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TW554095B - Semi-insulating silicon carbide without vanadium domination - Google Patents

Semi-insulating silicon carbide without vanadium domination Download PDF

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Publication number
TW554095B
TW554095B TW91111200A TW91111200A TW554095B TW 554095 B TW554095 B TW 554095B TW 91111200 A TW91111200 A TW 91111200A TW 91111200 A TW91111200 A TW 91111200A TW 554095 B TW554095 B TW 554095B
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Taiwan
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single crystal
semi
item
silicon carbide
patent application
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TW91111200A
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Chinese (zh)
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Calvin H Carter
Mark Brady
Valeri F Tsvetkov
Stephan Mueller
Hudson M Hobgood
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Cree Inc
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Priority claimed from US09/313,802 external-priority patent/US6218680B1/en
Priority claimed from US09/866,129 external-priority patent/US6396080B2/en
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Publication of TW554095B publication Critical patent/TW554095B/en

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Abstract

A semi-insulating bulk single crystal of silicon carbide is disclosed that has a resistivity of at least 5000 OMEGA-cm at room temperature and a concentration of trapping elements that create states at least 700 meV from the valence or conduction band that is below the amounts that will affect the resistivity of the crystal, preferably below detectable levels. A method of forming the crystal is also disclosed, along with some resulting devices that take advantage of the microwave frequency capabilities of devices formed using substrates according to the invention.

Description

554095 五、發明説明(1 ) 發明範疇 本案係2001年1月10日提出申請之序號〇9/757,950的部分 延續,該序號09/757,950係1999年5月18日提出申請,現為 美國專利第6,218,680號之序號〇9/3 13,802的延續。本發明係 關於供特定用途用之高品質碳化矽晶體的成長,及尤其係 關於有用於微波裝置之高品質半絕緣碳化矽基材之製造。 本發明係於空軍部(Department of the Air F〇rce)協約編號 F336 15- 95-C- 5426下進行。政府於本發明可擁有特定權 利。 發明背景 術語「微波」係指頻率涵蓋約〇」千兆赫(GHz)至1,〇〇〇 GHz之範圍的電磁能量,其之相對波長係自約3〇〇公分至約 〇·3毫米。雖然常人或許最常將「微波」與烹飪裝置廣泛地 產^聯想、,㈣悉電子裝^人士知曉微波頻率被使用於 相當多樣的電子用途及相關的電子裝置中,其包括各種通 訊裝置,及相關的電路元件及操作其之電路。如同許多其 他半導體電子裝置及所產生之電路的情況,裝置(或電路) 定之期望或所需性能特性的能力有極大程度,及通 mr見其之製造材料而定。微波裝置之_種適當的備 =材料為碳化石夕’其提供微波應用相當高之電破壞場的主 = 此特性使諸如金屬半導體場效電晶體 = ΕΤ)之裝置可在較於碎化鎵(GaAs)中形成之場效電晶 肢同十倍的汲極電壓下操作。 另外,碳化石夕彳導熱性為4·9瓦每度飢氏溫度每公分 本紙張尺^^國國家標^ •4- 554095 A7 __________B7 1、發明説明(2"")~— (W/K-cm),其較矽高3.3倍,及較砷化鎵或藍寶石高十倍的 顯著優點。此等性質使碳化矽具有以瓦每毫米(w/mm)測 量,以閘周圍計的高功率密度,以及以晶粒面積計的極高 功率操控能力(W/mm)。對於高功率、高頻率的應用,由= 晶粒尺寸變得受限於波長,因而此點特別有利。因此,由 於碳化矽在任何指定頻率下之優異的熱及電子性質,因而 碳化矽MESFET應可具有由砷化鎵製得之裝置之至少五倍的 功率。 如熟悉微波裝置之人士所知曉,由於導電性基材在微波 頻率下有產生顯著問題的傾向,@而其通常需要高電阻率 (「半絕緣」)基材供偶合用途用。對於大多數的用途,可 將此處所使用之術語「高電阻率」及「半絕緣」視為同 義。一般而言,兩個術語皆係描述具有大於約15〇〇歐姆-公 分(Ω - cm)之電阻率的半導體材料。 此種微波裝置對於廣泛使用於通訊裝置諸如傳呼機及行 動電洁巾’且-般需要高電阻率基材之單片式微波積體電 路(MMIC)尤其重要。因此,微波裝置基材希望具有以下特 性·適用於高度複雜、高性能電路元件之高結晶品質、良 好的導熱性、在裝置與基材之間的良好電絕緣、低電阻損 耗特性、低串音(cross_ialk)特性、及大的晶圓直徑。 …由於碳化矽具有寬能帶隙(在300K下在4H碳化矽中為3.2 電子伏特(eV)),因而理論上應可達到此種半絕緣特性。結 果適田的问電阻率碳化矽基材將可於同一積體電路(「晶 片」)上同時擁有功率及被動裝置,因此而減小裝置的尺554095 V. Description of the invention (1) Scope of the invention This case is a continuation of the serial number 09 / 757,950 filed on January 10, 2001. The serial number 09 / 757,950 was filed on May 18, 1999. Continuation of serial number 0218 / 13,802 of 6,218,680. This invention relates to the growth of high-quality silicon carbide crystals for specific applications, and in particular to the manufacture of high-quality semi-insulating silicon carbide substrates for use in microwave devices. The present invention is carried out under the Department of the Air Force's agreement number F336 15- 95-C-5426. The government may have certain rights in the invention. BACKGROUND OF THE INVENTION The term "microwave" refers to electromagnetic energy having a frequency in the range of about 0 "gigahertz (GHz) to 1,000 GHz, and its relative wavelength is from about 300 cm to about 0.3 mm. Although ordinary people may most commonly use "microwaves" and cooking devices extensively, they are familiar with electronic equipment. People who know electronic equipment know that microwave frequencies are used in a wide variety of electronic applications and related electronic devices, including various communication devices, and related Circuit elements and the circuits that operate them. As is the case with many other semiconductor electronic devices and the circuits they produce, the ability of a device (or circuit) to set desired or required performance characteristics is to a great extent, and it depends on the material from which it is made. A suitable device for a microwave device = material is carbonized carbide. It provides a relatively high electrical damage field for microwave applications. This feature allows devices such as metal semiconductor field effect transistors = ET) to be used in comparison with broken gallium. The field effect transistor formed in (GaAs) operates at ten times the drain voltage. In addition, the thermal conductivity of carbonized stone is 4.9 watts per degree of hunger temperature per centimeter of paper rule ^ ^ national standard ^ • 4-554095 A7 __________ B7 1. Description of the invention (2 " ") ~ — (W / K-cm), which is 3.3 times higher than silicon and ten times higher than gallium arsenide or sapphire. These properties give silicon carbide a high power density measured in watts per millimeter (w / mm), around the gate, and an extremely high power handling capability (W / mm) in terms of grain area. This is particularly advantageous for high-power, high-frequency applications where the grain size becomes limited by the wavelength. Therefore, due to the superior thermal and electronic properties of silicon carbide at any given frequency, the silicon carbide MESFET should have at least five times the power of a device made of gallium arsenide. As anyone familiar with microwave installations knows, conductive substrates tend to cause significant problems at microwave frequencies, and they often require high-resistivity ("semi-insulating") substrates for coupling purposes. For most purposes, the terms "high-resistivity" and "semi-insulated" as used herein can be considered synonymous. In general, both terms describe semiconductor materials having a resistivity greater than about 15,000 ohm-cm (Ω-cm). This type of microwave device is particularly important for monolithic microwave integrated circuits (MMICs) that are widely used in communication devices such as pagers and mobile cleaning towels and that generally require a high resistivity substrate. Therefore, microwave device substrates are expected to have the following characteristics: · High crystal quality suitable for highly complex, high-performance circuit components, good thermal conductivity, good electrical insulation between the device and the substrate, low resistive loss characteristics, and low crosstalk. (Cross_ialk) characteristics, and large wafer diameter. … Since silicon carbide has a wide band gap (3.2 electron volts (eV) in 4H silicon carbide at 300K), this semi-insulating property should theoretically be achieved. As a result, Shida ’s resistivity silicon carbide substrate will have both power and passive devices on the same integrated circuit ("chip"), thus reducing the device size.

五、發明説明(3 ) 。碳化矽亦可提供其他有 而沒有物理、化學、或電 寸’同時並提高其之效率及性能 利的性質,包括在高溫下操作, 破壞的能力。 ‘二:如L碳化石夕之人士所知曉,由大多數技術所成 長的石反化石夕對此等用途而言之導電性一般皆過高。尤盆, 碳化石夕中之標稱或意外的氮濃度在昇華成長晶體中有夠高 的傾向(1_2xloI7/立方公分)’而會提供阻礙此種碳化石夕被 使用於微波裝置中的足夠導電性。 為特別有用,碳化石夕裝置應具有至少1500歐姆-公分(Ω_ ㈣之基材電阻率’以達成動行為。此外,需要测歐 姆_公分以上之電阻率’以使裝置傳輸線損耗減至最小至01 分貝⑽)/公分以下的可接受值。為使裝置絕緣及使反問效 應(backgating effect)減至最*,半絕緣碳化石夕之電阻率庫 接近50,_歐姆_公分以上之範目。目前的研究工作傾向於 主張碳化石夕基材之半絕緣行為係在碳化石夕之能帶隙内之深 能階的結果;即較由p型及㈣摻雜劑所產生之能階更遠離 於價能帶及導電帶:例士。’美國專利第5,6ιι,955號。根據 955專利’在價能帶與導電帶之間之碳化石夕中之深能階可 經由控制選定元素諸如過渡金屬或錢化元素諸如氫、氣或 H此等元素之組合的引人至碳化石夕中’以於碳化石夕中 形成深能階中心而產生;例如,第3攔,第π”行。亦來 ’ Mitchel ’ 4H-SiC. SIMC_X中之i」電子伏特深能階^ u eV Deep Level in 4H_Sic.SIMC_x),加州柏克萊,i99_ 6月;Hobgood,利用物理蒸氣輸送成長之半絕緣QH_sic 554095 A7 B7 五、發明説明(4 ) (Semi-Insulating GH-SiC Grown by Physical Vapor Transport),Appl. Phys. Lett.,第 66卷,第 11號(1995) ; W〇 95/04171 ; Sriram,高電阻率基材上之SiC MESFET的RF性 能(RF Performance of SiC MESFETs on High Resistivity Substrates),IEEE Electron Device Letters,第 15卷,第 11號 (1994) ; Evwaraye,塊狀η型碳化矽中之飢之電及光學性質 的檢測(Examination of Electrical and Optical Properties of Vanadium in Bulk n-type Silicon Carbide),J. Appl· Phys. 76 (10)(1994) ; Schneider,碳化石夕中之飢深能階不純物之紅外 光譜及電子自旋譜振(Infrared Spectra and Electron Spin Resonance of Vanadium Deep Level Impurities in Silicon Carbide),Appl. Phys· Lett· 56 (12)(1990);及Allen,微波 SiC FET之頻率及功率性能(Frequency and Power Performance of Microwave SiC FET’s),國際碳化矽及相關材料會議會報 (Proceedings of International Conference on Silicon Carbide and Related Materials) 1995 ,物理協會(Institute of5. Description of the invention (3). Silicon carbide can also provide other properties that have no physical, chemical, or electrical properties, and improve its efficiency and performance, including the ability to operate at high temperatures and destroy. ‘Second: As known to those of L Carbide, the anti-fossil runes formed by most technologies are generally too conductive for these purposes. Youpen, the nominal or accidental nitrogen concentration in the carbides has a tendency to be sufficiently high in the sublimated growth crystals (1_2xloI7 / cm3) 'and will provide sufficient conductivity to prevent such carbides from being used in microwave devices. Sex. In order to be particularly useful, a carbonized carbide device should have a substrate resistivity of at least 1500 ohm-cm (Ω_㈣) to achieve dynamic behavior. In addition, it is necessary to measure the resistivity of ohm_cm or more to minimize the transmission line loss of the device to 01 decibels 公) / cm. In order to insulate the device and minimize the backgating effect, the resistivity library of semi-insulating carbides is close to the range of 50 ohms or more. The current research work tends to advocate that the semi-insulating behavior of the carbide base material is a result of the deep energy levels within the energy band gap of the carbide body; that is, it is farther away from the energy levels generated by the p-type and erbium dopants. In the valence band and conductive band: example. ’U.S. Patent No. 5,6ιι, 955. According to the 955 patent, the deep energy levels of the carbides between the valence band and the conductive band can be brought to carbon by controlling the combination of selected elements such as transition metals or chalcogens such as hydrogen, gas, or H. Fossil Xizhong 'is generated by the formation of deep energy level centers in carbonized fossils; for example, row 3, line π ". Also comes to' Mitchel '4H-SiC. I" in SIMC_X "electron volt deep energy level ^ u eV Deep Level in 4H_Sic.SIMC_x), Berkeley, California, i99_ June; Hobgood, semi-insulating QH_sic 554095 A7 B7 grown using physical vapor transport V. Description of the invention (4) (Semi-Insulating GH-SiC Grown by Physical Vapor Transport), Appl. Phys. Lett., Vol. 66, No. 11 (1995); W〇95 / 04171; Sriram, RF Performance of SiC MESFETs on High Resistivity Substrates), IEEE Electron Device Letters, Volume 15, No. 11 (1994); Evwaraye, Examination of Electrical and Optical Properties of Vanadium in Bulk n- type Silic on Carbide), J. Appl. Phys. 76 (10) (1994); Schneider, Infrared Spectra and Electron Spin Resonance of Vanadium Deep Level Impurities in Silicon Carbide), Appl. Phys · Let · 56 (12) (1990); and Allen, Frequency and Power Performance of Microwave SiC FET's, International Conference on Silicon Carbide and Related Materials (Proceedings of International Conference on Silicon Carbide and Related Materials) 1995, Institute of Physics

Physics) o 除了習知的想法之外,此等深能階元素不純物(亦稱為深 能階捕捉元素)可經由在高純度碳化矽之高溫昇華或化學蒸 氣沈積(CVD)成長過程中將其引入而加入。尤其,釩被視 為係供此用途用之期望的過渡金屬。根據,955專利及類似 技藝,釩補償碳化矽材料,及產生碳化矽之高電阻率(即半 絕緣)特性。 然而,引入釩作為補償元素以產生半絕緣碳化矽亦會帶 本紙張尺度適用中國國家榡準(CNS) A4規格(210X297公釐) 554095 五、發明説明(5 ,,:缺點。、百先’存在電子顯著量的任何摻雜劑,壬 二9對生成材料之結晶品質有負面影響。因此,^ 著降低或消除知七甘可在顯 品質及元素之程度内提高生成材料之晶體 、’的私子品質。尤其,目前的瞭解係補償 的飢g造成碳化石夕中 (micropipes) 〇 Μ之成長^ 4如㈣物及微管 第二個缺點為引入補償量的釩會降低 緣碳化矽基材的製造費用。望一 ν曰力+絕 衣仏賈用。第二,奴化矽或任何其他半 ::士、之積極主動的補償可能稱微複雜且不可預測,因此 ::來製造複雜性,因而如可避免補冑,則可如期將其避 在於1999年5月18曰提出申請之專利 __及於_w1〇日提出申請之其之㈣2 〇^9/ 757,95G中,揭示—種改良的半絕緣碳切,其中於補償 碳:矽單晶中,將釩的濃度維持低於可檢測(例如,SIM:· :松測)值。在說明相關的摻雜時,,802申請案以及許多先 則技蟄有時會將特定的摻雜劑稱為「深」<「淺」。雖然 在描述與特定之摻雜劑相關的狀態及能階時,術語「深」 及夂」可具有說明性的值,但其可以相對而非限制的咅、 味獲得最佳的瞭解。 u 各例來次在些情況中,將距能帶邊緣3 〇〇毫電子伏特 以上之能階稱為「深」。然而·,纟生在該範圍内之能階的 一些7L素(例如,硼)亦可以「淺」的方式作用;即其可產 生導電能階而非提高電阻率之能階。此外,如同硼(b)的情 -8- 本紙張尺度適用巾g g家標準(CNS) Μ規格(2lGX297公爱) 554095 A7 _________ B7 五、發明説明(6 ) 況,個別的元素可於能帶隙内產生多於一個能階。 的及概要 因此,本發明之一目的為提供一種沒有普遍被定為 「深」或「淺」之特定摻雜劑的半絕緣碳化矽基材,及提 供一種具有高頻操作所需且對之有利之能力,但同時可避 免先前材料及技術之缺點的半絕緣碳化矽基材。 本發明以一種在室溫下具有至少5〇〇〇歐姆-公分之電阻率 及低於1E16之過渡元素濃度之碳化矽之半絕緣塊狀單晶達 成此目的。 本發明之另一態樣係一種在室溫下具有至少5〇〇〇歐姆-公 分之電阻率,及具有較會影響晶體之電特性之量低之產生 距價能或導電帶至少700毫電子伏特之狀態之捕捉元素濃度 之碳化矽之半絕緣塊狀單晶。 本發明之又另一態樣包括加入根據提出專利申請之發明 之半絕緣碳化矽的裝置,其包括MESFET、特定的 MOSFET、及HEMT (高電子移動率電晶體)。 本發明之前述及其他的目的及優點及其之完成方式將可 基於以下之詳述結合附圖而更加清楚,其中: 周式簡單說明 圖1至3係於根據本發明製造之晶圓上進行之霍耳(Η"。效 應測量的圖; 圖4係根據本發明之半絕緣碳化矽之載體濃度之自然對數 對溫度(凱氏溫度)倒數的圖; 圖5係根據本發明之半絕緣碳化矽之電阻率之自然對數對 -9- 554095 A7 B7 五、發明説明(7 溫度倒數的圖; 圖6至8係與呈現於圖1至3相同之測量,但取自基材晶圓 的不同部分; 圖9係說明於圖6至8之樣品之載體濃度之自然對數對溫度 倒數的另一圖; 圖1〇係再次關於圖6至8之樣品測量之導電率之自然對數 對溫度倒數的另一圖; 圖11至13係關於在半導電性碳化矽材料之不同部分上之 又另一測量之與圖1至3及6至8相同的又另一組圖; 圖14係說明於圖11至13之樣品之電阻率之自然對數對溫 度倒數的另一圖;及 圖15、16、及π係根據本發明之材料及先前技藝材料之 各種樣品之第二離子質量光譜術(SIMS)的圖。 詳述 在第一具體實施例中,本發明係一種具有過渡元素濃度 較此種元素支配晶體電阻率之值低,及以在低於1〇•丨6每立 方公分(cm·3)(即1E16)之濃度下較佳之碳化矽之半絕緣 狀單晶。 在另一具體實施例中,本發明係一種在室溫下具有至少 歐姆-公分之電阻率,及具有較會影響晶體之電特性: 量低之產生距價能或導電帶至少7〇〇毫電子伏特之狀態之捕 捉元素濃度之碳化矽之半絕緣塊狀單晶。 此處所使用 碳化石夕中時, 之術語「過渡元素」係指當 形成在碳化矽之價能與導電 以摻雜劑加入於 帶之間之能階較 -10-Physics) o In addition to conventional ideas, these deep-level elemental impurities (also known as deep-level trapping elements) can be grown by high-temperature sublimation or chemical vapor deposition (CVD) of high-purity silicon carbide. Introduced and added. In particular, vanadium is considered a desirable transition metal for this purpose. According to the 955 patent and similar technologies, vanadium compensates silicon carbide materials and produces the high resistivity (ie, semi-insulating) properties of silicon carbide. However, the introduction of vanadium as a compensating element to produce semi-insulating silicon carbide will also bring the paper size to the Chinese National Standard (CNS) A4 specification (210X297 mm) 554095 5. Description of the invention (5 ,,: Disadvantages., Baixian ' In the presence of any dopant with a significant amount of electrons, Renji 9 has a negative impact on the crystalline quality of the resulting material. Therefore, reducing or eliminating Zhiqigan can increase the crystal quality of the resulting material to a significant degree and element. The quality of the child. In particular, the current understanding is that the compensation of starvation has caused the growth of carbon nanotubes (micropipes) 0 μm. 4 The second disadvantage is that the introduction of compensation vanadium will reduce the margin of silicon carbide. The manufacturing cost of materials. Wang Yi ν means strength + absolute clothing. In the second place, the active compensation of slave silicon or any other half ::: may be said to be slightly complicated and unpredictable, so :: to create complexity Therefore, if supplementation can be avoided, it can be avoided as scheduled in the patent filed on May 18, 1999, and in ㈣ 2 〇 9 / 757,95G, which was filed on _w10, and disclosed- An improved semi-insulating carbon cut, where Carbon compensation: In silicon single crystals, the concentration of vanadium is maintained below a detectable (e.g., SIM: ·: loose test) value. When explaining the related doping, the 802 application and many prior art techniques sometimes sometimes A specific dopant is referred to as "deep" < "shallow". Although the terms "deep" and "夂" may have descriptive values when describing the states and energy levels associated with a particular dopant You can get the best understanding of the relative taste, not the limit. U In each case, the energy level above 300 millielectron volts from the edge of the band is called "deep". However, ... Some 7L elements (for example, boron) that have energy levels in this range can also act in a "shallow" manner; that is, they can produce conductive energy levels rather than energy levels that increase resistivity. In addition, like boron (b) 's情 -8- This paper size is applicable to the GG standard (CNS) M specification (2lGX297 public love) 554095 A7 _________ B7 V. Description of the invention (6) In the case, individual elements can generate more than one energy level in the energy band gap Therefore, it is an object of the present invention to provide a method which is not generally defined as "deep" or " "Semi-insulating silicon carbide substrate with specific dopants, and a semi-insulating silicon carbide substrate with the necessary and beneficial capabilities for high-frequency operation, but at the same time avoiding the disadvantages of previous materials and technologies. The present invention This object is achieved by a semi-insulating bulk single crystal of silicon carbide having a resistivity of at least 5000 ohm-cm at room temperature and a transition element concentration lower than 1E16. Another aspect of the present invention is an Silicon carbide with a resistivity of at least 5000 ohm-cm at room temperature, and a capture element concentration that produces a valence energy or conductive band of at least 700 millielectron volts, which is lower than the amount that affects the electrical characteristics of the crystal The semi-insulating bulk single crystal. Yet another aspect of the invention includes a device incorporating a semi-insulating silicon carbide according to the patented invention, which includes a MESFET, a specific MOSFET, and a HEMT (High Electron Mobility Transistor). The foregoing and other objects and advantages of the present invention and the manner of accomplishing the same will be more clear based on the following detailed description in conjunction with the accompanying drawings, in which: Weekly brief description Figures 1 to 3 are performed on a wafer manufactured according to the present invention Fig. 4 is a graph of the effect measurement; Fig. 4 is a graph of the natural logarithm of the carrier concentration of the semi-insulating silicon carbide according to the present invention versus the temperature (Kelvin temperature); Fig. 5 is a semi-insulating carbonization according to the present invention The natural logarithm of the resistivity of silicon is -9- 554095 A7 B7 V. Description of the invention (7 Graph of temperature reciprocal; Figures 6 to 8 are the same measurements as shown in Figures 1 to 3, but taken from different substrate wafers Figure 9 is another graph illustrating the natural logarithm of the carrier concentration in the samples of Figures 6 to 8 versus the reciprocal temperature; Figure 10 is again about the natural logarithm of the conductivity measured in the samples of Figures 6 to 8 versus the reciprocal of temperature Another figure; Figures 11 to 13 are still another set of figures similar to Figures 1 to 3 and 6 to 8 regarding yet another measurement on different parts of the semi-conductive silicon carbide material; Figure 14 is illustrated in Figure Natural logarithm of resistivity versus temperature for samples from 11 to 13 Another figure of the countdown; and Figures 15, 16, and π are diagrams of the second ion mass spectrometry (SIMS) of various samples of materials according to the present invention and prior art materials. Detailed description in the first embodiment The present invention is a silicon carbide having a transition element concentration lower than that of the element dominating the crystal resistivity, and a silicon carbide which is better at a concentration lower than 10 · 丨 6 per cubic centimeter (cm · 3) (ie, 1E16). It is a semi-insulating single crystal. In another specific embodiment, the present invention has a resistivity of at least ohm-cm at room temperature, and has more electrical characteristics that will affect the crystal: Semi-insulating bulk single crystal of silicon carbide that captures elemental concentration in a state of a conductive band of at least 700 millielectron volts. The term "transition element" when used in carbides here means the value when formed on silicon carbide. The energy level between the energy and the conductivity added by the dopant to the band is -10-

554095 A7 --------- B7 五、發明説明(8 ) 更為習知之p型或η型摻雜劑更為遠離導電及價能帶之狀態 之週期表的元素。如記述於領域及背景中,釩係具有此種 特性的常見過渡元素。 如進一步使用於文中,經定義為「低於可檢測值」之濃 度係指以無法被新式之複雜分析技術檢測得之量存在的元 素。尤其,由於用於檢測少量元素之一種更常用的技術為 第二離子質量光譜術(「SIMS」),因而在此所指之可檢測 極限係以低於1/10,立方公分(1]£16),或在其他情況中, 低於約1E14之量存在之元素諸如釩及其他過渡金屬的量。 此兩量係代表使用SIMS技術之大部分微量元素(尤其係釩) 的典型檢測極限;例如,SIMS理論-敏感度及檢測極限 (SIMS Theory-Sensitivity and Detection Limits) ^ Charles554095 A7 --------- B7 V. Description of the invention (8) More conventional p-type or n-type dopants are farther away from the elements of the periodic table in the state of conduction and valence band. As described in the field and background, vanadium is a common transition element with such characteristics. As used further herein, a concentration defined as "below detectable value" refers to an element that exists in an amount that cannot be detected by new sophisticated analysis techniques. In particular, since a more commonly used technique for detecting small amounts of elements is second ion mass spectrometry ("SIMS"), the detectable limit referred to herein is below 1/10, cubic centimeters (1). 16), or in other cases, amounts of elements such as vanadium and other transition metals present in an amount below about 1E14. These two quantities represent typical detection limits for most trace elements (especially vanadium) using SIMS technology; for example, SIMS Theory-Sensitivity and Detection Limits ^ Charles

Evans & Associates (1995),靠〜⑽咖。 如前所指,釩(V)係用於製造半絕緣碳化矽之一種更常用 的元素。因在匕,本發明之特徵在於不存在^ ,或如存在的 活,其係以較實質上會影響晶體之電阻率之量低,及以低 於1Ε 16較佳之量存在。 - 雖然可有其他的多型結構(p〇lytype)(即晶體結構),但根 據本發明之此具體實施例的碳化矽單晶以具有選自由%、 4Η、6H及l5R多型結構所組成之群之多型結構較佳。 …為避免與氮之存在相關的問題,及所產生之嘗試 補償氮的需求’根據本發明之此具體實施例的碳化石夕^曰 以具有低於約1χι〇Ι7/立方公分(iei7)之氮原子濃度較佳:B 根據本發明之碳化矽半絕緣單晶具有5E16以下之氮濃度將 -11 - 554095 A7 B7 五、發明説明(9 ) 更佳。叙之濃度係低於1E16原子每立方公分,及低於1£14 原子每立方公分最佳。另外,生成之塊狀碳化石夕單晶在室 溫下具有至少10,000歐姆-公分之電阻率將較佳,及在室溫 下至少50,000歐姆-公分之電阻率最佳。 皿 為提供高頻MESFET用之半絕緣碳化矽基材,4Η?型姓構 由於其之較高的整體電子移動率而較佳。對於其他的°裝 置,另一多型結構可能為較佳。因此,本發明之一更佳具 體實施例係在室溫下具有至少丨〇,〇〇〇歐姆·公分之電阻率^ 具有低於旧4之凱原子濃度之沾碳化石夕之半I緣塊狀單 晶。 製造碳化石夕t半絕緣塊狀單晶之方法包括將碳化石夕源粉 末加熱至昇華,同時並將碳化石夕晶種加熱,然後再維持在 低:源粉末之溫度的溫度下,且在此溫度下,㈣源粉末 之昇華物種將凝結於晶種上較佳。其後,&方法包括繼續 加熱碳化矽源粉末,直至在晶種上發生期望量的單晶整體 成長為止。此方法之特徵在於:〇)源粉末(如前所述)中之 過渡元素的量係低於相關量,(2)源粉末包含MM以下之 ^ ’及(3)在昇華成長過矛呈中,冑源粉末及晶種維持在夠 二’、而可顯著降低在其他情況中將可加人至於晶種上之整 肢成長中之虱之量’及將在晶種上在整體成長中之點瑕疵 ^有曰時稱為固有點瑕疲)之數目提高至使生成之碳化石夕塊狀 早晶成為半絕緣之量的各別溫度下。較佳方式及在概念 上’經由將氮或其他摻雜劑之量維持為儘可能地低,則亦 了將使晶體成為半絕緣所需之點瑕疵的數目減至最小。目 本紙張 554095 五 發明説明(1〇 前’·=γ此的較佳數目似乎係在1E15_5E17之範圍内。 兩為衣k根據本發明之半絕緣碳化矽,所使用之源粉末必 =3釩或如存在釩的話,其必需低於可檢測值。如前 _ 可私測值典型上係經定為可使用SIMS測量之值。換 σ之源粕末中之釩的量係低於1Ε16原子每立方公分較 佳,及低於1Ε14原子每立方公分最佳。 在較佳具體實施例中,經由使用高純度石墨作為W之其 中種原料,以及經由在反應器的本身中使用純化石墨零 件’而使虱減至最低。一般而言,石墨(關於源粉末或反應 器零件)可經由在函素氣體(例如,之存在下加熱,及若 須要,經由在惰性大氣(例如,Ar)中在約25〇〇它下進一步 加熱(「烤乾(bake out)」),而將可能存在的摻雜元素諸如 硼或鋁純化掉。技藝中亦知曉適當的純化技術(例如,美國 專利第5,336,520、5,5〇5,929、及5,7G5,139號,且其視需要 可不經過多的實驗而實行)。 根據本發明更經發現生成塊狀單晶中之氮之量不僅可經 由使用在先刖技藝中所^及之咼純度技術(其自然被認可為 本發明技術之部分),並且可經由在相當高之溫度下進行昇 華,同時並將晶種、及在晶種上之任何整體成長之溫度維 持在低於源粉末之溫度的溫度下而降低。昇華成長之較佳 技術(除了如此處所說明的修改外)記述於美國專利第汉丘 34,861號,將其之内容以引·用的方式完全併入本文中 (「’861專利」)。 昇華係於適當的坩堝中進行,其如於,86 1專利中所記述, 554095 A7 —-------一 B7 五、發明説明(~--- 典型上係由石墨形出。以⑽a, ' ^ 々成坩堝包括晶種夾具,且其皆係設置 於昇華爐之内部。讳+面^ 現而要將Sic源粉末選擇及純化為具有低 於約1E 1 7之氮濃痄 η、 ^ 及以低於約5 Ε16較佳。此外,源粉末 具有較會影響生点s雜七兩^ 、 成曰曰體之電特性之量低之釩或其他重金屬 或^渡元素之展度。此種量包括低於sims可檢測值之量, 八心明使用目蝻可取得之SIMs,其至少低於ιΕΐ6,及以低 .於1 E14原子每立方公分較佳。源粉末滿足記述於,86 1專利 中之其他有利特性亦較佳。 田力入y里硼作為受體時,其最好係以包括期望量之源 材料(粉末)之形式加入。 由貝際的觀點來看,碳化石夕昇華可利用自約。〇至約 2500°C之源溫度,將晶種之溫度成比例地維持較低而進 行。關於此處所說明之材料,將源維持於約236〇及238〇。〇 =間,將晶種維持於300·35〇χ^τ。如熟悉此種程序及測 i之人士所知曉,所指出之溫度可視系統係如何測量及在 何處測量而定,且在不同系統之間會有輕微的差異。 由於釩係先前嘗試用於製造補償型半絕緣碳化矽的選擇 元素,因而本發明可以其中釩係低於以上所引述之可檢測 及數值之值之塊狀SiC單晶及其之製法表現。然而,熟悉碳 化矽之成長及使用於半導體用途之碳化矽之特性之人士所 當明瞭,本發明同樣考慮不存在任何其他會產生與釩相同 功能特性(及潛在缺點)的元素。 經由避免使用此種元素,本發明同樣消除以其他元素補 償此種兀素的需求,及相應地降低此種補償對晶體成長方 -14- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 554095 A7Evans & Associates (1995). As mentioned earlier, vanadium (V) is a more commonly used element for the manufacture of semi-insulating silicon carbide. Because of this, the present invention is characterized by the absence of ^, or, if it exists, it is present in an amount that is substantially lower than the resistivity that substantially affects the crystal, and in an amount that is preferably less than 1E 16. -Although there may be other polytype structures (ie, crystal structures), the silicon carbide single crystal according to this embodiment of the present invention has a structure selected from the group consisting of%, 4Η, 6H, and 15R polytype structures. The multi-type structure of the group is better. ... to avoid the problems associated with the presence of nitrogen and the need to try to compensate for the nitrogen 'according to this specific embodiment of the present invention, the carbonized stone is described as having a content of less than about 1 x 7 / cm3 (iei7) The nitrogen atom concentration is better: B. The silicon carbide semi-insulating single crystal according to the present invention has a nitrogen concentration below 5E16, which will be -11-554095 A7 B7 5. The invention description (9) is better. The concentration of Syria is below 1E16 atoms per cubic centimeter, and below 1 £ 14 atoms per cubic centimeter is the best. In addition, the resulting monolithic carbide carbide evening crystals will have a resistivity of at least 10,000 ohm-cm at room temperature, and a resistivity of at least 50,000 ohm-cm at room temperature will be the best. To provide a semi-insulating silicon carbide substrate for high-frequency MESFETs, the 4Η? Type surname is preferred due to its higher overall electron mobility. For other ° devices, another multi-type structure may be better. Therefore, one of the more preferred embodiments of the present invention has a resistivity of at least 10,000,00 ohm · cm at room temperature ^ a half-I edge block of carbonized fossil with a Ka atom concentration lower than the old 4 Crystalline single crystal. The method for manufacturing the semi-insulating bulk single crystal of carbonized carbide powder includes heating the carbonized powder powder to sublimation, while heating the carbonized powder powder, and then maintaining the temperature of the source powder at a low temperature: At this temperature, it is better that the sublimated species of the Wuyuan powder will condense on the seed crystal. Thereafter, the & method includes continuing to heat the silicon carbide source powder until a desired amount of single crystal overall growth occurs on the seed crystal. The characteristics of this method are: 0) the amount of the transition element in the source powder (as described above) is lower than the relevant amount, (2) the source powder contains ^ 'below MM and (3) the sublimation grows in the spear.胄 source powder and seed crystals are maintained at two enough, and can significantly reduce the amount of lice in whole limb growth that can be added to the seed crystals in other cases, and the overall growth of seed crystals The number of spot defects (sometimes called intrinsic spot defects) is increased to the respective temperatures of the amount of the resulting carbide-like early crystals that become semi-insulating. The preferred way and conceptually 'by keeping the amount of nitrogen or other dopants as low as possible, the number of dot defects required to make the crystal semi-insulating is also minimized. Item paper 554095 Five invention descriptions (10 before '· = γ The preferred number seems to be in the range of 1E15_5E17. Two are the semi-insulating silicon carbide according to the present invention, the source powder used must be 3 vanadium Or if vanadium is present, it must be lower than the detectable value. As before _ privately measured values are typically set to values that can be measured using SIMS. The amount of vanadium in the source meal for σ is less than 1E16 atoms Per cubic centimeter is better, and less than 1E14 atoms per cubic centimeter is best. In the preferred embodiment, by using high purity graphite as one of the raw materials of W, and by using purified graphite parts in the reactor itself ' Minimize lice. In general, graphite (in terms of source powder or reactor parts) can be heated by heating in the presence of a pheromone gas (eg, in the presence of) and, if necessary, in an inert atmosphere (eg, Ar). It is further heated ("bake out") at about 2500 ° C to purify possible doping elements such as boron or aluminum. Appropriate purification techniques are also known in the art (for example, U.S. Patent No. 5,336,520, 5,5〇5,9 29, and 5, 7G5, 139, and if necessary, can be implemented without much experimentation). According to the present invention, it has been found that the amount of nitrogen in the formation of bulk single crystals can not only be obtained by using in the prior art ^ And the purity technology (which is naturally recognized as part of the technology of the present invention), and can be sublimated at a relatively high temperature, while maintaining the temperature of the seed crystal and any overall growth on the seed crystal low It is lowered at the temperature of the source powder. A better technique for sublimation growth (except for the modification as described here) is described in US Patent No. 34,861, the content of which is fully incorporated herein by reference. Medium ("the '861 patent"). Sublimation is performed in a suitable crucible, as described in the 86 1 patent, 554095 A7 ----------- B7 V. Description of the invention (~ --- It is typically made of graphite. ⑽a, 々 is used to form a crucible that includes seed fixtures, and all of them are set inside the sublimation furnace. Tab + surface ^ Now select and purify the Sic source powder to have less than Nitrogen concentrations 痄 η, ^ of about 1E 1 7 and less than about 5 Ε 16 is preferred. Furthermore, the source powder has a green dot may affect more heteroatoms seventy-two ^ s, a low amount of the electrical characteristics of the body of the vanadium or other heavy metals or transition elements of the spread of said said ^. Such an amount comprising less than sims The amount of measurable value, which is at least less than ιΕ 心 6, and lower than that of Baxinming's SIMs. The source powder satisfies the other advantages described in the 86 1 patent. The characteristics are also better. When Tian Lijin boron is used as the acceptor, it is best to add it in the form of a source material (powder) that includes the desired amount. From the perspective of Beiji, the sublimation of carbonized rocks can be used at will. The source temperature is from 0 to about 2500 ° C, and the temperature of the seed crystal is kept proportionally low. Regarding the materials described herein, the sources are maintained at approximately 236.0 and 238. 〇 = In between, the seed was maintained at 300 · 35 × χ ^ τ. As known to those familiar with such procedures and measurements, the temperature indicated may depend on how and where the system is measured, and there may be slight differences between different systems. Since the vanadium series has previously been selected as a selective element for compensating semi-insulating silicon carbide, the present invention can be expressed as a bulk SiC single crystal in which the vanadium series is lower than the detectable and numerical values quoted above and its manufacturing method. However, those familiar with the growth of silicon carbide and the characteristics of silicon carbide used in semiconductor applications will understand that the present invention also considers that there are no other elements that would have the same functional characteristics (and potential disadvantages) as vanadium. By avoiding the use of such elements, the present invention also eliminates the need to compensate for this element with other elements, and correspondingly reduces this compensation for crystal growth. -14- This paper size applies Chinese National Standard (CNS) A4 specifications (210 X 297 mm) 554095 A7

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Hold

、命 554095 五、發明説明 樣可使用此象^ ;^索芬☆固士人 歎據及此圖於測定半絕緣碳化矽材料之活化 門 4寸的活化能。換言之,於圖4及5中測得之活 月匕S 、差異係在預期的實驗極限内,且數據可互相印 證0 圖6至10王現如同圖丨至5之相同類型的測量及圖,但其係 取自不同的樣品;明確言之,其係圖丨至5所測量之相同晶 圓的不同區域。因此,可看到圖6至8係與圖}至3所描繪之 結果一致。更明確言之,圖9 (其係載體濃度之自然對數對 溫度倒數之另一圖)顯示丨·⑻227電子伏特之計算得的活化 能。同樣地,此係在稱早測得之U電子伏特的實驗極限 内0 圖10以類似的方式描繪電阻率之自然對數對溫度倒數, 且其同樣地提供1.01159之活化能,其同樣係在U電子伏特 之實驗極限内。圖丨丨至13顯示來自晶圓之又另一部分的結 果’但其被視為較於先前測量中所見之結果不利。尤其, 圖11之圖無法以期望的方式形成直線,且數據較先前的結 果不利。同樣地,描繪電阻率之自然對數對溫度倒數之圖 14顯示僅有〇·63299之計算得的活化能,此值與1丨電子伏特 有甚大偏差,而與實驗不可靠性無關。 圖15、16、及17呈現各種比較樣品之第二離子質量光譜 (SIMS),且其傾向於顯示半絕緣碳化矽基材中之元素不純 物及其他材料。圖1 5係根據本發明之半絕緣碳化石夕材料的 SIM S光譜’且其證實在樣品中不存在飢或任何其他的過、、产Destiny 554095 V. Description of the invention This image can be used ^; ^ Sophie ☆ Gu Shiren The exclamation and this figure are used to determine the activation energy of the 4-inch activation gate of semi-insulating silicon carbide material. In other words, the live moon dagger S and the difference measured in Figures 4 and 5 are within the expected experimental limits, and the data can confirm each other. Figures 6 to 10 are the same types of measurements and maps as Figures 1-5. However, they are taken from different samples; specifically, they are different regions of the same wafer as measured in FIGS. Therefore, it can be seen that Figs. 6 to 8 are consistent with the results depicted in Figs. More specifically, Fig. 9 (which is another graph of the natural logarithm of the carrier concentration versus the reciprocal of temperature) shows the calculated activation energy of ⑻-227 electron volts. Similarly, this is within the experimental limit of U electron volts measured earlier. Figure 10 depicts the natural logarithm of resistivity versus temperature inverse in a similar manner, and it also provides an activation energy of 1.01159, which is also at U Within the experimental limits of electron volts. Figures 丨 to 13 show results from another part of the wafer 'but they are considered to be less favorable than the results seen in previous measurements. In particular, the graph of FIG. 11 cannot form a straight line in a desired manner, and the data is less favorable than the previous results. Similarly, Figure 14 depicting the natural logarithm of resistivity versus the reciprocal of temperature shows only a calculated activation energy of 0.629399, a value that deviates greatly from 1 丨 electron volts and has nothing to do with experimental unreliability. Figures 15, 16, and 17 present second ion mass spectra (SIMS) of various comparative samples, and they tend to show elemental impurities and other materials in semi-insulating silicon carbide substrates. Fig. 15 is a SIM S spectrum of a semi-insulating carbide fossil material according to the present invention, and it is confirmed that there is no starvation or any other problem in the sample.

五、發明説明(14 ) 金萄此哎貝存在於本發明之活化能及中間能隙狀態並非 由釩或其他過渡金屬之存在所產生。 圖16係供比較用’且其係、既非半絕緣,亦非根據本發明 所製造之碳化矽,而係呈現導電性碳化矽樣品之沭型晶圓 的SIMS光譜。由於N_型基材不存在包括鈒的理由,因= 量光譜不存在釩。 ' 圖17提供經補償鈒之先前型式之半絕緣碳化發的比較。 在光譜中之大約51原子質量單位處強烈地出現鈒波峰。在 圖15及16中明顯不存在此釩波峰。 :然,熟悉此等材料之人士當明瞭雖然片語「低於可檢 測量」係本發明之完全適當的說明,但亦可將此等量理解 為低於會影響碳化碎晶體之電子特性,及尤其係電阻率之 因此’本發明之另一態樣包括_種具有供體摻雜劑、受 體摻,劑、及时點瑕⑤之半絕緣碳切單晶。在本發明 之此態樣中’碳化矽晶體中之供體摻雜劑的數目較 體摻雜劑之數目(Na)大’且作為受體之碳化石夕中之固有點 瑕疯之數目(Nd|)較此等供體及受體摻雜劑之數目之間的數 值差大。料’關於此態樣,過渡元素及重金屬之濃产較 會影響碳化石夕單晶之電性質之濃度低,及以低於丨二交 佳。生成之碳化矽單晶在室溫下具有至少5〇〇〇歐姆-公分之 電阻率,以至少1〇,000歐姆-公分較佳,及5〇〇〇〇 最佳。 本發明之此態樣亦適用於受體摻雜劑原子之數目較供體 554095 A7V. Explanation of the invention (14) The activation energy and intermediate energy gap state of the present invention in the present invention is not generated by the presence of vanadium or other transition metals. Fig. 16 is for comparison 'and it is neither a semi-insulating nor a silicon carbide manufactured according to the present invention, but a SIMS spectrum of a 沭 -type wafer showing a conductive silicon carbide sample. The reason for the absence of N-type substrates including thorium is that vanadium is absent from the amount spectrum. 'Figure 17 provides a comparison of the previous version of semi-insulated carbonized hair with compensated gadolinium. The chirped peak appears strongly at about 51 atomic mass units in the spectrum. This vanadium wave is clearly absent in Figures 15 and 16. : Of course, those familiar with these materials should understand that although the phrase "below the detectable amount" is a completely appropriate description of the present invention, it can also be understood to be equivalent to less than the electronic characteristics that will affect the carbonized broken crystals, And especially the resistivity. Therefore, another aspect of the present invention includes a semi-insulating carbon cut single crystal with a donor dopant, an acceptor dopant, and a timely defect. In this aspect of the present invention, 'the number of donor dopants in the silicon carbide crystal is greater than the number of body dopants (Na)' and the number of intrinsic dot defects in the carbides as the acceptor ( Nd |) is larger than the numerical difference between the number of these donor and acceptor dopants. Regarding this aspect, the concentrated production of transition elements and heavy metals is lower than the concentration that will affect the electrical properties of the carbide single crystal, and it is better than the second best. The resulting silicon carbide single crystal has a resistivity of at least 5,000 ohm-cm at room temperature, preferably at least 10,000 ohm-cm, and most preferably 50,000. This aspect of the invention is also applicable to the number of acceptor dopant atoms compared to the donor 554095 A7

摻雜劑原子之數目大的互補情 體之固有點瑕疵之數目較供體 之間的數值差大。 況。在此一愔、、F & 清况中’作為供 不純物及受I μ 又私不純物之數目 者或另一 點瑕疲的 劑原子的 換言之,淺η型及ρ型摻雜劑互相補償,其中一 者支配至特定的程度。經電活化之晶體中之固孝 數目較在晶體中較另一者佔優勢之η型或ρ型摻杂 淨量大。以方程式來描述,The number of dopant atoms with complementary dots has a larger number of inherent point defects than the number of donors. condition. In this case, F & in the clear state, 'as the donor atom and the number of impure impurities or another impure agent atom, in other words, the shallow η-type and ρ-type dopants compensate each other, where One dominates to a certain degree. The number of solid particles in the electro-activated crystal is larger than the net amount of n-type or p-type doping that is dominant in the crystal over the other. Described by equations,

Ndi > (Nd~Na) 其中供體較受體佔優勢,或Ndi > (Nd ~ Na) where the donor has an advantage over the acceptor, or

