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TW551790U - Securing device - Google Patents

Securing device

Info

Publication number
TW551790U
TW551790U TW091221594U TW91221594U TW551790U TW 551790 U TW551790 U TW 551790U TW 091221594 U TW091221594 U TW 091221594U TW 91221594 U TW91221594 U TW 91221594U TW 551790 U TW551790 U TW 551790U
Authority
TW
Taiwan
Prior art keywords
securing device
securing
Prior art date
Application number
TW091221594U
Other languages
English (en)
Inventor
Hsieh-Kun Lee
Wan-Lin Xia
Tao Li
Lei Li
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW091221594U priority Critical patent/TW551790U/zh
Priority to US10/648,117 priority patent/US6934153B2/en
Publication of TW551790U publication Critical patent/TW551790U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44034—Dissociable gripping members

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW091221594U 2002-12-31 2002-12-31 Securing device TW551790U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091221594U TW551790U (en) 2002-12-31 2002-12-31 Securing device
US10/648,117 US6934153B2 (en) 2002-12-31 2003-08-25 Heat sink assembly with fixing mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091221594U TW551790U (en) 2002-12-31 2002-12-31 Securing device

Publications (1)

Publication Number Publication Date
TW551790U true TW551790U (en) 2003-09-01

Family

ID=31493824

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091221594U TW551790U (en) 2002-12-31 2002-12-31 Securing device

Country Status (2)

Country Link
US (1) US6934153B2 (zh)
TW (1) TW551790U (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7123482B2 (en) * 2003-12-16 2006-10-17 Hewlett-Packard Development Company, L.P. Levers for support of heatsink component
CN2694487Y (zh) * 2004-03-17 2005-04-20 鸿富锦精密工业（深圳）有限公司 散热器扣合装置
CN2700943Y (zh) * 2004-04-24 2005-05-18 鸿富锦精密工业（深圳）有限公司 散热器扣具
JP2005315156A (ja) 2004-04-28 2005-11-10 Toshiba Corp ポンプおよびポンプを備える電子機器
JP4343032B2 (ja) * 2004-05-31 2009-10-14 株式会社東芝 冷却構造および投射型画像表示装置
CN2799931Y (zh) * 2004-12-03 2006-07-26 鸿富锦精密工业（深圳）有限公司 风扇固定装置
CN100390975C (zh) * 2005-06-10 2008-05-28 技嘉科技股份有限公司 一种导热块的固定结构
US7283361B2 (en) * 2005-06-24 2007-10-16 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US7324342B2 (en) * 2005-10-19 2008-01-29 Delphi Technologies, Inc. Electronics assembly and electronics package carrier therefor
US7277290B2 (en) * 2005-11-02 2007-10-02 Asia Vital Components Co., Ltd. Secure device for a heat dissipating component
TWI291092B (en) * 2005-11-18 2007-12-11 Ibm Method and apparatus for fastening heat exchanger
JP4172503B2 (ja) * 2006-06-15 2008-10-29 セイコーエプソン株式会社 冷却装置、およびプロジェクタ
US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
US7952262B2 (en) * 2006-09-30 2011-05-31 Ruud Lighting, Inc. Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules
US20090086491A1 (en) 2007-09-28 2009-04-02 Ruud Lighting, Inc. Aerodynamic LED Floodlight Fixture
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US7480146B2 (en) * 2007-03-26 2009-01-20 Newisys, Inc. Heat sink mounting systems and methods
TWM331866U (en) * 2007-10-19 2008-05-01 Cooler Master Co Ltd Heat conduction device
TWI342183B (en) * 2007-12-06 2011-05-11 Delta Electronics Inc Heat dissipation module and fastening structure thereof
US8939723B2 (en) * 2012-02-07 2015-01-27 Aic Inc. Combining assembly for fan fixing base
US10942509B2 (en) 2018-01-19 2021-03-09 Ge Aviation Systems Llc Heterogeneous processing in unmanned vehicles
US11029985B2 (en) 2018-01-19 2021-06-08 Ge Aviation Systems Llc Processor virtualization in unmanned vehicles
US10779444B2 (en) * 2018-01-19 2020-09-15 Ge Aviation Systems Llc Control boxes and system-on-module circuit boards for unmanned vehicles
EP3901734A1 (en) * 2020-04-21 2021-10-27 Dynatron Corporation Active heat-radiating structure attached to passive heat-radiating part

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6332251B1 (en) * 2000-03-23 2001-12-25 Adda Corp. Retaining device for a heat sink
US6450248B1 (en) * 2001-10-29 2002-09-17 Hoya Tech Co., Ltd. Heat sink retainer
US6449152B1 (en) * 2001-11-06 2002-09-10 Jen-Cheng Lin Device for pressing a heat sink tightly against a CPU and positioning a fan over the heat sink
US6525941B1 (en) * 2001-12-27 2003-02-25 Tai-Sol Electronics Co., Ltd. Heat dissipating device with a pressing member that is rotatable to urge a fan module toward a circuit board
TW534377U (en) * 2002-01-31 2003-05-21 Delta Electronics Inc Heat-dissipating assembly and its used securing device

Also Published As

Publication number Publication date
US6934153B2 (en) 2005-08-23
US20040125566A1 (en) 2004-07-01

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees