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TW252263B - - Google Patents

Info

Publication number
TW252263B
TW252263B TW083101350A TW83101350A TW252263B TW 252263 B TW252263 B TW 252263B TW 083101350 A TW083101350 A TW 083101350A TW 83101350 A TW83101350 A TW 83101350A TW 252263 B TW252263 B TW 252263B
Authority
TW
Taiwan
Application number
TW083101350A
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of TW252263B publication Critical patent/TW252263B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
TW083101350A 1993-02-16 1994-02-18 TW252263B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/025,635 US5344592A (en) 1993-02-16 1993-02-16 Organic vehicle for electronic composition

Publications (1)

Publication Number Publication Date
TW252263B true TW252263B (zh) 1995-07-21

Family

ID=21827208

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083101350A TW252263B (zh) 1993-02-16 1994-02-18

Country Status (4)

Country Link
US (2) US5344592A (zh)
EP (1) EP0611627A3 (zh)
JP (1) JPH06315792A (zh)
TW (1) TW252263B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398474B (zh) * 2005-08-25 2013-06-11 Henkel Ag & Co Kgaa 作為底填料組成物之助熔與加速劑之喹啉類化合物

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5344592A (en) * 1993-02-16 1994-09-06 E. I. Du Pont De Nemours And Company Organic vehicle for electronic composition
JP2677161B2 (ja) * 1993-07-08 1997-11-17 双葉電子工業株式会社 蛍光表示管
JPH0822714A (ja) * 1994-07-08 1996-01-23 Murata Mfg Co Ltd 導電ペーストおよびそれを用いた半導体セラミック部品
US5518663A (en) * 1994-12-06 1996-05-21 E. I. Du Pont De Nemours And Company Thick film conductor compositions with improved adhesion
JP3454065B2 (ja) * 1997-01-29 2003-10-06 株式会社村田製作所 誘電体ペーストおよびそれを用いた厚膜コンデンサ
TW434577B (en) * 1998-06-18 2001-05-16 Futaba Denshi Kogyo Kk Aluminum paste for fluorescent display device, fluorescent display device using aluminum paste and method for manufacturing the same
US6224965B1 (en) 1999-06-25 2001-05-01 Honeywell International Inc. Microfiber dielectrics which facilitate laser via drilling
US6245696B1 (en) 1999-06-25 2001-06-12 Honeywell International Inc. Lasable bond-ply materials for high density printed wiring boards
EP1100123A1 (en) 1999-11-09 2001-05-16 Corning Incorporated Dip formation of flip-chip solder bumps
US6527164B1 (en) * 2000-05-31 2003-03-04 Advanced Micro Devices, Inc. Removing flux residue from reflow furnace using active gaseous solvent
FR2811922B1 (fr) * 2000-07-20 2003-01-10 Optoform Sarl Procedes De Prot Composition de pate chargee de poudre metallique, procede d'obtention de produits metalliques a partir de ladite composition, et produit metallique obtenu selon ledit procede
JP2002096194A (ja) * 2000-09-21 2002-04-02 Advantest Corp Ｐｂを含まないＳｎ合金系ハンダ用フラックス
US6474536B1 (en) * 2000-09-28 2002-11-05 Peter Kukanskis Flux composition and corresponding soldering method
GB2380964B (en) * 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
EP1807370A1 (en) * 2004-09-24 2007-07-18 E.I. Dupont De Nemours And Company Sealing compositions
JP2012041387A (ja) * 2010-08-12 2012-03-01 Idemitsu Kosan Co Ltd α置換ビニル基含有芳香族化合物及びその重合体
US20140048749A1 (en) * 2012-08-16 2014-02-20 Nthdegree Technologies Worldwide Inc. Conductive Ink Composition
US9892816B2 (en) * 2013-06-27 2018-02-13 Heraeus Precious Metals North America Conshohocken Llc Platinum containing conductive paste
US9837484B2 (en) * 2015-05-27 2017-12-05 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming substrate including embedded component with symmetrical structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1506747A (fr) * 1965-12-27 1967-12-22 Shell Int Research Fluide de brasage
US4504007A (en) * 1982-09-14 1985-03-12 International Business Machines Corporation Solder and braze fluxes and processes for using the same
DD247346A3 (de) * 1985-12-13 1987-07-08 Veb Uhrenwerke Ruhla,Dd Flussmittel
US5223033A (en) * 1990-07-02 1993-06-29 Cookson Group Plc Paste formulations for use in the electronics industry
US5344592A (en) * 1993-02-16 1994-09-06 E. I. Du Pont De Nemours And Company Organic vehicle for electronic composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398474B (zh) * 2005-08-25 2013-06-11 Henkel Ag & Co Kgaa 作為底填料組成物之助熔與加速劑之喹啉類化合物

Also Published As

Publication number Publication date
JPH06315792A (ja) 1994-11-15
US5397383A (en) 1995-03-14
EP0611627A2 (en) 1994-08-24
EP0611627A3 (en) 1995-05-03
US5344592A (en) 1994-09-06

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