Ndl > (Na — Nd) 以摻雜 體型點 點瑕疵 其中受體較供體佔優勢。在第一種情況中,晶體將 劑原子為主的η型補償。然而,此等淨供體再次被受 瑕疵補償,而產生半絕緣晶體。在第二種情況中, 作為供體型,並補償晶體中之受體的淨過量。 此處所使用之術語「摻雜劑」係以廣義的方式使用;即 用於描述存在於晶格中,並提供額外電子(供體)或額外電 洞(叉體)之除矽(Si)或碳(〇外之原子。在本發明,摻雜劑 可被動或主動地存在;即術語「摻雜劑」既非暗示「換 雜」步驟亦非不存在其。 在一較佳具體實施例中,受體為硼。在此具體實施例 中,硼過度補償氮,及點瑕疵作為供體過度補償硼,而產 生半絕緣碳化矽晶體。作為受體之硼的行為係與先前的概 念相反,其中硼被視為係深捕捉元素(例如,共同受讓之美 國專利第5,270,554號的第8襴第49-51行)。事實上,蝴會在 -18- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 554095 五、發明説明(16 ) S i C中產生7 0 〇耄電子伏特的 , . ^ a 旧捕捉月匕階,但(至目前為止)並 非可如此再現。因此,右, _荆夕主p访山 本务明,經發現硼係說明於此之 類i之丰、、、巴、,彖蛟化矽的適當受體摻雜劑。 在此一較佳具體實施例中, 政石甘,曰 T石反化矽係在可使活性氮濃度 降至甚少I之硼(以約1Ε15 5之蝴較佳)將會使晶體成為ρ型之 值的條件下成長。經由批生丨4、 、 乜制成長條件,可使點瑕疵濃度達 到約5 Ε1 5 ’因此而過度補僧咖 枝' 度補仏硼,及產生半絕緣晶體。經由 降低氣》辰度’及相對補償棚夕曰. 了補彳貝爛之1,本發明可避免過渡金屬 支配及重度摻雜和補償之先前裎 尤則徒及的缺失。由於SiC之晶體 成長係相當複雜的程序’因而確切的參數可視局部或個別 的情況,諸如在適當範圍内所使用之特定溫度及使用設備 之特(·生而異 '然而,以此處之揭示為基礎,預期熟悉技藝 人士可成功地實行本發明,而無需過多的實驗。 預期可經由使碳化石夕照射中子、高能電子、或γ射線,以 產生期望數目之點瑕疵’在某種程度上控制點瑕疵之數 目,而獲致與以上記述之方程式一致的結果。 雖然很難測1點瑕疵的確切數目,但諸如電子順磁諧振 (EPR)、深能階暫態光譜術(DLTS)、及位置消滅光譜術之 技術可得到存在數目之最佳可得的指示。如進一步記述於 文中,霍耳效應測量亦證實晶體之期望特性。 在另一怨樣中,可將本發明併入至利用半絕緣碳化矽基 材之主動裝置,尤其係主動微波裝置中。如前所指及如熟 悉主動半導體微波裝置之人士所知曉,相對於當將載體限 制至微波裝置之特殊通道及其他功能部分的理想情況,可 -19- 本紙杀尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 554095 A7 ______B7 五、發明説明7 17 ) ' 利用於操作微波裝置之頻率會受载體與基材之任何交互作 用的顯著阻礙。 根據本發明之碳化矽半絕緣材料的性質係使其於適當裝 置中具有優異的性能特性。此等裝置包括,但不限於, MESFET、特定的MOSFET、及諸如說明於下列專利中之其 他裝置:本美國專利及申請中之申請案第5,27〇,554、 5,686,737、5,719,409、5,831,288號;1997 年 7 月 10 日提出申 請之序號08/891,221 ;及1998年5月21日提出申請之序號 09/082,5 54,兩篇之標題為「栓上自由功率11]^〇3雙極電晶 體(Latch-up Free Power UMOS Bipolar Transistor)」;1 997年 2月7日提出申請之序號08/797,536,r提高碳化矽功率電晶 體之最大電壓的結構(Structure for Increasing the Maximum Voltage of Silicon Carbide Power Transistors)」;1997年 2 月 7 曰提出申請之序號08/795,135,「降低功率電晶體之開啟電 阻的結構(Structure to Reduce the On-resistance of Power 丁 ransistors)」;及1998年6月23日提出申請之國際申請案第 ?0丁/1^98/13003號(指定美國),「寬能帶隙半導體中之功 率裝置(Power Devices in Wide Bandgap Semiconductors)」 ,將其全部之内容以引用的方式完全併入本文中。 實驗 在空軍研究實驗室(Dayton,〇hio)(Wright-Patterson Air Force Base),利用高溫霍耳效應及SIMS檢測半絕緣SiC之兩 晶圓。並無法由其中一晶圓得到可理解的結果(可能係由於 不令人滿意之歐姆接觸的結果),但來自第二晶圓之兩霍耳 -20- 本紙張尺度適用中國國家標準(CNS) A4规格(210X297公釐) 554095Ndl > (Na — Nd) Doped body point spot defects. The acceptor is more dominant than the donor. In the first case, the crystal compensates for the n-type dominated by agent atoms. However, these net donors were once again compensated for by defects, resulting in semi-insulating crystals. In the second case, it acts as a donor and compensates for the net excess of acceptors in the crystal. As used herein, the term "dopant" is used in a broad sense; it is used to describe silicon removal (Si) or silicon that is present in a crystal lattice and provides additional electrons (donors) or extra holes (forks). Atoms other than carbon (0). In the present invention, a dopant may exist passively or actively; that is, the term "dopant" neither implies the "doping" step nor does it exist. In a preferred embodiment The acceptor is boron. In this specific embodiment, the boron overcompensates nitrogen and the point defect as a donor overcompensates boron, resulting in semi-insulating silicon carbide crystals. The behavior of boron as an acceptor is contrary to previous concepts, Among them, boron is regarded as a deep capture element (for example, commonly assigned US Patent No. 5,270,554, line 8 to line 49-51). In fact, the national standard (CNS ) A4 size (210 X 297 mm) 554095 V. Description of the invention (16) 700 耄 耄 electron volts in SiC,. ^ A Old capture moon dagger, but (so far) it is not reproducible . So, right, _ Jing Xizhu p visited Shan Benming and found that boron It is described here as a suitable acceptor dopant for silicon, silicon, silicon, titanium, silicon, silicon, titanium, and silicon. In this preferred embodiment, Zheng Shigan, T Stone Reversed Silica is available in Boron that reduces the concentration of active nitrogen to very little I (preferably about 1E15 5 butterfly) will make the crystal grow under the condition of ρ-type value. Through batch production 4, 4, and 乜 make long conditions, can make the point The concentration of the defect reached about 5 Ε1 5 'therefore excessively supplementing monks and coffee branches' to supplement boron, and to produce semi-insulating crystals. By reducing the qi "Chen degree" and the relative compensation shed Xi Yue. The invention can avoid the loss of previous metal transitions dominated by heavy metal and doping and compensation. Since the crystal growth of SiC is a very complicated procedure, the exact parameters can be seen locally or individually, such as within a proper range. The specific temperature used and the characteristics of the equipment used (· generated differently 'However, based on the disclosure herein, it is expected that those skilled in the art can successfully practice the present invention without undue experimentation. It is expected that the carbonized stone can be irradiated Neutrons, high-energy electrons, or gamma rays In order to generate the desired number of point defects', the number of point defects is controlled to a certain extent, and the result is consistent with the equation described above. Although it is difficult to measure the exact number of 1 point defects, such as electronic paramagnetic resonance (EPR ), Deep-level transient spectroscopy (DLTS), and position extinction spectroscopy can obtain the best available indication of the number of existences. As further described in the text, the Hall effect measurement also confirms the desired properties of the crystal. In another complaint, the present invention can be incorporated into active devices using semi-insulating silicon carbide substrates, especially active microwave devices. As previously mentioned and as known to those familiar with active semiconductor microwave devices, as opposed to when Ideally, the carrier is limited to the special channel and other functional parts of the microwave device. The standard of this paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 554095 A7 ______B7 V. Description of the invention 7 17) '' The frequency used to operate a microwave device is significantly hindered by any interaction between the carrier and the substrate. The properties of the silicon carbide semi-insulating material according to the present invention are such that it has excellent performance characteristics in a suitable device. These devices include, but are not limited to, MESFETs, specific MOSFETs, and other devices such as those described in the following patents: Application Nos. 5,27〇, 554, 5,686,737, 5,719,409, 5,831,288 in this US patent and application No .; Serial No. 08/891, 221 filed on July 10, 1997; and Serial No. 09/082, 5 54 filed on May 21, 1998; the titles of the two articles are "Punching Free Power 11] ^ 〇 3 Latch-up Free Power UMOS Bipolar Transistor "; Structure No. 08 / 797,536 filed on February 7, 1997, r Structure for Increasing the Maximum Voltage of Silicon Carbide Power Transistors "; Application Serial No. 08 / 795,135 dated February 7, 1997," Structure to Reduce the On-resistance of Power Dransistors "; and 1998 International Application No. 0 丁 / 1 ^ 98/13003 (designated US) filed on June 23, 2010, "Power Devices in Wide Bandgap Semiconductors" , The entire contents of which are incorporated herein by reference. Experiments In the Air Force Research Laboratory (Dayton, Ohio) (Wright-Patterson Air Force Base), the high-temperature Hall effect and SIMS were used to detect two wafers of semi-insulating SiC. It is not possible to obtain intelligible results from one of the wafers (possibly due to unsatisfactory ohmic contact), but two Halls-20 from the second wafer-This paper size applies Chinese National Standards (CNS) A4 size (210X297 mm) 554095

樣品皆產生相同的結果,於該等結果中得到合理的可作 度。 兩晶圓在室溫下皆為絕緣。估 θ 、 G緣使可測量晶圓在高溫下熱活 化,並測量載體漢度,由於古、、田 、阿/皿所涉及的低移動率,因而 此在半絕緣材料中並非始終可杆 」仃。載體》辰度在1000K下係約 10 5/立方公分,其中電阻傘私认,Λ 电I且羊如約103歐姆-公分。此種載體 濃度較習知之半絕緣材料吱株诞力 叶^穋雜釩之材料在相同溫度下所 見者低約一至二個數量級。麸而 —^… 、 里久然而,無法進行η對1 /Τ曲線之 迴歸’因此仍無法得到活性a沾綠、曲 注層的總濃度。活化能係約1.1電 子伏特0 利用南解析度糸統於樣品上推并qta 進订SIMS。除了接近檢測極 限的一些銅與一些氫之外,並去&袞 卫禾銳察到其他物質,其係由 質量47波峰之高度推測得。因此,所曰 丁 u此,貝I 47波峰係歸因於The samples all produced the same results, and reasonable viability was obtained from these results. Both wafers are insulated at room temperature. Estimating the θ and G margins enables thermal activation of measurable wafers at high temperatures, and measurement of carrier carrier degrees. Due to the low mobility involved in ancient, Japanese, and Arabesque dishes, this is not always possible in semi-insulating materials. " Alas. The carrier "Chen degree" is about 10 5 / cm 3 at 1000K, of which the resistance umbrella is privately recognized, ΔI and sheep are about 103 ohm-cm. The concentration of this kind of carrier is about one to two orders of magnitude lower than that of the conventional semi-insulating material. Bran-^ ..., Lijiu However, it is not possible to perform a regression of the η vs. 1 / T curve ', so the total concentration of active a and green and curved injection layers cannot be obtained. The activation energy is about 1.1 electron volts. 0 Using the south resolution system, the sample is pushed up and qta is used to order the SIMS. Except for some copper and some hydrogen which are close to the detection limit, and other materials were detected by Wei Herui, it is estimated from the height of the mass 47 wave peak. Therefore, due to the fact that Ding u 47, the peak system of B 47 is attributed to

