TW244394B - - Google Patents
Info
- Publication number
- TW244394B TW244394B TW082111009A TW82111009A TW244394B TW 244394 B TW244394 B TW 244394B TW 082111009 A TW082111009 A TW 082111009A TW 82111009 A TW82111009 A TW 82111009A TW 244394 B TW244394 B TW 244394B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/85—Complementary IGFETs, e.g. CMOS
- H10D84/856—Complementary IGFETs, e.g. CMOS the complementary IGFETs having different architectures than each other, e.g. high-voltage and low-voltage CMOS
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/971,382 US5446300A (en) | 1992-11-04 | 1992-11-04 | Semiconductor device configuration with multiple HV-LDMOS transistors and a floating well circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW244394B true TW244394B (zh) | 1995-04-01 |
Family
ID=25518309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082111009A TW244394B (zh) | 1992-11-04 | 1993-12-27 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5446300A (zh) |
| EP (1) | EP0596565B1 (zh) |
| JP (1) | JPH06260601A (zh) |
| DE (1) | DE69329097T2 (zh) |
| TW (1) | TW244394B (zh) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69207410T2 (de) * | 1992-09-18 | 1996-08-29 | Cons Ric Microelettronica | Monolithisch integrierte Brückenschaltung mit Transistoren und entsprechendes Herstellungsverfahren |
| JP4013785B2 (ja) * | 1995-04-12 | 2007-11-28 | 富士電機デバイステクノロジー株式会社 | 高耐圧ｉｃ |
| JP4775357B2 (ja) * | 1995-04-12 | 2011-09-21 | 富士電機株式会社 | 高耐圧ｉｃ |
| JP3565181B2 (ja) * | 1995-06-28 | 2004-09-15 | 富士電機デバイステクノロジー株式会社 | 高耐圧ｉｃ |
| JP3228093B2 (ja) * | 1995-06-28 | 2001-11-12 | 富士電機株式会社 | 高耐圧ｉｃ |
| EP0780900B1 (en) * | 1995-12-19 | 2003-04-02 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno - CoRiMMe | Monolithic semiconductor device having an edge structure and method for producing said structure |
| JP3917211B2 (ja) * | 1996-04-15 | 2007-05-23 | 三菱電機株式会社 | 半導体装置 |
| EP0977264B1 (en) * | 1998-07-31 | 2006-04-26 | Freescale Semiconductor, Inc. | Semiconductor structure for driver circuits with level shifting |
| DE19919130B4 (de) * | 1999-04-27 | 2005-10-06 | Infineon Technologies Ag | Monolithisch integrierte Halbleiteranordnung mit einem Steuerbereich und einem spannungsaufnehmenden Bereich |
| US6184700B1 (en) | 1999-05-25 | 2001-02-06 | Lucent Technologies, Inc. | Fail safe buffer capable of operating with a mixed voltage core |
| JP4610786B2 (ja) * | 2001-02-20 | 2011-01-12 | 三菱電機株式会社 | 半導体装置 |
| US6642583B2 (en) | 2001-06-11 | 2003-11-04 | Fuji Electric Co., Ltd. | CMOS device with trench structure |
| JP4545548B2 (ja) * | 2004-10-21 | 2010-09-15 | ルネサスエレクトロニクス株式会社 | 半導体集積回路及び半導体装置 |
| WO2007035862A2 (en) * | 2005-09-21 | 2007-03-29 | International Rectifier Corporation | Semiconductor package |
| KR101463076B1 (ko) * | 2008-03-28 | 2014-12-05 | 페어차일드코리아반도체 주식회사 | 레벨 시프트 소자들을 구비하는 고압 반도체소자 및 그의제조방법 |
| US8207580B2 (en) * | 2009-05-29 | 2012-06-26 | Power Integrations, Inc. | Power integrated circuit device with incorporated sense FET |
| TWI448055B (zh) | 2010-06-07 | 2014-08-01 | Richtek Technology Corp | 切換式電源供應器之控制電路及其控制方法以及用於其中之電晶體元件 |
| JP6379509B2 (ja) * | 2014-02-18 | 2018-08-29 | セイコーエプソン株式会社 | 回路装置及び電子機器 |
| TWI595653B (zh) * | 2016-09-13 | 2017-08-11 | 立積電子股份有限公司 | 用於增加信號振幅範圍的電晶體 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1358573A (fr) * | 1963-03-06 | 1964-04-17 | Csf | Circuit électrique intégré |
| JPS58135666A (ja) * | 1983-01-14 | 1983-08-12 | Hitachi Ltd | 高耐圧半導体装置 |
| US4678936A (en) * | 1984-02-17 | 1987-07-07 | Analog Devices, Incorporated | MOS-cascoded bipolar current sources in non-epitaxial structure |
| US4661838A (en) * | 1985-10-24 | 1987-04-28 | General Electric Company | High voltage semiconductor devices electrically isolated from an integrated circuit substrate |
| IT1213027B (it) * | 1986-01-24 | 1989-12-07 | Sgs Microelettrica Spa | Densita'.!circuito integrato a semiconduttore, in particolare del tipo comprendente dispositivi ad alta tensione e dispositivi di elaborazione di segnale ad alta |
| IT1188465B (it) * | 1986-03-27 | 1988-01-14 | Sgs Microelettronica Spa | Rpocedimento per la fabbricazione di circuiti integrati a semiconduttore includenti dispositiv cmos e dispositivi elettronici ad alta tensione |
| JPH0812918B2 (ja) * | 1986-03-28 | 1996-02-07 | 株式会社東芝 | 半導体装置の製造方法 |
| JPH0691193B2 (ja) * | 1986-07-11 | 1994-11-14 | 株式会社日立マイコンシステム | 半導体装置 |
| JPS63153910A (ja) * | 1986-12-17 | 1988-06-27 | Nec Corp | レベルシフト回路 |
| DE3856174T2 (de) * | 1987-10-27 | 1998-09-03 | Nippon Electric Co | Halbleiteranordnung mit einem isolierten vertikalen Leistungs-MOSFET. |
| IT1235843B (it) * | 1989-06-14 | 1992-11-03 | Sgs Thomson Microelectronics | Dispositivo integrato contenente strutture di potenza formate con transistori ldmos complementari, strutture cmos e pnp verticali con aumentata capacita' di supportare un'alta tensione di alimentazione. |
| US5003362A (en) * | 1989-07-28 | 1991-03-26 | Dallas Semiconductor Corporation | Integrated circuit with high-impedance well tie |
| US5192989A (en) * | 1989-11-28 | 1993-03-09 | Nissan Motor Co., Ltd. | Lateral dmos fet device with reduced on resistance |
| US5386136A (en) * | 1991-05-06 | 1995-01-31 | Siliconix Incorporated | Lightly-doped drain MOSFET with improved breakdown characteristics |
| US5146298A (en) * | 1991-08-16 | 1992-09-08 | Eklund Klas H | Device which functions as a lateral double-diffused insulated gate field effect transistor or as a bipolar transistor |
-
1992
- 1992-11-04 US US07/971,382 patent/US5446300A/en not_active Expired - Lifetime
-
1993
- 1993-10-28 DE DE69329097T patent/DE69329097T2/de not_active Expired - Fee Related
- 1993-10-28 EP EP93203015A patent/EP0596565B1/en not_active Expired - Lifetime
- 1993-11-04 JP JP5275531A patent/JPH06260601A/ja active Pending
- 1993-12-27 TW TW082111009A patent/TW244394B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP0596565B1 (en) | 2000-07-26 |
| JPH06260601A (ja) | 1994-09-16 |
| DE69329097T2 (de) | 2001-03-22 |
| EP0596565A2 (en) | 1994-05-11 |
| EP0596565A3 (en) | 1997-06-04 |
| US5446300A (en) | 1995-08-29 |
| DE69329097D1 (de) | 2000-08-31 |