TW404871B - Device and method for machining transparent medium by laser - Google Patents

Abstract

Transparent medium having a high hardness and being poor in light absorption is cut or put script of characters or figures by a laser beam, the method including the steps of forming a support of a medium which is a good absorber of a laser beam, and placing the transparent medium on the support and focusing the laser beam onto the support through the transparent medium while the transparent medium and the laser beam are made a relative movement thereby machining the transparent medium, whereby permitting the laser beam to cut or scribe character of figure in a transparent medium.

Description

_ ^ Π48ΐ1 5 'Description of the invention (1) Background of the invention The field of invention of the present invention relates to a device and method for processing a transparent medium, especially a device and method for processing a transparent medium by laser, wherein the transparent The hardness of the medium is relatively high and the light absorption is relatively low. The transparent medium is cut by a laser beam or text or graphics are drawn on the transparent medium. Background of related technology Description High-hardness and transparent media such as glass, sapphire, and silicon carbide have been widely used, such as in various windows, light devices, LCD (liquid crystal display), and PDP (plasma display panel). , And fine-tuning instruments that require high corrosion resistance. In addition, materials such as sapphire and silicon carbide have been widely used as substrate materials for optical devices, such as visible light (red, green, blue, etc.) _ light emitting diodes, and electronic devices such as HBT Crystal), and FET (field effect transistor). Therefore, the processing technology that can easily cut these materials, or draw text or graphics on these materials, has a considerable industrial impact. High hardness materials can be processed or light treated. In machining, cutting tools such as diamond tips or diamond blades that are harder than the work piece are used. Furthermore, in optical processing, thermal energy such as the light of a laser beam is used. The following will explain the related technologies and methods for processing a transparent medium, please refer to

V. Description of the invention (2 "404671 ------- Test Z diagram. Figure 1 shows the unintended circle of a glass substrate cut with a diamond tip of a conventional technology, and Figure 2 shows a diagram of a related technology diamond blade cut glass substrate Actually, please refer to Fig. 1. In the cutting of diamond tips using related technology, · In transparent media, the work piece of glass plate 1 with high hardness should be drawn with diamond tip 2 to be drawn on the glass plate. Manufacture to mark 3 and apply—mechanical heat should be applied to it to cut the glass plate 丨 scratch 3 or two work pieces 0 and 'now refer to FIG. 2 and use the related technology diamond blade to cut the transparent medium At a medium and high speed, a disc-shaped diamond blade is rotated, and _ glass-glass plate 5 ′ a work piece moves against the diamond blade 4 for grinding along the cutting line) etch the glass plate 5 ′ and therefore cut the glass plate 5. At this time Because the diamond blades that rotate at high speed will cut out fine particles such as glass, a nozzle such as water or oil is used to spray the cutting site to prevent the powder from flying. Figure 3 shows the method of cutting a glass plate using a carbon dioxide laser. Figure 4 shows the use of a supplemental slice and a gas ejection nozzle for carbon dioxide laser cutting of glass panels. 77 Now refer to Figure 3 'When using a laser, the laser beam 9 from laser 8 is used. The lens 10 is focused on the work piece 11 and the work piece 11 is moved to melt the work piece 11 along the cutting line. The laser 8 can provide a laser beam. According to the properties of the work piece u medium, the wavelength of this laser beam can be It is absorbed by the work piece 11. At this time, a supplementary device on the transparent medium may be used to process the transparent medium, such as a supplementary slice 1 3 having good conductivity and arranged along the cutting line to set the heat radiation direction 'and make the The cracks in the medium are minimized in any direction, and V. Description of the invention ⑶ 4487871 _____ A micro-nozzle 14 can blow the gas downward. Cut off the position so that the temperature of the etched material is considered transparently in the related technology. The characteristics of the parts and the use of the processing methods must be appropriate, and the advantages / disadvantages of the methods need to be 'considered differently in different fields, but used for processing transparency'. Good work ability and cost. The following questions: The device and method in the related art are the first. This method is the simplest method used earlier by the diamond tip in the related technology, and the stress acts on the work piece;: ς: scratches on the piece, and =… Show ::: as the second, this has made the work piece / knife cut, you can also use a private, manual cutting, and the difficulty is to divide the work piece into two overseas workers to perform this operation, but it must be scratched The breakage is quite due to the fact that when the mark is not deep enough, the work piece needs to be cut to 疋, if the medium is sapphire and the thickness is greater than the allowable range (in the case of light installation, the thickness is less than the thickness; if :: Its range is 100 hearts), it is more difficult to break it after drawing an example of using an electronic device with transparency. In order to obtain a proper thickness and bite, a complicated and careful light grinding operation is performed before the drawing, and it needs to be broken. It is bent and difficult to crack. . Moreover, the thin thickness can lead to the second, when the glass plate has high hardness for cutting, the diamond tip must be replaced periodically. The diamond tip adds extra cost, especially when drawing and breaking. Thirdly, the processing method of the related technology has a relatively high cost. 7 Difficulties on cutting, its

Page 6 m 5. Description of the invention (4) --- Cut a curve instead of a straight line, as in the traditional mechanical method, the speed is quite slow, and it is not suitable for drawing text or graphics outside the cutting board. And, the inconvenience is that the work piece or device must be aligned along a crystal direction 'and the direction of drawing and breaking must be determined. · Fourth "Although the method of using the related technology of diamond blades can cut a wide range of relative quality", the money stone blade & 'part caused actual damage to the work piece with poor cutting surface, and The thickness cannot be reduced under a certain limit. 'The work piece material consumes more than the thickness of the diamond blade, resulting in a very low yield (ie, the number of wafers per unit area), and this method is difficult to apply to micro-cutting, and, The method of using the diamond blade-related method has a very slow cutting surface, and the production director is relatively low and flying dust will be generated near the work site, resulting in environmental pollution. Therefore, the nozzle 7 is generally used as shown in FIG. 2 to sprinkle water. Degrees, or, as shown in Figure 4-temperature of π π 枨 welcome private 丨 placed on the cutting line with a dish: Liang Suo II, Gui Ke II with the supplementary device i, if it has a direction, so that slices can be supplemented in any direction Let's set the exothermic square = nozzle to blow the gas to the cutting part i, = the mark is minimized, and it has a drop of ° to make the temperature of the melting material, although the square part of the laser beam with good absorption is cut Second, the required type of cutting work piece, because the random phase cracks are generated in the piece by the local rate phase i = at room temperature, so the chance of cutting failure is at the temperature of the work piece that is sustainable at L. Softening temperature is not acceptable. Accompanying the use of supplementary devices, such as a conductive station +. W iL-so most of the dioxo lasers are difficult to focus on cutting glass plates φ lasers focus on less than several hundred microns: f makes _ v 1 ^ Domain

Page 7 V. Description of Invention (5)

4MSTT gas lasers are limited during micro-cutting. The laser used must be fully absorbed by the work piece medium without error. Yeah, the laser that is fully absorbed by the work piece medium must be additionally added to cut the transparent medium. Even the small-size solid-state laser in the small visible light range or near infrared range. It is also necessary to use this type of laser in industry. SUMMARY OF THE INVENTION Therefore, the present invention relates to an apparatus and method for processing a transparent medium by laser. This apparatus and method can solve one or more problems caused by the shortcomings of the limitation caused in the related art. The object of the present invention is to provide a device and method for processing a transparent medium by laser, which allows cutting of transparent medium or drawing text or graphics on transparent and transparent medium, such as glass, sapphire, or Sic, etc., or based on Different types of medium formed by solid-state lasers in the visible or infrared range. This type of laser is often used in industry. In the following, the features and advantages of the present invention will be described. This description should be acceptable, or it can be understood by actually learning the present invention. The reasons for the invention and its scope can be obtained by applying for the scope of the patent and the drawings. In order to achieve the purpose of the present invention, a device for processing these and other advantages of a laser by a laser processing structure whose material absorbs the laser is provided. The device includes: a better yield than the transparent medium, and a support member of the present invention. Machine support

V. Description of the Invention ⑹ 404871 is used to support transparent media; a laser beam generating mechanism is used to provide a laser beam to a support mechanism; and a movement is used to: a mechanism or a laser beam. For mobile support In another design concept of the present invention, the laser of the present invention processes a transparent and transparent square flavor ^. One kind of application-a ^ considerable quality method, the method includes the following steps: The material formed on the ϊ: 上 ΐίΓ cow is an excellent laser beam absorber; and the relative movement between the transparent medium and the laser beam to separate the thin beads must be understood. The above description is intended for those skilled in the art to understand. The invention is not intended to limit the invention as defined by the scope of the patent application. Brief description of the λ scheme The features and advantages of the present invention can be further understood from the following description 'When reading, please refer to the drawings. In each figure, FIG. 1 is a schematic diagram of cutting a glass substrate using a diamond tip of the related technology; FIG. 2 is a schematic diagram of cutting a glass substrate using a diamond blade of the related technology; FIG. 3 is a schematic diagram of cutting a glass plate by using a carbon dioxide laser; Schematic diagram of using a supplemental slice and gas ejection nozzle to apply an oxygenated carbon laser to cut a glass plate;

Page 9 V. Description of the invention (7) Fig. 5 shows a preferred embodiment according to i0i8n using laser

QI "II benefits the transparent work piece of the women's clothing on the support (the circles in the figure are deliberately enlarged parts); J f ΐτ In the first preferred embodiment of the present invention, when the laser beam is fixed at the condenser ' Moving work piece; Fig. 7 shows a view of the work piece being cut by two focused laser beams in the first embodiment of the present invention; and specular reflection of Fig. 8 is a second preferred embodiment according to the present invention, In response to the specular reflection of the focused laser beam, a picture is drawn from two rotation views; FIG. 9 above shows a strip type of a work piece according to a third preferred embodiment of the present invention, in order to continue Fed into a laser beam focusing point; and 10B shows a side view and a plan view of the basic structure of a device formed by a medium such as sapphire or SiC; < = 11A and 11B of the device according to the present invention by such as sapphire Side view and plan view of the basic structure formed by SIC or Sic, in which the fields have been separated; FIG. 12 of the area of 罝 甲 特 疋 shows a scratch on the workpiece formed by the method of laser processing a transparent medium according to the present invention. Photo; Figure 13A shows 11A viewed from the side of a device And 11B; Fig. 1 3 β Photo of the device in 丨 丨 a and 丨 丨 b not viewed from the medium side, and FIG. 13C shows the individual separated from the device shown in FIGS. 11A and 11B according to the present invention. Photo of the installation.

Page 10 V. Description of the invention (8) 404871 2 0 Work piece 21 Laser 22 Laser beam 23 Reflector 24 Laser 2 5，2 5 'Support 26 Flame 2 7 Deep groove 28 Cutting line 2 9，2 9 'Motor 30 and 30' mirror 33 Thin film device 34 Active area 3 5 Field effect area 37 Transparent substrate 38 Detailed description of the preferred embodiment of the loop: The preferred embodiment of the present invention will be described in detail below, and in the drawings Illustrated example.

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4048'U First Embodiment τι, 5 Not according to the first preferred embodiment of the present invention, settled on a support, and a laser beam guides the transparent work 侔 工 # 杜 发 月 之In the first embodiment, when the focused laser beam is fixed, the work piece is moved, and the circle 7 is shown in the first preferred embodiment of the present invention + the focus laser beam reflected by two rotating mirror surfaces cuts a work piece. Application Now please refer to FIG. 5. According to a first preferred embodiment of the present invention, a device for processing a transparent medium by a laser includes a support member 25. The material of this can be aluminum, iron or copper, which is a laser beam. A good absorber can generate a flame from a strong laser pulse to install work pieces such as glass, sapphire, or silicon carbide. The laser 21 can continuously emit a laser beam U, and a reflector 23 can be unidirectional. The reflected laser beam is a lens 24 for focusing the laser beam reflected by the mirror 23 toward the work piece 20. As shown in FIG. 6, if the laser beam is fixed and the support member 25 moves in the cutting direction of the work piece, a movement of the support member 25 in the required direction is additionally required and 'as shown in FIG. 7 In the example where the work piece is fixed and the laser beam is moved, 'use two mirrors 30 and 30 for moving the laser beam, and two motors 29' 29 'for mirrors, for Controller that controls the motor (not shown). Other mirrors and driving motors can be added to the mirrors 30, 30 'and the motors 29, 29' for micro-control, and the mirror 23 and laser 24 shown in FIG. 5 can be integrated, including A driving mechanism for moving the mirror 23 and the laser 24 to control the mechanism.

Page 12 5. Description of the Invention (（) The following describes a method for processing a transparent medium by " Ϊ048Ϊ1 laser according to the first preferred embodiment of the present invention. When the laser beam 22 emitted from a laser 21 is focused on a transparent work piece 20 mounted on a support member 25 via a reflector 23 and a lens 24, a flame 26 'may be produced on the support member. The surface of 25 is partially heated, and the back surface of the work piece 20 in partial contact with the support member 25 is heated and melted to form a deep groove 27 on the back surface. When the laser beam 22 emitted from the laser 21 can be placed in the state of sudden vibration or sudden vibration by the Q switch, as shown in FIG. 6, the work piece 2 can be moved by moving the support member 25 along the cutting line 28 〇, as shown in FIG. 7, or two reflection motors 30, 30 'arranged in the path of the laser beam driven by the motors 29 and 29', and the support 25 and the work 20 are fixed Then, the focal point of the laser beam 20 is continuously moved along the cutting line to make the above groove. At this time, after considering the thickness and physical properties of the work piece, and adjusting the beam, a groove can be formed in the entire thickness to directly divide the work piece, so the work piece can be cut or a certain depth of the film ^ The groove is formed to apply mechanical stress, so the work piece is divided into two pieces. = In the example of moving the support and fixing the laser beam, the support is manually moved, or (not shown in the figure) 'provides for ㈣ movement and control through, so that the user can place it in the position shown-mechanism The data required for cutting is input to the control mechanism, so that the control controls the drive mechanism according to the input data. Therefore, when the optional support is fixed along the same beam along f $, although KG is displayed, it can be used to control the motor. 29 and 29, the user can put it in the cutting position I Η iI puncture mechanism, J section position, and set the data required for cutting

The 13th stomach V. Description of the invention (11) 404871 --- In the control mechanism 'so that the control mechanism can control the motor according to the input data, so the cutting movement is moved along the cutting drive. First Embodiment FIG. 8 shows a method of drawing a figure into a work piece by using a focused laser beam reflected by two rotating mirrors in a second preferred embodiment, and FIG. 9 shows a third embodiment according to the present invention. In the example, a conditional pattern of a work piece support is used to continuously feed a laser beam. Referring now to FIG. 8, two mirrors 30, 30, _ 'are positioned in the laser beam path, and the two mirrors are driven by two motors 29 and 29', so that the laser beam enters the lens 24 at a degree of 1 degree, and Change the focus position of the laser beam 22, so 2 can cut a medium, and the text and graphics can be drawn on a transparent and hard 7p w * μ like 'heavy stones. That is (though not shown in the figure), if you need to provide-^ 9, characters or graphics to a computer, and make the computer control the motor 29,. Or figure motor drive the mirror 30, 30 ', so that the mirror 30, 30' according to the text If the shape of the laser beam changes the focal point of the laser beam, the required text can be solid-formed + on a hard and solid medium, such as a hard rock. Second Embodiment-At the same time, if the branch member 25 (Fig. 5) in the first embodiment generates a flame on the medium, a power laser is directed to the position, and the transparent member. Therefore, generating a groove for an extended period of time can consume a large amount of support. As shown in FIG. 9, in the third embodiment of the present invention,

V. Description of the invention (12) 4D4871 ------ If the type of the support member 2 5 'is a thin strip, provide a winding 38 on which the support member 25 is wound, and a laser beam 22 The focal point is used to guide the support member 25 'and the wide roller 32, and the support member 25 can be continuously fed in. By using this system, if the good processing quality can be maintained, the amount of loss of the support members 25 can be reduced. · The above apparatus and method for processing a transparent medium were tested by laser, and the following results were obtained. First, an example of cutting a transparent medium. Provide support members covered with black oxide film on aluminum plate or steel plate, and place 3mm thickness glass plates on the supporting parts in sequence, and 300 sapphire thickness from 300 m to 30W with an oscillation wavelength of 1.06 / im The solid-state laser is q-sensed and focused on a glass plate or sapphire, and the laser or support is moved. Result: You can observe the cutting of the work piece (glass plate or sapphire) along the line where the laser focuses and guides. And, in the case of the laser of 0,532em, using the second harmonic of the above laser, it is possible to cut the work piece in the same state. Therefore, the device and method for processing a transparent medium by laser can be It is applied to the general cutting of a transparent medium and can be cut into any type. Fourth Embodiment At the same time, an optical device or an electronic device is manufactured by forming a thin film (a GaN group material) on a medium such as sapphire or silicon carbide and applying a variety of different procedures to become a one-piece piece. Because if it ’s separated by the method described above, there may be many different problems. The following procedure is used

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On the slightly smooth part of the device. 10A and 10B are a side view and a plan view of a structure like a sapphire, separated according to the domain. Fig. 12 shows a photo of a scratch on a work piece according to the present invention. Referring now to FIGS. 10A and 10B, a work piece 25 formed on a transparent substrate 37 is placed thereon, and a thin film device 33 is placed on it, because it is absorbed or transmitted by a heat device generated by a focused laser beam, so it can be broken. The material of the area to be cut by the laser beam is formed in the transparent medium 37 to form the device on the area to be cut. The field effect area 35 is preferably removed as required. A thin groove is exposed through the separated area and the base is simply split evenly, because it will impact the split, and it is also possible that the depth of the end of the installation depends on a certain level in the underlying medium. When opening a very small area, the speed of the laser beam will be displayed for a sensing frequency and the laser's running speed. If the corresponding frequency of Q is 10K Hz, the laser beam's running speed (running radio power is 5W, forming a Defects (stone and SiC formation-device substrate) The present invention forms specific regions in each device 'from laser processing-transparent media. If a thin film device 33 is provided, the region 34 and field effect region 35 are used. The supporting transparent substrate 3 7. In this example, the thin film that will be placed on the support 25 can change the characteristics of the thin film device-it can be deposited clean when the device is formed. So 'as shown in Figure 11, if there is a deposit left behind In the case of materials, after forming the grooved medium 37 exposing the transparent medium 37, a body is formed on the substrate to rupture, rather than the entire thickness of the device. That is, even if the entire thickness of the isolation area is determined, the groove area is Prevent if needed Thermal shock is generated on the surface. For example, it has an impact on the substrate. In the case shown in Figure 12, the laser beam is pointed at a speed of 50 mm / sec, and the width of the laser is 40 m from the depth of 25 / zm). This intention

Page 16 404W1 V. Description of the invention (14) It may be broken at any time. "After breaking according to the above procedure, the performance of the device can be measured so that the performance of the device is not changed before the device is separated." That is, there is no substantial impact. Fig. 13A shows a photograph of the device in Figs. 11A and 11B, which is viewed from the device side. Fig. 13B shows photographs of the devices of Figs. 1A and 1B, as viewed from the medium side. Fig. 13C shows photographs of individual devices separated according to the present invention. Although it is not shown in the figure, one is cut into separate devices, which is rather poor, and has a cutting area with repeated pattern film devices, and a considerable movement is projected between the laser beams toward the parent to scan the cat by mistake In the shape of the work piece, the thermal shock is minimized. Moreover, the above-mentioned parts are produced by the high heat energy of the focused laser beam. According to the present invention, in addition to the case where the thermal shock can be reduced, the cooling accuracy can be adjusted. A plurality of devices formed from the transparent medium of the device shown in FIGS. 11A and 11B. The absorption of the laser beam by the transparent medium can be achieved by passing a laser beam on a support member, and focusing on the work piece and amount. The laser beam can be guided so that in the embodiment of the separating device, the support is susceptible to thermal damage, which in turn destroys the focal point and controls thermal shock. In addition to reducing the speed and achieving the above-mentioned method of processing work pieces, the above method has the following advantages: No. '' in-machine tools have high hardness and transparent media temporarily ** SC & stone or carbonized dream, because the support is made of glass with blue Therefore, when the laser beam is absorbed, a flame beam is generated on the supporting member opened by the absorber and the work piece can be treated with φ; by placing the work piece on the j piece, the laser beam can be used to cut the transparent medium or the workpiece.

Page 17 V. Description of the invention (15) 4〇4B71 Drawing transparent media to form graphic features, in which only a very small amount of laser beams are absorbed in the transparent media. Second, because the device and method for processing the transparent medium by laser simplify the transparent medium (such as widely used glass, such as different windows, light devices, liquid crystal and plasma display panels, and many fine-tuning instruments that require high anti-corrosion, Such as silicon carbide with a wide range of applications, such as the base material of optical devices, such as visible light emitting diodes or laser upper poles and electronic devices) processing operations. Third, because a generally inexpensive solid-state laser is used to process high-hardness transparent media, and no expensive equipment (such as a gas laser) is required, the device and method for processing a transparent medium with a laser in the present invention is quite economical. And can be mass produced. Although the present invention should be explained with preferred embodiments, those skilled in the art need to understand that the above-mentioned apparatus and method embodiments of the transparent medium processed by the laser of the present invention can be modified and changed without departing from the spirit of the present invention and Viewpoints, the spirit and views of the present invention are defined by the scope of the attached patent applications and their equivalent meanings.

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Claims (1)

I A method for processing a transparent medium by laser. The method consists of the following steps: Ancient I forms a medium support, which is a good absorption of the laser beam and the transparent medium is placed on the support. When the transparent medium and the laser beam move relative to each other, the laser beam is focused on the support through the transparent medium to process the transparent medium. 2. For example, a method for processing a transparent medium by laser as described in item 1 of the scope of the patent application, wherein a support for placing a transparent medium is moved, and a laser is used to process the transparent medium. 3. A method for processing a transparent medium by laser as in item 1 of the scope of the patent application, 'where the laser beam moves' and the transparent medium is fixed to process the light medium. ^ For a method for processing a transparent substrate I by a laser, as described in item 1 of the scope of patent application, in which the laser is focused on a support to generate thermal energy, because when cutting a transparent medium, the thermal energy can be used in conjunction with the support A groove is formed in the contacting medium. Quality and quality • As described in item 1 of the scope of patent application, a method of laser processing_transparent medium, in which the laser beam is focused on a support to generate thermal energy, = in a transparent medium in contact with the support, the Heat can form a shallow groove. When cutting a transparent medium, a mechanical stress is applied to the transparent medium. 6, as described in the scope of application for a laser processing_transparent medium method, in which the laser beam is focused on the support to generate thermal energy,-when drawing text or graphics on a transparent medium, the thermal energy can be With support # 19 6. Application scope 41. A groove is formed in the transparent medium in contact with the floor. Qualified application, one of the scope of the patent is processed by a laser with a transparent support, and it includes a step of moving the support, so that the laser beam can be incident on a fixed focus point. 8. For example, one of the scope of the patent application applies a laser processing of a transparent medium. #, Which further includes the step of adjusting the thermal shock to a position on the support of the laser beam focus. 9. A method for processing a transparent medium from a laser as claimed in item 1 of the scope of patent application, wherein the laser beam is emitted from a solid-state laser. A method of applying a laser to process a transparent medium to separate a thin film device having a plurality of active areas and field effect areas, the method includes the following steps: removing a thin film on the field effect area to expose Forming a support member; the material of this support member is a laser beam absorber that is better than the transparent medium; and a thin film device is placed on the branch member, and the laser beam is focused on the support member by the transparent medium 'The relative movement between the transparent medium and the laser beam is performed to separate the thin film device. 11. A method of processing a transparent medium using a laser as in item 10 of the scope of the patent application, wherein the focused laser beam is incident in a staggered scanning pattern. 12.—A device for processing a transparent medium by a laser, comprising: a support mechanism whose material is better than the transparent medium in absorbing laser light; the support is used to support the transparent medium; Page 20 6. Patent application scope ~ 1 The 'laser beam generating mechanism' is used to provide a laser beam to the support mechanism via a transparent medium; and a moving mechanism is used to move the support mechanism or laser beam. 13. A device for processing a transparent medium by a laser according to item 12 of the patent application, wherein the laser beam generating mechanism includes: a solid-state laser for providing a laser beam; and a laser beam focused on a support Body lens. 14. A device for processing a transparent medium by a laser according to item 2 of the scope of the patent application, wherein the moving mechanism for moving the laser beam includes: a plurality of reflectors arranged in a laser beam path; A motor for moving the mirror; and a controller for controlling the motor. 15. A device for processing a transparent medium by a laser according to item 12 of the patent application scope, wherein the moving mechanism for moving the laser beam includes: a reflector disposed in the path of the laser beam; a lens for A motor for focusing the laser beam reflected by the reflector onto a support for moving the mirror and lens; and a controller for controlling the motor. 16. A device according to item 12 of the scope of patent application, wherein the support mechanism includes a support member to continuously feed the support to a point where the laser beam is focused. 17. As in item 12 of the scope of patent application-a device with a medium, wherein the support mechanism includes: laser processing transparent feed mechanism, laser processing transparent 404871 VI. Scope of patent application: a strip-shaped substance for absorbing the laser beam; a circle surrounding the strip-shaped substance; a roller for guiding the strip-shaped substance at the focus of the laser beam. I round country page 22