TW340133B - Room-temperature stable, one-component, flexible epoxy adhesives - Google Patents
Room-temperature stable, one-component, flexible epoxy adhesivesInfo
- Publication number
- TW340133B TW340133B TW085109713A TW85109713A TW340133B TW 340133 B TW340133 B TW 340133B TW 085109713 A TW085109713 A TW 085109713A TW 85109713 A TW85109713 A TW 85109713A TW 340133 B TW340133 B TW 340133B
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- parts
- room
- component
- temperature stable
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4035—Hydrazines; Hydrazides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50410595A | 1995-07-19 | 1995-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW340133B true TW340133B (en) | 1998-09-11 |
Family
ID=24004865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085109713A TW340133B (en) | 1995-07-19 | 1996-08-09 | Room-temperature stable, one-component, flexible epoxy adhesives |
Country Status (6)
Country | Link |
---|---|
US (1) | US6723803B1 (zh) |
EP (1) | EP0754742B1 (zh) |
KR (1) | KR100189282B1 (zh) |
DE (1) | DE69616187T2 (zh) |
HK (1) | HK1012670A1 (zh) |
TW (1) | TW340133B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7662468B2 (en) * | 2000-10-06 | 2010-02-16 | Brock Usa, Llc | Composite materials made from pretreated, adhesive coated beads |
EP1359202A1 (de) * | 2002-05-03 | 2003-11-05 | Sika Schweiz AG | Hitze-härtbare Epoxydharzzusammensetzung |
US20040072927A1 (en) * | 2002-10-14 | 2004-04-15 | Hachikian Zakar Raffi | Two-part epoxy adhesives with improved flexibility and process for making and using same |
EP1431325A1 (de) * | 2002-12-17 | 2004-06-23 | Sika Technology AG | Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit |
US7314091B2 (en) * | 2003-09-24 | 2008-01-01 | Weatherford/Lamb, Inc. | Cement-through, tubing retrievable safety valve |
KR20060051761A (ko) * | 2004-09-29 | 2006-05-19 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 아크릴계 접착제 조성물 및 아크릴계 접착제 시트 |
EP1741734A1 (de) * | 2005-07-05 | 2007-01-10 | Sika Technology AG | Tieftemperaturschlagzähe hitze-härtbare Epoxidharzzusammensetzung mit Epoxidfestharzen |
JP2007258682A (ja) * | 2006-02-24 | 2007-10-04 | Sanyo Electric Co Ltd | フレキシブル基板 |
SG174142A1 (en) * | 2009-02-25 | 2011-10-28 | 3M Innovative Properties Co | Article with gasket having moisture transmission resistivity and method |
DE102009028100A1 (de) * | 2009-07-29 | 2011-02-03 | Henkel Ag & Co. Kgaa | Schlagzähmodifizierte Zusammensetzung auf Epoxidharzbasis |
GB2475066A (en) * | 2009-11-04 | 2011-05-11 | Hexcel Composites Ltd | Curing a syntactic paste to produce a syntactic foam |
US9334432B2 (en) | 2013-11-20 | 2016-05-10 | Ppg Industries Ohio, Inc. | Curable compositions that include hydrazide functional materials |
US10308757B2 (en) * | 2014-11-11 | 2019-06-04 | Dow Global Technologies Llc | Fast curing high glass transition temperature epoxy resin system |
GB2549405B (en) * | 2015-01-16 | 2021-09-22 | Halliburton Energy Services Inc | Hydrazide-based curing agents for use in subterranean operations |
WO2017179536A1 (ja) * | 2016-04-12 | 2017-10-19 | 株式会社カネカ | 硬化性組成物及び接着剤 |
CN110591292B (zh) * | 2019-09-29 | 2022-05-13 | 烟台德邦科技股份有限公司 | 一种表面绝缘电阻高的底部填充胶及其制备方法 |
CN112625631A (zh) * | 2020-12-18 | 2021-04-09 | 武汉艾科滤膜技术有限公司 | 一种用于超滤膜膜丝根部保护的环氧基软胶 |
CN118048122A (zh) * | 2024-03-13 | 2024-05-17 | 宁波峰梅化学科技有限公司 | 一种单组分环氧结构胶及其制备方法和应用 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2847395A (en) * | 1955-06-13 | 1958-08-12 | Minnesota Mining & Mfg | Stable heat-curing epoxy resin compositions |
DE1079833B (de) * | 1956-03-12 | 1960-04-14 | Minnesota Mining & Mfg | Verwendung von latenten Haertungsmitteln fuer Epoxyharze |
US4268656A (en) * | 1980-01-16 | 1981-05-19 | National Starch And Chemical Corporation | Co-curing agents for epoxy resins |
US4360649A (en) * | 1980-04-30 | 1982-11-23 | Sumitomo Chemical Company, Limited | Curable composition |
JPS5967256A (ja) * | 1982-10-12 | 1984-04-16 | Ajinomoto Co Inc | 新規なヒドラジド及びその化合物からなるエポキシ樹脂用潜在性硬化剤 |
GB8330649D0 (en) * | 1983-11-17 | 1983-12-29 | Ciba Geigy Ag | Use of one-component epoxy resin coating material |
GB2164944B (en) * | 1984-08-01 | 1988-06-08 | Toho Rayon Kk | Prepregs and method for production thereof |
EP0200678B1 (de) * | 1985-04-02 | 1990-09-12 | Ciba-Geigy Ag | Verfahren zum Verkleben von Oberflächen mit einem härtbaren Epoxidharzgemisch |
US4866108A (en) * | 1988-01-19 | 1989-09-12 | Hughes Aircraft Company | Flexible epoxy adhesive blend |
US4956411A (en) * | 1988-02-05 | 1990-09-11 | Mitsubishi Rayon Company, Ltd. | Epoxy resin composition for composite material from m- or o-substituted triglycidylaminophenols, diaminodiphenylsulfone and latent curing agents |
ATE123502T1 (de) * | 1988-07-09 | 1995-06-15 | Ciba Geigy Ag | Härtbare epoxydharzzusammensetzungen. |
GB8824391D0 (en) * | 1988-10-18 | 1988-11-23 | Ciba Geigy Ag | Compositions |
US5201248A (en) * | 1989-09-19 | 1993-04-13 | Sumitomo Bakelite Company Limited | Materials for balancing rotators and method for balancing rotators |
JPH07119273B2 (ja) * | 1990-05-30 | 1995-12-20 | ソマール株式会社 | エポキシ樹脂組成物の製造方法 |
DE69229262T2 (de) * | 1992-03-16 | 2000-01-20 | Raytheon Co., Lexington | Wärmetransferklebstoff |
-
1996
- 1996-07-18 EP EP96111579A patent/EP0754742B1/en not_active Expired - Lifetime
- 1996-07-18 KR KR1019960028963A patent/KR100189282B1/ko not_active IP Right Cessation
- 1996-07-18 DE DE69616187T patent/DE69616187T2/de not_active Expired - Lifetime
- 1996-08-09 TW TW085109713A patent/TW340133B/zh not_active IP Right Cessation
- 1996-08-20 US US08/700,133 patent/US6723803B1/en not_active Expired - Fee Related
-
1998
- 1998-12-18 HK HK98114055A patent/HK1012670A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0754742A2 (en) | 1997-01-22 |
KR100189282B1 (ko) | 1999-06-01 |
EP0754742A3 (en) | 1997-07-02 |
EP0754742B1 (en) | 2001-10-24 |
KR970006450A (ko) | 1997-02-21 |
DE69616187T2 (de) | 2002-07-11 |
DE69616187D1 (de) | 2001-11-29 |
US6723803B1 (en) | 2004-04-20 |
HK1012670A1 (en) | 1999-08-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |