TW379158B - Method of manufacturing micro granule segregate for polishing - Google Patents

Description

V. Description of the invention (1) [Details of the invention [Technical aspects of the invention] The present invention is about the method of the present invention for recording media, especially the smoothing of interlayer insulating films and fine unevenness, (CMP. The manufacture of Chem i ca sub-dispersions is so-called equipped with ultra-fine particles for grinding. [Previous technology] The development of the integration of ultra-fine particle conductors for surface grinding of recording media has been studied on the semiconductor device surface quite precisely. In the manufacturing operation of the interlayer insulation between the layers, the operation of the interlayer insulation film is also used, and it must also be used in the field. — A kind of polishing super-brightness is about the polishing of a surface and the shape and flatness of the semiconductor metal wiring film. Processing 1 Mechanical method, and the method of manufacturing fine dispersions of fine dispersions, producing and producing semiconductor dispersions; methods of manufacturing ultrafine particle dispersing devices and magnetic devices; Large and broken use of chemical mechanical micro-Polish) method 2 grinding is especially about-the kind of 4 micro-productivity and pollution-free The plus =; method. Called < Grind and magnetic mill to become a phase dispersion. The half of the progress is related to the surface, the mirror surface of the film is formed by vacuum. When the precision is particularly spread, the semiconductor is mounted on the surface, and it becomes the media after the flat film is used between the layers. In the previous grinding, in the semiconductor device, the flat insulating film became flat. Means, in the semiconductor manufacturing method described in the manufacturing method of large and small, the center of the conductor device is also oriented so that it must be frank. Therefore, 'researching and forming a micro metal density in half' is to place the surface and Magnetism is used in research, and it should be formed with semi-multilayering, and it will be polished in semiconducting to make the conductor wiring.

δHai is used in chemical-mechanical grinding methods. It uses a particle grinder, a ball grinder, a knife body, a M-8 "mill, and a sand grinder.卩 and colloid-type grinding machine: Shell medium wave dispersing machine 'is used for the production of particles such as stone oxide, oxide, titanium, emulsified, emulsified, and iron oxide. D? Ultrafine particle dispersion for mechanical grinding -Generally, the user has a fairly fine particle dispersion with a particle diameter of 10nm to 100nm. It also disperses ultrafine particles in an alkaline 2 micron aqueous solution 'but' when the will Near the surface of the ultra-differential two or two, the ultra-fine particles ^ a ^ will form ions of 〒 in the water u, and an electric I- layer will be formed, and the particles in the slurry will also be made. The f-potential one (zeta-P0tential) becomes relatively small, and the "... force" becomes larger, and there is a so-called ": wide-pulling phenomenon", so that it becomes the so-called aggregate of the chest m. ) Is quite stable. In the head: m ϊ m should become chemical mechanical grinding The particle diameter of the center of the required particle diameter of the dispersion with ultrafine particles is "Ο⑽ ～ 刀

Page 5 V. Description of the invention (3) 200 nm 'and its particle distribution range is 100nm to 400nm [n, so it is necessary to disperse the aforementioned again by some methods Aggregate 〇, even if it is used for a long period of time, the aggregate of the aforementioned ultrafine particle dispersion for chemical machine ^ is once again dispersed using only a mixing type disperser. The decentralized treatment of time can hardly be done anymore. For example, in the state of ultrafine particle dispersion for chemical mechanical polishing using silicon oxide particles as an abrasive, in an alkaline solution in which potassium hydroxide is dissolved in ultrapure water, and mixed with 1 to 25% by weight The oxide particle with a particle diameter of 30 nm was then 'stirred at a high speed for 1 hour under the conditions of 3,000 Å', and, also, borrowed With a particle grinder, at 1 400 rpm, the particles with a diameter of 2 mm are dispersed for 1 hour in order to obtain neutron straight k230nm, and a 6 ~ i0mpa · 3 grinding. Ultrafine particle dispersion. 4 Ϊ In the state of a media-media disperser such as a user's sphere grinder, in terms of the diameter of the ’系, the diameter of the central particle can be obtained. 20 〇ηιη 左

Υ U π U ^ ultrafine particle dispersion, and as far as the particle distribution range is concerned, the particle public right # J dispersion is obtained, so: m50nm ~ 7 ° 〇nm grinding for ultrafine particle protection, Fenyizi has a very sharp and concentrated particle size distribution. If it is treated for a long time with the peak right, the medium itself will: wear phenomenon, so that in the semiconductor device manufacturing operations, there is contamination. (2) Wooden objects, and it is likely to contaminate semiconductor devices.

