TW432093B - Rheology-modified substantially gel-free thermoplastic elastomer composition and its process for preparation and use - Google Patents
Rheology-modified substantially gel-free thermoplastic elastomer composition and its process for preparation and use Download PDFInfo
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- TW432093B TW432093B TW087101119A TW87101119A TW432093B TW 432093 B TW432093 B TW 432093B TW 087101119 A TW087101119 A TW 087101119A TW 87101119 A TW87101119 A TW 87101119A TW 432093 B TW432093 B TW 432093B
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- 238000000034 method Methods 0.000 title abstract description 5
- 239000000203 mixture Substances 0.000 title abstract 7
- 229920002725 thermoplastic elastomer Polymers 0.000 title 1
- 238000004891 communication Methods 0.000 claims description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims 1
- 229910052744 lithium Inorganic materials 0.000 claims 1
- 238000012986 modification Methods 0.000 abstract 2
- 230000004048 modification Effects 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 abstract 1
- 239000004743 Polypropylene Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000155 melt Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 150000002978 peroxides Chemical class 0.000 abstract 1
- 230000000704 physical effect Effects 0.000 abstract 1
- 229920002959 polymer blend Polymers 0.000 abstract 1
- -1 polypropylene Polymers 0.000 abstract 1
- 229920001155 polypropylene Polymers 0.000 abstract 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 abstract 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 abstract 1
- 238000000518 rheometry Methods 0.000 abstract 1
- 239000004711 α-olefin Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 230000009182 swimming Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Ethene-propene or ethene-propene-diene copolymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/04—Thermoplastic elastomer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- User Interface Of Digital Computer (AREA)
Description
M432093 五、新型說明: 【新型所屬之技術領域】 本創作係關於一種電子系統之控制裝置,特別是一種 利用觸控感測技術控制電子系統開機並且進入相對應操作 介面的電子系統之控制裝置。 【先前技術】 近年來觸控感應之相關技術大幅提升,且在使用上具 有極大的便利性,因此各式各樣的觸控感應技術已被廣泛 的應用於各種不同的電子產品中。 目前多數的電腦系統都是利用電腦主機上的按鍵式電 源開關來開啟或者關閉電腦,當使用者想要開啟電腦時, 會按壓電腦主機上的按鍵式電源開關,以啟動電腦的作業 系統,進入作業系統内所設定的鎖碼功能,再由使用者輸 入預先設定的密碼以順利開啟電腦,讓電腦系統正常的運 作,然而按鍵式電源開關的造型因為侷限於機械式開關的 構造而受到一定的限制,而且使用者必須透過鍵盤才能輸 入猎碼,在電細系統的使用上會受到需搭配鍵盤使用的限 制。
因此如何设計出一種新型態的電腦開機方式,利用逐 漸成熟的觸控感測技術來達成電腦開機以及解鎖的動作。 兼具符合造型美觀、㈣者#作簡便以及直觀的使用U 4 M432093 來控制電腦系統’即為廣大消費大眾所期望,而成為電子 系統之控制裝置發展及應用上的重要課題。 【新型内容】 目的 本創作之目的在於提供一種電子系統之控制襄置,其 可以利用電子t統搭载的觸控面板,透過觸控_技術達 成控制電子系統開機、解鎖並且進入相對應之操作介面的 創作提供一種電子系統之控制裝置,包含有一顯示 模組、-感測模組、-比對模組以及—控制模組。顯示模 址用以顯示一第一操作圖樣以及至少—第二操作圖樣。感 測模組耦接於顯示模組,用以感 』忧用者相對應該第一操 作圖樣以及該至少-第二操作圖樣所執行之—第一操作以 及至少-第二操作。比對模組輕接於該感測模組,用以比 對該第一操作是否符合一第一 〇 弟預5又條件以及該至少一第二 操作是否符合至少一第二預設條# 亚且刀別產生相對應 之一第一比對結果及至少一第二 ^ τ、、、°果。控制模組耦接 ;該比對模組,用以根據該第一 布耵、、,σ果控制該顯示模組 並且根據該至少一第二比對社杲 訂、0果控制—電子系統;其中若 該第一比對結果為該第一操作 铞忭付D该第一預設條件時,該 控制模組係控制續+指^ 4 _ ⑽不模組顯不該至少-第二操作圖樣, 若該至少一第二比對結果 乐一刼作符合該至少 5 -第二預設條件時’該控制模組則控制該電子系統開啟並 +進入相對應的操作介面。 【實施方式】 請參閱第1圖及第2圖,第i圖為本創作之電子系統 之控制裝置之-實施例之示意圖。第2圖為本創作之電子 系統之控制裳置的顯示裝置之一實施例之示意圖。如第】 圖及第2圖所示’本創作為一種電子系統ι〇之控制裝置 2〇 ’、其包含有—顯示模組22 一感測模組24、-比對模組 26以及一控制模組28。顯示模組22用以顯示一第一操作 β以及至)一第二操作圖樣223。感測模組24耦接 於顯示模'组22,用以感測使用者相對應該第-操作圖樣 221以及該至少—第二操作圖樣⑵所執行之-第一操作 以及至少-第二操作。比對模組26輕接於感測模組仏 用:比對第一操作是否符合一第一預設條件以及至少一第 操作疋否符合至少一第二預設條件’並且分別產生相對 應之—第—比對結果C1及至少_第二比對結果^。控制 模組28㈣於—26,心㈣第—比對結果C1控 制顯不模組22並且根據至少-第二比對結果C2控制電子 、,0’其中右第一比對結果C1為第一操作符合第一預 設條件時,控制模組28係控制顯示模組22顯示至少一第 二知作圖樣223’而若至少一第二比對結果。為至少一第 M432093 :操作符合至少-第:預設條件時,控制模組μ則控制該 電子系統1 〇開啟並且進入相對應的操作介面。 於一實施例中,本創作之電子系統1〇之控制裝置 的作動方式如下,當感測模組24感測到使用者的觸碰時, 顯不模組22會先顯示第一操作圖樣22卜接著感測模組μ 感測使用者相對應第一操作圖樣221所執行之—第一操 作。比對模組26比對第一操作是否符合第一預設條件,產 生相對應之第-比對結果C1。若第一比對結果^為第一 操作符合第—預設條件時,控制模組28會控制顯示模組 22顯示至少一第二操作圖樣223,M,則不會顯示至少 —第二操作圖樣223,而重新進行偵測。當顯示模組22顯 示至少一第二操作圖樣223時’感測模組24會接著感測使 用者相對應該至少一第二操作圖樣2U所執行之至少一第 二操作。比對模組26再比對至少一第二操作是否符合至少 一第二預設條件,產生相對應之至少一第二比對結果C2。 右至少一第二比對結果C2為至少一第二操作符合至少一 第二預設條件所包含之一第二第一預設條件肖,控制模組 28會控制電子系統1〇開啟並且進入一第一操作介面,當 至少一第二比對結果C2為至少一第二操作符合至少一第 二預設條件所包含之一第二第二預設條件時,控制模組28 則會控制電子系統10開啟並且進入一第二操作介面,若 7 M432093 否,感測模組24會重新感測使用者於感測模組 作’再重新比對該操作是否符合該些第二預設條件。 於一實施例中,感測模組24為一電阻式觸控面板、 -電容式觸控面板、—電磁式觸控面板、—光學式觸控面 板或者一表面聲波式觸控面板。而電子系統10則為一桌上 型電腦、一筆記型電腦、一平板電腦或者一智慧型手機。 第一預設條件為透過第一操作圖樣221執行一預定手 勢。至少-第二預設條件為透過該至少_第二操作圖樣⑵ 執打至少一預定手勢,其中第一預設條件以及第二預設條 件之預定手勢可由使用者自行設定。於—實施例中,第一 操作圖樣221包含有至少一文字或者至少一數字,該第一 預設條件係透過第—操作_ 221進行至少—預定密瑪的 輸入。於另一實施例中’至少一第二操作圖樣加為包含 有至少一文字或者至少一數字的圖樣,至少一第二操作圖 樣223係如同一般電腦鍵盤上的數字鍵區塊包含有〇〜9等 數予’而至少-第二預設條件係由使用者透過顯示模組22 上所顯示之至少-第二操作圖樣223進行至少—預定密碼 的輸入同-般密碼輸入的方式。於-實施例中,至少 -第二預設條件包含有多組預定密碼,每組預定密竭相對 應為-個使用者的操作介面,當使用者根據該至少—第二 8 操作圓樣22.3輪人棼人μ .+· # z 碼8#,械 、°上述夕·.且預設密碼尹的其申—組密 ·.’工制模組28即會控制電子系 ^ ύ ^ 间啟,並且進入 二^所相對應的使用者操作介面。其_顯示模組_ 二第:圖樣—據控制 第择I 223,換句話說,當比對模組%比對 第-#作付合第一預設條件時’才會再顯示至少一第二操 作圖樣223供使用者進行第 ” A ^ 丹甲第一刼作即為一 般“的密碼解鎖操作,在此不再費述。而第一操作圖樣 221以及至少—第二操作㈣223所顯現出來的形狀或者 樣式並不以第2圖所示的樣態為限,其可由使用者依據使 用上的需求自行設定 “閱第3圖’第3圖為本創作之電子系統之控制裝 例之示思圖。於一實施例中,控制裝置2〇包含 的全部元件可設置在電子系統1〇内,如同目前市面上常見 的-體成型電腦(—)4〇,如第3圖所示。請參閱 第1圖至第3圖’以下說明本創作之電子系統⑺之控制裝 置20的運作方式’其中電子系統10為--體成型電腦40, 第一預①條件為對第—操作®樣221執行-滑動手勢、至 丨’ 預°又條件為使用者預先設定多組密碼,當使用者 欲進行開機時’則透過第二操作圖樣223輸入該多組預先 設疋的狁碼其中之一。首先當使用者欲開啟一體成型電腦 M432093
40時’顯示模組22會顯示第1作圖請。接著使用者 可以根據第-操作圖樣221執行—滑動手勢。當感測模组 24感測到滑動手勢並且交由比對模組26與第—預設停件 預設之滑動手勢比對無誤時,控制模組28會控制顯示模組 22顯不至少-第二操作圖#如(複數個數字),供使用者 進行符合第二預設條件之密碼輪人,若比對模組%判斷與 第二預設條件預設的多組密碼其中的一組密碼—致時,控 制模組28即會將-體成型電腦40開啟並且進入該組預: 密碼相對應的操作介面’完成整個一體成型電腦4〇的開: 及解鎖動作。除第3圖所示之一體成型電腦4〇外,本創作 之控制裝置20亦可設置在不同種類的電腦主機5〇、⑼、 7〇、80上,藉由設置在電腦主機5〇、6〇、7〇、8〇上的控 制裝置20來控制電腦’如同第4A圖至第4D圖所示,第 4A圖至第4D圖為本創作之電子系統之控制裝置設置在電 腦主機上之各個實施例之示意圖。其中第4A圖至第4d圖 僅顯示控制裝置20的顯示模組22以及第一操作圖樣221 以及至少一第二操作圖樣223,控制裝置2〇所包含之其他 的元件係δ又置於電腦主機5〇、6〇、70、80内,圖未示。 請參閱第1圖、第2圖及第5圖,第5圖為本創作之 電子系統之控制裝置之另一實施例之示意圖。於一實施例 中顯不模組22及感測模組24係設置在獨立於電子系統】〇 10
外之一個機構内’而比對桓細9 K L 卞棋、、且26及控制模組28則設置在 電子系統1 〇中,彼iH* ΉΓ LV泳、ja 丄 ‘ 過‘,,、線傳輪的方式進行訊號傳 遞,如第5圖所示,可以將辟 將顯不模組22及感測模組24設 置在-般的電腦鍵盤90上’而將比對模組%以及控制模 組28設置在電腦(圖未示)内部,透過無線傳輸技術將使用 者於電腦鍵盤9。上之感測模組24的操作訊號傳送至電腦 (圖未示)待比對模組26進行確認後,一樣可透過控制模
組28進行電腦的控制。於此實施例中,控制裝置另包 含有一無線發射模組(圖未示),用以採用RFm、NFC、
WiFi、Bluetooth、ZigBee、PHS、GSM、CDMA、LTE 等等 形式之無線通信方式傳送代表該第一操作以及該至少一第 二操作之訊號。 本創作之電子系統之控制裝置係利用觸控感測技術搭 •配預 先設定之操作手勢以及開機密碼來執行電子系統的開 機功能’其中第一階段的操作手勢係用以避免使用者誤 觸’第二階段的開機密碼輸入則可避免電腦遭盜用,並且 讓使用者根擄其輸入的密碼自行選擇欲開啟的操作介面, 本創作透過觸控感測技術整合上述兩種不同階段的操作, 可以提供使用者操作便利的控制裝置,以上皆是本創作之 電子系統之控制裂置所帶來的助益。
雖然本創作已以較祛眘A 佳實靶例揭露如上,然其並 ,限定本創作,任何熟習Π姑菽本 一 .4此技藝者’在不脫離本創作之精神 和範圍内,當可作此耸 击 之更動與_,因此本創作之保護 圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 —第1圖為本創作之電子系統之控制裝置之一實施例之 不圖〇 第2圖為本創作之電子系統之控制裝置的顯示裝置之 實施例之示意圖。 — 圖為本創作之電子系統之控制裝置之一實施例之 示意圖。 4 Α圖至第4D圖為本創作之電子系統之控制裝置設 置在電日怒+ 碼主機上之各個實施例之示意圖。 • 帛5圖為本創作之電子系統之控制裝置之另-實施例 之示意圖。 【1要元件符號說明】 10 電子系統 20 控制裝置 22 顯示模組 24 感測模組 26 比對模組 12 M432093 28 控制模組 221 ' 223 操作圖樣 Cl ' C2 比對結果 40 一體成型電腦 50、60、70、80 電腦主機 90 電腦鍵盤
13
Claims (1)
- M432093 7. 如申請專利範圍第1項所述之電子系統之控制裝置,其中該顯 示模組係先顯示該第一操作圖樣,再根據該控制模組的控制顯 示該至少一第二操作圖樣。 8. 如申請專利範圍第丨項所述之電子系統之控制裝置,其中該控 制裝置另包含一無線發射模組,用以採用RFID、NFC、WiFi、 - Bluet00th、離㊁、PHS、GSM、CDMA、LTE 等等形式之無 •、線通#方式傳送代表該第一操作以及該至少-第二操作之訊號 至該比對模組。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US3698097P | 1997-01-29 | 1997-01-29 | |
US08/969,870 US6506842B1 (en) | 1997-01-29 | 1997-11-14 | Rheology-modified thermoplastic elastomer compositions and articles fabricated therefrom |
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TW432093B true TW432093B (en) | 2001-05-01 |
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ID=26713684
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TW087101119A TW432093B (en) | 1997-01-29 | 1998-02-17 | Rheology-modified substantially gel-free thermoplastic elastomer composition and its process for preparation and use |
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US (1) | US6506842B1 (zh) |
EP (1) | EP0963406B1 (zh) |
JP (2) | JP4885338B2 (zh) |
KR (1) | KR100562807B1 (zh) |
CN (1) | CN1140573C (zh) |
AR (1) | AR011781A1 (zh) |
AT (1) | ATE480590T1 (zh) |
AU (1) | AU5931998A (zh) |
BR (1) | BR9806932A (zh) |
CA (1) | CA2277950C (zh) |
DE (1) | DE69841883D1 (zh) |
ID (1) | ID19852A (zh) |
TW (1) | TW432093B (zh) |
WO (1) | WO1998032795A1 (zh) |
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- 1998-01-29 AT AT98902732T patent/ATE480590T1/de not_active IP Right Cessation
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- 1998-01-29 AR ARP980100387A patent/AR011781A1/es active IP Right Grant
- 1998-01-29 KR KR1019997006825A patent/KR100562807B1/ko not_active IP Right Cessation
- 1998-01-29 DE DE69841883T patent/DE69841883D1/de not_active Expired - Lifetime
- 1998-01-29 WO PCT/US1998/001625 patent/WO1998032795A1/en not_active Application Discontinuation
- 1998-01-29 CA CA002277950A patent/CA2277950C/en not_active Expired - Fee Related
- 1998-01-29 CN CNB988021056A patent/CN1140573C/zh not_active Expired - Lifetime
- 1998-02-17 TW TW087101119A patent/TW432093B/zh not_active IP Right Cessation
-
2008
- 2008-03-28 JP JP2008087279A patent/JP2008163353A/ja active Pending
Also Published As
Publication number | Publication date |
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AR011781A1 (es) | 2000-09-13 |
JP2008163353A (ja) | 2008-07-17 |
CA2277950A1 (en) | 1998-07-30 |
KR100562807B1 (ko) | 2006-03-21 |
US6506842B1 (en) | 2003-01-14 |
CN1140573C (zh) | 2004-03-03 |
ATE480590T1 (de) | 2010-09-15 |
ID19852A (id) | 1998-08-13 |
DE69841883D1 (de) | 2010-10-21 |
JP4885338B2 (ja) | 2012-02-29 |
AU5931998A (en) | 1998-08-18 |
EP0963406B1 (en) | 2010-09-08 |
EP0963406A1 (en) | 1999-12-15 |
JP2002513430A (ja) | 2002-05-08 |
BR9806932A (pt) | 2000-05-02 |
CN1246133A (zh) | 2000-03-01 |
WO1998032795A1 (en) | 1998-07-30 |
KR20000070578A (ko) | 2000-11-25 |
CA2277950C (en) | 2008-08-05 |
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