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TW359036B - Semiconductor memory - Google Patents

Semiconductor memory

Info

Publication number
TW359036B
TW359036B TW084110799A TW84110799A TW359036B TW 359036 B TW359036 B TW 359036B TW 084110799 A TW084110799 A TW 084110799A TW 84110799 A TW84110799 A TW 84110799A TW 359036 B TW359036 B TW 359036B
Authority
TW
Taiwan
Prior art keywords
wordlines
semiconductor substrate
semiconductor memory
memory
center
Prior art date
Application number
TW084110799A
Other languages
English (en)
Inventor
Narumi Sakashita
Kazutami Arimoto
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW359036B publication Critical patent/TW359036B/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • G11C11/4097Bit-line organisation, e.g. bit-line layout, folded bit lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/14Word line organisation; Word line lay-out
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/50Peripheral circuit region structures
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/18Bit line organisation; Bit line lay-out

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
  • Static Random-Access Memory (AREA)
TW084110799A 1995-09-06 1995-10-14 Semiconductor memory TW359036B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22917595A JP3434397B2 (ja) 1995-09-06 1995-09-06 半導体記憶装置

Publications (1)

Publication Number Publication Date
TW359036B true TW359036B (en) 1999-05-21

Family

ID=16887973

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084110799A TW359036B (en) 1995-09-06 1995-10-14 Semiconductor memory

Country Status (4)

Country Link
US (1) US6448602B1 (zh)
JP (1) JP3434397B2 (zh)
KR (1) KR970017618A (zh)
TW (1) TW359036B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11203862A (ja) * 1998-01-13 1999-07-30 Mitsubishi Electric Corp 半導体記憶装置
US6072743A (en) * 1998-01-13 2000-06-06 Mitsubishi Denki Kabushiki Kaisha High speed operable semiconductor memory device with memory blocks arranged about the center
JPH11214638A (ja) 1998-01-29 1999-08-06 Mitsubishi Electric Corp 半導体記憶装置
JPH11219598A (ja) * 1998-02-03 1999-08-10 Mitsubishi Electric Corp 半導体記憶装置
TW461079B (en) * 1999-02-08 2001-10-21 Sanyo Electric Co Semiconductor memory apparatus
JP2003100073A (ja) * 2001-09-25 2003-04-04 Mitsubishi Electric Corp 半導体記憶装置
US7123537B2 (en) * 2002-03-15 2006-10-17 Macronix International Co., Ltd. Decoder arrangement of a memory cell array
US7236420B2 (en) 2002-04-10 2007-06-26 Hynix Semiconductor Inc. Memory chip architecture having non-rectangular memory banks and method for arranging memory banks
DE102004017313A1 (de) * 2004-04-06 2005-07-28 Infineon Technologies Ag Halbleiterbauteil mit oberflächenmontierbaren Aussenkontakten und Verfahren zum Anordnen derartiger Aussenkontakte
JP4754235B2 (ja) * 2005-02-21 2011-08-24 Ntn株式会社 回転伝達装置
JP2007306012A (ja) * 2007-06-15 2007-11-22 Renesas Technology Corp ダイナミックランダムアクセスメモリおよび半導体記憶装置
JP4372189B2 (ja) 2007-12-27 2009-11-25 株式会社東芝 情報処理装置及び不揮発性半導体メモリドライブ
JP4679656B2 (ja) * 2009-08-31 2011-04-27 株式会社東芝 情報処理装置及び不揮発性半導体メモリドライブ
KR102127966B1 (ko) * 2013-12-20 2020-06-30 에스케이하이닉스 주식회사 반도체 장치
CN112634955A (zh) 2019-09-24 2021-04-09 长鑫存储技术有限公司 Dram存储器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0658947B2 (ja) * 1984-02-24 1994-08-03 株式会社日立製作所 半導体メモリ装置の製法
JPS62180594A (ja) 1986-02-04 1987-08-07 Fujitsu Ltd 半導体記憶装置
US4864381A (en) * 1986-06-23 1989-09-05 Harris Corporation Hierarchical variable die size gate array architecture
JP2675659B2 (ja) * 1990-08-10 1997-11-12 株式会社東芝 集積回路のセルレイアウト方法
JPH04129089A (ja) * 1990-09-19 1992-04-30 Mitsubishi Electric Corp ダイナミック型半導体記憶装置
US5214657A (en) * 1990-09-21 1993-05-25 Micron Technology, Inc. Method for fabricating wafer-scale integration wafers and method for utilizing defective wafer-scale integration wafers
JP3299260B2 (ja) * 1990-10-10 2002-07-08 株式会社日立製作所 半導体集積回路装置
JPH06244282A (ja) 1993-02-15 1994-09-02 Nec Corp 半導体集積回路装置
KR950010628B1 (ko) * 1993-08-20 1995-09-20 현대전자산업주식회사 반도체 소자의 컬럼 디코더 인에이블 신호 발생회로

Also Published As

Publication number Publication date
KR970017618A (ko) 1997-04-30
US6448602B1 (en) 2002-09-10
JPH0974171A (ja) 1997-03-18
JP3434397B2 (ja) 2003-08-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees