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TW429562B - A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor - Google Patents

A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor

Info

Publication number
TW429562B
TW429562B TW087115296A TW87115296A TW429562B TW 429562 B TW429562 B TW 429562B TW 087115296 A TW087115296 A TW 087115296A TW 87115296 A TW87115296 A TW 87115296A TW 429562 B TW429562 B TW 429562B
Authority
TW
Taiwan
Prior art keywords
inductive coil
integrated circuit
chip
semiconductor chip
circuit semiconductor
Prior art date
Application number
TW087115296A
Other languages
English (en)
Inventor
Joseph Fernandez
Leo Furey
Original Assignee
Microchip Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microchip Tech Inc filed Critical Microchip Tech Inc
Application granted granted Critical
Publication of TW429562B publication Critical patent/TW429562B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
TW087115296A 1997-09-15 1998-09-28 A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor TW429562B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92903397A 1997-09-15 1997-09-15

Publications (1)

Publication Number Publication Date
TW429562B true TW429562B (en) 2001-04-11

Family

ID=25457214

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087115296A TW429562B (en) 1997-09-15 1998-09-28 A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor

Country Status (4)

Country Link
EP (1) EP0902475A3 (zh)
JP (1) JPH11177027A (zh)
KR (1) KR19990029973A (zh)
TW (1) TW429562B (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2780221B1 (fr) 1998-06-22 2000-09-29 Sgs Thomson Microelectronics Emission d'une consigne de fonctionnement par une ligne d'alimentation alternative
FR2780220A1 (fr) 1998-06-22 1999-12-24 Sgs Thomson Microelectronics Transmission de donnees numeriques sur une ligne d'alimentation alternative
FR2792130B1 (fr) * 1999-04-07 2001-11-16 St Microelectronics Sa Transpondeur electromagnetique a fonctionnement en couplage tres proche
FR2792135B1 (fr) 1999-04-07 2001-11-02 St Microelectronics Sa Fonctionnement en complage tres proche d'un systeme a transpondeur electromagnetique
FR2792134B1 (fr) 1999-04-07 2001-06-22 St Microelectronics Sa Detection de distance entre un transpondeur electromagnetique et une borne
US6650226B1 (en) 1999-04-07 2003-11-18 Stmicroelectronics S.A. Detection, by an electromagnetic transponder reader, of the distance separating it from a transponder
FR2792136B1 (fr) 1999-04-07 2001-11-16 St Microelectronics Sa Transmission en duplex dans un systeme de transpondeurs electromagnetiques
FR2792132B1 (fr) 1999-04-07 2001-11-02 St Microelectronics Sa Borne de lecture d'un transpondeur electromagnetique fonctionnant en couplage tres proche
FR2796781A1 (fr) * 1999-07-20 2001-01-26 St Microelectronics Sa Dimensionnement d'un systeme a transpondeur electromagnetique pour un fonctionnement en hyperproximite
FR2808945B1 (fr) 2000-05-12 2002-08-16 St Microelectronics Sa Evaluation du nombre de transpondeurs electromagnetiques dans le champ d'un lecteur
FR2808946A1 (fr) 2000-05-12 2001-11-16 St Microelectronics Sa Validation de la presence d'un transpondeur electromagnetique dans le champ d'un lecteur
FR2808942B1 (fr) 2000-05-12 2002-08-16 St Microelectronics Sa Validation de la presence d'un transpondeur electromagnetique dans le champ d'un lecteur a demodulation de phase
FR2809235A1 (fr) 2000-05-17 2001-11-23 St Microelectronics Sa Antenne de generation d'un champ electromagnetique pour transpondeur
FR2812986B1 (fr) 2000-08-09 2002-10-31 St Microelectronics Sa Detection d'une signature electrique d'un transpondeur electromagnetique
US20030169169A1 (en) 2000-08-17 2003-09-11 Luc Wuidart Antenna generating an electromagnetic field for transponder
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP5214082B2 (ja) * 2001-07-25 2013-06-19 インヴェンサス・コーポレイション 半導体装置
JP4904813B2 (ja) * 2003-06-16 2012-03-28 日本電気株式会社 半導体デバイスおよびその製造方法
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7578053B2 (en) 2004-12-03 2009-08-25 Hallys Corporation Interposer bonding device
WO2006109678A1 (ja) 2005-04-06 2006-10-19 Hallys Corporation 電子部品の製造装置
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
KR101212722B1 (ko) 2010-02-26 2013-01-09 에스케이하이닉스 주식회사 멀티 칩 패키지

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2641102B1 (zh) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
GB2262105B (en) * 1991-12-03 1994-11-23 Marconi Electronic Devices Method of manufacturing circuit components
DE4431606A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Chipkartenmodul für eine kontaktlose Chipkarte und Verfahren zu deren Herstellung
AU7689596A (en) * 1995-12-05 1997-06-27 Michel Bisson Contactless electronic transponder with printed loop antenna circuit

Also Published As

Publication number Publication date
JPH11177027A (ja) 1999-07-02
EP0902475A2 (en) 1999-03-17
KR19990029973A (ko) 1999-04-26
EP0902475A3 (en) 2000-07-19

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees