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TW428023B - Polishing slurry - Google Patents

Polishing slurry

Info

Publication number
TW428023B
TW428023B TW88101990A TW88101990A TW428023B TW 428023 B TW428023 B TW 428023B TW 88101990 A TW88101990 A TW 88101990A TW 88101990 A TW88101990 A TW 88101990A TW 428023 B TW428023 B TW 428023B
Authority
TW
Taiwan
Prior art keywords
weight
parts
polishing
water soluble
polishing slurry
Prior art date
Application number
TW88101990A
Other languages
Chinese (zh)
Inventor
Hsin-Hsen Lu
Li-Mei Chen
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW88101990A priority Critical patent/TW428023B/en
Priority to JP2000015603A priority patent/JP2000230169A/en
Application granted granted Critical
Publication of TW428023B publication Critical patent/TW428023B/en

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A polishing slurry for chemically mechanically planarizing dielectric layers is disclosed. The slurry comprises: (a) 100 parts by weight of an aqueous medium; (b) 1 to 50 parts by weight of Si02 particles; (c) 0.1 to 10 parts by weight of a pH buffer; and (d) 0.1 to 10 parts by weight of a polishing accelerant selected from the group consisting of water soluble alcohols, water soluble amines, water soluble aminoalcohols, and combinations thereof. The polishing slurry is useful in providing effective polishing to dielectric layers while eliminating metal contamination problems.
TW88101990A 1999-02-09 1999-02-09 Polishing slurry TW428023B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW88101990A TW428023B (en) 1999-02-09 1999-02-09 Polishing slurry
JP2000015603A JP2000230169A (en) 1999-02-09 2000-01-25 Polishing slurry

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88101990A TW428023B (en) 1999-02-09 1999-02-09 Polishing slurry

Publications (1)

Publication Number Publication Date
TW428023B true TW428023B (en) 2001-04-01

Family

ID=21639658

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88101990A TW428023B (en) 1999-02-09 1999-02-09 Polishing slurry

Country Status (2)

Country Link
JP (1) JP2000230169A (en)
TW (1) TW428023B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319900A (en) * 2000-05-10 2001-11-16 Toshiba Ceramics Co Ltd Polishing method for semiconductor substrate
TWI228538B (en) * 2000-10-23 2005-03-01 Kao Corp Polishing composition
JP4195212B2 (en) * 2000-10-23 2008-12-10 花王株式会社 Polishing liquid composition
KR20020047417A (en) * 2000-12-13 2002-06-22 안복현 Slurry for polishing metal layer of semiconductor device
US6682575B2 (en) 2002-03-05 2004-01-27 Cabot Microelectronics Corporation Methanol-containing silica-based CMP compositions
KR100643632B1 (en) 2005-12-23 2006-11-10 제일모직주식회사 Slurry Composition for Silicon Wafer Polishing and Polishing Method Using the Same
JP5335183B2 (en) * 2006-08-24 2013-11-06 株式会社フジミインコーポレーテッド Polishing composition and polishing method
JP2013021343A (en) * 2012-08-29 2013-01-31 Fujimi Inc Lpd reducer, defect reduction method of silicon wafer, and manufacturing method of silicon wafer
JP2013016832A (en) * 2012-08-29 2013-01-24 Fujimi Inc Polishing composition, lpd reduction agent, lpd reduction method using the same

Also Published As

Publication number Publication date
JP2000230169A (en) 2000-08-22

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees