TW455826B - Radio frequency identification tag circuit chip having printed interconnection pads - Google Patents

Abstract

A radio frequency identification tag circuit chip (10) includes a circuit chip (11) having a surface (18) and at least one interconnection pad (12, 14) formed in the surface (18). A layer (24) of insulting material is deposited on the surface and about the at least one interconnection pad (12, 14), and a layer of conductive material (26) is deposited on the insulating material and coupling to the interconnection pad (12, 14).

Description

455826 V. Description of the invention (υ Scope of the invention The present invention relates to radio frequency identification marks and radio frequency identification circuit chips, including but not limited to radio frequency identification mark circuit chips with printed interconnection pads. BACKGROUND OF THE INVENTION '· RFID Identification Marks The radio frequency identification mark has a long-known name and has many uses. For example, radio frequency identification marks are often used to identify people at the entrance of automatic doors to protect security buildings and areas. Information stored on radio frequency identification marks can identify intended entry. People and members of the security building. A radio frequency identification tag system can easily provide information from radio frequency identification tags at short distances using radio frequency (RF) data transmission technology. Generally, users only hold or place the radio frequency identification tag on a The base station transmits a survey signal to the power supply circuit in the RFID tag. This circuit responds to the stimulus signal to communicate the stored data with the base station, and the station receives and decodes the information. Usually, the RFID tag has the ability to retain & gt Launch quality information-sufficient information to uniquely identify people, packages, equipment, etc .; Radio frequency identification tags can also receive and store information. In read / write applications, the base station can not only send excitation signals and receive responses from radio frequency identification tags, but also send data, or write signals to radio frequency identification tags. Radio frequency The identification mark receives the written signal, which may contain the data stored in the mark. Depending on the type of the written signal, the radio frequency identification mark responds to the stored data or receives an instruction. The base station and the radio frequency identification mark When coupling inductive or electrostatic signals between them, the marker must include at least one and often two antenna elements. A marker circuit chip and antenna are usually electrically coupled and connected to the _ marker substrate. The marker may include

45 582 6 V. Description of the invention (2) --- Additional components, such as resistors, capacitors and electrical or electrical devices, are electrically coupled to the marking circuit chip and / or antenna. # 统 标 益 设计 offers the conductive track on the substrate of the T′labeled circuit crystal #, and the component and the antenna are connected to the substrate and electrically coupled to the conductive track. Wire bonding is a common technique 'to provide electrical coupling between interconnect pads and / or components and conductive tracks on a marked circuit wafer. Alternatively, " inverted " chip mounting technology provides a raised conductive area (relief pad) on a marked circuit wafer (similar to a panel assembly). Flip-chips are inverted and located on the wafer during assembly, are aligned with the cushions, and are electrically coupled to the conductive tracks. A conductive adhesive can be used between the bump pad and the conductive track to ensure a good electrical coupling D, and to provide a mechanical bond between the marked circuit chip and the substrate. 2. I understand that * larger interconnect welds on standard circuit chips can provide more area to couple the labeled circuit chip to the conductive tracks. In addition, larger interconnect pads on the marker circuit wafer allow the marker circuit wafer to be easily aligned with the conductive tracks. But larger interconnect soldering heat is quite expensive. For example, the use of light-shielding 'electroplating (with or without electrodes) and similar metallization techniques to form larger interconnect pads may cost between $ 50- $ 150 per wafer. Equal to 2-5 cents per marked circuit chip when separated from the wafer. In many radio frequency identification tag applications, the radio frequency identification tag is designed for simple use and disposable devices. For example, in electronic object surveillance applications, radio frequency identification tags are attached and retained on each tracked item. Hundreds of thousands of items use electronic object tracking technology in stores ’department stores and warehouses. It has also been suggested to use RFID tagging technology for mail or parcel delivery tracking applications. The US Postal Service alone handles more than 600 million mail items every four.

Page 5 455826 V. Description of the Invention (3) Although the minimum estimate of each RFID circuit chip is about 2 cents, it is not cost-effective to increase the size of interconnect pads using known plating techniques. Therefore, there is a need for an improved radio frequency identification tag circuit; -,. Brief description of the drawings 圊 1 is a perspective view of the three-dimensional assembly of a radio frequency identification marking circuit chip, which is one of the preferred embodiments of the present invention. Figure 2 is a plan view of the radio frequency identification tag circuit chip shown in Figure 1. FIG. 3 is a cross-sectional view taken from line 3 ** 3 of FIG. 2. Fig. 4 is a plan view of a radio frequency identification mark incorporated in the radio frequency identification mark circuit chip of the preferred embodiment of the present invention. FIG. 5 is a cross-sectional view taken from line 5-5 of FIG. 4. FIG. FIG. 6 is a plan view of a portion of a radio frequency identification mark incorporated in a radio frequency identification mark circuit crystal of another preferred embodiment of the present invention. FIG. 7 is a cross-sectional view taken from line 7-7 of FIG. 6. FIG. FIG. 8 is a cross-sectional view similar to FIG. 7 and illustrates a part of a radio frequency identification mark according to another preferred embodiment of the present invention. Detailed description of the preferred specific examples According to the preferred specific examples of the present invention, and with reference to FIG. 1, FIG. 2 and FIG. Made from Ichimori wafer. The formation of the circuit wafer 11 further includes at least one interconnect pad, and the first interconnect pad 12 and the second interconnect pad 14 are shown in the figure. The first interconnect pad 12 and the second woolen pad 14 are on the same surface as the surface 18

4 5 5 8 2 6 V. Description of the invention (4) ';'------ Surface formation. I understand that the first interconnect pad is trapped in the surface 18 or the bump 12 and the second interconnect pad 14 are within the range "2, which is contrary to the scope of the present invention. The direction of the electrical surface 22 is perpendicular to the surface 2 = the first and second side surfaces 20 and the second side ', and the Naiming surface 18, as shown in the figure. κ Continuing to refer to FIG. 1, FIG. 2, and 囷 3, a first 18, on the first interconnect pad 12 and the 枓 layer 24 are deposited on the surface 24 and the first holes 陏 21 and 坌 χ a mutual & All around. That is, the layer -L = the pores 2 and 3 surround the -interconnect solder joints respectively; in the second way, the layer 24 substantially covers the surface 18 "can be formed as a separate layer and is exposed at the solder 14" layer. The printing layer, screen, mimeograph, pad transfer or similar non-layer 24 should preferably be formed of a material selected from non-conductive polymers, inks or non-conductive adhesives. Conductive layer conductive material, first layer of conductive material ⑸ and η enter the pore 21, and consume to the first interconnect Tan 塾] Department: Extend the layer 24 to the full length of the circuit chip. Similarly, the layer 28 延 also extends: into the pore 23 1 and Combined to the second interconnect Tan 1 [the second layer 26. = layer 24 'to actually extend the circuit crystal moon ^ all good, the materials forming the layer 26 and layer 28 should be selected from the group consisting of conductive ink, material and conductive Transfer agent ... 1 using camping, mimeographing, welding and finishing = similar printing techniques to print and deposit on layer 24. Those skilled in this art will understand that virtually any precise printing technique can be used, and there is no scope of 4 I also understand that the size of '24 only needs to be guaranteed

# 7 页 4 5 582 6 V. Description of the invention (5) The first layer 2 6 and the second layer 2 8 can be insulated from the circuit chip 1 1. I should understand-for some applications, the insulating layer 24 is not needed, so it can be omitted in these applications. At least one insulating layer is discussed in each preferred embodiment. The insulating layer preferably provides at least two advantages. First, the insulating layer 2 4 makes the first layer 26 and the second layer .2 8 rise to isolate the circuit chip 1 1 so as to minimize the capacitive coupling therebetween. Secondly, the insulating layer 24 can provide an additional obstacle to minimize the chance of the first layer 26 or the second layer 28 being short-circuited with the circuit chip 11. The first layer 26 and the second layer 28 define at least one printed interconnection on the circuit wafer 11; tp 塾 'corresponds to the first printed interconnection pad and the second printed interconnection pad, respectively. In addition, the first layer 26 and the second layer clock together constitute an interconnect pad that is larger than the interconnect pad 12 and the interconnect Tan 14 on the circuit chip 丨 for coupling to the RFID tag antenna. The invention is intended to achieve an increase in interconnect pad area greater than 2 0: 丨 Estimated interconnect pad-area increase can be obtained at less than 1 cent per circuit chip. Referring to Figs. 4 and 5 ', the RFID tag 100 includes a base body 30 and an antenna 32 formed on a surface 34. As shown, the 'antenna 32 includes a first antenna element including a first coupling region 38 and a second antenna element 40 including a second coupling region 42. I understand that the * antenna 32 can be formed by the coil antennas of the first and second wires without departing from the scope of the present invention. The radio frequency identification tag circuit chip 24 is fixed on the surface 34 and is located between the first coupling region 38 and the second coupling region 42. As shown in Figure 5, the first layer 26 is coupled to the first coupling region 38 via the conductive material layer 44 * Similarly, the second layer 28 is coupled to the second coupling via the Mann material layer 46

45582 6 V. Description of invention (6) Joint area 42. _ · As mentioned above, since the first layer and the second layer are formed by using printing technology, each layer can be substantially more expensive than forming an enlarged metal interconnection pad on the circuit wafer 11 by using light shielding 'plating and the like. I believe that the first layer 26 and the second layer 28 can be formed at a cost of less than 1 cent per circuit chip. Therefore, a substantial increase in the area of the interconnect pads can be obtained, and the cost is reduced compared to the scaled-up metal pads formed using existing technology. Figures 6 and 7 show another preferred RFID tag circuit chip 1 1 0, which is related to a part of a RFID tag 1 02. The radio frequency identification mark 1 0 2 and the radio frequency identification mark 1 0 0 have a similar structure and include an antenna formed on the substrate 104. The antenna includes one or more antenna antennas, as shown in the figure, and further includes a first turning region 106 and a second coupling region 108. The radio frequency identification marking circuit chip 110 is fixed on the base body 104, and is between the coupling region 106 and the coupling region 108. The radio frequency identification circuit chip 110 includes a circuit chip 111, which includes a first interconnect pad 112 and a second interconnect pad 114 on the surface 118. The circuit wafer 111 further includes a first side surface 120 and a second side surface 1 2 2, which are arranged substantially perpendicular to the surface 118. The first insulating layer 124 includes a hole 125 formed on the circuit wafer ill to surround the first interconnection pad 112. The first insulating layer 1 24 extends across the surface 1 1 8 and downwards through the first side surface 120 to substantially the entire length of the circuit chip 111. In the same way, a second insulating layer 1 2 6 including a hole 127 surrounding the second interconnection pad 114 is formed on the radio frequency identification mark circuit jU0. The second insulating layer 126 extends across the surface 118 and downward through the ~~ side surface 1 2 2 ′, which is substantially the entire length of the circuit wafer 1 1 1. The first layer 128 of conductive material and the second layer 13 of conductive material are each on each

455826 V. Description of the invention (7) The first insulating layer 124 and the second insulating layer 126 are formed. The first layer 128 includes a portion 1 2 9- extending through the aperture 1 2 5 and coupled to the first interconnect pad 丨 丨 2. The first layer 128 also includes a portion 132 covering the ground-insulating layer 124 on the surface 128 and a portion 134 extending across the first side surface 120. The second layer i3Q includes a portion 131 extending through the aperture 27 and coupled to the second interconnect pad 14. The second layer includes a portion 136 covering the second insulating layer 126 on the surface 118, and a portion 138 extends the second side surface 1 2 2. It can be clearly seen in FIG. 7 that after the radio frequency identification marking circuit wafer 110 is fixed on the substrate 104, the portions 134 and 138 are aligned adjacent to the first coupling region 106 and the second coupling region 108, respectively. The conductive material layer 140 and the conductive material layer 142 are deposited by printing, and respectively couple a portion 4 to the first coupling region 106 and a portion 138 is lightly closed to the second coupling region 108. In this way, the radio frequency identification tag circuit crystal> 1110 is effectively coupled to the antenna on the substrate 104. Referring to FIG. 8, there is shown a radio frequency identification tag 'circuit chip 1 10' that is coupled to a substrate 204 of another preferred embodiment of the present invention. The base body 204 includes a surface 206 on which an antenna (not shown) is formed. The formation of the substrate 204 includes a recessed 208 'radio frequency identification circuit chip which is fixed therein. The antenna includes a first coupling region 210 and a second coupling region 212. Each of the first coupling region 210 and the second coupling region 212 extends into the recess 208 and adjacent portions 134 and 138. The channel 214 and the channel 2 16 are then established between the portion 134 and the first coupling region 2 10 and between the portion 1 38 and the second coupling region 2 12 respectively. A conductive material layer 218 and a conductive material layer 220 are deposited into the channel 214 and the channel 216, respectively. The layer 218 couples the portion 134 to the first coupling region 210, and the layer 220 couples the portion 138 to the second coupling region 212. Preferred conductive materials include conductive oil

O: \ 60 \ 60346.PTD Page 10 455826 V. Description of the invention (8) Ink 'conductive polymer and a group of adhesive materials. In addition to the light conductive RFID tag circuit chip 110 to the antenna, the conductive adhesive can also provide the advantage of increased mechanical stress to keep the RFID tag circuit chip 110 in the recess 208. The recess 208 preferably has a depth. The radio frequency identification tag circuit can be disposed below the surface 20-6. Therefore, the radio frequency identification tag circuit chip 110 is not separated from the base body 204. The recess 208 can also eliminate or reduce the protrusions caused by the circuit wafer of the cover layer, and can reduce the stress in the subsequent stacking process. The recess 208 is preferably formed by local compression of the base body 204. Such a locally compressed portion can be formed by stamping or casting. The recess 2 08 can be formed by a sheet fixed on the base body 204. 'The formed wafer contains a void β. In summary' and referring to FIG. 1, FIG. 2 and FIG. 3, an RFID circuit chip 10 includes a surface U And at least one interconnect pad 12 and a circuit chip u forming the interconnect pad 14 on the surface 18. An insulating material layer 24 is deposited on the surface and adjacent to at least one interconnect pad, and a conductive material layer 26 is deposited on the insulating material and bonded to the interconnect pad. Referring to FIGS. 4 and 5, the radio frequency identification mark 100 includes a radio frequency identification mark circuit chip 10 fixed on a base 30, and the formation of the base 30 includes an antenna 32, and the formation of the radio frequency identification circuit chip 100 includes at least printing. Interconnect solder_ pad. This printed interconnection pad is a layer of conductive material 2 β, 2 8 'printed deposited on the surface 18 of the circuit wafer 11 and is coupled to the interconnection pads 12, 14 formed in the surface 18 and coupled to the antenna 32. Referring to FIGS. 6 and 7, the radio frequency identification mark} 〇2 includes a radio frequency identification mark circuit chip 丨 丨 0 fixed on the substrate i 〇4. After the base body 104 is formed, it includes an antenna, and the shape of the radio frequency identification tag circuit chip 1 1 10 includes at least-printed interconnections.

4 5 582 6 V. Description of the invention (9) Solder pad. This interconnect pad is a layer of conductive material 1 28, 130, printed and deposited on the surfaces 118, 120, 122 of the circuit wafer 1-41, and is coupled to an interconnect pad formed on the circuit wafer Π1. 112, 114. This printed interconnect pad is dissipated to the antenna. '' Reference 圊 8. The radio frequency identification mark 2 0 2 covers the radio frequency identification mark circuit chip 1 1 0 formed in the recess 2 0 8 formed in the base body 2 0 4. The formation of the base body 2 0 4 includes an antenna, and the formation of the radio frequency identification marking circuit 1 10 includes at least-printed interconnect pads. This printed interconnect '· pad is a conductive material layer 128, 1 3 0, which is printed and deposited on the surface 1 1 8 1 2 0, 1 2 2 of the circuit wafer 11 1 and is coupled to the circuit wafer 11 Interconnect pads 112, 114. The printed interconnect pads are coupled to the antenna. 2. The printed interconnect pads can provide a substantially larger coupling area for RFID tags. Using printing technology and conductive inks, conductive polymers or conductive adhesives can significantly increase the area of interconnect pads without increasing the cost of circuit chips. In contrast, a printed interconnect pad formed in accordance with a preferred embodiment of the present invention can be formed at a cost of less than one cent per circuit wafer. Larger printed interconnect pads can also simplify manufacturing methods compared to metallized pads produced by known technologies. Larger pads are easier to align with antenna elements formed on the base material. Many additional changes and modifications are possible without departing from the scope and spirit of the invention. The scope of some changes has been discussed above. Other scopes will become clearer from the scope of the attached patent application.

Page 12

Claims (1)

455826 VI. Application for Patent Scope 1. A radio frequency identification mark circuit chip includes: a circuit crystal chip having a surface and at least one interconnect pad formed on the surface: and—a layer of conductive material is substantially more solderable than at least one interconnect The pad is large, and is deposited on the surface and is coupled to at least: an interconnect pad. ί 2. For example, the radio frequency identification marking circuit chip of the scope of patent application No. 1 still contains an insulating material layer, which is deposited between the surface and the conductive material layer. 3. For the radio frequency identification marking circuit chip of item 2 of the patent application scope, wherein the conductive layer is printed on the insulating material layer. 4. For the radio frequency identification marking circuit crystal moon in the second patent application scope, the insulating material layer includes one of a non-conductive polymer, a non-conductive ink, and a non-conductive adhesive. 5. For the radio frequency identification mark circuit chip of the second patent application range, the insulating material layer is printed on the surface, and the conductive material layer is printed on the insulating material layer. 6. For the radio frequency identification marking circuit crystal of item 1 of the patent application scope, wherein the conductive material includes conductive ink, conductive polymer and conductive adhesive--. 7. If the radio frequency identification marking circuit crystal moon of item 1 of the patent application scope, the surface thereof also includes one side surface of the circuit chip. 8. If the radio frequency identification tag circuit crystal moon of item 1 of the patent application scope, wherein the circuit chip is fixed on the substrate > The formation of the substrate includes an antenna, and the antenna is coupled to the conductive material layer. 9. If the application of the scope of the patent No. 8 shooting | identifying the circuit chip, Page 13 45582 S VI. Scope of patent application Contains a conductive adhesive to couple conductive materials to the antenna. -1 0.-A radio frequency identification tag circuit chip includes: a circuit chip having a first interconnection pad and a second interconnection pad; an insulating material layer disposed on a surface of the circuit wafer, and the formation of the insulation chip '' The edge material layer includes first pores and second pores. The first pores and the second pores can expose the first interconnect pads and the second interconnect pads through the insulating material layer. ΤΤγ · * Road) One conductive material And a second conductive material layer is disposed on the insulating material layer and is coupled to the second interconnection pad. 2 1 1. If you apply, the radio frequency identification mark circuit chip of item 10 of the patent scope, wherein the insulating material layer is printed on the surface. 1 2. The radio frequency identification tag circuit crystal according to item 10 of the patent application, wherein the first conductive material layer and the second conductive material layer are printed on the insulating material layer. 1 3. According to the patent application scope of item 10 of the RFID circuit, the surface also includes the first side surface and the second side surface. 14. The radio frequency identification mark circuit chip according to item 13 of the patent application, wherein the insulating material layer includes a first insulating material layer disposed on the first side surface, and a second insulating material layer disposed on the second side surface. . 1 5. The radio frequency identification marking circuit crystal moon according to item 14 of the scope of patent application, wherein the first conductive material layer is disposed on the first insulating material layer and the second conductive material layer is disposed on the second and second insulating material layer 4. Page M 45 5B2 6 6. Scope of patent application 1 6. If the radio frequency identification mark circuit chip of item 10 of the patent application scope, the conductive material includes conductive ink, conductive polymer and conductive adhesive--. 1 7. The radio frequency identification marking circuit chip according to item 10 of the patent application scope, wherein the insulating material contains one of a non-conductive polymer, a non-conductive ink, and a non-conductive adhesive. 1 8. The radio frequency identification tag circuit chip according to item 10 of the patent application scope, wherein the circuit chip is fixed on the substrate: the substrate is formed to include an antenna having a first coupling region and a second coupling region, and the first conductive material layer is coupled To the first coupling region, the second conductive material layer is coupled to the second coupling region. 19, if the patent application scope of item 18 = radio frequency identification marking circuit; the sheet still contains a conductive adhesive to couple the first conductive material layer and the second conductive material layer. 2 0. — A type of radio frequency identification mark includes :: a base body including an antenna formed on the surface thereof; and — a radio frequency identification mark circuit chip fixed on the base body, and at least one printed interconnection pad formed on the radio frequency identification mark circuit chip. , And at least one printed interconnection pad coupled with the radio frequency identification marking circuit to the antenna β 2 1. The RF identification mark of item 20 in the patent application scope, wherein at least one printed interconnection pad includes a conductive material layer printed An interconnect pad is formed on one surface of the circuit crystal and is coupled to the substrate. 2 2. The radio frequency identification mark according to item 21 of the patent application scope, wherein at least one printed interconnection pad includes an insulating material layer disposed between the conductive material layer and the surface. - Page 15 45 582 6 6. Scope of patent application 2 3. If the radio frequency identification mark of item 22 of the patent application scope, the insulating material is printed on the surface. 2 4. The RF identification mark according to item 21 of the patent application scope, wherein the conductive material contains one of conductive ink, conductive polymer and conductive adhesive. ‘F 2 5 • If you apply for the radio frequency identification mark of item 21 of the patent, the surface also includes the side surface of the circuit chip. 2 6 · If the radio frequency identification mark in item 21 of the patent application scope, it still contains a layer of conductive material coupled to at least one printed interconnection pad and antenna. 2 7. The RF identification mark according to item 20 of the scope of patent application, wherein the base body includes a C0 gap, and the radio frequency identification mark circuit crystal >! is disposed in the recess. 0.2, a kind of radio frequency identification The mark includes: a base body, the base body including a recess formed on the surface and an antenna formed on the surface; and-the radio frequency identification mark circuit chip is arranged in the recess and fixed on the base body, and the radio frequency identification mark circuit chip is at least Formed with a printed interconnection pad, wherein at least one printed interconnection pad couples the RFID circuit chip to the antenna. 2 9. The radio frequency identification mark according to item 28 of the scope of patent application, wherein at least-the printed interconnection pad contains a layer of conductive material printed on the surface of the circuit chip, and is coupled to an interconnection pad formed on the surface . 30 · If the RFI mark of item 29 of the patent application scope, at least one printed interconnection pad includes an insulating material layer and is disposed between the conductive material layer and the surface. Page 16 455826 VI. Scope of Patent Application 3 1. For the radio frequency identification mark No. 30 of the scope of patent application, the insulating layer is printed on the surface. 3 2. The radio frequency identification mark according to item 29 of the patent application scope, wherein the conductive layer contains one of conductive ink, conductive polymer and conductive adhesive. ~ .3 3. If the radio frequency identification mark of item 29 of the patent application scope, the surface of which contains the side surface of the circuit chip. 3 4. If the radio frequency identification mark of item 29 of the patent application scope includes a conductive material layer coupled to at least one printed interconnection pad and antenna. 3 5. The radio frequency identification mark according to item 28 of the patent application scope, wherein the recess contains the local compressed part of the substrate. 36. The gradual frequency identification mark according to item 28 of the scope of patent application, wherein the recess contains a pore formed in a thin laminated sheet fixed on the substrate.