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TW350116B - A semiconductor device and the manufacturing method - Google Patents

A semiconductor device and the manufacturing method

Info

Publication number
TW350116B
TW350116B TW085106607A TW85106607A TW350116B TW 350116 B TW350116 B TW 350116B TW 085106607 A TW085106607 A TW 085106607A TW 85106607 A TW85106607 A TW 85106607A TW 350116 B TW350116 B TW 350116B
Authority
TW
Taiwan
Prior art keywords
film
conductive film
semiconductor device
manufacturing
contact
Prior art date
Application number
TW085106607A
Other languages
English (en)
Inventor
Keiko Kushida
Masahiko Hiratani
Kazuyoshi Torii
Shinichiro Takatani
Hiroshi Miki
Yoshihisa Fujisaki
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW350116B publication Critical patent/TW350116B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/033Making the capacitor or connections thereto the capacitor extending over the transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/682Capacitors having no potential barriers having dielectrics comprising perovskite structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/315DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/48Data lines or contacts therefor
    • H10B12/485Bit line contacts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW085106607A 1996-03-08 1996-06-03 A semiconductor device and the manufacturing method TW350116B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1996/000579 WO1997033316A1 (en) 1996-03-08 1996-03-08 Semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
TW350116B true TW350116B (en) 1999-01-11

Family

ID=14153014

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085106607A TW350116B (en) 1996-03-08 1996-06-03 A semiconductor device and the manufacturing method

Country Status (4)

Country Link
US (1) US6144052A (zh)
KR (1) KR100275853B1 (zh)
TW (1) TW350116B (zh)
WO (1) WO1997033316A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6678585B1 (en) * 1999-09-28 2004-01-13 Pavilion Technologies, Inc. Method and apparatus for maximizing power usage in a power plant
US6259126B1 (en) * 1999-11-23 2001-07-10 International Business Machines Corporation Low cost mixed memory integration with FERAM
DE60220912T2 (de) * 2001-05-07 2008-02-28 Advanced Micro Devices, Inc., Sunnyvale Speichervorrichtung mit einem sich selbst einbauenden polymer und verfahren zur herstellung derselben
US6900487B2 (en) * 2001-06-29 2005-05-31 Oki Electric Industry Co., Ltd. Wiring layer structure for ferroelectric capacitor
JP4005805B2 (ja) * 2001-12-17 2007-11-14 株式会社東芝 半導体装置
JP4601896B2 (ja) * 2002-10-30 2010-12-22 富士通セミコンダクター株式会社 半導体装置及びその製造方法
KR100967110B1 (ko) 2003-06-30 2010-07-05 주식회사 하이닉스반도체 하부층의 배향성을 따르는 강유전체막 형성 방법 및 그를이용한 강유전체 캐패시터 형성 방법
CN101238573B (zh) * 2005-08-15 2012-05-30 富士通半导体股份有限公司 半导体器件及其制造方法
JP2007227500A (ja) 2006-02-22 2007-09-06 Seiko Epson Corp 半導体記憶装置および半導体記憶装置の製造方法
JP4730541B2 (ja) * 2006-03-15 2011-07-20 セイコーエプソン株式会社 強誘電体メモリおよびその製造方法
JP4858685B2 (ja) * 2006-03-15 2012-01-18 セイコーエプソン株式会社 強誘電体メモリおよびその製造方法
JP4683224B2 (ja) * 2006-03-15 2011-05-18 セイコーエプソン株式会社 強誘電体メモリの製造方法
JP4697437B2 (ja) * 2006-03-24 2011-06-08 セイコーエプソン株式会社 強誘電体メモリおよびその製造方法
US20080137262A1 (en) * 2006-12-12 2008-06-12 Texas Instruments Inc. Methods and systems for capacitors

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199746A (ja) * 1990-11-29 1992-07-20 Matsushita Electric Ind Co Ltd 薄膜強誘電体の製造方法
JPH06120423A (ja) * 1992-10-06 1994-04-28 Hitachi Ltd 半導体装置およびその製造方法
JP3407409B2 (ja) * 1994-07-27 2003-05-19 富士通株式会社 高誘電率薄膜の製造方法
JP3466851B2 (ja) * 1997-01-20 2003-11-17 株式会社東芝 半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR19990087370A (ko) 1999-12-27
US6144052A (en) 2000-11-07
KR100275853B1 (ko) 2001-02-01
WO1997033316A1 (en) 1997-09-12

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