Page 6 V. Explanation of the invention (4) In addition, the microparticle dispersion which is subjected to a dispersion treatment by a method such as the one described above, has a processing characteristic that changes with the passage of time, and in each of the medicaments ° times. It is not the same, so that it becomes no _ ^ ^, in the grinding result 'or in the so-called D-shaped groove of the slurry which is supplied with a sufficient abrasive for polishing a wafer of 1 part. There is a problem in the body that there is a slurry, which leads to the problem that the slurry must be discharged from the tank to the outside, and the slurry is discarded. Therefore, in Japanese Patent Laid-Open No. 9_1 4 828 6, there is a so-called "method for dynamically mixing" for raising ants, and the "method for dynamically mixing" is provided with an oxidizing agent, The abrasive and slurry mixers disperse and treat the aforementioned oxidants and abrasives in a relatively small amount each time, and then apply the aforementioned dispersed oxidants and abrasives to the abrasive surface, but, As a mixer for destroying the body, the user should use a magnetic stirrer with a magnetic stirrer, and the dispersibility of the slurry obtained by the magnetic stirrer is not sufficiently complete. Changes in time cause particles :: 隼, resulting in the generation of particles with relatively large particle sizes. 【[Problems to be Solved by the Invention] The present invention provides a method for grinding, that is, the grinding of the invention; 2: the smoothness of the particle dispersion, and the unevenness of the chemical machine in flat processing (Mechanieal PQlish) method wet method of ultrafine particles

II _

Page 7 V. Description of the invention (5) Ultrafine particles: fine particles provided by silicon oxide, ytterbium manganese oxide, and oxygen are dispersed to one particle or one time to produce a uniform microfinger, but not completely In order to obtain the so-called high-purity, high-purity, relatively narrow center particle diameter, etc., which can be obtained in the high-mechanical polishing process of semiconductor devices, it can also be targeted at future manufacturers of particle dispersions. There should be no impure method, especially the method of making a dispersion with relatively small change over time in the present invention. Manufacturing of bodies such as oxides, iron, etc. Near particles Dispersion of particles Including the uniformity required to integrate more, the ratio of the particles is narrower. The problem is a problem for polishing, and the method of characteristic gasification error and dispersion is' so far, combined, and in addition, the progress of the prescribed high fine particles and the like is relatively high, and the distribution range is provided in the progress of the present invention. An ultrafine particle system is provided to provide a relatively stable titanium dioxide manufacturing method which can, and can also, "capable of particle diameter sub-dispersions" to cooperate with smooth, flat, and other issues, the required research and gasification; the fine particles of the present invention are divided into equivalent Stable cooperation with the above teaching. In addition, the chemical machine is relatively small and precise, and it also provides— > Ultrafine grinding mills can continuously produce dispersions. Manufacturers of so-called agglomeration and other ultrafine particles for grinding [Solution to the problem] The present invention is A method for producing a superfine particle dispersion for polishing is provided with the dispersion operation described below: In the method for producing a superfine particle dispersion for polishing, a suspension in which a superfine particle for grinding is dispersed in a liquid is provided. After stirring, remove the known flow tendency (thi X 〇tr 〇py), then, for

Page 8 V. Description of the invention (6) The suspensions described in June 1J are subjected to pressure treatment, and the aforementioned suspensions are introduced into each other from opposite directions, so that the suspensions are mutually performed. Collision to facilitate dispersion of the grinding ultrafine particles in the suspension. In the aforementioned method for producing an ultrafine particle dispersion for polishing, the ultrafine particle dispersion for polishing 'is a dispersion for chemical mechanical polishing of semiconductor planarization applications. In the aforementioned method for producing a dispersion of ultrafine particles for grinding, the dispersion system is an aqueous suspension having a concentration of 5 wt% or more and 60 wt% or less. In addition, the aforementioned method for producing a dispersion of ultrafine particles for polishing further includes a separation operation for classifying particles having a relatively large particle size after a so-called dispersion treatment. [Embodiment of the invention] ○ ^ Invention = A method for producing a superfine particle dispersion for polishing, which is found by J. Orthogonal dispersion means and a dispersion process is performed to obtain the ultrafine particle dispersion in a highly dispersed state. . In other words, it was found that, in order to use the ultrafine particles for polishing in the application of mechanical mechanical polishing ±, when the powder f of the ultrafine particles for polishing is an aqueous suspension, it should be aggregated twice. Coagulation with ultrafine particles f is gelatinized, which means that * when the phase suspension is used by the dispersion device using a medium such as a particle grinder, —: ft, and a sand grinder: required It takes a lot of money to do all the work on the knife and knife, and at the same time, it is not possible to get the clear sentence and the knife into a dispersion of quite fine particles.

m V. Description of the invention (7) Therefore, the difference between highly dispersed powdered ultrafine particles for grinding ^ ^ ^ suspension suspension, that is, to prevent the so-called 21 times of condensation \ Sexual media mixed in-the phenomenon of gelation occurs, why? Aggregates of ultrafine particles are aggregated into powders. The ultrafine particles for grinding are mixed with :: 3, while agitating the aforesaid deaqueous suspension's production tendency, and deducting the sigma body to facilitate the removal of L > — — , ', · Health (th 1 X 〇tr 〇py), lack of virtue, and then dispersed the aforementioned aqueous suspension to a considerable degree. ., ', And later, also issued to the following department X, >, 昍 堂, S 太 直 刹 4 * described in U.S. Patent No. 4 5332 No. Η material flat No. 6 flat No. 94 933 Or in Japanese Patent Laid-Open No. 6-4, it is used as a highly dispersed method. ^ The fluid of the superfine particles in 5Hai / is subjected to high pressure treatment, and waits: ΐsuspend 2 superfine particles The fluid becomes a high-pressure state, and the fluid collides with the fluid to disperse the ultrafine particles. It is formed in the flow path between the groove and the plate-like body, so that the pressure is compressed and the collision phenomenon occurs. # 着, Starting from the intersection of the grooves of the aforementioned groove and the plate-like body,-until the flow path composed of the grooves formed on the plate-like body at the opposite position, flows into the above-mentioned and is pressurized to become A method of dispersing ultrafine particles in a fluid under a high pressure; and starting from the through holes provided in the plate-shaped body in opposite directions to each other, and 'the towel in the center of the plate-shaped body' makes the The pressure becomes the "I!" Body of the high-pressure filter. Opening the ultrafine particles and the like methods; that is, the use of the aforementioned U.S. Patent No. 4 453 325 instruction manual, Japanese Laid-Open Patent of Shu -9493 Publication No. 3, or Japanese Patent

Page 10 V. Explanation of the invention (8) = On = No. 6-4 726 No. 4 proposes that the fluids under pressure a are in a state of pressure collision with each other in order to facilitate In the state of dispersing the ultrafine particles in a divided manner, in addition to being able to disperse the ultrafine particle dispersion for grinding at a relatively high level, the aforementioned dispersion characteristics can be maintained for a long time. In addition, it also has the characteristics described below: In the dispersion method using a particle grinder, a ball grinder, and a sand grinder, the dispersion medium will be damaged due to the dispersion medium itself and abrasion. It is impossible to avoid the so-called foreign matter mixing phenomenon. However, the fluids containing the ultrafine particle dispersion for grinding which are pressurized to a high pressure state collide with each other to facilitate the dispersion of the ultrafine particles. In the method, the occurrence of so-called foreign matter caused by the dispersion medium does not occur. Since the ultrafine particle dispersion for grinding obtained above is used even in the manufacture of semiconductor devices, it is not suitable for Semiconductor devices have considerable adverse effects. s Fig. 1 is a diagram for explaining a superabrasive operation for polishing according to the present invention. Readjustment of the system of Ding Dao government = In industry A, the ultrafine particles for grinding, ultrapure water, test reagents, and I4 required agents are mixed in — the suspension of the required composition in the grinding operation J: The loading industry lost the aforementioned suspension (th1Xtrotropy). And, after dispersing the suspension of the cloud, the former phenomenon was added to the suspension so as to disperse the ultrafine particles. Peranakan rushes

V. Description of the invention In the separation operation D, the centrifugal separation method is used to obtain the ultrafine particle dispersion for grinding obtained in the fraction m and before f, and then, in the grinding operation E, the aforementioned grinding is used. Ultrafine particle dispersion. In the polishing operation E, the ultrafine particle dispersion for polishing which has not been subjected to the so-called separation operation may be used. And it is related. First, the stirring operation in the method of the present invention is explained. The agitator equipped with two or four blades is used as the agitator in the method of the present invention, and then, the blades and the liquid contact part are subjected to inert and stable polytetrafluoroethylene and the like The resin coating is completely treated, and metal ions that do not contaminate the so-called ultrafine particle dispersion for grinding are also used. 49. When an embodiment is listed in the state of producing a superfine particle dispersion for grinding with a solid concentration of 30% by weight, it is dissolved in 6 8. 4 7 1 kg of ultrapure water, 1. 49 8 kg of a potassium hydroxide aqueous solution having a concentration of 20% by weight, and 'the agitator provided with a fan having a blade of 50 to 100 mm at a speed of 1500 rpm' was used to agitate the above-mentioned dissolving solution. Within 0 minutes, 30. 3 kg of smoked silica having a primary particle diameter of 20 to 30 nm was put in fairly evenly. After putting in the full amount of the ingredients, the number of revolutions of the mixer was set to 2000 rpm, and the stirring operation was performed for 15 minutes. Then, the number of revolutions of the blender described in the lift was set to 3,000 rpm, and carried out. After 15 minutes of stirring operation, "continued" was dispersed in the dispersion manufacturing apparatus for dispersing the ultrafine particle dispersion for grinding by the collision phenomenon of the high-pressure fluid.

Page 12 V. Description of the invention (10) In order to reduce the so-called thixotropy of ultrafine particles for flow-tightening grinding. Next, the high-pressure flow of the field manufacturing method is used to make the ultrafine particles for grinding of the invention. The dispersion potential of the dispersion Ϊ f colliding phenomenon and disperse the ultrafine particles for grinding Figure 2 is used to say: / set 'for related explanation. An example of a body _ < dispersion section of the dispersion manufacturing apparatus of the present invention, the dispersion section 1, is & the dispersion section, on the right side of the formation is a dispersion device provided with a dispersion section, and the slice is 4 In order to keep the f-shaped flow paths 2 and 3 in front, the gap between the ^ member in the opening 6 formed by the gap filling member and the member 5 on the opposite part is collided. The flow introduced in the groove-shaped flow path. In addition, FIG. 3 is a super particle dispersion for grinding by using an image. Schema of his example.乂 5The invention of the dispersion manufacturing apparatus of the present invention is used to explain the dispersion of the dispersion manufacturing apparatus of the present invention. "Elements < and Figure 3 (B) is used to show the main body manufacturing apparatus. Sectional view. Through the intermediate plate-like body 17 ′ having the intersecting flow path 16, the inflow-side plate-like body 13 provided with the fluid inlets 11 and 12 and the outlet-side plate-like shape provided with the groove-shaped through hole 14 are laminated. The body 15 is opened from the inlet of the inflow-side plate-shaped body 13 and flows into the fluid containing ultrafine particles. After changing the fluid to a right angle, the fluid is then formed between the grooved plate-shaped bodies. In the flow path, 'impinging on the fluid', then, starting from the intersection of the grooves of the aforementioned grooves and the plate-shaped body, the formation of the

V. Description of the invention (11) The plate-shaped office L, ^ ^ ^ at the opposite part, flows through the channel formed by the difficult grooves, and flows into the aforementioned * H, I to create a superfine particle dispersion for grinding. In addition, Fig. 4 is a drawing of the main body of the dispersion part of A m and said. Fig. 4 shows the dispersion manufacturing apparatus of the present invention, and Fig. 4 is a part thereof; ； * 舯 々 ~ The hardness ratio of the standing faceted diamond of the blade body of the fluid of the dispersion manufacturing apparatus of the present invention * _. The dispersion unit main body 21 is formed by overlapping the plate-shaped body composed of the material of the dispersion unit main body 21, and the inflow port 2 is formed at + 〇, and, in Previously

The two inflow inlets 22 $ I, L with iv heart ^ t both 'are formed with a nozzle', and the nozzle 'is a small mouth portion 9 which is gradually reduced by the state M. „

That is, the minimum cross-sectional area of Z3 and the cross-sectional area of the flow path. And ι 'in the red, the ggu A quasi ~ -mm 1 夂 A through the solid-liquid mixed phase flow in the small mouth at a speed and after the "ceremonial dispersion operation, and from the outflow port 24, take out the aforementioned The solid-liquid mixed phase, ^ Λ L. Compared to the nozzle with a small opening on a straight line, θ is opened like the above, it can prevent the so-called solid-liquid: combined phase flow contact. The abrasion phenomenon caused by the contact phenomenon to the wall surface can occur in the pressurized container by forming a flow path smaller than the body in the high-pressure container to form a through-hole with a relatively small diameter and a relatively thin plate. In order to form the dispersion manufacturing apparatus shown in Fig. 4, in the apparatus of Fig. 4, the center of the through hole of the plate-shaped body is toward the side surface of the plate-shaped body, and communicates with the perpendicular to the plate. The flow path for the outflow through the through-holes of the shape body, and the fluid supplied from the through-holes of the emulsified part in opposite directions to each other 'is in the central part of the plate-shaped body, and a collision phenomenon occurs' to facilitate dispersion. Superfine particle dispersion for grinding.

V. Description of the invention (12) Even if it is integrally formed, the surface can be formed on the surface of the plate-shaped body in two ways: the plate-shaped body that operates, and the through hole in the center of the body starts and continues. Two: The groove formed on the two-piece plate, and by overlapping 至 2h to the side of the plate-shaped body to facilitate the formation of the above-mentioned: Γ through-sheet hole can be overlapped by two plate-shaped body In addition, it is also provided to facilitate the processing of through-holes or shapes during the processing operation of forming the emulsion scatter grooves for each of the dispersion sections. Manufacturing of various arbitrary shaped devices is underway. Yi also carries out dispersion manufacturing. In addition, the diameter of the fluid is smaller than that of the fluid at a relatively high pressure: while the part hitting the fluid is straight, it also causes the fluid to flow into the pipeline of the fluid with GIL. Diameter, straight, and the part that passes through the speed of the field becomes degree. Therefore, the length of the force and the part of the flow velocity can be reduced, in order to increase the energy lost by the body crashing against the wall of the device. The durability of the components of the above-mentioned dispersion operation. Most ideal and good. From "^", the dispersion device shown in Fig. 4 is inside the dispersion device, and the flow direction of the fluid in the dispersion device shown in Fig. 2 ▲ or Fig. 3 is changed by 'pressurized to high pressure. When the wall surface of the dispersing device in the state is worn due to the impact of the fluid on the wall surface, due to the determination, there will be contamination of the gastric dispersion, which is the same as the pressure and flow rate. The small mouth radius is related to the κ complex that produces a large number of dispersions, for example, so there is a so-called chicken that cannot be manufactured. Page 5 5. Explanation of the invention (13) In addition, FIG. 5 is a diagram for explaining the cross-sectional shape of the nozzle and the existence state of solid particles in the solid-liquid mixed phase fluid. In a state where a small opening is formed between the inflow side and the outflow side, the cross-sectional area of the pipe gradually decreases toward the small opening. To be more specific, in the example shown in FIG. 5, the aforementioned inflow side is formed by a pipe with a size of 1 mm, and the cross-sectional area of the pipe is between 0.52 mm in length. It is gradually reduced toward a small mouth radius of 0.3 mm. As a result, the boundary particle flow line in which the so-called area where no particles exist is formed by the small mouth portion; the horizontal axis of FIG. 5 shows the nozzle length in a state where the small mouth portion radius is 1, and The vertical axis of FIG. 5 shows the diameter of the pipe in a state where the small mouth radius is 1. Compared with the small mouth of the nozzle, the so-called part without particles is formed on the exit side. Therefore, the wall surface can be formed at a position farther away from the central axis than the boundary particle flow line. In order to prevent the so-called nozzle wear phenomenon. In addition, in the method for producing the ultrafine particle dispersion for polishing of the present invention, the particle size can be adjusted by a method such as centrifugation, and the so-called dispersion obtained during the dispersion operation can be so-called Graded jobs. Although various devices can be used in the separation operation, for example, a centrifugal separation device (manufactured by Bergman, A VANT I HP-201) is used at a speed of 1000 rpm and a centrifugal force of 30,000 g. In the state of continuous processing, the particle size distribution area before the separation operation is 76 nm to 339 nm. However, in practice, the separation operation

