[go: up one dir, main page]

TW371285B - Foiled UD-prepreg and PWB laminate prepared therefrom - Google Patents

Foiled UD-prepreg and PWB laminate prepared therefrom

Info

Publication number
TW371285B
TW371285B TW083110086A TW83110086A TW371285B TW 371285 B TW371285 B TW 371285B TW 083110086 A TW083110086 A TW 083110086A TW 83110086 A TW83110086 A TW 83110086A TW 371285 B TW371285 B TW 371285B
Authority
TW
Taiwan
Prior art keywords
foiled
prepreg
pwb
layers
prepared therefrom
Prior art date
Application number
TW083110086A
Other languages
Chinese (zh)
Inventor
Erik Middelman
Original Assignee
Amp Akzo Linlam Vof
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Akzo Linlam Vof filed Critical Amp Akzo Linlam Vof
Application granted granted Critical
Publication of TW371285B publication Critical patent/TW371285B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/40—Shaping or impregnating by compression not applied
    • B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • B29C70/08—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers
    • B29C70/088—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers and with one or more layers of non-plastics material or non-specified material, e.g. supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
    • B29K2105/10—Cords, strands or rovings, e.g. oriented cords, strands or rovings
    • B29K2105/101—Oriented
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
    • B29K2105/10—Cords, strands or rovings, e.g. oriented cords, strands or rovings
    • B29K2105/101—Oriented
    • B29K2105/108—Oriented arranged in parallel planes and crossing at substantial angles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
    • B29K2105/243—Partially cured
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/253—Preform
    • B29K2105/256—Sheets, plates, blanks or films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0276—Polyester fibres
    • B32B2262/0284—Polyethylene terephthalate [PET] or polybutylene terephthalate [PBT]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514—Oriented
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0287—Unidirectional or parallel fibers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The invention relates to a basic material for making a PWB laminate, which is a foiled UD prepreg comprising a layer of a conductive metal foil bonded to a layer made up of parallel, unidirectionally oriented reinforcing fibres impregnated with not yet fully consolidated matrix resin. The foiled UD-prepreg can be used to manufacture UD-crossply PWB laminates by stacking and pressing them together with, in between, other UD-layers, which may be either non-foiled UD prepreg layers, of non-flowing UD composite layers.
TW083110086A 1994-09-19 1994-11-02 Foiled UD-prepreg and PWB laminate prepared therefrom TW371285B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP94202688 1994-09-19

Publications (1)

Publication Number Publication Date
TW371285B true TW371285B (en) 1999-10-01

Family

ID=8217206

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083110086A TW371285B (en) 1994-09-19 1994-11-02 Foiled UD-prepreg and PWB laminate prepared therefrom

Country Status (9)

Country Link
EP (1) EP0782500A1 (en)
JP (1) JPH10508720A (en)
KR (1) KR970705465A (en)
CN (1) CN1158101A (en)
AU (1) AU694564B2 (en)
CA (1) CA2200314A1 (en)
MX (1) MX9702059A (en)
TW (1) TW371285B (en)
WO (1) WO1996009158A1 (en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0838977A1 (en) * 1996-10-25 1998-04-29 Gividi Italia S.P.A. Laminates for printed circuits using unidirectional glass fabric
WO2000072643A1 (en) * 1999-05-26 2000-11-30 Ppg Industries Ohio, Inc. Fabrication of unidirectional laminate prepregs using tape casting methods and equipment
US7356916B2 (en) 2001-07-18 2008-04-15 Matsushita Electric Industrial Co., Ltd. Circuit-formed substrate and method of manufacturing circuit-formed substrate
ITRM20040571A1 (en) * 2004-11-22 2005-02-22 Gen Services Srl ROTOR, RELATIVE MANUFACTURING PROCEDURE, AND INDUCTION MACHINE USING THE ROTOR.
US8129623B2 (en) 2006-01-30 2012-03-06 Kyocera Corporation Resin film, adhesive sheet, circuit board, and electronic apparatus
WO2008093757A1 (en) 2007-01-31 2008-08-07 Kyocera Corporation Process for producing prepreg sheet, apparatus therefor and prepreg sheet
EP1970951A3 (en) * 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP2372756A1 (en) 2007-03-13 2011-10-05 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device and manufacturing method thereof
JP5268395B2 (en) 2007-03-26 2013-08-21 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
EP1976000A3 (en) * 2007-03-26 2009-05-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
CN101680707B (en) 2007-03-26 2013-02-20 Lg电子株式会社 Reinforcing component for refrigerator
US8012561B2 (en) 2007-03-30 2011-09-06 Kyocera Corporation Fiber-reinforced resin and method for manufacturing the same
EP2001047A1 (en) * 2007-06-07 2008-12-10 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device
JP2009045915A (en) * 2007-07-26 2009-03-05 Kyocera Corp Composite board, wiring board, mounting structure, and method for manufacturing composite board
WO2009051239A1 (en) * 2007-10-18 2009-04-23 Kyocera Corporation Wiring board, mounting structure and method for manufacturing wiring board
JP5293075B2 (en) * 2007-10-24 2013-09-18 日立化成株式会社 Metal foil-clad laminate and printed wiring board
JP2009205669A (en) 2008-01-31 2009-09-10 Semiconductor Energy Lab Co Ltd Semiconductor device
KR101596698B1 (en) 2008-04-25 2016-02-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
KR101582503B1 (en) 2008-05-12 2016-01-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing semiconductor device
KR101549530B1 (en) 2008-05-23 2015-09-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2009142310A1 (en) 2008-05-23 2009-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5248412B2 (en) 2008-06-06 2013-07-31 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US8053253B2 (en) 2008-06-06 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5473413B2 (en) 2008-06-20 2014-04-16 株式会社半導体エネルギー研究所 Wiring substrate manufacturing method, antenna manufacturing method, and semiconductor device manufacturing method
US8563397B2 (en) 2008-07-09 2013-10-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR102026604B1 (en) 2008-07-10 2019-10-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Light emitting device and electronic device
TWI475282B (en) 2008-07-10 2015-03-01 Semiconductor Energy Lab Liquid crystal display device and method for manufacturing the same
JP5216716B2 (en) 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 Light emitting device and manufacturing method thereof
WO2010032611A1 (en) 2008-09-19 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5583951B2 (en) 2008-11-11 2014-09-03 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
CN102460722B (en) 2009-06-05 2015-04-01 株式会社半导体能源研究所 Photoelectric conversion device and method for manufacturing the same
TWI517268B (en) 2009-08-07 2016-01-11 半導體能源研究所股份有限公司 Method for manufacturing terminal structure and method for manufacturing electronic device
JP5719560B2 (en) 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 Manufacturing method of terminal structure
KR20110114325A (en) * 2010-04-13 2011-10-19 삼성모바일디스플레이주식회사 Display device
JP5594872B2 (en) * 2010-05-06 2014-09-24 日精株式会社 Colored fiber reinforced composite
JP5851875B2 (en) * 2012-02-14 2016-02-03 信越化学工業株式会社 Method for manufacturing package for optical semiconductor device and method for manufacturing optical semiconductor device
NL2016357B1 (en) 2016-03-03 2017-09-20 Allotropica Tech Inc Pre-preg and composite products
JPWO2019111416A1 (en) * 2017-12-08 2020-12-10 昭和電工マテリアルズ株式会社 Prepregs, laminates, and their manufacturing methods, as well as printed wiring boards and semiconductor packages.
CN109049891B (en) * 2018-06-13 2020-09-29 咸阳天华电子科技有限公司 Preparation method of high-elasticity copper-clad unidirectional fiber sheet
CN109496076B (en) * 2018-12-19 2020-12-15 咸阳天华电子科技有限公司 Manufacturing process of unidirectional fiber circuit board
CN111688287B (en) * 2020-06-14 2022-06-10 湖南亿润新材料科技有限公司 Epoxy resin prepreg and production process thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111879A (en) * 1975-03-27 1976-10-02 Mitsubishi Gas Chemical Co Manufacture of metal foillclad preepreg
FR2516441A1 (en) * 1981-11-18 1983-05-20 Spie Batignolles PROCESS FOR PRODUCING FIBER-LOADED THERMOPLASTIC RESIN PROFILES, INSTALLATION FOR IMPLEMENTATION, PROFILES OBTAINED AND USE THEREOF
KR900009265A (en) * 1988-12-07 1990-07-04 원본미기재 Manufacturing method of reinforced thermoplastic composite-metal foil laminate
JPH04329132A (en) * 1991-04-30 1992-11-17 Tonen Corp Hybrid prepreg
TW244340B (en) * 1992-07-21 1995-04-01 Akzo Nv

Also Published As

Publication number Publication date
AU694564B2 (en) 1998-07-23
MX9702059A (en) 1997-06-28
CA2200314A1 (en) 1996-03-28
EP0782500A1 (en) 1997-07-09
CN1158101A (en) 1997-08-27
AU3568495A (en) 1996-04-09
JPH10508720A (en) 1998-08-25
KR970705465A (en) 1997-10-09
WO1996009158A1 (en) 1996-03-28

Similar Documents

Publication Publication Date Title
TW371285B (en) Foiled UD-prepreg and PWB laminate prepared therefrom
RU2007115401A (en) THIN LAYERED LAMINATES
FI92303B (en) Process for making reinforced thermoplastic laminates and products made therefrom
EP0366979A3 (en) Improved interleaf layer in fiber reinforced resin laminate composites
CA2511571A1 (en) Manufacture of void-free laminates and use thereof
KR910018171A (en) Plastic laminate
ES8801499A1 (en) A laminate sheet and a process for making the sheet.
GB9101691D0 (en) Toughened resins and composites
EP1505103A3 (en) Advanced composites with thermoplastic particles at the interface between layers
ATE78225T1 (en) COMPOSITE LAMINATE OF METAL LAYERS AND PLASTIC LAYERS REINFORCED WITH CONTINUOUS THREADS.
ES8507383A1 (en) Process for producing an embossed multi-layer material
CA2350048A1 (en) Moulding materials
ATE137445T1 (en) COMPOSITE FILM
TW259925B (en)
JPS6248538A (en) Light-weight laminated structure and manufacture thereof
US7204906B2 (en) Method for laminating and forming a composite laminate in a single operation
GB1341500A (en) Production of laminated slabs
CA2081640A1 (en) Process for the preparation of fibre reinforced metal matrix composites and novel preforms therefor
WO1998026924A3 (en) Layered bullet-resistant and shock-resistant material
MXPA01008430A (en) Structural laminate and method of making the same.
JPS6123385Y2 (en)
EP0939099A3 (en) Prepregs, comprising only one of the reactive components, and composites derived from them
JPS6477533A (en) Inorganic composite molding material
JPS5857940A (en) Laminated board
JPS644628A (en) Copper-clad epoxy resin laminate