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TW354420B - The structure of a metal inner connecting line and the method for arranging the same - Google Patents

The structure of a metal inner connecting line and the method for arranging the same

Info

Publication number
TW354420B
TW354420B TW086101562A TW86101562A TW354420B TW 354420 B TW354420 B TW 354420B TW 086101562 A TW086101562 A TW 086101562A TW 86101562 A TW86101562 A TW 86101562A TW 354420 B TW354420 B TW 354420B
Authority
TW
Taiwan
Prior art keywords
inner connecting
connecting line
metal inner
gate array
line
Prior art date
Application number
TW086101562A
Other languages
English (en)
Inventor
Noriaki Shinagawa
Original Assignee
Oki Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Ind Co Ltd filed Critical Oki Electric Ind Co Ltd
Application granted granted Critical
Publication of TW354420B publication Critical patent/TW354420B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5225—Shielding layers formed together with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
TW086101562A 1996-02-22 1997-02-12 The structure of a metal inner connecting line and the method for arranging the same TW354420B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8034635A JPH09232435A (ja) 1996-02-22 1996-02-22 半導体集積回路

Publications (1)

Publication Number Publication Date
TW354420B true TW354420B (en) 1999-03-11

Family

ID=12419876

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086101562A TW354420B (en) 1996-02-22 1997-02-12 The structure of a metal inner connecting line and the method for arranging the same

Country Status (7)

Country Link
US (1) US5886371A (zh)
EP (1) EP0791963B1 (zh)
JP (1) JPH09232435A (zh)
KR (1) KR100336155B1 (zh)
CN (1) CN1085410C (zh)
DE (1) DE69728805T2 (zh)
TW (1) TW354420B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI480977B (zh) * 2007-04-09 2015-04-11 Harvard College 銅內連線用的氮化鈷層及其製造方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6786420B1 (en) 1997-07-15 2004-09-07 Silverbrook Research Pty. Ltd. Data distribution mechanism in the form of ink dots on cards
TW399319B (en) * 1997-03-19 2000-07-21 Hitachi Ltd Semiconductor device
US6547364B2 (en) * 1997-07-12 2003-04-15 Silverbrook Research Pty Ltd Printing cartridge with an integrated circuit device
US6618117B2 (en) 1997-07-12 2003-09-09 Silverbrook Research Pty Ltd Image sensing apparatus including a microcontroller
AUPO850597A0 (en) 1997-08-11 1997-09-04 Silverbrook Research Pty Ltd Image processing method and apparatus (art01a)
US6985207B2 (en) 1997-07-15 2006-01-10 Silverbrook Research Pty Ltd Photographic prints having magnetically recordable media
US7110024B1 (en) 1997-07-15 2006-09-19 Silverbrook Research Pty Ltd Digital camera system having motion deblurring means
US6879341B1 (en) 1997-07-15 2005-04-12 Silverbrook Research Pty Ltd Digital camera system containing a VLIW vector processor
US20040119829A1 (en) 1997-07-15 2004-06-24 Silverbrook Research Pty Ltd Printhead assembly for a print on demand digital camera system
AUPO802797A0 (en) 1997-07-15 1997-08-07 Silverbrook Research Pty Ltd Image processing method and apparatus (ART54)
US6624848B1 (en) 1997-07-15 2003-09-23 Silverbrook Research Pty Ltd Cascading image modification using multiple digital cameras incorporating image processing
US6690419B1 (en) 1997-07-15 2004-02-10 Silverbrook Research Pty Ltd Utilising eye detection methods for image processing in a digital image camera
US6166403A (en) * 1997-11-12 2000-12-26 Lsi Logic Corporation Integrated circuit having embedded memory with electromagnetic shield
AUPP702098A0 (en) 1998-11-09 1998-12-03 Silverbrook Research Pty Ltd Image creation method and apparatus (ART73)
AUPQ056099A0 (en) 1999-05-25 1999-06-17 Silverbrook Research Pty Ltd A method and apparatus (pprint01)
US6492736B1 (en) * 2001-03-14 2002-12-10 Lsi Logic Corporation Power mesh bridge
JP2003273231A (ja) * 2002-03-19 2003-09-26 Fujitsu Ltd 半導体集積回路のシールド構造
JP2004031389A (ja) * 2002-06-21 2004-01-29 Fujitsu Ltd 半導体回路設計方法、半導体回路設計装置、プログラム及び半導体装置
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US8530880B2 (en) * 2009-07-27 2013-09-10 Hewlett-Packard Development Company, L.P. Reconfigurable multilayer circuit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6197849A (ja) * 1984-10-18 1986-05-16 Fujitsu Ltd ゲ−トアレイｌｓｉ装置
KR920005863B1 (ko) * 1988-08-12 1992-07-23 산요덴끼 가부시끼가이샤 반도체 집적회로
JPH02106968A (ja) * 1988-10-17 1990-04-19 Hitachi Ltd 半導体集積回路装置及びその形成方法
US5321280A (en) * 1990-09-13 1994-06-14 Nec Corporation Composite semiconductor integrated circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI480977B (zh) * 2007-04-09 2015-04-11 Harvard College 銅內連線用的氮化鈷層及其製造方法

Also Published As

Publication number Publication date
US5886371A (en) 1999-03-23
DE69728805D1 (de) 2004-06-03
KR970063679A (ko) 1997-09-12
CN1169035A (zh) 1997-12-31
CN1085410C (zh) 2002-05-22
JPH09232435A (ja) 1997-09-05
EP0791963B1 (en) 2004-04-28
EP0791963A1 (en) 1997-08-27
KR100336155B1 (ko) 2002-09-18
DE69728805T2 (de) 2005-04-21

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