TW202505649A - Transporting apparatus, resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

The present invention positions and holds a molding object without using a positioning pin. A transporting apparatus 6 which transports a molding object W includes a holding unit 61 that holds the molding object W and an articulated arm portion 62 that moves the holding unit 61. The holding unit 6 includes a base member 63 connected to a tip portion 621 of the articulated arm portion 62 and a positioning mechanism 64 that contacts the outer peripheral end surface of the molding object W to position the molding object W relative to the base member 63.

Description

Conveying device, resin molding device and method for manufacturing resin molded product

The present invention relates to a conveying device, a resin molding device and a method for manufacturing a resin molded product.

Previously, as a resin molding device for performing resin molding on a workpiece, the device shown in Patent Document 1 was considered. In this resin molding device, a transport robot including a manipulator is used to take out the workpiece from a supply warehouse or store the molded product in a storage warehouse. Here, in the manipulator, a mechanism including a suction mechanism on a fork-shaped member corresponding to the shape of the workpiece is used at the front end of the multi-joint robot. [Prior art document] [Patent document]

[Patent Document 1] Japanese Patent Publication No. 2019-145548

[The problem that the invention wants to solve]

However, Patent Document 1 does not disclose a structure for positioning the workpiece relative to the robot. If the workpiece is not positioned sufficiently relative to the robot, the position of the workpiece placed by the robot becomes inappropriate, so an error is reported and the operation of the resin molding device stops. In the case of a structure that does not report an error, the robot will place the workpiece at an inappropriate position, causing defects in subsequent processing, resulting in defects in the appearance of the resin molded product.

Furthermore, it is also considered to provide a positioning pin on the robot and insert the positioning pin into a positioning hole formed in the workpiece for positioning. However, there is a case where the positioning pin cannot be inserted into the positioning hole due to warping or positional deviation of the workpiece.

Therefore, the present invention is completed to solve the above-mentioned problem, and its main subject is to position and hold the formed object without using positioning pins. [Means for solving the problem]

That is, the conveying device of the present invention is a conveying device for conveying a molding object, and is characterized by comprising: a holding unit for holding the molding object; and a multi-jointed arm for moving the holding unit, wherein the holding unit comprises: a base member connected to the front end of the arm; and a positioning mechanism for contacting the outer peripheral end surface of the molding object and positioning the molding object relative to the base member. [Effect of the invention]

According to the present invention thus constituted, the object to be formed can be positioned and held without using positioning pins.

Next, examples are given to further illustrate the technology of the present invention. However, the present invention is not limited to the following technology.

The conveying device of the technology 1 of the present invention is a conveying device for conveying a molding object, and is characterized in that it includes: a holding unit for holding the molding object; and a multi-joint arm for moving the holding unit, and the holding unit includes: a base member connected to the front end of the multi-joint arm; and a positioning mechanism for contacting the outer peripheral end surface of the molding object and positioning the molding object relative to the base member. In the case of this conveying device, the molding object is contacted with the outer peripheral end surface of the molding object and positioned relative to the base member, so that the molding object can be positioned and held without using a positioning pin. As a result, the molding object can be conveyed to an appropriate position, and in subsequent processing, it is possible to avoid reporting errors caused by the positional deviation of the molding object, thereby preventing the resin molding action from stopping. In addition, by making a structure that does not report errors, defects in the resin molded product such as poor appearance caused by positional deviation of the molded object can be prevented.

Ideally, in addition to the structure of the above-mentioned technique 1, the conveying device of the technique 2 of the present invention includes: a holding claw for holding the molding object; and a holding claw moving part for moving the holding claw, wherein the holding claw moving part moves the holding claw between a holding position for holding the molding object and a retreat position for retreating from the holding position, wherein the holding claw at the holding position contacts the outer peripheral end surface to position the molding object relative to the base member. If this structure is adopted, the molding object is positioned relative to the base member by the holding claw, so that the molded object can be positioned while the molded object is held.

Ideally, in addition to the structure of the above-mentioned technique 2, the conveying device of the technique 3 of the present invention has the following structure: the object to be formed is rectangular in plan view, and the holding claws are respectively provided corresponding to the four sides of the object to be formed. If this structure is adopted, the object to be formed, which is rectangular in plan view, can be surely held, and the object to be formed can be positioned relative to the base member.

Ideally, in addition to the structure of the above-mentioned technique 3, the conveying device of the technique 4 of the present invention includes: a linkage mechanism that links the above-mentioned retaining claws arranged corresponding to the above-mentioned four sides; and a retaining claw driving unit that moves the above-mentioned retaining claws arranged corresponding to the above-mentioned four sides through the linkage mechanism. If it is this structure, the front substrate of the molding can be positioned in one move by the retaining claws arranged corresponding to the four sides. In addition, the retaining claws arranged corresponding to the four sides can be moved by the common retaining claw driving unit, and the enlargement of the retaining unit can be avoided.

Ideally, the conveying device of technology 5 of the present invention includes, in addition to any one of the structures of technology 2 to technology 4, a retaining plate that clamps and holds the molding object between the retaining plate and the retaining claw located at the retaining position. If this structure is adopted, the retaining plate and the retaining claw are used to clamp the molding object positioned by the retaining claw, so that the molding object can be securely held, and the molding object can be prevented from being offset during conveyance.

Ideally, in addition to the structure of the above-mentioned technique 5, the conveying device of the technique 6 of the present invention has a rectangular shape in a plan view corresponding to the above-mentioned object to be formed, and the above-mentioned retaining claw is arranged to surround the four sides of the above-mentioned retaining plate and contact the above-mentioned retaining plate at the above-mentioned retaining position. If it is this structure, the retaining claw contacts the retaining plate at the retaining position, so the retaining claw can be physically retained at the retaining position. As a result, the object to be formed can be accurately positioned relative to the base member.

Ideally, the conveying device of technology 7 of the present invention includes a plate moving part in addition to the structure of technology 5 or technology 6, and the plate moving part moves the holding plate between a contact position with the molding object positioned by the positioning mechanism and a separation position away from the molding object. If it is this structure, the positioning action based on the positioning mechanism and the holding action based on the holding plate can be performed separately. As a result, it can be avoided that the holding plate interferes with the positioning action based on the positioning mechanism.

