following Page 20 558657 VI. Steps for applying for a patent: Forming a first V-shaped groove with a predetermined radius of curvature and a positioning groove on a crystal plane in the (100) plane direction of a first silicon wafer; Glue fixes a first optical fiber in the first V-shaped groove; grinds the optical shell of the first optical fiber to be close to the core inside the first optical fiber and forms a first side-grinded optical fiber with a first abrasive surface ; Forming a second V-shaped groove with a predetermined radius of curvature and another positioning groove on a crystal plane in the (100) plane direction of a second silicon wafer; fixing a second optical fiber to the above by a glue Inside the second V-shaped groove; grinding the optical shell of the second optical fiber to near the core inside the second optical fiber and forming a second side-grinded optical fiber having a second polishing surface; combining the first silicon wafer and the above A second silicon wafer, wherein the first V-shaped groove and the second V-shaped groove overlap so that the first polishing surface overlaps the second polishing surface, and the two positioning grooves overlap to form a cavity; and a positioning Set in the above space Such that said first and second silicon chip silicon chip may be relatively moved along the axial direction of the hole. ◦ 498-7474TWF (N); Jasper.ptd page 21