[go: up one dir, main page]

TW363242B - Vacuum chuck of semiconductor manufacturing apparatus - Google Patents

Vacuum chuck of semiconductor manufacturing apparatus

Info

Publication number
TW363242B
TW363242B TW085102907A TW85102907A TW363242B TW 363242 B TW363242 B TW 363242B TW 085102907 A TW085102907 A TW 085102907A TW 85102907 A TW85102907 A TW 85102907A TW 363242 B TW363242 B TW 363242B
Authority
TW
Taiwan
Prior art keywords
vacuum chuck
manufacturing apparatus
semiconductor manufacturing
vacuum
chuck
Prior art date
Application number
TW085102907A
Other languages
Chinese (zh)
Inventor
Yong-Su Kim
Byung-Hyo Jung
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW363242B publication Critical patent/TW363242B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

A vacuum chuck of a semiconductor manufacturing apparatus is used for holding a semiconductor wafer during the performance of a manufacturing process such as photolithography. The vacuum chuck has a base in which a pattern of vacuum holes are formed in at least two directions from the center of the vacuum chuck, respectively. Thus, the thickness uniformity of a coated material such as photoresist is enhanced. Also, fewer scratches are generated by forming the vacuum chuck of ceramic, which improves the operational efficiency of the vacuum chuck.
TW085102907A 1995-03-31 1996-03-11 Vacuum chuck of semiconductor manufacturing apparatus TW363242B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950007588A KR960035951A (en) 1995-03-31 1995-03-31 Vacuum chuck of semiconductor device

Publications (1)

Publication Number Publication Date
TW363242B true TW363242B (en) 1999-07-01

Family

ID=19411361

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085102907A TW363242B (en) 1995-03-31 1996-03-11 Vacuum chuck of semiconductor manufacturing apparatus

Country Status (3)

Country Link
JP (1) JPH08274149A (en)
KR (1) KR960035951A (en)
TW (1) TW363242B (en)

Also Published As

Publication number Publication date
JPH08274149A (en) 1996-10-18
KR960035951A (en) 1996-10-28

Similar Documents

Publication Publication Date Title
US5837093A (en) Apparatus for performing plain etching treatment
JP5566982B2 (en) Plasma processing equipment
EP1291910A4 (en) Wafer chuck, exposure system, and method of manufacturing semiconductor device
MY132081A (en) Method and apparatus for surface-grinding of workpiece
EP0414267A3 (en) Process for deposition of a tungsten layer on a semiconductor wafer
WO2003010799A3 (en) Plasma ashing process
EP0456479A3 (en) Pattern forming process, apparatus for forming said pattern and process for preparing semiconductor device utilizing said pattern forming process
TW375554B (en) Wafer holder for chemical and mechanical planarization machines
TW367530B (en) Multiple substrate processing apparatus for enhanced throughput
CA1157575A (en) Reducing charging effects in charged-particle-beam lithography
TW200508813A (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby
GB2375883A (en) A method and apparatus for implanting semiconductor wafer substrates
TW375765B (en) Method for reducing particles deposited onto a semiconductor wafer during plasma processing
TW363242B (en) Vacuum chuck of semiconductor manufacturing apparatus
EP0940844A3 (en) Integrated circuit fabrication
TW200515102A (en) A processing liquid coating apparatus and a processing liquid coating method
CA2077359A1 (en) X-ray mask and semiconductor device manufacturing method using the same
JPS5651732A (en) Exposure processing method
JPH11260895A (en) Wafer supporting apparatus for semiconductor
JPH03163848A (en) Vacuum suction base
TW330988B (en) The photomask structure of semiconductor lithography processes
KR19980034188A (en) Lower electrode plate of semiconductor etching equipment
WO2001078108A3 (en) Wafer chuck having piezoelectric elements and method
JPH03201429A (en) Wafer holder for vertical cvd device
JPS63179525A (en) Ashing apparatus