Specifically, it is desirable that the conveying device of the technique 8 of the present invention, in addition to the structure of the technique 7, positions the molding object by the positioning mechanism while the holding plate is in the separated position by the plate moving part, and after the molding object is positioned by the positioning mechanism, the holding plate is placed in the contact position by the plate moving part. If this structure is adopted, the holding plate will not hinder the positioning of the molding object by the positioning mechanism, and the positioned molding object can be reliably held by the holding plate.

The conveying device of technology 9 of the present invention can convey the molding object having an electronic component fixed on one side in addition to any one of the structures of technology 1 to technology 8. Here, in the resin molding device, there is a device having the following structure: the molding object is accommodated in a first state (tip up state) in which the electronic component is on the upper side, and the molding object is set on a transfer platform or a molding mold in a second state (tip down state) in which the electronic component is on the lower side. In order to be used in the resin molding device, it is ideal that the conveying device of technology 9 holds the molding object placed in the first state in which the electronic component is on the upper side, and hands it over to the transfer platform in the second state in which the electronic component is on the lower side. With this structure, the pre-molding object can be contained in the first state, and dust can be prevented from adhering to the back side (the side held by the molding die) of the pre-molding object opposite to the electronic component. As a result, the appearance of the resin molded product can be prevented from being poor.

In the conveying device of technology 10 of the present invention, the holding unit can hold the molding object before molding and the molding object after molding at a common position relative to the base member. In technology 10 of the present invention, the holding unit is not provided with a positioning pin for positioning the molding object, so the molding object before molding and the molding object after molding can be held indiscriminately. If it is this structure, there is no need to set a conveying mechanism respectively for the molding object before molding and the molding object after molding, which can make the installation space of the conveying mechanism smaller and the installation space of the resin molding device smaller.

In addition, a resin molding device having any one of the conveying devices of Techniques 1 to 10 is also an aspect of the present invention.

Ideally, the resin forming device of the technology 12 of the present invention includes, in addition to the technology 11, a forming object supply section for supplying the forming object before forming; a forming object storage section for storing the forming object after forming; a first transfer platform for temporarily placing the forming object before forming; a second transfer platform for temporarily placing the forming object after forming; and a handover mechanism for handing over the forming object before forming and the forming object after forming between the transfer platforms and the forming mold, the conveying device for handing over the forming object before forming between the forming object supply section and the first transfer platform, and for handing over the forming object after forming between the forming object storage section and the second transfer platform. If this structure is adopted, during the period when the forming object is handed over between each transfer platform and the forming mold by the handover mechanism, the forming object before forming can be transported from the forming object supply section to the first transfer platform, and the forming object after forming can be stored in the forming object storage section from the second transfer platform. As a result, the time from the forming object supply section to the forming mold to the forming mold to the forming object after forming can be shortened.

Ideally, in addition to the structure of the above-mentioned technique 12, the resin molding device of the technique 13 of the present invention has the handover mechanism having: a pre-molding conveying section for conveying the molding object before molding; and a post-molding conveying section for conveying the molding object after molding. If it is this structure, the molding object before molding and the molding object after molding can be conveyed by a common handover mechanism. As a result, the molding object before molding and the molding object after molding can be handed over during the period when the handover mechanism goes back and forth between each transfer platform and the molding mold once, and the time spent on these conveyances can be shortened.

Ideally, in addition to the structure of the above-mentioned technique 12 or technique 13, the resin forming device of the technique 14 of the present invention has an electronic component fixed on one side of the forming object, and the forming object supply unit supplies the forming object before forming in a first state (upturned state) in which the electronic component is on the upper side, and sets the forming object before forming on the first transfer platform in a second state (downturned state) in which the electronic component is on the lower side. If it is this structure, the front and back of the holding unit are reversed by the multi-jointed arm of the conveying device, thereby setting the forming object before forming supplied in the first state by the forming object supply unit to the second state and conveying it to the first transfer platform. That is, the object to be formed before forming can be set to the first state before being transported by the transport device, thereby preventing dust from adhering to the back surface (the surface held by the forming mold) of the object to be formed before forming, which is opposite to the electronic component. As a result, the appearance of the resin molded product can be prevented from being poor.

Moreover, a method for manufacturing a resin molded product is also an aspect of the present invention, wherein the method for manufacturing a resin molded product is a method for performing resin molding on a molding object, and comprises: a conveying step, in which the molding object is conveyed by a conveying device described in any one of Techniques 1 to 10; and a resin molding step, in which the molding object is resin molded.

<One embodiment of the present invention> Hereinafter, one embodiment of the resin molding device of the present invention will be described with reference to the drawings. In any of the following drawings, for the sake of ease of understanding, the drawings are schematically depicted with appropriate omissions or exaggerations. For the same structural elements, the same symbols are marked and the description is appropriately omitted.

<Overall structure of resin molding device> In the resin molding device 100 of the first embodiment, a substrate W as a molding object having an electronic component Wx fixed on one side is resin-sealed by resin molding using a resin material J to manufacture a resin molded product P. In addition, hereinafter, the molding object (substrate W) before resin molding is referred to as "pre-molding substrate W", and the molding object (substrate W) after resin molding is referred to as "molded substrate W" or "resin molded product P".

Here, the substrate W is rectangular in a plan view, and examples thereof include metal substrates, resin substrates, glass substrates, ceramic substrates, circuit substrates, semiconductor substrates, lead frames, silicon wafers, glass wafers, etc. In addition, the substrate W may be a carrier without wiring.

In addition, examples of the resin material J include powdered resins (including granular resins), liquid resins, etc. In addition, examples of the electronic components Wx include electronic components such as semiconductor chips, resistor elements, capacitor elements, or electronic components in a form where at least one of these electronic components is sealed with resin.

As shown in Fig. 1, the resin molding apparatus 100 includes a substrate supply/storage module A, two resin molding modules B, and a resin material supply module C as structural elements. Furthermore, each structural element (each module A to C) is detachable and replaceable relative to each structural element.

As shown in FIG. 1 , the substrate supply/storage module A includes: a substrate supply section 2 for supplying a pre-molding substrate W; a molded product storage section 3 for storing a molded substrate W (resin molded product P); a first transfer platform 4 for temporarily placing the pre-molding substrate W; a second transfer platform 5 for temporarily placing the resin molded product P; a first conveying mechanism 6 for conveying the pre-molding substrate W from the substrate supply section 2 to the first transfer platform 4 and conveying the resin molded product P from the second transfer platform 5 to the molded product storage section 3; and a second conveying mechanism 7 for conveying or handing over the pre-molding substrate W and the resin molded product P between the transfer platforms 4, 5 and the molding dies 10, 11 of the resin molding module B. Furthermore, the specific structure of each section of the substrate supply/storage module A will be described below. In addition, although the substrate supply/storage module A is provided with the control unit COM for controlling the operation of the resin molding apparatus 100, the other modules B and C may also be provided with the control unit COM.

As shown in FIG2 , each resin molding module B comprises: an upper mold 10, which is a first mold for holding a substrate W; a lower mold 11, which is a second mold having a mold cavity 11C formed therein; and a mold clamping mechanism 12 for clamping the upper mold 10 and the lower mold 11. The upper mold 10 is disposed on an upper fixed platen (not shown) via an upper platen 101. The lower mold 11 is disposed on a movable platen 102 which is raised and lowered by the mold clamping mechanism 12 via a lower platen 103.

Here, the upper mold 10 sucks and holds the back side (the side without the electronic component Wx fixed) of the substrate W. A suction port (not shown) is formed on the lower surface of the upper mold 10, and a suction flow path (not shown) connected to the suction port is formed inside the upper mold 10. The suction flow path is connected to an external suction device (not shown).

In addition, the lower mold 11 has a mold cavity 11C for accommodating the electronic component Wx and the resin material J fixed to the substrate W. Specifically, the lower mold 11 has: a bottom member 111, which forms the bottom surface of the mold cavity 11C; and a side member 112, which surrounds the bottom member 111. The mold cavity 11C is formed by the upper surface of the bottom member 111 and the inner peripheral surface of the side member 112. In addition, the side member 112 is arranged to be able to move up and down relative to the bottom member 111. Specifically, the side member 112 is supported by a plurality of elastic members 114 such as coil springs relative to the base plate 113 of the lower mold 11. Furthermore, in order to improve the demolding properties of the resin molded product P, the lower mold 11 is covered with a mold release film F. In addition, an exhaust hole (not shown) may be provided on the upper surface of the side member 112 to exhaust air or gas. In addition, a sealing structure 13 including a side wall portion and a sealing member such as an O-ring is provided around the upper mold 10 and the lower mold 11 to evacuate the surroundings of the molding mold 10 and the molding mold 11 during resin molding.

The mold clamping mechanism 12 of this embodiment is a linear movement type mechanism that uses a ball screw mechanism that converts the rotation of a servo motor or the like into a linear movement to raise and lower the movable platen. In addition, the mold clamping mechanism 12 may also be a connecting rod type mechanism that uses a connecting rod mechanism such as a crank connecting rod to transmit the power source of the servo motor or the like to the movable platen.

As shown in FIG1 , the resin material supply module C includes: a moving platform 14; a resin material storage part 15 placed on the moving platform 14; a resin material feeding mechanism 16 for measuring the resin material J and feeding it into the resin material storage part 15; and a resin material conveying mechanism 17 for conveying the resin material storage part 15 to supply the resin material J to the cavity 11C of the lower mold 11. Here, the resin material storage part 15 is constructed using a holding frame for holding the release film F, and the resin material feeding mechanism 16 is used to feed the resin material J onto the release film F held by the holding frame.

The movable platform 14 moves within the resin material supply module C between a resin input position of the resin material input mechanism 16 and a conveying position for delivering the resin material storage portion 15 to the resin material conveying mechanism 17 .

In addition, the resin material conveying mechanism 17 conveys the resin material storage part 15 containing the resin material J from the resin material supply module C to the resin forming module B, and supplies the mold release film F and the resin material J to the forming mold 10 and the forming mold 11 in the resin forming module B. Thereafter, the resin material conveying mechanism 17 conveys the resin material storage part 15 after the resin material J is supplied from the resin forming module B to the resin material supply module C. The resin material conveying mechanism 17 of this embodiment includes: a resin material conveying part 171 for conveying the resin material storage part 15 containing the resin material J; and a film recovery part 172 for recovering the used mold release film F from the cavity 11C of the lower mold 11.

<Specific structure of each part of substrate supply/storage module A> As shown in FIG1 , substrate supply/storage module A includes substrate supply section 2, molded product storage section 3, first transfer platform 4, second transfer platform 5, first conveying mechanism 6 and second conveying mechanism 7.

As shown in FIG. 1 and FIG. 3 , the substrate supply section 2 includes: a storage box 21 that stores a pre-molding substrate W; and a take-out mechanism 22 that takes out the pre-molding substrate W from the storage box 21. The storage box 21 stores a plurality of pre-molding substrates W in multiple layers, up and down. In addition, the storage box 21 stores the pre-molding substrates W in a first state (so-called flipped-up state) with the electronic components Wx located on the upper side. The storage box 21 is configured to be able to be taken out from the resin molding device 100. The take-out mechanism 22, for example, takes out a pre-molding substrate W by clamping it from the storage box 21, and positions the pre-molding substrate W on the pre-molding substrate platform 23 of the substrate supply section 2. Furthermore, a guide rail 24 is provided between the storage box 21 and the pre-molding substrate platform 23.

Furthermore, the pre-molding substrate stage 23 may also be a structure that slides on the guide rail 24. In this case, when the pre-molding substrate stage 23 is located near the storage box 21, the removal mechanism 22 takes out the pre-molding substrate W from the storage box 21 and arranges the taken-out pre-molding substrate W on the pre-molding substrate stage 23. The pre-molding substrate stage 23, for example, adsorbs and holds the pre-molding substrate W. Thereafter, the pre-molding substrate stage 23 moves along the guide rail 24 in a direction away from the storage box 21. In addition, a confirmation mechanism (not shown) for confirming whether the electronic component Wx is properly arranged on the pre-molding substrate W is provided in the substrate supply section 2, for example. In this structure, for example, while the pre-molding substrate stage 23 moves on the guide rail 24, the confirmation mechanism confirms from above whether the electronic component Wx is properly arranged on the pre-molding substrate W. The confirmation mechanism is a laser displacement meter or a camera.

As shown in FIG. 1 and FIG. 3 , the molded product storage section 3 includes: a storage box 31 for storing the resin molded product P; and a storage mechanism 32 for storing the resin molded product P in the storage box 31. The storage box 31 stores a plurality of resin molded products P in multiple layers up and down. In addition, the storage box 31 stores the resin molded product P in a first state (so-called flipped-up state) in which the electronic component Wx sealed by the resin is located on the upper side. The storage box 31 is configured to be able to be taken out from the resin molding device 100. The storage mechanism 32 stores the resin molded product P in the storage box 31 by pressing the resin molded product P located on the resin molded product platform 33 of the molded product storage section 3. Furthermore, a guide rail 34 is provided between the storage box 31 and the resin molded product platform 33. Alternatively, the storage mechanism 32 may move to the vicinity of the storage box 31 while sandwiching the resin molded product P. In this case, after the resin molded product P is moved to the vicinity of the storage box 31, the resin molded product P is pressed by the storage mechanism 32 and the like and stored in the storage box 31.

Here, regarding the substrate supply unit 2 and the molded product storage unit 3, FIG. 1 shows a state in which they are arranged in the front-rear direction for convenience. In order to miniaturize the installation space of the resin molding device 100 (substrate supply/storage module A), as shown in FIG. 3, the substrate supply unit 2 and the molded product storage unit 3 of this embodiment are arranged up and down. Furthermore, the substrate supply unit 2 and the molded product storage unit 3 can be arranged at the top. In addition, the substrate supply unit 2 and the molded product storage unit 3 can also be arranged in a horizontal direction.

As shown in FIG. 1 and FIG. 3 , the first transfer platform 4 is temporarily provided for the pre-molding substrate W supplied by the substrate supply unit 2, and is used to deliver the pre-molding substrate W to the second conveying mechanism 7. Here, on the first transfer platform 4, the pre-molding substrate W is provided in the second state (so-called flip-down state) with the electronic component Wx located at the lower side. The first transfer platform 4 has a holding claw (not shown) for hooking and holding the end of the pre-molding substrate W in the second state, and the pre-molding substrate W in the second state is held by opening and closing the holding claw. Furthermore, a positioning pin 41 may also be provided on the first transfer platform 4, and the positioning pin 41 is inserted into a positioning hole formed in the pre-molding substrate W (refer to FIG. 3 ).

As shown in Fig. 1 and Fig. 3, the second transfer platform 5 is used to temporarily place the resin molded product P formed by resin, and receives the resin molded product P from the second conveying mechanism 7. Here, on the second transfer platform 5, the resin molded product P is set in the second state (so-called flipped-down state) with the electronic component Wx sealed by resin located at the lower side. The second transfer platform 5 has a holding claw (not shown) for hooking and holding the end of the resin molded product P in the second state, and the resin molded product P in the second state is held by opening and closing the holding claw.

1 and 3, the first transfer platform 4 and the second transfer platform 5 are arranged side by side in the left-right direction, and their height positions are at the same height.

As shown in FIG1 , the first conveying mechanism 6 delivers the pre-molding substrate W between the substrate supply unit 2 and the first transfer platform 4, and delivers the resin molded product P between the second transfer platform 5 and the molded product storage unit 3. The first conveying mechanism 6 is provided between the substrate supply unit 2 and the molded product storage unit 3 and the transfer platforms 4 and 5 in a plan view.

Specifically, the first transport mechanism 6 includes: a holding unit 61 for holding the pre-molding substrate W and the resin molded product P, respectively; and a multi-joint arm 62 for moving the holding unit 61.

The multi-joint arm 62 is, for example, a vertical multi-joint robot (for example, a multi-joint robot with six joints). The multi-joint arm 62 can control the position and posture of the holding unit 61. Specifically, the multi-joint arm 62 can reverse the front and back of the holding unit 61 holding the pre-molding substrate W or the resin molded product P. In addition, the multi-joint arm 62 moves the holding unit 61 between the substrate supply section 2 and the first transfer platform 4 and between the molded product storage section 3 and the second transfer platform 5. Furthermore, the specific structure of the first conveying mechanism 6 will be described below.

As shown in FIG1 , the second conveying mechanism 7 moves back and forth between the substrate supply/storage module A and the resin forming module B, and moves along a track (not shown) provided throughout the substrate supply/storage module A and the resin forming module B. The second conveying mechanism 7 receives the pre-molding substrate W temporarily provided on the first transfer platform 4, and conveys it to the upper mold 10 of the resin forming module B. In addition, after the resin of the pre-molding substrate W is formed, the second conveying mechanism 7 receives the resin molded product P from the upper mold 10 of the resin forming module B, and conveys it to the second transfer platform 5.

As shown in FIG. 1 and FIG. 3 , the second conveying mechanism 7 of the present embodiment comprises: a substrate conveying section 71 for conveying a pre-molding substrate W; and a molded product conveying section 72 for conveying a resin molded product P. Furthermore, a positioning pin 711 may be provided on the substrate conveying section 71, and the positioning pin 711 is inserted into a positioning hole formed in the pre-molding substrate W (refer to FIG. 3 ). Moreover, the second conveying mechanism 7 is configured so that the substrate conveying section 71 and the molded product conveying section 72 move simultaneously. The substrate conveying section 71 and the molded product conveying section 72 are arranged correspondingly to the configuration relationship of the first transfer platform 4 and the second transfer platform 5. In the present embodiment, the first transfer platform 4 and the second transfer platform 5 are arranged horizontally in the left-right direction, so the substrate conveying section 71 and the molded product conveying section 72 are also arranged horizontally in the left-right direction correspondingly thereto. In addition, the height positions of the substrate conveying unit 71 and the molded product conveying unit 72 are also the same height.

With this structure, the pre-molding substrate W can be transported from the first transfer platform 4 to the upper mold 10, and the resin molded product P can be transported from the upper mold 10 to the second transfer platform 5 during one round trip of the second transfer mechanism 7 between the substrate supply/storage module A and the resin molding module B.

<Specific structure of the first conveying mechanism 6> In addition, the first conveying mechanism 6 of this embodiment is configured to position and hold the pre-molding substrate W and the resin molded product P, respectively.

Specifically, as shown in FIGS. 4 to 8 , the holding unit 61 includes: a base member 63 connected to the front end portion 621 of the multi-joint arm 62; and a positioning mechanism 64 that contacts the outer peripheral end surface Wa of the pre-molding substrate W or the resin molded product P and positions the pre-molding substrate W or the resin molded product P relative to the base member 63. In addition, in FIGS. 4 , 6 and 7 , an example of holding the pre-molding substrate W is shown, and the resin molded product P can also be held in the same manner.

The base member 63 is rectangular in a plan view corresponding to the pre-molding substrate W (see FIG. 8 ). The long side of the base member 63 is connected to the front end 621 of the multi-joint arm 62 (see FIG. 4 and FIG. 5 ). Furthermore, the front end 621 of the multi-joint arm 62 is configured to be rotatable around an axis extending in the left-right direction of FIG. 4 , thereby enabling the front and back of the holding unit 61 to be reversed.

The positioning mechanism 64 of this embodiment not only positions the pre-molding substrate W or the resin molded product P, but also holds them, as shown in Figures 4 to 8, including: a holding claw 641, which holds the pre-molding substrate W or the resin molded product P; and a holding claw moving part 642, which moves the holding claw 641.

The holding claws 641 hook and hold the ends of the pre-molding substrate W and the resin molded product P at a common position relative to the base member 63, and are respectively provided corresponding to the four sides of the pre-molding substrate W and the resin molded product P. Each holding claw 641 is rotatably provided on the base member 63, and is provided to be rotatable between a holding position R (see FIG. 4 ) for holding the pre-molding substrate W or the resin molded product P and a retreat position Q (see FIG. 5 ) for retreating from the holding position R.

Furthermore, each holding claw 641 holds the pre-molded substrate W and the resin molded product P respectively by hooking the free end portion thereof at the holding position R. In addition, each holding claw 641 positions the pre-molded substrate W and the resin molded product P at a common position relative to the base member 63 by contacting the inner surface of the free end portion thereof with the outer peripheral end surface Wa of the pre-molded substrate W or the resin molded product P at the holding position R. By positioning the pre-molded substrate W or the resin molded product P relative to the base member 63, the pre-molded substrate W and the resin molded product P are also positioned relative to the holding surface 65a of the holding plate 65 described later.

The holding claw moving section 642 moves the holding claw 641 between a holding position R for holding the pre-molding substrate W or the resin molded product P and a retreat position Q for retreating from the holding position R.

Specifically, as shown in FIGS. 4 to 8 , the holding claw moving portion 642 includes: a linkage mechanism 642a that links the holding claws 641 provided at the four sides, respectively; and a holding claw driving portion 642b that moves the holding claws 641 provided at the four sides, respectively, via the linkage mechanism 642a. In addition, the holding claw driving portion 642b is omitted in FIGS. 6 to 8 .

The linkage mechanism 642a links the holding claws 641 provided at the four sides respectively, and switches the holding claws 641 between the holding position R and the retreat position Q at the same time. Specifically, as shown in FIG8 , the linkage mechanism 642a includes: a connecting shaft 642a1 connecting one or more holding claws 641 provided at each side; and a connecting portion 642a2 connecting the connecting shafts 642a1 at each side. Each connecting shaft 642a1 is provided to be rotatable around an axis along each side relative to the base member 63, and each holding claw 641 moves between the holding position R and the retreat position Q by the rotation of the connecting shaft 642a1 around the axis.

The example shown in FIG8 is a structure in which the connecting shafts 642a1 of the long sides facing each other are connected by a connecting portion 642a2, and the connecting shaft 642a1 of one short side is connected to the connecting shafts 642a1 of each long side by a connecting portion 642a2. As the connecting portion 642a2 that connects the connecting shafts 642a1 of the long sides, for example, a connecting rod mechanism can be used, and as the connecting portion 642a2 that connects the connecting shafts 642a1 of the long sides and the connecting shafts 642a1 of the short sides, for example, a universal joint can be used. In addition, as the linkage mechanism 642a, a mechanism using a gear mechanism can also be used.

As shown in Fig. 4 and Fig. 5, the holding claw driving part 642b moves the plurality of holding claws 641 connected by the linkage mechanism 642a between the holding position R and the retreat position Q. The holding claw driving part 642b rotates the connecting shaft 642a1 provided on either side and can be constituted by using, for example, an air cylinder.

Furthermore, as shown in FIGS. 4 to 7 , the holding unit 61 further includes a holding plate 65 having a holding surface 65a for holding the pre-molding substrate W or the resin molded product P, so that the pre-molding substrate W or the resin molded product P can be securely held even when the front and back are reversed.

The holding plate 65 has a rectangular shape in a plan view corresponding to the pre-molding substrate W. The holding plate 65 sandwiches and holds the pre-molding substrate W or the resin molded product P between the holding claws 641 located at the holding position R.

Specifically, the holding plate 65 is formed with a receiving portion 651 for receiving the electronic component Wx of the pre-molding substrate W in the first state or the resin molded portion of the resin molded product P in the first state, and a holding surface 65a for holding the peripheral portion of the pre-molding substrate W or the resin molded product P is formed around the receiving portion 651. In addition, the holding plate 65 is moved up and down relative to the base member 63 by the plate moving portion 66.

In addition, the holding plate 65 is arranged inside the holding claws 641 respectively arranged corresponding to the four sides of the pre-molding substrate W or the resin molded product P. That is, the holding claws 641 are arranged to surround the four sides of the holding plate 65. Moreover, the holding plate 65 moves up and down inside the holding claws 641 on the four sides. Furthermore, the holding claws 641 are configured to contact the outer peripheral end surface of the holding plate 65 at the holding position R so that the holding claws 641 are physically stopped at the holding position R.

The plate moving part 66 moves the holding plate 65 between a contact position T (see FIG. 7 ) where the holding surface 65 a contacts the pre-molding substrate W or the resin molded product P positioned by the positioning mechanism 64 and a separation position U (see FIG. 6 ) where the holding surface 65 a separates from the pre-molding substrate W or the resin molded product P. As shown in FIG. 6 and FIG. 7 , the plate moving part 66 includes: a guide mechanism 661 that guides the holding plate 65 between the contact position T and the separation position U; and a plate driving part 662 that moves the holding plate 65. The guide mechanism 661 includes: a guide part 661 a that is provided on the base member 63; and a sliding part 661 b that is provided on the holding plate 65 and slides along the guide part 661 a. The plate driving part 662 can be constituted by, for example, a cylinder.

Here, the operation of the first transport mechanism 6 is described with reference to Fig. 9 (a) to Fig. 9 (e) and Fig. 10 (a) to Fig. 10 (e). Fig. 9 (a) to Fig. 9 (e) show an example of transporting a pre-molding substrate W, and Fig. 10 (a) to Fig. 10 (e) show an example of transporting a resin molded product P.

The first transport mechanism 6 positions and holds the pre-molding substrate W or the resin molded product P by the holding claws 641 of the positioning mechanism 64 while the holding plate 65 is in the separated position U by the plate moving part 66 (refer to FIG. 9 (a) → FIG. 9 (b), FIG. 10 (a) → FIG. 10 (b)). Then, after the pre-molding substrate W or the resin molded product P is positioned by the holding claws 641 of the positioning mechanism 64, the first transport mechanism 6 positions the pre-molding substrate W or the resin molded product P by the plate moving part 66 (refer to FIG. 9 (b) → FIG. 9 (c), FIG. 10 (b) → FIG. 10 (c)). The holding plate 65 is moved to the contact position T, whereby the positioned pre-molding substrate W or the resin molded product P is held by the holding claws 641 and the holding plate 65. In this state, the first conveying mechanism 6 reverses the front and back of the holding unit 61 through the multi-joint arm 62 (refer to Figure 9 (d) → Figure 9 (e), Figure 10 (d) → Figure 10 (e)), thereby stably switching the first state and the second state of the pre-molded substrate W or the resin molded product P.

<Operation of the first conveying mechanism 6 and the second conveying mechanism 7> Next, the conveying operation of the first conveying mechanism 6 and the second conveying mechanism 7 will be described with reference to FIG. 3, FIG. 9 (a) to FIG. 9 (e), and FIG. 10 (a) to FIG. 10 (e).

First, the pre-molding substrate W is placed on the pre-molding substrate stage 23 (see FIG. 3 ) from the storage box 21 of the substrate supply unit 2 by the removal mechanism 22. Here, on the pre-molding substrate stage 23, the pre-molding substrate W is in a first state (so-called upturned state).

When holding the pre-molding substrate W on the pre-molding substrate stage 23, the multi-joint arm 62 of the first transfer mechanism 6 moves the holding unit 61 above the pre-molding substrate stage 23. At this time, the holding claw 641 of the holding unit 61 is at the retreat position Q (see FIG. 9(a)).

Then, the holding unit 61 is moved to a height position for holding the pre-molding substrate W, and the holding claw 641 is placed at the holding position R (see FIG. 9( b )) by the holding claw moving portion 642. As a result, the holding claw 641 contacts the outer peripheral end surface Wa of the pre-molding substrate W, and the pre-molding substrate W is positioned relative to the base member 63 and held by the holding claw 641. Before the pre-molding substrate W is held by the holding claw 641, the holding plate 65 is placed at the separation position U.

After the holding claw 641 holds the pre-molding substrate W, the plate moving unit 66 moves the holding plate 65 located at the separation position U to the contact position T (see (c) of FIG. 9 ). Thus, the positioned pre-molding substrate W is clamped and held by the holding claw 641 and the holding plate 65 (see (d) of FIG. 9 ). After being set to this state, the multi-jointed arm 62 of the first transport mechanism 6 turns the holding unit 61 upside down and moves it to the first transfer platform 4 (see (e) of FIG. 9 ).

By the above actions, the first transport mechanism 6 holds the pre-molding substrate W in the first state on the pre-molding substrate stage 23, sets the pre-molding substrate W to the second state, and transports and delivers it to the first transfer stage 4. Here, the first transport mechanism 6 delivers the pre-molding substrate W to the first transfer stage 4 by releasing the holding claws 641.

Next, the second conveying mechanism 7 receives the pre-molding substrate W in the second state located on the first transfer platform 4 (see FIG. 3 ), and conveys it to the upper mold 10 to hand over the pre-molding substrate W to the upper mold 10. Here, the second conveying mechanism 7 hands over the resin molded product P in the second state to the second transfer platform 5 while holding the resin molded product P when receiving the pre-molding substrate W from the first transfer platform 4 (see FIG. 3 ).

When the resin molded product P is placed on the second transfer platform 5, the multi-joint arm 62 of the first transfer mechanism 6 moves the holding unit 61 to the lower side of the second transfer platform 5. At this time, the holding claw 641 of the holding unit 61 is at the retreat position Q (see FIG. 10(a)).

Then, the holding unit 61 is moved to a height position for holding the resin molded product P, and the holding claw 641 is placed in the holding position R (see FIG. 10( b) ) by the holding claw moving portion 642. As a result, the holding claw 641 contacts the outer peripheral end surface Wa of the resin molded product P, and the resin molded product P is positioned relative to the base member 63 and held by the holding claw 641. Before the resin molded product P is held by the holding claw 641, the holding plate 65 is placed in the separation position U.

After the holding claw 641 holds the resin molded product P, the plate moving part 66 moves the holding plate 65 located at the separation position U to the contact position T (refer to (c) in FIG. 10 ). Thereby, the positioned resin molded product P is clamped and held by the holding claw 641 and the holding plate 65 (refer to (d) in FIG. 10 ). After being set to this state, the multi-jointed arm part 62 of the first conveying mechanism 6 reverses the holding unit 61 front and back and moves it to the resin molded product platform 33 of the molded product storage part 3 (refer to (e) in FIG. 10 ). Here, the first conveying mechanism 6 releases the holding claw 641, thereby placing the resin molded product P in the first state (the so-called flipped-up state) on the resin molded product platform 33.

After the resin molded product P is placed on the resin molded product platform 33 in the first state, the storage mechanism 32 of the molded product storage section 3 presses the resin molded product P located on the resin molded product platform 33 and stores it in the storage box 31 (see FIG. 3 ). Furthermore, after the resin molded product P is placed on the resin molded product platform 33 in the first state, the storage mechanism 32 of the molded product storage section 3 may also move the resin molded product P to the vicinity of the storage box 31 as described above. In this case, as described above, after the resin molded product P is moved to the vicinity of the storage box 31, the resin molded product P is pressed by the storage mechanism 32 and the like and stored in the storage box 31.

<Effects of the present embodiment> According to the resin molding device 100 of the present embodiment, the first conveying mechanism 6 contacts the outer peripheral end surface Wa of the pre-molding substrate W and positions the pre-molding substrate W relative to the base member 63, so that the pre-molding substrate W can be positioned and held without using positioning pins. As a result, the pre-molding substrate W can be conveyed to an appropriate position, and the error caused by the positional deviation of the pre-molding substrate W can be avoided in the subsequent processing, thereby preventing the resin molding action from being stopped. In addition, when a structure that does not report errors is made, defects of the resin molded product P such as poor appearance caused by the positional deviation of the pre-molding substrate W can be prevented.

<Other variant implementation forms> Furthermore, the present invention is not limited to the above-mentioned implementation forms.

For example, the molded product storage section 3 is a structure for storing the resin molded product P in the first state (so-called flip-up state), but it can also be a structure for storing the resin molded product P in the second state (so-called flip-down state). In this case, the first conveying mechanism 6 is configured as follows: when conveying the resin molded product P from the second transfer platform 5 to the resin molded product platform 33, the holding unit 61 is not reversed.

In addition, the first conveying mechanism 6 of the above-described embodiment is a common mechanism for conveying both the pre-molding substrate W and the resin molded product P, but it may be a structure including the first conveying mechanism 6 for conveying the pre-molding substrate W and the first conveying mechanism 6 for conveying the resin molded product P. Similarly, the second conveying mechanism 7 is a common mechanism for conveying both the pre-molding substrate W and the resin molded product P, but it may be a structure including the second conveying mechanism 7 for conveying the pre-molding substrate W and the second conveying mechanism 7 for conveying the resin molded product P.

Furthermore, the first transport mechanism 6 in the above-described embodiment is a structure in which the holding unit 61 is reversed front and back, but it may be a structure in which the holding unit 61 is not reversed front and back.

In addition, the holding claw moving part 642 can also switch between the holding position R and the retreat position Q by expanding or reducing the interval between the holding claws 641 provided on the opposing sides.

Furthermore, the positioning mechanism 64 of the embodiment has a function of holding the molding object using the holding claws 641, but may not have a function of holding the molding object, but may only have a function of positioning the molding object by contacting the outer peripheral end surface of the molding object. In this case, the holding unit 61 becomes a structure that is independent of the positioning mechanism 64 and has a holding portion that holds the molding object positioned by the positioning mechanism 64.

Furthermore, the holding unit 61 may be configured without the holding plate 65. In this case, for example, a structure may be configured such that a recessed portion into which the end of the molding object W enters is formed in the holding claw 641, and the recessed portion contacts the outer peripheral end surface of the molding object and sandwiches the front and back surfaces of the molding object W. With this structure, even when the front and back surfaces are reversed, the molding object W can be maintained in a state of being positioned in the planar direction.

Furthermore, the resin molding module B may include a plurality of molding dies 10 and 11. In this case, as shown in FIG. 11 , the second conveying mechanism 7 has a plurality of substrate conveying parts 71 and a plurality of molded product conveying parts 72 corresponding to the multi-layer molding dies 10 and 11. In addition, as shown in FIG. 11 , the first transfer platform 4 and the second transfer platform 5 also have a multi-layer structure corresponding to the multi-layer molding dies 10 and 11. In this structure, the first conveying mechanism 6 conveys the pre-molding substrates W one by one from the pre-molding substrate platform 23 to the multi-layer first transfer platform 4, and conveys the resin molded products P one by one from the multi-layer second transfer platform 5 to the resin molded product platform 33.

In addition, the present invention is not limited to the above-described embodiments, and various modifications are possible without departing from the gist of the invention. [Industrial Applicability]

According to the present invention, the object to be formed can be positioned and held without using positioning pins.

10: Forming mold (upper mold) 100: Resin forming device 101: Upper platen 102: Movable platen 103: Lower platen 11: Forming mold (lower mold) 111: Bottom member 112: Side member 113: Base plate 114: Elastic member 11C: Cavity 12: Clamping mechanism 13: Sealing structure 14: Moving platform 15: Resin material storage unit 16: Resin material feeding mechanism 17: Resin material conveying mechanism 171: Resin material conveying unit 172: Film recovery unit 2: Substrate supply unit (molding object supply unit) 21, 31: Storage box 22: Take-out mechanism 23: Pre-molding substrate platform 24, 34: Guide rail 3: Molded product storage section (molding object storage section) 32: Storage mechanism 33: Resin molded product platform 4: First transfer platform (transfer platform) 41, 711: Positioning pin 5: Second transfer platform (transfer platform) 6: First conveying mechanism (conveying device) 61: Holding unit 62: Multi-joint arm section 621: Front end section 63: Base member 64: Positioning mechanism 641: Holding claw 642: Holding claw moving section 642a: Linking mechanism 642a1: Connecting shaft 642a2: Connecting section 642b: Holding claw driving section 65: Holding plate 65a: Holding surface 651: Receiving section 66: Plate moving part 661: Guide mechanism 661a: Guide part 661b: Sliding part 662: Plate driving part 7: Second conveying mechanism (handover mechanism) 71: Substrate conveying part 72: Molded product conveying part A: Substrate supply/storage module B: Resin molding module C: Resin material supply module COM: Control unit F: Mold release film P: Resin molded product (molding object) Q: Retract position R: Holding position T: Contact position U: Separation position W: Substrate before molding (molding object/substrate/molding completed substrate) Wa: Peripheral end surface Wx: Electronic parts

FIG. 1 is a schematic diagram showing the structure of a resin molding device of an embodiment of the present invention. FIG. 2 is a schematic diagram showing the structure of a resin molding module of the embodiment. FIG. 3 is a diagram schematically showing the structure of a substrate supply unit and a molded product storage unit of the embodiment, and showing the conveying action of a pre-molded substrate and a conveying action of a resin molded product between these and each transfer platform. FIG. 4 is a cross-sectional diagram orthogonal to the long side direction schematically showing a state in which a holding claw is in a holding position in a first conveying mechanism of the embodiment. FIG. 5 is a cross-sectional diagram orthogonal to the long side direction schematically showing a state in which a holding claw is in a retracted position in a first conveying mechanism of the embodiment. FIG. 6 is a cross-sectional view orthogonal to the short side direction schematically showing a state where the holding plate is located at a separated position in the first conveying mechanism of the embodiment. FIG. 7 is a cross-sectional view orthogonal to the short side direction schematically showing a state where the holding plate is located at a contact position in the first conveying mechanism of the embodiment. FIG. 8 is a schematic diagram showing the structure of the linkage mechanism in the holding claw moving part of the embodiment. FIG. 9 (a) to FIG. 9 (e) are schematic diagrams showing the positioning/holding action and conveying action of the pre-molding substrate performed by the holding unit of the embodiment. FIG. 10 (a) to FIG. 10 (e) are schematic diagrams showing the positioning/holding action and conveying action of the resin molded product performed by the holding unit of the embodiment. FIG11 is a schematic diagram showing the structure (two-layer structure) of a substrate supply/storage module of a modified implementation form.

6: First conveying mechanism (conveying device)

61: Keep unit

62: Multi-joint arm

621: Front end

63: Base components

64: Positioning mechanism

641:Keep claws

642: Keep claw moving part

642a: linkage mechanism

642a1: Connecting shaft

642a2: Connection part

642b: Holding claw drive unit

65: Holding board

65a: Keep the face

651: Containment Department

R: Hold position

U: Separation position

W: Substrate before molding (molding object/substrate/molding completed substrate)

Wa: peripheral end surface

Wx: Electronic parts

Claims (15)

A conveying device is used to convey a molding object, and the conveying device includes: A holding unit for holding the molding object; and A multi-joint arm for moving the holding unit, and the holding unit includes: A base member connected to the front end of the multi-joint arm; and A positioning mechanism for contacting the outer peripheral end surface of the molding object and positioning the molding object relative to the base member. The conveying device as described in claim 1, wherein the positioning mechanism includes: a holding claw for holding the molding object; and a holding claw moving unit for moving the holding claw, the holding claw moving unit moves the holding claw between a holding position for holding the molding object and a retreat position for retreating from the holding position, the holding claw at the holding position contacts the outer peripheral end surface to position the molding object relative to the base member. The conveying device as described in claim 2, wherein the object to be formed is rectangular in a plan view, and the retaining claws are arranged corresponding to the four sides of the object to be formed. The conveying device as described in claim 3, wherein the holding claw moving part includes: a linkage mechanism that causes the holding claws arranged corresponding to the four sides to be linked; and a holding claw driving part that causes the holding claws arranged corresponding to the four sides to be moved via the linkage mechanism. The conveying device as described in any one of claims 2 to 4 further includes a holding plate, which sandwiches and holds the forming object between the holding plate and the holding claw located at the holding position. The conveying device as described in claim 5, wherein the holding plate is rectangular in a plan view corresponding to the forming object, and the holding claw is arranged to surround the four sides of the holding plate and contact the holding plate at the holding position. The conveying device as described in claim 5 or 6 further includes a plate moving part, which enables the retaining plate to move between a contact position in contact with the forming object positioned by the positioning mechanism and a separation position away from the forming object. A conveying device as described in claim 7, wherein the conveying device positions the forming object by the positioning mechanism when the retaining plate is in the separated position by the plate moving part, and after the forming object is positioned by the positioning mechanism, the retaining plate is placed in the contact position by the plate moving part. A conveying device as described in any one of claims 1 to 8, wherein the object to be formed has an electronic component fixed on one side, and the conveying device holds the object to be formed in a first state in which the electronic component is on the upper side, and transfers the object to the transfer platform in a second state in which the electronic component is on the lower side. The conveying device as described in any one of claims 1 to 9, wherein the holding unit holds the forming object before forming and the forming object after forming at a common position relative to the base member. A resin molding device comprises a conveying device as described in any one of claims 1 to 10. The resin forming device as described in claim 11 comprises: a forming object supply section for supplying the forming object before forming; a forming object storage section for storing the forming object after forming; a first transfer platform for temporarily placing the forming object before forming; a second transfer platform for temporarily placing the forming object after forming; and a handover mechanism for handing over the forming object before forming and the forming object after forming between the transfer platforms and the forming mold, the conveying device for handing over the forming object before forming between the forming object supply section and the first transfer platform, and for handing over the forming object after forming between the forming object storage section and the second transfer platform. The resin molding device as described in claim 12, wherein the handover mechanism comprises: a pre-molding conveying unit for conveying the molding object before molding; and a post-molding conveying unit for conveying the molding object after molding. A resin molding device as described in claim 12 or 13, wherein the molding object has an electronic component fixed on one side, the molding object supply unit supplies the molding object before molding in a first state in which the electronic component is on the upper side, and the molding object before molding is set on the first transfer platform in a second state in which the electronic component is on the lower side. A method for manufacturing a resin molded product, wherein a molding object is subjected to resin molding, the method comprising: a conveying step, wherein the molding object is conveyed by a conveying device as described in any one of claims 1 to 10; and a resin molding step, wherein the molding object is subjected to resin molding.

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