[go: up one dir, main page]

TW413399U - Micro chip scale package - Google Patents

Micro chip scale package

Info

Publication number
TW413399U
TW413399U TW88202423U TW88202423U TW413399U TW 413399 U TW413399 U TW 413399U TW 88202423 U TW88202423 U TW 88202423U TW 88202423 U TW88202423 U TW 88202423U TW 413399 U TW413399 U TW 413399U
Authority
TW
Taiwan
Prior art keywords
chip scale
scale package
micro chip
micro
package
Prior art date
Application number
TW88202423U
Other languages
Chinese (zh)
Inventor
Rung-Jen Juang
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW88202423U priority Critical patent/TW413399U/en
Publication of TW413399U publication Critical patent/TW413399U/en

Links

TW88202423U 1999-02-11 1999-02-11 Micro chip scale package TW413399U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88202423U TW413399U (en) 1999-02-11 1999-02-11 Micro chip scale package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88202423U TW413399U (en) 1999-02-11 1999-02-11 Micro chip scale package

Publications (1)

Publication Number Publication Date
TW413399U true TW413399U (en) 2000-11-21

Family

ID=21644985

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88202423U TW413399U (en) 1999-02-11 1999-02-11 Micro chip scale package

Country Status (1)

Country Link
TW (1) TW413399U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8426982B2 (en) 2001-03-30 2013-04-23 Megica Corporation Structure and manufacturing method of chip scale package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8426982B2 (en) 2001-03-30 2013-04-23 Megica Corporation Structure and manufacturing method of chip scale package
US8748227B2 (en) 2001-03-30 2014-06-10 Megit Acquisition Corp. Method of fabricating chip package
US8912666B2 (en) 2001-03-30 2014-12-16 Qualcomm Incorporated Structure and manufacturing method of chip scale package
US9018774B2 (en) 2001-03-30 2015-04-28 Qualcomm Incorporated Chip package

Similar Documents

Publication Publication Date Title
SG93192A1 (en) Face-to-face multi chip package
SG91352A1 (en) Semiconductor package
AU9447701A (en) Package
GB0024796D0 (en) Package
AU4974500A (en) Chip scale package
AU149513S (en) Package
TW443581U (en) Wafer-sized semiconductor package structure
TW413399U (en) Micro chip scale package
PL112567U1 (en) Factory-protected package
SG85103A1 (en) Multi-chip chip scale package
TW529770U (en) Chip scale package
TW462536U (en) Chip package structure
TW428875U (en) Multi-chip IC packaging structure
SG83700A1 (en) Multi-chip chip scale package
GB9923998D0 (en) Novel package
TW408855U (en) Chip scale package with die pad
TW497757U (en) Multi-chip packaging structure
TW420382U (en) Planar packaging of chips on the lead
TW413397U (en) Chip scale semiconductor package structure
PL338651A1 (en) Package
TW572362U (en) Dual-face chip package
TW470210U (en) Improved chip upward-ejecting mechanism
CA86435S (en) Package
GB0103884D0 (en) Package
TW560699U (en) Structure of chip package

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004