557645 1 A7 B7 五、發明說明（/) 〔技術領域〕 本發明係有關於可撓性印刷電路板及其製造方法。 〔背景技術〕 從以前起’可撓性印刷電路板就使用於各個領域，其 形狀也有很多種。 例如，液晶面板驅動用之典型的可撓性印刷電路板， 係如第6圖般的T字狀者。此處，靠BB側的端子，爲了 能將訊號一起送給1C故以較廣的配線間距來形成，另一方 面，靠AA側的端子，爲了連接於驅動用的小型半導體模 組則以較窄的配線間距來形成。 然而，在製作圖6之T字形的可撓性印刷電路板時， 係在導電層上形成有絕緣層之每單位面積的可撓性印刷配 線用積層板上製作出複數個T字形的可撓性印刷電路板， 再從其裁切出各個電路板。具體而言，如圖7所示般，在 長250mm、寬200mm之可撓性印刷配線用積層板71上， 藉由利用光微影技術等之加成（additive)法或減成 (substractive)法來製作出6塊分之圖6的T字形之可撓性印 刷電路板（尺寸：a=160mm/b=17mm/c=30mm/d=20mm /e=25mm/f=115mm) 0 然而，要從圖7所示般之可撓性印刷配線用積層板71 製作出T字形的可撓性印刷電路板72時，約58%的可撓性 印刷配線用積層板71會被廢棄掉，故將造成減低製造成本 上的一大阻礙。這個問題，隨著可撓性印刷電路板的外形 之凹凸高度(深度)及複雜化的增加，已成爲極大的問題。557645 1 A7 B7 V. Description of the Invention (/) [Technical Field] The present invention relates to a flexible printed circuit board and a manufacturing method thereof. [Background Art] Flexible printed circuit boards have been used in various fields and have various shapes in the past. For example, a typical flexible printed circuit board for driving a liquid crystal panel is a T-shape as shown in FIG. 6. Here, the terminals on the BB side are formed with a wide wiring pitch in order to send signals to 1C together. On the other hand, the terminals on the AA side are connected to a small semiconductor module for driving. It is formed with a narrow wiring pitch. However, when the T-shaped flexible printed circuit board of FIG. 6 is manufactured, a plurality of T-shaped flexible printed circuit boards are formed on a flexible printed wiring laminate per unit area in which an insulating layer is formed on a conductive layer. Printed circuit board, and then cut each circuit board out of it. Specifically, as shown in FIG. 7, the flexible printed wiring laminated board 71 having a length of 250 mm and a width of 200 mm is subjected to an additive method or a substractive method using a photolithography technique or the like. Method to make 6 pieces of T-shaped flexible printed circuit boards (size: a = 160mm / b = 17mm / c = 30mm / d = 20mm / e = 25mm / f = 115mm). 0 However, When a T-shaped flexible printed wiring board 72 is produced from the flexible printed wiring laminated board 71 shown in FIG. 7, approximately 58% of the flexible printed wiring laminated board 71 is discarded, so Will cause a major obstacle in reducing manufacturing costs. This problem has become a great problem as the height (depth) and complexity of the unevenness (outer shape) of the outer shape of the flexible printed circuit board increase.
I 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) --------訂---------線一 經濟部智慧財產局員工消費合作社印製 557645 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（>) 本發明係爲了解決以上之以往的技術問題點而提出者 ，其目的係提供一可撓性印刷電路板，該電路板的構造將 能從既定大小的可撓性印刷配線用積層板上得出最多塊的 可撓性印刷電路板。 " 〔發明之揭示〕 本案發明人等發現出下列3點而完成本發明：（1)在可 撓性印刷配線用積層板上製作可撓性印刷電路板時，藉由 將可撓性印刷電路板製造分成2個構件而製作出，即可減 少積層板的廢棄量；（2)連接2個構件來製成1個可撓性印 刷電路板時，當要連接一構件的表面側和另一構件的背面 側時，基於連接可靠性以進行凸塊連接爲佳；（3)作爲凸塊 ，若利用光微影法並藉由化學蝕刻以在可撓性印刷配線用 積層板的絕緣層上形成孔後，利用電解電鍍將金屬柱塞充 塡於孔中，再成長出金屬凸塊，如此在形成孔時不需過高 的對準精度，而能以低成本來導入金屬凸塊。 亦即，本發明係提供一可撓性印刷電路板，其係將第 1可撓性印刷配線構件的金屬凸塊和第2可撓性印刷配線 構件的連接墊進行連接而成，其特徵在於： 第1可撓性印刷配線構件，係由導電層及相鄰接的絕 緣層所構成，絕緣層上穿設有通達導電層之孔，在該孔內 利用電解電鍍法來形成金屬柱塞，該金屬柱塞的前端係突 出絕緣層而構成金屬凸塊。 又，本發明之可撓性印刷電路板的製造方法，其特徵 在於，係含有： . I , 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公釐） --------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 557645 A7 B7 五、發明說明（Ύ) (a) 在導電層上形成相鄰的絕緣層所構成之可撓性印刷 配線用積層板上，以能在每單位面積上儘可能取得最多的 第1可撓性印刷配線構件和第2可撓性印刷配線構件的方 式，製作出第1可撓性印刷配線構件及/或第2可撓性印刷 配線構件的步驟； 此處，第1可撓性印刷配線構件的金屬凸塊，係利用 光微影法而藉由化學蝕刻來在鄰接於導電層之絕緣層上形 成穿通至導電層的孔，接著邊以導電層爲陽極而利用電解 電鍍法在絕緣層的孔內形成金屬柱塞，邊連續地藉由電解 電鑛法來使該金屬柱塞成長，使其前端突出於絕緣層的表 面而製作出； (b) 裁切可撓性印刷配線用積層板以取得第1可撓性印 刷配線構件及第2可撓性印刷配線構件的步驟； (c) 將所取得之第1可撓性印刷配線構件和第2可撓性 印刷配線構件，在確保第1可撓性印刷配線構件的金屬凸 塊和第2可撓性印刷配線構件的連接墊導通下進行接著的 步驟。 〔圖式之簡單說明〕 圖1係本發明的可撓性印刷電路板的一例之俯視圖（圖 ⑻)及X - X截面圖（圖(b))。 圖2係本發明所使用的第1及第2可撓性印刷配線構 件製作用之可撓性印刷配線積層板的俯視圖。 圖3係本發明所使用之第1可撓性印刷配線構件的金 屬凸塊面側的表面圖。 