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TW202504694A - Coating removal system and methods of operating same - Google Patents

Coating removal system and methods of operating same Download PDF

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Publication number
TW202504694A
TW202504694A TW113136533A TW113136533A TW202504694A TW 202504694 A TW202504694 A TW 202504694A TW 113136533 A TW113136533 A TW 113136533A TW 113136533 A TW113136533 A TW 113136533A TW 202504694 A TW202504694 A TW 202504694A
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coating
fluid
removal
pressure
coating removal
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TW113136533A
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Chinese (zh)
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TWI879680B (en
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肯尼斯艾倫 艾奇森
約翰吉爾博 碇
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美商極度清淨控股公司
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Abstract

A coating removal process includes providing a coating removal vessel having a sealable processing volume therein, providing a coating removal fluid, which reacts with the coating, at an elevated temperature above the ambient temperature surrounding the removal vessel, in the sealable processing volume, locating a component having a coating thereon to be removed in the processing volume, sealing the sealable process volume from the ambient surrounding the processing volume, heating the coating removal fluid to a temperature greater than the boiling point thereof at the pressure of the surrounding ambient, removing the coating from the component using the coating removal fluid at the temperature greater than the boiling point thereof at the pressure of the surrounding ambient, reducing the temperature of the coating removal fluid to a temperature less than the boiling point thereof at the pressure of the surrounding ambient, venting the sealable volume to the surrounding ambient, and removing the component from the processing volume.

Description

塗層移除系統及其操作方法Coating removal system and method of operation thereof

本揭示案係關於在半導體處理設備中使用的組件之清潔之領域,其中材料經沉積或形成在組件之表面上作為在處理設備中執行的製程之副產物,且當形成在組件上的沉積物之量可或將不利地影響處理設備中之處理時,組件經處理以移除沉積在上面作為在處理設備中執行的製程之副產物的塗層。The present disclosure relates to the field of cleaning of components used in semiconductor processing equipment, wherein material is deposited or formed on the surface of the component as a byproduct of a process performed in the processing equipment, and when the amount of deposit formed on the component can or will adversely affect processing in the processing equipment, the component is processed to remove a coating deposited thereon as a byproduct of a process performed in the processing equipment.

在諸如製程腔室的製程設備中之某些製程環境中使用的組件通常變得塗佈有沉積材料或塗佈有蝕刻或材料移除製程之副產物,其中沉積製程或塗佈製程經執行塗佈製程腔室中之物件,或蝕刻或材料移除製程經執行以蝕刻或移除製程腔室中之物件上的塗層。此塗層可逐漸地產生,例如與正塗佈的物件上的塗層一般厚或比該塗層薄的塗層經形成或沉積在腔室組件上,每當物件經處理以在處理設備中經塗佈時,該等腔室組件暴露於製程腔室中之製程環境。類似地,在蝕刻或材料移除製程中,蝕刻或材料移除製程之副產物可沉積在暴露於製程環境的腔室組件之壁或其他表面上。此塗層當其達到一定厚度時,可自組件剝落且變成製程污染物,例如藉由變得附接至正塗佈的物件或藉由沉澱在提供來支撐物件處理腔室或系統內之物件的支撐件上,該塗層可刮傷處理腔室或系統中正塗佈的物件在其受支撐側上的表面。因為製程腔室組件通常為處理腔室之高成本組件,所以組件通常經回收以重新使用一或多次。組件之此回收要求作為該組件所暴露的製程之副產物形成在該組件上的塗層經移除且組件經清潔,且組件然後可適合於重新使用。在一些狀況下,組件在使用於製程環境或製程腔室中之前上面將具有保護塗層,且移除為製程環境之副產物的塗層可亦移除保護塗層中之一些或全部。在彼狀況下,保護塗層將亦需要替換。額外不合需要的塗層可為組件之自然氧化或其他效應之結果,諸如作為燃燒之副產物的結果,例如在內燃機、燃氣渦輪引擎等中。另外,為整修組件,副產物塗層需要經移除。在暴露於在上面形成不合需要的塗層作為組件之使用之副產物的材料的組件之整修期間,組件之表面上不合需要的塗層必須經移除。移除製程通常包括: a) 化學製程,例如濕式蝕刻製程,其中組件暴露於液體蝕刻劑,且蝕刻劑之化學組成與組件上之不合需要的塗層反應以將塗層化學地移除; b) 乾式蝕刻技術諸如電漿蝕刻,其中電漿活化的化學物種與不合需要的塗層反應以將該不合需要的塗層自組件移除;以及 c) 物理移除製程,諸如噴砂,其中用砂粒或顆粒轟擊組件以將不合需要的塗層自組件之下層表面物理地研磨掉。 Components used in certain process environments such as process equipment such as process chambers often become coated with deposited materials or coated with byproducts of etch or material removal processes, wherein a deposition process or coating process is performed to coat an object in the process chamber, or an etch or material removal process is performed to etch or remove a coating on an object in the process chamber. Such a coating may be generated gradually, such as a coating that is generally thicker or thinner than a coating on an object being coated is formed or deposited on chamber components that are exposed to a process environment in a process chamber whenever an object is processed to be coated in a processing apparatus. Similarly, during an etching or material removal process, byproducts of the etching or material removal process may be deposited on walls or other surfaces of chamber components that are exposed to the process environment. This coating, when it reaches a certain thickness, can flake off the component and become a process contaminant, for example by becoming attached to the article being coated or by being deposited on a support provided to support the article within the article processing chamber or system, the coating can scratch the surface of the article being coated on its supported side in the processing chamber or system. Because process chamber components are typically high cost components of the processing chamber, the components are typically recycled for reuse one or more times. This recycling of the components requires that the coating formed on the component as a byproduct of the process to which the component is exposed be removed and the component cleaned, and the component can then be suitable for reuse. In some cases, a component will have a protective coating thereon prior to use in a process environment or process chamber, and removing the coating as a byproduct of the process environment may also remove some or all of the protective coating. In that case, the protective coating will also need to be replaced. Additional undesirable coatings may be the result of natural oxidation of the component or other effects, such as as a byproduct of combustion, for example in internal combustion engines, gas turbine engines, etc. Additionally, to refurbish the component, the byproduct coating needs to be removed. During refurbishment of a component that was exposed to a material on which the undesirable coating was formed as a byproduct of the use of the component, the undesirable coating on the surface of the component must be removed. Removal processes typically include: a) chemical processes, such as wet etching processes, in which the component is exposed to a liquid etchant and the chemical composition of the etchant reacts with the undesirable coating on the component to chemically remove the coating; b) dry etching techniques such as plasma etching, in which chemical species activated by the plasma react with the undesirable coating to remove the undesirable coating from the component; and c) physical removal processes, such as sandblasting, in which the component is bombarded with sand or particles to physically grind the undesirable coating away from the underlying surface of the component.

亦可採用此等製程或技術之組合,以將不期望的塗層自組件移除。Combinations of these processes or techniques may also be used to remove undesirable coatings from components.

使用濕式或乾式蝕刻化學品及技術在不亦損壞下層組件的情況下移除諸如某些金屬、金屬氧化物的許多材料及下層組件上的其他材料塗層為困難的或視為不切實際的或不可能的。例如,氧化鉿及氧化鋁,以及其他塗層組成通常為使用化學蝕刻技術不容易移除的。例如,用以移除不合需要的塗層的時間可為過多的,或可利用於塗層之濕式蝕刻以使用已知濕式蝕刻技術來移除塗層的可能化學品不能以對於使用商業可行的充分高的移除速率來有效地移除不合需要的塗層,或該等可能化學品可不利地亦蝕刻組件之下層材料。另外,具有自其移除的不合需要的塗層的組件可具有關鍵尺寸,例如關鍵孔大小、材料厚度或實體特徵尺寸,該等關鍵尺寸需要保持在製造商的允差或其他指定允差內以有效地重新使用製程腔室中之組件。在不合需要的塗層材料與蝕刻劑緩慢反應,且蝕刻劑亦與組件材料反應的情況下,材料將經自組件移除且關鍵特徵尺寸可不再存在於組件中。當此發生時,組件不再可使用於其預期目的,且將需要替換。通常,同與下層組件的反應速率相比,蝕刻劑材料將具有與不合需要的塗層之材料的較大蝕刻或反應速率。然而,不合需要的塗層將通常具有跨於部分之表面的不同厚度,且濕式蝕刻之各向同性性質將導致組件表面之部分暴露於蝕刻劑,而組件之其他部分仍然覆蓋在將要移除的不合需要的塗層材料中。因此,下層組件之一部分之過度蝕刻或移除可發生。Many materials, such as certain metals, metal oxides, and other material coatings on underlying components are difficult or considered impractical or impossible to remove using wet or dry etching chemistries and techniques without also damaging the underlying components. For example, cobalt oxide and aluminum oxide, as well as other coating compositions, are generally not easily removed using chemical etching techniques. For example, the time used to remove the undesirable coating may be excessive, or possible chemistries that may be utilized for wet etching of the coating to remove the coating using known wet etching techniques may not effectively remove the undesirable coating at a sufficiently high removal rate to be commercially viable for use, or such possible chemistries may disadvantageously also etch underlying materials of the component. Additionally, the component having the undesirable coating removed therefrom may have critical dimensions, such as critical hole size, material thickness, or physical feature size, that need to be maintained within a manufacturer's tolerance or other specified tolerance to effectively reuse the component in the process chamber. In the event that the undesirable coating material reacts slowly with the etchant, and the etchant also reacts with the component material, the material will be removed from the component and the critical feature dimension may no longer exist in the component. When this occurs, the component can no longer be used for its intended purpose and will need to be replaced. Typically, the etchant material will have a greater etching or reaction rate with the material of the undesirable coating than the reaction rate with the underlying component. However, the undesirable coating will generally have a different thickness across the surface of the component, and the isotropic nature of wet etching will result in portions of the component surface being exposed to the etchant while other portions of the component remain covered in the undesirable coating material to be removed. As a result, overetching or removal of a portion of the underlying component may occur.

一些材料不容易受藉由濕式或乾式蝕刻技術之移除影響,因為塗層之蝕刻速率如此低,使得用來移除塗層的時間為過多的。在此,塗層通常藉由噴丸或噴砂移除,其中塗層藉由撞擊在該塗層上且使塗層脫離組件之表面的小球或砂粒物理地移除。然而,下層組件表面變得暴露於轟擊小球或砂粒且小球或砂粒侵蝕暴露的組件表面,從而將材料自暴露的組件表面移除且導致尺寸變化,該等尺寸變化將最終需要組件之置換。在組件為在半導體之製造中使用的製程腔室中所使用的零件的情況下,零件之尺寸完整性通常為對於電氣、流體流動、溫度或其他製程性質中之至少一個關鍵的,且因而為對製造製程之可重複性關鍵的。在諸如氧化鉿、氧化鋁的材料,及其他難移除材料,或其蝕刻副產物沉積在組件上的情況下,噴丸或噴砂經視為用以移除塗層的唯一實際方式,因為塗層與蝕刻劑的反應速率為如此低,使得用以將不合需要的塗層蝕刻掉的時間經視為商業上不切實際的。Some materials are not susceptible to removal by wet or dry etching techniques because the etch rate of the coating is so low that the time used to remove the coating is excessive. Here, the coating is usually removed by shot blasting or sand blasting, in which the coating is physically removed by small balls or grit that impact on the coating and lift the coating off the surface of the component. However, the underlying component surface becomes exposed to the impinging balls or grit and the balls or grit erode the exposed component surface, thereby removing material from the exposed component surface and causing dimensional changes that will ultimately require replacement of the component. In the case of components that are used in process chambers used in the manufacture of semiconductors, the dimensional integrity of the component is typically critical to at least one of electrical, fluid flow, temperature or other process properties, and thus critical to the repeatability of the manufacturing process. In the case of materials such as einsteinium oxide, aluminum oxide, and other difficult to remove materials, or their etch byproducts deposited on the component, shot blasting or sand blasting has been considered the only practical way to remove the coating because the reaction rate of the coating with the etchant is so slow that the time to etch away the undesirable coating has been considered commercially impractical.

本文提供用於自組件之表面移除塗層的方法及設備,該組件包括組件之至少一外部表面、諸如進入組件中的孔或開口的組件之凹入表面、自組件之外部可存取的組件之內部表面,或具有黏合在或黏合至上面的希望移除的材料之其他組件表面。在一個態樣中,塗層移除容器包括外主體,該外主體包含處理容積及進入該處理容積中的開口;開口上的覆蓋,該覆蓋包括其中的密封件,該密封件可與外主體之表面及覆蓋接觸;組件夾持器,該組件夾持器可移除地可定位於處理容積中;加熱器,該加熱器經組配以在供應至處理容積時,將清潔流體加熱至大於清潔流體在包圍塗層移除容器的環境壓力下之沸點的溫度;以及壓力調節器,其中在組件夾持器定位於處理容積中,且覆蓋密封地連接至容器以關閉開口且將處理容積與周圍環境密封的情況下,且可定位於處理容積中的清潔流體可加熱至高於其在周圍環境中之沸點的溫度,但自加壓至足以防止該清潔流體在壓力容器中沸騰的壓力。Provided herein are methods and apparatus for removing coatings from surfaces of components, including at least one exterior surface of the component, a recessed surface of the component such as into a hole or opening in the component, an interior surface of the component accessible from the exterior of the component, or other component surface having a material to be removed adhered thereto or thereto. In one aspect, the coating removal container includes an outer body comprising a processing volume and an opening into the processing volume; a cover over the opening, the cover including a seal therein that is contactable with a surface of the outer body and the cover; a component holder that is removably positionable in the processing volume; and a heater configured to heat a cleaning fluid to a temperature greater than the cleaning fluid when supplied to the processing volume. a pressure regulator wherein, with the assembly holder positioned in the process volume and the cover sealingly connected to the vessel to close the opening and seal the process volume from the surrounding environment, a cleaning fluid positioned in the process volume can be heated to a temperature above its boiling point in the surrounding environment but is self-pressurized to a pressure sufficient to prevent the cleaning fluid from boiling in the pressure vessel.

在另一態樣中,自組件移除塗層之方法包括提供其中具有可密封處理容積的塗層移除容器;在該可密封處理容積中提供塗層移除流體,該塗層移除流體在高於包圍該移除容器的環境溫度的高溫處與該塗層反應;將上面具有將要在該塗層移除容器中移除之塗層的組件定位於該塗層移除容器之該處理容積中;將該可密封處理容積與包圍該處理容積的環境密封;將該塗層移除流體加熱至大於該塗層移除流體在該周圍環境之壓力下之沸點的溫度;在大於該塗層移除流體在該周圍環境之該壓力下之該沸點的該溫度處使用該塗層移除流體來自該組件移除該塗層;將該塗層移除流體之該溫度降低至小於該塗層移除流體在該周圍環境之該壓力下之該沸點的溫度;使該可密封容積排放至該周圍環境;以及自該處理容積移除該組件。In another aspect, a method for removing a coating from a component includes providing a coating removal container having a sealable processing volume therein; providing a coating removal fluid in the sealable processing volume, the coating removal fluid reacting with the coating at an elevated temperature above the temperature of an environment surrounding the removal container; positioning a component having a coating to be removed in the coating removal container in the processing volume of the coating removal container; sealing the sealable processing volume from the environment surrounding the processing volume; and heating the coating removal fluid to a temperature greater than the boiling point of the coating removal fluid at the pressure of the surrounding environment; using the coating removal fluid to remove the coating from the component at the temperature greater than the boiling point of the coating removal fluid at the pressure of the surrounding environment; reducing the temperature of the coating removal fluid to a temperature less than the boiling point of the coating removal fluid at the pressure of the surrounding environment; venting the sealable volume to the surrounding environment; and removing the component from the processing volume.

在另一態樣中,塗層移除系統包括圍阻容器,該圍阻容器具有內部容積及可密封門;以及一或多個塗層移除容器,該塗層移除容器經組配以經接收在該圍阻容器內。In another aspect, a coating removal system includes a containment container having an interior volume and a sealable door; and one or more coating removal containers configured to be received within the containment container.

在另一態樣中,自組件移除塗層之方法包括提供圍阻容器,該圍阻容器具有內部容積及可密封門;提供一或多個塗層移除容器,該一或多個塗層移除容器經組配以經接收在該圍阻容器內;在該塗層移除容器中提供塗層移除液體;將組件定位至塗層移除容器中;將該塗層移除容器定位於該圍阻容器之該內部容積內,及關閉該可密封門以密封該內部容積;以及將該塗層移除流體之壓力及溫度增加至大於該塗層移除流體之沸點的溫度而將該塗層移除流體維持在液體狀態中。In another aspect, a method of removing coating from an assembly includes providing a containment container having an interior volume and a sealable door; providing one or more coating removal containers configured to be received within the containment container; providing a coating removal liquid in the coating removal container; positioning an assembly into the coating removal container; positioning the coating removal container within the interior volume of the containment container, and closing the sealable door to seal the interior volume; and increasing the pressure and temperature of the coating removal fluid to a temperature greater than the boiling point of the coating removal fluid to maintain the coating removal fluid in a liquid state.

在本文中,描述用於自下層組件,例如自在製造設備中使用的組件,包括在半導體製造設備中使用且暴露於半導體處理環境的組件移除塗層的方法及設備。在本文中,基本組件,亦即處於經置放至一類型的處理設備中且暴露於製程環境的條件下的組件,具有下層材料組成,該基本組件可包括由單個材料構成的組件、由若干不同材料組成的零件、塗層意欲保護下層組件材料免於暴露於製造環境的塗佈零件,或其他組成。Herein, methods and apparatus are described for removing coatings from underlying components, such as components used in manufacturing equipment, including components used in semiconductor manufacturing equipment and exposed to semiconductor processing environments. Herein, a base component, i.e., a component under the conditions of being placed in a type of processing equipment and exposed to a process environment, has an underlying material composition, which may include a component composed of a single material, a part composed of several different materials, a coated part where the coating is intended to protect the underlying component material from exposure to the manufacturing environment, or other compositions.

此類示範性零件包括碳化矽組件諸如環等,及在處理設備中使用的金屬組件諸如護罩、腔室、蓮蓬頭、排氣導管等。此等組件具有關鍵厚度、關鍵孔尺寸,及其他關鍵特徵尺寸。孔之尺寸,包括直徑(多個)、錐角、深度等經視為對於製造環境中,例如半導體處理腔室中的護罩之有效使用關鍵的。熟知的是,在使用期間,膜層形成為此等組件之表面上的塗層且在一定時段、沉積厚度、製程設備操作小時數,或其他準則之後必須經移除。因為組件為昂貴的,所以製造設備之使用者將清潔且重新使用該等組件,此舉包括移除在使用期間沉積在上面的膜層,亦即,不合需要的塗層。組件可重新使用的次數部分地依賴於在塗層移除製程期間移除組件之下層材料中之多少,尤其在關鍵尺寸區域諸如其孔中。組件之使用者之期望將自組件移除塗層,且最大可能次數地重新使用組件。Exemplary parts of this type include silicon carbide components such as rings, and metal components used in processing equipment such as shields, chambers, showerheads, exhaust ducts, etc. These components have critical thicknesses, critical hole sizes, and other critical feature sizes. The hole sizes, including diameter(s), taper, depth, etc. are considered critical to the effective use of shields in manufacturing environments, such as semiconductor processing chambers. It is well known that during use, films are formed as coatings on the surfaces of these components and must be removed after a certain period of time, deposition thickness, number of hours of process equipment operation, or other criteria. Because components are expensive, users of manufacturing equipment will clean and reuse them, which includes removing films that deposit on them during use, i.e., undesirable coatings. The number of times a component can be reused depends in part on how much of the component's underlying material is removed during the coating removal process, especially in critical size areas such as its pores. The desire of the component user is to remove the coating from the component and reuse the component as many times as possible.

在此,為移除塗層,在高於大氣壓力下的流體之沸點的流體之溫度下使用塗層移除流體,亦即,其中具有活性化學品的移除流體,該活性化學品能夠在室溫(20 C)下但以不可接受地低的蝕刻速率蝕刻掉,亦即,移除,不合需要的塗層,或在室溫下不能移除下層塗層之材料。此藉由在組件暴露於塗層移除流體期間將具有設置在其中之組件的移除流體維持在超大氣壓力,亦即,高於執行製程的局部環境大氣壓力之壓力處來實現。因而,在製程腔室或製造環境中的組件之使用期間沉積在上面的不合需要的塗層之材料與塗層移除流體接觸,該塗層移除流體處於大於其在正常或局部大氣壓力下,亦即,在760托下或附近之沸點的溫度處。替代地,移除流體可經維持在液體狀態的塗層材料流體之維持由於其過量汽化而變得困難的溫度處,例如在大氣壓力下的沸點溫度之70%至100%處。Here, to remove the coating, a coating removal fluid is used at a temperature of the fluid above the boiling point of the fluid at atmospheric pressure, i.e., a removal fluid having an active chemistry therein that is capable of etching away, i.e., removing, the undesirable coating at room temperature (20° C.) but at an unacceptably low etching rate, or material from which the underlying coating cannot be removed at room temperature. This is accomplished by maintaining the removal fluid with the component disposed therein at a superatmospheric pressure, i.e., a pressure above the local ambient atmospheric pressure in which the process is performed, during exposure of the component to the coating removal fluid. Thus, the material of the undesirable coating deposited thereon during use of the component in the process chamber or manufacturing environment is in contact with a coating removal fluid at a temperature greater than its boiling point at normal or local atmospheric pressure, i.e., at or near 760 Torr. Alternatively, the removal fluid may be maintained at a temperature at which maintenance of the coating material fluid in a liquid state becomes difficult due to its excessive vaporization, such as at 70% to 100% of the boiling point temperature at atmospheric pressure.

因而,在一個態樣中,提供塗層移除容器100,該塗層移除容器作用來在大氣壓力下將組件收納在其中,且提供密封環境以使其中的塗層移除流體之溫度升高至大於該塗層移除流體在大氣壓力下之沸點的溫度而維持其中的條件,使得移除流體不沸騰。此藉由將塗層移除流體維持在容器100內之密封環境中,且然後將流體自低於其在周圍環境中之沸點的溫度加熱至高於彼沸點之溫度來實現。因為流體容積經密封,所以當流體在其變得接近其大氣壓力沸點時散發蒸氣時,蒸氣經密封在容器之固定容積內。因為蒸氣具有相較於塗層移除流體的較低密度,所以該蒸氣將保持在塗層移除流體上方或之上的頂部空間中且在塗層移除流體之溫度增加時將變得加壓,從而產生塗層移除流體之蒸氣壓力,且自此釋放更多蒸氣,從而變得與頂部空間中之增加的壓力相等,且彼壓力足以防止塗層移除流體沸騰,即使該塗層移除流體處於高於其在大氣壓力下之沸點的溫度處。在相較於當塗層移除流體暴露於周圍大氣條件時液體塗層移除流體中可達成的此較高溫度處,塗層材料之蝕刻速率對於特定塗層移除流體化學品顯著地增加。此允許在先前技術中使用濕式蝕刻劑為不可能或不切實際的組件上之塗層之濕式蝕刻移除。Thus, in one aspect, a coating removal container 100 is provided that functions to contain the assembly therein at atmospheric pressure and provides a sealed environment to raise the temperature of the coating removal fluid therein to a temperature greater than the boiling point of the coating removal fluid at atmospheric pressure while maintaining conditions therein such that the removal fluid does not boil. This is achieved by maintaining the coating removal fluid in a sealed environment within the container 100 and then heating the fluid from a temperature below its boiling point in the surrounding environment to a temperature above that boiling point. Because the fluid volume is sealed, when the fluid emits vapor as it becomes close to its atmospheric pressure boiling point, the vapor is sealed within the fixed volume of the container. Because the vapor has a lower density than the coating removal fluid, the vapor will remain in the headspace above or on top of the coating removal fluid and will become pressurized as the temperature of the coating removal fluid increases, thereby creating a vapor pressure of the coating removal fluid, and from there releasing more vapor to become equal to the increased pressure in the headspace, and that pressure is sufficient to prevent the coating removal fluid from boiling, even if the coating removal fluid is at a temperature above its boiling point at atmospheric pressure. At such higher temperatures than can be achieved in a liquid coating removal fluid when the coating removal fluid is exposed to ambient atmospheric conditions, the etching rate of the coating material is significantly increased for a particular coating removal fluid chemistry. This allows wet etching removal of coatings on components that were not possible or practical using wet etchants in the prior art.

在此,在一個態樣中,塗層移除容器100在第1圖中以截面示出且大體上包括其中形成處理容積106的大體上正環形主體104、可釋放地緊固至主體104的可移除覆蓋102、溫度維持系統108、藉由覆蓋102與處理容積106流體連通的第一流體線路110、藉由覆蓋102與處理容積106流體連通的第二流體線路112,及形成流體出口的第三流體線路114入口,該第三流體線路入口藉由主體104之基底116與處理容積106流體連通。第一流體線路110在覆蓋102遠側的該第一流體線路之末端處用破裂圓盤120關閉。破裂圓盤120經組配以在低於塗層移除容器100由於其過壓條件而將失靈或將洩漏之壓力的壓力下破碎或破裂。替代地,可使用釋壓閥代替破裂圓盤120。第二流體線路112藉由如第2圖中所示之通氣閥122連接至收集容器199。通氣閥122可經手動地或自動地操作,以允許處理容積106內之流體自處理容積106釋放,該流體包括塗層移除容器100之頂部空間128中藉由加熱其中之移除流體126產生的超大氣蒸氣124。第三流體線路114在此經組配以提供流體排洩口以允許液體形式的移除流體藉由重力自塗層移除容器100之處理容積106排洩。在此,排泄閥130藉由凸緣連接132連接至主體104之基底116之外部遠側的第三流體線路114之末端。排泄閥130可具有手動或自動操作,或兩者,且排泄閥130在用以自示意性地示出且設置在處理容積106中的組件200移除塗層的塗層移除容器100之操作期間維持在關閉條件下。Here, in one embodiment, the coating removal container 100 is shown in cross-section in Figure 1 and generally includes a generally annular body 104 forming a processing volume 106, a removable cover 102 releasably secured to the body 104, a temperature maintenance system 108, a first fluid line 110 fluidly connected to the processing volume 106 through the cover 102, a second fluid line 112 fluidly connected to the processing volume 106 through the cover 102, and an inlet of a third fluid line 114 forming a fluid outlet, the third fluid line inlet being fluidly connected to the processing volume 106 through a base 116 of the body 104. The first fluid line 110 is closed with a rupture disc 120 at the end of the first fluid line distal to the cover 102. The rupture disc 120 is configured to break or rupture at a pressure below the pressure at which the coating removal container 100 would fail or would leak due to its overpressure condition. Alternatively, a pressure relief valve may be used in place of the rupture disc 120. The second fluid line 112 is connected to the collection container 199 via a vent valve 122 as shown in FIG. The vent valve 122 can be operated manually or automatically to allow fluid within the processing volume 106 to be released from the processing volume 106, including supergas vapor 124 generated by heating the removal fluid 126 therein in the head space 128 of the coating removal vessel 100. The third fluid line 114 is here configured to provide a fluid drain port to allow the removal fluid in liquid form to drain by gravity from the processing volume 106 of the coating removal vessel 100. Here, the drain valve 130 is connected to the end of the third fluid line 114 on the outside of the base 116 of the main body 104 by a flange connection 132. The drain valve 130 may have manual or automatic operation, or both, and is maintained in a closed condition during operation of the coating removal vessel 100 for removing coating from an assembly 200 schematically shown and disposed in the processing volume 106.

主體104大體上組配為正環形殼,具有在處理容積106周圍沿圓周延伸的圓周容器壁134、自容器壁134之下圓周末端壁138延伸的凸形基底壁136,及形成主體104之上末端壁140的圓周凸緣152。著陸表面142提供在面向處理容積106且定界處理容積106之下部分的凸形基底壁136之內表面144上。著陸表面142可為自凸形基底壁136之內表面144向處理容積106內延伸的圓周壁架、自凸形基底壁136之內表面144向處理容積106內延伸且沿圓周路徑彼此間隔開的一系列突出物、定位於自凸形基底壁136之內表面144向處理容積106內延伸上的分離插入物,或另一結構。著陸表面142合意地在垂直於重力方向之方向上延伸,亦即大體上水平地且平行於上末端壁140延伸,且經組配以允許諸如籠或籃146的組件夾持器置放在上面而不在朝向容器壁134之方向上滑動。籃146用來含有或容納一或多個組件200,該一或多個組件上具有將要在塗層移除容器100中自該一或多個組件移除的一或多個塗層。The body 104 is generally configured as a right annular shell having a circumferential container wall 134 extending circumferentially around the processing volume 106, a convex base wall 136 extending from a circumferential end wall 138 below the container wall 134, and a circumferential flange 152 forming an upper end wall 140 of the body 104. A landing surface 142 is provided on an inner surface 144 of the convex base wall 136 facing the processing volume 106 and delimiting a lower portion of the processing volume 106. The landing surface 142 may be a circumferential ledge extending from the inner surface 144 of the convex base wall 136 into the processing volume 106, a series of protrusions extending from the inner surface 144 of the convex base wall 136 into the processing volume 106 and spaced apart from each other along a circumferential path, a separate insert positioned on the inner surface 144 of the convex base wall 136 extending into the processing volume 106, or another structure. The landing surface 142 desirably extends in a direction perpendicular to the direction of gravity, i.e., generally horizontally and parallel to the upper end wall 140, and is configured to allow a component holder such as a cage or basket 146 to be placed thereon without sliding in a direction toward the container wall 134. The basket 146 is used to contain or accommodate one or more components 200 having one or more coatings thereon to be removed from the one or more components in the coating removal container 100 .

溫度維持系統108經提供來將處理容積106中之移除流體126加熱至用於處理容積106中之組件200上的一或多個塗層之移除的所要的溫度,且在塗層移除製程期間維持移除流體126之所要的溫度。塗層移除流體126流體之溫度可在塗層自組件200之移除期間維持在單個溫度處或所要的溫度範圍內,或可在塗層移除製程期間的不同時間使用不同溫度或溫度範圍。為向容器100提供此能力,溫度維持系統108包括包圍容器壁104之外部表面150的加熱器148,及冷卻通道151,該冷卻通道在其相反的第一末端154及第二末端156處延伸穿過圓周凸緣152且在處理容積106內在該第一末端與該第二末端之間延伸且與移除流體126接觸。在此,冷卻通道151經組配為流體冷卻劑可流過的配管之長度,其中其在處理容積106內的部分以具有盤管內徑160之正環形盤管158之形狀組配。盤管內徑160經組配為大於籃146之最大寬度尺寸,以允許籃146經自由地置放至處理容積中且自處理容積移除,且維持籃146之側與盤管158之鄰近周圍表面之間的間隙以允許移除流體存在於其間。冷卻通道151之相反的第一末端154及第二末端156流體地連接至第2圖中示意性地示出的冷凍器162及泵164,且冷凍器162及泵164操作性地連接至系統控制器166。冷凍器162冷卻自冷卻通道151之第二末端156流動的流體冷卻劑且泵164使冷凍或冷卻的流體流動至冷卻通道151之第一末端154中。加熱器148經提供為加熱護套或可環繞容器壁134之外部表面150的其他加熱系統。加熱器148可經提供為單個環繞元件諸如加熱毯,提供為各自在高度上小於容器壁134之高度且一個堆疊在另一個之上的多個環繞元件,提供為並排安置在容器壁134之外部表面150周圍的單獨加熱器分段,或其組合。加熱器148或其單獨分離部分當使用時為操作性地連接至電源供應器172的電阻加熱器,該電源供應器操作性地連接至系統控制器166 (第2圖)。熱電偶174定位於處理容積中且藉由熱電偶絲操作性地連接至系統控制器166。系統控制器166使用熱電偶174來監測處理容積中的移除液體之溫度。儘管示出僅一個熱電偶174,但多個此類裝置可部署在處理容積106內之不同位置處。A temperature maintenance system 108 is provided to heat the removal fluid 126 in the processing volume 106 to a desired temperature for removal of one or more coatings on the component 200 in the processing volume 106, and to maintain the desired temperature of the removal fluid 126 during the coating removal process. The temperature of the coating removal fluid 126 fluid may be maintained at a single temperature or within a desired temperature range during removal of the coating from the component 200, or different temperatures or temperature ranges may be used at different times during the coating removal process. To provide this capability to the vessel 100, the temperature maintenance system 108 includes a heater 148 surrounding an exterior surface 150 of the vessel wall 104, and a cooling channel 151 extending through a circumferential flange 152 at its opposite first and second ends 154, 156 and extending within the processing volume 106 between the first and second ends and in contact with the removal fluid 126. Here, the cooling channel 151 is configured as a length of tubing through which a fluid coolant may flow, wherein the portion thereof within the processing volume 106 is configured in the shape of a positive annular coil 158 having a coil inner diameter 160. The coil inner diameter 160 is configured to be larger than the maximum width dimension of the basket 146 to allow the basket 146 to be freely placed into and removed from the processing volume, and to maintain a gap between the sides of the basket 146 and the adjacent surrounding surface of the coil 158 to allow removal fluid to exist therebetween. The opposite first and second ends 154, 156 of the cooling channel 151 are fluidly connected to a freezer 162 and a pump 164, schematically shown in FIG. 2, and the freezer 162 and the pump 164 are operatively connected to a system controller 166. A freezer 162 cools the fluid coolant flowing from the second end 156 of the cooling channel 151 and a pump 164 causes the frozen or cooled fluid to flow into the first end 154 of the cooling channel 151. The heater 148 is provided as a heating jacket or other heating system that can surround the exterior surface 150 of the container wall 134. The heater 148 can be provided as a single surrounding element such as a heating blanket, as a plurality of surrounding elements each less than the height of the container wall 134 and stacked one on top of the other, as individual heater segments disposed side by side around the exterior surface 150 of the container wall 134, or a combination thereof. The heater 148 or a separate separate portion thereof, when used, is a resistive heater operatively connected to a power supply 172, which is operatively connected to a system controller 166 (FIG. 2). A thermocouple 174 is positioned in the process volume and operatively connected to the system controller 166 by a thermocouple wire. The system controller 166 uses the thermocouple 174 to monitor the temperature of the removed liquid in the process volume. Although only one thermocouple 174 is shown, multiple such devices may be deployed at different locations within the process volume 106.

如本文將進一步描述,加熱器148用來在操作性地連接到電源供應器172的系統控制器166之控制下將塗層移除流體126加熱至其所要的塗層移除溫度。流過冷卻通道151的流體用來將熱自移除流體移除。藉由在處理容積106中之組件200上的塗層移除製程期間引起塗層移除流體之冷卻及加熱的系統控制器166之操作,可在塗層移除製程期間達到且維持一或多個所要的設定點溫度或溫度範圍。As will be further described herein, the heater 148 is used to heat the coating removal fluid 126 to its desired coating removal temperature under the control of a system controller 166 operatively connected to a power supply 172. The fluid flowing through the cooling channel 151 is used to remove heat from the removal fluid. By operation of the system controller 166 to cause cooling and heating of the coating removal fluid during a coating removal process on a component 200 in the processing volume 106, one or more desired set point temperatures or temperature ranges can be achieved and maintained during the coating removal process.

覆蓋102經組配以可釋放地緊固至形成主體104之上末端壁140的圓周凸緣152。當移除時,處理容積106為可接近的,以將其中的籃146及組件200 (多個)置放至處理容積106中,或將其自處理容積106移除。覆蓋102至圓周凸緣152之緊固可藉由夾具、螺栓或類似者提供,且在此覆蓋102包括自覆蓋突出的其上表面176、吊機或架空升降機可連接來用於將覆蓋102升離主體104之上末端壁140的吊孔178,及延伸穿過該覆蓋且沿螺栓圓圈180彼此間隔開的複數個扣件開口180。圓周凸緣152包括數目對應於扣件開口180的螺椿182,該等螺椿大體上垂直於主體104之上末端壁140退出。螺椿中之每一個沿螺栓圓圈佈置,且以與扣件開口180之彼間隔相同的間隔沿螺栓圓圈彼此間隔開。每個螺椿182包括自主體104之上末端壁140向圓周凸緣152內延伸的基底部分184,及在穿過覆蓋的扣件開口180之位置處沿遠離主體104之上末端壁140的方向延伸大於覆蓋102之厚度之距離的螺紋柄部分186。The cover 102 is configured to be releasably secured to a circumferential flange 152 forming an upper end wall 140 of the body 104. When removed, the processing volume 106 is accessible to place the basket 146 and the assembly 200(s) therein into or remove them from the processing volume 106. The fastening of the cover 102 to the circumferential flange 152 may be provided by clamps, bolts or the like, and in this case the cover 102 includes an upper surface 176 thereof protruding from the cover, a lifting hole 178 to which a crane or overhead lift may be connected for lifting the cover 102 off the upper end wall 140 of the body 104, and a plurality of fastener openings 180 extending through the cover and spaced apart from one another along a bolt circle 180. The circumferential flange 152 includes a number of studs 182 corresponding to the number of fastener openings 180, which exit generally perpendicular to the upper end wall 140 of the body 104. Each of the studs is arranged along the bolt circle and is spaced apart from one another along the bolt circle at the same spacing as the spacing of the fastener openings 180. Each screw 182 includes a base portion 184 extending from the upper end wall 140 of the main body 104 into the circumferential flange 152, and a threaded shank portion 186 extending away from the upper end wall 140 of the main body 104 at a position passing through the fastener opening 180 of the cover by a distance greater than the thickness of the cover 102.

為將覆蓋102可釋放地緊固至主體104,覆蓋102經降低至主體104之上末端壁140上使得不同螺椿182之柄部分186對準以進入每個不同扣件開口180中。然後,覆蓋102進一步降低以使鄰近於其周邊的該覆蓋之內覆蓋表面靠在主體104之上末端壁140上。因此,螺椿182中之每一個之柄部分186之一部分向外覆蓋表面188外延伸足以將墊圈190及螺帽192置放在每個螺椿182之突出部分上的距離。藉由擰緊螺紋軸上的螺帽192,將內覆蓋表面壓抵上末端壁140的上表面。為防止內覆蓋表面與上末端壁140的上表面之間向外流體洩漏,密封溝槽194在螺椿182之螺栓圓圈向內的位置處向上末端壁140內延伸,且亦在上末端壁140周圍沿圓周延伸且延伸至上末端壁140中。密封環196定位於密封溝槽194中,使得密封環196在密封溝槽之圓周伸長範圍上與密封溝槽194之基底198接觸。密封環196及密封溝槽194經定大小,使得當密封環接觸密封溝槽194之基底198時,密封環196在其自由未壓縮狀態中向密封溝槽194外延伸。在覆蓋102降低至上末端壁140上時,內覆蓋表面嚙合密封環196之此突出部分,且在覆蓋102在上末端壁140之方向上進一步降低時,密封環196變得壓縮以維持密封環196與密封溝槽194之基底198之間接觸,且維持內覆蓋表面與密封環196之間的接觸。內覆蓋表面與上末端壁140之間的界面區之此密封用以防止經由其界接表面的流體洩漏。To releasably secure the cover 102 to the body 104, the cover 102 is lowered onto the upper end wall 140 of the body 104 so that the shank portions 186 of the different screws 182 are aligned to enter each of the different fastener openings 180. The cover 102 is then further lowered so that the inner cover surface of the cover adjacent its periphery rests against the upper end wall 140 of the body 104. Thus, a portion of the shank portion 186 of each of the screws 182 extends outwardly of the outer cover surface 188 a distance sufficient to place the washer 190 and nut 192 on the protruding portion of each screw 182. By tightening the nut 192 on the threaded shaft, the inner cover surface is pressed against the upper surface of the upper end wall 140. To prevent outward fluid leakage between the inner cover surface and the upper surface of the upper end wall 140, a sealing groove 194 extends into the upper end wall 140 at a location inward of the bolt circle of the stud 182, and also extends circumferentially around and into the upper end wall 140. A sealing ring 196 is positioned in the sealing groove 194 so that the sealing ring 196 contacts the base 198 of the sealing groove 194 over the circumferential extension of the sealing groove. The sealing ring 196 and the sealing groove 194 are sized so that when the sealing ring contacts the base 198 of the sealing groove 194, the sealing ring 196 extends out of the sealing groove 194 in its free, uncompressed state. As the cover 102 is lowered onto the upper end wall 140, the inner cover surface engages this protruding portion of the sealing ring 196, and as the cover 102 is further lowered in the direction of the upper end wall 140, the sealing ring 196 becomes compressed to maintain contact between the sealing ring 196 and the base 198 of the sealing groove 194, and to maintain contact between the inner cover surface and the sealing ring 196. This seal of the interface area between the inner cover surface and the upper end wall 140 serves to prevent leakage of fluid through the interface surfaces thereof.

在移除容器100用來將不需要的或不合需要的塗層自組件200移除期間,組件200,或複數個組件,經置放至籃146中,且籃146與其中的組件200經降低至存在於處理容積106中的移除流體126中。覆蓋102然後經降低至上末端壁140上且藉由將墊圈190置放在每個螺椿182之每個突出部分上且將螺帽192旋擰至每個螺椿182之突出部分上來緊固至上末端壁140。螺帽192然後經擰緊以抵靠外覆蓋表面188緊固墊圈中之每一個且因而將覆蓋102緊固至主體104。During the use of the removal container 100 to remove unwanted or undesirable coatings from the assembly 200, the assembly 200, or a plurality of assemblies, is placed into the basket 146, and the basket 146 with the assembly 200 therein is lowered into the removal fluid 126 present in the processing volume 106. The cover 102 is then lowered onto the upper end wall 140 and secured to the upper end wall 140 by placing a gasket 190 over each protrusion of each stud 182 and screwing a nut 192 onto the protrusion of each stud 182. The nut 192 is then tightened to secure each of the gaskets against the outer cover surface 188 and thereby secure the cover 102 to the body 104.

一旦覆蓋102經緊固至主體104,系統控制器166啟動電源供應器172以將功率供應至加熱器148且啟動泵164以開始藉由冷卻通道151泵送冷卻流體。可在移除流體126之加熱期間、之後,或在該加熱期間且在該加熱之後泵送冷卻流體。當達到移除流體之所要的溫度時,系統控制器166控制冷凍器162以使在流過冷卻通道151時已吸收熱的冷卻流體適當地冷卻,且同時藉由變化由電源供應器172供應至加熱器148的電壓、電流或兩者來控制加熱器148之操作,以維持移除流體126之所要的溫度。Once the cover 102 is secured to the body 104, the system controller 166 activates the power supply 172 to supply power to the heater 148 and activates the pump 164 to begin pumping the cooling fluid through the cooling channel 151. The cooling fluid may be pumped during, after, or during and after the heating of the removal fluid 126. When the desired temperature of the removal fluid is reached, the system controller 166 controls the freezer 162 to appropriately cool the cooling fluid that has absorbed heat while flowing through the cooling channel 151, and at the same time controls the operation of the heater 148 by varying the voltage, current, or both supplied to the heater 148 by the power supply 172 to maintain the desired temperature of the removal fluid 126.

當具有塗層將自其移除的組件200的籃146經置放至移除流體126中,且覆蓋102經緊固至上末端壁140時,移除流體及設置在移除流體126與覆蓋102之間的任何空氣處於大氣壓力下或暴露於大氣壓力。在用以移除組件200上之塗層的移除流體至所要的製程溫度之後續加熱期間,將通氣閥122及排泄閥130維持在關閉位置中,且因而防止液體向處理容積106外流動。因為處理容積106藉由通氣閥122及排泄閥130位置且藉由連接至上末端壁140的覆蓋102密封,所以在移除流體126經加熱時,蒸氣124將逐步形成。因為蒸氣具有相較於以液體狀態存在且包圍將要處理的組件200的移除流體126的較低密度,所以蒸氣124將聚集在液體移除流體126上方的頂部空間128中。在此蒸氣124繼續逐步形成時,頂部空間128中之壓力增加至大於周圍環境大氣壓力的位準。此壓力導致液體移除流體之蒸氣壓力變得與頂部空間中之增加的壓力相等,且因而現在處於大於大氣壓力之壓力處的塗層移除流體處於在處理容積106內具有相較於其在直接包圍容器100的環境大氣壓力下之沸點的較高沸點之壓力下。因而,液體形式的移除流體126可經加熱至遠高於其在周圍環境大氣壓力下之沸點的溫度,因為自液體移除流體126逐漸形成的蒸氣124將上升至頂部空間128中且使處理容積106內之壓力進一步增加。When the basket 146 with the component 200 from which the coating is to be removed is placed into the removal fluid 126 and the cover 102 is secured to the upper end wall 140, the removal fluid and any air disposed between the removal fluid 126 and the cover 102 are under or exposed to atmospheric pressure. During the subsequent heating of the removal fluid to the desired process temperature for removing the coating on the component 200, the vent valve 122 and the drain valve 130 are maintained in the closed position and thus prevent the liquid from flowing out of the processing volume 106. Because the process volume 106 is sealed by the vent valve 122 and drain valve 130 positions and by the cover 102 connected to the upper end wall 140, vapor 124 will gradually form as the removal fluid 126 is heated. Because the vapor has a lower density than the removal fluid 126 in a liquid state and surrounding the component 200 to be processed, the vapor 124 will accumulate in the head space 128 above the liquid removal fluid 126. As this vapor 124 continues to develop, the pressure in the head space 128 increases to a level greater than the surrounding ambient atmospheric pressure. This pressure causes the vapor pressure of the liquid removal fluid to become equal to the increased pressure in the headspace, and thus the coating removal fluid, now at a pressure greater than atmospheric pressure, is at a pressure within the processing volume 106 having a higher boiling point than its boiling point at the ambient atmospheric pressure immediately surrounding the vessel 100. Thus, the removal fluid 126 in liquid form can be heated to a temperature well above its boiling point at the surrounding ambient atmospheric pressure because the vapor 124 that is gradually formed from the liquid removal fluid 126 will rise into the headspace 128 and cause the pressure within the processing volume 106 to increase further.

在移除流體加熱至所要的處理溫度以將塗層自組件200移除時,包圍組件200的移除流體126之蝕刻或移除速率增加。此增加允許移除流體將先前使用噴丸或噴砂或其他物理移除技術移除的塗層移除。在此,移除流體之化學品經選擇為對於將要自組件移除的塗層下層的組件之材料相對不起反應,但充分地反應以允許塗層在商業合理的時段內自組件移除。當塗層經自組件移除時,清潔製程終止,亦即,達到終點,在此之後移除流體經被動地或主動地冷卻,且頂部空間128藉由第二流體線路112及通氣閥122排放至大氣壓力。The etching or removal rate of the removal fluid 126 surrounding the component 200 increases as the removal fluid is heated to the desired processing temperature to remove the coating from the component 200. This increase allows the removal fluid to remove coatings that were previously removed using shot blasting or sand blasting or other physical removal techniques. Here, the chemistry of the removal fluid is selected to be relatively unreactive to the material of the component underlying the coating to be removed from the component, but sufficiently reactive to allow the coating to be removed from the component within a commercially reasonable period of time. When the coating is removed from the component, the cleaning process terminates, i.e., reaches the end point, after which the removal fluid is passively or actively cooled and the head space 128 is vented to atmospheric pressure via the second fluid line 112 and the vent valve 122.

許多製程終點範例可用來決定何時藉由將通氣閥122移動至敞開位置來使移除容器100之處理容積106經由第二流體線路112排放。例如,可考慮塗層移除製程時間、溫度、蝕刻速率及將要移除的塗層之厚度。零件已暴露於高溫移除流體的時間及初始移除流體溫度至較高製程溫度之間的斜坡時間,及自較高製程溫度至顯著的蒸氣不在大氣壓力下逐步形成的溫度的斜坡時間之量係基於將要移除的塗層之厚度來選擇。因為在溫度正上升至製程溫度或下降至移除流體之開放溫度時移除液體將仍與塗層反應,所以技術人員必須將此納入考慮以決定使溫度多快地斜升且斜降,及將組件200及呈液體狀態的包圍組件200的移除流體維持在高溫處多久。Many process endpoint examples may be used to determine when to vent the processing volume 106 of the removal vessel 100 through the second fluid line 112 by moving the vent valve 122 to the open position. For example, the coating removal process time, temperature, etch rate, and thickness of the coating to be removed may be considered. The amount of time the part has been exposed to the elevated temperature removal fluid and the ramp time between the initial removal fluid temperature to the higher process temperature, and the ramp time from the higher process temperature to a temperature at which significant vapor is not gradually formed at atmospheric pressure are selected based on the thickness of the coating to be removed. Because the removal fluid will still react with the coating as the temperature is rising to the process temperature or falling to the open temperature of the removal fluid, the technician must take this into consideration to decide how quickly to ramp up and down the temperature, and how long to maintain the component 200 and the removal fluid surrounding the component 200 in a liquid state at a high temperature.

為將組件200自塗層移除容器100移除,系統控制器166控制冷凍器162以繼續使已在流過冷卻通道151時吸收熱的冷卻流體冷卻,且同時控制電源供應器172以停止將功率供應至加熱器148。系統控制器166可使穿過泵164的冷卻劑之流動速率增加,使藉由冷凍器162自冷卻流體的熱移除增加以降低進入盤管158的冷卻流體之溫度,或兩者,以使自移除流體126的熱移除增加且減少時間,直至移除流體126經冷卻至足以允許塗層移除容器經排放且打開的溫度。當移除流體126之溫度低於其在大氣壓力下之沸點時,通氣閥122可經打開以自頂部空間排放蒸氣且使相反的外覆蓋表面188及內覆蓋表面上或處的壓力相等。可在任何時間,在移除流體126溫度已下降至其在大氣壓力下之沸點以下之前或之後執行排放。然而,當移除流體126溫度處於其在大氣壓力下之沸點處或以上時的排放可引發移除流體之立即沸騰,除非通氣線路經加壓。一旦頂部空間128壓力與周圍環境壓力相等,使螺帽192自螺椿182松脫,將墊圈190移除,且將覆蓋102升離主體以允許接近籃146。籃146經移除,且以其中具有一或多個組件200的額外籃替換以對一或多個額外組件200執行相同塗層材料之移除。To remove the assembly 200 from the coating removal container 100, the system controller 166 controls the freezer 162 to continue cooling the cooling fluid that has absorbed heat while flowing through the cooling channel 151, and simultaneously controls the power supply 172 to stop supplying power to the heater 148. The system controller 166 may increase the flow rate of the coolant through the pump 164, increase the heat removal from the cooling fluid by the freezer 162 to reduce the temperature of the cooling fluid entering the coil 158, or both, to increase the heat removal from the removal fluid 126 and reduce the time until the removal fluid 126 is cooled to a temperature sufficient to allow the coating removal container to be drained and opened. When the temperature of the removal fluid 126 is below its boiling point at atmospheric pressure, the vent valve 122 can be opened to vent vapor from the headspace and equalize the pressure on or at the opposing outer cover surface 188 and inner cover surface. Venting can be performed at any time, before or after the temperature of the removal fluid 126 has dropped below its boiling point at atmospheric pressure. However, venting when the temperature of the removal fluid 126 is at or above its boiling point at atmospheric pressure can cause immediate boiling of the removal fluid unless the vent line is pressurized. Once the pressure in the headspace 128 equals the ambient pressure, the nut 192 is loosened from the stud 182, the washer 190 is removed, and the cover 102 is lifted off the body to allow access to the basket 146. The basket 146 is removed and replaced with an additional basket having one or more components 200 therein to perform the same coating material removal on the one or more additional components 200.

可藉由經由打開排泄閥130且允許移除流體126自處理容積106排洩移除塗層移除流體126來改變移除流體化學品。此後,用例如緩衝劑沖洗主體及覆蓋之內壁,接著是用去離子水的一或多個沖洗,且排泄閥130經移動至關閉位置。在覆蓋102脫離主體104,且排泄閥130處於關閉位置中的情況下,將新的移除化學品灌注至處理容積106中。替代地,第三流體導管193可用來使新的移除流體流動至處理容積106中。在此,第三流體線路114入口下游的排泄線路上之一系列閥及至少一個T形連接可經組配以將用過的移除液體導向至諸如收集容器199的收集設施,或允許新鮮的或不同的移除流體向第三流體線路114入口內流動且自移除流體儲存器197流動至處理容積106中。例如,如第2圖中所示,排泄閥130可經關閉,且再填充閥191經打開,從而允許移除流體儲存器197中之移除流體126藉由穿過第三流體線路114向處理容積106內傳送。然後,再填充閥191經關閉,且對一或多個組件200執行一或多次用於執行自組件之塗層移除的容器100之操作之以上所述循環。The removal fluid chemistry may be changed by removing the coating removal fluid 126 by opening the drain valve 130 and allowing the removal fluid 126 to drain from the treatment volume 106. Thereafter, the inner walls of the body and cover are rinsed with, for example, a buffer, followed by one or more rinses with deionized water, and the drain valve 130 is moved to the closed position. With the cover 102 off the body 104 and the drain valve 130 in the closed position, new removal chemistry is poured into the treatment volume 106. Alternatively, the third fluid conduit 193 may be used to flow new removal fluid into the treatment volume 106. Here, a series of valves and at least one T-connection on the drain line downstream of the inlet of the third fluid line 114 can be configured to direct the spent removal fluid to a collection facility such as a collection container 199, or to allow fresh or different removal fluid to flow into the inlet of the third fluid line 114 and from the removal fluid reservoir 197 into the processing volume 106. For example, as shown in FIG. 2 , the drain valve 130 can be closed and the refill valve 191 opened, thereby allowing the removal fluid 126 in the removal fluid reservoir 197 to be transferred into the processing volume 106 by passing through the third fluid line 114. The refill valve 191 is then closed and the above-described cycle of operations for performing removal of the container 100 from the assembly is performed one or more times for the one or more assemblies 200 .

在另一態樣中,組件自身可為或提供用於在高溫下執行自其內部之塗層移除的壓力容器。在此,例如,製程腔室自身經清潔,其中腔室之內壁已在其中之零件之處理期間經塗佈且塗層必須經移除。在使用期間氣體流過且氣體可在歧管或管道之內表面上形成沉積物的例如氣體歧管及製程配管的其他組件亦可以此方式加以使用,以形成用於塗層之高移除流體溫度移除的內部密封環境,例如在局部環境大氣壓力下的移除流體之沸點之至少50%的溫度,以及在局部環境大氣壓力下的移除流體之沸點以上的溫度。在組件之內容積必須使沉積的塗層自該內容積移除的情況下,若內容積可經密封且安全地加壓至高於周圍環境壓力,則組件可用來提供用於容納加熱至高於其大氣壓力下之沸點的加熱移除流體的壓力容器。In another aspect, the component itself may be or provide a pressure vessel for performing coating removal from its interior at high temperatures. Here, for example, a process chamber itself is cleaned, wherein the interior walls of the chamber have been coated during processing of parts therein and the coating must be removed. Other components such as gas manifolds and process piping through which gases flow during use and which may form deposits on the interior surfaces of the manifold or piping may also be used in this manner to form an internal sealed environment for high removal fluid temperature removal of coatings, such as a temperature of at least 50% of the boiling point of the removal fluid at the local ambient atmospheric pressure, and above the boiling point of the removal fluid at the local ambient atmospheric pressure. Where the content volume of the assembly must have a deposited coating removed therefrom, the assembly may be used to provide a pressure vessel for containing a heat removal fluid heated to above its boiling point at atmospheric pressure if the content volume can be sealed and safely pressurized above the surrounding ambient pressure.

第4圖示意性地示出此組件,在此歧管222,其中在使用中,在處理環境中,氣體藉由可密封螺紋連接進入該歧管之內部且藉由可密封螺紋連接離開該歧管之內部。在此,歧管222包括空心主體202,該空心主體可包括內部擋板、內部曲折路徑,或經組配以使兩個氣體流能夠在其中混合的其他內部架構(未示出)。第一歧管入口204及第二歧管入口206包含與歧管222之內部容積流體連通的流體導管,且歧管222流體出口208同樣與歧管222之內部體積流體連通。在此,歧管222自身提供用於清潔其內部表面的密封壓力容器。為賦能此舉,歧管經包裹在包圍其外表面的組件加熱器210中,或替代地置放至爐中以將歧管222及其中的塗層移除流體加熱至高於移除流體126在周圍大氣壓力下之沸點的溫度。FIG. 4 schematically illustrates this assembly, where a manifold 222 is provided wherein in use, in a process environment, gases enter the interior of the manifold via a sealable threaded connection and exit the interior of the manifold via a sealable threaded connection. Here, the manifold 222 includes a hollow body 202 which may include internal baffles, internal tortuous paths, or other internal structures configured to enable two gas streams to mix therein (not shown). The first manifold inlet 204 and the second manifold inlet 206 include fluid conduits in fluid communication with the internal volume of the manifold 222, and the manifold 222 fluid outlet 208 is likewise in fluid communication with the internal volume of the manifold 222. Here, the manifold 222 itself provides a sealed pressure vessel for cleaning its internal surfaces. To enable this, the manifold is encased in an assembly heater 210 surrounding its outer surface, or alternatively placed in a furnace to heat the manifold 222 and the coating removal fluid therein to a temperature above the boiling point of the removal fluid 126 at the ambient atmospheric pressure.

類似於塗層移除容器100,在此,破裂圓盤212連接至且密封第二歧管入口206,且泄壓閥214在釋放流體管路216中流體地連接至第一歧管入口204。同樣地,歧管排泄閥218在排泄線路220內流體地連接至出口208。Similar to the coating removal container 100, here, a rupture disk 212 is connected to and seals the second manifold inlet 206, and a pressure relief valve 214 is fluidly connected to the first manifold inlet 204 in a relief fluid line 216. Likewise, a manifold drain valve 218 is fluidly connected to the outlet 208 in a drain line 220.

為對歧管222或具有要清潔之內部表面的另一組件之內部表面執行材料移除,將移除流體藉由第一歧管入口204,或替代地,藉由出口208流動至該歧管之內部,在此之後,關閉泄壓閥214且組件加熱器210經供電且產生熱以使移除流體之溫度增加。因為歧管排泄閥218同樣地經關閉,且破裂圓盤212密封第二入口206,所以在移除流體經加熱且逐步形成其蒸氣或氣體時,蒸氣或氣體經截留在歧管之內容積內,且歧管222內之壓力增加至移除流體126將在大氣壓力下過度地蒸發或沸騰的溫度。歧管222經保持在此高溫處預定時段以確保其內表面上之非所要的塗層之完全移除,且然後至組件加熱器210的功率經移除且歧管經允許返回至較低溫度。然後,泄壓閥214經移動至其敞開位置,且歧管排泄閥218同樣地移動至其敞開位置,且移除流體經排洩至諸如第2圖之彼收集容器的收集容器。為移除其中的殘餘移除流體126,歧管222之內部然後用緩衝溶液且然後用去離子水加以沖洗以自其內部移除任何殘餘移除流體。To perform material removal on the interior surface of the manifold 222 or another component having an interior surface to be cleaned, the removal fluid is flowed to the interior of the manifold through the first manifold inlet 204, or alternatively, through the outlet 208, after which the pressure relief valve 214 is closed and the component heater 210 is powered and generates heat to increase the temperature of the removal fluid. Because the manifold drain valve 218 is likewise closed and the rupture disk 212 seals the second inlet 206, as the removal fluid is heated and develops its vapor or gas, the vapor or gas is trapped within the content volume of the manifold, and the pressure within the manifold 222 increases to a temperature at which the removal fluid 126 will evaporate or boil excessively at atmospheric pressure. Manifold 222 is maintained at this high temperature for a predetermined period of time to ensure complete removal of the undesirable coating on its interior surface, and then power to assembly heater 210 is removed and the manifold is allowed to return to a lower temperature. Pressure relief valve 214 is then moved to its open position, and manifold drain valve 218 is likewise moved to its open position, and the removal fluid is drained to a collection container such as that of FIG. 2 . To remove the residual removal fluid 126 therein, the interior of manifold 222 is then flushed with a buffer solution and then with deionized water to remove any residual removal fluid from its interior.

現參考第5圖,示出塗層移除系統之替代構造,其中一或多個塗層移除容器300可設置在可密封圍阻容器302內側,且圍阻容器經加壓以賦能予塗層移除容器300中之組件之超大氣濕式或液體蝕刻。在此,與本文第1圖至第4圖之移除容器100相反,塗層移除容器300無須相對於其周圍環境獨立地加壓,亦即不相對於圍阻容器302之周圍內部圍阻容積304獨立地加熱,且塗層移除容器300替代地在處於圍阻容器302中時充滿加壓塗層移除流體以允許或賦能予定位於該圍阻容器中的塗層移除容器300內之壓力經維持在包圍圍阻容器302的局部大氣環境壓力以上。在此,圍阻容器302自身可經加熱,使得將其中的流體維持在塗層移除腔室300中之塗層移除流體之所要的溫度處或以上。以此方式,塗層移除容器300無須由具有經得起其內部與外部之間的壓力差之充分強度的材料構建。因而,塗層移除容器可由針對材料對與用來自零件移除塗層的移除化學品反應的抗性及對與移除製程之反應產物反應的抗性,及為便於清潔其表面而選擇的材料加以構建。Referring now to FIG. 5 , an alternative configuration of a coating removal system is shown in which one or more coating removal containers 300 may be disposed inside a sealable containment container 302 , and the containment container is pressurized to enable ultra-large-scale wet or liquid etching of components in the coating removal container 300 . Here, in contrast to the removal vessel 100 of FIGS. 1-4 herein, the coating removal vessel 300 need not be independently pressurized relative to its surrounding environment, i.e., independently heated relative to the surrounding internal containment volume 304 of the containment vessel 302, and the coating removal vessel 300 is instead filled with a pressurized coating removal fluid while in the containment vessel 302 to allow or enable the pressure within the coating removal vessel 300 positioned therein to be maintained above the local atmospheric environment pressure surrounding the containment vessel 302. Here, the containment vessel 302 itself may be heated so as to maintain the fluid therein at or above the desired temperature of the coating removal fluid in the coating removal chamber 300. In this manner, the coating removal container 300 need not be constructed of a material having sufficient strength to withstand the pressure differential between its interior and exterior. Thus, the coating removal container can be constructed of a material selected for its resistance to reaction with the removal chemicals used to remove the coating from the parts and for its resistance to reaction with the reaction products of the removal process, and for facilitating cleaning of its surface.

圍阻容器302在此為壓力容器,該壓力容器具有由例如不銹鋼形成的大體上正環形主體外殼301,該大體上正環形主體外殼在其一個末端處具有焊接至主體外殼303之一個大體上環形末端壁的半球形帽303,及鉸接地連接至主體外殼303之相反末端的門320。門320可打開以藉由所得開口306提供對圍阻容積304之存取,且關閉並閂鎖以允許內部圍阻容積304維持高於周圍環境壓力的壓力。閂扣經提供來相對圍阻容器之敞開末端306緊密地緊固門320,且一或多個適當密封件經提供來在門320與包圍敞開末端306的圍阻容器之環形壁307之間產生耐壓密封。替代地,螺椿、墊圈及螺帽可用來將門320之周邊緊固至主體外殼301之環形末端壁307。The containment vessel 302 is here a pressure vessel having a generally annular main body shell 301 formed of, for example, stainless steel, having at one end thereof a hemispherical cap 303 welded to one generally annular end wall of the main body shell 303, and a door 320 hingedly connected to the opposite end of the main body shell 303. The door 320 can be opened to provide access to the containment volume 304 through the resulting opening 306, and closed and latched to allow the inner containment volume 304 to maintain a pressure higher than the ambient pressure. A latch is provided to tightly secure the door 320 relative to the open end 306 of the containment vessel, and one or more suitable seals are provided to create a pressure-resistant seal between the door 320 and the annular wall 307 of the containment vessel surrounding the open end 306. Alternatively, screws, washers and nuts may be used to secure the perimeter of the door 320 to the annular end wall 307 of the main housing 301.

與本文第1圖至第4圖的用於自零件移除塗層的組態相反,在此,塗層將要自其移除的一或多個零件在圍阻容器302外部的位置處置放至一或多個塗層移除容器300中。例如,塗層移除容器300可定位於濕式工作台上,且塗層將自其移除的零件在其中裝載於濕式工作台上。塗層移除容器300可經組配以包括主體,該主體大體上包圍處理空間且具有其開口,該開口藉由覆蓋加以覆蓋。此後,塗層移除容器300或容器300經裝載至圍阻容器302之敞開末端306中。擱板或基座310藉由間隙器311支撐脫離主體外殼301之下部分,且基座310將塗層移除容器或容器300支撐在上面。內部容積流體地連接至壓力容器400中之加熱及加壓塗層移除流體之體積,以使塗層移除容器300選擇性地充滿在塗層移除流體之所要的處理壓力及處理溫度處或附近的流體。In contrast to the configurations for removing coating from parts of FIGS. 1 to 4 herein, here, one or more parts from which the coating is to be removed are placed in one or more coating removal containers 300 at a location outside of a containment container 302. For example, the coating removal container 300 may be positioned on a wet bench and the parts from which the coating is to be removed are loaded therein on the wet bench. The coating removal container 300 may be configured to include a body that generally surrounds a processing space and has an opening thereof that is covered by a cover. Thereafter, the coating removal container 300 or container 300 is loaded into the open end 306 of the containment container 302. A shelf or base 310 is supported off the lower portion of the main housing 301 by a spacer 311 and the base 310 supports the coating removal container or container 300 thereon. The internal volume is fluidly connected to the volume of heated and pressurized coating removal fluid in the pressure vessel 400 so that the coating removal container 300 is selectively filled with fluid at or near the desired processing pressure and processing temperature of the coating removal fluid.

在其一個態樣中,塗層移除容器(多個) 300裝載有塗層將自其移除的一或多個組件,且經置放至無定位於其中的塗層移除流體的圍阻容器中。在此態樣中,在塗層移除容器經置放於圍阻容器302中之後,將塗層移除流體自分離壓力容器400輸送至塗層移除容器300中。在塗層移除容器(多個) 300放置在其中且用門320密封圍阻容積304開口306之後,使圍阻容器302之壓力增加至大於包圍圍阻容器302的環境壓力之壓力。每個塗層移除容器300在此包括延伸穿過其覆蓋的通氣開口294,以使圍阻容積304內之壓力與塗層移除容器之內部容積連通,且藉此使將要裝載至其中的塗層移除流體之壓力維持至或維持在與圍阻容積304之彼壓力相同的壓力。In one aspect thereof, the coating removal container(s) 300 are loaded with one or more components from which the coating is to be removed and are placed into a containment vessel without a coating removal fluid positioned therein. In this aspect, after the coating removal container(s) 300 are placed into the containment vessel 302, the coating removal fluid is transferred from the separation pressure vessel 400 into the coating removal container 300. After the coating removal container(s) 300 are placed therein and the containment volume 304 opening 306 is sealed with the door 320, the pressure of the containment vessel 302 is increased to a pressure greater than the ambient pressure surrounding the containment vessel 302. Each coating removal container 300 here includes a vent opening 294 extending through its cover so that the pressure within the containment volume 304 is connected to the internal volume of the coating removal container and thereby the pressure of the coating removal fluid to be loaded therein is maintained to or at the same pressure as the containment volume 304.

圍阻容積304中之壓力可在一或多個步驟中逐步增加至大於或等於將要形成或存在於定位於其中的塗層移除容器300中之壓力。在另一態樣中,塗層移除容器300之塗層移除容積298中之壓力可經監測,且圍阻容積304中之壓力基於塗層移除容積298中之壓力而增加或減少,以調整塗層移除容積298中之塗層移除流體之壓力。在第5圖至第7圖中所示之材料移除系統之態樣中,在圍阻容積內之壓力下的流體經維持在高溫處以將熱供應至塗層移除容器300內之塗層材料流體。在處理組件以在塗層移除容器300中將塗層自一或多個零件移除之後,在移除液體之溫度減少時,圍阻容積304中之壓力可降低,但維持高於或等於防止塗層移除容積298中之塗層移除流體之沸騰所需要的彼溫度。在圍阻容器302之門320打開之前,將圍阻容器302中之壓力帶至其周圍環境之壓力。在此態樣中,塗層移除容器(多個) 300可裝載有零件且在多個零件塗層移除製程上置放至圍阻容器302中,亦即,重新使用,且自圍阻容器移除以用於零件裝載至該或該等塗層移除容器或自該或該等塗層移除容器卸載。The pressure in the containment volume 304 can be gradually increased in one or more steps to be greater than or equal to the pressure that will be formed or exists in the coating removal container 300 positioned therein. In another aspect, the pressure in the coating removal volume 298 of the coating removal container 300 can be monitored, and the pressure in the containment volume 304 is increased or decreased based on the pressure in the coating removal volume 298 to adjust the pressure of the coating removal fluid in the coating removal volume 298. In the aspect of the material removal system shown in Figures 5-7, the fluid under pressure within the containment volume is maintained at an elevated temperature to supply heat to the coating material fluid within the coating removal vessel 300. After processing the assembly to remove coating from one or more parts in the coating removal vessel 300, as the temperature of the removal fluid decreases, the pressure within the containment volume 304 may be reduced, but maintained above or equal to that temperature required to prevent boiling of the coating removal fluid in the coating removal volume 298. The pressure within the containment vessel 302 is brought to the pressure of its surrounding environment before the door 320 of the containment vessel 302 is opened. In this aspect, coating removal container(s) 300 may be loaded with parts and placed into containment container 302 during multiple part coating removal processes, i.e., reused, and removed from the containment container for loading parts into or unloading parts from the coating removal container(s).

第5圖之塗層移除系統通常包括具有內部圍阻容積304的圍阻腔室或容器302、可替換地定位於其中的可移除塗層移除容器300中之一或多個,及連接至圍阻容器302或可移除塗層移除容器300中之至少一個且經組配以控制塗層移除製程之壓力及溫度的設施。在第5圖中,設施連接在系統控制器324與圍阻容器302之間,且包括一或多個圍阻容器壓力感測器326、一或多個圍阻容器溫度感測器328,及圍阻容器加熱器控制線330。一或多個圍阻容器壓力感測器326及一或多個圍阻容器溫度感測器328經組配以提供指示圍阻容積304內之壓力及溫度的電氣信號。然而,如以上所述,一或多個圍阻容器壓力感測器326及一或多個圍阻容器溫度感測器328可經連接以直接監測塗層移除容器(多個) 300之內部容積之壓力及溫度。控制器324經組配以接收此等信號,且將圍阻容器加熱器控制信號發送至圍阻容器加熱器電源供應器332,該圍阻容器加熱器電源供應器連接至設置在圍阻容器之外部表面周圍的一或多個圍阻容器加熱器360 (第6圖)。控制器324基於用於圍阻容積304或圍阻容器302之壁的所要的溫度設定點來控制圍阻容器加熱器電源供應器332至圍阻容器加熱器360之功率輸出。The coating removal system of FIG. 5 generally includes a containment chamber or vessel 302 having an internal containment volume 304, one or more of the removable coating removal vessels 300 replaceably positioned therein, and a facility connected to at least one of the containment vessel 302 or the removable coating removal vessel 300 and configured to control the pressure and temperature of the coating removal process. In FIG. 5 , the facility is connected between the system controller 324 and the containment vessel 302 and includes one or more containment vessel pressure sensors 326, one or more containment vessel temperature sensors 328, and a containment vessel heater control line 330. The one or more containment vessel pressure sensors 326 and the one or more containment vessel temperature sensors 328 are configured to provide electrical signals indicative of the pressure and temperature within the containment volume 304. However, as described above, the one or more containment vessel pressure sensors 326 and the one or more containment vessel temperature sensors 328 may be connected to directly monitor the pressure and temperature of the interior volume of the coating removal vessel(s) 300. The controller 324 is configured to receive these signals and send containment vessel heater control signals to the containment vessel heater power supply 332, which is connected to one or more containment vessel heaters 360 ( FIG. 6 ) disposed about the exterior surface of the containment vessel. The controller 324 controls the power output of the containment vessel heater power supply 332 to the containment vessel heater 360 based on a desired temperature set point for the walls of the containment volume 304 or containment vessel 302.

在此,為對圍阻容積302加壓,分離泵434或多個泵可經提供,且泵連接至流體之源以將流體泵送至圍阻容器302中以使壓力或圍阻容積增加。在另一態樣中,圍阻容積304可經維持在大氣壓力處。在另一態樣中,用來使塗層移除腔室(多個)300充滿塗層移除流體的相同壓力容器400可用來將塗層移除流體供應至圍阻容器之圍阻容積304。在第5圖中,壓力容器400將作為液體的塗層移除流體直接供應至塗層移除容器(多個) 300。壓力容器400包括密封地封閉可加壓容積402的外圓周壁404及上半球形帽406及下半球形帽408。泵410藉由泵線路412提供以與壓力容器之內部可加壓容積402連通。泵410連接至流體供應線路412,以允許將流體泵送至可加壓容積402中。流體供應線路412連接至將要用作塗層移除流體的流體之源,該塗層移除流體供應至塗層移除腔室(多個) 300以用於執行塗層移除製程。一或多個壓力容器溫度感測器416及壓力感測器414經提供來將指示可加壓容積402之壓力及溫度,或壓力容器400之壁溫度的信號供應至控制器324。控制器324經組配以將壓力容器加熱器電源供應器信號發送至壓力容器加熱器電源供應器418,該壓力容器加熱器電源供應器將功率供應至壓力容器400之外部上的一或多個護套加熱器420。Here, to pressurize the containment volume 302, a separate pump 434 or multiple pumps may be provided and the pump is connected to a source of fluid to pump the fluid into the containment vessel 302 to increase the pressure or the containment volume. In another aspect, the containment volume 304 may be maintained at atmospheric pressure. In another aspect, the same pressure vessel 400 used to fill the coating removal chamber(s) 300 with the coating removal fluid may be used to supply the coating removal fluid to the containment volume 304 of the containment vessel. In FIG. 5 , the pressure vessel 400 supplies the coating removal fluid as a liquid directly to the coating removal vessel(s) 300. The pressure vessel 400 includes an outer circumferential wall 404 and upper and lower hemispherical caps 406, 408 that sealingly enclose a pressurizable volume 402. A pump 410 is provided in communication with the inner pressurizable volume 402 of the pressure vessel via a pump line 412. The pump 410 is connected to a fluid supply line 412 to allow fluid to be pumped into the pressurizable volume 402. The fluid supply line 412 is connected to a source of fluid to be used as a coating removal fluid that is supplied to the coating removal chamber(s) 300 for performing a coating removal process. One or more pressure vessel temperature sensors 416 and pressure sensor 414 are provided to supply signals indicative of the pressure and temperature of the pressurizable volume 402, or the wall temperature of the pressure vessel 400, to the controller 324. The controller 324 is configured to send a pressure vessel heater power supply signal to a pressure vessel heater power supply 418, which supplies power to one or more jacket heaters 420 on the exterior of the pressure vessel 400.

壓力容器400之可加壓容積402流體地連接至塗層移除腔室(多個) 300之內部容積以賦能予加壓流體至其中之供應,及加壓流體自塗層移除容器(多個) 300之移除。在第5圖中,加壓流體填充線路422自可加壓容積402之下部分延伸,穿過閥424,穿過圍阻容器302之上部分且延伸至塗層移除腔室300之上內部部分中。在塗層移除腔室300中之多個塗層移除腔室一起在單個圍阻容積中處理的情況下,使填充線路422分支以同時使多個塗層移除容器(多個) 300充滿塗層移除流體。流體返回線路430穿過返回閥428自塗層移除容器(多個) 300之下部分延伸,穿過圍阻容積304之下壁,且因此延伸至可加壓容積420之上部分。The pressurizable volume 402 of the pressure vessel 400 is fluidly connected to the interior volume of the coating removal chamber(s) 300 to enable the supply of pressurized fluid therein, and the removal of pressurized fluid from the coating removal vessel(s) 300. In FIG. 5 , a pressurized fluid fill line 422 extends from a lower portion of the pressurizable volume 402, through a valve 424, through an upper portion of the containment vessel 302 and into an upper interior portion of the coating removal chamber 300. In the case where multiple coating removal chambers 300 are processed together in a single containment volume, fill line 422 is branched to simultaneously fill multiple coating removal container(s) 300 with coating removal fluid. A fluid return line 430 extends from a lower portion of the coating removal container(s) 300 through a return valve 428, through the lower wall of the containment volume 304, and thence to an upper portion of the pressurizable volume 420.

在第5圖之塗層移除系統之操作中,在圍阻容器302處於局部環境壓力322下,換言之處於局部大氣壓力下的情況下,圍阻容器302之門320經打開,且已在圍阻容積304之高壓高溫環境中處理但已清洗或大體上清洗塗層移除流體的塗層移除容器300在門320已經打開之後經由開口306自圍阻容積304移除。其中的零件經移除以用於進一步處理,且使塗層自其移除的新零件經裝載至塗層移除容器300中之相同或不同塗層移除容器中,在此之後,塗層移除容器(多個) 300經由開口306經裝載且置放在圍阻容器302中之基座310上。門320然後經關閉且閂鎖以密封且將圍阻容器302之圍阻容積304與周圍環境322隔離。In operation of the coating removal system of FIG. 5 , with the containment vessel 302 at a local ambient pressure 322, in other words, at local atmospheric pressure, the door 320 of the containment vessel 302 is opened, and the coating removal vessel 300 that has been processed in the high pressure and high temperature environment of the containment volume 304 but has been cleaned or substantially cleaned of the coating removal fluid is removed from the containment volume 304 through the opening 306 after the door 320 has been opened. The parts therein are removed for further processing and new parts from which the coating has been removed are loaded into the same or a different one of the coating removal containers 300, after which the coating removal container(s) 300 are loaded through the opening 306 and placed on the base 310 in the containment container 302. The door 320 is then closed and latched to seal and isolate the containment volume 304 of the containment container 302 from the surrounding environment 322.

壓力容器400在塗層移除容器300至圍阻容積中之裝載之前充滿或幾乎充滿將要傳輸或流動至圍阻容器302的塗層移除流體432。在此,在零件或組件及塗層移除容器300經移除且裝載至圍阻容器中時,壓力容器400可經操作以維持其中的塗層移除流體432之所要的流體壓力及溫度。例如,可將壓力容器400中之塗層移除流體432之溫度維持在高於其在大氣或周圍環境壓力322下將沸騰的溫度,且泵410用來增加液體狀態的塗層移除流體432流動至可加壓容積402中且使可加壓容積402內之彼流體之壓力增加至大約大於一個大氣壓力至十或更多個大氣壓力。因而,塗層移除流體可經保持在用於在將塗層自組件移除中使用的該塗層移除流體之所要的製程壓力及溫度處,用於一旦門320經關閉且開口經密封立即輸送至圍阻容器302中之塗層移除容器(多個) 300中。壓力容器400對於將塗層移除流體維持在移除製程溫度處或附近的溫度處及使塗層移除製程壓力及溫度處或附近的彼流體流動至塗層移除容器(多個) 300中的使用減少在塗層移除容器300中處理零件所需要的時間,因為可消除對使用加熱毯或其他類型加熱器原地加熱流體的需要。The pressure vessel 400 is filled or nearly filled with the coating removal fluid 432 to be transferred or flowed to the containment vessel 302 prior to loading of the coating removal vessel 300 into the containment volume. Here, the pressure vessel 400 may be operated to maintain a desired fluid pressure and temperature of the coating removal fluid 432 therein as the parts or assemblies and the coating removal vessel 300 are removed and loaded into the containment vessel. For example, the temperature of the coating removal fluid 432 in the pressure vessel 400 can be maintained at a temperature above the temperature at which it would boil at atmospheric or ambient pressure 322, and the pump 410 is used to increase the coating removal fluid 432 in a liquid state to flow into the pressurizable volume 402 and increase the pressure of the fluid in the pressurizable volume 402 to approximately greater than one atmosphere to ten or more atmospheres. Thus, the coating removal fluid can be maintained at a desired process pressure and temperature for use in removing coatings from assemblies for immediate delivery to the coating removal vessel(s) 300 in the containment vessel 302 once the door 320 is closed and the opening is sealed. The use of the pressure vessel 400 to maintain the coating removal fluid at a temperature at or near the removal process temperature and to flow that fluid at or near the coating removal process pressure and temperature into the coating removal vessel(s) 300 reduces the time required to process parts in the coating removal vessel 300 because the need to heat the fluid in situ using a heating blanket or other type of heater can be eliminated.

一旦具有塗層將自其移除的零件或組件200之塗層移除容器(多個) 300經裝載至圍阻容器302中,且門320關閉且密封,閥424經打開以允許塗層移除流體432自壓力容器432流動至圍阻容積304中之塗層移除容器300中。可加壓容積402中之較高壓力使塗層移除流體432流動至塗層移除容器300中。在此,塗層移除容器300之覆蓋包括通氣開口294,藉此圍阻容積304中之壓力傳輸至塗層移除容器300之內容積中。因而,在圍阻容積304中之壓力經維持在稍低於塗層移除流體432之彼壓力的壓力但塗層移除流體432在其至塗層移除容器中之進入溫度處將不沸騰的壓力處時,塗層移除容器300可僅藉由較高壓力容器400與較低壓力圍阻容積304之間的壓力差填充。Once the coating removal container(s) 300 having the parts or assemblies 200 from which the coating is to be removed are loaded into the containment container 302, and the door 320 is closed and sealed, the valve 424 is opened to allow the coating removal fluid 432 to flow from the pressure vessel 432 to the coating removal container 300 in the containment volume 304. The higher pressure in the pressurized volume 402 may cause the coating removal fluid 432 to flow into the coating removal container 300. Here, the cover of the coating removal container 300 includes a vent opening 294, whereby the pressure in the containment volume 304 is transmitted to the content volume of the coating removal container 300. Thus, the coating removal vessel 300 can be filled solely by the pressure differential between the higher pressure vessel 400 and the lower pressure containment volume 304 when the pressure in the containment volume 304 is maintained at a pressure slightly lower than that of the coating removal fluid 432 but at a pressure at which the coating removal fluid 432 will not boil at its entry temperature into the coating removal vessel.

圍阻容積泄壓閥362流體地耦接至圍阻容積304,使得圍阻容積304中之壓力可經排放以防止其中的背壓力,該背壓力防止充分量的加壓流體覆蓋塗層移除腔室(多個) 300中之組件。泵364流體地耦接至圍阻容積304以對圍阻容積304加壓,且圍阻容積泄壓閥362經設定以在大於塗層移除腔室300中之零件或組件之處理壓力的壓力下打開。藉由使用泵364及圍阻容積泄壓閥362來控制圍阻容積304中之壓力,及因而圍阻容積304與進入塗層移除容器300的塗層移除流體432之彼壓力之間的壓力差,塗層移除流體至塗層移除容器(多個) 300中之流動速率經控制。分配至每個槽的塗層移除流體之量可藉由塗層移除容器(多個)之內側壁上之流體感測器、填充線路(多個) 422上之流量計,或其他方法控制或決定。泵410可在塗層移除容器(多個) 300之填充期間經操作,以將塗層移除流體432之壓力保持在流體進入塗層移除容器300時防止該流體之沸騰所需要的壓力處或以上,且若圍阻容積泄壓閥362打開以排放圍阻容積304,將彼壓力維持在圍阻容積304中之壓力以上。一旦塗層移除容器(多個) 300充滿熱塗層移除流體,該熱塗層移除流體處於大於其將在大氣壓力下沸騰之彼溫度的溫度及足以在塗層移除容器304中防止其沸騰的壓力處,填充閥424經關閉且塗層移除製程經執行。若需要,圍阻容積中之升高至或超過製程溫度的流體之熱經由塗層移除容器300之壁傳遞以加熱其中之塗層移除流體,或反之亦然。一或多個圍阻容器加熱器360較佳地將圍阻容器302中之流體維持在所要的製程溫度處或以上以減少自塗層移除容器300中之塗層移除流體的熱損失。若圍阻容積304中之壓力下降,則填充泵434可經啟動以將額外流體提供至圍阻容積304以維持流體地耦接至該圍阻容積的塗層移除容器(多個) 300中之所要的處理壓力。控制器324電氣佈纜至填充閥424及返回閥428,以用來自控制器324的電氣控制信號控制其打開及關閉。The containment volume pressure relief valve 362 is fluidly coupled to the containment volume 304 so that pressure in the containment volume 304 can be vented to prevent back pressure therein that prevents a sufficient amount of pressurized fluid from covering the components in the coating removal chamber(s) 300. A pump 364 is fluidly coupled to the containment volume 304 to pressurize the containment volume 304, and the containment volume pressure relief valve 362 is configured to open at a pressure greater than the process pressure of the parts or components in the coating removal chamber 300. By using the pump 364 and the containment volume pressure relief valve 362 to control the pressure in the containment volume 304, and thus the pressure differential between the containment volume 304 and the pressure of the coating removal fluid 432 entering the coating removal vessel 300, the flow rate of the coating removal fluid into the coating removal vessel(s) 300 is controlled. The amount of coating removal fluid distributed to each tank can be controlled or determined by a fluid sensor on the inside wall of the coating removal vessel(s), a flow meter on the fill line(s) 422, or other methods. The pump 410 can be operated during the filling of the coating removal container(s) 300 to maintain the pressure of the coating removal fluid 432 at or above the pressure required to prevent boiling of the fluid as it enters the coating removal container 300, and if the containment volume pressure relief valve 362 is opened to vent the containment volume 304, maintain that pressure above the pressure in the containment volume 304. Once the coating removal vessel(s) 300 are filled with hot coating removal fluid at a temperature greater than that at which it would boil at atmospheric pressure and at a pressure sufficient to prevent it from boiling in the coating removal vessel 304, the fill valve 424 is closed and the coating removal process is performed. If desired, heat from the fluid in the containment volume that rises to or exceeds the process temperature is transferred through the walls of the coating removal vessel 300 to heat the coating removal fluid therein, or vice versa. The one or more containment vessel heaters 360 preferably maintain the fluid in the containment vessel 302 at or above the desired process temperature to reduce heat loss of the coating removal fluid from the coating removal vessel 300. If the pressure in the containment volume 304 drops, the fill pump 434 can be activated to provide additional fluid to the containment volume 304 to maintain the desired process pressure in the coating removal vessel(s) 300 fluidly coupled to the containment volume. The controller 324 is electrically wired to the fill valve 424 and the return valve 428 to control their opening and closing with electrical control signals from the controller 324.

耦接至塗層移除容器(多個) 300的壓力容器400允許塗層移除流體432經回收用於重新使用。因而,在將塗層自塗層移除容器(多個)中之零件移除之製程接近其終點時,壓力容器400中之壓力降低至低於圍阻容器302中之彼壓力。一旦塗層移除製程完成,返回閥428藉由控制器324打開,且塗層移除容器300中之較高壓力加壓流體流動至壓力容器400之較低壓力可加壓容積402中。壓力容器泄壓閥423經提供來允許返回加壓流體上方的頂部空間排放且防止背壓力建立,從而防止用可加壓流體432再填充壓力容器400。在加壓流體返回至壓力容器400中時,泵434可用來選擇性地將諸如環境空氣的流體傳輸至圍阻容器中以維持其中的充分壓力以使其中的流體維持為大於壓力容器400中之彼壓力。同時,至圍阻容器加熱器360的功率經移除,從而允許圍阻容器開始冷卻至該圍阻容器將為對於打開門320安全的溫度。一旦加壓流體返回至壓力容器400,在控制器324之操作下,將通氣閥428切換至關閉位置以將加壓容積402及圍阻容積304彼此隔離,且圍阻容器302藉由圍阻容器泄壓閥362或另一閥排放。類似於本文第1圖至第4圖之態樣,冷卻盤管可經提供來浸沒於壓力容器400中之加壓流體中,以更精確地控制該加壓流體之溫度。在加壓流體經移除之後,盤管亦可用來冷卻圍阻容器302之壁。可使用圍阻容器302之其他冷卻,諸如用以在圍阻容器之外部上吹空氣的一或多個吹風機。返回至壓力容器400的塗層移除流體若需要,則在壓力容器中加熱且加壓,且維持在彼壓力及溫度處,直至圍阻容器302重新裝載新塗層移除容器(多個) 300用於處理其中的組件200以將塗層自該組件移除。儘管示出單個壓力容器400連接至單個圍阻容器302,但多個圍阻容器302可連接至單個壓力容器400。在此狀況下,壓力容器400可在填充第一圍阻容器302中之塗層移除容器(多個) 300之後用塗層移除流體再填充,以對加壓流體進行加熱且加壓以填充另一圍阻容器中之塗層移除容器(多個) 300。替代地,壓力容器加壓容積402可經定大小以容納充分的加壓流體以填充二或更多個圍阻容器中之塗層移除容器300。另外,二或更多個壓力容器400可連接至單個圍阻容器,以在塗層移除容器(多個) 300中之流體排放至另一壓力容器400中時,使壓力容器中之一個能夠處於製程溫度及壓力處。另外,壓力容器400中之不同的壓力容器可容納不同類型的塗層移除流體。The pressure vessel 400 coupled to the coating removal vessel(s) 300 allows the coating removal fluid 432 to be recovered for reuse. Thus, as the process of removing coating from parts in the coating removal vessel(s) approaches its end, the pressure in the pressure vessel 400 decreases below that in the containment vessel 302. Once the coating removal process is complete, the return valve 428 is opened by the controller 324 and the higher pressure pressurized fluid in the coating removal vessel 300 flows into the lower pressure pressurizable volume 402 of the pressure vessel 400. A pressure vessel relief valve 423 is provided to allow the headspace above the returning pressurized fluid to vent and prevent back pressure from building up, thereby preventing refilling of the pressure vessel 400 with the pressurizable fluid 432. As the pressurized fluid returns to the pressure vessel 400, a pump 434 may be used to selectively deliver a fluid, such as ambient air, into the containment vessel to maintain sufficient pressure therein to maintain the fluid therein greater than that in the pressure vessel 400. At the same time, power to the containment vessel heater 360 is removed, thereby allowing the containment vessel to begin cooling to a temperature at which the containment vessel will be safe for opening the door 320. Once the pressurized fluid is returned to the pressure vessel 400, under operation of the controller 324, the vent valve 428 is switched to a closed position to isolate the pressurized volume 402 and the containment volume 304 from each other, and the containment vessel 302 is vented through the containment vessel pressure relief valve 362 or another valve. Similar to the aspects of Figures 1-4 herein, cooling coils may be provided to be immersed in the pressurized fluid in the pressure vessel 400 to more accurately control the temperature of the pressurized fluid. The coils may also be used to cool the walls of the containment vessel 302 after the pressurized fluid is removed. Other cooling of the containment vessel 302 may be used, such as one or more blowers to blow air over the exterior of the containment vessel. The coating removal fluid returned to the pressure vessel 400 is heated and pressurized in the pressure vessel if necessary, and maintained at that pressure and temperature until the containment vessel 302 is reloaded with a new coating removal vessel(s) 300 for processing the assembly 200 therein to remove the coating therefrom. Although a single pressure vessel 400 is shown connected to a single containment vessel 302, multiple containment vessels 302 may be connected to a single pressure vessel 400. In this case, the pressure vessel 400 may be refilled with coating removal fluid after filling the coating removal vessel(s) 300 in the first containment vessel 302 to heat and pressurize the pressurized fluid to fill the coating removal vessel(s) 300 in another containment vessel. Alternatively, the pressure vessel pressurization volume 402 may be sized to hold sufficient pressurized fluid to fill the coating removal vessels 300 in two or more containment vessels. Additionally, two or more pressure vessels 400 may be connected to a single containment vessel to enable one of the pressure vessels to be at process temperature and pressure while the fluid in the coating removal vessel(s) 300 is discharged into another pressure vessel 400. Additionally, different ones of the pressure vessels 400 may contain different types of coating removal fluids.

在塗層移除系統之此態樣中,除塗層移除容器300並非耐壓的之外,塗層移除容器300組配為大體上與本文第1圖至第4圖之塗層移除容器100相同。換言之,該等塗層移除容器包括一或多個通氣開口294,該一或多個通氣開口延伸穿過該等塗層移除容器之壁以允許流體,或至少流體壓力,在該等塗層移除容器之塗層移除容積298與周圍圍阻容積304之間傳輸。此允許塗層移除容器300內之壓力為與圍阻容積304中之彼壓力相同的壓力,使得塗層移除容器之材料不需要能夠保持塗層移除容積298內比塗層移除容器300之外部上更高壓力的高強度材料,藉此允許系統之使用者在塗層移除容器300中使用的材料之選擇方面的較大自由度。儘管圍阻容積之加壓在本文中描述為使用空氣或氣體,但諸如去離子水的液體或塗層移除流體432可用來對圍阻容積304加壓。現參考第8圖,示出塗層移除系統之又一態樣,如塗層移除容器100之情況,塗層移除容器300經組配以經加熱,且同時冷卻,以維持塗層移除容積298及其中的任何移除流體之所要的溫度。在此,塗層移除容器300之下部分經組配為流體貯器,且籠、平台,或其他容納結構,例如第2圖之籠,定位於貯器之上,使得室溫(大約20攝氏度)下的塗層流體之流體容積定位於塗層將要在塗層移除容器300中移除的零件下方。In this aspect of the coating removal system, the coating removal container 300 is configured substantially the same as the coating removal container 100 of Figures 1-4 herein, except that the coating removal container 300 is not pressure resistant. In other words, the coating removal containers include one or more vent openings 294 extending through the wall of the coating removal container to allow fluid, or at least fluid pressure, to be transmitted between the coating removal volume 298 and the surrounding enclosure volume 304 of the coating removal container. This allows the pressure within the coating removal container 300 to be the same pressure as that in the containment volume 304, so that the material of the coating removal container does not need to be a high-strength material that can maintain a higher pressure within the coating removal volume 298 than on the outside of the coating removal container 300, thereby allowing the user of the system greater freedom in the choice of materials used in the coating removal container 300. Although pressurization of the containment volume is described herein as using air or a gas, a liquid such as deionized water or the coating removal fluid 432 may be used to pressurize the containment volume 304. Referring now to FIG. 8 , yet another aspect of a coating removal system is shown, where the coating removal vessel 300 is configured to be heated and simultaneously cooled to maintain a desired temperature of the coating removal volume 298 and any removal fluid therein, as in the case of the coating removal vessel 100. Here, the lower portion of the coating removal vessel 300 is configured as a fluid reservoir, and a cage, platform, or other containment structure, such as the cage of FIG. 2 , is positioned above the reservoir so that a fluid volume of coating fluid at room temperature (approximately 20 degrees Celsius) is positioned below the part from which the coating is to be removed in the coating removal vessel 300.

參考第8圖,示出第5圖至第7圖之塗層移除系統之修改,其中第8圖之圍阻容器經使用,但在第8圖中示意性地示出,第5圖至第7圖之塗層移除容器(多個)經使用,但在此經單獨地加熱,且因而不需要壓力容器400。在此,塗層移除容器300容納在圍阻容器之圍阻容積內,但單獨塗層移除容器經單獨地加熱以逐步形成塗層移除流體之蒸氣以對單獨塗層移除容器300加壓。類似於第1圖至第4圖之塗層移除容器100,此塗層移除容器300包括溫度維持系統108 (第1圖),該溫度維持系統包括包圍塗層移除容器壁104之外部表面150的加熱器148;及冷卻通道151,該冷卻通道在其相反的第一末端154及第二末端156處延伸穿過圓周凸緣152且在塗層移除容積298內於該第一末端與該第二末端之間延伸且與移除流體126接觸。在此,冷卻通道151經組配為流體冷卻劑可流過的配管之長度,其中其在處理容積106內的部分以正環形盤管之形狀組配。盤管內徑經組配以大於籃146 (第1圖)之最大寬度尺寸,以允許籃146自由地置放至塗層移除容積298中且自塗層移除容積298移除,且維持籃146之側與盤管158之鄰近周圍表面之間的間隙以允許移除流體存在於其間。冷卻通道151之相反的第一末端154及第二末端156藉由流體快速連接或其他類型連接器流體地連接至第5圖中示意性地示出的冷凍器162及泵164,且冷凍器162及泵164操作性地連接至系統控制器166。在此,第一冷卻流體線路312延伸穿過將要連接在冷卻通道151之第一末端154與冷卻流體泵164之間的圍阻容器302之壁,且第二流體線路314在冷卻通道151之第二末端156與冷凍器162之間延伸。冷凍器162流體地連接至冷卻劑泵164,使得用於泵送至冷卻流體的連續流體迴路經產生。冷凍器162使自冷卻通道151之第二末端156流動的流體冷卻劑冷卻,且泵使冷凍或冷卻的流體流動至冷卻通道151之第一末端154中。第一流體線路312及第二流體線路314可分叉,使得其第一部分延伸至圍阻容器之壁及定位來允許流體通過圍阻容器之壁的流體連接器,且其第二部分自流體連接器通向冷卻通道151之相反的末端。在此,第二部分可為可撓性的,且包括在其冷卻通道151末端處的第二管接頭,以連接至冷卻通道。可撓性允許第一流體線路312及第二流體線路314至冷卻通道之連接的更容易性。Referring to Fig. 8, a modification of the coating removal system of Figs. 5-7 is shown, wherein the containment vessel of Fig. 8 is used, but schematically shown in Fig. 8, the coating removal vessel(s) of Figs. 5-7 are used, but here are individually heated, and thus do not require a pressure vessel 400. Here, the coating removal vessel 300 is contained within the containment volume of the containment vessel, but the individual coating removal vessels are individually heated to gradually form vapor of the coating removal fluid to pressurize the individual coating removal vessels 300. Similar to the coating removal vessel 100 of FIGS. 1-4 , this coating removal vessel 300 includes a temperature maintenance system 108 ( FIG. 1 ) including a heater 148 surrounding an exterior surface 150 of the coating removal vessel wall 104, and a cooling channel 151 extending through a circumferential flange 152 at its opposite first and second ends 154, 156 and extending within the coating removal volume 298 between the first and second ends and in contact with the removal fluid 126. Here, the cooling channel 151 is configured as a length of tubing through which a fluid coolant can flow, wherein the portion thereof within the processing volume 106 is configured in the shape of a positive annular coil. The inner diameter of the coil is configured to be larger than the maximum width dimension of the basket 146 (FIG. 1) to allow the basket 146 to be freely placed into and removed from the coating removal volume 298, and to maintain a gap between the sides of the basket 146 and the adjacent surrounding surface of the coil 158 to allow removal fluid to exist therebetween. The opposing first and second ends 154, 156 of the cooling channel 151 are fluidly connected to the freezer 162 and pump 164 schematically shown in FIG. 5 by fluid quick connects or other types of connectors, and the freezer 162 and pump 164 are operatively connected to the system controller 166. Here, a first cooling fluid line 312 extends through the wall of the containment vessel 302 to be connected between the first end 154 of the cooling channel 151 and the cooling fluid pump 164, and a second fluid line 314 extends between the second end 156 of the cooling channel 151 and the freezer 162. The freezer 162 is fluidly connected to the coolant pump 164 so that a continuous fluid loop for pumping to the cooling fluid is created. The freezer 162 cools the fluid coolant flowing from the second end 156 of the cooling channel 151, and the pump causes the frozen or cooled fluid to flow into the first end 154 of the cooling channel 151. The first fluid line 312 and the second fluid line 314 may be bifurcated such that a first portion thereof extends to a wall of the containment vessel and a fluid connector positioned to allow fluid to pass through the wall of the containment vessel, and a second portion thereof leads from the fluid connector to an opposite end of the cold channel 151. Here, the second portion may be flexible and include a second pipe fitting at its cold channel 151 end to connect to the cold channel. Flexibility allows for easier connection of the first fluid line 312 and the second fluid line 314 to the cold channel.

用以加熱塗層移除容器300,及因而其中的零件(多個)及塗層移除流體的加熱器148經提供為加熱護套或其他加熱系統,該其他加熱系統可環繞塗層移除容器300之容器壁134之外部表面150。加熱器可經提供為單個環繞元件,提供為各自在高度上比容器壁134之高度小且一個堆疊在另一個之上的多個環繞元件,提供為作為垂直延伸加熱器條帶並排安置在容器壁134之外部表面150周圍的單獨加熱器分段,或其組合。每個塗層移除容器300,或其單獨分離部分上的加熱器148當使用時,藉由配線173操作性地連接至電源供應器172,該電源供應器操作性地連接至系統控制器166。各自專用於加熱器148或與一個塗層移除腔室相關聯的加熱器的複數個配線可經使用,或配線173可包括主排線,單獨電線或電纜自該主排線延伸至與每個塗層移除容器300相關聯的單獨加熱器148。變數控制器351安置在塗層移除容器300中之每一個與電源供應器172之間,以調整供應至加熱器148中之每一個的功率。替代地,複數個電源供應器172使得電源供應器專用於與每個單獨塗層移除容器300相關聯的加熱器(多個) 148。熱電偶174定位於每個塗層移除容器300之塗層移除容積298中且藉由熱電偶絲操作性地連接至系統控制器166。系統控制器166使用熱電偶174來監測塗層移除容積298中之移除液體之溫度。儘管示出僅一個熱電偶,但多個此類裝置可部署在塗層移除容積298內之不同位置處。藉由變化供應至加熱器148的功率,及至每個塗層移除容器300之冷卻通道151的冷卻流體之流動,可控制塗層移除流體之溫度。The heater 148 for heating the coating removal vessel 300, and thus the part(s) and coating removal fluid therein, is provided as a heating jacket or other heating system that may surround the exterior surface 150 of the vessel wall 134 of the coating removal vessel 300. The heater may be provided as a single surrounding element, as a plurality of surrounding elements each having a height less than the height of the vessel wall 134 and stacked one upon another, as individual heater segments disposed side by side around the exterior surface 150 of the vessel wall 134 as a vertically extending heater strip, or a combination thereof. Each coating removal container 300, or the heater 148 on a separate separate portion thereof, when used, is operatively connected to a power supply 172 by wiring 173, which is operatively connected to the system controller 166. A plurality of wirings, each dedicated to a heater 148 or heaters associated with one coating removal chamber, may be used, or the wiring 173 may include a main cable from which individual wires or cables extend to individual heaters 148 associated with each coating removal container 300. A variable controller 351 is disposed between each of the coating removal containers 300 and the power supply 172 to adjust the power supplied to each of the heaters 148. Alternatively, a plurality of power supplies 172 allow a power supply to be dedicated to the heater(s) 148 associated with each individual coating removal container 300. A thermocouple 174 is positioned in the coating removal volume 298 of each coating removal container 300 and is operatively connected to the system controller 166 by a thermocouple wire. The system controller 166 uses the thermocouple 174 to monitor the temperature of the removal liquid in the coating removal volume 298. Although only one thermocouple is shown, multiple such devices may be deployed at different locations within the coating removal volume 298. By varying the power supplied to the heater 148 and the flow of cooling fluid to the cooling channel 151 of each coating removal container 300, the temperature of the coating removal fluid can be controlled.

圍阻容器304經組配為能夠在大於包圍圍阻容器之壓力的壓力下維持密封及結構完整性的可加壓容積,該周圍壓力在使用中通常為局部環境大氣壓力。在用以將塗層自零件(多個)移除的製程之操作期間,圍阻容器302使用諸如氮或空氣的相對無反應性氣體或諸如氬的惰性氣體加以積極地泵送,以使其中,亦即,其圍阻容積304中的壓力增加。圍阻容積304可經維持在例如周圍環境壓力的1.1倍,大於周圍環境壓力的1至1.5倍、大於周圍環境壓力的1至2倍,或更大,例如比周圍環境壓力大十倍的大於周圍環境壓力的壓力處。圍阻容器302及門320係由不銹鋼組配,該不銹鋼提供充分強度以經得起圍阻容積304與周圍環境壓力之間的壓力差。The containment vessel 304 is configured as a pressurizable volume capable of maintaining a seal and structural integrity at a pressure greater than the pressure surrounding the containment vessel, which in use is typically the local ambient atmospheric pressure. During operation of a process for removing a coating from a part(s), the containment vessel 302 is actively pumped with a relatively non-reactive gas such as nitrogen or air, or an inert gas such as argon, to increase the pressure therein, i.e., in its containment volume 304. The containment volume 304 may be maintained at a pressure greater than, for example, 1.1 times the ambient pressure, greater than 1 to 1.5 times the ambient pressure, greater than 1 to 2 times the ambient pressure, or greater, such as ten times greater than the ambient pressure. The containment vessel 302 and the door 320 are assembled from stainless steel, which provides sufficient strength to withstand the pressure differential between the containment volume 304 and the ambient pressure.

圍阻容積302藉由耦接至泵334的氣體供應器336連接至氣體源或流體源,例如氮或惰性或與塗層移除流體相對不反應的氣體之供應器。泵經組配以將氣體泵送至圍阻容積中以達成大於包圍圍阻容器302的大氣壓力之壓力。泵334可為壓縮機。流體移除線路338流體地耦接至圍阻容積以自圍阻容積304抽吸流體。在此,流體移除線路338連接至閥340,該閥可經變化以改變穿過閥340的流體傳導,前級線路341自該閥延伸至回收容器342,該回收容器經組配以截留凝結流動至其中的塗層移除流體,該回收容器藉由閥346連接至真空源344,該真空源可為真空泵之設施真空系統。The containment volume 302 is connected to a gas source or fluid source, such as a supply of nitrogen or a gas that is inert or relatively non-reactive with the coating removal fluid, via a gas supply 336 coupled to a pump 334. The pump is configured to pump gas into the containment volume to achieve a pressure greater than the atmospheric pressure surrounding the containment vessel 302. The pump 334 may be a compressor. A fluid removal line 338 is fluidly coupled to the containment volume to draw fluid from the containment volume 304. Here, fluid removal line 338 is connected to valve 340, which can be changed to change the fluid conduction through valve 340, and a foreline 341 extends from the valve to a recovery container 342, which is configured to intercept the coating removal fluid that condenses and flows into it. The recovery container is connected to a vacuum source 344 via a valve 346, which can be a facility vacuum system of a vacuum pump.

在使用塗層移除容器300之一個方法中,將上面具有將要移除的塗層的一或多個零件定位於塗層移除容器300中。在一個態樣中,當門320敞開時,藉由開口306將塗層移除容器300自圍阻容器302移除,且以將要自其移除塗層的零件或組件替換定位於該塗層移除容器中的一或多個零件。塗層移除容器300然後經定位於基座或平台310上,且連接至電源供應器172、控制器166,且第一流體供應線路312及第二流體供應線路314連接至冷卻通道151之第一末端154及第二末端156。然後關閉門320以將圍阻容積304與周圍環境322密封。在另一態樣中,將塗層移除容器300維持在圍阻容積304內,且將要自其移除塗層的零件或組件藉由開口306傳遞且置放在平台310上之塗層移除容器300中。此後,將門320關閉以將圍阻容積304與周圍環境322密封。然後操作泵334以藉由將氣體泵送至圍阻容積304中來增加該圍阻容積中之壓力。泵334可經操作以將圍阻容積304泵送至大於周圍環境322之彼壓力的預定壓力,或該泵可經操作以僅將圍阻容積304中之壓力維持在塗層移除容器(300)中之壓力處或大於該壓力。加熱器(多個) 148經供電以將塗層移除流體加熱至大於其在大氣壓力下之沸點的所要的溫度。在塗層移除容器(多個) 300中之溫度增加時,塗層移除流體之蒸氣逐步形成。在一個態樣中,塗層移除容器300包括一或多個通氣開口294,使得圍阻容器之壓力傳輸至塗層移除容器300內。在此態樣中,圍阻容積304內之壓力可經維持在顯著的蒸氣自塗層移除流體逐步形成的彼壓力以上,或維持在低於塗層移除將基於塗層移除流體之溫度開始沸騰的壓力處。在另一態樣中,通氣開口294包括連接至其的釋壓閥,該釋壓閥可連接至控制器,且當塗層移除容器300中之壓力達到不合需要的壓力時,藉由控制器操作以將通氣通路打開。若需要,圍阻容器中之壓力使用泵334及真空系統334加以控制,以在塗層移除流體經加熱至用於塗層移除製程之較高溫度時,將圍阻容積壓力維持在防止塗層移除流體沸騰的充分高的位準處。另外,一旦達成所要的圍阻容積304壓力,可關閉自泵334至圍阻容積304的流體入口上之閥350,且使泵脫離,而閥340同樣地經關閉。若在圍阻容積334中存在壓力下降,則可藉由在打開閥350之後啟動泵334來重新啟動泵334。In one method of using the coating removal container 300, one or more parts having coating to be removed therefrom are positioned in the coating removal container 300. In one aspect, the coating removal container 300 is removed from the containment container 302 through the opening 306 when the door 320 is open, and the one or more parts positioned in the coating removal container are replaced with the parts or assemblies from which the coating is to be removed. The coating removal container 300 is then positioned on a base or platform 310 and connected to the power supply 172, the controller 166, and the first and second fluid supply lines 312, 314 are connected to the first and second ends 154, 156 of the cooling channel 151. The door 320 is then closed to seal the containment volume 304 from the surrounding environment 322. In another aspect, the coating removal container 300 is maintained within the containment volume 304, and the parts or assemblies from which the coating is to be removed are transferred through the opening 306 and placed in the coating removal container 300 on the platform 310. Thereafter, the door 320 is closed to seal the containment volume 304 from the surrounding environment 322. The pump 334 is then operated to increase the pressure in the containment volume 304 by pumping gas into the containment volume 304. The pump 334 may be operated to pump the containment volume 304 to a predetermined pressure greater than that of the surrounding environment 322, or the pump may be operated to simply maintain the pressure in the containment volume 304 at or greater than the pressure in the coating removal vessel (300). The heater(s) 148 are powered to heat the coating removal fluid to a desired temperature greater than its boiling point at atmospheric pressure. As the temperature in the coating removal vessel(s) 300 increases, vapor of the coating removal fluid is gradually formed. In one aspect, the coating removal container 300 includes one or more vent openings 294 so that the pressure of the containment container is transmitted into the coating removal container 300. In this aspect, the pressure within the containment volume 304 can be maintained above the pressure at which significant vapor is developed from the coating removal fluid, or maintained below the pressure at which the coating removal will begin to boil based on the temperature of the coating removal fluid. In another aspect, the vent opening 294 includes a pressure relief valve connected thereto, which can be connected to a controller and operated by the controller to open the vent passage when the pressure in the coating removal container 300 reaches an undesirable pressure. If necessary, the pressure in the containment vessel is controlled using the pump 334 and vacuum system 334 to maintain the containment volume pressure at a sufficiently high level to prevent the coating removal fluid from boiling when the coating removal fluid is heated to the higher temperatures used in the coating removal process. In addition, once the desired containment volume 304 pressure is achieved, the valve 350 on the fluid inlet to the containment volume 304 from the pump 334 can be closed and the pump disengaged, with the valve 340 likewise closed. If there is a pressure drop in the containment volume 334, the pump 334 can be restarted by starting the pump 334 after opening the valve 350.

在適當的時間已度過以確保塗層已自零件移除之後,泵334若尚未脫離圍阻容積且與圍阻容積隔離,則藉由關閉閥350脫離圍阻容積304且與圍阻容積304隔離,且閥340打開以允許圍阻容器排放至真空線路344,該真空線路可僅低於圍阻容器302之周圍環境壓力。然後,當圍阻容積已重新獲得包圍圍阻容器302的環境322之壓力時,將門320打開,使得零件,或其中具有零件的塗層移除容器可自圍阻容器移除,且零件之另一集合返回至圍阻容積且在塗層移除容器(多個)內以經處理。After an appropriate amount of time has elapsed to ensure that the coating has been removed from the part, pump 334, if not already disengaged and isolated from the containment volume, is disengaged and isolated from the containment volume 304 by closing valve 350, and valve 340 opens to allow the containment vessel to vent to vacuum line 344, which may be just below the ambient pressure of the containment vessel 302. Then, when the containment volume has regained the pressure of the environment 322 surrounding the containment vessel 302, the door 320 is opened so that the parts, or the coating removal container with the parts therein, can be removed from the containment vessel and another collection of parts returned to the containment volume and within the coating removal container(s) to be processed.

儘管在此圍阻容器302經描述為用氣體加壓,但圍阻容積亦可使用液體加壓。Although the containment vessel 302 is described herein as being pressurized with a gas, the containment volume may also be pressurized with a liquid.

表1陳述對於自示範性下層材料移除示範性塗層有用的示範性化學品。表1中之塗層先前已視為對於使用化學移除製程,亦即,濕式蝕刻製程來移除不可能的或不切實際的。因而,用來移除塗層的噴吵或噴丸,及下層組件200之材料之後繼固有移除為用來移除此等塗層的唯一製程。因此,下層組件200之使用壽命藉由塗層移除製程限制,因為將在一或多個塗層移除製程之後自組件之製造商說明書生產此等組件200之關鍵尺寸。 表1 形成將要移除的塗層之組件之下層材料 將要移除的塗層 移除流體化學品 移除流體溫度 用以移除塗層的製程時間 氧化鋁 KOH/H 2O 150-300C 1-48小時 氧化鉿 KOH/H 2O 150-300C 1-48小時 氧化鋁 NaOH/H 2O 150-300C 1-48小時 氧化鉿 NaOH/H 2O 150-300C 1-48小時 氧化鋁 NaOH/H 2O 150-300C 1-48小時 碳化矽 氧化鋁 NaOH/H 2O 150-300C 1-48小時 碳化矽 氧化鉿 NaOH/H 2O 150-300C 1-48小時 碳化矽 氧化鋁 KOH/H 2O 150-300C 1-48小時 碳化矽 氧化鉿 KOH/H 2O 150-300C 1-48小時 Table 1 sets forth exemplary chemistries useful for removing exemplary coatings from exemplary underlying materials. The coatings in Table 1 have previously been deemed impossible or impractical to remove using a chemical removal process, i.e., a wet etching process. Thus, blasting or shot blasting to remove the coatings, and subsequent inherent removal of the material of the underlying component 200, are the only processes used to remove such coatings. Therefore, the useful life of the underlying component 200 is limited by the coating removal processes because critical dimensions of such components 200 will be produced from the manufacturer's specifications of the component after one or more coating removal processes. Table 1 The material underlying the component that forms the coating to be removed The coating to be removed Removal of fluid chemicals Removal fluid temperature Process time to remove coating Titanium Alumina KOH/ H2O 150-300C 1-48 hours Titanium Ethylene oxide KOH/ H2O 150-300C 1-48 hours Titanium Alumina NaOH/H 2 O 150-300C 1-48 hours Titanium Ethylene oxide NaOH/H 2 O 150-300C 1-48 hours Titanium Alumina NaOH/H 2 O 150-300C 1-48 hours Silicon Carbide Alumina NaOH/H 2 O 150-300C 1-48 hours Silicon Carbide Ethylene oxide NaOH/H 2 O 150-300C 1-48 hours Silicon Carbide Alumina KOH/ H2O 150-300C 1-48 hours Silicon Carbide Ethylene oxide KOH/ H2O 150-300C 1-48 hours

在表1中陳述的每一狀況下,執行塗層之移除的處理溫度高於移除流體在大氣壓力下之沸點。例如,以10%之NaOH及90%之H 2O的NaOH/H 2O溶液具有105℃之沸點,且50%之NaOH及50%之H 2O的溶液具有140℃之沸點。KOH/H 2O溶液具有在140℃至150℃之範圍內的沸點。在表1之每一狀況下,製程溫度高於用來移除塗層的移除化學品在大氣壓力下之沸點。另外,已知KOH及NaOH移除化學品與碳化矽及鈦,表1中之下層組件之材料,相對不反應。另外,在表1中所描述的KOH及NaOH溶液可使用在溶液暴露於大氣壓力的槽中的溫度範圍處,塗層移除速率低至使得使用濕式蝕刻技術來移除此等塗層並非商業上可行的。因而,在此,在每個塗層移除步驟中,請相信組件之下層材料之小於0.1%至0.5%經移除。因此,與將噴丸或噴砂使用於具有此等下層材料組成之組件的塗層移除相反,大體上增加塗層移除及組件重新使用之數目。 In each case described in Table 1, the process temperature at which the removal of the coating was performed was above the boiling point of the removal fluid at atmospheric pressure. For example, a NaOH/ H2O solution of 10% NaOH and 90% H2O has a boiling point of 105°C, and a solution of 50% NaOH and 50% H2O has a boiling point of 140°C. KOH/ H2O solutions have boiling points in the range of 140°C to 150°C. In each case of Table 1, the process temperature was above the boiling point of the removal chemical used to remove the coating at atmospheric pressure. In addition, KOH and NaOH removal chemicals are known to be relatively unreactive with silicon carbide and titanium, the materials of the underlying components in Table 1. Additionally, at the temperature ranges in which the KOH and NaOH solutions described in Table 1 may be used in the baths where the solutions are exposed to atmospheric pressure, the coating removal rates are so low that it is not commercially feasible to remove such coatings using wet etching techniques. Thus, herein, in each coating removal step, it is believed that less than 0.1% to 0.5% of the underlying material of the component is removed. Thus, the amount of coating removal and component reuse is substantially increased as opposed to using shot blasting or sand blasting for coating removal of components having such underlying material compositions.

100:塗層移除容器 102:可移除覆蓋 104:大體上正環形主體 106:處理容積 108:溫度維持系統 110:第一流體線路 112:第二流體線路 114:第三流體線路 116:基底 120:破裂圓盤 122:通氣閥 124:超大氣蒸氣 126:移除流體 128:頂部空間 130:排泄閥 132:凸緣連接 134:圓周容器壁 136:凸形基底壁 138:下圓周末端壁 140:上末端壁 142:著陸表面 144:內表面 146:籠/籃 148:加熱器 150:外部表面 151:冷卻通道 152:圓周凸緣 154:第一末端 156:第二末端 158:正環形盤管 160:盤管內徑 162:冷凍器 164:泵 166:系統控制器 172:電源供應器 173:配線 174:熱電偶 176:上表面 178:吊孔 180:扣件開口 182:螺椿 184:基底部分 186:螺紋柄部分 188:外覆蓋表面 190:墊圈 191:再填充閥 192:螺帽 193:第三流體導管 194:密封溝槽 196:密封環 197:移除流體儲存器 198:基底 199:收集容器 200:組件 202:空心主體 204:第一歧管入口 206:第二歧管入口 208:流體出口 210:組件加熱器 212:破裂圓盤 214:泄壓閥 216:釋放流體管路 218:歧管排泄閥 220:排泄線路 222:歧管 294:通氣開口 298:塗層移除容積 300:塗層移除容器 301:大體上正環形主體外殼 302:可密封圍阻容器 303:半球形帽 304:周圍內部圍阻容積 306:敞開末端 307:環形壁 310:基座 311:間隙器 312:第一冷卻流體線路 314:第二流體線路 320:門 322:局部環境壓力/周圍環境 324:控制器 326:圍阻容器壓力感測器 328:圍阻容器溫度感測器 330:圍阻容器加熱器控制線 332:圍阻容器加熱器電源供應器 334:泵 336:氣體供應器 338:流體移除線路 340:閥 341:前級線路 342:回收容器 344:真空源 346:閥 350:閥 351:變數控制器 360:圍阻容器加熱器 362:圍阻容積泄壓閥 364:泵 400:壓力容器 402:可加壓容積 404:外圓周壁 406:上半球形帽 408:下半球形帽 410:泵 412:泵線路/流體供應線路 414:壓力感測器 416:壓力容器溫度感測器 418:壓力容器加熱器電源供應器 420:護套加熱器 422:加壓流體填充線路 423:壓力容器泄壓閥 424:閥 428:返回閥 430:流體返回線路 432:塗層移除流體 434:分離泵 100: coating removal container 102: removable cover 104: substantially annular body 106: process volume 108: temperature maintenance system 110: first fluid circuit 112: second fluid circuit 114: third fluid circuit 116: base 120: rupture disk 122: vent valve 124: supergas 126: fluid removal 128: head space 130: drain valve 132: flange connection 134: circumferential container wall 136: convex base wall 138: lower circumferential end wall 140: upper end wall 142: landing surface 144: inner surface 146: cage/basket 148: heater 150: external surface 151: cooling channel 152: circumferential flange 154: first end 156: second end 158: positive annular coil 160: coil inner diameter 162: freezer 164: pump 166: system controller 172: power supply 173: wiring 174: thermocouple 176: upper surface 178: lifting hole 180: fastener opening 182: screw 184: base portion 186: threaded shank portion 188: outer cover surface 190: gasket 191: refill valve 192: Nut 193: Third fluid conduit 194: Sealing groove 196: Sealing ring 197: Removal fluid reservoir 198: Base 199: Collection container 200: Assembly 202: Hollow body 204: First manifold inlet 206: Second manifold inlet 208: Fluid outlet 210: Assembly heater 212: Rupture disc 214: Pressure relief valve 216: Release fluid line 218: Manifold drain valve 220: Drain line 222: Manifold 294: Vent opening 298: Coating removal volume 300: Coating removal container 301: generally annular main body housing 302: sealable containment vessel 303: hemispherical cap 304: surrounding inner containment volume 306: open end 307: annular wall 310: base 311: spacer 312: first cooling fluid line 314: second fluid line 320: door 322: local ambient pressure/ambient environment 324: controller 326: containment vessel pressure sensor 328: containment vessel temperature sensor 330: containment vessel heater control line 332: containment vessel heater power supply 334: pump 336: gas supply 338: fluid removal line 340: Valve 341: Foreline 342: Recovery container 344: Vacuum source 346: Valve 350: Valve 351: Variable controller 360: Containment container heater 362: Containment volume pressure relief valve 364: Pump 400: Pressure vessel 402: Pressurizable volume 404: Outer circumferential wall 406: Upper hemispherical cap 408: Lower hemispherical cap 410: Pump 412: Pump line/fluid supply line 414: Pressure sensor 416: Pressure vessel temperature sensor 418: Pressure vessel heater power supply 420: Sheath heater 422: Pressurized fluid fill line 423: Pressure vessel relief valve 424: Valve 428: Return valve 430: Fluid return line 432: Coating removal fluid 434: Separation pump

第1圖為塗層移除腔室的示意性截面圖;FIG. 1 is a schematic cross-sectional view of a coating removal chamber;

第2圖為第1圖之塗層移除腔室的示意性圖解,其示出該塗層移除腔室至對於該塗層移除腔室之操作有用的周邊設備之連接;FIG. 2 is a schematic illustration of the coating removal chamber of FIG. 1 showing the connection of the coating removal chamber to peripheral equipment useful for the operation of the coating removal chamber;

第3圖為第1圖之塗層移除容器的平面圖;且Figure 3 is a plan view of the coating removal container of Figure 1; and

第4圖為經組配以提供用於其清潔的其自有可加壓內部容積之組件的示意圖;FIG4 is a schematic diagram of the assembly assembled to provide its own pressurizable internal volume for cleaning thereof;

第5圖為替代性材料移除系統的示意圖,其中在圍阻容器中處理單獨塗層移除腔室或容器;FIG. 5 is a schematic diagram of an alternative material removal system in which a separate coating removal chamber or vessel is processed within a containment vessel;

第6圖為第5圖之圍阻容器的側視圖;Figure 6 is a side view of the containment vessel in Figure 5;

第7圖為第5圖之壓力容器的平面圖;Figure 7 is a plan view of the pressure vessel in Figure 5;

第8圖為另一替代性塗層移除系統的示意圖。FIG. 8 is a schematic diagram of another alternative coating removal system.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

200:組件 200:Components

294:通氣開口 294: Ventilation opening

298:塗層移除容積 298: Coating removal volume

300:塗層移除容器 300:Coating removal container

301:大體上正環形主體外殼 301: Generally annular main body shell

302:可密封圍阻容器 302: Sealable containment container

303:半球形帽 303: Hemispherical cap

304:周圍內部圍阻容積 304: Surrounding internal resistance volume

306:敞開末端 306: Open end

307:環形壁 307: Ring wall

310:基座 310: Base

311:間隙器 311: Spacer

320:門 320: Door

322:局部環境壓力/周圍環境 322: Local environmental stress/surrounding environment

324:控制器 324: Controller

326:圍阻容器壓力感測器 326: Containment vessel pressure sensor

328:圍阻容器溫度感測器 328: Containment container temperature sensor

330:圍阻容器加熱器控制線 330: Containment container heater control line

332:圍阻容器加熱器電源供應器 332: Containment vessel heater power supply

360:圍阻容器加熱器 360: Containment container heater

362:圍阻容積泄壓閥 362: Containment volume pressure relief valve

364:泵 364: Pump

400:壓力容器 400: Pressure vessel

402:可加壓容積 402: Pressurizable volume

404:外圓周壁 404: Outer circumferential wall

406:上半球形帽 406: Upper hemispherical cap

408:下半球形帽 408: Lower hemispherical cap

410:泵 410: Pump

412:泵線路/流體供應線路 412: Pump line/fluid supply line

414:壓力感測器 414: Pressure sensor

416:壓力容器溫度感測器 416: Pressure vessel temperature sensor

418:壓力容器加熱器電源供應器 418: Pressure vessel heater power supply

420:護套加熱器 420: Sheath heater

422:加壓流體填充線路 422: Pressurized fluid fill line

423:壓力容器泄壓閥 423: Pressure vessel relief valve

424:閥 424: Valve

428:返回閥 428: Return valve

430:流體返回線路 430: Fluid return line

432:塗層移除流體 432: Coating removal fluid

434:分離泵 434: Separation pump

Claims (10)

一種自一組件移除一塗層之方法,該方法包含以下步驟: 提供一塗層移除容器,該塗層移除容器具有一主體、以及位於該主體中之一可密封處理容積; 在該可密封處理容積中,以液態並於周圍環境壓力下提供一塗層移除流體,該塗層移除流體在高於包圍該移除容器的環境溫度的一高溫下與該塗層反應; 將上面具有將要在該塗層移除容器中移除之該塗層的該組件定位於該塗層移除容器之該處理容積中; 將該可密封處理容積密封隔絕於包圍該處理容積的周圍環境; 在保持該塗層移除流體為液態的情況下,將該塗層移除流體加熱至大於該塗層移除流體在周圍環境之壓力下之沸點的溫度; 在自該組件移除該塗層的期間,使用一溫度維持系統來加熱及冷卻該塗層移除流體; 在大於該塗層移除流體在周圍環境之壓力下之沸點的溫度,使用液態之該塗層移除流體來自該組件移除該塗層; 使用該溫度維持系統來將該塗層移除流體之溫度降低至小於該塗層移除流體在周圍環境之壓力下之沸點的溫度,該溫度維持系統包括包圍該塗層移除容器之一外部表面的一加熱器、以及一冷卻通道,該冷卻通道在其相反的第一末端及第二末端處延伸穿過該塗層移除容器之該主體、且在該處理容積內在該第一末端與該第二末端之間延伸、並與該塗層移除流體接觸; 使該可密封容積排放至周圍環境;以及 自該處理容積移除該組件。 A method for removing a coating from a component, the method comprising the following steps: Providing a coating removal container, the coating removal container having a main body and a sealable processing volume located in the main body; Providing a coating removal fluid in a liquid state and under ambient pressure in the sealable processing volume, the coating removal fluid reacting with the coating at an elevated temperature higher than the ambient temperature surrounding the removal container; Positioning the component having the coating to be removed in the coating removal container in the processing volume of the coating removal container; Sealing the sealable processing volume from the ambient environment surrounding the processing volume; heating the coating removal fluid to a temperature greater than the boiling point of the coating removal fluid at the pressure of the surrounding environment while maintaining the coating removal fluid in a liquid state; using a temperature maintenance system to heat and cool the coating removal fluid during the removal of the coating from the component; removing the coating from the component using the coating removal fluid in a liquid state at a temperature greater than the boiling point of the coating removal fluid at the pressure of the surrounding environment; Using the temperature maintenance system to reduce the temperature of the coating removal fluid to a temperature less than the boiling point of the coating removal fluid at the pressure of the surrounding environment, the temperature maintenance system includes a heater surrounding an exterior surface of the coating removal container, and a cooling channel extending through the body of the coating removal container at opposite first and second ends thereof and extending within the processing volume between the first and second ends and in contact with the coating removal fluid; venting the sealable volume to the surrounding environment; and removing the assembly from the processing volume. 如請求項1所述之方法,進一步包含以下步驟:在該塗層移除容器中自該組件移除該塗層,同時該組件之材料僅有小於0.05%被該移除流體移除。The method of claim 1, further comprising the step of removing the coating from the component in the coating removal vessel, wherein less than 0.05% of the material of the component is removed by the removal fluid. 如請求項2所述之方法,進一步包含以下步驟:自該處理容積移除已暴露於將要自該組件移除的該塗層的該移除流體且將新鮮的移除流體提供至該處理容積。The method of claim 2 further comprises the steps of removing the removal fluid that has been exposed to the coating to be removed from the component from the processing volume and providing fresh removal fluid to the processing volume. 如請求項1所述之方法,其中將要移除的該塗層為氧化鉿或氧化鋁中之一者,且該組件之材料為碳化矽或鈦。The method as described in claim 1, wherein the coating to be removed is one of benzimidazole or aluminum oxide, and the material of the component is silicon carbide or titanium. 一種自包含碳化矽或鈦中之至少一者的一下層材料移除氧化鉿或氧化鋁中之至少一者之一塗層之方法,該方法包含以下步驟: 在周圍環境之壓力下,使該塗層暴露於一移除流體,該移除流體在該移除流體在周圍環境之壓力的大氣條件下為液體的溫度下與該塗層反應,但與該塗層所在的該下層材料不反應; 在保持該移除流體為液態的情況下,將暴露於該塗層之該移除流體加熱至大於該移除流體在周圍環境之壓力的大氣條件下為液態的溫度,同時使該塗層持續地暴露於該移除流體; 將暴露於該塗層之該移除流體之溫度保持在第一溫度,該第一溫度大於該移除流體在周圍環境之壓力之大氣條件下為液體的第二溫度,同時使該塗層持續地暴露於該移除流體; 在自該下層材料移除該塗層的期間,使用一溫度維持系統來加熱及冷卻該移除流體; 藉由使該塗層與該移除流體反應來移除該塗層;以及隨後 將該移除流體之該溫度降低至該移除流體在周圍環境之壓力之大氣條件下為液體的溫度,或降低至小於該移除流體在周圍環境之壓力之大氣條件下為液體的溫度。 A method for removing a coating of at least one of ferroxene oxide or aluminum oxide from an underlying material containing at least one of silicon carbide or titanium, the method comprising the following steps: Under the pressure of the surrounding environment, the coating is exposed to a removal fluid, the removal fluid reacts with the coating at a temperature at which the removal fluid is liquid under the atmospheric conditions of the pressure of the surrounding environment, but does not react with the underlying material on which the coating is located; While keeping the removal fluid in a liquid state, the removal fluid exposed to the coating is heated to a temperature greater than the temperature at which the removal fluid is liquid under the atmospheric conditions of the pressure of the surrounding environment, and the coating is continuously exposed to the removal fluid; Maintaining the temperature of the removal fluid exposed to the coating at a first temperature greater than a second temperature at which the removal fluid is liquid under atmospheric conditions of the pressure of the surrounding environment while continuously exposing the coating to the removal fluid; Using a temperature maintenance system to heat and cool the removal fluid during the removal of the coating from the underlying material; Removing the coating by reacting the coating with the removal fluid; and Thereafter reducing the temperature of the removal fluid to a temperature at which the removal fluid is liquid under atmospheric conditions of the pressure of the surrounding environment, or to a temperature less than a temperature at which the removal fluid is liquid under atmospheric conditions of the pressure of the surrounding environment. 如請求項5所述之方法,其中該移除流體不蝕刻該組件之該下層材料。The method of claim 5, wherein the removal fluid does not etch the underlying material of the component. 如請求項5所述之方法,其中該塗層包含氧化鉿或氧化鋁中之至少一者,且該組件材料包含氮化矽或鈦中之至少一者。The method of claim 5, wherein the coating comprises at least one of bismuth oxide or aluminum oxide, and the component material comprises at least one of silicon nitride or titanium. 如請求項7所述之方法,其中該移除流體包含KOH或NaOH之至少一者。The method of claim 7, wherein the removal fluid comprises at least one of KOH or NaOH. 一種自一組件移除一塗層之方法,該方法包含以下步驟: 提供一圍阻容器,該圍阻容器具有一內部容積及一可密封門; 提供一或多個塗層移除容器,該一或多個塗層移除容器經配置以被收容在該圍阻容器內; 於大氣壓力下,在該塗層移除容器中提供一塗層移除流體; 在該一或多個塗層移除容器的內部暴露於周圍環境大氣壓力的情況下,將一組件定位至該一或多個塗層移除容器之一者的內部; 將該塗層移除容器定位於該圍阻容器之該內部容積內,並關閉該可密封門以密封該內部容積; 在保持該塗層移除流體為液態的情況下,將該塗層移除流體之壓力及溫度增加至大於該塗層移除流體在周圍環境之壓力下之沸點的溫度;以及 在自該組件移除該塗層的期間,使用一溫度維持系統來加熱及冷卻該塗層移除流體。 A method for removing a coating from a component, the method comprising the following steps: Providing a containment container having an interior volume and a sealable door; Providing one or more coating removal containers, the one or more coating removal containers being configured to be contained within the containment container; Providing a coating removal fluid in the coating removal container under atmospheric pressure; Positioning a component inside one of the one or more coating removal containers with the interior of the one or more coating removal containers exposed to ambient atmospheric pressure; Positioning the coating removal container within the interior volume of the containment container and closing the sealable door to seal the interior volume; While maintaining the coating removal fluid in a liquid state, increasing the pressure and temperature of the coating removal fluid to a temperature greater than the boiling point of the coating removal fluid at the pressure of the surrounding environment; and using a temperature maintenance system to heat and cool the coating removal fluid during the removal of the coating from the component. 如請求項9所述之塗層移除方法,進一步包含以下步驟:提供一壓力源,該壓力源選擇性地流體連接至該圍阻容器之該內部容積;以及 使一加壓流體自該壓力源流動至該圍阻容器中。 The coating removal method as described in claim 9 further comprises the steps of: providing a pressure source, the pressure source selectively fluidly connected to the internal volume of the containment vessel; and allowing a pressurized fluid to flow from the pressure source into the containment vessel.
TW113136533A 2023-01-25 2023-03-14 Coating removal system and methods of operating same TWI879680B (en)

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