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TW325901U - Modular heat dissipating device for notebook computer - Google Patents

Modular heat dissipating device for notebook computer

Info

Publication number
TW325901U
TW325901U TW086202418U TW86202418U TW325901U TW 325901 U TW325901 U TW 325901U TW 086202418 U TW086202418 U TW 086202418U TW 86202418 U TW86202418 U TW 86202418U TW 325901 U TW325901 U TW 325901U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
notebook computer
dissipating device
modular heat
modular
Prior art date
Application number
TW086202418U
Other languages
Chinese (zh)
Inventor
Qi-Ren Wang
Original Assignee
Tennmax Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tennmax Inc filed Critical Tennmax Inc
Priority to TW086202418U priority Critical patent/TW325901U/en
Publication of TW325901U publication Critical patent/TW325901U/en

Links

TW086202418U 1997-02-14 1997-02-14 Modular heat dissipating device for notebook computer TW325901U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086202418U TW325901U (en) 1997-02-14 1997-02-14 Modular heat dissipating device for notebook computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086202418U TW325901U (en) 1997-02-14 1997-02-14 Modular heat dissipating device for notebook computer

Publications (1)

Publication Number Publication Date
TW325901U true TW325901U (en) 1998-01-21

Family

ID=54627992

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086202418U TW325901U (en) 1997-02-14 1997-02-14 Modular heat dissipating device for notebook computer

Country Status (1)

Country Link
TW (1) TW325901U (en)

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