Page 16 V. Description of the invention (14) The particle size distribution area before treatment 'is 76nm ~ 140nm, that is, it can be confirmed that there are no particles with a particle size of 14nm or more. If a centrifugal separator is used, the rotation speed of the centrifugal separator can be adjusted in accordance with the so-called "no upper particle diameter requirement". In addition, the ideal centrifugal force is in the range of 0.001 g to 600 g. In the present method for producing ultrafine particle dispersions for polishing, it is possible to use a variety of relatively large particles for polishing; if one = example f is listed, the methods described below can be listed : Fumigation method in which the raw material vapor containing the metal component is precipitated by a flame-saturated = rolling 'atmosphere; or, n', which is a so-called abrasive particle, is precipitated by a solid colloid method, and is like The method of high-temperature production; or, the size of the granules is mixed with the powder to facilitate the classification of the grinding particles. As a method of grinding ultrafine particles, the silicon oxide and aluminum oxide are produced. , Osmium oxide, and oxidized titanium,-emulsified titanium, osmium oxide, oxidation mixture, and oxide compounds, and metal compounds other than the above-mentioned oxides and emulsions. In particular, the above-mentioned oxidation The purity ratio of the particles is within the range of the heart obtained by the plasma method, and the diameter of the secondary particles is also in the range of 10 to 50 true circles. Also, the shape of the particles should preferably be nearly close to each other and in In the dispersion, the absolute basic substances and iodic acid substances β are mixed with oxidants such as potassium hydroxide, potassium hydroxide, and hydrogen peroxide water.

Page 17 V. Description of the invention (15) " In addition, the ultrafine particles for grinding in the ultrafine particle dispersion for grinding of the present invention. The concentration of the particles in the suspension is preferably an aqueous suspension of 5% by weight or more and 60% by weight or less. If it is more desirable, the concentration of the suspension is preferably 13% by weight to 30% by weight of water. suspension. When the concentration of the suspension of the ultrafine particles for grinding in the ultrafine gastric particle dispersion for grinding is less than 5 weight 1%, the chemical mechanical milling (CMp: Chemical

The mechanical part of the mechanical polish), that is, the mechanical polishing characteristics, will become relatively small. The concentration of the suspension of the polishing ultrafine particles in the polishing ultrafine particle dispersion is 60% by weight. In the state where the solid content concentration is quite high, only 7 grinding treatments are performed, so that the chemical grinding effect shows a so-called reduction :; i granules are not suitable for grinding in the ultrafine particle dispersion for grinding. The dispersion obtained by the method of the invention exhibits the dispersion phenomenon of the ancient winter degree, and the change over time is relatively small, and the field will be agglomerated and settled around the time of the month: time Regimes, which are obtained by the method of the present invention, can be used for a long period of more than one year. [Exemplary Embodiments] Hereinafter, examples of the present invention will be listed and the present invention will be described. Heart pit valley, Example 1 In the ultrapure water, hydrogen and oxygen used as a pH adjusting agent were added to prepare a test solution of ρ Η 11. 5. In the aforementioned test solution, potassium V. Description of the invention (; 16) While stirring, the smoked silicon oxide is put in order to prepare the so-called input amounts of 12. 5 wt% and 25 wt%, respectively. And 3 types of samples of 50% by weight =) Next, a dispersing device having a facing nozzle as shown in FIG. 3 (: a 1 timi zer-sy stem by Sugino Machinery Co., Ltd.) HJP -2 5 0 28), under the condition of 1 100 kgf / c m2, for the above-sample, the number of processing times of one-pass (one-pas s) and two-pass (two-pass) are performed, A total of six dispersions were prepared, and the particle size and particle diameter of the ultrafine particles in the dispersion were measured by a laser light diffraction type particle size distribution measuring device (SALD-2000A manufactured by Shimadzu Corporation). distributed. Table 1 shows the processing conditions of the samples and the characteristics of the obtained granules. [Table 1] Oxygen treatment pressure through the particle size distribution center particle size foreign matter concentration ((kgf / frequency range (nm) (nm) weight%) cm2) 12.5 1100 1 100-380 140 No detected 12.5 1100 2 80- 300 130 not detected 25 1100 1 80-330 130 not detected 25 1100 2 70-300 125 not detected 50 1100 1 80-300 125 not detected 50 1100 2 65-280 120 not detected Next, a continuous centrifugal separator (manufactured by Bergman Corporation, AVANT I HP-20 1 type) connected by a so-called dispersing device through a pipeline.

