TW202440300A - Laminate molding system, tension assist system and laminated molding method - Google Patents
Laminate molding system, tension assist system and laminated molding method Download PDFInfo
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Abstract
在先前的積層成形系統中,存在有起因於載體膜之撓曲而導致位置偏離之問題。 本發明之積層成形系統具有:捲出裝置20,其在利用1對載體膜夾持被積層體之狀態下捲出載體膜;積層成形裝置10,其以將被積層體之至少單面與積層膜加以積層之方式,實施利用加壓部對被積層體進行加壓的積層成形步驟;捲取裝置30,其藉由捲取1對載體膜,將積層成形步驟後的被積層體自積層成形裝置10搬出;及張力輔助裝置11,其被配置在加壓部之捲出裝置20側與捲取裝置30側的至少一者,且暫時增強被配置在1對載體膜之下側之下側載體膜CFL的張力。 In the previous lamination forming system, there is a problem of positional deviation caused by the warping of the carrier film. The lamination forming system of the present invention has: a roll-out device 20, which rolls out the carrier film while the laminated body is clamped by a pair of carrier films; a lamination forming device 10, which performs a lamination forming step of pressurizing the laminated body by a pressurizing part in a manner that at least one side of the laminated body is laminated with the laminated film; a winding device 30 , which moves the laminated body after the lamination forming step out of the lamination forming device 10 by rolling up a pair of carrier films; and a tension auxiliary device 11, which is arranged on at least one of the roll-out device 20 side and the roll-up device 30 side of the pressurizing part, and temporarily enhances the tension of the carrier film CFL arranged under the pair of carrier films.
Description
本發明係關於一種,例如於表面具有凹凸的基板材料上積層填埋該凹凸之薄膜材的積層成形系統、張力輔助系統及積層成形方法。The present invention relates to a lamination forming system, a tension-assisted system and a lamination forming method for laminating a thin film material for filling the unevenness on a substrate material having unevenness on the surface.
近年來,在半導體基板或電子電路基板中,形成配線之配線層的多層化不斷發展。在如此多層配線基板中,有採用利用衝壓加工貼附有形成於層間之層間絕緣膜而加以形成的方法。因此,提議在形成如此電子電路的基板材料對作為層間絕緣膜之薄膜材進行積層的積層成形系統。專利文獻1揭示了如此之積層成形系統的一例。In recent years, the number of wiring layers forming wiring in semiconductor substrates or electronic circuit substrates has been increasing. In such multi-layer wiring substrates, there is a method of forming them by attaching interlayer insulating films formed between layers using a stamping process. Therefore, a lamination forming system is proposed for laminating a thin film material as an interlayer insulating film on a substrate material for forming such an electronic circuit. Patent document 1 discloses an example of such a lamination forming system.
專利文獻1所記載之積層成形系統,在使用積層裝置對積層成形體進行積層成形的積層成形系統中,在至少2台已準備的積層裝置中,至少1台積層裝置可更換地配置於供給裝置與回收裝置之間,而構成一系列的成形線。 [先前技術文獻] [專利文獻] The laminated forming system described in Patent Document 1 is a system for performing laminated forming on a laminated formed body using a laminated device, wherein at least one of at least two prepared laminated devices is replaceably arranged between a supply device and a recovery device to form a series of forming lines. [Prior Art Document] [Patent Document]
[專利文獻1]日本專利特開2022-15589號公報[Patent Document 1] Japanese Patent Publication No. 2022-15589
(發明所欲解決之問題)(Invent the problem you want to solve)
在專利文獻1所記載之積層裝置中,隔著被上下配置的載體膜而將被積層體向積層裝置進行搬入及搬出,但在搬送被積層體時載體膜發生撓曲,有起因於該撓曲而在積層裝置內於被積層體產生位置偏離之虞。In the lamination apparatus described in Patent Document 1, a laminate is carried in and out of the lamination apparatus via carrier films arranged above and below. However, the carrier film is warped when the laminate is carried, and there is a risk that the laminate may be displaced from its position in the lamination apparatus due to the warping.
本發明係鑒於上述情形而完成者,其目的在於抑制起因於載體膜之撓曲而導致被積層體的位置偏離,以進行高精度之積層成形。 (解決問題之技術手段) The present invention is completed in view of the above situation, and its purpose is to suppress the position deviation of the laminated body caused by the warping of the carrier film, so as to perform high-precision laminate forming. (Technical means to solve the problem)
一實施形態之積層成形系統係具有:捲出裝置,其捲出搬送被積層體的載體膜;積層成形裝置,其實施利用加壓部對前述被積層體進行加壓的積層成形步驟;捲取裝置,其藉由捲取前述載體膜而將前述積層成形步驟後的前述被積層體自前述積層成形裝置搬出;及張力輔助裝置,其被配置在前述積層成形裝置與前述捲出裝置之間,以及,前述積層成形裝置與前述捲取裝置之間的至少一者,且支撐前述載體膜的下表面;且前述張力輔助裝置被配置在前述加壓部與前述張力輔助裝置之間且不隔著構造物的位置。A lamination forming system in one embodiment comprises: a roll-out device for rolling out a carrier film for conveying a laminated body; a lamination forming device for performing a lamination forming step of pressurizing the laminated body by a pressurizing unit; a take-up device for taking up the carrier film and conveying the laminated body after the lamination forming step from the lamination forming device to a lamination forming unit; out; and a tension assisting device, which is arranged between the aforementioned lamination forming device and the aforementioned unwinding device, and at least one of the aforementioned lamination forming device and the aforementioned winding device, and supports the lower surface of the aforementioned carrier film; and the aforementioned tension assisting device is arranged between the aforementioned pressurizing portion and the aforementioned tension assisting device and is not separated by a structure.
一實施形態之張力輔助系統係與積層成形裝置組合者,該積層成形裝置係搬送被積層體,且以將前述被積層體之至少單面與積層膜加以積層之方式,實施利用加壓部對前述被積層體進行加壓的積層成形步驟;該張力輔助系統具有張力輔助裝置,該張力輔助裝置在前述被積層體停止在被設定於前述加壓部之停止位置的狀態下,在載置前述被積層體的前述載體膜中,以前述被積層體之搬送方向的張力在前述搬送方向的前後實質相同之方式,支撐前述載體膜的下側。One embodiment of the tension-assisting system is combined with a lamination forming device, which conveys a laminated body and performs a lamination forming step of pressurizing the laminated body by a pressurizing section in such a manner that at least one side of the laminated body is laminated with a laminate film; the tension-assisting system comprises a tension-assisting device, which, when the laminated body stops at a stop position set at the pressurizing section, supports the lower side of the carrier film on which the laminated body is carried in such a manner that the tension in the conveying direction of the laminated body is substantially the same before and after the conveying direction.
一實施形態之積層成形系統的被積層體之積層成形方法,其中,上述積層成形系統係具有:捲出裝置,其捲出搬送被積層體的載體膜;積層成形裝置,其以將前述被積層體之至少單面與積層膜加以積層之方式,實施利用加壓部對前述被積層體進行加壓的積層成形步驟;捲取裝置,其藉由捲取前述載體膜而將前述積層成形步驟後的前述被積層體自前述積層成形裝置搬出;上述積層成形方法係,在前述被積層體停止在被設定於前述加壓部之停止位置的狀態下,一邊支撐前述載體膜的下側,一邊對前述被積層體進行加壓。A method for forming a laminated body using a laminate forming system in an embodiment, wherein the laminate forming system comprises: a roll-out device for rolling out a carrier film for conveying the laminated body; a laminate forming device for laminating the laminated body by laminating at least one side of the laminated body with the laminate film, and performing a lamination process by pressurizing the laminated body using a pressurizing unit. forming step; a winding device, which moves the aforementioned laminated body after the aforementioned lamination forming step out of the aforementioned lamination forming device by winding the aforementioned carrier film; the aforementioned lamination forming method is that when the aforementioned laminated body stops at a stop position set in the aforementioned pressurizing part, the lower side of the aforementioned carrier film is supported while the aforementioned laminated body is pressurized.
在一實施形態之積層成形系統、張力輔助系統及積層成形方法中,在設置於加壓部附近的張力輔助裝置中,於被積層體被搬送至停止位置之後,藉由增加下側載體膜的張力而抑制下側載體膜的撓曲量。 (對照先前技術之功效) In a laminate forming system, a tension assisting system and a laminate forming method in one embodiment, in a tension assisting device disposed near a pressurizing portion, after the laminated body is transported to a stop position, the amount of bending of the lower carrier film is suppressed by increasing the tension of the lower carrier film. (Compared to the effect of the prior art)
根據一實施形態的積層成形系統、張力輔助系統及積層成形方法,可抑制起因於載體膜之撓曲而導致位置偏離,以進行高精度之積層成形。According to a lamination forming system, a tension assisting system and a lamination forming method in one embodiment, positional deviation caused by warping of a carrier film can be suppressed to perform high-precision lamination forming.
為了使說明更加明確化,因此對以下之記載及圖式適宜地加以省略及簡化。又,在各圖式中,對相同的要件賦予相同的符號,且根據需要而省略重複說明。In order to make the description more clear, the following description and drawings are appropriately omitted and simplified. In addition, in each drawing, the same elements are given the same symbols, and repeated descriptions are omitted as necessary.
(實施形態1) 實施形態1的積層成形系統1係具有積層成形裝置,該積層成形裝置係在利用1對載體膜夾持被積層體之狀態下搬送,以將被積層體之至少單面與積層膜加以積層之方式,實施利用加壓部對被積層體進行加壓的積層成形步驟。實施形態1的積層成形系統1係在將積層膜載置於被積層體之狀態下,利用載體膜夾持並進行搬送。又,在積層成形系統1中,將進行載體膜之供給的捲出裝置及進行載體膜之回收的捲取裝置與積層成形裝置組合為1個系統。並且,在實施形態1之積層成形系統1中,在將被積層體搬送至設定於積層成形裝置內之加壓部的停止位置時,藉由提高1對載體膜中下側載體膜之張力,而防止載體膜的撓曲。因此,以下,對具有載體膜之張力調整機構的積層成形系統1詳細地進行說明。 (Implementation Form 1) The lamination forming system 1 of Implementation Form 1 has a lamination forming device, which performs a lamination forming step of pressurizing the laminated body by a pressurizing unit in a state where the laminated body is sandwiched by a pair of carrier films and transported so that at least one side of the laminated body is laminated with the laminated film. The lamination forming system 1 of Implementation Form 1 sandwiches and transports the laminated body by a carrier film while the laminated film is placed on the laminated body. Furthermore, in the lamination forming system 1, a roll-out device for supplying a carrier film and a roll-up device for recovering a carrier film are combined with the lamination forming device into one system. Furthermore, in the lamination forming system 1 of the embodiment 1, when the laminated body is transported to the stop position of the pressurizing section set in the lamination forming device, the tension of the lower carrier film in a pair of carrier films is increased to prevent the carrier film from buckling. Therefore, the lamination forming system 1 having a carrier film tension adjustment mechanism is described in detail below.
圖1表示說明實施形態1之積層成形系統之概要的構成圖。圖1所示的構成圖,主要說明在積層成形系統1中暫時增加下側載體膜之張力之張力輔助裝置11的構成,而對積層成形系統1之具體的構成加以簡化。再者,在以下的說明中,關於積層在被積層體的積層膜,省略圖示。FIG1 is a schematic diagram showing a lamination forming system of embodiment 1. The diagram shown in FIG1 mainly shows the structure of a tension assisting device 11 for temporarily increasing the tension of the lower carrier film in the lamination forming system 1, and simplifies the specific structure of the lamination forming system 1. In the following description, the lamination film laminated on the laminated body is omitted from the diagram.
如圖1所示,積層成形系統1係相對於積層成形裝置10而組合有張力輔助裝置11及夾緊裝置12。又,在積層成形系統1中,為了在將已於被積層體WK1暫時放上積層膜者以1對載體膜夾著的狀態下,將其對積層成形裝置10進行搬入及搬出,而組合有供給載體膜的捲出裝置及捲取裝置。在圖1中,已顯示有捲出裝置中的下供給輥21、從動輥22、上供給輥23、從動輥24、載置台25。又,已顯示有捲取裝置中的下回收輥31、從動輥32、上回收輥33、從動輥34、回收台35。再者,在實施形態1的積層成形系統1中,利用載置台25使被積層體WK1與積層膜重疊。在以下的說明中,省略關於積層膜的說明,但實施形態1的積層成形系統1係被用於將積層膜積層在被積層體WK1者,該點並未改變。As shown in FIG1 , the lamination forming system 1 is combined with a tension assisting device 11 and a clamping device 12 with respect to the lamination forming device 10. In addition, in the lamination forming system 1, a roll-out device and a roll-up device for supplying a carrier film are combined in order to carry in and out of the lamination forming device 10 a laminated film temporarily placed on the laminated body WK1 in a state of being clamped by a pair of carrier films. FIG1 shows a lower supply roller 21, a driven roller 22, an upper supply roller 23, a driven roller 24, and a mounting table 25 in the roll-out device. In addition, the lower recovery roller 31, the driven roller 32, the upper recovery roller 33, the driven roller 34, and the recovery table 35 in the winding device are shown. Furthermore, in the lamination forming system 1 of the embodiment 1, the laminated body WK1 and the laminated film are overlapped by the mounting table 25. In the following description, the description of the laminated film is omitted, but the lamination forming system 1 of the embodiment 1 is used to laminate the laminated film on the laminated body WK1, and this point has not changed.
又,在圖1中,作為積層成形裝置10的構成,已顯示有上模101、上側加壓盤102、下模103、下側加壓盤104、衝柱105、加壓力產生裝置106。積層成形裝置10係藉由將上模101及下模103加以裝合而形成可將內部的空間維持在較外部更為減壓之減壓狀態的腔室。又,在上模101之與下模103對向的面設置有上側加壓盤102,在下側加壓盤104之與上模101對向的面配置有下側加壓盤104。下模103係構成為,藉由設置在下模103下側的液壓單元等加壓力產生裝置106推起衝柱105而接近上側加壓盤102側。即,上側加壓盤102及下模103係設置在前述腔室內,而成為對被積層體WK2施加壓力的加壓台。而且,積層成形裝置10係進行真空積層成形的真空積層成形裝置,該真空積層成形係一邊使腔室內為真空,一邊利用上側加壓盤102與下側加壓盤104對被積層體WK2進行加壓。即,在積層成形裝置10中,藉由上側加壓盤102、下側加壓盤104而構成,利用該加壓部對被積層體WK2進行加壓。又,在積層成形裝置10中,為了進行真空積層成形,亦可考慮將上模101與上側加壓盤102、以及下模103及下側加壓盤104作為加壓部。再者,上側加壓盤102及下側加壓盤104亦可分別作為可撓性薄片。又,在不進行真空積層成形之情形下,無需用於構成腔室的構造。又,加壓力產生裝置106亦可為伺服馬達,衝柱105亦可為滾珠螺桿。In FIG. 1 , as the structure of the lamination forming apparatus 10, an upper die 101, an upper pressure plate 102, a lower die 103, a lower pressure plate 104, a punch 105, and a pressure generating device 106 are shown. The lamination forming apparatus 10 is formed by assembling the upper die 101 and the lower die 103 to form a cavity that can maintain the inner space in a depressurized state that is more depressurized than the outer space. The upper pressure plate 102 is provided on the surface of the upper die 101 that faces the lower die 103, and the lower pressure plate 104 is provided on the surface of the lower pressure plate 104 that faces the upper die 101. The lower mold 103 is configured such that the punch 105 is pushed up by a pressure generating device 106 such as a hydraulic unit disposed on the lower side of the lower mold 103 and approaches the upper pressure plate 102. That is, the upper pressure plate 102 and the lower mold 103 are disposed in the aforementioned cavity and serve as a pressure stage for applying pressure to the laminated body WK2. Furthermore, the lamination forming apparatus 10 is a vacuum lamination forming apparatus for performing vacuum lamination forming, and the vacuum lamination forming is to pressurize the laminated body WK2 using the upper pressure plate 102 and the lower pressure plate 104 while making the cavity vacuum. That is, in the lamination forming apparatus 10, the upper pressure plate 102 and the lower pressure plate 104 are used to pressurize the laminated body WK2. In addition, in the lamination forming apparatus 10, in order to perform vacuum lamination forming, the upper mold 101 and the upper pressure plate 102, and the lower mold 103 and the lower pressure plate 104 can also be considered as the pressurizing part. Furthermore, the upper pressure plate 102 and the lower pressure plate 104 can also be used as flexible sheets, respectively. In addition, when vacuum lamination forming is not performed, the structure for forming the cavity is not required. Furthermore, the pressure generating device 106 may be a servo motor, and the plunger 105 may be a ball screw.
在實施形態1的積層成形系統1中,在載置台25中將被積層體WK1載置在下側載體膜CFL上。其後,藉由在被積層體WK1重疊上側載體膜CFU,而在利用下側載體膜CFL與上側載體膜CFU將被積層體WK1加以夾入之狀態下將被積層體WK1搬送至積層成形裝置10內。又,在圖1中,將被搬送至積層成形裝置10內之停止位置的被積層體表示為被積層體WK2。然後,在積層成形系統1中,藉由使下側載體膜CFL與上側載體膜CFU移動,利用積層成形裝置10將已在被積層體WK2積層有積層膜的積層體WK3搬出至回收台35。再者,積層在被積層體WK2的薄膜不限於上側載體膜CFU,只要為下側載體膜CFL與上側載體膜CFU之至少一者即可。In the lamination forming system 1 of the embodiment 1, the laminated body WK1 is placed on the lower carrier film CFL on the placing table 25. Then, by overlapping the upper carrier film CFU on the laminated body WK1, the laminated body WK1 is transported to the lamination forming apparatus 10 in a state where the laminated body WK1 is sandwiched between the lower carrier film CFL and the upper carrier film CFU. In FIG. 1 , the laminated body transported to the stop position in the laminated forming apparatus 10 is shown as the laminated body WK2. Then, in the lamination forming system 1, by moving the lower carrier film CFL and the upper carrier film CFU, the lamination forming device 10 carries out the lamination body WK3 on which the lamination film has been laminated to the collection station 35. Furthermore, the thin film laminated on the lamination body WK2 is not limited to the upper carrier film CFU, and it only needs to be at least one of the lower carrier film CFL and the upper carrier film CFU.
又,在實施形態1中,在搬送被積層體時,將自下供給輥21捲出的下側載體膜CFL以從動輥22及從動輥32加以輔助並利用下回收輥31進行捲取,並且,將自上供給輥23捲出的上側載體膜CFU以從動輥24及從動輥34加以輔助並利用上回收輥33進行捲取。Furthermore, in embodiment 1, when conveying the laminated body, the lower carrier film CFL rolled out from the lower supply roller 21 is assisted by the driven rollers 22 and 32 and taken up by the lower recovery roller 31, and the upper carrier film CFU rolled out from the upper supply roller 23 is assisted by the driven rollers 24 and 34 and taken up by the upper recovery roller 33.
然後,在積層成形裝置10中,使用張力輔助裝置11及夾緊裝置12而進行暫時增加下側載體膜CFL之張力的控制。此處,在圖1中,已顯示有控制積層成形系統1之整體的動作控制部CU。動作控制部CU控制載體膜的移動、積層成形裝置10中之加壓時間點與加壓力、張力輔助裝置11與夾緊裝置12的動作。具體的控制方法將於後敘述。Then, in the lamination forming apparatus 10, the tension auxiliary device 11 and the clamping device 12 are used to temporarily increase the tension of the lower carrier film CFL. Here, in FIG. 1, the motion control unit CU for controlling the entire lamination forming system 1 is shown. The motion control unit CU controls the movement of the carrier film, the time point and the pressure of the pressurization in the lamination forming apparatus 10, and the motion of the tension auxiliary device 11 and the clamping device 12. The specific control method will be described later.
在圖1所示之例中,張力輔助裝置11設置在積層成形裝置10與捲出裝置之間。更具體而言,張力輔助裝置11被配置在積層成形裝置10之加壓部與張力輔助裝置11之間且不隔著構造物的位置。又,夾緊裝置12被設置在捲取裝置與積層成形裝置10之間。更具體而言,夾緊裝置12被配置在積層成形裝置10之加壓部與夾緊裝置12之間且不隔著構造物的位置。此處,在圖1所示的例中,積層成形裝置10的加壓部係具有由上模101及上側加壓盤102、與下模103及下側加壓盤104構成之加壓機構的腔室。又,夾緊裝置12係隔著積層成形裝置10的加壓部而配置在張力輔助裝置11的相反側。再者,亦可取替夾緊裝置12而設置與張力輔助裝置11成對的張力輔助裝置,亦可取替夾緊裝置12而藉由停止下回收輥31的旋轉來進行下側載體膜的固定。In the example shown in FIG. 1 , the tension assisting device 11 is provided between the lamination forming device 10 and the unwinding device. More specifically, the tension assisting device 11 is disposed between the pressurizing portion of the lamination forming device 10 and the tension assisting device 11 and at a position where no structure is interposed therebetween. Furthermore, the clamping device 12 is provided between the unwinding device and the lamination forming device 10. More specifically, the clamping device 12 is disposed between the pressurizing portion of the lamination forming device 10 and the clamping device 12 and at a position where no structure is interposed therebetween. Here, in the example shown in FIG. 1 , the pressurizing section of the lamination forming device 10 is a chamber having a pressurizing mechanism composed of an upper mold 101 and an upper pressurizing plate 102, and a lower mold 103 and a lower pressurizing plate 104. Furthermore, the clamping device 12 is arranged on the opposite side of the tension assisting device 11 across the pressurizing section of the lamination forming device 10. Furthermore, a tension assisting device that is paired with the tension assisting device 11 may be provided instead of the clamping device 12, and the lower carrier film may be fixed by stopping the rotation of the lower recovery roller 31 instead of the clamping device 12.
然後,在積層成形系統1中,根據被積層體WK2到達被設定在加壓部的停止位置,動作控制部CU進行指示,以藉由夾緊裝置12而夾入下側載體膜CFL及上側載體膜CFU。其後,在積層成形系統1中,動作控制部CU進行指示,以於張力輔助裝置11增加下側載體膜的張力。藉此,在積層成形系統1中,在對被積層體WK2進行加壓之前,增加下側載體膜CFL的張力而抑制下側載體膜CFL的撓曲。Then, in the laminate forming system 1, according to the arrival of the laminated body WK2 at the stop position set in the pressurizing part, the motion control unit CU instructs the clamping device 12 to clamp the lower carrier film CFL and the upper carrier film CFU. Thereafter, in the laminate forming system 1, the motion control unit CU instructs the tension assisting device 11 to increase the tension of the lower carrier film. Thus, in the laminate forming system 1, before pressurizing the laminated body WK2, the tension of the lower carrier film CFL is increased to suppress the bending of the lower carrier film CFL.
此處,對於張力輔助裝置11,更詳細地說明構成及動作。再者,張力輔助裝置11亦可與動作控制部CU一起作為積層成形系統1的張力輔助系統而與積層成形系統1分開地被供給。又,對於張力輔助裝置11,可考慮有複數個形態,但在以下的說明中,對2個構成例進行說明。Here, the structure and operation of the tension assisting device 11 are described in more detail. Furthermore, the tension assisting device 11 can also be supplied separately from the lamination forming system 1 together with the operation control unit CU as a tension assisting system of the lamination forming system 1. Moreover, although the tension assisting device 11 can have a plurality of forms, two structure examples are described in the following description.
圖2表示說明實施形態1之張力輔助裝置11之第1構成及第1動作例的圖。如圖2所示,在第1例中,張力輔助裝置11具有第1輥111、第2輥112、第3輥113。Fig. 2 is a diagram for explaining a first configuration and a first operation example of the tension assisting device 11 of the embodiment 1. As shown in Fig. 2 , in the first example, the tension assisting device 11 includes a first roller 111, a second roller 112, and a third roller 113.
第1輥111為被配置在捲出裝置側的從動輥。第2輥112為被配置在捲取裝置側的從動輥。第3輥113為使自第1輥111被輸送至第2輥112之下側載體膜CFL繞道至較被積層體WK1之搬送高度更下側的輥。再者,實施形態1中被積層體WK1的搬送高度可規定為將第1輥111之圓的最高位置與第2輥112之圓的最高位置加以連結的直線。在第1構成例中,第3輥113在被積層體WK1的搬送時作為從動輥而進行動作,在增加下側載體膜CFL之張力的張力輔助動作時,其作為朝向將下側載體膜CFL往與被積層體WK1之搬送方向相反的方向拉伸之側的旋轉方向旋轉的驅動輥而進行動作。在圖2所示的例中,表示以下態樣:藉由在張力輔助動作時朝逆時針產生驅動力,而第3輥113將下側載體膜CFL往與搬送方向相反的方向拉伸,藉此提高下側載體膜CFL之張力。再者,第3輥113的動作藉由動作控制部CU而被控制。The first roller 111 is a driven roller disposed on the unwinding device side. The second roller 112 is a driven roller disposed on the winding device side. The third roller 113 is a roller that allows the carrier film CFL conveyed from the first roller 111 to the lower side of the second roller 112 to be detoured to a lower side than the conveying height of the laminated body WK1. Furthermore, in the first embodiment, the conveying height of the laminated body WK1 can be defined as a straight line connecting the highest position of the circle of the first roller 111 and the highest position of the circle of the second roller 112. In the first configuration example, the third roller 113 acts as a driven roller when the laminate WK1 is transported, and acts as a driving roller that rotates in a rotation direction that stretches the lower carrier film CFL in a direction opposite to the transport direction of the laminate WK1 during a tension assisting action to increase the tension of the lower carrier film CFL. In the example shown in FIG. 2 , the following state is shown: by generating a driving force counterclockwise during the tension assisting action, the third roller 113 stretches the lower carrier film CFL in a direction opposite to the transporting direction, thereby increasing the tension of the lower carrier film CFL. Furthermore, the action of the third roller 113 is controlled by the action control unit CU.
接著,圖3表示說明實施形態1之張力輔助裝置11的第2構成及第2動作例之圖。如圖3所示,在第2例中,張力輔助裝置11亦具有第1輥111、第2輥112、第3輥113。Next, Fig. 3 shows a diagram for explaining a second configuration and a second operation example of the tension assisting device 11 of the embodiment 1. As shown in Fig. 3, in the second example, the tension assisting device 11 also has a first roller 111, a second roller 112, and a third roller 113.
在圖3所示的第2構成例中,第1輥111係被配置在積層成形裝置10之捲出裝置側(例如,前段)的從動輥。第2輥112係被配置在積層成形裝置10之捲取裝置側(例如,後段)的從動輥。第3輥113係使自第1輥111被輸送至第2輥112之下側載體膜CFL繞道至較被積層體WK1之搬送高度更下側的輥。在第2構成例中,第3輥113在被積層體WK1搬送時作為從動輥而進行動作,在增加下側載體膜CFL之張力的張力輔助動作時,其藉由將下側載體膜CFL拉伸至較將被積層體WK1搬入至積層成形裝置10內之搬入動作時的搬送位置更下側,而提高下側載體膜CFL的張力。再者,第3輥113的動作藉由動作控制部CU而被控制。In the second configuration example shown in FIG3 , the first roller 111 is a driven roller disposed on the unwinding device side (e.g., the front section) of the laminate forming device 10. The second roller 112 is a driven roller disposed on the winding device side (e.g., the rear section) of the laminate forming device 10. The third roller 113 is a roller that allows the carrier film CFL conveyed from the first roller 111 to the lower side of the second roller 112 to detour to a lower side than the conveying height of the laminated body WK1. In the second configuration example, the third roller 113 acts as a driven roller when the laminated body WK1 is transported, and in the tension-assisting action of increasing the tension of the lower carrier film CFL, the tension of the lower carrier film CFL is increased by stretching the lower carrier film CFL to a position lower than the transport position during the transport action of transporting the laminated body WK1 into the laminate forming apparatus 10. The action of the third roller 113 is controlled by the action control unit CU.
接著,圖4表示說明實施形態1之張力輔助裝置11的第3構成及第3動作例之圖。如圖4所示,在第3構成例中,張力輔助裝置11亦具有第1輥111、第2輥112、第3輥113。Next, Fig. 4 shows a diagram for explaining a third configuration and a third operation example of the tension assisting device 11 of the embodiment 1. As shown in Fig. 4 , in the third configuration example, the tension assisting device 11 also has a first roller 111, a second roller 112, and a third roller 113.
並且,在第3構成例中,第1輥111係被配置在積層成形裝置10之捲出裝置側(例如,前段)的從動輥。第2輥112係被配置在積層成形裝置10之捲取裝置側(例如,後段)的從動輥。第3輥113係沿著以輥旋轉中心點為中心之圓弧進行移動的從動輥。在第3構成例中,第3輥113在增加下側載體膜CFL之張力的張力輔助動作時,沿著以輥旋轉中心點為中心的圓弧而往與被積層體搬送方向相反的方向移動。藉由如此之第3輥113的移動,在第3構成例中,藉由拉伸下側載體膜CFL而提高下側載體膜CFL的張力。再者,第3輥113的動作藉由動作控制部CU而被控制。Furthermore, in the third configuration example, the first roller 111 is a driven roller disposed on the unwinding device side (e.g., the front section) of the laminate forming device 10. The second roller 112 is a driven roller disposed on the winding device side (e.g., the rear section) of the laminate forming device 10. The third roller 113 is a driven roller that moves along an arc centered on the roller rotation center point. In the third configuration example, the third roller 113 moves in a direction opposite to the conveying direction of the laminated body along an arc centered on the roller rotation center point during the tension assisting action of increasing the tension of the lower carrier film CFL. By the movement of the third roller 113, in the third configuration example, the tension of the lower carrier film CFL is increased by stretching the lower carrier film CFL. The movement of the third roller 113 is controlled by the movement control unit CU.
接著,圖5表示說明實施形態1之張力輔助裝置11的第4構成及第4動作例之圖。如圖5所示,在第4構成例中,張力輔助裝置11亦具有第1輥111、第2輥112、第3輥113。Next, Fig. 5 shows a diagram for explaining a fourth configuration and a fourth operation example of the tension assisting device 11 of the embodiment 1. As shown in Fig. 5 , in the fourth configuration example, the tension assisting device 11 also has a first roller 111, a second roller 112, and a third roller 113.
並且,在第4構成例中,第1輥111係被配置在積層成形裝置10之捲出裝置側(例如,前段)的從動輥。第2輥112係被配置在積層成形裝置10之捲取裝置側(例如,後段)的從動輥。第3輥113係在與鉛垂軸VX具有角度θ之方向上直線地移動的從動輥。此處,角度θ係為了提高下側載體膜CFL的張力,因而較佳為90°≦θ≦270°的範圍。在第4構成例中,第3輥113在增加下側載體膜CFL之張力的張力輔助動作時往與鉛垂軸VX具有角度θ之方向直線地移動。藉由如此之第3輥113的移動,在第4構成例中,藉由拉伸下側載體膜CFL而提高下側載體膜CFL的張力。再者,第3輥113的動作藉由動作控制部CU而被控制。Furthermore, in the fourth configuration example, the first roller 111 is a driven roller disposed on the unwinding device side (e.g., the front section) of the laminate forming device 10. The second roller 112 is a driven roller disposed on the winding device side (e.g., the rear section) of the laminate forming device 10. The third roller 113 is a driven roller that moves linearly in a direction having an angle θ with the vertical axis VX. Here, the angle θ is for increasing the tension of the lower carrier film CFL, and is preferably in the range of 90°≦θ≦270°. In the fourth configuration example, the third roller 113 moves linearly in a direction having an angle θ with the lead-vertical axis VX during the tension-assisting action of increasing the tension of the lower carrier film CFL. By such movement of the third roller 113, in the fourth configuration example, the tension of the lower carrier film CFL is increased by stretching the lower carrier film CFL. Furthermore, the action of the third roller 113 is controlled by the action control unit CU.
再者,在圖2及圖3中,對使用3根輥的張力輔助裝置11進行說明,但在張力輔助裝置11中,用於增強下側載體膜CFL之張力的輥至少有1根即可。又,輥的支撐形態可為單側支撐,可為兩端支撐,可自上部懸吊支撐,亦可以通過橫樑之方式被支撐。即,輥的支撐形態無特別限定。又,在圖2所示之張力輔助裝置11的構成中,發揮驅動力的輥亦可為第1輥111、第2輥112中的至少1者。Furthermore, in FIG. 2 and FIG. 3, the tension auxiliary device 11 using three rollers is described, but in the tension auxiliary device 11, at least one roller for enhancing the tension of the lower carrier film CFL is sufficient. In addition, the supporting form of the roller can be single-sided support, can be two-end support, can be suspended from the top, and can also be supported by a crossbeam. That is, the supporting form of the roller is not particularly limited. In the structure of the tension auxiliary device 11 shown in FIG. 2, the roller that exerts the driving force can also be at least one of the first roller 111 and the second roller 112.
又,構成張力輔助裝置11之3根輥的直徑,可為全部相同的直徑、亦可至少有1根不同。作為3根輥之直徑的一例,第1輥111與第2輥112具有相同的直徑,第3輥113具有其他輥以下的直徑。進一步更佳為,將第1輥111與第2輥112之直徑設為第3輥113之直徑的0.2倍~1.9倍。藉由設為如此之構成,可提高省空間性。Furthermore, the diameters of the three rollers constituting the tension assisting device 11 may all be the same diameter, or at least one roller may be different. As an example of the diameters of the three rollers, the first roller 111 and the second roller 112 have the same diameter, and the third roller 113 has a diameter smaller than the other rollers. More preferably, the diameters of the first roller 111 and the second roller 112 are set to 0.2 to 1.9 times the diameter of the third roller 113. By setting such a structure, space saving can be improved.
又,對構成張力輔助裝置11之3根輥的原材料,並無特別限制,可考慮金屬、樹脂、橡膠等。又,在構成張力輔助裝置11之3根輥中至少1根,亦可在表面塗布或貼附防滑材。進而,亦可對構成張力輔助裝置11的3根輥附加調溫功能。調溫功能較佳為加熱或冷卻輥者,但更佳為冷卻。Furthermore, there is no particular limitation on the raw materials of the three rollers constituting the tension assisting device 11, and metal, resin, rubber, etc. can be considered. Furthermore, at least one of the three rollers constituting the tension assisting device 11 can also be coated with cloth or attached with anti-slip material on the surface. Furthermore, the three rollers constituting the tension assisting device 11 can also be provided with a temperature control function. The temperature control function is preferably a heating or cooling roller, and more preferably a cooling roller.
此處,在實施形態1之積層成形系統1中,在進行下側載體膜CFL的張力輔助動作時,動作控制部CU進行如下的動作。在無夾緊裝置12之情形下,動作控制部CU在被積層體WK2停止在加壓部之加壓位置的狀態下向張力輔助裝置11給予提高下側載體膜CFL之張力的指示。又,當有夾緊裝置12時,動作控制部CU在被積層體WK1停止在加壓部之加壓位置,並且,藉由夾緊裝置12而固定有1對載體膜的狀態下,向張力輔助裝置11給予提高下側載體膜CFL之張力的指示。在以下的說明中,對具有夾緊裝置12之狀態之積層成形系統1的動作進行說明。Here, in the lamination forming system 1 of the embodiment 1, when the tension assisting action of the lower carrier film CFL is performed, the action control unit CU performs the following action. In the absence of the clamping device 12, the action control unit CU gives an instruction to the tension assisting device 11 to increase the tension of the lower carrier film CFL when the laminated body WK2 stops at the pressurizing position of the pressurizing unit. In addition, when the clamping device 12 is present, the action control unit CU gives an instruction to the tension assisting device 11 to increase the tension of the lower carrier film CFL when the laminated body WK1 stops at the pressurizing position of the pressurizing unit and a pair of carrier films are fixed by the clamping device 12. In the following description, the operation of the layered forming system 1 in a state with the clamping device 12 is described.
圖6表示說明實施形態1之積層成形系統1之動作的流程圖。再者,以下說明之積層成形系統1之動作係根據動作控制部CU的指示而進行。Fig. 6 is a flow chart for explaining the operation of the multilayer forming system 1 according to the embodiment 1. The operation of the multilayer forming system 1 described below is performed according to the instruction of the operation control unit CU.
如圖6所示,積層成形系統1根據被積層體WK1被載置於載置台25而開始其後的動作(步驟S1)。根據在步驟S1中將被積層體WK1載置於載置台25,動作控制部CU向各輥加以指示,使下供給輥21及上供給輥23捲出1對載體膜,且下回收輥31及上回收輥33捲取1對載體膜,藉此,被積層體WK1被搬入至積層成形裝置10(步驟S2)。然後,繼續步驟S2的搬入動作,直到載體膜之捲出量達到規定量為止,根據載體膜的捲出量達到規定量,藉由指示下供給輥21、上供給輥23、下回收輥31及上回收輥33,以停止載體膜之捲出,而停止被積層體WK1的搬送動作(步驟S3、S4)。藉此,被積層體WK1成為被放置在停止位置的被積層體WK2。As shown in FIG6 , the lamination forming system 1 starts the subsequent operation (step S1) when the lamination object WK1 is placed on the stage 25. When the lamination object WK1 is placed on the stage 25 in step S1, the operation control unit CU instructs each roller to roll out a pair of carrier films by the lower supply roller 21 and the upper supply roller 23, and to roll up a pair of carrier films by the lower recovery roller 31 and the upper recovery roller 33, thereby carrying the lamination object WK1 into the lamination forming apparatus 10 (step S2). Then, the carrying-in action of step S2 is continued until the unwinding amount of the carrier film reaches the specified amount. When the unwinding amount of the carrier film reaches the specified amount, the lower supply roller 21, the upper supply roller 23, the lower recovery roller 31 and the upper recovery roller 33 are instructed to stop unwinding the carrier film, and the conveying action of the stacked layer WK1 is stopped (steps S3 and S4). Thus, the stacked layer WK1 becomes the stacked layer WK2 placed at the stop position.
其後,動作控制部CU指示夾緊裝置12夾緊載體膜(步驟S5)。其後,動作控制部CU指示張力輔助裝置11進行將下側載體膜CFL捲回的張力輔助動作(步驟S6)。又,動作控制部CU繼續步驟S6的張力輔助動作,直至張力輔助裝置11之下側載體膜CFL的捲回量達到規定量為止(步驟S7)。並且,藉由下側載體膜CFL的捲回量達到規定量,動作控制部CU指示積層成形裝置10實施真空積層成形加工(步驟S8)。Thereafter, the action control unit CU instructs the clamping device 12 to clamp the carrier film (step S5). Thereafter, the action control unit CU instructs the tension assisting device 11 to perform a tension assisting action to roll back the lower carrier film CFL (step S6). Furthermore, the action control unit CU continues the tension assisting action of step S6 until the roll-back amount of the lower carrier film CFL by the tension assisting device 11 reaches a prescribed amount (step S7). Furthermore, when the roll-back amount of the lower carrier film CFL reaches a prescribed amount, the action control unit CU instructs the lamination forming device 10 to perform vacuum lamination forming processing (step S8).
在步驟S8的真空積層形成加工中進行:腔室封閉,其關閉上模101與下模103;真空抽取,其使封閉後的腔室內成為真空;積層成形加工,其加壓被積層體WK2;真空解除,其解除腔室內的真空;及腔室開放,其打開上模101與下模103。其後,動作控制部CU根據在S1中於載置台25已載置有被積層體WK1,而動作控制部CU向各輥指示,以使下供給輥21及上供給輥23捲出1對載體膜,且下回收輥31及上回收輥33捲取1對載體膜,藉此將被積層體WK2自積層成形裝置10搬出(步驟S9)。In the vacuum lamination forming process of step S8, the following steps are performed: chamber closing, which closes the upper mold 101 and the lower mold 103; vacuum extraction, which makes the closed chamber a vacuum; lamination forming processing, which pressurizes the laminated body WK2; vacuum release, which releases the vacuum in the chamber; and chamber opening, which opens the upper mold 101 and the lower mold 103. Thereafter, based on the fact that the laminated body WK1 has been placed on the loading table 25 in S1, the action control unit CU instructs each roller to make the lower supply roller 21 and the upper supply roller 23 roll out a pair of carrier films, and the lower recovery roller 31 and the upper recovery roller 33 roll up a pair of carrier films, thereby moving the laminated body WK2 out of the lamination forming device 10 (step S9).
接著,對張力輔助裝置11的詳細配置進行說明。於此,圖7表示實施形態1之積層成形系統之具體的構成圖。如圖7所示,實施形態1之積層成形系統1具有積層成形裝置10、捲出裝置20、捲取裝置30。在積層成形裝置10中組裝有上模101、上側加壓盤102、下模103、下側加壓盤104。又,在圖7所示的例中,張力輔助裝置11及夾緊裝置12組裝在積層成形裝置10。在捲出裝置20中組裝有下供給輥21、從動輥22、上供給輥23、從動輥24、載置台25。在捲取裝置30中組裝有下回收輥31、從動輥32、上回收輥33、從動輥34、回收台35。再者,組裝於各裝置中的構成為實際組裝之構造的一部分。又,在圖7中,雖然未明示動作控制部CU,但動作控制部CU可組裝在積層成形裝置10內,亦可組裝在與積層成形裝置10、捲出裝置20、捲取裝置30不同的框體中。Next, the detailed configuration of the tension assisting device 11 is described. Here, FIG7 shows a specific configuration diagram of the lamination forming system of the embodiment 1. As shown in FIG7, the lamination forming system 1 of the embodiment 1 has a lamination forming device 10, a roll-out device 20, and a roll-up device 30. An upper mold 101, an upper pressure plate 102, a lower mold 103, and a lower pressure plate 104 are assembled in the lamination forming device 10. Furthermore, in the example shown in FIG7, the tension assisting device 11 and the clamping device 12 are assembled in the lamination forming device 10. The unwinding device 20 is assembled with a lower feed roller 21, a driven roller 22, an upper feed roller 23, a driven roller 24, and a loading table 25. The take-up device 30 is assembled with a lower recovery roller 31, a driven roller 32, an upper recovery roller 33, a driven roller 34, and a recovery table 35. Furthermore, the structure assembled in each device is a part of the structure actually assembled. In addition, in FIG. 7, although the motion control unit CU is not explicitly shown, the motion control unit CU can be assembled in the lamination forming device 10, and can also be assembled in a frame different from the lamination forming device 10, the unwinding device 20, and the take-up device 30.
而且,如圖7所示,在積層成形系統1中,為了儘量縮短用於搬送之載體膜的長度,而將積層成形裝置10、捲出裝置20、捲取裝置30進行緊密地配置。因此,張力輔助裝置11及夾緊裝置12被組裝在積層成形裝置10的上模101及下模103之間的狹窄空間。其中,上模101為固定模,下模103為可動模。因此,若考量上模101與下模103之間的空間時,則張力輔助裝置11理想係藉由螺栓等而緊固在上模101。在圖7中,表示組裝有張力輔助裝置11及夾緊裝置12之部分的放大圖。Moreover, as shown in FIG. 7 , in the lamination forming system 1, in order to shorten the length of the carrier film used for conveying as much as possible, the lamination forming device 10, the unwinding device 20, and the winding device 30 are closely arranged. Therefore, the tension assisting device 11 and the clamping device 12 are assembled in the narrow space between the upper mold 101 and the lower mold 103 of the lamination forming device 10. Among them, the upper mold 101 is a fixed mold, and the lower mold 103 is a movable mold. Therefore, considering the space between the upper mold 101 and the lower mold 103, the tension assisting device 11 is ideally fastened to the upper mold 101 by bolts or the like. FIG. 7 shows an enlarged view of a portion where the tension assisting device 11 and the clamping device 12 are assembled.
在積層成形裝置10中,附屬於下模103而設置有閘門107,藉由使具備閘門107之下模103上升而構成腔室。而且,在腔室被構成時,1對載體膜成為被上模101與閘門107夾入的狀態。其後,在積層成形裝置10中,藉由使下模103上升而對被積層體WK2進行加壓。由於進行如此之加壓動作,因此張力輔助裝置11需要保持於不與最大上升後之下模103接觸的高度,且保持於較由載體膜構成之被積層體之搬送位置更低的位置。在該情形下,藉由將張力輔助裝置11設為圖2所示的第1構成例,而可抑制張力輔助裝置11之上下方向的高度。即,在張力輔助裝置11的第1構成例中,有可設置在狹窄之位置的優點。另一方面,在將張力輔助裝置11設為第2構成例之情形下,雖然需要使第3輥113上下移動的空間,但由於不需要旋轉方向的驅動力,因此有可簡化張力輔助裝置11之構成的優點。In the lamination molding apparatus 10, a gate 107 is provided in conjunction with the lower mold 103, and a cavity is formed by raising the lower mold 103 equipped with the gate 107. When the cavity is formed, a pair of carrier films are sandwiched by the upper mold 101 and the gate 107. Thereafter, in the lamination molding apparatus 10, the laminated body WK2 is pressurized by raising the lower mold 103. Since such a pressurizing action is performed, the tension assisting device 11 needs to be maintained at a height that does not contact the lower mold 103 after the maximum rise, and is maintained at a position lower than the conveying position of the laminated body composed of the carrier film. In this case, by setting the tension assisting device 11 to the first configuration example shown in FIG. 2 , the height of the tension assisting device 11 in the vertical direction can be suppressed. That is, in the first configuration example of the tension assisting device 11, there is an advantage that it can be set in a narrow position. On the other hand, when the tension assisting device 11 is set to the second configuration example, although a space is required for the third roller 113 to move up and down, since a driving force in the rotational direction is not required, there is an advantage that the configuration of the tension assisting device 11 can be simplified.
又,對於夾緊裝置12,亦設為相對於設置在下側載體膜CFL之下側的工作台而自上側載體膜CFU之上側按壓載體膜之構成的夾緊裝置12,藉此而可將夾緊裝置12設置在上模101與上模載體膜CFU之間的狹窄空間。Furthermore, the clamping device 12 is also configured to press the carrier film from the upper side of the upper carrier film CFU relative to the workbench disposed below the lower carrier film CFL, thereby enabling the clamping device 12 to be disposed in the narrow space between the upper mold 101 and the upper mold carrier film CFU.
再者,在圖7中,已顯示有於捲出裝置20設置抑制1對載體膜之工作台及夾緊裝置26的例,但藉由設置工作台及夾緊裝置26,而可實現張力輔助裝置11進行張力輔助動作時的第3輥113之驅動力的減低。7, there is shown an example in which a workbench and a clamping device 26 for suppressing a pair of carrier films are provided in the unwinding device 20. However, by providing the workbench and the clamping device 26, the driving force of the third roller 113 can be reduced when the tension assisting device 11 performs the tension assisting action.
根據上述說明,在實施形態1的積層成形系統1中,藉由使用張力輔助裝置11,而可抑制下側載體膜CFL的撓曲。此時,藉由將張力輔助裝置11配置在與加壓部之間不隔著其他構造物的位置(例如,加壓部的正前方位置),而可有效地向下側載體膜CFL施加張力。According to the above description, in the lamination forming system 1 of the embodiment 1, the bending of the lower carrier film CFL can be suppressed by using the tension assisting device 11. At this time, by arranging the tension assisting device 11 at a position where there is no other structure between the tension assisting device 11 and the pressurizing part (for example, a position directly in front of the pressurizing part), tension can be effectively applied to the lower carrier film CFL.
此處,載體膜大多為PET(聚對苯二甲酸乙二酯樹脂)等樹脂膜。在如此之樹脂膜中,由於藉由張力產生伸長,因此如上所述,藉由在儘量接近加壓部之位置設置張力輔助裝置11,而可有效地向下側載體膜CFL施加張力。此處,構成張力輔助裝置11之輥中最接近加壓部之輥的表面與加壓部的張力輔助裝置側之端部的距離較佳為500 mm以內,若為100 mm以內更佳。Here, the carrier film is mostly a resin film such as PET (polyethylene terephthalate resin). In such a resin film, since elongation is generated by tension, as described above, by setting the tension auxiliary device 11 as close to the pressurizing part as possible, tension can be effectively applied to the lower carrier film CFL. Here, the distance between the surface of the roller closest to the pressurizing part among the rollers constituting the tension auxiliary device 11 and the end of the tension auxiliary device side of the pressurizing part is preferably within 500 mm, and more preferably within 100 mm.
又,藉由在隔著加壓部而與張力輔助裝置11對向的位置設置夾緊裝置12,而可使成為張力之起點的點較下回收輥31或從動輥32更接近加壓部側,因此向下側載體膜CFL附加張力的效率進一步提高。Furthermore, by providing the clamping device 12 at a position opposite to the tension assisting device 11 across the pressurizing portion, the starting point of the tension can be made closer to the pressurizing portion side than the lower recovery roller 31 or the driven roller 32, thereby further improving the efficiency of adding tension to the lower carrier film CFL.
因此,藉由如積層成形系統1般,由張力輔助裝置11抑制下側載體膜CFL的撓曲,而可提高被積層體WK2的位置精度,且提高積層成形的精度。Therefore, by suppressing the deflection of the lower carrier film CFL by the tension assist device 11 as in the lamination forming system 1, the position accuracy of the laminated body WK2 can be improved, and the accuracy of lamination forming can be improved.
此處,圖8表示說明下側載體膜CFL之撓曲的圖,對下側載體膜CFL的撓曲詳細地進行說明。在圖8中,上圖為表示說明不使用張力輔助裝置11之比較例中下側載體膜CFL之撓曲的圖,下圖為表示說明具有張力輔助裝置11之實施形態1的積層成形系統1中下側載體膜CFL之撓曲的圖。又,在圖8中,表示實施形態1之積層成形系統1及比較例之積層成形系統兩者皆具有設置在捲出裝置20側之夾緊裝置26的例。Here, FIG8 shows a diagram for explaining the bending of the lower carrier film CFL, and explains the bending of the lower carrier film CFL in detail. In FIG8, the upper diagram shows the bending of the lower carrier film CFL in the comparative example without using the tension assisting device 11, and the lower diagram shows the bending of the lower carrier film CFL in the lamination forming system 1 of the embodiment 1 having the tension assisting device 11. In addition, FIG8 shows an example in which both the lamination forming system 1 of the embodiment 1 and the lamination forming system of the comparative example have a clamping device 26 provided on the side of the unwinding device 20.
如圖8之上圖所示,在比較例的積層成形系統中,已到達預先所設定之停止位置的被積層體WK2的中心位置CENT與作為薄膜搬送來源側之支點的工作台之端部的距離L1,較中心位置CENT與作為薄膜搬送目的地側之支點的工作台之端部的距離L0長得多。即,在比較例的積層成形系統中,L0<L1。因此,在比較例的積層成形系統中,由於到達停止位置之被積層體WK2的中心位置與距離L0、L1的平衡,使被積層體WK2大幅傾斜,而產生被積層體WK2的位置偏離。又,在圖8中,將比較例之積層成形系統中之最大撓曲量表示為DL0。As shown in the upper figure of FIG. 8 , in the comparative example lamination forming system, the distance L1 between the center position CENT of the laminated body WK2 that has reached the preset stop position and the end of the workbench that serves as the fulcrum on the film conveying source side is much longer than the distance L0 between the center position CENT and the end of the workbench that serves as the fulcrum on the film conveying destination side. That is, in the comparative example lamination forming system, L0<L1. Therefore, in the comparative example lamination forming system, due to the balance between the center position of the laminated body WK2 that has reached the stop position and the distances L0 and L1, the laminated body WK2 is greatly tilted, resulting in a positional deviation of the laminated body WK2. In addition, in FIG. 8 , the maximum bending amount in the multilayer forming system of the comparative example is represented as DL0.
另一方面,在圖8之下圖所示之實施形態1的積層成形系統1中,藉由將張力輔助裝置11配置在腔室附近,被積層體WK2的中心位置CENT與作為薄膜搬送來源側之支點的張力輔助裝置11之最接近腔室位置的第2輥112之端部的距離L2係,和中心位置CENT與作為薄膜搬送目的地側之支點的工作台之端部的距離L0大致相同的距離。藉此,由於被積層體WK2之中心位置CENT到達以下位置,即,中心位置CENT與薄膜搬送來源側之支點、以及中心位置CENT與薄膜搬送目的地側之支點兩者的中心,因此被積層體WK2的傾斜被抑制。並且,載置被積層體WK2之下側載體膜CFL的最大撓曲量亦成為較DL0更小的DL1。On the other hand, in the lamination forming system 1 of the embodiment 1 shown in the lower figure of Fig. 8, by arranging the tension assisting device 11 near the chamber, the distance L2 between the center position CENT of the laminated body WK2 and the end of the second roller 112 of the tension assisting device 11 closest to the chamber position, which is the fulcrum on the film conveying source side, is substantially the same distance as the distance L0 between the center position CENT and the end of the worktable, which is the fulcrum on the film conveying destination side. Thus, since the center position CENT of the laminated body WK2 reaches the center of the center position CENT and the fulcrum on the film conveying source side and the center position CENT and the fulcrum on the film conveying destination side, the tilt of the laminated body WK2 is suppressed. Furthermore, the maximum deflection amount of the carrier film CFL on the lower side where the laminate WK2 is mounted is DL1, which is smaller than DL0.
如此,藉由將張力輔助裝置11配置在腔室附近,而可抑制被積層體WK2的傾斜,且有效地抑制下側載體膜CFL的撓曲。又,如圖8之下圖所示,張力輔助裝置11即使在第2輥112只有1根且無任何驅動力之情形下,亦可抑制被積層體WK2的傾斜。並且,如圖2及圖3,藉由張力輔助裝置11具備具有驅動力的第3輥113,而可進一步提高撓曲抑制效果。Thus, by arranging the tension assisting device 11 near the chamber, the tilt of the laminate WK2 can be suppressed, and the buckling of the lower carrier film CFL can be effectively suppressed. Moreover, as shown in the lower figure of FIG8 , the tension assisting device 11 can suppress the tilt of the laminate WK2 even when there is only one second roller 112 and no driving force. Furthermore, as shown in FIG2 and FIG3 , the buckling suppression effect can be further improved by providing the tension assisting device 11 with the third roller 113 having driving force.
又,如上述之用於縮小距離L2與距離L0的差之張力輔助裝置11的配置係,在自捲取裝置30向捲出裝置20之方向觀察時,較佳為被配置在自閘門107的端部至上模101的端部之間。亦即,張力輔助裝置11較佳為被配置在距離閘門107的端部100 mm以內,更佳為被配置在50 mm以內。此處,圖9表示張力輔助裝置11之配置的更佳配置。圖9係說明張力輔助裝置11與夾緊裝置12之配置例的圖。Furthermore, the arrangement of the tension assisting device 11 for reducing the difference between the distance L2 and the distance L0 as described above is preferably arranged between the end of the gate 107 and the end of the upper mold 101 when viewed from the winding device 30 toward the unwinding device 20. That is, the tension assisting device 11 is preferably arranged within 100 mm from the end of the gate 107, and more preferably within 50 mm. Here, FIG. 9 shows a more preferred arrangement of the tension assisting device 11. FIG. 9 is a diagram illustrating an example of the arrangement of the tension assisting device 11 and the clamping device 12.
如圖9所示,積層成形裝置10設置有貫通上模101及下模103的連接桿108。該連接桿108例如被配置在腔室的四角。於此,將第2輥112配置成,於將與載體膜搬送方向正交之方向對向配置的連接桿108之外周加以連結的區域A(連接桿108的投影區域)上,重疊有張力輔助裝置11之第2輥112的至少一部分。即,張力輔助裝置11支撐下側載體膜CFL的支點被設定於如下位置,即,於積層成形裝置10,被設置在加壓部之外周側的連接桿108中,將與下側載體膜CFL之搬送方向正交的方向對向配置的2個連接桿108之外周加以連結的區域A(連接桿108的投影區域)上重疊的位置。又,對相對於區域A而線對稱地對向的區域B,亦可將第1輥111進而配置成,張力輔助裝置11之第1輥111的至少一部分與區域B重疊。即,藉由2個以上的張力輔助裝置11支撐下側載體膜CFL之支點亦可被設定在如下位置,即,與以積層成形裝置10之加壓部為邊界而線對稱之區域A與區域B各者重疊的位置。藉由如此地配置張力輔助裝置11,距離L2與距離L0的差變得更小,而可進一步抑制下側載體膜CFL的撓曲量。As shown in FIG9 , the lamination molding device 10 is provided with a connecting rod 108 penetrating the upper mold 101 and the lower mold 103. The connecting rod 108 is disposed, for example, at the four corners of the chamber. Here, the second roller 112 is disposed so that at least a portion of the second roller 112 of the tension assisting device 11 is overlapped on the area A (projection area of the connecting rod 108) that connects the outer periphery of the connecting rod 108 disposed opposite to the direction perpendicular to the carrier film conveying direction. That is, the fulcrum for the tension assisting device 11 to support the lower carrier film CFL is set at a position overlapping an area A (projection area of the connecting rod 108) connecting the outer peripheries of two connecting rods 108 arranged opposite to each other in a direction perpendicular to the conveying direction of the lower carrier film CFL in the connecting rod 108 provided on the outer periphery of the pressurizing portion in the lamination forming device 10. In addition, the first roller 111 may be further arranged so that at least a portion of the first roller 111 of the tension assisting device 11 overlaps with the area B which is line-symmetrically opposite to the area A. That is, the supporting point for supporting the lower carrier film CFL by two or more tension assisting devices 11 can also be set at a position overlapping with the area A and the area B which are line symmetrical with the pressurizing part of the lamination forming device 10 as a boundary. By arranging the tension assisting device 11 in this way, the difference between the distance L2 and the distance L0 becomes smaller, and the bending amount of the lower carrier film CFL can be further suppressed.
(實施形態2) 在實施形態2中,對實施形態1之積層成形系統1之變化例的積層成形系統2進行說明。再者,在實施形態2的說明中,對與實施形態1相同的構成要件賦予與實施形態1相同的符號並省略說明。 (Implementation Form 2) In Implementation Form 2, a multilayer forming system 2 which is a variation of the multilayer forming system 1 of Implementation Form 1 is described. In the description of Implementation Form 2, the same symbols as those of Implementation Form 1 are assigned to the same components as those of Implementation Form 1, and the description thereof is omitted.
圖10表示說明實施形態2之積層成形系統2之概要的構成圖。如圖10所示,實施形態2之積層成形系統2係將張力輔助裝置11與夾緊裝置12的配置設為與實施形態1的積層成形系統1相反者。Fig. 10 is a schematic diagram showing the structure of the lamination forming system 2 according to the second embodiment. As shown in Fig. 10, the arrangement of the tension assisting device 11 and the clamping device 12 in the lamination forming system 2 according to the second embodiment is opposite to that in the lamination forming system 1 according to the first embodiment.
如此,即使張力輔助裝置11與夾緊裝置12相反,亦可與實施形態1的積層成形系統1同樣地對下側載體膜CFL施加張力。In this way, even if the tension assisting device 11 and the clamping device 12 are opposite, tension can be applied to the lower carrier film CFL in the same manner as the lamination forming system 1 of the embodiment 1.
即,在本說明書中說明的積層成形系統中,張力輔助裝置11只要被配置在積層成形裝置10之加壓部的捲出裝置20側與捲取裝置30側的至少一者即可。又,在實施形態2的積層成形系統2中,較佳為,將張力輔助裝置11配置在距離積層成形裝置10之加壓部的端部500 mm以內,更佳為100 mm以內,藉此而可抑制下側載體膜CFL的撓曲量。That is, in the lamination forming system described in this specification, the tension assisting device 11 only needs to be arranged on at least one of the unwinding device 20 side and the winding device 30 side of the pressurizing section of the lamination forming device 10. Furthermore, in the lamination forming system 2 of the second embodiment, it is preferred that the tension assisting device 11 be arranged within 500 mm, more preferably within 100 mm, from the end of the pressurizing section of the lamination forming device 10, thereby suppressing the amount of deflection of the lower carrier film CFL.
(實施形態3) 在實施形態3中,對成為實施形態1之積層成形系統1的變化例的積層成形系統3進行說明。再者,在實施形態3的說明中,對與實施形態1相同的構成要件賦予與實施形態1相同的符號並省略說明。 (Implementation Form 3) In Implementation Form 3, a multilayer forming system 3 which is a variation of the multilayer forming system 1 of Implementation Form 1 is described. In the description of Implementation Form 3, the same symbols as those of Implementation Form 1 are assigned to the same components as those of Implementation Form 1, and the description thereof is omitted.
圖11表示實施形態3之積層成形系統的構成圖。如圖11所示,積層成形系統3在積層成形裝置10與捲取裝置30之間配置有至少1個衝壓裝置。衝壓裝置對自積層成形裝置10搬出的被積層體進一步施加加壓力。在圖11所示的例中,表示在積層成形裝置10與捲取裝置30之間設置衝壓裝置40、衝壓裝置50的例。FIG11 shows a configuration diagram of a lamination forming system of embodiment 3. As shown in FIG11, the lamination forming system 3 is provided with at least one punching device between the lamination forming device 10 and the winding device 30. The punching device further applies a pressure to the laminated body carried out from the lamination forming device 10. In the example shown in FIG11, a punching device 40 and a punching device 50 are provided between the lamination forming device 10 and the winding device 30.
衝壓裝置40藉由被設置在上模401的上側加壓盤402、及被設置在下模403的下側加壓盤404而對被積層體進行加壓。衝壓裝置50藉由被設置在上模501的上側加壓盤502、及被設置在下模503的下側加壓盤504而對被積層體進行加壓。如此,藉由在積層成形裝置10之後段設置1個以上的衝壓裝置,而可使積層成形面的平坦度階段性地提高。The punching device 40 presses the laminated body by means of the upper pressurizing plate 402 provided on the upper mold 401 and the lower pressurizing plate 404 provided on the lower mold 403. The punching device 50 presses the laminated body by means of the upper pressurizing plate 502 provided on the upper mold 501 and the lower pressurizing plate 504 provided on the lower mold 503. In this way, by providing one or more punching devices at the rear stage of the laminate forming device 10, the flatness of the laminate forming surface can be improved step by step.
另一方面,若在積層成形裝置10與捲取裝置30之間設置衝壓裝置40、50,則自捲出裝置20至捲取裝置30的距離變得更遠,且下側載體膜CFL的撓曲量變大。然而,藉由在積層成形裝置10、衝壓裝置40、50設置張力輔助裝置11,而可抑制下側載體膜CFL的撓曲量。再者,此時,藉由設置產生驅動力的張力輔助裝置11,而可進一步抑制下側載體膜CFL的撓曲量。On the other hand, if the punching device 40, 50 is provided between the lamination forming device 10 and the winding device 30, the distance from the unwinding device 20 to the winding device 30 becomes longer, and the bending amount of the lower carrier film CFL becomes larger. However, by providing the tension assisting device 11 in the lamination forming device 10 and the punching device 40, 50, the bending amount of the lower carrier film CFL can be suppressed. Furthermore, at this time, by providing the tension assisting device 11 that generates a driving force, the bending amount of the lower carrier film CFL can be further suppressed.
又,如圖11所示,藉由對衝壓裝置40、衝壓裝置50各者設置夾緊裝置42、52,而可抑制衝壓裝置中之撓曲量的增加。Furthermore, as shown in FIG. 11 , by providing the clamping devices 42 and 52 to the punching device 40 and the punching device 50 , respectively, the increase in the amount of deflection in the punching device can be suppressed.
再者,本發明並非限定於上述實施形態,在不脫離其主旨之範圍內,可適宜地進行變更。Furthermore, the present invention is not limited to the above-mentioned embodiments and can be modified appropriately without departing from the scope of the present invention.
1~3:積層成形系統 10:積層成形裝置 11:張力輔助裝置 12、26、42、52:夾緊裝置 20:捲出裝置 21:下供給輥 22、24、32、34:從動輥 23:上供給輥 25:載置台 30:捲取裝置 31:下回收輥 33:上回收輥 35:回收台 40、50:衝壓裝置 101、401、501:上模 102、402、502:上側加壓盤 103、403、503:下模 104、404、504:下側加壓盤 105:衝柱 106:加壓力產生裝置 107:閘門 108:連接桿 111:第1輥 112:第2輥 113:第3輥 θ:角度 A、B:區域 CENT:中心位置 CFU:上側載體膜 CFL:下側載體膜 CU:動作控制部 DL0、DL1:最大撓曲量 L0、L1、L2:距離 S1~S9:步驟 WK1、WK2:被積層體 WK3:積層體 VX:鉛垂軸 1~3: Lamination forming system 10: Lamination forming device 11: Tension assist device 12, 26, 42, 52: Clamping device 20: Rolling device 21: Lower supply roller 22, 24, 32, 34: Driven roller 23: Upper supply roller 25: Loading table 30: Rolling device 31: Lower recovery roller 33: Upper recovery roller 35: Recovery table 40, 50: Punching device 101, 401, 501: Upper mold 102, 402, 502: Upper pressure plate 103, 403, 503: Lower mold 104, 404, 504: Lower pressure plate 105: Punch 106: Pressure generating device 107: Gate 108: Connecting rod 111: 1st roller 112: 2nd roller 113: 3rd roller θ: Angle A, B: Area CENT: Center position CFU: Upper carrier membrane CFL: Lower carrier membrane CU: Motion control unit DL0, DL1: Maximum bending amount L0, L1, L2: Distance S1~S9: Steps WK1, WK2: Integral layer WK3: Layer VX: Lead vertical axis
圖1係說明實施形態1之積層成形系統之概要的構成圖。 圖2係說明實施形態1之張力輔助裝置之第1構成及第1動作例的圖。 圖3係說明實施形態1之張力輔助裝置之第2構成及第2動作例的圖。 圖4係說明實施形態1之張力輔助裝置之第3構成及第3動作例的圖。 圖5係說明實施形態1之張力輔助裝置之第4構成及第4動作例的圖。 圖6係說明實施形態1之積層成形系統之動作的流程圖。 圖7係實施形態1之積層成形系統之具體的構成圖。 圖8係說明下側載體膜之撓曲的圖。 圖9係說明下側載體膜之支點之設定位置的圖。 圖10係說明實施形態2之積層成形系統之概要的構成圖。 圖11係實施形態3之積層成形系統之具體的構成圖。 FIG. 1 is a schematic diagram of the multilayer forming system of embodiment 1. FIG. 2 is a diagram of the first structure and the first operation example of the tension assisting device of embodiment 1. FIG. 3 is a diagram of the second structure and the second operation example of the tension assisting device of embodiment 1. FIG. 4 is a diagram of the third structure and the third operation example of the tension assisting device of embodiment 1. FIG. 5 is a diagram of the fourth structure and the fourth operation example of the tension assisting device of embodiment 1. FIG. 6 is a flow chart of the operation of the multilayer forming system of embodiment 1. FIG. 7 is a specific diagram of the multilayer forming system of embodiment 1. FIG8 is a diagram for explaining the bending of the lower carrier film. FIG9 is a diagram for explaining the setting position of the supporting point of the lower carrier film. FIG10 is a diagram for explaining the general structure of the multilayer forming system of the implementation form 2. FIG11 is a diagram for explaining the specific structure of the multilayer forming system of the implementation form 3.
1:積層成形系統 1:Layered forming system
10:積層成形裝置 10: Layer forming device
11:張力輔助裝置 11: Tension auxiliary device
12、26:夾緊裝置 12, 26: Clamping device
20:捲出裝置 20: Roll-out device
21:下供給輥 21: Lower supply roller
22、24、32、34:從動輥 22, 24, 32, 34: driven roller
23:上供給輥 23: Offering to the roller
25:載置台 25: Loading platform
30:捲取裝置 30: Rolling device
31:下回收輥 31: Lower recovery roller
33:上回收輥 33: Upper recovery roller
35:回收台 35: Recycling station
101:上模 101: Upper mold
102:上側加壓盤 102: Upper pressure plate
103:下模 103: Lower mold
104:下側加壓盤 104: Lower pressure plate
107:閘門 107: Gate
111:第1輥 111: Roll 1
112:第2輥 112: Roller 2
113:第3輥 113: Roller 3
CFU:上側載體膜 CFU: upper carrier membrane
CFL:下側載體膜 CFL: Lower carrier film
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JP2023042912A JP7605881B2 (en) | 2023-03-17 | 2023-03-17 | Laminated molding system and laminated molding method |
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TW202440300A true TW202440300A (en) | 2024-10-16 |
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