I , 5 本紙張尺度適用中國國家標準（CNS)A4規格（2川x 297公釐） (清先閱璜背面之?i意事頃再填寫本頁) --------訂---------線一 經濟部智慧財產局員工消費合作社印製 557645 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明) 圖4係顯示本發明的可撓性印刷電路板之製造過程。 圖5係顯示本發明的可撓性印刷電路板之製造過程。 圖6係以往的可撓性印刷電路板之俯視圖。 圖7係以往的可撓性印刷電路板製作用之可撓性印刷 配線用積層板的俯視圖。 〔用以實施本發明之最佳形態〕 , 以下，邊參照圖面邊詳細說明本發明的可撓性印刷電 路板之一例。 圖1(俯視圖（圖(a))、x-x截面圖（圖(b))之可撓性印刷 電路板1〇，其所具備的構造，係利用接著層3將第1可撓 性印刷配線構件1和第2可撓性印刷配線構件2接著成第 1可撓性印刷配線構件1的金屬凸塊la和第2可撓性印刷 配線構件2的連接墊2a成爲電性連接。如此般，對可撓性 印刷電路板10採用至少2個構件（1、2)所接合成的構造， 要在可撓性印刷配線積層板上製作出可撓性印刷電路板時 ，即可減少積層板的廢棄量。 例如，將圖6之T字形可撓性印刷電路板（尺寸： a=160mm/b=17mm/c=30mm/d：=20mm /e=25mm/f=l 15mm)分割 成圖1所示之第1可撓性印刷配線構件1(尺寸： c’=35mm/e=25mm)和第2可撓性印刷配線構件2(尺寸： a=160mm/b=17mm)，當要在圖2所示般長200mm、寬 250mm之可撓性印刷配線用積層板100上進行製作時，將 分別可製作出10塊，相較於圖7時的廢棄率(58.4%)，係大 幅地降低到28.1%。I This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) -------- Order -------- -Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed 557645 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed A7 B7 V. Invention Description (>) The present invention was proposed in order to solve the above technical problems in the past, The purpose is to provide a flexible printed circuit board having a structure capable of deriving the largest number of flexible printed circuit boards from a flexible printed wiring multilayer board of a given size. [Disclosure of Invention] The inventors of the present invention have found the following three points to complete the present invention: (1) When a flexible printed circuit board is produced on a flexible printed wiring multilayer board, the flexible printed circuit board is printed by The circuit board is manufactured by dividing it into two components, which can reduce the waste of laminated boards; (2) When two components are connected to make a flexible printed circuit board, when the surface side of one component is connected to another For the back side of a component, it is better to connect the bumps based on the reliability of the connection. (3) As the bumps, if the photolithography method is used and chemical etching is used to insulate the insulating layer of the laminated board for flexible printed wiring After the hole is formed, the metal plunger is filled in the hole by electrolytic plating, and then a metal bump is grown. In this way, the metal bump can be introduced at a low cost without forming a high alignment accuracy. That is, the present invention provides a flexible printed circuit board which is formed by connecting a metal bump of a first flexible printed wiring member and a connection pad of a second flexible printed wiring member, and is characterized in that: : The first flexible printed wiring member is composed of a conductive layer and an adjacent insulating layer. A hole is formed in the insulating layer to access the conductive layer, and a metal plunger is formed by electrolytic plating in the hole. The front end of the metal plunger protrudes from the insulating layer to constitute a metal bump. In addition, the method for manufacturing a flexible printed circuit board of the present invention is characterized in that it contains:. I, 4 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 χ 297 mm) ----- --------------- Order --------- line (please read the precautions on the back before filling this page) 557645 A7 B7 V. Description of the invention (Ύ) ( a) A flexible printed wiring laminated board formed by forming adjacent insulating layers on a conductive layer so that the first flexible printed wiring member and the second flexible can be obtained as much as possible per unit area. The method of producing a flexible printed wiring member includes the steps of manufacturing a first flexible printed wiring member and / or a second flexible printed wiring member. Here, the metal bumps of the first flexible printed wiring member are made of light. The lithography method uses chemical etching to form a hole through the conductive layer on the insulating layer adjacent to the conductive layer, and then uses the conductive layer as an anode to form a metal plunger in the hole of the insulating layer by electrolytic plating. This metal plunger is continuously grown by electrolytic power ore method, and its front end protrudes from the surface of the insulating layer. (B) cutting the laminated board for flexible printed wiring to obtain the first flexible printed wiring member and the second flexible printed wiring member; (c) the obtained first flexible printed wiring The wiring member and the second flexible printed wiring member are subjected to subsequent steps while ensuring that the metal bumps of the first flexible printed wiring member and the connection pads of the second flexible printed wiring member are electrically connected. [Brief Description of Drawings] Fig. 1 is a plan view (Fig. IX) and an X-X cross-sectional view (Fig. (B)) of an example of a flexible printed circuit board of the present invention. Fig. 2 is a plan view of a flexible printed wiring laminated board for producing first and second flexible printed wiring members used in the present invention. Fig. 3 is a surface view of a metal bump surface side of a first flexible printed wiring member used in the present invention. I, 5 This paper size is in accordance with Chinese National Standard (CNS) A4 (2 Sichuan x 297 mm) (Please read the "?" On the back of the paper first before filling in this page) -------- Order- -------- Line 1 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 557645 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention) Figure 4 shows the flexible printed circuit of the present invention Board manufacturing process. FIG. 5 shows the manufacturing process of the flexible printed circuit board of the present invention. FIG. 6 is a plan view of a conventional flexible printed circuit board. Fig. 7 is a plan view of a multilayer printed wiring board for a conventional flexible printed wiring board for manufacturing a flexible printed wiring board. [Best Mode for Carrying Out the Invention] Hereinafter, an example of a flexible printed circuit board according to the present invention will be described in detail with reference to the drawings. The flexible printed circuit board 10 shown in FIG. 1 (a plan view (FIG. (A)) and a xx cross-sectional view (FIG. (B))) has a structure in which a first flexible printed wiring member is formed by using an adhesive layer 3. The first and second flexible printed wiring members 2 are connected to form a metal bump 1a of the first flexible printed wiring member 1 and the connection pad 2a of the second flexible printed wiring member 2 is electrically connected. The flexible printed circuit board 10 has a structure combined with at least two members (1, 2). When a flexible printed circuit board is produced on the flexible printed wiring laminated board, the waste of the laminated board can be reduced. For example, the T-shaped flexible printed circuit board (size: a = 160mm / b = 17mm / c = 30mm / d: = 20mm / e = 25mm / f = l 15mm) in FIG. 6 is divided into FIG. 1 The first flexible printed wiring member 1 (size: c '= 35mm / e = 25mm) and the second flexible printed wiring member 2 (size: a = 160mm / b = 17mm) are shown in FIG. 2 When the laminated printed wiring board 100 for flexible printed wiring having a length of 200 mm and a width of 250 mm is shown, 10 pieces can be produced respectively, which is greatly reduced compared to the rejection rate (58.4%) in FIG. 7. 28.1%
I 6 --------------------訂---------線^^ (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 557645 1 A7 B7 五、發明說明（f) (請先閱讀背面之注意事項再填寫本頁) 又，本發明之第1可撓性印刷配線構件1的金屬凸塊 la，如圖1所示般，係在鄰接於第1可撓性印刷配線構件1 的導電層4之絕緣層5上，利用光微影法而藉由化學蝕刻 所形成之孔A內，藉由電解電鍍法所形成的金屬柱塞6的 前端之突出絕緣層5的部分。如此般，在第1可撓性印刷 配線構件1的表面上，能低成本且簡便地形成金屬凸塊la 〇 另一方面，第2可撓性印刷配線構件2，除在用以連 接第1可撓性印刷配線構件1的金屬凸塊la之部分形成一 般的連接墊2a外，係採取和習知的可撓性印刷電路板相同 的層構成，例如可由導電層4和相鄰接的絕緣層5來構成 〇 作爲導電層4，一般是採用銅箔，其他金屬之金、銀 、鋁、焊料、鎳等或其等的合金等所構成者亦可。 導電層4的厚度能依照電路基板的使用目的來適當地 決定出。又，視必要，也能將導電層4圖案化。 經濟部智慧財產局員工消費合作社印製 本發明中，作爲絕緣層5，可採用和一般可撓性印刷 電路板的絕緣層同樣的構成，較佳爲使用絕緣特性、耐熱 性、耐濕性及耐電壓特性優異之聚醯亞胺層。更佳爲使用 聚醯胺酸所醯亞胺化成的聚醯亞胺層。此乃基於，於醯胺 化前，能利用化學蝕刻來正確且簡便地形成孔。 又，絕緣層5的厚度能依照可撓性印刷電路板的使用 目的來適當地決定出。 作爲接著層3，能使用一般之製作可撓性印刷電路板I 6 -------------------- Order --------- Line ^^ (Please read the notes on the back before filling this page) This paper The scale is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 557645 1 A7 B7 V. Description of the invention (f) (Please read the precautions on the back before filling this page) Also, the first flexible of the present invention As shown in FIG. 1, the metal bumps 1a of the flexible printed wiring member 1 are attached to the insulating layer 5 adjacent to the conductive layer 4 of the first flexible printed wiring member 1 by a photolithography method and chemically. In the hole A formed by the etching, a portion of the front end of the metal plunger 6 formed by the electrolytic plating method protrudes from the insulating layer 5. In this way, the metal bumps la can be formed on the surface of the first flexible printed wiring member 1 at low cost and easily. On the other hand, the second flexible printed wiring member 2 is connected to the first flexible printed wiring member 1 only. A part of the metal bump 1a of the flexible printed wiring member 1 forms a common connection pad 2a, and is made of the same layer as a conventional flexible printed circuit board. For example, the conductive printed layer 4 and the adjacent insulation can be used. As the conductive layer 4, copper foil is generally used, and other metals such as gold, silver, aluminum, solder, nickel, or an alloy thereof may be used. The thickness of the conductive layer 4 can be appropriately determined according to the purpose of use of the circuit board. If necessary, the conductive layer 4 can be patterned. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs In the present invention, as the insulating layer 5, the same structure as the insulating layer of a general flexible printed circuit board can be adopted, and it is preferable to use insulation characteristics, heat resistance, humidity resistance, and Polyimide layer with excellent withstand voltage characteristics. More preferably, a polyimide layer formed by polyimide imidization is used. This is based on the fact that, prior to amination, chemical etching can be used to form holes accurately and simply. The thickness of the insulating layer 5 can be appropriately determined in accordance with the purpose of use of the flexible printed circuit board. As the adhesive layer 3, a general flexible printed circuit board can be produced.
I 7 $紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）~' 557645 A7 __ B7_____ 五、發明說明（） 時採用的接著劑所構成之接著層。例如，可列舉習知的各 向異性導電膜、熱可塑性聚醯亞胺、環氧樹脂等。其中， 較佳爲使用和絕緣層5的親和性佳、絕緣特性、耐熱性、 耐濕性及耐電壓特性優異的熱可塑性聚醯亞胺層。 孔內A所充塡的金屬柱塞6及突出於絕緣層5之柱塞 6前端的金屬凸塊la，係如前述般之電解電鍍法所形成的 金屬物質，較佳爲利用電鑛銅柱塞(電鍍銅凸塊）。 金屬柱塞6的直徑和高度、金屬凸塊la的直徑和高度 ，能依照可撓性印刷電路板的使用目的而適當地決定出。 在第1可撓性印刷配線構件1的金屬凸塊la表面上， 爲了提昇導通可靠性，視必要亦可適當地形成鍍金等鍍貴 金屬層。 又較佳爲，如圖3所示般，將金屬凸塊la配列成鋸齒 狀。藉此，即可窄化配線間距，而能達成可撓性印刷電路 板、及使用該電路板的電子機器之小型化、輕量化。這時 較佳爲，第2可撓性印刷配線構件的連接墊也採用相對應 的鋸齒狀配列。 其次針對本發明的可撓性印刷電路板之製造方法，舉 使用熱可塑性聚醯亞胺膜作爲接著層3的情形爲例，邊參 照圖面邊說明每個製程。 製程⑻ 首先，在導電層和相鄰接的絕緣層所構成之可撓性印 刷配線用積層板100上，以能在每單位面積取得最多的第 1可撓性印刷配線構件1和第2可撓性印刷配線構件2的 8 才、紙張尺度適用中國國家&準（CNS)A4規格（210 X： 297公釐） 一 ' " I H ϋ tMwa I n ϋ n n ^1» I t— n i_i I 一δ、· i^i I ϋ n i_i n I (請先閱讀背面之注意事項再填寫本頁) 557645 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（^) 方式，製作出第1可撓性印刷配線構件1及第2可撓性印 刷配線構件2(圖4(a))。第1可撓性印刷配線構件1及第2 可撓性印刷配線構件2 ’可在不同的可撓性印刷配線用積 層板100上製作出，也能在同一個可撓性印刷配線用積層 板100上製作出。 此處，第1可撓性印刷配線構件1 ’係如下述般的製 作出。 又，第2可撓性印刷配線構件2，能利用習知的技術 來製作出。 製程(aa) 在鄰接於導電層4的絕緣層5上，利用光微影法而藉 由化學触刻來形成通達導電層4的孔A。具體而言，在導 電層4上塗佈聚醯胺酸，經乾燥而形成絕緣層前驅物層7( 圖4(b))。接著在其上方塗佈感光性光阻，經乾燥而形成感 光性光阻層8，接著在其上方積層保護膜9(圖4(c))。