TW202440694A - Liquid crystal sealant, liquid crystal display panel using the same, and method for manufacturing the same - Google Patents
Liquid crystal sealant, liquid crystal display panel using the same, and method for manufacturing the same Download PDFInfo
- Publication number
- TW202440694A TW202440694A TW113107820A TW113107820A TW202440694A TW 202440694 A TW202440694 A TW 202440694A TW 113107820 A TW113107820 A TW 113107820A TW 113107820 A TW113107820 A TW 113107820A TW 202440694 A TW202440694 A TW 202440694A
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid crystal
- sealant
- compound
- crystal sealant
- frame
- Prior art date
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 192
- 239000000565 sealant Substances 0.000 title claims abstract description 151
- 238000000034 method Methods 0.000 title claims description 23
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 150000001875 compounds Chemical class 0.000 claims abstract description 188
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 39
- 230000035699 permeability Effects 0.000 claims abstract description 30
- -1 oxime ester Chemical class 0.000 claims description 90
- 239000004593 Epoxy Substances 0.000 claims description 79
- 239000000758 substrate Substances 0.000 claims description 75
- 238000007789 sealing Methods 0.000 claims description 48
- 239000003999 initiator Substances 0.000 claims description 42
- 238000001723 curing Methods 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 28
- 125000000217 alkyl group Chemical group 0.000 claims description 21
- 239000000945 filler Substances 0.000 claims description 21
- 239000011521 glass Substances 0.000 claims description 20
- 239000003566 sealing material Substances 0.000 claims description 18
- 239000011859 microparticle Substances 0.000 claims description 17
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- 239000011258 core-shell material Substances 0.000 claims description 14
- 125000003700 epoxy group Chemical group 0.000 claims description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 9
- 150000001412 amines Chemical class 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 4
- 229920000768 polyamine Polymers 0.000 claims description 4
- 150000004056 anthraquinones Chemical class 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 3
- 238000001029 thermal curing Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 17
- 230000001070 adhesive effect Effects 0.000 abstract description 17
- 239000000126 substance Substances 0.000 abstract description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 27
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 22
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 19
- 239000002253 acid Substances 0.000 description 19
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 18
- 125000004122 cyclic group Chemical group 0.000 description 16
- 239000011256 inorganic filler Substances 0.000 description 15
- 229910003475 inorganic filler Inorganic materials 0.000 description 15
- 239000010408 film Substances 0.000 description 11
- 239000004848 polyfunctional curative Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 8
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 5
- 150000002009 diols Chemical class 0.000 description 5
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- JYKHAJGLEVKEAA-UHFFFAOYSA-N 2-(hydroxymethyl)anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CO)=CC=C3C(=O)C2=C1 JYKHAJGLEVKEAA-UHFFFAOYSA-N 0.000 description 4
- GCDBEYOJCZLKMC-UHFFFAOYSA-N 2-hydroxyanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(O)=CC=C3C(=O)C2=C1 GCDBEYOJCZLKMC-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- GTTSNKDQDACYLV-UHFFFAOYSA-N Trihydroxybutane Chemical compound CCCC(O)(O)O GTTSNKDQDACYLV-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- APAJFZPFBHMFQR-UHFFFAOYSA-N anthraflavic acid Chemical compound OC1=CC=C2C(=O)C3=CC(O)=CC=C3C(=O)C2=C1 APAJFZPFBHMFQR-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 238000004128 high performance liquid chromatography Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000004895 liquid chromatography mass spectrometry Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920000193 polymethacrylate Polymers 0.000 description 3
- 239000007870 radical polymerization initiator Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 125000004417 unsaturated alkyl group Chemical group 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 125000000490 cinnamyl group Chemical group C(C=CC1=CC=CC=C1)* 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 125000005982 diphenylmethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000004849 latent hardener Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical group O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- CZZVAVMGKRNEAT-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;3-hydroxy-2,2-dimethylpropanoic acid Chemical group OCC(C)(C)CO.OCC(C)(C)C(O)=O CZZVAVMGKRNEAT-UHFFFAOYSA-N 0.000 description 1
- YTNJFNJBHWWVCT-UHFFFAOYSA-N 2,4-bis(ethylsulfanyl)-10H-anthracen-9-one Chemical compound C(C)SC1=CC=2C(C3=CC=CC=C3CC=2C(=C1)SCC)=O YTNJFNJBHWWVCT-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LZHUBCULTHIFNO-UHFFFAOYSA-N 2,4-dihydroxy-1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)(O)C(=O)C(O)(C)CC1=CC=C(OCCO)C=C1 LZHUBCULTHIFNO-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- BMTMWCVGAVWDRA-UHFFFAOYSA-N 2-hydroxymethylanthraquinone Natural products O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CO BMTMWCVGAVWDRA-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- VAXWRFJBZKAQFI-UHFFFAOYSA-N 3-[3-(3-hydrazinyl-3-oxopropyl)-2,4-dioxo-5-propan-2-ylimidazolidin-1-yl]propanehydrazide Chemical compound CC(C)C1N(CCC(=O)NN)C(=O)N(CCC(=O)NN)C1=O VAXWRFJBZKAQFI-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- OKISUZLXOYGIFP-UHFFFAOYSA-N 4,4'-dichlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=C(Cl)C=C1 OKISUZLXOYGIFP-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 1
- 125000004864 4-thiomethylphenyl group Chemical group 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- CPPPOJMUONKOMF-UHFFFAOYSA-N C(C)(C)SC1=CC=CC=2C(C3=CC=CC=C3CC12)=O Chemical compound C(C)(C)SC1=CC=CC=2C(C3=CC=CC=C3CC12)=O CPPPOJMUONKOMF-UHFFFAOYSA-N 0.000 description 1
- MYRMJHXAAZJPBD-UHFFFAOYSA-N C=1C=CC=CC=1P(=O)C1=CC=CC=C1.CC1=CC(C)=CC(C)=C1C(=O)C(O)C1=CC=CC=C1 Chemical compound C=1C=CC=CC=1P(=O)C1=CC=CC=C1.CC1=CC(C)=CC(C)=C1C(=O)C(O)C1=CC=CC=C1 MYRMJHXAAZJPBD-UHFFFAOYSA-N 0.000 description 1
- FTVLRWHSYXAEPB-UHFFFAOYSA-N CSC1=CC=2C(C3=CC=CC=C3CC2C(=C1)SC)=O Chemical compound CSC1=CC=2C(C3=CC=CC=C3CC2C(=C1)SC)=O FTVLRWHSYXAEPB-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- BWPYBAJTDILQPY-UHFFFAOYSA-N Methoxyphenone Chemical compound C1=C(C)C(OC)=CC=C1C(=O)C1=CC=CC(C)=C1 BWPYBAJTDILQPY-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- ZCILODAAHLISPY-UHFFFAOYSA-N biphenyl ether Natural products C1=C(CC=C)C(O)=CC(OC=2C(=CC(CC=C)=CC=2)O)=C1 ZCILODAAHLISPY-UHFFFAOYSA-N 0.000 description 1
- ZNAAXKXXDQLJIX-UHFFFAOYSA-N bis(2-cyclohexyl-3-hydroxyphenyl)methanone Chemical compound C1CCCCC1C=1C(O)=CC=CC=1C(=O)C1=CC=CC(O)=C1C1CCCCC1 ZNAAXKXXDQLJIX-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 125000005998 bromoethyl group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 125000002603 chloroethyl group Chemical group [H]C([*])([H])C([H])([H])Cl 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 125000006003 dichloroethyl group Chemical group 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 125000006001 difluoroethyl group Chemical group 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- GRGBENNNGZARRZ-UHFFFAOYSA-N dodecanedihydrazide Chemical compound NNC(=O)CCCCCCCCCCC(=O)NN GRGBENNNGZARRZ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000003784 fluoroethyl group Chemical group [H]C([H])(F)C([H])([H])* 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000000589 high-performance liquid chromatography-mass spectrometry Methods 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000005394 methallyl group Chemical group 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- OLUGOCOUXQGYQN-UHFFFAOYSA-N methyl 2-benzoylbenzoate;phenyl-(4-phenylphenyl)methanone Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1.C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 OLUGOCOUXQGYQN-UHFFFAOYSA-N 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Sealing Material Composition (AREA)
Abstract
本發明的課題在於提供一種能夠製作具有黏接強度及低透濕性的密封材的液晶密封劑。解決所述課題的液晶密封劑包含硬化性化合物及硬化劑,所述硬化性化合物包含特定的化學式所表示的環化聚合性化合物。The subject of the present invention is to provide a liquid crystal sealant capable of producing a sealant having strong adhesive strength and low moisture permeability. The liquid crystal sealant for solving the above-mentioned subject comprises a curable compound and a curing agent, wherein the curable compound comprises a cyclopolymerizable compound represented by a specific chemical formula.
Description
本發明是有關於一種液晶密封劑以及使用其的液晶顯示面板及其製造方法。The present invention relates to a liquid crystal sealant, a liquid crystal display panel using the same, and a manufacturing method thereof.
液晶顯示面板通常具有一對基板、配置於該些之間的框狀的密封材、以及封入於由該密封材包圍的區域內的液晶材料。此種液晶顯示面板是藉由液晶滴加製程來製造。A liquid crystal display panel generally has a pair of substrates, a frame-shaped sealing material disposed between the substrates, and a liquid crystal material sealed in a region surrounded by the sealing material. Such a liquid crystal display panel is manufactured by a liquid crystal dropping process.
在液晶滴加製程中,首先,藉由分配法而在一對基板的其中一基板塗佈液晶密封劑,形成長方形形狀的框狀密封圖案。繼而,在液晶密封劑未硬化的狀態下,將液晶材料滴加至框狀密封圖案內、或另一基板的對應的區域。然後,在真空下將基板彼此重疊,對框狀密封圖案照射紫外線等光而進行暫時硬化。之後,進行加熱而進行正式硬化,從而製作液晶顯示面板。In the liquid crystal drop process, first, a liquid crystal sealant is applied to one of a pair of substrates by a dispensing method to form a rectangular frame-shaped seal pattern. Then, before the liquid crystal sealant is cured, a liquid crystal material is dropped into the frame-shaped seal pattern or the corresponding area of the other substrate. Then, the substrates are stacked on top of each other under vacuum, and the frame-shaped seal pattern is irradiated with light such as ultraviolet rays for temporary curing. Afterwards, it is heated for formal curing, thereby manufacturing a liquid crystal display panel.
近年來,隨著液晶顯示面板的窄邊框化,亦要求密封材的窄線寬化。因此,對密封材要求:即便窄寬化,亦具有與先前同等以上的和基板的黏接性及耐濕性,即高度兼顧黏接強度與低透濕性。In recent years, as the bezels of liquid crystal display panels have become narrower, the line width of sealants has also been required to be narrower. Therefore, sealants are required to have better adhesion and moisture resistance to the substrate than before, even if the width is narrower, that is, to have a high balance between adhesion strength and low moisture permeability.
作為提高密封材的低透濕性的方法,已知有一種調配滑石或氧化鋁等無機填充劑的方法。例如,在專利文獻1中提出了一種包含硬化性樹脂、自由基聚合起始劑或熱硬化劑、以及氧化鋁的液晶顯示元件用密封劑。另外,在專利文獻2中提出了一種包含硬化性樹脂、自由基聚合起始劑或熱硬化劑、以及縱橫比為2以上的氧化鋁或滑石的液晶顯示元件用密封劑。 [現有技術文獻] [專利文獻] As a method for improving the low moisture permeability of a sealing material, a method of mixing an inorganic filler such as talc or alumina is known. For example, Patent Document 1 proposes a sealant for a liquid crystal display element comprising a curable resin, a radical polymerization initiator or a thermosetting agent, and alumina. In addition, Patent Document 2 proposes a sealant for a liquid crystal display element comprising a curable resin, a radical polymerization initiator or a thermosetting agent, and alumina or talc having an aspect ratio of 2 or more. [Prior Art Document] [Patent Document]
[專利文獻1]日本專利特開2016-218447號公報 [專利文獻2]日本專利特開2013-214056號公報 [Patent document 1] Japanese Patent Publication No. 2016-218447 [Patent document 2] Japanese Patent Publication No. 2013-214056
[發明所欲解決之課題][The problem that the invention wants to solve]
然而,在調配無機填充劑的方法中,關於所獲得的密封材,低透濕性變得良好,但其柔軟性受損,因此存在黏接強度容易降低的課題。如此,黏接強度與低透濕性通常處於權衡關係,在現有的液晶密封劑中,難以兼顧該些。However, in the method of mixing an inorganic filler, the obtained sealant has good low moisture permeability, but its flexibility is impaired, so there is a problem that the adhesive strength is easily reduced. As such, the adhesive strength and low moisture permeability are usually in a trade-off relationship, and it is difficult to take both into account in the existing liquid crystal sealants.
本發明是鑒於所述課題而成,其目的在於提供一種能夠製作具有黏接強度及低透濕性的密封材的液晶密封劑以及使用其的液晶顯示面板及其製造方法。 [解決課題之手段] The present invention is made in view of the above-mentioned problem, and its purpose is to provide a liquid crystal sealant capable of producing a sealant with strong adhesive strength and low moisture permeability, as well as a liquid crystal display panel using the same and a method for manufacturing the same. [Means for solving the problem]
本發明提供一種液晶密封劑,其包含硬化性化合物及硬化劑,所述硬化性化合物包含下述通式(1)所表示的環化聚合性化合物。 [化1] (在通式(1)中,R 1表示氫原子或碳數1以上且30以下的烴基,R 2及R 3分別獨立地表示碳數1以上且4以下的烴基,X表示單鍵、-O-、-S-或NR 4(R 4為氫原子或碳數1以上且4以下的烴基)) The present invention provides a liquid crystal sealant, comprising a curable compound and a curing agent, wherein the curable compound comprises a cyclopolymerizable compound represented by the following general formula (1). (In the general formula (1), R1 represents a hydrogen atom or a alkyl group having 1 to 30 carbon atoms, R2 and R3 each independently represent a alkyl group having 1 to 4 carbon atoms, and X represents a single bond, -O-, -S-, or NR4 ( R4 is a hydrogen atom or a alkyl group having 1 to 4 carbon atoms))
本發明進而提供一種液晶顯示面板,其具有:一對基板;液晶層,夾入至所述一對基板間;以及框狀的密封材,配置於所述一對基板間,用於對所述液晶層進行密封,所述密封材為如上述所記載的液晶密封劑的硬化物。The present invention further provides a liquid crystal display panel, which has: a pair of substrates; a liquid crystal layer sandwiched between the pair of substrates; and a frame-shaped sealing material arranged between the pair of substrates and used to seal the liquid crystal layer, wherein the sealing material is a cured product of the liquid crystal sealant described above.
本發明進而提供一種液晶顯示面板的製造方法,其包含如下步驟:準備一對基板;在其中一個基板上塗佈上述記載的液晶密封劑,形成框狀密封圖案;在所述框狀密封圖案的外側塗佈虛設密封劑,形成虛設密封圖案;在所述框狀密封圖案及所述虛設密封圖案未硬化的狀態下,向所述框狀密封圖案的內側及/或另一個基板上滴加液晶材料;在減壓環境下,使所述一對基板經由所述液晶材料重疊;以及使所述框狀密封圖案及所述虛設密封圖案硬化。 [發明的效果] The present invention further provides a method for manufacturing a liquid crystal display panel, which comprises the following steps: preparing a pair of substrates; applying the above-described liquid crystal sealant on one of the substrates to form a frame-shaped seal pattern; applying a dummy sealant on the outer side of the frame-shaped seal pattern to form a dummy seal pattern; dripping a liquid crystal material onto the inner side of the frame-shaped seal pattern and/or onto another substrate when the frame-shaped seal pattern and the dummy seal pattern are not hardened; overlapping the pair of substrates via the liquid crystal material in a reduced pressure environment; and hardening the frame-shaped seal pattern and the dummy seal pattern. [Effects of the invention]
藉由本發明的液晶密封劑,能夠製作具有黏接強度及低透濕性的密封材。The liquid crystal sealant of the present invention can produce a sealant having strong adhesive strength and low moisture permeability.
在本說明書中,使用「~」表示的數值範圍是指包含於「~」的前後記載的數值作為下限值及上限值的範圍。In this specification, a numerical range expressed using "to" means a range including the numerical values described before and after "to" as the lower limit and the upper limit.
1.液晶密封劑 本發明的液晶密封劑只要包含硬化性樹脂、以及用於使該硬化性樹脂硬化的硬化劑即可,根據需要亦可更包含填料或矽烷偶合劑等。 1. Liquid crystal sealant The liquid crystal sealant of the present invention only needs to include a curable resin and a curing agent for curing the curable resin, and may further include a filler or a silane coupling agent, etc., as needed.
如上所述,關於現有的液晶密封劑,在硬化後的密封材中,難以兼顧高黏接強度與低透濕性。相對於此,根據本發明者等人的努力研究,明確了藉由在液晶密封劑中包含具有特定的結構的環化聚合性化合物,能夠實現高黏接強度與低透濕性。關於該環化聚合性化合物的結構,將在後文詳細說明,當對該環化聚合性化合物進行聚合時,形成多個脂環式結構利用乙烯鏈連結而成的結構。根據此種聚合物,藉由剛性的脂環式結構,能夠抑制水分向密封材內的侵入。另一方面,在該聚合物中,藉由乙烯鏈發揮出適度的柔軟性。因此,當對液晶顯示面板施加外力時,能夠使密封材追隨於基板而發生變形,基板與密封材之間的黏接強度變得非常高。 以下,對本發明的液晶密封劑所包含的各成分進行詳細說明。 As described above, it is difficult to achieve both high adhesive strength and low moisture permeability in the existing liquid crystal sealant after curing. In contrast, according to the diligent research of the inventors and others, it is clear that high adhesive strength and low moisture permeability can be achieved by including a cyclic polymerizable compound with a specific structure in the liquid crystal sealant. The structure of the cyclic polymerizable compound will be described in detail later. When the cyclic polymerizable compound is polymerized, a structure is formed in which multiple alicyclic structures are connected by ethylene chains. According to this polymer, the rigid alicyclic structure can inhibit the intrusion of moisture into the sealant. On the other hand, in the polymer, appropriate flexibility is exerted by the ethylene chain. Therefore, when an external force is applied to the liquid crystal display panel, the sealant can follow the substrate and deform, and the bonding strength between the substrate and the sealant becomes very high. Below, each component contained in the liquid crystal sealant of the present invention is described in detail.
1-1.硬化性化合物 在本說明書中,所謂硬化性化合物,是指藉由熱或光等能量而聚合並硬化的化合物。該硬化性化合物只要至少包含下述的環化聚合性化合物即可,較佳為更包含該環化聚合性化合物以及後述的環氧系化合物或(甲基)丙烯酸系化合物、(甲基)丙烯酸改質環氧化合物等。 1-1. Curable compound In this specification, the so-called curable compound refers to a compound that polymerizes and cures by energy such as heat or light. The curable compound only needs to contain at least the following cyclic polymerizable compound, and preferably further contains the cyclic polymerizable compound and the epoxy compound or (meth) acrylic compound, (meth) acrylic modified epoxy compound, etc. described later.
(1)環化聚合性化合物 如上所述,硬化性化合物包含具有下述通式(1)所表示的結構的環化聚合性化合物。硬化性化合物可僅包含一種該環化聚合性化合物,亦可包含兩種以上。再者,該環化聚合性化合物藉由該些的聚合而成為具有下述通式(2)所表示的重複單元的聚合物。 [化2] 在通式(1)及通式(2)中,R 1表示氫原子或碳數1以上且30以下的烴基。烴基的碳數更佳為1以上且4以下。 (1) Cyclic polymerizable compound As described above, the curable compound includes a cyclic polymerizable compound having a structure represented by the following general formula (1). The curable compound may include only one type of the cyclic polymerizable compound, or may include two or more types. Furthermore, the cyclic polymerizable compound is converted into a polymer having a repeating unit represented by the following general formula (2) by polymerization. [Chemistry 2] In the general formula (1) and the general formula (2), R1 represents a hydrogen atom or a alkyl group having 1 to 30 carbon atoms. The alkyl group preferably has 1 to 4 carbon atoms.
作為R 1所表示的基的具體例,包含:氫原子;甲基、乙基、正丙基、異丙基、正丁基、第二丁基、第三丁基、正戊基、第二戊基、第三戊基、正己基、第二己基、正庚基、正辛基、第二辛基、第三辛基、2-乙基己基、癸醯基、壬基、癸基、十一基、十二基、十三基、十四基、十五基、十六基、十七基、十八基、十九基、二十基、二十六基、三十基等鏈狀飽和烴基; 甲氧基乙基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、3-甲氧基丁基、乙氧基乙基、乙氧基乙氧基乙基、苯氧基乙基、苯氧基乙氧基乙基等鏈狀飽和烴基的氫原子的一部分經烷氧基取代而成的烷氧基取代鏈狀飽和烴基; 羥乙基、羥丙基、羥丁基等鏈狀飽和烴基的氫原子的一部分經羥基取代而成的羥基取代鏈狀飽和烴基; 氟乙基、二氟乙基、氯乙基、二氯乙基、溴乙基、二溴乙基等鏈狀飽和烴基的氫原子的一部分經鹵素取代而成的鹵素取代鏈狀飽和烴基; 乙烯基、烯丙基、甲基烯丙基、巴豆基、炔丙基等鏈狀不飽和烴基、及其氫原子的一部分經烷氧基、羥基或鹵素取代而成的鏈狀不飽和烴基; 環戊基、環己基、4-甲基環己基、4-第三丁基環己基、三環癸基、異冰片基、金剛烷基、二環戊二烯基等脂環式烴基、及其氫原子的一部分經烷氧基、羥基或鹵素取代而成的脂環式烴基; 苯基、甲基苯基、二甲基苯基、三甲基苯基、4-第三丁基苯基、苄基、二苯基甲基、二苯基乙基、三苯基甲基、肉桂基、萘基、蒽基等芳香族烴基、及其氫原子的一部分經烷氧基、羥基或鹵素取代而成的芳香族烴基;等。 Specific examples of the group represented by R1 include: a hydrogen atom; a chain saturated alkyl group such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a t-butyl group, an n-pentyl group, a sec-pentyl group, a t-pentyl group, an n-hexyl group, a sec-hexyl group, an n-heptyl group, an n-octyl group, a sec-octyl group, a t-octyl group, a 2-ethylhexyl group, a decyl group, a nonyl group, a decyl group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecanyl group, an octadecyl group, a nonadecanyl group, an eicosyl group, a hexadecyl group, a triacontanyl group, etc.; an alkoxy-substituted chain saturated alkyl group in which a part of the hydrogen atoms of a chain saturated alkyl group such as a methoxyethyl group, a methoxyethoxyethyl group, a methoxyethoxyethoxyethyl group, a 3-methoxybutyl group, an ethoxyethyl group, an ethoxyethoxyethyl group, a phenoxyethyl group, a phenoxyethoxyethyl group, etc. are substituted with an alkoxy group; A hydroxy-substituted chain saturated alkyl group obtained by replacing a part of the hydrogen atoms of a chain saturated alkyl group such as hydroxyethyl, hydroxypropyl, hydroxybutyl with a hydroxy group; A halogen-substituted chain saturated alkyl group obtained by replacing a part of the hydrogen atoms of a chain saturated alkyl group such as fluoroethyl, difluoroethyl, chloroethyl, dichloroethyl, bromoethyl, dibromoethyl with a halogen; A chain unsaturated alkyl group such as vinyl, allyl, methallyl, crotyl, propargyl, and a chain unsaturated alkyl group obtained by replacing a part of the hydrogen atoms of the chain unsaturated alkyl group with an alkoxy group, a hydroxyl group or a halogen; Alicyclic hydrocarbon groups such as cyclopentyl, cyclohexyl, 4-methylcyclohexyl, 4-t-butylcyclohexyl, tricyclodecyl, isobornyl, adamantyl, dicyclopentadienyl, and alicyclic hydrocarbon groups in which a part of hydrogen atoms thereof are substituted with an alkoxy group, a hydroxyl group, or a halogen; Aromatic hydrocarbon groups such as phenyl, methylphenyl, dimethylphenyl, trimethylphenyl, 4-t-butylphenyl, benzyl, diphenylmethyl, diphenylethyl, triphenylmethyl, cinnamyl, naphthyl, anthracenyl, and alicyclic hydrocarbon groups in which a part of hydrogen atoms thereof are substituted with an alkoxy group, a hydroxyl group, or a halogen; etc.
該些中,較佳為氫原子或鏈狀飽和烴基,就在環化聚合性化合物的聚合時不易產生位阻的觀點而言,較佳為氫原子或甲基。Among these, a hydrogen atom or a chain saturated hydrocarbon group is preferred, and a hydrogen atom or a methyl group is preferred from the viewpoint of being less likely to cause steric hindrance during polymerization of the cyclopolymerizable compound.
另外,所述通式(1)及通式(2)中的R 2及R 3分別獨立地表示碳數1以上且4以下的烴基,較佳為碳數1以上且2以下的烴基,特佳為碳數1、即亞甲基。再者,R 2及R 3可彼此相同,亦可不同。 In the general formula (1) and the general formula (2), R2 and R3 each independently represent a alkyl group having 1 to 4 carbon atoms, preferably a alkyl group having 1 to 2 carbon atoms, and particularly preferably a alkyl group having 1 carbon atoms, i.e., a methylene group. R2 and R3 may be the same or different from each other.
進而,所述通式(1)及通式(2)中的X表示單鍵、-O-、-S-、或NR 4(R 4為氫原子、或碳數1以上且4以下的烴基)。在X為單鍵的情況下,該環化聚合性化合物進行聚合時形成的環成為脂肪族烴環。另一方面,在X為-O-、-S-或NR 4的情況下,該環化聚合性化合物進行聚合而形成的環成為脂環式雜環結構。X在所述中較佳為-O-或-S-,特佳為-O-。若X為-O-,則環化聚合性化合物的聚合物、進而密封材更容易表現出柔軟性。另外,藉由該O原子與基板表面的基進行氫鍵結等,密封材的強度更容易提高。 Furthermore, X in the general formula (1) and the general formula (2) represents a single bond, -O-, -S-, or NR4 ( R4 is a hydrogen atom, or a alkyl group having 1 to 4 carbon atoms). When X is a single bond, the ring formed when the cyclopolymerizable compound is polymerized becomes an aliphatic hydrocarbon ring. On the other hand, when X is -O-, -S-, or NR4 , the ring formed when the cyclopolymerizable compound is polymerized becomes an alicyclic heterocyclic structure. Among the above, X is preferably -O- or -S-, and particularly preferably -O-. If X is -O-, the polymer of the cyclopolymerizable compound and thus the sealing material are more likely to show flexibility. In addition, the strength of the sealing material is more likely to be improved by hydrogen bonding between the O atom and the base on the surface of the substrate.
所述通式(1)所表示的環化聚合性化合物的具體例中包含:α-烯丙氧基甲基丙烯酸、α-烯丙氧基甲基丙烯酸甲酯、α-烯丙氧基甲基丙烯酸乙酯、α-烯丙氧基甲基丙烯酸正丙酯、α-烯丙氧基甲基丙烯酸異丙酯、α-烯丙氧基甲基丙烯酸正丁酯、α-烯丙氧基甲基丙烯酸第二丁酯、α-烯丙氧基甲基丙烯酸第三丁酯、α-烯丙氧基甲基丙烯酸正戊酯、α-烯丙氧基甲基丙烯酸第二戊酯、α-烯丙氧基甲基丙烯酸第三戊酯、α-烯丙氧基甲基丙烯酸正己酯、α-烯丙氧基甲基丙烯酸第二己酯、α-烯丙氧基甲基丙烯酸正庚酯、α-烯丙氧基甲基丙烯酸正辛酯、α-烯丙氧基甲基丙烯酸第二辛酯、α-烯丙氧基甲基丙烯酸第三辛酯、α-烯丙氧基甲基丙烯酸2-乙基己酯、α-烯丙氧基甲基丙烯酸癸醯酯、α-烯丙氧基甲基丙烯酸壬酯、α-烯丙氧基甲基丙烯酸癸酯、α-烯丙氧基甲基丙烯酸十一基酯、α-烯丙氧基甲基丙烯酸十二基酯、α-烯丙氧基甲基丙烯酸十三基酯、α-烯丙氧基甲基丙烯酸十四基酯、α-烯丙氧基甲基丙烯酸十五基酯、α-烯丙氧基甲基丙烯酸十六基酯、α-烯丙氧基甲基丙烯酸十七基酯、α-烯丙氧基甲基丙烯酸十八基酯、α-烯丙氧基甲基丙烯酸十九基酯、α-烯丙氧基甲基丙烯酸二十基酯、α-烯丙氧基甲基丙烯酸二十六基酯、α-烯丙氧基甲基丙烯酸三十基酯、α-烯丙氧基甲基丙烯酸甲氧基乙酯、α-烯丙氧基甲基丙烯酸甲氧基乙氧基乙酯、α-烯丙氧基甲基丙烯酸甲氧基乙氧基乙氧基乙酯、α-烯丙氧基甲基丙烯酸3-甲氧基丁酯、α-烯丙氧基甲基丙烯酸乙氧基乙酯、α-烯丙氧基甲基丙烯酸乙氧基乙氧基乙酯、α-烯丙氧基甲基丙烯酸苯氧基乙酯、α-烯丙氧基甲基丙烯酸苯氧基乙氧基乙酯、α-烯丙氧基甲基丙烯酸羥乙酯、α-烯丙氧基甲基丙烯酸羥丙酯、α-烯丙氧基甲基丙烯酸羥丁酯、α-烯丙氧基甲基丙烯酸氟乙酯、α-烯丙氧基甲基丙烯酸二氟乙酯、α-烯丙氧基甲基丙烯酸氯乙酯、α-烯丙氧基甲基丙烯酸二氯乙酯、α-烯丙氧基甲基丙烯酸溴乙酯、α-烯丙氧基甲基丙烯酸二溴乙酯、α-烯丙氧基甲基丙烯酸乙烯酯、α-烯丙氧基甲基丙烯酸烯丙酯、α-烯丙氧基甲基丙烯酸甲基烯丙酯、α-烯丙氧基甲基丙烯酸巴豆酯、α-烯丙氧基甲基丙烯酸炔丙酯、α-烯丙氧基甲基丙烯酸環戊酯、α-烯丙氧基甲基丙烯酸環己酯、α-烯丙氧基甲基丙烯酸4-甲基環己酯、α-烯丙氧基甲基丙烯酸4-第三丁基環己酯、α-烯丙氧基甲基丙烯酸三環癸酯、α-烯丙氧基甲基丙烯酸異冰片酯、α-烯丙氧基甲基丙烯酸金剛烷基酯、α-烯丙氧基甲基丙烯酸二環戊二烯酯、α-烯丙氧基甲基丙烯酸苯酯、α-烯丙氧基甲基丙烯酸甲基苯酯、α-烯丙氧基甲基丙烯酸二甲基苯酯、α-烯丙氧基甲基丙烯酸三甲基苯酯、α-烯丙氧基甲基丙烯酸4-第三丁基苯酯、α-烯丙氧基甲基丙烯酸苄酯、α-烯丙氧基甲基丙烯酸二苯基甲酯、α-烯丙氧基甲基丙烯酸二苯基乙酯、α-烯丙氧基甲基丙烯酸三苯基甲酯、α-烯丙氧基甲基丙烯酸肉桂酯、α-烯丙氧基甲基丙烯酸萘酯、α-烯丙氧基甲基丙烯酸蒽酯等。Specific examples of the cyclopolymerizable compound represented by the general formula (1) include α-allyloxymethacrylic acid, methyl α-allyloxymethacrylic acid, ethyl α-allyloxymethacrylic acid, n-propyl α-allyloxymethacrylic acid, isopropyl α-allyloxymethacrylic acid, n-butyl α-allyloxymethacrylic acid, sec-butyl α-allyloxymethacrylic acid, t-butyl α-allyloxymethacrylic acid, n-pentyl α-allyloxymethacrylic acid, sec-pentyl α-allyloxymethacrylic acid, t-pentyl α-allyloxymethacrylic acid, n-hexyl α-allyloxymethacrylic acid, sec-hexyl α-allyloxymethacrylic acid, n-heptyl α-allyloxymethacrylic acid, n-octyl α-allyloxymethacrylic acid, sec-octyl α-allyloxymethacrylic acid, t-octyl α-allyloxymethacrylic acid, 2-ethylhexyl α-allyloxymethacrylic acid, α-allyloxymethacrylate decyl ester, α-allyloxymethacrylate nonyl ester, α-allyloxymethacrylate decyl ester, α-allyloxymethacrylate undecyl ester, α-allyloxymethacrylate dodecyl ester, α-allyloxymethacrylate tridecyl ester, α-allyloxymethacrylate tetradecyl ester, α-allyloxymethacrylate pentadecyl ester, α-allyloxymethacrylate hexadecyl ester, α-allyloxymethacrylate heptadecanyl ester, α-allyloxymethacrylate octadecyl ester, α-allyloxymethacrylate nonadecanyl ester, α-allyloxymethacrylate hexadecyl ester, α-allyloxymethacrylate tridecyl ester, α-allyloxymethacrylate methoxyethyl ester, α-allyloxymethacrylate methoxyethoxyethyl ester, α-allyloxymethacrylate methoxyethoxyethoxyethyl ester, α-allyloxymethacrylate 3-methoxybutyl ester, α-allyloxymethacrylate -allyloxy methacrylate ethoxyethyl, α-allyloxy methacrylate ethoxyethoxyethyl, α-allyloxy methacrylate phenoxyethyl, α-allyloxy methacrylate phenoxyethoxyethyl, α-allyloxy methacrylate hydroxyethyl, α-allyloxy methacrylate hydroxypropyl, α-allyloxy methacrylate hydroxybutyl, α-allyloxy methacrylate fluoroethyl, α-allyloxy methacrylate difluoroethyl, α-allyloxy methacrylate chloroethyl, α-allyloxy methacrylate dichloroethyl, α-allyloxy methacrylate bromoethyl, α-allyloxy methacrylate dibromoethyl, α-allyloxy methacrylate vinyl, α-allyloxy methacrylate allyl, α-allyloxy methacrylate methylallyl, α-allyloxy methacrylate crotonyl, α-allyloxy methacrylate propargyl, α-allyloxy methacrylate cyclopentyl, α-allyloxy Cyclohexyl methacrylate, 4-methylcyclohexyl α-allyloxymethacrylate, 4-tert-butylcyclohexyl α-allyloxymethacrylate, tricyclodecyl α-allyloxymethacrylate, isobornyl α-allyloxymethacrylate, adamantyl α-allyloxymethacrylate, dicyclopentadienyl α-allyloxymethacrylate, phenyl α-allyloxymethacrylate, methyl phenyl α-allyloxymethacrylate, dimethylphenyl α-allyloxymethacrylate, trimethylphenyl α-allyloxymethacrylate, 4-tert-butylphenyl α-allyloxymethacrylate, benzyl α-allyloxymethacrylate, diphenylmethyl α-allyloxymethacrylate, diphenylethyl α-allyloxymethacrylate, triphenylmethyl α-allyloxymethacrylate, cinnamyl α-allyloxymethacrylate, naphthyl α-allyloxymethacrylate, anthracene α-allyloxymethacrylate, and the like.
所述中,較佳為α-烯丙氧基甲基丙烯酸。Among the above, α-allyloxymethylacrylic acid is preferred.
相對於硬化性化合物的總量,所述環化聚合性化合物的量較佳為1質量%以上且30質量%以下,更佳為5質量%以上且27質量%以下,進而佳為10質量%以上且20質量%以下。若液晶密封劑的黏度過低,則當在一對基板之間夾入未硬化的液晶密封劑(框狀密封圖案)及液晶材料進行貼合時,液晶材料容易進入由液晶密封劑形成的框狀密封圖案內(在本說明書中,亦將該現象稱為「內衝」)。相對於此,若相對於硬化性化合物的總量,環化聚合性化合物的量為30質量%以下,則液晶密封劑的黏度更容易收斂於所期望的範圍內,在製造液晶顯示面板時,不易產生所述內衝。另一方面,若相對於硬化性化合物的總量,環化聚合性化合物的量為1質量%以上,則所獲得的密封材的黏接強度更容易提高,更容易實現低透濕性。The amount of the cyclized polymerizable compound relative to the total amount of the curable compound is preferably 1 mass % or more and 30 mass % or less, more preferably 5 mass % or more and 27 mass % or less, and further preferably 10 mass % or more and 20 mass % or less. If the viscosity of the liquid crystal sealant is too low, when the uncured liquid crystal sealant (frame-shaped sealing pattern) and the liquid crystal material are sandwiched between a pair of substrates for bonding, the liquid crystal material is likely to enter the frame-shaped sealing pattern formed by the liquid crystal sealant (this phenomenon is also referred to as "inward rush" in this specification). In contrast, if the amount of the cyclized polymerizable compound is 30 mass % or less relative to the total amount of the curable compound, the viscosity of the liquid crystal sealant is more easily converged within the desired range, and the inward rush is less likely to occur when manufacturing a liquid crystal display panel. On the other hand, when the amount of the cyclopolymerizable compound is 1 mass % or more relative to the total amount of the curable compound, the adhesive strength of the obtained sealing material is more likely to be improved and low moisture permeability can be more easily achieved.
另外,在液晶密封劑包含後述的填料的情況下,相對於填料的總量,環化聚合性材料的量較佳為3質量%以上且300質量%以下,更佳為25質量%以上且200質量%以下,進而佳為50質量%以上且150質量%以下。若環化聚合性化合物相對於填料的比例為該範圍,則液晶密封劑的黏度更容易收斂於所期望的範圍內,液晶密封劑的塗佈性更容易變得良好。In addition, when the liquid crystal sealant contains a filler described later, the amount of the cyclopolymerizable material relative to the total amount of the filler is preferably 3 mass % or more and 300 mass % or less, more preferably 25 mass % or more and 200 mass % or less, and further preferably 50 mass % or more and 150 mass % or less. When the ratio of the cyclopolymerizable compound relative to the filler is within this range, the viscosity of the liquid crystal sealant is more likely to converge within a desired range, and the coating property of the liquid crystal sealant is more likely to become good.
(2)其他硬化性化合物 硬化性化合物所包含的、所述環化聚合性化合物以外的硬化性化合物的例子中包含在分子內具有一個以上的環氧基的環氧系化合物、在分子內具有一個以上的(甲基)丙烯醯基的(甲基)丙烯酸系化合物、以及在分子內具有(甲基)丙烯醯基及環氧基的(甲基)丙烯酸改質環氧化合物。再者,在本說明書中,所謂(甲基)丙烯醯基,表示甲基丙烯醯基、丙烯醯基以及該些兩者。另外,所謂(甲基)丙烯酸,表示甲基丙烯酸、丙烯酸以及該些兩者,所謂(甲基)丙烯酸酯,表示甲基丙烯酸酯、丙烯酸酯以及該些兩者。 (2) Other curable compounds Examples of curable compounds other than the above-mentioned cyclic polymerizable compounds included in the curable compound include epoxy compounds having one or more epoxy groups in the molecule, (meth)acrylic acid compounds having one or more (meth)acrylic acid groups in the molecule, and (meth)acrylic acid-modified epoxy compounds having (meth)acrylic acid groups and epoxy groups in the molecule. In addition, in this specification, the so-called (meth)acrylic acid group means methacrylic acid, acryl group, and both of these. In addition, the so-called (meth)acrylic acid means methacrylic acid, acrylic acid, and both of these, and the so-called (meth)acrylate means methacrylate, acrylate, and both of these.
·環氧系化合物 在本說明書中,環氧系化合物是指在分子內具有一個以上的環氧基的化合物。但是,在本說明書中,環氧化合物中不包含具有環氧基及(甲基)丙烯醯基的化合物。硬化性化合物可僅包含一種環氧系化合物,亦可包含兩種以上。 ·Epoxy compounds In this specification, epoxy compounds refer to compounds having one or more epoxy groups in the molecule. However, in this specification, epoxy compounds do not include compounds having epoxy groups and (meth)acryloyl groups. The curable compound may include only one epoxy compound or two or more.
另外,環氧系化合物在一分子內包含的環氧基的數量可為一個,亦可為兩個以上。若硬化性化合物包含環氧系化合物,則液晶密封劑的熱硬化性容易變得良好。環氧系化合物的例子中包含公知的環氧系化合物,例如芳香族環氧化合物、脂肪族環氧化合物、脂環式環氧化合物。該些中,就容易實現所獲得的密封材的低透濕性的觀點而言,較佳為芳香族環氧化合物。In addition, the number of epoxy groups contained in one molecule of the epoxy compound may be one or more. If the curable compound contains an epoxy compound, the thermosetting property of the liquid crystal sealant tends to be good. Examples of epoxy compounds include well-known epoxy compounds, such as aromatic epoxy compounds, aliphatic epoxy compounds, and alicyclic epoxy compounds. Among these, aromatic epoxy compounds are preferred from the viewpoint of easily achieving low moisture permeability of the obtained sealant.
芳香族環氧化合物的例子中包含藉由雙酚A、雙酚S、雙酚F、雙酚AD等所代表的芳香族二醇類或利用乙二醇、丙二醇、烷二醇等對該些芳香族二醇進行改質而成的二醇類,與表氯醇的反應而獲得的芳香族多元縮水甘油醚化合物;藉由由苯酚或甲酚與甲醛衍生的酚醛清漆樹脂、聚烯基苯酚或其共聚物等所代表的多酚類,與表氯醇的反應而獲得的酚醛清漆型多元縮水甘油醚化合物;伸二甲苯基苯酚樹脂的縮水甘油醚化合物類等。Examples of aromatic epoxy compounds include aromatic polyglycidyl ether compounds obtained by reacting aromatic diols represented by bisphenol A, bisphenol S, bisphenol F, bisphenol AD, etc., or diols obtained by modifying these aromatic diols using ethylene glycol, propylene glycol, alkane diol, etc., with epichlorohydrin; novolac-type polyglycidyl ether compounds obtained by reacting polyphenols represented by novolac resins derived from phenol or cresol and formaldehyde, polyalkenylphenols, or copolymers thereof, with epichlorohydrin; glycidyl ether compounds of xylylphenol resins, etc.
其中,較佳為甲酚酚醛清漆型環氧化合物、苯酚酚醛清漆型環氧化合物、雙酚A型環氧化合物、雙酚F型環氧化合物、三苯酚甲烷型環氧化合物、三苯酚乙烷型環氧化合物、三苯酚型環氧化合物、二環戊二烯型環氧化合物、二苯基醚型環氧化合物或聯苯型環氧化合物。Among them, the preferred ones are cresol novolac type epoxy compounds, phenol novolac type epoxy compounds, bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, trisphenol methane type epoxy compounds, trisphenol ethane type epoxy compounds, trisphenol type epoxy compounds, dicyclopentadiene type epoxy compounds, diphenyl ether type epoxy compounds or biphenyl type epoxy compounds.
此處,環氧系化合物可為液狀,亦可為固體狀。就容易實現密封材的低透濕性的觀點而言,較佳為固體狀的環氧系化合物。固體狀的環氧系化合物的軟化點較佳為40℃以上且150℃以下。軟化點可藉由日本工業標準(Japanese Industrial Standard,JIS)K7234所規定的環球法進行測定。Here, the epoxy compound may be in liquid or solid form. From the viewpoint of easily achieving low moisture permeability of the sealing material, a solid epoxy compound is preferred. The softening point of the solid epoxy compound is preferably 40° C. or higher and 150° C. or lower. The softening point can be measured by the cyclotron method specified in Japanese Industrial Standard (JIS) K7234.
另外,環氧系化合物的重量平均分子量較佳為500~10000,更佳為1000~5000。環氧系化合物的重量平均分子量藉由凝膠滲透層析法(Gel Permeation Chromatography,GPC)並以聚苯乙烯換算來進行測定。The weight average molecular weight of the epoxy compound is preferably 500 to 10000, more preferably 1000 to 5000. The weight average molecular weight of the epoxy compound is measured by gel permeation chromatography (GPC) in terms of polystyrene.
相對於硬化性化合物的總量,環氧系化合物的總量較佳為5質量%以上且60質量%以下,更佳為10質量%以上且40質量%以下。若環氧系化合物的量為5質量%以上,則密封材的透濕性容易進一步降低。另一方面,若環氧系化合物的量為60質量%以下,則所述環化聚合性化合物等的量相對變多,所獲得的密封材的光聚合性容易進一步提高,或者黏接強度等容易進一步提高。The total amount of the epoxy compound is preferably 5% by mass or more and 60% by mass or less, and more preferably 10% by mass or more and 40% by mass or less, relative to the total amount of the curable compound. If the amount of the epoxy compound is 5% by mass or more, the moisture permeability of the sealant is likely to be further reduced. On the other hand, if the amount of the epoxy compound is 60% by mass or less, the amount of the cyclic polymerizable compound is relatively large, and the photopolymerizability of the obtained sealant is likely to be further improved, or the adhesive strength is likely to be further improved.
·(甲基)丙烯酸系化合物 在本說明書中,(甲基)丙烯酸系化合物設為在分子內具有一個以上的(甲基)丙烯醯基的化合物。但是,在本說明書中,(甲基)丙烯酸系化合物中不包含所述環化聚合性化合物或具有(甲基)丙烯醯基及環氧基的化合物。硬化性化合物可僅包含一種(甲基)丙烯酸系化合物,亦可包含兩種以上。 ·(Meth)acrylic compounds In this specification, (meth)acrylic compounds are compounds having one or more (meth)acrylic groups in the molecule. However, in this specification, (meth)acrylic compounds do not include the above-mentioned cyclic polymerizable compounds or compounds having (meth)acrylic groups and epoxy groups. The curable compound may include only one (meth)acrylic compound or two or more.
(甲基)丙烯酸系化合物在一分子內包含的(甲基)丙烯醯基的數量可為一個,亦可為兩個以上。在一分子內包含一個(甲基)丙烯醯基的(甲基)丙烯酸系化合物的例子中包含(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯及(甲基)丙烯酸2-羥乙酯等(甲基)丙烯酸烷基酯。The number of (meth)acrylic acid groups contained in one molecule of a (meth)acrylic acid compound may be one or more. Examples of (meth)acrylic acid compounds containing one (meth)acrylic acid group in one molecule include alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, and 2-hydroxyethyl (meth)acrylate.
在一分子內具有兩個以上的(甲基)丙烯醯基的(甲基)丙烯酸系化合物的例子中包含源自聚乙二醇、丙二醇、聚丙二醇等的二(甲基)丙烯酸酯;源自三(2-羥基乙基)異氰脲酸酯的二(甲基)丙烯酸酯;源自在1莫耳的新戊二醇中加成4莫耳以上的環氧乙烷或環氧丙烷而獲得的二醇的二(甲基)丙烯酸酯;源自在1莫耳的雙酚A或雙酚F中加成2莫耳的環氧乙烷或環氧丙烷而獲得的二醇的二(甲基)丙烯酸酯(雙酚A型或雙酚F型環氧基(甲基)丙烯酸酯);源自在1莫耳的三羥甲基丙烷中加成2莫耳或3莫耳的環氧乙烷或環氧丙烷而獲得的多元醇的二(甲基)丙烯酸酯或三(甲基)丙烯酸酯;源自在1莫耳的雙酚A中加成4莫耳以上的環氧乙烷或環氧丙烷而獲得的二醇的二(甲基)丙烯酸酯;三(2-羥基乙基)異氰脲酸酯三(甲基)丙烯酸酯;三羥甲基丙烷三(甲基)丙烯酸酯或其寡聚物;季戊四醇三(甲基)丙烯酸酯或其寡聚物;二季戊四醇的聚(甲基)丙烯酸酯;三(丙烯醯氧基乙基)異氰脲酸酯;己內酯改質三(丙烯醯氧基乙基)異氰脲酸酯;己內酯改質三(甲基丙烯醯氧基乙基)異氰脲酸酯;烷基改質二季戊四醇的聚(甲基)丙烯酸酯;己內酯改質二季戊四醇的聚(甲基)丙烯酸酯;羥基三甲基乙酸新戊二醇二(甲基)丙烯酸酯;己內酯改質羥基三甲基乙酸新戊二醇二(甲基)丙烯酸酯;環氧乙烷改質磷酸(甲基)丙烯酸酯;環氧乙烷改質烷基化磷酸(甲基)丙烯酸酯;以及新戊二醇、三羥甲基丙烷及季戊四醇的寡聚(甲基)丙烯酸酯等。其中,較佳為源自在1莫耳的雙酚A或雙酚F中加成2莫耳的環氧乙烷或環氧丙烷而獲得的二醇的二(甲基)丙烯酸酯(雙酚A型或雙酚F型環氧基(甲基)丙烯酸酯)。Examples of (meth)acrylic compounds having two or more (meth)acryloyl groups in one molecule include di(meth)acrylates derived from polyethylene glycol, propylene glycol, polypropylene glycol, etc.; di(meth)acrylates derived from tri(2-hydroxyethyl)isocyanurate; di(meth)acrylates derived from a diol obtained by adding 4 mol or more of ethylene oxide or propylene oxide to 1 mol of neopentyl glycol; di(meth)acrylates derived from 1 mol of bisphenol A or bisphenol F; di(meth)acrylate of a diol obtained by adding 2 mol of ethylene oxide or propylene oxide to 1 mol of trihydroxymethylpropane (bisphenol A type or bisphenol F type epoxy (meth)acrylate); di(meth)acrylate or tri(meth)acrylate of a polyol obtained by adding 2 or 3 mol of ethylene oxide or propylene oxide to 1 mol of trihydroxymethylpropane; di(meth)acrylate of a diol obtained by adding 4 or more mol of ethylene oxide or propylene oxide to 1 mol of bisphenol A; (Meth)acrylate; tri(2-hydroxyethyl) isocyanurate tri(meth)acrylate; trihydroxymethylpropane tri(meth)acrylate or its oligomer; pentaerythritol tri(meth)acrylate or its oligomer; poly(meth)acrylate of dipentaerythritol; tri(acryloxyethyl) isocyanurate; caprolactone-modified tri(acryloxyethyl) isocyanurate; caprolactone-modified tri(methacryloxyethyl) isocyanurate; alkyl-modified The present invention also includes poly (meth)acrylates of dipentaerythritol modified with caprolactone; poly (meth)acrylates of dipentaerythritol modified with caprolactone; hydroxytrimethylacetic acid neopentyl glycol di (meth)acrylate; caprolactone modified hydroxytrimethylacetic acid neopentyl glycol di (meth)acrylate; ethylene oxide modified phosphoric acid (meth)acrylate; ethylene oxide modified alkylated phosphoric acid (meth)acrylate; and oligomeric (meth)acrylates of neopentyl glycol, trihydroxymethylpropane and pentaerythritol. Among them, di (meth)acrylates of diols obtained by adding 2 mols of ethylene oxide or propylene oxide to 1 mol of bisphenol A or bisphenol F (bisphenol A type or bisphenol F type epoxy (meth)acrylates) are preferred.
(甲基)丙烯酸系化合物的藉由凝膠滲透層析法(GPC)測定的重量平均分子量較佳為200~10000,更佳為200~5000。The weight average molecular weight of the (meth)acrylic acid compound measured by gel permeation chromatography (GPC) is preferably 200 to 10,000, more preferably 200 to 5,000.
(甲基)丙烯酸系化合物的重量平均分子量較佳為310~1000左右。該重量平均分子量例如是藉由凝膠滲透層析法(GPC)以聚苯乙烯換算進行測定的值。The weight average molecular weight of the (meth)acrylic acid compound is preferably about 310 to 1000. The weight average molecular weight is, for example, a value measured by gel permeation chromatography (GPC) in terms of polystyrene.
此處,相對於硬化性化合物的總量,(甲基)丙烯酸系化合物的總量較佳為3質量%以上且60質量%以下,更佳為10質量%以上且40質量%以下。若(甲基)丙烯酸系化合物的總量為3質量%以上,則液晶密封劑的光硬化性容易變得良好。另一方面,若(甲基)丙烯酸系化合物的總量為60質量%以下,則相對地,所述環化聚合性化合物或環氧系化合物的量變得充分,所獲得的密封材的黏接強度或低透濕性更容易變得良好。Here, the total amount of the (meth)acrylic acid compound is preferably 3% by mass or more and 60% by mass or less, and more preferably 10% by mass or more and 40% by mass or less, relative to the total amount of the curable compound. If the total amount of the (meth)acrylic acid compound is 3% by mass or more, the light curing property of the liquid crystal sealant is likely to be good. On the other hand, if the total amount of the (meth)acrylic acid compound is 60% by mass or less, the amount of the cyclic polymerizable compound or the epoxy compound is relatively sufficient, and the adhesive strength or low moisture permeability of the obtained sealant is likely to be good.
·(甲基)丙烯酸改質環氧化合物 在本說明書中,(甲基)丙烯酸改質環氧化合物是指在分子內具有一個以上環氧基及一個以上(甲基)丙烯醯基的化合物。硬化性化合物可僅包含一種(甲基)丙烯酸改質環氧化合物,亦可包含兩種以上。 ·(Meth)acrylic acid modified epoxy compound In this specification, (meth)acrylic acid modified epoxy compound refers to a compound having one or more epoxy groups and one or more (meth)acrylic acid groups in the molecule. The curable compound may contain only one (meth)acrylic acid modified epoxy compound or may contain two or more.
(甲基)丙烯酸改質環氧化合物中的環氧基及(甲基)丙烯醯基的數量並無特別限制,可分別僅為一個,亦可為兩個以上。該(甲基)丙烯酸改質環氧化合物與所述環化聚合性化合物或所述環氧系化合物、所述丙烯酸系化合物均相容性良好。因此,若包含(甲基)丙烯酸改質環氧化合物作為硬化性化合物,則不同種類的硬化性化合物彼此的相容性變得非常良好。The number of epoxy groups and (meth)acrylic groups in the (meth)acrylic modified epoxy compound is not particularly limited, and each may be only one or two or more. The (meth)acrylic modified epoxy compound has good compatibility with the epoxide-polymerizable compound or the epoxy-based compound and the acrylic-based compound. Therefore, if the (meth)acrylic modified epoxy compound is included as a curable compound, the compatibility of different types of curable compounds becomes very good.
(甲基)丙烯酸改質環氧化合物是利用(甲基)丙烯醯基對二官能以上的環氧化合物所具有的環氧基中的至少一個環氧基進行改質而獲得。該(甲基)丙烯酸改質環氧化合物例如可使二官能以上的環氧化合物與(甲基)丙烯酸在鹼性觸媒的存在下進行反應而獲得。The (meth)acrylic acid-modified epoxy compound is obtained by modifying at least one of the epoxy groups of a difunctional or higher epoxy compound with a (meth)acrylic acid group. The (meth)acrylic acid-modified epoxy compound can be obtained, for example, by reacting a difunctional or higher epoxy compound with (meth)acrylic acid in the presence of an alkaline catalyst.
利用(甲基)丙烯醯基進行改質的環氧化合物只要是在分子內具有兩個以上的環氧基的多官能的環氧化合物即可,就抑制交聯密度過高而導致密封材的黏接強度過度降低的觀點而言,較佳為二官能的環氧化合物。二官能的環氧化合物的例子中包含雙酚型環氧化合物(雙酚A型、雙酚F型、2,2'-二烯丙基雙酚A型、雙酚AD型及氫化雙酚型等)、聯苯型環氧化合物及萘型環氧化合物。其中,就液晶密封劑的塗佈性容易變得良好的觀點而言,較佳為雙酚A型及雙酚F型的雙酚型環氧化合物。與源自聯苯基醚型環氧化合物的(甲基)丙烯酸改質環氧化合物相比,源自雙酚型環氧化合物的(甲基)丙烯酸改質環氧化合物具有塗佈性優異等優點。The epoxy compound modified with a (meth)acryloyl group may be a multifunctional epoxy compound having two or more epoxy groups in the molecule. From the viewpoint of suppressing excessive crosslinking density and excessive reduction in the adhesive strength of the sealant, a difunctional epoxy compound is preferred. Examples of difunctional epoxy compounds include bisphenol-type epoxy compounds (bisphenol A type, bisphenol F type, 2,2'-diallylbisphenol A type, bisphenol AD type, and hydrogenated bisphenol type, etc.), biphenyl-type epoxy compounds, and naphthalene-type epoxy compounds. Among them, from the viewpoint of improving the coating properties of the liquid crystal sealant, bisphenol-type epoxy compounds of bisphenol A type and bisphenol F type are preferred. Compared with the (meth)acrylic acid-modified epoxy compound derived from the biphenyl ether type epoxy compound, the (meth)acrylic acid-modified epoxy compound derived from the bisphenol type epoxy compound has advantages such as excellent coating properties.
(甲基)丙烯酸改質環氧化合物的(甲基)丙烯醯基的莫耳數相對於環氧基的莫耳數1的比率較佳為1以上,更佳為2以上。藉由提高(甲基)丙烯醯基的莫耳數的比率,容易抑制液晶密封劑向液晶的溶出。The ratio of the molar number of the (meth)acrylic group of the (meth)acrylic acid-modified epoxy compound to the molar number of the epoxy group is preferably 1 or more, more preferably 2 or more. By increasing the molar ratio of the (meth)acrylic group, elution of the liquid crystal sealant into the liquid crystal is easily suppressed.
(甲基)丙烯酸改質環氧化合物的藉由凝膠滲透層析法(GPC)測定的重量平均分子量較佳為300~500。The weight average molecular weight of the (meth)acrylic acid-modified epoxy compound measured by gel permeation chromatography (GPC) is preferably 300 to 500.
另外,相對於硬化性組成物的總量,(甲基)丙烯酸改質環氧化合物的量較佳為10質量%以上且80質量%以下,更佳為20質量%以上且60質量%以下。若(甲基)丙烯酸改質環氧化合物的量為10質量%以上,則容易提高所述環化聚合性化合物或丙烯酸系化合物與環氧系化合物的相容性。另一方面,若(甲基)丙烯酸改質環氧化合物的量為80質量%以下,則環化聚合性化合物等的量容易變得充分,在所獲得的密封材中,更容易實現低透濕性或高黏接強度。In addition, the amount of the (meth) acrylic acid modified epoxy compound is preferably 10% by mass or more and 80% by mass or less, and more preferably 20% by mass or more and 60% by mass or less, relative to the total amount of the curable composition. If the amount of the (meth) acrylic acid modified epoxy compound is 10% by mass or more, it is easy to improve the compatibility of the cyclic polymerizable compound or the acrylic compound with the epoxy compound. On the other hand, if the amount of the (meth) acrylic acid modified epoxy compound is 80% by mass or less, the amount of the cyclic polymerizable compound, etc., is easy to become sufficient, and it is easier to achieve low moisture permeability or high adhesive strength in the obtained sealing material.
·其他 硬化性化合物在不損害本發明的目的及效果的範圍內,亦可更包含所述說明以外的硬化性化合物。 此處,相對於液晶密封劑的總量,硬化性組成物的總量較佳為40質量%以上且90質量%以下,更佳為60質量%以上且80質量%以下。若硬化性組成物的總量為40質量%以上,則在液晶顯示面板中,藉由密封材容易抑制液晶的漏出。另一方面,若硬化性組成物的總量為90質量%以下,則後述的硬化劑等的量變得充分,容易使液晶密封劑的硬化性更良好,或者容易將液晶密封劑的黏度調整為所期望的範圍。 ·Others The curable compound may further include curable compounds other than those described above within the scope that does not impair the purpose and effect of the present invention. Here, the total amount of the curable composition is preferably 40% by mass or more and 90% by mass or less, and more preferably 60% by mass or more and 80% by mass or less relative to the total amount of the liquid crystal sealant. If the total amount of the curable composition is 40% by mass or more, the leakage of liquid crystal can be easily suppressed by the sealant in the liquid crystal display panel. On the other hand, if the total amount of the curable composition is 90% by mass or less, the amount of the curing agent described later becomes sufficient, and it is easy to make the curability of the liquid crystal sealant better, or it is easy to adjust the viscosity of the liquid crystal sealant to the desired range.
1-2.硬化劑 液晶密封劑包含硬化劑。該硬化劑的例子中包含用於使液晶密封劑熱硬化的熱硬化劑、以及用於使液晶密封劑光硬化的光聚合起始劑。 1-2. Hardener The liquid crystal sealant contains a hardener. Examples of the hardener include a thermosetting agent for thermally hardening the liquid crystal sealant and a photopolymerization initiator for photohardening the liquid crystal sealant.
(1)熱硬化劑 熱硬化劑只要是能夠使所述環氧系化合物或(甲基)丙烯酸改質環氧化合物熱硬化的材料,則並無特別限制,但熱硬化劑較佳為潛在性熱硬化劑。所謂潛在性熱硬化劑,是在通常的保存條件下(室溫、可見光線下等)不使環氧系化合物或(甲基)丙烯酸改質環氧化合物等硬化,但藉由加熱使該些化合物硬化的化合物。潛在性熱硬化劑較佳為能夠使所述硬化性化合物所具有的環氧基開環而硬化的硬化劑(以下,亦稱為「環氧硬化劑」)。 (1) Thermohardener Thermohardener is not particularly limited as long as it is a material that can thermally harden the epoxy compound or (meth)acrylic modified epoxy compound, but the thermohardener is preferably a latent thermohardener. The so-called latent thermohardener is a compound that does not harden epoxy compounds or (meth)acrylic modified epoxy compounds under normal storage conditions (room temperature, visible light, etc.), but hardens these compounds by heating. The latent thermohardener is preferably a hardener that can harden the epoxy group possessed by the curable compound by ring opening (hereinafter also referred to as "epoxy hardener").
就提高液晶密封劑的黏度穩定性、且不損害所獲得的密封材的耐濕性的觀點而言,環氧硬化劑的熔點較佳為50℃~250℃,更佳為100℃~200℃,進而佳為150℃~200℃。From the viewpoint of improving the viscosity stability of the liquid crystal sealant and not impairing the moisture resistance of the obtained sealant, the melting point of the epoxy curing agent is preferably 50°C to 250°C, more preferably 100°C to 200°C, and further preferably 150°C to 200°C.
環氧硬化劑(熱硬化劑)的例子中包含二醯肼系熱潛在性硬化劑(dihydrazide-based thermal latent curing agent)、咪唑系熱潛在性硬化劑(imidazole-based thermal latent curing agent)、胺加成物系熱潛在性硬化劑(amine adduct-based thermal latent curing agent)、及多胺系熱潛在性硬化劑(polyamine-based thermal latent curing agent)等。液晶密封劑可僅包含該些中的一種,亦可包含兩種以上。Examples of epoxy curing agents (thermocuring agents) include dihydrazide-based thermal latent curing agents, imidazole-based thermal latent curing agents, amine adduct-based thermal latent curing agents, and polyamine-based thermal latent curing agents. The liquid crystal sealant may include only one of these, or may include two or more of them.
二醯肼系熱潛在性硬化劑的例子中包含己二酸二醯肼、1,3-雙(肼基羰乙基)-5-異丙基乙內醯脲、7,11-十八烷二烯-1,18-二羰醯肼、十二烷二酸二醯肼及癸二酸二醯肼等。Examples of the dihydrazide-based heat-latent curing agent include adipic acid dihydrazide, 1,3-bis(hydrazinocarbonylethyl)-5-isopropylhydantoin, 7,11-octadecadiene-1,18-dicarbonylhydrazide, dodecanedioic acid dihydrazide, sebacic acid dihydrazide, and the like.
咪唑系熱潛在性硬化劑的例子中包含2,4-二胺基-6-[2'-乙基咪唑基-(1')]-乙基三嗪及2-苯基咪唑等。Examples of the imidazole-based heat-latent curing agent include 2,4-diamino-6-[2'-ethylimidazolyl-(1')]-ethyltriazine and 2-phenylimidazole.
胺加成物系熱潛在性硬化劑是包含使具有觸媒活性的胺系化合物與任意的化合物進行反應而獲得的加成化合物的熱潛在性硬化劑。胺加成物系熱潛在性硬化劑的市售品的例子中包含阿米固(Amicure)PN-40、阿米固(Amicure)PN-23、阿米固(Amicure)PN-31、阿米固(Amicure)PN-H、阿米固(Amicure)MY-24及阿米固(Amicure)MY-H(均為味之素精密技術公司製造)等。Amine adduct-based heat latent curing agents are heat latent curing agents containing an addition compound obtained by reacting an amine compound having catalytic activity with an arbitrary compound. Examples of commercially available products of amine adduct-based heat latent curing agents include Amicure PN-40, Amicure PN-23, Amicure PN-31, Amicure PN-H, Amicure MY-24, and Amicure MY-H (all manufactured by Ajinomoto Precision Technologies Co., Ltd.).
多胺系熱潛在性硬化劑是使胺與環氧樹脂進行反應而獲得的具有聚合物結構的熱潛在性硬化劑,其市售品的例子中包含艾迪科硬化劑(Adeka Hardener)EH4339S及艾迪科硬化劑(Adeka Hardener)EH4357S(均為艾迪科(ADEKA)公司製造)等。The polyamine-based heat latent hardener is a heat latent hardener having a polymer structure obtained by reacting an amine with an epoxy resin, and commercially available examples thereof include Adeka Hardener EH4339S and Adeka Hardener EH4357S (both manufactured by Adeka Corporation).
所述中,就獲取容易性、與其他成分的相容性等觀點而言,較佳為二醯肼系熱潛在性硬化劑、胺加成物系熱潛在性硬化劑、多胺系熱潛在性硬化劑、及咪唑系熱潛在性硬化劑,特佳為二醯肼系熱潛在性硬化劑。Among the above, from the viewpoints of availability, compatibility with other components, etc., dihydrazide-based heat latent curing agents, amine adduct-based heat latent curing agents, polyamine-based heat latent curing agents, and imidazole-based heat latent curing agents are preferred, and dihydrazide-based heat latent curing agents are particularly preferred.
相對於液晶密封劑的總量,熱硬化劑的量較佳為3質量%以上且30質量%以下,更佳為3質量%以上且20質量%以下,進而佳為5質量%以上且20質量%以下。The amount of the thermosetting agent relative to the total amount of the liquid crystal sealant is preferably 3 mass % or more and 30 mass % or less, more preferably 3 mass % or more and 20 mass % or less, and further preferably 5 mass % or more and 20 mass % or less.
(2)光聚合起始劑 光聚合起始劑只要是用於使所述環化聚合性化合物或丙烯酸系化合物、進而(甲基)丙烯酸改質環氧化合物的硬化(聚合)開始的化合物,則並無特別限制。光聚合起始劑可為自裂解型的光聚合起始劑,亦可為去氫型的光聚合起始劑。液晶密封劑可僅包含一種光聚合起始劑,亦可包含兩種以上。 (2) Photopolymerization initiator The photopolymerization initiator is not particularly limited as long as it is a compound used to initiate the curing (polymerization) of the cyclopolymerizable compound or acrylic compound, and further the (meth)acrylic acid-modified epoxy compound. The photopolymerization initiator may be a self-cleaving type photopolymerization initiator or a dehydrogenating type photopolymerization initiator. The liquid crystal sealant may contain only one type of photopolymerization initiator or may contain two or more types.
自裂解型的光聚合起始劑的例子中包含苯烷基酮系化合物(例如2,2-二甲氧基-1,2-二苯基乙烷-1-酮(巴斯夫(BASF)公司製造,豔佳固(IRGACURE)651)等苄基二甲基縮酮系化合物;例如2-甲基-2-嗎啉基(4-硫代甲基苯基)丙烷-1-酮(巴斯夫(BASF)公司製造,豔佳固(IRGACURE)907)等α-胺基苯烷基酮系化合物;例如1-羥基-環己基-苯基-酮(巴斯夫(BASF)公司製造,豔佳固(IRGACURE)184)等α-羥基苯烷基酮系化合物;例如2,4,6-三甲基安息香二苯基氧化膦等醯基氧化膦系化合物;例如雙(η5-2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1H-吡咯-1-基)-苯基)鈦等二茂鈦系化合物;例如二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、苄基二甲基縮酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、4-(2-羥基乙氧基)苯基-(2-羥基-2-丙基)酮、1-羥基環己基-苯基酮、2-甲基-2-嗎啉基(4-硫代甲基苯基)丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮等苯乙酮系化合物;例如苯甲醯甲酸甲酯等苯甲醯甲酸酯系化合物;例如安息香、安息香甲醚、安息香異丙醚等安息香醚系化合物;及例如1,2-辛二酮-1-[4-(苯硫基)-2-(O-苯甲醯基肟)](巴斯夫(BASF)公司製造,豔佳固(IRGACURE)OXE01)、乙酮-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]-1-(O-乙醯基肟)(巴斯夫(BASF)公司製造,豔佳固(IRGACURE)OXE02)等肟酯系化合物。Examples of self-cleaving photopolymerization initiators include alkyl phenone compounds (e.g., benzyl dimethyl ketal compounds such as 2,2-dimethoxy-1,2-diphenylethane-1-one (manufactured by BASF, IRGACURE 651); α-aminoalkyl phenone compounds such as 2-methyl-2-oxo-(4-thiomethylphenyl)propane-1-one (manufactured by BASF, IRGACURE 907); α-Hydroxyphenyl alkyl ketone compounds such as hydroxy-cyclohexyl-phenyl-ketone (manufactured by BASF, IRGACURE 184); acyl phosphine oxide compounds such as 2,4,6-trimethylbenzoin diphenylphosphine oxide; titanium bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium; diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1 -ketone, benzyl dimethyl ketal, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1-one, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)ketone, 1-hydroxycyclohexyl-phenyl ketone, 2-methyl-2-oxolinyl (4-thiomethylphenyl) propane-1-one, 2-benzyl-2-dimethylamino-1-(4-oxolinylphenyl)-butanone; benzoylformic acid ester compounds such as methyl benzoate; benzoin, benzoin methyl ether; , benzoin isopropyl ether and other benzoin ether compounds; and oxime ester compounds such as 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyl oxime)] (manufactured by BASF, IRGACURE OXE01), ethyl ketone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(O-acetyl oxime) (manufactured by BASF, IRGACURE OXE02).
去氫型的光聚合起始劑的例子中包含例如二苯甲酮、鄰苯甲醯基苯甲酸甲酯-4-苯基二苯甲酮、4,4'-二氯二苯甲酮、羥基二苯甲酮、4-苯甲醯基-4'-甲基-二苯基硫醚、丙烯酸化二苯甲酮、3,3',4,4'-四(過氧化第三丁基羰基)二苯甲酮、3,3'-二甲基-4-甲氧基二苯甲酮等二苯甲酮系化合物;例如硫雜蒽酮、2-氯硫雜蒽酮(東京化成工業公司製造)、1-氯-4-丙氧基硫雜蒽酮、1-氯-4-乙氧基硫雜蒽酮(蘭姆森有限公司(Lambson Limited)製造,斯派克(Speedcure)CPTX)、2-異丙基氧雜蒽酮(蘭姆森有限公司(Lambson Limited)製造,斯派克(Speedcure)ITX)、4-異丙基硫雜蒽酮、2,4-二甲基硫雜蒽酮、2,4-二乙基硫雜蒽酮(蘭姆森有限公司(Lambson Limited)製造,斯派克(Speedcure)DETX)、2,4-二氯硫雜蒽酮等硫雜蒽酮系化合物;例如2-甲基蒽醌、2-乙基蒽醌、2-第三丁基蒽醌、1-氯蒽醌、2-羥基蒽醌(東京化成工業公司製造,2-Hydroxyanthraquinone)、2,6-二羥基蒽醌(東京化成工業公司製造,Anthraflavic Acid)、2-羥基甲基蒽醌(純正化學公司製造,2-(Hydroxymethyl)anthraquinone)等蒽醌系化合物;及苯偶醯系化合物。Examples of dehydrogenation-type photopolymerization initiators include benzophenone, methyl o-benzoylbenzoate-4-phenylbenzophenone, 4,4'-dichlorobenzophenone, hydroxybenzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, acrylated benzophenone, 3,3',4,4'-tetrakis(tert-butylcarbonylperoxide)benzophenone, 3,3'-dimethyl-4-methoxybenzophenone and the like; and thioxanthrone, 2-chlorothioxanthrone (manufactured by Tokyo Chemical Industry Co., Ltd.), 1-chloro-4-propoxythioxanthrone, 1-chloro-4-ethoxythioxanthrone (manufactured by Lambson Limited, Speedcure CPTX), 2-isopropyloxythioxanthrone (manufactured by Lambson Limited, Speedcure CPTX), and 1-isopropyloxythioxanthrone (manufactured by Lambson Limited, Speedcure CPTX). Thioxanthrone compounds such as 4-isopropylthioanthrone, 2,4-dimethylthioanthrone, 2,4-diethylthioanthrone (Lambson Limited, Speedcure DETX), and 2,4-dichlorothioanthrone; anthraquinone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-hydroxyanthraquinone (Tokyo Chemical Industry Co., Ltd., 2-Hydroxyanthraquinone), 2,6-dihydroxyanthraquinone (Tokyo Chemical Industry Co., Ltd., Anthraflavic Acid), and 2-hydroxymethylanthraquinone (Junsei Chemical Co., Ltd., 2-(Hydroxymethyl)anthraquinone); and benzoyl compounds.
光聚合起始劑的吸收波長並無特別限定,例如較佳為吸收波長360 nm以上的光。其中,更佳為吸收可見光區域的光,特佳為吸收波長360 nm~430 nm的光。若光聚合起始劑在該範圍內具有吸收波長,則藉由可見光照射能夠使液晶密封劑硬化,可非常減少對液晶材料等的影響。再者,在本說明書中,所謂「可見光區域」,是波長360 nm~780 nm的範圍。The absorption wavelength of the photopolymerization initiator is not particularly limited, for example, it is preferred to absorb light with a wavelength of 360 nm or more. Among them, it is more preferred to absorb light in the visible light region, and it is particularly preferred to absorb light with a wavelength of 360 nm to 430 nm. If the photopolymerization initiator has an absorption wavelength within this range, the liquid crystal sealant can be cured by visible light irradiation, and the influence on the liquid crystal material can be greatly reduced. In addition, in this specification, the so-called "visible light region" is a wavelength range of 360 nm to 780 nm.
吸收波長360 nm以上的光的光聚合起始劑的例子中包含苯烷基酮系化合物、醯基氧化膦系光聚合起始劑、二茂鈦系光聚合起始劑、肟酯系光聚合起始劑(oxime ester photopolymerization initiator)、硫雜蒽酮系光聚合起始劑(thioxanthone photopolymerization initiator)、蒽醌系光聚合起始劑(anthraquinone photopolymerization initiator),較佳為肟酯系光聚合起始劑、硫雜蒽酮系光聚合起始劑及蒽醌系光聚合起始劑,特佳為肟酯系光聚合起始劑。Examples of photopolymerization initiators that absorb light having a wavelength of 360 nm or more include alkyl phenoxide compounds, acylphosphine oxide photopolymerization initiators, titanocene photopolymerization initiators, oxime ester photopolymerization initiators, thioxanthone photopolymerization initiators, and anthraquinone photopolymerization initiators. Oxime ester photopolymerization initiators, thioxanthone photopolymerization initiators, and anthraquinone photopolymerization initiators are preferred, and oxime ester photopolymerization initiators are particularly preferred.
再者,光聚合起始劑的結構可藉由將高效液相層析法(High Performance Liquid Chromatography,HPLC)及液相層析質量分析(Liquid Chromatography Mass Spectrometry,LC/MS)與核磁共振(Nuclear Magnetic Resonance,NMR)測定或紅外線(Infrared,IR)測定加以組合來特定。Furthermore, the structure of the photopolymerization initiator can be identified by combining high performance liquid chromatography (HPLC) and liquid chromatography mass spectrometry (LC/MS) with nuclear magnetic resonance (NMR) or infrared (IR) analysis.
另外,光聚合起始劑的分子量例如較佳為200以上且5000以下。若分子量為200以上,則在液晶密封劑與液晶材料接觸時,光聚合起始劑不易溶出至液晶材料中。另一方面,若分子量為5000以下,則光聚合起始劑與硬化性化合物的相容性提高,液晶密封劑的光硬化性容易變得良好。光聚合起始劑的分子量更佳為230以上且3000以下,進而佳為230以上且1500以下。In addition, the molecular weight of the photopolymerization initiator is preferably, for example, 200 or more and 5000 or less. If the molecular weight is 200 or more, the photopolymerization initiator is not easily eluted into the liquid crystal material when the liquid crystal sealant contacts the liquid crystal material. On the other hand, if the molecular weight is 5000 or less, the compatibility of the photopolymerization initiator and the curable compound is improved, and the photocurability of the liquid crystal sealant is easy to become good. The molecular weight of the photopolymerization initiator is more preferably 230 or more and 3000 or less, and further preferably 230 or more and 1500 or less.
光聚合起始劑的分子量可作為利用高效液相層析法(High Performance Liquid Chromatography,HPLC)進行分析時所檢測到的主峰的、分子結構的「相對分子質量」來求出。The molecular weight of the photopolymerization initiator can be determined as the "relative molecular mass" of the molecular structure of the main peak detected during analysis using high performance liquid chromatography (HPLC).
具體而言,製備使光聚合起始劑溶解於四氫呋喃(tetrahydrofuran,THF)中而成的試樣液,並進行高效液相層析法(HPLC)測定。然後,求出所檢測到的峰值的面積百分率(各峰值的面積相對於合計的比率),來確認有無主峰。所謂主峰,是指對各化合物以特徵性的檢測波長(例如,若為硫雜蒽酮系化合物,則為400 nm)所檢測到的所有峰值中強度最大的峰值(峰值的高度最高的峰值)。與所檢測到的主峰的峰值頂點對應的相對分子質量可藉由液相層析質譜分析(Liquid Chromatography Mass Spectrometry,LC/MS)來測定。Specifically, a sample solution is prepared by dissolving a photopolymerization initiator in tetrahydrofuran (THF), and then subjected to high performance liquid chromatography (HPLC) measurement. Then, the area percentage of the detected peak (the ratio of the area of each peak to the total) is calculated to confirm the presence or absence of a main peak. The so-called main peak refers to the peak with the highest intensity (the peak with the highest peak height) among all peaks detected at a characteristic detection wavelength for each compound (for example, 400 nm for thioxanthrone compounds). The relative molecular mass corresponding to the peak apex of the detected main peak can be measured by liquid chromatography mass spectrometry (LC/MS).
相對於硬化性化合物中的具有不飽和雙鍵的化合物的總量(例如,所述環化聚合性化合物或(甲基)丙烯酸系化合物、(甲基)丙烯酸改質環氧化合物的合計量),光聚合起始劑的量較佳為0.01質量%~10質量%。若相對於具有不飽和雙鍵的化合物的總量,光聚合起始劑的量為0.01質量%以上,則液晶密封劑的光硬化性容易變得良好。另一方面,若光聚合起始劑的含量為10質量%以下,則光聚合起始劑不易溶出至液晶中。相對於硬化性化合物中的具有不飽和雙鍵的化合物的總量,光聚合起始劑的含量更佳為0.1質量%~5質量%,進而佳為0.1質量%~3質量%,特佳為0.1質量%~2.5質量%。The amount of the photopolymerization initiator is preferably 0.01 mass % to 10 mass % relative to the total amount of the compound having an unsaturated double bond in the curable compound (for example, the total amount of the cyclopolymerizable compound or (meth) acrylic acid compound, (meth) acrylic acid modified epoxy compound). If the amount of the photopolymerization initiator is 0.01 mass % or more relative to the total amount of the compound having an unsaturated double bond, the photocurability of the liquid crystal sealant tends to become good. On the other hand, if the content of the photopolymerization initiator is 10 mass % or less, the photopolymerization initiator is not easily eluted into the liquid crystal. The content of the photopolymerization initiator is more preferably 0.1% by mass to 5% by mass, further preferably 0.1% by mass to 3% by mass, and particularly preferably 0.1% by mass to 2.5% by mass, relative to the total amount of the compound having an unsaturated double bond in the curable compound.
1-3.填料 液晶密封劑較佳為包含填料。若液晶密封劑包含填料,則液晶密封劑的黏度更容易收斂於所期望的範圍內。另外,所獲得的密封材的透濕性進一步變低。填料的例子中包含無機填充劑或核殼型微粒子等。 1-3. Filler The liquid crystal sealant preferably contains a filler. If the liquid crystal sealant contains a filler, the viscosity of the liquid crystal sealant is more easily converged within the desired range. In addition, the moisture permeability of the obtained sealant is further reduced. Examples of fillers include inorganic fillers or core-shell type microparticles.
(1)無機填充劑 無機填充劑除了對所獲得的密封材賦予規定的硬度或線膨脹性以外,亦起到進一步提高密封材的低透濕性的功能。 (1) Inorganic fillers In addition to imparting a specified hardness or linear expansion to the obtained sealant, inorganic fillers also have the function of further improving the low moisture permeability of the sealant.
無機填充劑的例子中包含碳酸鈣、碳酸鎂、硫酸鋇、硫酸鎂、矽酸鋁、矽酸鋯、氧化鐵、氧化鈦、氮化鈦、所述以外的氧化鋁、氧化鋅、二氧化矽(silica)、鈦酸鉀、高嶺土(kaolin)、滑石、玻璃珠、絹雲母(sericite)、活性白土、膨土(bentonite)、氮化鋁及氮化矽等。該些中,較佳為二氧化矽及滑石。Examples of the inorganic filler include calcium carbonate, magnesium carbonate, barium sulfate, magnesium sulfate, aluminum silicate, zirconium silicate, iron oxide, titanium oxide, titanium nitride, aluminum oxide other than those mentioned above, zinc oxide, silica, potassium titanate, kaolin, talc, glass beads, sericite, activated clay, bentonite, aluminum nitride, silicon nitride, etc. Among these, silica and talc are preferred.
無機填充劑的形狀可為球狀、板狀、針狀等固定形狀,亦可為非固定形狀。在無機填充劑為球狀的情況下,無機填充劑的平均一次粒徑較佳為1.5 μm以下。另外,無機填充劑的比表面積較佳為0.5 m 2/g以上且20 m 2/g以下。無機填充劑的平均一次粒徑可藉由JIS Z8825(2013年)中記載的雷射繞射法進行測定。填充劑的比表面積藉由JIS Z8830(2013年)中記載的布厄特(Brunauer-Emmett-Teller,BET)法進行測定。 The shape of the inorganic filler may be a fixed shape such as a sphere, a plate, or a needle, or may be a non-fixed shape. When the inorganic filler is spherical, the average primary particle size of the inorganic filler is preferably 1.5 μm or less. In addition, the specific surface area of the inorganic filler is preferably 0.5 m 2 /g or more and 20 m 2 /g or less. The average primary particle size of the inorganic filler can be measured by the laser diffraction method described in JIS Z8825 (2013). The specific surface area of the filler is measured by the Brunauer-Emmett-Teller (BET) method described in JIS Z8830 (2013).
相對於硬化性化合物的總量,液晶密封劑中的無機填充劑的量較佳為2質量%以上且30質量%以下,更佳為2質量%以上且20質量%以下,進而佳為5質量%以上且20質量%以下。無機填充劑的含量越多,所獲得的密封材的透濕性越容易變低,但若含量過多,則有時會損害密封材的柔軟性。因此,較佳為所述範圍。The amount of the inorganic filler in the liquid crystal sealant is preferably 2% by mass or more and 30% by mass or less, more preferably 2% by mass or more and 20% by mass or less, and further preferably 5% by mass or more and 20% by mass or less relative to the total amount of the curable compound. The higher the content of the inorganic filler, the lower the moisture permeability of the obtained sealant. However, if the content is too high, the flexibility of the sealant may be impaired. Therefore, the above range is preferred.
(2)核殼型微粒子 核殼型微粒子為包括具有所期望的物性的核、以及覆蓋該核的殼部的微粒子。藉由殼部,能夠提高與其他成分的相容性,或與其他成分發生部分反應。 (2) Core-shell type microparticles Core-shell type microparticles are microparticles that include a core having desired physical properties and a shell covering the core. The shell can improve compatibility with other components or partially react with other components.
核殼型微粒子的例子中包含有機微粒子,所述有機微粒子具有包含共軛二烯系橡膠及矽酮橡膠等的彈性的核、以及包含(甲基)丙烯酸酯、或乙烯基單體、環氧單體等聚合物的殼部。Examples of core-shell type fine particles include organic fine particles having an elastic core made of conjugated diene rubber, silicone rubber, or the like, and a shell made of a polymer such as (meth)acrylate, vinyl monomer, or epoxy monomer.
另外,核殼型微粒子的另一例中亦包含如下微粒子,所述微粒子具有包含無機粒子的核、以及包含覆蓋核的聚合物層的殼部,且在表面具有包含碳-碳雙鍵的官能基。該核殼型微粒子所具有的包含碳-碳雙鍵的官能基的例子中包含乙烯基、烯丙基、丙烯酸基、甲基丙烯酸基等。再者,該核殼型微粒子中的核的例子中包含與所述無機填充劑相同的粒子。其中,就熱穩定性優異的觀點而言,較佳為二氧化矽粒子。In addition, another example of core-shell type microparticles also includes the following microparticles, wherein the microparticles have a core including an inorganic particle, and a shell including a polymer layer covering the core, and have a functional group including a carbon-carbon double bond on the surface. Examples of the functional group including a carbon-carbon double bond possessed by the core-shell type microparticles include vinyl, allyl, acrylic, methacrylic, etc. Furthermore, examples of the core in the core-shell type microparticles include particles that are the same as the inorganic filler. Among them, from the viewpoint of excellent thermal stability, silica particles are preferred.
相對於硬化性化合物的基本量,核殼型微粒子的量較佳為2質量%以上且30質量%以下,更佳為2質量%以上且20質量%以下,進而佳為5質量%以上且20質量%以下。若核殼型微粒子的含量為該範圍,則容易將所獲得的密封材的物性調整為所期望的範圍。The amount of the core-shell type microparticles relative to the basic amount of the curable compound is preferably 2 mass % or more and 30 mass % or less, more preferably 2 mass % or more and 20 mass % or less, and further preferably 5 mass % or more and 20 mass % or less. If the content of the core-shell type microparticles is within this range, it is easy to adjust the physical properties of the obtained sealing material to the desired range.
(3)其他 在不損害本發明的目的及效果的範圍內,可包含所述以外的填料,例如亦可更包含並非核殼結構的有機微粒子等。 (3) Others Within the scope of not impairing the purpose and effect of the present invention, fillers other than those mentioned above may be included, for example, organic microparticles other than core-shell structures may also be included.
如上所述,若填料的量與環化聚合性化合物的量滿足規定的關係,則液晶密封劑的黏度等物性容易收斂於所期望的範圍內,液晶密封劑的塗佈性變得良好,或者在製作液晶顯示面板時不易產生內衝。此處,相對於液晶密封劑的總量,填料的總量較佳為5質量%以上且40質量%以下,更佳為10質量%以上且30質量%以下。若填料的總量為所述範圍,則容易將液晶密封劑的各種物性調整為所期望的範圍。As described above, if the amount of filler and the amount of cyclopolymerizable compound satisfy the prescribed relationship, the physical properties of the liquid crystal sealant such as viscosity are easily converged within the desired range, the coating property of the liquid crystal sealant becomes good, or it is difficult to generate inward impact when manufacturing a liquid crystal display panel. Here, the total amount of filler is preferably 5 mass% or more and 40 mass% or less, and more preferably 10 mass% or more and 30 mass% or less relative to the total amount of the liquid crystal sealant. If the total amount of filler is within the above range, it is easy to adjust various physical properties of the liquid crystal sealant to the desired range.
1-4.其他 所述液晶密封劑除包含所述各成分以外,亦可更包含熱自由基產生劑、有機微粒子、矽烷偶合劑等偶合劑、離子捕捉劑、離子交換劑、調平劑、顏料、染料、增感劑、塑化劑及消泡劑等。 1-4. Others In addition to the above-mentioned components, the liquid crystal sealant may also include a thermal free radical generator, organic microparticles, coupling agents such as silane coupling agents, ion scavengers, ion exchange agents, leveling agents, pigments, dyes, sensitizers, plasticizers, and defoaming agents, etc.
熱自由基聚合起始劑的例子中包含有機過氧化物、偶氮化合物、安息香類、安息香醚類及苯乙酮類等。Examples of the thermal radical polymerization initiator include organic peroxides, azo compounds, benzoins, benzoin ethers, and acetophenones.
矽烷偶合劑的例子中包含乙烯基三甲氧基矽烷、γ-(甲基)丙烯醯氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、及γ-縮水甘油氧基丙基三乙氧基矽烷等。Examples of the silane coupling agent include vinyltrimethoxysilane, γ-(meth)acryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropyltriethoxysilane.
相對於液晶密封劑的總量,矽烷偶合劑的量較佳為0.01質量%以上且5質量%以下。若矽烷偶合劑的含量為0.01質量%以上,則可進一步提高密封材與基板的黏接強度。The amount of the silane coupling agent is preferably 0.01 mass % or more and 5 mass % or less relative to the total amount of the liquid crystal sealant. If the content of the silane coupling agent is 0.01 mass % or more, the bonding strength between the sealant and the substrate can be further improved.
液晶密封劑亦可更包含用於對液晶顯示面板的間隙進行調整的間隔物等。The liquid crystal sealant may further include a spacer for adjusting the gap of the liquid crystal display panel.
相對於液晶密封劑的總量,其他成分的總量較佳為0.1質量%以上且50質量%以下。若所述合計量為50質量%以下,則液晶密封劑的黏度不易過度上升,液晶密封劑的塗佈穩定性不易受損。The total amount of other components is preferably 0.1 mass % or more and 50 mass % or less relative to the total amount of the liquid crystal sealant. If the total amount is 50 mass % or less, the viscosity of the liquid crystal sealant is unlikely to increase excessively, and the coating stability of the liquid crystal sealant is unlikely to be impaired.
1-5.液晶密封劑的黏度 基於所述液晶密封劑的E型黏度計的25℃、2.5 rpm下的黏度較佳為200 Pa·s~450 Pa·s,更佳為300 Pa·s~400 Pa·s。若黏度處於所述範圍,則利用分配器的密封劑的塗佈性變得良好。另外,若液晶密封劑的黏度為該範圍,則更不易產生所述內衝。 1-5. Viscosity of liquid crystal sealant The viscosity of the liquid crystal sealant at 25°C and 2.5 rpm based on an E-type viscometer is preferably 200 Pa·s to 450 Pa·s, and more preferably 300 Pa·s to 400 Pa·s. If the viscosity is within the above range, the coating property of the sealant using a dispenser becomes good. In addition, if the viscosity of the liquid crystal sealant is within this range, the above-mentioned inrush is less likely to occur.
2.液晶顯示面板及其製造方法 本發明的液晶顯示面板包含:一對基板;液晶層,夾入至該一對基板間;以及框狀的密封材,配置於所述一對基板間,用於對液晶層進行密封。 2. Liquid crystal display panel and its manufacturing method The liquid crystal display panel of the present invention comprises: a pair of substrates; a liquid crystal layer sandwiched between the pair of substrates; and a frame-shaped sealing material disposed between the pair of substrates for sealing the liquid crystal layer.
一對基板中的其中一個基板設為顯示基板,另一個基板設為相向基板。該些均為透明基板。透明基板的材質可為玻璃等無機材料,亦可為聚碳酸酯、聚對苯二甲酸乙二酯、聚醚碸及聚甲基丙烯酸甲酯(Polymethyl Methacrylate,PMMA)等塑膠。One of the substrates in the pair is set as a display substrate, and the other substrate is set as an opposite substrate. These are all transparent substrates. The material of the transparent substrate can be inorganic materials such as glass, or plastics such as polycarbonate, polyethylene terephthalate, polyether ether and polymethyl methacrylate (PMMA).
可在一對基板(顯示基板及相向基板)的表面配置矩陣狀的薄膜電晶體(Thin Film Transistor,TFT)、彩色濾光片、黑色矩陣等。在顯示基板或相向基板的表面通常亦配置有配向膜。配向膜是包含公知的有機配向劑或無機配向劑的膜。Thin Film Transistors (TFT), color filters, black matrix, etc. can be arranged on the surface of a pair of substrates (display substrate and counter substrate). An alignment film is usually arranged on the surface of the display substrate or the counter substrate. The alignment film is a film containing a known organic alignment agent or an inorganic alignment agent.
所述液晶層是包含封入至被一對基板與密封材包圍的區域內的液晶材料的層。液晶材料與公知的液晶材料相同。The liquid crystal layer is a layer including a liquid crystal material sealed in a region surrounded by a pair of substrates and a sealant. The liquid crystal material is the same as a known liquid crystal material.
所述密封材是配置於一對基板之間的、用於對液晶進行密封的框狀的構件。該密封材是所述液晶密封劑的硬化物。The sealing material is a frame-shaped member disposed between a pair of substrates and used to seal the liquid crystal. The sealing material is a cured product of the liquid crystal sealant.
所述液晶顯示面板是使用本發明的液晶密封劑來製造。液晶顯示面板的製造方法中通常有液晶滴加製程與液晶注入製程,但本發明的液晶顯示面板較佳為利用液晶滴加製程來製造。The liquid crystal display panel is manufactured using the liquid crystal sealant of the present invention. The manufacturing method of the liquid crystal display panel generally includes a liquid crystal dropping process and a liquid crystal injection process, but the liquid crystal display panel of the present invention is preferably manufactured using the liquid crystal dropping process.
利用液晶滴加製程的液晶顯示面板的製造方法包含如下步驟: 1)準備一對基板; 2)在一對基板中的其中一個基板上,藉由所述液晶密封劑形成框狀密封圖案; 3)在所述框狀密封圖案的外側塗佈虛設密封劑,形成虛設密封圖案; 4)在框狀密封圖案及虛設密封圖案未硬化的狀態下,向其中一個基板上的由框狀密封圖案包圍的區域的內側及/或另一個基板上的對應的區域滴加液晶材料; 5)在減壓環境下,使其中一個基板與另一個基板經由液晶材料重疊;以及 6)使所述框狀密封圖案及所述虛設密封圖案硬化。 再者,2)的步驟及3)的步驟均可先進行。另外,亦可在所述6)的步驟後,進一步進行將形成有所述虛設密封圖案的區域去除的步驟。 The manufacturing method of a liquid crystal display panel using a liquid crystal drop process includes the following steps: 1) preparing a pair of substrates; 2) forming a frame-shaped sealing pattern on one of the pair of substrates by using the liquid crystal sealant; 3) applying a dummy sealant on the outer side of the frame-shaped sealing pattern to form a dummy sealing pattern; 4) dripping liquid crystal material to the inner side of the area surrounded by the frame-shaped sealing pattern on one of the substrates and/or the corresponding area on the other substrate when the frame-shaped sealing pattern and the dummy sealing pattern are not hardened; 5) overlapping one of the substrates with the other substrate via the liquid crystal material in a reduced pressure environment; and 6) hardening the frame-shaped sealing pattern and the dummy sealing pattern. Furthermore, both step 2) and step 3) can be performed first. In addition, after step 6), a step of removing the area where the virtual sealing pattern is formed can be further performed.
在1)的步驟中,通常準備配置有矩陣狀的TFT、彩色濾光片、黑色矩陣及配向膜的顯示基板及相向基板。In step 1), a display substrate and a counter substrate having a matrix of TFTs, a color filter, a black matrix and an alignment film are usually prepared.
在2)的步驟中,塗敷液晶密封劑的區域可根據液晶顯示面板的結構來適宜選擇。液晶密封劑的塗佈方法只要能夠以所期望的寬度塗佈液晶密封劑,則並無特別限制,例如能夠藉由分配器等進行塗佈。In step 2), the area to which the liquid crystal sealant is applied can be appropriately selected according to the structure of the liquid crystal display panel. The method of applying the liquid crystal sealant is not particularly limited as long as the liquid crystal sealant can be applied with a desired width, and for example, the liquid crystal sealant can be applied by a dispenser or the like.
在3)的步驟中,塗佈虛設密封劑的區域亦可根據液晶顯示面板的結構來適宜選擇。虛設密封劑可與液晶密封劑相同,亦可不同。再者,虛設密封劑與液晶密封劑不同時的虛設密封劑的組成並無特別限制,與公知的虛設密封劑相同。虛設密封劑亦能夠藉由分配器等進行塗佈。In step 3), the area where the dummy sealant is applied can also be appropriately selected according to the structure of the liquid crystal display panel. The dummy sealant can be the same as the liquid crystal sealant or different. Furthermore, when the dummy sealant is different from the liquid crystal sealant, the composition of the dummy sealant is not particularly limited and is the same as the known dummy sealant. The dummy sealant can also be applied by a dispenser or the like.
此處,虛設密封圖案與密封圖案隔開間隙地配置。若形成該虛設密封圖案,則當在後述的5)的步驟中使一對基板重疊時,在虛設密封件與密封材之間形成減壓空間。藉此,可牢固地固定一對基板。Here, the virtual sealing pattern is arranged with a gap between the sealing patterns. If the virtual sealing pattern is formed, when a pair of substrates are overlapped in the step 5) described later, a decompression space is formed between the virtual sealing member and the sealing material. Thereby, the pair of substrates can be firmly fixed.
在4)的步驟中,將液晶材料滴加至規定的區域。此處,所謂框狀密封圖案及虛設密封圖案未硬化的狀態,是指液晶密封劑或虛設密封劑的硬化反應未進行至凝膠化點的狀態。因此,在4)的步驟中,為了抑制液晶密封劑向液晶的溶解,亦可預先對框狀密封圖案進行光照射或加熱,並使其半硬化。另外,在4)的步驟中向另一個基板上滴加液晶的情況下,當在5)的步驟中使2塊帶配向膜的基板重疊時,以液晶收納於框狀密封圖案的內側的方式滴加液晶。In step 4), the liquid crystal material is dripped into a predetermined area. Here, the state in which the frame-shaped sealing pattern and the dummy sealing pattern are not hardened refers to the state in which the hardening reaction of the liquid crystal sealant or the dummy sealant has not proceeded to the gelation point. Therefore, in step 4), in order to suppress the dissolution of the liquid crystal sealant into the liquid crystal, the frame-shaped sealing pattern may be irradiated with light or heated in advance and semi-hardened. In addition, when the liquid crystal is dripped onto another substrate in step 4), when two substrates with alignment films are overlapped in step 5), the liquid crystal is dripped in such a way that the liquid crystal is contained inside the frame-shaped sealing pattern.
在5)的步驟中,在減壓環境下,使其中一個基板與另一個基板經由液晶材料而重疊。由於如此在減壓環境下使液晶材料重疊,因此如上所述,所獲得的密封材與虛設密封件之間成為減壓狀態。但是,當在5)的步驟中使一對基板重疊時,框狀密封圖案未硬化。因此,在使用一般的液晶密封劑的情況下,液晶材料有時會進入框狀密封框狀密封圖案內部(產生內衝)。相對於此,在所述液晶密封劑中,不易產生此種內衝。另外,特別是在所述液晶密封劑包含填料的情況下,更不易產生內衝。In step 5), one of the substrates is overlapped with the other substrate via the liquid crystal material in a reduced pressure environment. Since the liquid crystal material is overlapped in a reduced pressure environment in this way, the obtained sealant and the dummy seal are in a reduced pressure state as described above. However, when a pair of substrates are overlapped in step 5), the frame-shaped sealing pattern is not cured. Therefore, when a general liquid crystal sealant is used, the liquid crystal material sometimes enters the inside of the frame-shaped seal frame-shaped sealing pattern (causing inward impact). In contrast, in the liquid crystal sealant, such inward impact is not easy to occur. In addition, especially when the liquid crystal sealant contains fillers, inward impact is less likely to occur.
在6)的步驟中,亦可進行利用光照射的硬化、及其後的利用加熱的硬化。藉由進行利用光照射的硬化,可在短時間內使液晶密封劑(及虛設密封劑)硬化,因此可抑制液晶密封劑向液晶的溶解。藉由將利用光照射的硬化與利用加熱的硬化加以組合,與僅進行利用光照射的硬化的情況相比,可減少由光引起的對液晶層造成的損傷。In step 6), curing by light irradiation and subsequent curing by heating may be performed. By performing curing by light irradiation, the liquid crystal sealant (and dummy sealant) can be cured in a short time, thereby suppressing the dissolution of the liquid crystal sealant into the liquid crystal. By combining curing by light irradiation with curing by heating, damage to the liquid crystal layer caused by light can be reduced compared to the case of performing curing by light irradiation alone.
所照射的光可根據所述液晶密封劑(及虛設密封劑)中的光聚合起始劑的種類來適宜選擇,較佳為可見光區域的光,例如較佳為波長370 nm以上且450 nm以下的光。其原因在於,所述波長的光對液晶材料或驅動電極造成的損傷相對較少。光的照射可使用發出紫外線或可見光的公知的光源。在照射可見光的情況下,可使用高壓水銀燈、低壓水銀燈、金屬鹵化物燈、氙燈、螢光燈等。The irradiated light can be appropriately selected according to the type of photopolymerization initiator in the liquid crystal sealant (and dummy sealant), preferably light in the visible light region, for example, preferably light with a wavelength of 370 nm or more and 450 nm or less. The reason is that the light of the wavelength causes relatively little damage to the liquid crystal material or the drive electrode. The irradiation of light can use a known light source that emits ultraviolet rays or visible light. In the case of irradiating visible light, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, a xenon lamp, a fluorescent lamp, etc. can be used.
光照射能量只要是所述硬化性化合物能夠硬化的能量即可。光硬化時間亦取決於液晶密封劑的組成,例如為10分鐘左右。The light irradiation energy may be any energy that can cure the curable compound. The light curing time also depends on the composition of the liquid crystal sealant, and is, for example, about 10 minutes.
熱硬化溫度亦取決於液晶密封劑或虛設密封劑的組成,例如為120℃,熱硬化時間為2小時左右。 [實施例] The heat curing temperature also depends on the composition of the liquid crystal sealant or the dummy sealant, for example, it is 120°C, and the heat curing time is about 2 hours. [Example]
以下,參照實施例對本發明進行說明。本發明的範圍並不由實施例限定地解釋。Hereinafter, the present invention will be described with reference to the embodiments. The scope of the present invention is not limited to the embodiments.
1.材料的準備 作為實施例及比較例中使用的材料,準備了以下化合物。 1. Preparation of materials As materials used in the examples and comparative examples, the following compounds were prepared.
(1)硬化性化合物 (環化聚合性化合物) ·硬化性化合物(A-1):下述通式(1A)所表示的環化聚合性化合物(商品名「奧瑪(AOMA)」,日本觸媒公司製造) [化3] (1) Curable compound (cyclopolymerizable compound) Curable compound (A-1): a cyclopolymerizable compound represented by the following general formula (1A) (trade name "AOMA", manufactured by Nippon Catalyst Co., Ltd.) [Chemical 3]
(其他硬化性化合物) ·硬化性化合物(A-2):雙酚A型二丙烯酸酯(大賽璐-奧諾斯(Daicel-Allnex)公司製造、艾巴克力(Ebecryl)3700) ·硬化性化合物(A-3):下述式所表示的三-(2-丙烯醯氧基乙基)異氰脲酸酯(新中村化學工業公司製造,A-9300-2CL) [化4] ·硬化性化合物(A-4):下述式所表示的乙氧基化雙酚A二丙烯酸酯(新中村化學工業公司製造,A-BPE-4) [化5] (式中,m+n=4) ·硬化性化合物(A-5):雙酚F型環氧樹脂(三菱化學公司製造,YL983U) ·硬化性化合物(A-6):丙烯酸改質環氧樹脂(KSM公司製造,BAEM-50) (Other curable compounds) Curable compound (A-2): Bisphenol A diacrylate (manufactured by Daicel-Allnex, Ebecryl 3700) Curable compound (A-3): Tris-(2-acryloyloxyethyl) isocyanurate represented by the following formula (manufactured by Shin-Nakamura Chemical Industries, Ltd., A-9300-2CL) [Chemical 4] Curable compound (A-4): ethoxylated bisphenol A diacrylate represented by the following formula (manufactured by Shin-Nakamura Chemical Industries, Ltd., A-BPE-4) [Chemical 5] (where m+n=4) Curable compound (A-5): Bisphenol F type epoxy resin (manufactured by Mitsubishi Chemical Corporation, YL983U) Curable compound (A-6): Acrylic modified epoxy resin (manufactured by KSM, BAEM-50)
(2)硬化劑 ·熱硬化劑:胺加成物型硬化劑(味之素精密技術公司製造,PN-50) ·光聚合起始劑:肟酯系光聚合起始劑(巴斯夫(BASF)日本公司製造,豔佳固(IRGACURE)OXE02) (2) Hardener · Thermohardener: Amine adduct type hardener (manufactured by Ajinomoto Precision Technology Co., Ltd., PN-50) · Photopolymerization initiator: Oxime ester photopolymerization initiator (manufactured by BASF Japan, IRGACURE OXE02)
(3)填料 ·二氧化矽粒子(雅都瑪科技(Admatechs)公司製造,SO-C1) ·核殼型微粒子(愛克(Aica)工業公司製造,F351) (3) Filler · Silica particles (manufactured by Admatechs, SO-C1) · Core-shell microparticles (manufactured by Aica Industries, F351)
(4)矽烷偶合劑 ·KBM403(信越化學工業公司製造) (4) Silane coupling agent ·KBM403 (manufactured by Shin-Etsu Chemical Co., Ltd.)
2.液晶密封劑的製備 (實施例1) 利用三輥磨機將硬化性化合物(A-1)100質量份、硬化性化合物(A-2)70質量份、硬化性化合物(A-5)100質量份、硬化性化合物(A-6)400質量份、熱硬化劑130質量份、光聚合起始劑10質量份、二氧化矽粒子100質量份、核殼型微粒子100質量份、及矽烷偶合劑10質量份加以混合,從而獲得液晶密封劑。 2. Preparation of liquid crystal sealant (Example 1) 100 parts by mass of curable compound (A-1), 70 parts by mass of curable compound (A-2), 100 parts by mass of curable compound (A-5), 400 parts by mass of curable compound (A-6), 130 parts by mass of thermosetting agent, 10 parts by mass of photopolymerization initiator, 100 parts by mass of silica particles, 100 parts by mass of core-shell type microparticles, and 10 parts by mass of silane coupling agent were mixed using a three-roll mill to obtain a liquid crystal sealant.
(實施例2~實施例9及比較例1、比較例2) 除變更為表1所示的組成以外,與實施例1同樣地製備液晶密封劑。 (Example 2 to Example 9 and Comparative Example 1, Comparative Example 2) A liquid crystal sealant was prepared in the same manner as in Example 1 except that the composition was changed to that shown in Table 1.
3.評價 對於所獲得的液晶密封劑的硬化物,藉由以下方法分別對黏接強度、透濕量(低透濕性)、耐內衝性、及描繪性進行評價。將結果示於表1中。 3. Evaluation The obtained cured product of the liquid crystal sealant was evaluated for adhesive strength, moisture permeability (low moisture permeability), inward impact resistance, and drawing properties by the following methods. The results are shown in Table 1.
(黏接強度) 使用分配器(點膠機(Shotmaster)、武藏高科技(Musashi Engineering)公司製造),在預先形成有透明電極與配向膜的40 mm×45 mm玻璃基板(RT-DM88-PIN、EHC公司製造)上,將所獲得的液晶密封劑形成38 mm×38 mm的四邊形的框狀密封圖案(剖面積2500 μm 2)。 繼而,以與形成有框狀密封圖案的玻璃基板垂直的方式,將成對的玻璃基板在減壓下貼合後,開放大氣而貼合。然後,將所貼合的2塊玻璃基板在遮光箱內保持1分鐘,然後照射3000 mJ/cm 2的包含可見光的光(波長370 nm~450 nm的光),進而在120℃下加熱1小時而使框狀密封圖案硬化,從而獲得試驗片。 針對所獲得的試驗片的距框狀密封圖案的角落為4.5 mm外側的部分,使用壓痕試驗機(型號(Model)210、因特斯克(Intesco)公司製造)以5 mm/分鐘的速度進行垂直壓入。對10塊玻璃基板進行所述操作(n=10),對玻璃基板產生破裂的塊數進行計數。然後,按照以下的基準來評價黏接強度。 ◎:玻璃基板產生破裂的塊數為10塊 ○:玻璃基板產生破裂的塊數為6塊~9塊 △:玻璃基板產生破裂的塊數為1塊~5塊 ×:玻璃基板產生破裂的塊數為0塊 玻璃基板產生破裂的塊數越多,可判斷為黏接強度越高。若為△以上,則是實用上無問題的水準,判斷為良好。 (Adhesion Strength) The obtained liquid crystal sealant was formed into a 38 mm × 38 mm square frame-shaped seal pattern (cross-sectional area 2500 μm 2 ) on a 40 mm × 45 mm glass substrate (RT-DM88-PIN, manufactured by EHC) on which a transparent electrode and an alignment film were previously formed using a dispenser (Shotmaster, manufactured by Musashi Engineering ) . Then, the paired glass substrates were bonded together under reduced pressure in a manner perpendicular to the glass substrate on which the frame-shaped seal pattern was formed, and then bonded together by opening the atmosphere. Then, the two bonded glass substrates were kept in a light-shielding box for 1 minute, and then irradiated with 3000 mJ/ cm2 of visible light (light with a wavelength of 370 nm to 450 nm), and then heated at 120°C for 1 hour to cure the frame-shaped sealing pattern, thereby obtaining a test piece. For the portion of the obtained test piece that is 4.5 mm outside the corner of the frame-shaped sealing pattern, an indentation tester (Model 210, manufactured by Intesco) was used to perform vertical indentation at a speed of 5 mm/minute. The above operation was performed on 10 glass substrates (n=10), and the number of glass substrates that were cracked was counted. Then, the bonding strength was evaluated according to the following criteria. ◎: The number of cracks on the glass substrate is 10 pieces○: The number of cracks on the glass substrate is 6 to 9 pieces△: The number of cracks on the glass substrate is 1 to 5 pieces×: The number of cracks on the glass substrate is 0 pieces. The more cracks on the glass substrate, the higher the bonding strength. If it is △ or above, it is a level that is not a problem in practical use and is judged to be good.
(耐濕性) 使用敷料器將所獲得的液晶密封劑以100 μm的厚度塗佈於脫模紙上。之後,將所塗佈的液晶密封劑放入氮氣置換用的容器中並實施5分鐘氮氣沖洗,然後照射3000 mJ/cm 2的光(利用波長365 nm感測器校正後的光),進而在120℃下加熱1小時,從而製作硬化膜。 (Moisture resistance) The obtained liquid crystal sealant was applied to a release paper with a thickness of 100 μm using an applicator. The applied liquid crystal sealant was then placed in a nitrogen replacement container and flushed with nitrogen for 5 minutes, then irradiated with 3000 mJ/ cm2 of light (light calibrated with a 365 nm wavelength sensor), and then heated at 120°C for 1 hour to prepare a cured film.
在封入有作為吸濕劑的氯化鈣(無水)的鋁杯上載置2塊硬化膜,進而載置鋁環並進行螺絲緊固,然後測量鋁杯整體的初始重量。之後,將鋁杯放入設定為60℃90%Rh的恆溫槽中,經過24小時後,取出鋁杯並測量重量。將所獲得的重量值代入至以下的計算式中來算出透濕量。 計算式: 透濕量=(試驗後重量-試驗前重量)×膜厚度/(膜面積×100) 然後,基於以下的基準來進行評價。 ◎:透濕量為60 g/m 2以下 ○:透濕量超過60 g/m 2且為80 g/m 2以下 △:透濕量超過80 g/m 2且為100 g/m 2以下 ×:透濕量超過100 g/m 2若為△以上,則是實用上無問題的水準,判斷為良好。 Two hardened films are placed on an aluminum cup filled with calcium chloride (anhydrous) as a moisture absorbent, and then an aluminum ring is placed and screwed, and then the initial weight of the entire aluminum cup is measured. After that, the aluminum cup is placed in a constant temperature bath set at 60℃ and 90%Rh. After 24 hours, the aluminum cup is taken out and the weight is measured. The obtained weight value is substituted into the following calculation formula to calculate the moisture permeation. Calculation formula: Moisture permeation = (weight after test - weight before test) × film thickness / (film area × 100) Then, evaluation is performed based on the following criteria. ◎: Moisture permeability is 60 g/m2 or less ○: Moisture permeability exceeds 60 g/ m2 and is 80 g/m2 or less △: Moisture permeability exceeds 80 g/ m2 and is 100 g/ m2 or less ×: Moisture permeability exceeds 100 g/ m2 If it is △ or above, it is a level that does not cause any practical problems and is judged to be good.
(耐內衝性) 使用分配器(點膠機(Shotmaster)、武藏高科技(Musashi Engineering)公司製造),在預先形成有透明電極與配向膜的40 mm×45 mm玻璃基板(RT-DM88-PIN,EHC公司製造)上,將所獲得的液晶密封劑形成24 mm×24 mm、線寬0.5 mm的四邊形的框狀密封圖案(剖面積2500 μm 2)。進而,在其周圍,藉由液晶密封劑形成38 mm×38 mm、線寬1 mm的四邊形的框狀的虛設密封圖案。繼而將液晶(MLC-3007;默克(Merck)公司製造)的微滴(滴加量2.0 μl)滴加至框狀密封圖案的框內。 繼而,以與形成有框狀密封圖案及虛設密封圖案的玻璃基板垂直的方式,將成對的玻璃基板在減壓下貼合後,開放大氣而貼合。然後,將所貼合的兩塊玻璃基板在遮光箱內保持1分鐘,然後照射3000 mJ/cm 2的包含可見光的光(波長370 nm~450 nm的光),進而在120℃下加熱1小時而使密封硬化,從而獲得試驗片。然後,利用偏光顯微鏡對密封材與液晶的界面進行觀察,按照以下基準進行評價。將結果示於表1中。 ◎:液晶材料向液晶密封劑(硬化物)的寬度方向的進入(密封路徑)為0.1 mm以下 ○:密封路徑超過0.1 mm且為0.3 mm以下 △:密封路徑超過0.3 mm且為0.5 mm以下 ×:密封路徑超過0.5 mm (Inrush resistance) Using a dispenser (Shotmaster, manufactured by Musashi Engineering), the obtained liquid crystal sealant was formed into a 24 mm × 24 mm, 0.5 mm line width quadrilateral frame-shaped seal pattern (cross-sectional area 2500 μm 2 ) on a 40 mm × 45 mm glass substrate (RT-DM88-PIN, manufactured by EHC) on which a transparent electrode and an alignment film were previously formed. Furthermore, a 38 mm × 38 mm, 1 mm line width quadrilateral frame-shaped dummy seal pattern was formed around it using the liquid crystal sealant. Then, droplets of liquid crystal (MLC-3007; manufactured by Merck) (dropping amount 2.0 μl) were dripped into the frame of the frame-shaped seal pattern. Next, the paired glass substrates were bonded under reduced pressure in a manner perpendicular to the glass substrates formed with the frame-shaped sealing pattern and the dummy sealing pattern, and then bonded in an open atmosphere. The two bonded glass substrates were then kept in a light-shielding box for 1 minute, and then irradiated with 3000 mJ/ cm2 of light containing visible light (light with a wavelength of 370 nm to 450 nm), and then heated at 120°C for 1 hour to harden the seal, thereby obtaining a test piece. The interface between the sealing material and the liquid crystal was then observed using a polarizing microscope and evaluated according to the following criteria. The results are shown in Table 1. ◎: The penetration of the liquid crystal material into the liquid crystal sealant (cured material) in the width direction (sealing path diameter) is 0.1 mm or less ○: The sealing path diameter exceeds 0.1 mm and is 0.3 mm or less △: The sealing path diameter exceeds 0.3 mm and is 0.5 mm or less ×: The sealing path diameter exceeds 0.5 mm
(描繪性) 將所獲得的液晶密封劑填充至10 cc的注射器中,然後進行脫泡,繼而填充至分配器(點膠機(Shotmaster);武藏高科技(Musashi Engineering)公司製造)中。使用該分配器以每秒4 cm的速度塗佈於玻璃基板上來進行描繪。描繪性(塗佈性)是按照以下基準進行評價。 ○:無斷線部位及線變細部位 △:無斷線部位,但線變細部位有1個以上 ×:斷線部位有1個以上 (Drawing property) The obtained liquid crystal sealant was filled into a 10 cc syringe, degassed, and then filled into a dispenser (Shotmaster; manufactured by Musashi Engineering). The dispenser was used to draw on a glass substrate at a speed of 4 cm per second. Drawing property (drawing property) was evaluated according to the following criteria. ○: No broken line or thin line △: No broken line, but there are one or more thin line ×: There are one or more broken line
[表1]
如所述表1所示,液晶密封劑在包含所述通式(1)所表示的環化聚合性化合物(硬化性化合物(A-1))的情況下,耐內衝性或描繪性良好,進而所獲得的密封材的黏接強度均高,透濕性亦低(實施例1~實施例9)。藉由所述環化聚合性化合物的聚合物的結構,可實現以往特別難的高黏接強度及低透濕性的兼顧。As shown in Table 1, when the liquid crystal sealant contains the cyclopolymerizable compound (curable compound (A-1)) represented by the general formula (1), the intrusion resistance and the drawing property are good, and the obtained sealant has high adhesive strength and low moisture permeability (Examples 1 to 9). Due to the polymer structure of the cyclopolymerizable compound, it is possible to achieve both high adhesive strength and low moisture permeability, which was particularly difficult in the past.
相對於此,在使用與所述通式(1)不同的結構的硬化性化合物(A-3)及硬化性化合物(A-4)的情況下,黏接強度及低透濕性中的任一者的結果差(比較例1及比較例2)。In contrast, when the curable compound (A-3) and the curable compound (A-4) having structures different from those of the general formula (1) were used, the results of either the adhesive strength or the low moisture permeability were inferior (Comparative Examples 1 and 2).
再者,在實施例中,在相對於填料的總量,環化聚合性化合物的量為3質量%以上且300質量%以下的情況下,特別是耐內衝性容易變得良好(實施例1~實施例7)。認為液晶密封劑的黏度成為適度的範圍,在真空環境下的貼合時,液晶不易進入框狀密封圖案內。Furthermore, in the examples, when the amount of the cyclopolymerizable compound is 3 mass % or more and 300 mass % or less relative to the total amount of the filler, the inrush resistance is particularly likely to be good (Examples 1 to 7). It is believed that the viscosity of the liquid crystal sealant is within an appropriate range, and the liquid crystal is unlikely to enter the frame-shaped sealing pattern during lamination in a vacuum environment.
本申請案主張基於2023年3月7日提出申請的日本專利特願2023-034812號的優先權。該申請案說明書中記載的所有內容被引用至本申請案說明書中。 [產業上的可利用性] This application claims priority based on Japanese Patent Application No. 2023-034812 filed on March 7, 2023. All contents described in the specification of that application are incorporated herein by reference. [Industrial Applicability]
藉由本發明,提供一種能夠製作具有黏接強度及低透濕性的密封材的液晶密封劑以及使用其的液晶顯示面板及其製造方法。因此,在液晶顯示面板的製造領域中非常有用。The present invention provides a liquid crystal sealant capable of producing a sealant having strong adhesive strength and low moisture permeability, a liquid crystal display panel using the same, and a method for producing the same, and is therefore very useful in the field of manufacturing liquid crystal display panels.
無without
無without
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023-034812 | 2023-03-07 | ||
JP2023034812 | 2023-03-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202440694A true TW202440694A (en) | 2024-10-16 |
Family
ID=92675178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW113107820A TW202440694A (en) | 2023-03-07 | 2024-03-05 | Liquid crystal sealant, liquid crystal display panel using the same, and method for manufacturing the same |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW202440694A (en) |
WO (1) | WO2024185743A1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5642028B2 (en) * | 2011-07-06 | 2014-12-17 | 株式会社日本触媒 | Optical UV-curable resin composition, cured product, and display device |
JP7134640B2 (en) * | 2018-02-20 | 2022-09-12 | 株式会社日本触媒 | Photosensitive resin composition |
JP2023154283A (en) * | 2022-04-06 | 2023-10-19 | 株式会社レゾナック | Adhesive composition, adhesive film for circuit connection, circuit connection structure and method for manufacturing the same |
JP2024009452A (en) * | 2022-07-11 | 2024-01-23 | 株式会社日本触媒 | Active energy ray-curable resin composition and its cured product |
-
2024
- 2024-03-04 WO PCT/JP2024/008058 patent/WO2024185743A1/en active Application Filing
- 2024-03-05 TW TW113107820A patent/TW202440694A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2024185743A1 (en) | 2024-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI717470B (en) | Liquid crystal sealant and its hardened product, liquid crystal display panel and manufacturing method thereof | |
JPWO2011118191A1 (en) | Liquid crystal sealant, liquid crystal display panel manufacturing method using the same, and liquid crystal display panel | |
KR102797689B1 (en) | Photothermo-curable resin composition and liquid crystal sealant containing the same, and liquid crystal display panel and method for producing the same | |
TW202440694A (en) | Liquid crystal sealant, liquid crystal display panel using the same, and method for manufacturing the same | |
JP7238112B2 (en) | Liquid crystal sealant, liquid crystal display panel using the same, and method for manufacturing the same | |
JP7557607B2 (en) | Photocurable resin composition, liquid crystal sealant, liquid crystal display panel using the same, and method for producing the same | |
JP7536999B2 (en) | Liquid crystal sealant, method for producing liquid crystal display panel, and liquid crystal display panel | |
TWI879899B (en) | Sealant for liquid crystal dripping method and method for manufacturing liquid crystal display panel | |
JP7413511B2 (en) | Sealant for liquid crystal dripping method, manufacturing method of liquid crystal display panel, and liquid crystal display panel | |
JP7710095B2 (en) | Liquid crystal sealant, liquid crystal display panel manufacturing method, and liquid crystal display panel | |
TW202428666A (en) | Resin composition, liquid crystal sealant, liquid crystal display panel and manufacturing method thereof | |
TWI882101B (en) | Sealant for liquid crystal dripping method, method for manufacturing liquid crystal display panel, and liquid crystal display panel | |
TW202442732A (en) | Resin composition, liquid crystal sealant, and liquid crystal display panel using the same | |
WO2024204234A1 (en) | Resin composition, liquid crystal sealant, and liquid crystal display panel using same | |
JP2025021999A (en) | Sealing agent for liquid crystal dropping method, liquid crystal display panel using the same, and method for manufacturing liquid crystal display panel |