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TW252061B - Process of undergoing diffusion bonding under low pressure - Google Patents

Process of undergoing diffusion bonding under low pressure

Info

Publication number
TW252061B
TW252061B TW83106638A TW83106638A TW252061B TW 252061 B TW252061 B TW 252061B TW 83106638 A TW83106638 A TW 83106638A TW 83106638 A TW83106638 A TW 83106638A TW 252061 B TW252061 B TW 252061B
Authority
TW
Taiwan
Prior art keywords
diffusion bonding
low pressure
under low
bonding under
undergoing
Prior art date
Application number
TW83106638A
Other languages
Chinese (zh)
Inventor
Dong-Hann Chang
Ming-Shiun Yeh
Original Assignee
Dong-Hann Chang
Ming-Shiun Yeh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dong-Hann Chang, Ming-Shiun Yeh filed Critical Dong-Hann Chang
Priority to TW83106638A priority Critical patent/TW252061B/en
Application granted granted Critical
Publication of TW252061B publication Critical patent/TW252061B/en

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

A process of undergoing diffusion bonding under low pressure, which comprises the steps of : providing a first material which is to be bonded; providing a second material which is to be bonded; putting a thin plate of super plastic material, which can undergo diffusion bonding with the first material and the second material, between the first material and the second material; and applying specific diffusion bonding temperature and specific diffusion bonding pressure on the first material and the second material in direction perpendicular to the thin plate plane for a specific diffusion bonding time to allow the first material and the second material boding together.
TW83106638A 1994-07-20 1994-07-20 Process of undergoing diffusion bonding under low pressure TW252061B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW83106638A TW252061B (en) 1994-07-20 1994-07-20 Process of undergoing diffusion bonding under low pressure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW83106638A TW252061B (en) 1994-07-20 1994-07-20 Process of undergoing diffusion bonding under low pressure

Publications (1)

Publication Number Publication Date
TW252061B true TW252061B (en) 1995-07-21

Family

ID=51401397

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83106638A TW252061B (en) 1994-07-20 1994-07-20 Process of undergoing diffusion bonding under low pressure

Country Status (1)

Country Link
TW (1) TW252061B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9968012B2 (en) 2012-10-16 2018-05-08 Mitsubishi Materials Corporation Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate
US10011093B2 (en) 2012-09-21 2018-07-03 Mitsubishi Materials Corporation Bonding structure of aluminum member and copper member

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10011093B2 (en) 2012-09-21 2018-07-03 Mitsubishi Materials Corporation Bonding structure of aluminum member and copper member
US9968012B2 (en) 2012-10-16 2018-05-08 Mitsubishi Materials Corporation Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent