TW202501201A - Liquid cooling assembly and server - Google Patents

Abstract

A liquid cooling assembly includes a first liquid cooling plate, a second liquid cooling plate, a first connection pipe and a second connection pipe. The first liquid cooling plate includes a first heat dissipation part and a second heat dissipation part. The first heat dissipation part has a first fluid chamber. The second heat dissipation part is connected to the first heat dissipation part and has a first fluid channel. The second liquid cooling plate includes a third heat dissipation part and a fourth heat dissipation part. The third heat dissipation part has a second fluid chamber. The fourth heat dissipation part is connected to the third heat dissipation part and has a second fluid channel in fluid communication with the second fluid chamber. The first connection pipe is connected to the third heat dissipation part and the first heat dissipation part so as to connect the first fluid chamber to the second fluid chamber. The second connection pipe is connected to the second heat dissipation part and the fourth heat dissipation part so as to connect the first fluid channel to the second fluid channel.

Description

Liquid cold plate assembly and server

The present invention relates to a liquid cooling plate assembly and a server.

In addition to the central processing unit (hereinafter referred to as CPU), the server motherboard usually has a voltage regulator (hereinafter referred to as VR) chip to adjust the load voltage so that the CPU can work normally. Currently, most CPUs are cooled by cold plates, while VR chips are cooled by heat sink fins with passive air cooling or active air cooling. However, as the performance of VR chips increases, VR chips generate more heat, so the traditional heat sink fins with passive air cooling or active air cooling are no longer in line with the heat dissipation efficiency of VR chips. Therefore, researchers in this field are currently working to solve the above problems.

The present invention provides a liquid cooling plate assembly and a server, which can efficiently dissipate heat for VR chips.

A liquid cooling plate assembly disclosed in an embodiment of the present invention is used for thermal contact with two first heat sources and multiple second heat sources. The liquid cooling plate assembly includes a first liquid cooling plate, a second liquid cooling plate, a first connecting tube and at least one second connecting tube. The first liquid cooling plate includes a first heat sink and at least one second heat sink. The first heat sink is used for thermal contact with one of the first heat sources and has a first fluid chamber. The second heat sink is connected to the first heat sink and is used for thermal contact with a portion of the second heat source. The second heat sink has a first fluid channel. The second liquid cooling plate includes a third heat sink and at least one fourth heat sink. The third heat sink is used for thermal contact with another first heat source and has a second fluid chamber. The fourth heat sink is connected to the third heat sink and is used for thermal contact with a portion of the second heat source. The fourth heat sink has a second fluid channel, and the second fluid channel is connected to the second fluid chamber. The first connecting tube is connected to the third heat dissipation part and the first heat dissipation part, so that the second fluid chamber is connected to the first fluid chamber. The second connecting tube is connected to the fourth heat dissipation part and the second heat dissipation part, so that the second fluid channel is connected to the first fluid channel.

Another embodiment of the present invention discloses a server, comprising a case, a motherboard and a liquid cooling plate assembly. The case has a storage space. The motherboard is located in the storage space and has two first heat sources and multiple second heat sources. The liquid cooling plate assembly comprises a first liquid cooling plate, a second liquid cooling plate, a first connecting tube and at least one second connecting tube. The first liquid cooling plate comprises a first heat sink and at least one second heat sink. The first heat sink is thermally in contact with one of the first heat sources and has a first fluid chamber. The second heat sink is connected to the first heat sink and is thermally in contact with a portion of the second heat source, and the second heat sink has a first fluid channel. The second liquid cooling plate comprises a third heat sink and at least one fourth heat sink. The third heat sink is thermally in contact with another first heat source and has a second fluid chamber. The fourth heat sink is connected to the third heat sink and is in thermal contact with a portion of the second heat source. The fourth heat sink has a second fluid channel, and the second fluid channel is connected to the second fluid chamber. The first connecting tube is connected to the third heat sink and the first heat sink, so that the second fluid chamber is connected to the first fluid chamber. The second connecting tube is connected to the fourth heat sink and the second heat sink, so that the second fluid channel is connected to the first fluid channel.

According to the liquid cooling plate assembly and server disclosed in the above-mentioned embodiments, the cooling liquid can flow through the first fluid chamber of the first heat sink of the first liquid cooling plate, the second fluid chamber of the third heat sink of the second liquid cooling plate, the second fluid channel of the fourth heat sink of the second liquid cooling plate, and the first fluid channel of the second heat sink of the first liquid cooling plate, so that the cooling liquid can exchange heat with the first heat sink and the second heat sink that are in thermal contact with the first heat source to remove the heat generated by the first heat source, and the cooling liquid can exchange heat with the second heat sink and the fourth heat sink that are in thermal contact with the second heat source to remove the heat generated by the second heat source. In this way, the liquid cooling plate can efficiently dissipate heat for the first heat source and the second heat source, and meet the heat dissipation requirements of the first heat source and the second heat source.

The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figures 1 to 3. Figure 1 is a partial three-dimensional schematic diagram of a server disclosed according to an embodiment of the present invention. Figure 2 is an exploded schematic diagram of the liquid cooling plate assembly and the motherboard of Figure 1. Figure 3 is a top view schematic diagram of the liquid cooling plate assembly and the motherboard of Figure 1.

In this embodiment, the server 1 includes a housing 10, a motherboard 20 and a liquid cooling plate assembly 30. In addition, the server 1 may also include other components, such as hard disks, fans and power supplies. In order to highlight the structure of the liquid cooling plate of the server 1, the figure omits the aforementioned components.

In the present embodiment, the case 10 has a housing space 11, and the motherboard 20 is located in the housing space 11. The motherboard 20 has a plurality of first heat sources 21 and a plurality of second heat sources 22. In detail, the number of the first heat sources 21 is two, and the two first heat sources 21 are, for example, central processing units (CPUs). The number of the second heat sources 22 is, for example, 46, and the second heat sources 22 are, for example, voltage regulator chips. The second heat sources 22 are located around the two second heat sources 22. For example, part of the second heat sources 22 are located on opposite sides of one of the first heat sources 21, and another part of the second heat sources 22 are located on opposite sides of another first heat source 21.

The liquid cooling plate assembly 30 includes a first liquid cooling plate 31 , a second liquid cooling plate 32 , a first connecting tube 33 and two second connecting tubes 34 . In addition, the liquid cooling plate assembly 30 may further include a third connecting tube 35 and a fourth connecting tube 36 .

The first liquid cooling plate 31 includes a first heat sink 311 and two second heat sinks 312. The first heat sink 311 includes a first base 3111, a first cover 3112 and a plurality of first fin structures 3113. The first base 3111 is used to thermally contact one of the first heat sources 21 to absorb heat generated by the first heat source 21. The first cover 3112 is installed on the first base 3111, and the first cover 3112 and the first base 3111 together form a first fluid chamber 3114. These first fin structures 3113 are arranged in the first fluid chamber 3114 at intervals, and a three-dimensional shovel-toothed flow channel is formed in the first fluid chamber 3114 to increase the contact area between the cooling liquid and the first heat sink 311, thereby improving the heat exchange efficiency. The two second heat sinks 312 are integrally connected to the opposite sides of the first base 3111, and the width W1 of the first heat sink 311 is greater than the width W2 of the two second heat sinks 312. The first heat sink 311 and the two second heat sinks 312 are jointly I-shaped. The two second heat sinks 312 are in thermal contact with a portion of the second heat source 22 located on the opposite sides of one of the first heat sources 21, and the two second heat sinks 312 each have a first fluid channel 3121.

It should be noted that the first fin structure 3113 is an optional structure and can be configured or omitted according to the required heat exchange efficiency. In addition, the first cover 3112 of the first heat sink 311 is not limited to being combined with the first base 3111 in an assembled manner. In other embodiments, the first cover of the first heat sink can be formed integrally with the first base.

The second liquid cooling plate 32 includes a third heat sink 321 and two fourth heat sinks 322. The third heat sink 321 includes a second base 3211, a second cover 3212 and a plurality of second fin structures 3213. The second base 3211 is used to thermally contact another first heat source 21 to absorb the heat generated by the first heat source 21. The second cover 3212 is mounted on the second base 3211, and the second cover 3212 and the second base 3211 together form a second fluid chamber 3214. The second fin structures 3213 are arranged in the second fluid chamber 3214 at intervals, and a three-dimensional shovel-toothed flow channel is formed in the second fluid chamber 3214 to increase the contact area between the cooling liquid and the third heat sink 321, thereby improving the heat exchange efficiency. The second fourth heat sink 322 is integrally connected to two opposite sides of the second base 3211, and the width W3 of the third heat sink 321 is greater than the width W4 of the second fourth heat sink 322. The third heat sink 321 and the second fourth heat sink 322 are both in an I shape. The second fourth heat sink 322 is in thermal contact with a portion of the second heat source 22 located on two opposite sides of the other first heat source 21, and each of the second fourth heat sink 322 has a second fluid channel 3221.

It should be noted that the second fin structure 3213 is an optional structure and can be configured or omitted according to the required heat exchange efficiency. In addition, the second cover 3212 of the third heat sink 321 is not limited to being combined with the second base 3211 in an assembled manner. In other embodiments, the second cover of the third heat sink can be formed integrally with the second base.

Two opposite ends of the first connecting tube 33 are respectively connected to the first cover 3112 of the first heat dissipation portion 311 and the second cover 3212 of the third heat dissipation portion 321 , so that the first fluid chamber 3114 of the first heat dissipation portion 311 and the second fluid chamber 3214 of the third heat dissipation portion 321 are connected.

The opposite ends of one of the second connecting tubes 34 are respectively connected to one of the fourth heat dissipation parts 322 and one of the second heat dissipation parts 312, so that the second fluid channel 3221 of the fourth heat dissipation part 322 is connected to the first fluid channel 3121 of the second heat dissipation part 312. The opposite ends of the other second connecting tube 34 are respectively connected to another fourth heat dissipation part 322 and another second heat dissipation part 312, so that the second fluid channel 3221 of the fourth heat dissipation part 322 is connected to the first fluid channel 3121 of the second heat dissipation part 312.

Two opposite ends of the third connecting tube 35 are respectively connected to the third heat dissipation portion 321 and one of the fourth heat dissipation portions 322 , so that the second fluid chamber 3214 of the third heat dissipation portion 321 is connected to the second fluid channel 3221 of the fourth heat dissipation portion 322 .

The opposite ends of the fourth connecting pipe 36 are respectively connected to the two ends of the second heat sinks 312 respectively far from the second fourth heat sinks 322, so as to connect the two first fluid channels 3121 of the second heat sinks 312. The second heat sinks 312, the second fourth heat sinks 322 and the fourth connecting pipe 36 are all in a U shape.

In this embodiment, the cover of the first heat sink 311 is used for connecting a liquid inlet pipe I, and the fourth heat sink 322 not connected with the fourth connecting pipe 36 is used for connecting a liquid outlet pipe O. The liquid inlet pipe I, the liquid cooling plate assembly 30 and the liquid outlet pipe O can form a cooling liquid circulation together with a pump (not shown) and a heat sink (not shown). For example, the pump can drive the cooling liquid (not shown) into the first fluid chamber 3114 of the first heat sink 311 through the liquid inlet pipe I, so that the cooling liquid can exchange heat with the first heat sink 311 and take away the heat generated by one of the first heat sources 21. Then, the cooling liquid enters the second fluid chamber 3214 of the third heat sink 321 through the first connecting pipe 33, so that the cooling liquid can exchange heat with the third heat sink 321 and take away the heat generated by another first heat source 21. Then, the cooling liquid enters the second fluid channel 3221 of one of the fourth heat sinks 322 through the third connecting pipe 35, and then flows to the second fluid channel 3221 of another fourth heat sink 322 through one of the second connecting pipes 34, the first fluid channel 3121 of one of the second heat sinks 312, the fourth connecting pipe 36, the first fluid channel 3121 of another second heat sink 312 and the second connecting pipe 34 in sequence, and takes away the heat generated by these second heat sources 22. Then, the cooling liquid flows to the radiator through the liquid outlet pipe O and is cooled. In this way, by repeating the above process, the liquid cooling plate assembly 30 can effectively dissipate heat for the first heat sources 21 and the second heat sources 22, thereby meeting the heat dissipation requirements of the first heat sources 21 and the second heat sources 22. Specifically, after the second heat sources 22 are dissipated by the liquid cooling plate assembly 30, the temperature of the second heat sources 22 is distributed between 55.2 and 69.3 degrees Celsius, which is much lower than the critical temperature of the second heat sources 22, which is 85 degrees Celsius. In addition, the conventional heat dissipation means for the second heat sources 22 can only allow the temperature of the second heat sources 22 to be distributed between 57.1 and 76.1 degrees Celsius, so compared with the conventional heat dissipation means, the liquid cooling plate assembly 30 of this embodiment can further reduce the temperature of the second heat sources 22.

In this embodiment, by configuring the two second heat dissipation parts 312 to be integrally connected to the opposite sides of the first base 3111, and the two fourth heat dissipation parts 322 to be integrally connected to the opposite sides of the second base 3211, the first liquid cooling plate 31 and the second liquid cooling plate 32 can have sufficient structural strength and save the manufacturing cost of the first liquid cooling plate 31 and the second liquid cooling plate 32.

It should be noted that the two second heat sinks 312 are not limited to being integrally connected to the opposite sides of the first base 3111, and the two fourth heat sinks 322 are not limited to being integrally connected to the opposite sides of the second base 3211. In other embodiments, the two second heat sinks may be assembled to the opposite sides of the first base, and the two fourth heat sinks may be assembled to the opposite sides of the second base.

In this embodiment, the fluid channels and fluid chambers of the first liquid cooling plate 31 and the second liquid cooling plate 32 are connected by the design of the first connecting tube 33, the second connecting tube 34, the third connecting tube 35 and the fourth connecting tube 36, so that the entire liquid cooling plate assembly 30 is applicable to a variety of complex situations, making the liquid cooling plate assembly 30 universal for different models. In addition, the liquid cooling plate assembly 30 can support harsh environments, is highly stable, and has a long service life.

It should be noted that the third connecting tube 35 is an optional component. In other embodiments, the second fluid chamber of the third heat sink can flow through the inner flow channel of the second base to the second fluid channel of the fourth heat sink.

In addition, the two opposite sides of each first heat source 21 of the motherboard 20 are not limited to having the second heat source 22. In other embodiments, each first heat source of the motherboard may have the second heat source on only one side. Under such a configuration, the first liquid cooling plate may have only one second heat dissipation part, the second liquid cooling plate may have only one fourth heat dissipation part, the number of the second connecting pipe may be only one to connect the aforementioned second heat dissipation part and the fourth heat dissipation part, and the fourth connecting pipe may be omitted.

In this embodiment, the first liquid cooling plate 31 and the second liquid cooling plate 32 can be made of metal materials, such as aluminum or copper, which have better thermal conductivity, and further enhance the heat dissipation effect of the liquid cooling plate assembly 30 on the first heat source 21 and the second heat source 22.

The liquid cooling plate assembly 30 is not limited to being applied to the server 1 , and the liquid cooling plate assembly 30 can be applied to other types of electronic products as required.

According to the liquid cooling plate assembly and server disclosed in the above-mentioned embodiments, the cooling liquid can flow through the first fluid chamber of the first heat sink of the first liquid cooling plate, the second fluid chamber of the third heat sink of the second liquid cooling plate, the second fluid channel of the fourth heat sink of the second liquid cooling plate, and the first fluid channel of the second heat sink of the first liquid cooling plate, so that the cooling liquid can exchange heat with the first heat sink and the second heat sink that are in thermal contact with the first heat source to remove the heat generated by the first heat source, and the cooling liquid can exchange heat with the second heat sink and the fourth heat sink that are in thermal contact with the second heat source to remove the heat generated by the second heat source. In this way, the liquid cooling plate can efficiently dissipate heat for the first heat source and the second heat source, and meet the heat dissipation requirements of the first heat source and the second heat source.

Furthermore, by designing the first connecting tube, the second connecting tube, the third connecting tube and the fourth connecting tube, the fluid channels and the fluid chambers of the first liquid cooling plate and the second liquid cooling plate can be connected, so that the entire liquid cooling plate assembly is applicable to a variety of complex situations, making the liquid cooling plate assembly universal for various different models.

Although the present invention is disclosed as above with the aforementioned preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

1: Server 10: Chassis 11: Accommodation space 20: Motherboard 21: First heat source 22: Second heat source 30: Liquid cooling plate assembly 31: First liquid cooling plate 311: First heat sink 3111: First base 3112: First cover 3113: First fin structure 3114: First fluid chamber 312: Second heat sink 3121: First fluid channel 32: Second liquid cooling plate 321: Third heat sink 3211: Second base 3212: Second cover 3213: Second fin structure 3214: Second fluid chamber 322: Fourth heat sink 3221: Second fluid channel 33: First connecting pipe 34: Second connecting pipe 35: Third connecting pipe 36: Fourth connecting pipe W1, W2, W3, W4: Width I: Liquid inlet pipe O: Liquid outlet pipe

FIG. 1 is a partial three-dimensional schematic diagram of a server disclosed according to an embodiment of the present invention. FIG. 2 is a schematic diagram of an exploded view of the liquid cooling plate assembly and the motherboard of FIG. 1 . FIG. 3 is a schematic diagram of a top view of the liquid cooling plate assembly and the motherboard of FIG. 1 .

20: Motherboard

21: The first heat source

22: Second heat source

30: Liquid cooling plate assembly

31: The first liquid cooling plate

32: Second liquid cooling plate

33: First connecting pipe

34: Second connecting pipe

35: The third connecting pipe

36: Fourth connecting tube

I: Liquid inlet pipe

O: Liquid outlet pipe

Claims (10)