SiOH。分別將本發明之質|搞y I、/ η π 、 a & M里和^田以及兩比較樣品之掃描包 含為圖18-20。在圖19及20中鈦(Ti)明顯在約】χ 1〇丨6/立方 公分下,但其未出現於本發明之樣品中(圖18)。釩亦隨同 指示氫之SiOH線條出現於標準的半絕緣樣。。〇中(圖2〇)。 由此等結果’第-晶圓被認為係非常高純度的材料,且 由於任何的殘留釩不純物隨同組成U電子伏特能階之其他 瑕疵係以較淺不純物之總和大之濃度存在,且因此11電子 伏特能階補償淺不純物,因而其被視為係絕緣。費米 子伏m因此使材料成為^ 絕緣。若有之氫的存在可意謂發生氫補償,但預期其將 選擇性地補償或中和較淺的不純物,且非較深能階。〃 裝 訂 f -21 -SiOH. The scans of the properties of the present invention, y I, / η π, a & M and Y, and the two comparative samples are included in Figures 18-20, respectively. In Figs. 19 and 20, titanium (Ti) is apparently at about χ 10/10 / cm3, but it does not appear in the sample of the present invention (Fig. 18). Vanadium also appears in standard semi-insulating samples along with SiOH lines indicating hydrogen. . 〇 (Figure 20). From these results, the '-wafer is considered to be a very high-purity material, and since any remaining vanadium impurities are present along with other defects that make up the U-electron volt energy level, the concentration of the shallower impurities is greater, and therefore The electron volt level compensates for shallow impurities, so it is considered to be insulating. The fermion m therefore makes the material ^ insulating. The presence of hydrogen may mean that hydrogen compensation occurs, but it is expected that it will selectively compensate or neutralize the shallower impurities and not the deeper energy levels. 〃 Staple f -21-

554095 A7 B7 五、發明説明(19 ) 在圖式及說明書中,已揭示本發明之典型具體實施例, 雖然係使用特定的術語,但其僅係以概括及說明性的意義 使用,而非作限制用,本發明之範圍係記述於以下之申請 專利範圍中。 -22- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)554095 A7 B7 V. Description of the invention (19) In the drawings and description, typical specific embodiments of the present invention have been disclosed. Although specific terms are used, they are used only in a general and illustrative sense, not as For limited use, the scope of the invention is described in the following patent application scope. -22- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

5 55 5 圍範利 A BCD 1 · 一種半絕緣碳化;g夕單晶,包括: 及固 於該碳化石夕單晶中之供體摻雜劑、受體 有點瑕疵; 其中第-導電性類型之摻雜劑的數目較第 型之摻雜劑的數目大;及 > t f 用於補償支配性之第-類型摻雜劑之該碳化石夕晶體中 .之固有點瑕疲的數目較該第一類型摻雜劑超 型摻雜劑之數值差大;及 一卖員 過渡元素之濃度係低於1E16 ; 該碳切單晶在室溫下具有至少5()⑽歐姆_公分 率。 i 2. -種碳切之半絕緣塊狀單晶,其在室溫下1有至,卜 5_歐姆-公分之電阻率,及具有較會影響晶體二 性之量低之產生距價能或導電帶至少7 〇 〇毫電子 狀態之捕捉元素濃度。 符之 3·根據申請專利範圍第丨或2項之碳化 1X1。”/立方公分之氣原子濃度。早“具有低於 4. f據中請專利範圍第】或2項之碳切單晶,其中 度係低於1 X 1〇16/立方公分。 辰 5·根據申請專利範圍第i項之半絕緣碳化石夕晶體 , 第—類型摻雜劑係為供體,該第二類型推雜劑係為受X 體,及該固有點瑕疵係作為受體。 又 6.根據巾請專利範圍第5項之半絕緣碳切晶體, 受體包括硼。 “Yd -23- 裝 本紙張尺度通用宁國國家標準(CNS) Μ規格(21GX297公董) 554095 A8 B8Wei Fanli A BCD 1 · A semi-insulating carbonization; g evening single crystal, including: and the donor dopant and acceptor fixed in the carbonized stone evening single crystal are a bit defective; of which-the first conductivity type doping The number of dopants is greater than the number of dopants of the first type; and > tf is the number of inherent point defects in the carbonized carbide crystal of the first type of dopant used to compensate for dominance compared to the first type. The dopant has a large difference in the value of the super-type dopant; and the concentration of a salesman's transition element is less than 1E16; the carbon-cut single crystal has at least 5 () ⑽ohm_cm at room temperature. i 2.-A kind of carbon-cut semi-insulating bulk single crystal, which has a resistivity of 1 to 5 at room temperature, and a resistivity of 5 ohm-cm, and has a lower generation energy than the amount that will affect the duality of the crystal. Or the concentration of the capture element in the conductive band of at least 7000 millielectrons. Note 3. Carbonized 1X1 according to item 丨 or 2 of the scope of patent application. The gas atomic concentration of "/ cm3." "Earthly, it has a carbon-cut single crystal that is less than 4. f according to the patent claims, or 2 items, in which the degree is less than 1 X 1016 / cm3. Chen 5. According to the semi-insulating carbon carbide crystal of item i in the scope of the patent application, the first type dopant is the donor, the second type dopant is the acceptor X, and the inherent point defect is used as the acceptor. body. 6. According to the patent, the semi-insulating carbon cut crystal of item 5, the acceptor includes boron. "Yd -23- The size of this paper is General Ningguo National Standard (CNS) M specification (21GX297 public director) 554095 A8 B8 λ =申請專利範圍第1項之半絕緣碳化石夕晶體,其中該 第類型摻雜劑係為受體,該第二類型推雜劑係為供 體’及該固有點瑕疵係作為供體。 8·根據中請專利範圍第1或2項之碳化碎單晶,其中該碳化 矽之多型結構(p〇lytype)係選自由3C、4H、6H及15R多 型結構所組成之群。 9. 根據申請專利範圍第1或2項之碳化石夕單晶,其中該氮濃 度係5 X 1 〇 1 6/立方公分以下。 10. 根據申請專利範圍第1或2項之碳化矽單晶,其中該釩濃 度係低於可被第二離子質量光譜術(SIMS)檢測得之值。 U·根據申請專利範圍第1或2項之碳化石夕單晶,其中該釩濃 度係低於1 X 1〇丨4/立方公分。 12.根據申請專利範圍第1或2項之碳化矽單晶,其在室溫下 具有至少10,000歐姆·公分之電阻率。 13·根據申請專利範圍第1或2項之碳化矽單晶,其在室溫下 八有至少50, 〇〇〇歐姆-公分之電阻率。 14. 一種電晶體’其具有包括根據申請專利範圍第1或2項之 塊狀單晶之基材。 15·根據申請專利範圍第14項之電晶體,其係選自由下列所 組成之群··金屬-半導體場效電晶體、金屬-絕緣體場效 電晶體、及高電子移動率電晶體。 — _ - - 本紙張尺度適财國s家標準(CNS) A4規格(210 X 297公爱)λ = semi-insulating carbon carbide crystal of item 1 of the scope of patent application, wherein the first type of dopant is the acceptor, the second type of dopant is the donor 'and the intrinsic point defect is the donor. 8. The broken single crystal of carbide according to item 1 or 2 of the patent application, wherein the polytype structure of the silicon carbide is selected from the group consisting of 3C, 4H, 6H, and 15R polytype structures. 9. According to the scope of the patent application, item 1 or 2 of the carbonized eve single crystal, wherein the nitrogen concentration is 5 X 106 or less per cubic centimeter. 10. The silicon carbide single crystal according to item 1 or 2 of the patent application scope, wherein the vanadium concentration is lower than a value that can be detected by the second ion mass spectrometry (SIMS). U. The carbide single crystal according to item 1 or 2 of the scope of the patent application, wherein the vanadium concentration is lower than 1 × 10 4 / cm 3. 12. The silicon carbide single crystal according to item 1 or 2 of the patent application scope, which has a resistivity of at least 10,000 ohm · cm at room temperature. 13. The silicon carbide single crystal according to item 1 or 2 of the scope of the patent application, which has a resistivity of at least 50,000 ohm-cm at room temperature. 14. A transistor ' having a substrate comprising a bulk single crystal according to item 1 or 2 of the scope of the patent application. 15. The transistor according to item 14 of the scope of the patent application, which is selected from the group consisting of: metal-semiconductor field effect transistors, metal-insulator field effect transistors, and high electron mobility transistors. — _--This paper is compliant with China Standards (CNS) A4 specifications (210 X 297 public love) 裝 訂Binding line
TW91111200A 1999-05-18 2002-05-27 Semi-insulating silicon carbide without vanadium domination TW554095B (en)

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US09/866,129 US6396080B2 (en) 1999-05-18 2001-05-25 Semi-insulating silicon carbide without vanadium domination

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