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TW341726B - Flip-chip type connection with elastic contacts - Google Patents

Flip-chip type connection with elastic contacts

Info

Publication number
TW341726B
TW341726B TW086100963A TW86100963A TW341726B TW 341726 B TW341726 B TW 341726B TW 086100963 A TW086100963 A TW 086100963A TW 86100963 A TW86100963 A TW 86100963A TW 341726 B TW341726 B TW 341726B
Authority
TW
Taiwan
Prior art keywords
flip
type connection
chip type
elastic contacts
chip
Prior art date
Application number
TW086100963A
Other languages
English (en)
Inventor
Hesselbom Hjalmar
Bodo Peter
Hentzell Hans
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Application granted granted Critical
Publication of TW341726B publication Critical patent/TW341726B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/1319—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L2924/102—Material of the semiconductor or solid state bodies
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    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/1025—Semiconducting materials
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
TW086100963A 1996-12-19 1997-01-29 Flip-chip type connection with elastic contacts TW341726B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9604676A SE516748C2 (sv) 1996-12-19 1996-12-19 Sammansättningsstruktur innefattande minst ett flip-chip och ett substrat

Publications (1)

Publication Number Publication Date
TW341726B true TW341726B (en) 1998-10-01

Family

ID=20405042

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086100963A TW341726B (en) 1996-12-19 1997-01-29 Flip-chip type connection with elastic contacts

Country Status (6)

Country Link
JP (1) JP2001506413A (zh)
KR (1) KR20000069626A (zh)
CN (1) CN1156003C (zh)
CA (1) CA2275523A1 (zh)
SE (1) SE516748C2 (zh)
TW (1) TW341726B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI228959B (en) * 2002-07-05 2005-03-01 J S T Mfg Co Ltd Connector, method for manufacturing the same, and wiring board structure employing the connector
US7005751B2 (en) * 2003-04-10 2006-02-28 Formfactor, Inc. Layered microelectronic contact and method for fabricating same
CN100591181C (zh) * 2007-08-24 2010-02-17 武汉华灿光电有限公司 倒装焊发光二极管芯片的制造方法
CN103180944A (zh) 2010-10-25 2013-06-26 松下电器产业株式会社 电子元件的接合方式
CN105185724B (zh) * 2014-05-30 2019-03-01 无锡华润安盛科技有限公司 一种用于倒装芯片装片工艺的垫块、机器和倒装芯片的方法
WO2023163433A1 (ko) * 2022-02-24 2023-08-31 삼성전자주식회사 디스플레이 모듈의 리페어 방법

Also Published As

Publication number Publication date
SE9604676L (sv) 1998-06-20
SE9604676D0 (sv) 1996-12-19
KR20000069626A (ko) 2000-11-25
CA2275523A1 (en) 1998-06-25
SE516748C2 (sv) 2002-02-26
CN1246202A (zh) 2000-03-01
CN1156003C (zh) 2004-06-30
JP2001506413A (ja) 2001-05-15

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