然而 ，透過對應於待開孔的孔之光罩而進行曝光，經顯像來將 感光性光阻層8圖案化，以圖案化的感光性光阻層8作爲 蝕刻罩幕來將絕緣層前驅物層7施以化學蝕刻。蝕刻結束 後接照通常的方法施以醯亞胺化，藉由除去感光性光阻層 8和保護層9而形成帶有孔A之絕緣層5(圖4(d))。 化學蝕刻的條件，係按照絕緣層前驅物層7的材質、 待開孔的孔A之尺寸等而適當地決定出。 製程(ab) 接著，邊以導電層4爲陽極而利用電解電鍍法在絕緣 I., 9 本紙張尺度適用中國國家標準（CNS)aT^格（210 X 297公釐） " (請先閱讀背面之注意事項再填寫本頁) --------訂 ------I ·線- 557645 A7 ___B7__ 五、發明說明（） 層5的孔A內形成金屬柱塞6，邊連續地藉由電解電鍍法 來使該金屬柱塞6成長’使其則端突出於絕緣層5的表面 而製作出金屬凸塊la(圖5(e))。這時，較佳爲用遮蔽膠帶 被覆於導電層4的外側面4a。 又，作爲電解電鍍的條件，能按照電鍍金屬的種類、 孔徑、待形成的柱塞尺寸等來適當地決定出。 又，該遮蔽膠帶，可在形成接著層3的電鍍過程(ac) 前除去可，直到未圖示的最終製程時仍保持該狀態也可以 〇 製程(ac) 接著，在形成有金屬凸塊la之絕緣層5表面上，按照 需要而以能將金屬凸塊la埋沒的方式來形成接著層3(圖 5(f))。 接著層3的形成，例如係用刮刀塗佈熱可塑性聚醯亞 胺溶液，經乾燥而完成。 製程(ad) 接著，將接著層3的表面化學蝕刻成金屬凸塊la成爲 既定的高度。藉此，即可得出表面設有接著層3之第1可 撓性印刷配線構件(圖5(g))。 接著層3的化學蝕刻條件，能按照接著層3的材質、 金屬凸塊la的材質、所需的回蝕量等而適當地決定出。例 如，當接著層3爲熱可塑性聚醯亞胺層時，作爲鈾刻液可 使用鹼性水溶液。 製程(b) 10 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 557645 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（"j ) 然後，從可撓性印刷配線用積層板上裁出第1可撓性 印刷配線構件1及第2可撓性印刷配線構件2 ’分割成各 個構件(圖5(h))。 製程(c) 將所得的第1可撓性印刷配線構件1和第2可撓性印 刷配線構件2，用接著層3接著成金屬凸塊la和連接墊2a 能互相導通。藉此，不需使用各向異性導電接著膜或導電 膠，即可得出圖5⑴之可撓性印刷電路板。 又，將圖5(e)狀態之第1可撓性印刷配線構件1和第2 可撓性印刷配線構件2，使用另行準備好的各向異性導電 接著膜或導電膠加以接著，即可得出圖1的可撓性印刷電 路板。 如此般所得的可撓性印刷電路板，係適用於各種的電 子機器。 實施例 以下，用實施例來更具體地說明本發明。 實施例1 在厚18//m之銅箔的一面，將均苯四甲酸二酐1.01莫 耳和4,4’_二氨基二苯基醚1.0莫耳溶解於溶媒之N-甲基 -2-吡咯熔酮中得出聚醯胺酸溶液，將該溶液以乾燥厚形 成10//m厚的方式進行塗佈、乾燥。 在該聚醯胺酸層上以乾燥厚成爲8//m的方式塗佈感 光性光阻劑(NR-41(尼龍-低聚酯系光阻劑），蘇尼化學公 司製)並令其乾燥，再在其上方積層厚12//m的保護膜(聚I 7 $ Paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) ~ '557645 A7 __ B7_____ V. Adhesive layer composed of the adhesive used in the description of the invention (). For example, a conventional anisotropic conductive film, a thermoplastic polyimide, an epoxy resin, and the like can be mentioned. Among them, a thermoplastic polyimide layer having good affinity with the insulating layer 5 and excellent insulating properties, heat resistance, moisture resistance, and voltage resistance characteristics is preferably used. The metal plunger 6 filled in the hole A and the metal bump la protruding from the front end of the plunger 6 of the insulating layer 5 are metal substances formed by the electrolytic plating method as described above, and it is preferable to use an electric copper pillar Plug (plated copper bump). The diameter and height of the metal plunger 6 and the diameter and height of the metal bump 1a can be appropriately determined according to the purpose of use of the flexible printed circuit board. On the surface of the metal bump 1a of the first flexible printed wiring member 1, in order to improve the conduction reliability, a precious metal plating layer such as gold plating may be formed as necessary. It is also preferable to arrange the metal bumps la in a zigzag manner as shown in FIG. 3. Thereby, the wiring pitch can be narrowed, and miniaturization and weight reduction of a flexible printed circuit board and an electronic device using the same can be achieved. In this case, it is preferable that the connection pads of the second flexible printed wiring member are also arranged in a corresponding zigzag manner. Next, with regard to the method for manufacturing a flexible printed circuit board of the present invention, a case where a thermoplastic polyimide film is used as the adhesive layer 3 is taken as an example, and each process will be described with reference to the drawings. Process ⑻ First, the first flexible printed wiring member 1 and the second flexible printed wiring member 1 that can obtain the most per unit area are formed on the flexible printed wiring laminated board 100 composed of a conductive layer and an adjacent insulating layer The size of the flexible printed wiring member 2 and the paper size are applicable to China's National & Standard (CNS) A4 specification (210 X: 297 mm). One '" IH ϋ tMwa I n ϋ nn ^ 1 »I t— n i_i I a δ, · i ^ i I ϋ n i_i n I (Please read the precautions on the back before filling this page) 557645 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (^) Method, production The first flexible printed wiring member 1 and the second flexible printed wiring member 2 are extracted (FIG. 4 (a)). The first flexible printed wiring member 1 and the second flexible printed wiring member 2 ′ can be produced on different flexible printed wiring laminated boards 100, and can also be formed on the same flexible printed wiring laminated board. Made on 100. Here, the first flexible printed wiring member 1 'is manufactured as described below. The second flexible printed wiring member 2 can be produced by a known technique. Process (aa) On the insulating layer 5 adjacent to the conductive layer 4, a photolithography method is used to form a hole A through which the conductive layer 4 is reached by chemical etching. Specifically, polyamic acid is coated on the conductive layer 4 and dried to form an insulating layer precursor layer 7 (Fig. 4 (b)). Next, a photosensitive photoresist is applied thereon, and the photosensitive photoresist layer 8 is formed by drying, and then a protective film 9 is laminated thereon (Fig. 4 (c)). However, exposure is performed through a photomask corresponding to the hole to be opened, and the photosensitive photoresist layer 8 is patterned through development, and the insulating layer precursor layer is formed by using the patterned photoresist layer 8 as an etching mask. 7 Chemical etching is applied. After the etching is completed, fluorene imidization is applied in accordance with a usual method, and the photosensitive photoresist layer 8 and the protective layer 9 are removed to form an insulating layer 5 with holes A (Fig. 4 (d)). The conditions for chemical etching are appropriately determined according to the material of the insulating layer precursor layer 7 and the size of the hole A to be opened. Process (ab) Next, using the conductive layer 4 as the anode and using electrolytic plating to insulate the insulation I., 9 This paper size applies the Chinese National Standard (CNS) aT ^ grid (210 X 297 mm) " (Please read first Note on the back, please fill out this page again) -------- Order ------ I · Line-557645 A7 ___B7__ V. Description of the invention () A metal plunger 6 is formed in the hole A of the layer 5, the side The metal plunger 6 is continuously grown by the electrolytic plating method so that its end protrudes from the surface of the insulating layer 5 to produce a metal bump la (FIG. 5 (e)). In this case, it is preferable to cover the outer side surface 4a of the conductive layer 4 with a masking tape. In addition, the conditions for electrolytic plating can be appropriately determined according to the type of plated metal, the hole diameter, the size of the plunger to be formed, and the like. The masking tape may be removed before forming the plating process (ac) of the adhesive layer 3, and the state may be maintained until a final process (not shown). Process (ac) Next, a metal bump la is formed. An adhesive layer 3 is formed on the surface of the insulating layer 5 so that the metal bumps la can be buried as needed (FIG. 5 (f)). Next, the formation of the layer 3 is completed by, for example, applying a thermoplastic polyimide solution with a doctor blade and drying. Process (ad) Next, the surface of the adhesive layer 3 is chemically etched into the metal bumps la to a predetermined height. As a result, a first flexible printed wiring member having an adhesive layer 3 on its surface can be obtained (Fig. 5 (g)). The chemical etching conditions of the next layer 3 can be appropriately determined according to the material of the next layer 3, the material of the metal bump la, the required etch-back amount, and the like. For example, when the adhesive layer 3 is a thermoplastic polyfluorene imide layer, an alkaline aqueous solution may be used as the uranium etching solution. Process (b) 10 wood paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------------- Order ------ --- (Please read the precautions on the back before filling this page) 557645 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (" j) The first flexible printed wiring member 1 and the second flexible printed wiring member 2 ′ are cut into individual members (FIG. 5 (h)). Process (c) The obtained first flexible printed wiring member 1 and the second flexible printed wiring member 2 are connected to each other by a bonding layer 3 to form a metal bump la and a connection pad 2a. Thereby, without using an anisotropic conductive adhesive film or conductive adhesive, the flexible printed circuit board shown in FIG. 5 (a) can be obtained. In addition, the first flexible printed wiring member 1 and the second flexible printed wiring member 2 in the state shown in FIG. 5 (e) can be obtained by using an anisotropic conductive adhesive film or a conductive adhesive prepared separately. The flexible printed circuit board of FIG. 1 is produced. The flexible printed circuit board thus obtained is suitable for various electronic devices. Examples Hereinafter, the present invention will be described more specifically with reference to examples. Example 1 On one side of a copper foil having a thickness of 18 // m, 1.01 mol of pyromellitic dianhydride and 1.0 mol of 4,4'_diaminodiphenyl ether were dissolved in N-methyl-2 in a solvent. -A polyamic acid solution was obtained from pyrrole, and the solution was applied and dried in a dry thickness of 10 // m. A photosensitive photoresist (NR-41 (nylon-oligopolyester-based photoresist), manufactured by Suney Chemical Co., Ltd.) was applied to the polyamic acid layer so as to have a dry thickness of 8 // m, and the photoresist After drying, a 12 // m thick protective film (poly
I 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 557645 A7 B7 五、發明說明（π ) 酯膜，東累公司製）。 從保護膜側，以負片作爲光罩而藉由照射波長365nm 的光來將感光性光阻劑曝光，經顯像而將感光性光阻以每 單位面積(200x250mm)能形成第1可撓性印刷配線構件和 第2可撓性印刷配線構件各10塊的方式進行圖案化。 以圖案化後的感光性光阻作爲蝕刻罩幕，將聚醯胺酸 層用鹼性溶液施以化學蝕刻(蝕刻溫度25°C，蝕刻時間15 秒），以在構成第1可撓性印刷配線構件的聚醯胺酸層上形 成孔。銅范係露出於孔的底部，底部直徑爲50//m，聚醯 胺酸層表面之孔徑爲80//m。 接著，將形成有孔之聚醯胺酸層醯亞胺化而形成絕緣 層(醯亞胺化加熱溫度350°C，醯亞胺化加熱時間1〇分鐘) 〇 接著，將銅箔的外表面用遮蔽膠帶被覆後，以銅箔作 爲陽極進行電鍍銅(硫酸銅鍍溶，鍍溶溫度30°C，電流密度 15A/dm2，電鍍時間30分）。其結果，在第1可撓性印刷配 線構件的絕緣層表面係形成突出20 高之銅凸塊。 接著，在銅凸塊側之絕緣層的全面，以形成乾燥厚20 //m的熱可塑性聚醯亞胺層(接著層)的方式，將3,4,3，，4, -二苯基四羧酸二酐1.0莫耳和1，3-二(3-氨基苯氧基)苯 1.0莫耳溶解於溶媒之N-甲基-2-吡咯熔酮中所得之聚 醯胺酸溶液，用刮刀塗佈後乾燥。 接著，將接著層的表面用鹼性水溶液化學回蝕刻(回蝕 刻溫度25°C，回蝕刻時間1$秒)成銅凸塊的露出高度爲1〇 12 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂---------線一 經濟部智慧財產局員工消費合作社印製 557645 A7 ____B7 _____ 五、發明說明（） //m後，將聚醯胺酸醯亞胺化而完成了熱可塑性聚醯亞胺 層，藉此，即可製作出圖2所示般之第1可撓性印刷配線 構件和第2可撓性印刷配線構件。 將所得的第1可撓性印刷配線構件和第2可撓性印刷 配線構件從模子中取出。然後，將第1可撓性印刷配線構 件的金屬凸塊重疊於第2可撓性印刷配線構件的連接墊上 ，藉由熱壓接來接合(接合溫度260°C，接合時間1〇秒)時 ，能完成高接著強度及高導通可靠性的接合。 〔產業上之可利用性〕 本發明之可撓性印刷電路板，由於毫不浪費地利用既 定大小的可撓性印刷配線積層板即可製造出，故能以低成 本製造出，且具有良好的導通可靠性。 〔元件符號說明〕 1 :第1可撓性印刷配線構件 la :金屬凸塊 2 :第2可撓性印刷配線構件 2a :連接墊 3 :接著層 4 :導電層 4a :導電層之外側面 5 :絕緣層 6 :金屬柱塞 7:絕緣層前驅物層 8:感光性光阻層 13 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） I ϋ n n n n n I ϋ · ϋ ϋ 1· n ϋ ϋ n 一：OJ IBM MB I MM I a··· (請先閱讀背面之注意事項再填寫本頁) 557645 A7 _B7_ 五、發明說明（） 9 :保護層 10 :可撓性印刷電路板 (請先閱讀背面之注意事項再填寫本頁) 71 :可撓性印刷配線用積層板 72 :可撓性印刷電路板 100 :可撓性印刷配線用積層板 A :孔 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）I This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -------------------- Order --------- (Please read the notes on the back before filling out this page) 557645 A7 B7 V. Description of the invention (π) Ester film, manufactured by Toray Corporation. From the protective film side, the negative film is used as a photomask to expose the photosensitive photoresist by irradiating light with a wavelength of 365nm. After development, the photosensitive photoresist can be formed into a first flexibility per unit area (200x250mm). The printed wiring member and the second flexible printed wiring member were each patterned in a pattern of 10 pieces. Using the patterned photoresist as an etching mask, the polyamic acid layer was chemically etched with an alkaline solution (etching temperature 25 ° C, etching time 15 seconds) to form the first flexible printing. A hole is formed in the polyamic acid layer of the wiring member. The copper fan is exposed at the bottom of the hole, the bottom diameter is 50 // m, and the pore diameter on the surface of the polyamic acid layer is 80 // m. Next, the porous polyimide layer formed with pores was imidized to form an insulating layer (the imidization heating temperature was 350 ° C and the imidization heating time was 10 minutes). Next, the outer surface of the copper foil was formed. After being covered with a masking tape, copper electroplating was performed using copper foil as an anode (copper sulfate plating, plating temperature 30 ° C, current density 15A / dm2, plating time 30 minutes). As a result, copper bumps having a height of 20 protrusions were formed on the surface of the insulating layer of the first flexible printed wiring member. Next, on the entire surface of the copper bump side, a 3,4,3,4, -diphenyl group was formed in a manner to form a dry thermoplastic polyimide layer (adhesive layer) with a thickness of 20 // m. A polyamic acid solution obtained by dissolving 1.0 mol of tetracarboxylic dianhydride and 1.0 mol of 1,3-bis (3-aminophenoxy) benzene in N-methyl-2-pyrrolidone, Dry with a doctor blade. Next, the surface of the adhesive layer was chemically etched back with an alkaline aqueous solution (etch back temperature 25 ° C, etch back time 1 $ seconds) to form copper bumps with an exposed height of 1012. This paper is compliant with Chinese National Standards (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling out this page) Order --------- Printed by Line 1 Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives 557645 A7 ____B7 _____ V. Description of the invention () // After m, the polyfluorene imide is imidized to complete the thermoplastic polyfluorine imide layer, whereby the first flexible printed wiring member as shown in FIG. 2 can be produced And a second flexible printed wiring member. The obtained first flexible printed wiring member and the second flexible printed wiring member were taken out of the mold. Then, the metal bumps of the first flexible printed wiring member are superposed on the connection pads of the second flexible printed wiring member, and they are bonded by thermocompression bonding (bonding temperature 260 ° C, bonding time 10 seconds). , Can complete the bonding with high bonding strength and high conduction reliability. [Industrial Applicability] Since the flexible printed circuit board of the present invention can be manufactured without using wasteful flexible printed wiring laminates of a predetermined size, it can be manufactured at low cost and has good quality. Reliability. [Explanation of Element Symbols] 1: First flexible printed wiring member la: Metal bump 2: Second flexible printed wiring member 2a: Connection pad 3: Adhesive layer 4: Conductive layer 4a: Outside side of conductive layer 5 : Insulating layer 6: Metal plunger 7: Insulating layer precursor layer 8: Photosensitive photoresist layer 13 Wood paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) I ϋ nnnnn I ϋ · ϋ ϋ 1 · n ϋ ϋ n 1: OJ IBM MB I MM I a ··· (Please read the precautions on the back before filling out this page) 557645 A7 _B7_ V. Description of the invention () 9: Protective layer 10: Flexible printing Circuit board (please read the precautions on the back before filling out this page) 71: Flexible printed wiring board 72: Flexible printed circuit board 100: Flexible printed wiring board A: Perforated paper size China National Standard (CNS) A4 specification (210 X 297 mm)