A liquid cooling plate assembly is used for thermally contacting two first heat sources and a plurality of second heat sources. The liquid cooling plate assembly comprises: a first liquid cooling plate, comprising: a first heat sink, which is used for thermally contacting one of the first heat sources and has a first fluid chamber; and at least one second heat sink, which is connected to the first heat sink and is used for thermally contacting some of the second heat sources, and the at least one second heat sink has a first fluid channel; a second liquid cooling plate, comprising: a third heat sink, which is used for thermally contacting another of the first heat sources and has a second fluid chamber. chamber; and at least one fourth heat dissipation portion connected to the third heat dissipation portion and used for thermally contacting part of the second heat sources, the at least one fourth heat dissipation portion having a second fluid channel, the second fluid channel connected to the second fluid chamber; a first connecting tube connected to the third heat dissipation portion and the first heat dissipation portion, so that the second fluid chamber is connected to the first fluid chamber; and at least one second connecting tube connected to the at least one fourth heat dissipation portion and the at least one second heat dissipation portion, so that the second fluid channel is connected to the first fluid channel. The liquid cooling plate assembly as described in claim 1 further comprises a third connecting tube, wherein the third connecting tube connects the third heat sink and the at least one fourth heat sink, thereby connecting the second fluid chamber to the second fluid channel. The liquid cooling plate assembly as described in claim 2 further includes a fourth connecting tube, the number of the at least one second heat sink and the number of the at least one fourth heat sink are both two, the two second heat sinks are respectively connected to the two opposite sides of the first heat sink, the two fourth heat sinks are respectively connected to the two opposite sides of the third heat sink, the number of the at least one second connecting tube is two, the two second heat sinks are respectively connected to the two fourth heat sinks through the two second connecting tubes, so that the two first fluid channels of the two second heat sinks are respectively connected to the two second fluid channels of the two fourth heat sinks, the third connecting tube is connected to one of the fourth heat sinks, and the opposite ends of the fourth connecting tube are respectively connected to the two ends of the two second heat sinks that are respectively far away from the two fourth heat sinks, so that the two first fluid channels of the two second heat sinks are connected. A liquid cooling plate assembly as described in claim 3, wherein the first heat sink and the two second heat sinks are collectively I-shaped, the third heat sink and the two fourth heat sinks are collectively I-shaped, and the two second heat sinks, the two fourth heat sinks and the fourth connecting tube are collectively U-shaped. The liquid cooling plate assembly as described in claim 1, wherein the width of the first heat dissipation portion is greater than the width of the at least one second heat dissipation portion, and the width of the third heat dissipation portion is greater than the width of the at least one fourth heat dissipation portion. A liquid cooling plate assembly as described in claim 1, wherein the first heat dissipation portion comprises a first base, a first cover and a plurality of first fin structures, the first base is connected to the at least one second heat dissipation portion, the first cover is disposed on the first base, the first cover and the first base together form the first fluid chamber, and the first fin structures are disposed in the first fluid chamber at intervals from each other, the third heat dissipation portion comprises a second base, a second cover and a plurality of second fin structures, the second base is connected to the at least one fourth heat dissipation portion, the second cover is disposed on the second base, the second cover and the second base together form the second fluid chamber, and the second fin structures are disposed in the second fluid chamber at intervals from each other. A server comprises: a case having a housing space; a motherboard located in the housing space and having two first heat sources and a plurality of second heat sources; and a liquid cooling plate assembly comprising: a first liquid cooling plate comprising: a first heat sink thermally contacting one of the first heat sources and having a first fluid chamber; and at least one second heat sink connected to the first heat sink and thermally contacting a portion of the second heat sources, and the at least one second heat sink having a first fluid channel; a second liquid cooling plate comprising: a third heat sink thermally contacting another of the first heat sources; a heat source having a second fluid chamber; and at least one fourth heat sink connected to the third heat sink and in thermal contact with part of the second heat sources, the at least one fourth heat sink having a second fluid channel, the second fluid channel connected to the second fluid chamber; a first connecting tube connected to the third heat sink and the first heat sink to connect the second fluid chamber to the first fluid chamber; and at least one second connecting tube connected to the at least one fourth heat sink and the at least one second heat sink to connect the second fluid channel to the first fluid channel. The server as described in claim 7 further includes a third connecting tube, which connects the third heat sink and the at least one fourth heat sink to connect the second fluid chamber to the second fluid channel. The server as described in claim 8 further includes a fourth connecting tube, the number of the at least one second heat sink and the number of the at least one fourth heat sink are both two, the two second heat sinks are respectively connected to two opposite sides of the first heat sink, the two fourth heat sinks are respectively connected to two opposite sides of the third heat sink, the number of the at least one second connecting tube is two, the two second heat sinks are respectively connected to the two fourth heat sinks through the two second connecting tubes, so that the two first fluid channels of the two second heat sinks are respectively connected to the two second fluid channels of the two fourth heat sinks, the third connecting tube is connected to one of the fourth heat sinks, and the opposite ends of the fourth connecting tube are respectively connected to the two ends of the two second heat sinks that are respectively far away from the two fourth heat sinks, so that the two first fluid channels of the two second heat sinks are connected. A server as described in claim 7, wherein the width of the first heat dissipation portion is greater than the width of the at least one second heat dissipation portion, and the width of the third heat dissipation portion is greater than the width of the at least one fourth heat dissipation portion.