Fifth, invention description (17)) on page 19, and two methods of so-called 2.8 liters / minute, rotor rotation number 6000 rpm, centrifugal forces 18000 g and 1000 rpm, and centrifugal force 30,000 g are also used. The dispersion was continuously processed, and the results of the processing are shown in Table 2. [Table 2] Concentration of oxide treatment pressure passing times 6000rpm to 1000rpm ((kgf / particle size distribution particle size distribution weight%) cm2) (nm) (nm) 12. 5 1100 1 100-180 100-140 12.5 1100 2 80-180 80-140 25 1100 1 80-180 80-140 25 1100 2 70-180 70-140 50 1100 1 80-180 80-140 50 1 100 2 65-180 65-140 [Effect of the invention] Just like As described above, by the method of the present invention, the particle size of the ultrafine particle dispersion for chemical mechanical polishing can be adjusted to adjust the uniform ultrafine particle dispersion with a narrow particle size distribution range and high purity in the water. So that during the semiconductor manufacturing operation, a considerable effect can be exerted in the smoothing and planarizing treatment of the oxide film and the metal wiring film such as the interlayer insulating film. [Brief description of the drawings] Fig. 1 is a drawing for explaining the manufacturing operation of the ultrafine particle dispersion for polishing of the present invention.

Page 20 V. Description of the invention (18) FIG. 2 is a diagram for explaining an example of the dispersion part body of the dispersion manufacturing apparatus of the present invention. Fig. 3 is a diagram for explaining another example of the dispersion manufacturing apparatus of the present invention. Fig. 4 is a diagram for explaining another main body of the dispersion part of the dispersion manufacturing apparatus of the present invention. Fig. 5 is a diagram for explaining the cross-sectional shape of a nozzle and the existence state of solid particles in a solid-liquid mixed-phase fluid. [Description of component numbers] A: Preparation operation B: Stirring operation C: Dispersion operation D: Separation operation E: Grinding operation 1: Dispersion unit body 2: Groove-shaped flow path 3: Groove-shaped flow path 4: For gap filling Sheet 5: Opposite member 6: Opening section 11: Fluid inflow port 12: Fluid inflow port 13: Inflow-side plate-like body 14: Channel-shaped through hole

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Claims (1)

6. Scope of patent application 1. A method for manufacturing a superfine particle dispersion for grinding, characterized in that it comprises the following dispersing operations: In the method for manufacturing a superfine particle dispersion for grinding, The suspension in which the ultrafine particles for grinding are dispersed is stirred, and the so-called flow tendency (thi X 〇tr 〇py) is removed. Then, the suspension is subjected to a pressure treatment, and, The aforementioned suspensions are introduced from each other in opposite directions, so that the suspensions collide with each other so as to disperse the ultrafine particles for grinding in the suspension. 2. The manufacturing method of the ultrafine particle dispersion for polishing as described in the first patent application range, wherein the ultrafine particle dispersion for polishing is a dispersion for chemical mechanical polishing of semiconductor planarization applications. 3. The manufacturing method of the ultrafine particle dispersion for grinding as described in the scope of patent application item 1, wherein the dispersion system is an aqueous suspension having a concentration of 5 wt% or more and 60 wt% or less. 4. The manufacturing method of the ultrafine particle dispersion for grinding according to any one of claims 1 to 3, wherein after the so-called dispersing treatment, it is further provided with the separation for classifying particles with a relatively large particle size. operation. Page 23