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TW202438871A - Automatic optical re-inspecting system for multiple re-inspection and multiple re-inspection method - Google Patents

Automatic optical re-inspecting system for multiple re-inspection and multiple re-inspection method Download PDF

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TW202438871A
TW202438871A TW112111562A TW112111562A TW202438871A TW 202438871 A TW202438871 A TW 202438871A TW 112111562 A TW112111562 A TW 112111562A TW 112111562 A TW112111562 A TW 112111562A TW 202438871 A TW202438871 A TW 202438871A
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image
defect
inspection
automated optical
light source
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TWI855614B (en
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鄒嘉駿
徐敏堂
李偉聖
黃柏仁
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由田新技股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64Fluorescence; Phosphorescence
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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Abstract

The present invention discloses an automatic optical re-inspecting system for multiple re-inspection. The system receives a detection signal and a corresponding object to be tested from the outside. It includes a light source device, an image capture device, and a defect screening module. The light source device provides multiple light sources to the object to be tested in the detection area. The image capture device captures the corresponding defective area on the object to be tested based on the detection signal, obtaining a first image and a second image. The defect screening module determines whether the first image is a true defective image, generates a first replication result, and determines whether the second image is a true defective image based on the first replication result, producing a second replication result.

Description

多重複檢之自動化光學複判系統以及多重複檢方法Automated optical re-examination system for multiple re-examination and multiple re-examination method

本發明係有關於一種自動化光學複判系統,尤指一種多重複檢之自動化光學複判系統。The present invention relates to an automated optical review system, and in particular to an automated optical review system for multiple review.

現行的光學檢測設備,包括用於半導體、PCB、LCD等等的各段製程中的光學檢測設備,都有搭配複檢設備,其目的是將檢測而得的缺陷影像,經由另一獨立的顯示裝置(複判顯示設備)顯示給人員重複檢查,作為複判之用,以降低過檢、漏檢率。Current optical inspection equipment, including those used in various stages of semiconductor, PCB, LCD and other manufacturing processes, is equipped with re-inspection equipment. Its purpose is to display the defect images obtained through the inspection to personnel for repeated inspection through another independent display device (re-inspection display equipment) for the purpose of re-inspection, so as to reduce the over-inspection and under-inspection rates.

隨著人力費用的提高,傳統一人一機式的人工影像複檢作法,對人力成本的耗費過高,但若不採取複檢,僅利用更高規格的光學拍攝方式或檢測演算法方式來解決「第一次檢測」的過檢、漏檢問題,則又會導致「第一次檢測」的檢測時間大幅增加,無法達到工業化量產需求。With the increase in labor costs, the traditional one-person-one-machine manual image re-inspection method has too high labor costs. However, if re-inspection is not adopted and only higher-specification optical shooting methods or detection algorithms are used to solve the problems of "first inspection" over-inspection and missed inspection, the inspection time of "first inspection" will be greatly increased, which cannot meet the needs of industrial mass production.

本發明的主要目的,在於提供一種多重複檢之自動化光學複判系統,由外部接收一檢測資訊與對應該檢測資訊的一待測物,該系統包括一光源裝置、一影像擷取裝置、以及一瑕疵篩選模組。該光源裝置提供複數光源至一檢測範圍上的該待測物。該影像擷取裝置根據該檢測資訊,拍攝該待測物上對應的一瑕疵區域,以獲得一第一影像與一第二影像。該瑕疵篩選模組判斷該第一影像是否為真實瑕疵影像,並產生一第一複判結果,並根據該第一複判結果,判斷該第二影像是否為真實瑕疵影像,產生一第二複判結果。The main purpose of the present invention is to provide an automated optical review system for multiple re-inspections, which receives a detection information and an object to be tested corresponding to the detection information from the outside. The system includes a light source device, an image capture device, and a defect screening module. The light source device provides a plurality of light sources to the object to be tested within a detection range. The image capture device photographs a corresponding defect area on the object to be tested based on the detection information to obtain a first image and a second image. The defect screening module determines whether the first image is a real defect image and generates a first review result, and determines whether the second image is a real defect image based on the first review result to generate a second review result.

本發明的另一目的,在於提供一種多重複檢方法,包括:由外部接收一檢測資訊與對應該檢測資訊的一待測物;提供第一光源至一檢測範圍上的該待測物上,由影像擷取裝置根據該檢測資訊,拍攝該待測物上對應的一瑕疵區域,以獲得一第一影像,並產生一第一複判結果;以及提供第二光源至該檢測範圍上的該待測物上,由影像擷取裝置根據該第一複判結果,拍攝該待測物上對應的該瑕疵區域,以獲得一第二影像,並判斷該第二影像是否為真實瑕疵影像,產生一第二複判結果。Another object of the present invention is to provide a multiple re-inspection method, including: receiving a detection information and a test object corresponding to the detection information from the outside; providing a first light source to the test object in a detection range, and having an image capture device photograph a corresponding defect area on the test object according to the detection information to obtain a first image and generate a first re-judgment result; and providing a second light source to the test object in the detection range, and having an image capture device photograph the corresponding defect area on the test object according to the first re-judgment result to obtain a second image, and judging whether the second image is a real defect image to generate a second re-judgment result.

本發明採用非在線式架構,本發明的分離式複判架構僅自外部接收第三方AOI設備的初檢資訊,以進行複檢。可相容於各種規格之自動光學檢測設備的檢測資訊,並取得齊一化複檢影像與檢測資訊。此外,本發明的白光結合螢光的複檢流程,相對於先前技術僅包括一道白光或螢光的複檢流程,可以更提升複檢的準確度。此外,本發明僅需針對白光複檢程序所過濾的缺陷進行螢光檢測,大幅降低螢光複檢次數,相較於習知的複檢設備必須根據檢測列表的所有缺陷候選逐一進行螢光複檢(螢光檢測所需時間約為白光檢測的數倍),本發明可有效節省整體檢測的時間。此外,所述的控制裝置可以根據檢測資訊控制光源裝置的光學輸出特性以及影像擷取裝置的外在參數及/或內在參數,強化瑕疵區域影像中的瑕疵特徵,以便於瑕疵篩選模組更精確的執行複判程序。The present invention adopts a non-online architecture. The separate re-inspection architecture of the present invention only receives the initial inspection information of the third-party AOI equipment from the outside for re-inspection. It is compatible with the inspection information of various specifications of automatic optical inspection equipment and obtains unified re-inspection images and inspection information. In addition, the re-inspection process of the present invention, which combines white light with fluorescence, can improve the accuracy of re-inspection compared to the re-inspection process of the previous technology that only includes one white light or fluorescent light. In addition, the present invention only needs to perform fluorescence inspection on the defects filtered by the white light re-inspection procedure, which greatly reduces the number of fluorescence re-inspections. Compared with the known re-inspection equipment that must perform fluorescence re-inspection one by one according to all defect candidates in the inspection list (the time required for fluorescence inspection is about several times that of white light inspection), the present invention can effectively save the time of the overall inspection. In addition, the control device can control the optical output characteristics of the light source device and the external parameters and/or internal parameters of the image capture device according to the detection information, and strengthen the defect characteristics in the defect area image, so that the defect screening module can perform the re-judgment procedure more accurately.

有關本發明之詳細說明及技術內容,現就配合圖式說明如下。再者,本發明中之圖式,為說明方便,其比例未必按實際比例繪製,而有誇大之情況,該等圖式及其比例非用以限制本發明之範圍。The detailed description and technical content of the present invention are described below with reference to the accompanying drawings. Furthermore, the drawings in the present invention are not necessarily drawn in accordance with the actual scale for the convenience of explanation, but may be exaggerated. The drawings and their scales are not intended to limit the scope of the present invention.

本發明提出一種多重複檢之自動化光學複判系統,例如但不限定應用於電路板的內層檢測,並用於配合人工智慧(AI)進行檢測,進而實現複判程序。本發明的多重複檢之自動化光學複判系統為包括但不限於,可採用非在線式架構,僅自外部接收初檢檢測資訊,不和實施初檢的外部自動光學檢測設備(Automated Optical Inspection, AOI)實體連接。上述光學複判系統可於近端或遠端存取檢測資料庫所儲存的檢測資訊;資料庫可以同時儲存複數個相同或不同規格的自動光學檢測設備,該等實施例的變化非屬本發明所欲限制的範圍。因此,在進行複判程序時,利用本發明的自動化光學複判系統,會根據外部接收的檢測資訊,依照本發明的自動化光學複判系統的光學架構再次拍攝待測物的瑕疵影像,以正規化(normalize)瑕疵影像,用以後續判斷於該檢測資訊上的缺陷是否為真實瑕疵。如此可在不同硬體規格、檢測環境的初檢設備/系統架構下,正規化複檢影像,以利後續的多重複檢程序。再者,本發明利用了白光與螢光結合之複檢功能,根據外部自動光學檢測設備所提供的瑕疵位置,先進行白光檢測程序先初步過濾假性瑕疵後,再根據螢光檢測程序判斷經過濾後的瑕疵位置,以確認是否為真實缺陷,藉此降低過檢及漏檢的問題。The present invention proposes an automated optical re-inspection system for multiple re-inspections, which can be used, for example but not limited to, for inner layer inspection of circuit boards, and can be used in conjunction with artificial intelligence (AI) for inspection to implement a re-inspection procedure. The automated optical re-inspection system for multiple re-inspections of the present invention includes, but is not limited to, a non-online architecture that only receives initial inspection information from the outside and is not physically connected to an external automated optical inspection device (AOI) that performs the initial inspection. The above-mentioned optical re-inspection system can access the inspection information stored in the inspection database at the near end or the remote end; the database can simultaneously store multiple automated optical inspection devices of the same or different specifications, and the variations of these embodiments are not within the scope of the present invention. Therefore, when the re-inspection process is performed, the automatic optical re-inspection system of the present invention will take the defect image of the object to be inspected again according to the optical structure of the automatic optical re-inspection system of the present invention based on the externally received inspection information to normalize the defect image for subsequent judgment on whether the defect in the inspection information is a real defect. In this way, the re-inspection image can be normalized under the initial inspection equipment/system structure of different hardware specifications and inspection environments, so as to facilitate the subsequent multiple re-inspection process. Furthermore, the present invention utilizes the re-inspection function of combining white light and fluorescence. According to the defect position provided by the external automatic optical inspection equipment, a white light inspection process is first performed to initially filter out false defects, and then the defect position after filtering is determined according to the fluorescent inspection process to confirm whether it is a real defect, thereby reducing the problem of over-inspection and missed inspection.

於本發明中所述的「器」、「模組」、「裝置」,可以由例如後台設備、各裝置及個別設備的處理器、控制器、或電腦等複數個設備所協同控制並執行,亦可以由如上所述的單一裝置或設備控制並執行,該等裝置或設備的數量非屬本發明所欲限制的範圍,且其間的通訊方式(例如實體的或無線的)或通訊協定由於非屬本發明所欲限制的範圍,於本發明中即不再予以贅述。所述的處理器可耦接於儲存單元並執行對應的程式,並依據程式控制裝置即設備的運作。該等處理器、電腦例如是中央處理器(Central Processing Unit, CPU),或是其他可程式化之一般用途或特殊用途的微處理器(Microprocessor)、數位訊號處理器(Digital Signal Processor, DSP)、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuits, ASIC)、可程式化邏輯裝置(Programmable Logic Device, PLD)或其他類似裝置或這些裝置的組合,於本發明中不予以限制。The "device", "module", and "device" described in the present invention may be controlled and executed by multiple devices such as background equipment, processors, controllers, or computers of each device and individual equipment, or may be controlled and executed by a single device or equipment as described above. The number of such devices or equipment is not within the scope of the present invention, and the communication method (such as physical or wireless) or communication protocol therebetween is not within the scope of the present invention, so it will not be described in detail in the present invention. The processor may be coupled to the storage unit and execute the corresponding program, and control the operation of the device or equipment according to the program. Such processors and computers may be, for example, a central processing unit (CPU), or other programmable general-purpose or special-purpose microprocessors, digital signal processors (DSP), programmable controllers, application specific integrated circuits (ASIC), programmable logic devices (PLD), or other similar devices or combinations of these devices, which are not limited in the present invention.

於本發明中各裝置間可以直接或間接的通訊,以進行資料的互換。於一實施例中,各裝置工作的執行可以由中央控制系統進行工作編程的統籌及分配(例如PLC),然而,於本發明中亦不排除可以由各裝置獨立的控制器或處理器相互間的互相協同以完成工作程序,該等實施例的變化非屬本發明所欲限制的範圍。In the present invention, each device can communicate directly or indirectly to exchange data. In one embodiment, the execution of each device can be coordinated and allocated by a central control system (such as PLC). However, the present invention does not exclude that the independent controllers or processors of each device can cooperate with each other to complete the work process. The changes of these embodiments are not within the scope of the present invention.

以下針對本發明的其中一實施例進行詳細說明,請參閱「圖1」,係為本發明多重複檢之自動化光學複判系統的方塊示意圖,如圖所示:本實施例揭示一種多重複檢之自動化光學複判系統100,通過接收自動化光學檢測系統A所提供對應於目標待測物Ak的檢測資訊對目標待測物Ak進行複判。The following is a detailed description of one of the embodiments of the present invention. Please refer to "Figure 1", which is a block diagram of the automated optical review system for multiple re-inspections of the present invention, as shown in the figure: This embodiment discloses an automated optical review system 100 for multiple re-inspections, which reviews the target object Ak by receiving detection information corresponding to the target object Ak provided by the automated optical detection system A.

所述的自動光學檢測設備A用以檢測待測物Ak的瑕疵,並記錄待測物Ak的瑕疵座標或瑕疵種類。自動化光學檢測系統A可以為現行任意規格的自動光學檢測設備(Automated Optical Inspection, AOI),用於對待測物Ak進行影像分析。影像分析的方式例如可以透過一般影像處理方式(例如高斯、傅立葉、二值化、影像相減、型態分析)獲得瑕疵的種類或是位置、或是透過機器學習、深度學習等利用類神經網絡進行瑕疵種類的辨識或定位,藉此獲得檢測資訊。一般而言,常規的自動光學檢測設備A經檢測後所提供的檢測資訊,例如包括瑕疵種類、瑕疵影像、瑕疵位置、及/或定位點位置。於一實施例中,待測物Ak為電路基板,檢測資訊係關於電路基板的內層瑕疵,於本發明中不予以限制。The automatic optical inspection equipment A is used to detect defects of the object Ak to be tested, and record the defect coordinates or defect types of the object Ak to be tested. The automated optical inspection system A can be an automated optical inspection equipment (AOI) of any existing specification, which is used to perform image analysis on the object Ak to be tested. The image analysis method can, for example, obtain the type or position of the defect through general image processing methods (such as Gaussian, Fourier, binarization, image subtraction, morphological analysis), or use machine learning, deep learning, etc. to identify or locate the type of defect using a neural network to obtain detection information. Generally speaking, the detection information provided by the conventional automatic optical inspection equipment A after detection includes, for example, the type of defect, defect image, defect location, and/or positioning point location. In one embodiment, the object to be tested Ak is a circuit substrate, and the detection information is related to the inner layer defects of the circuit substrate, which is not limited in the present invention.

所述的多重複檢之自動化光學複判系統100依據待測物Ak的檢測資訊進行複檢。於一實施例中,檢測資訊儲存裝置DB可以同時連線至複數個相同或不同規格的自動光學檢測設備,該等實施例的變化非屬本發明所欲限制的範圍。The multiple re-inspection automated optical re-judgment system 100 performs re-inspection based on the detection information of the object Ak. In one embodiment, the detection information storage device DB can be simultaneously connected to a plurality of automated optical detection devices of the same or different specifications, and the variations of these embodiments are not within the scope of the present invention.

所述的多重複檢之自動化光學複判系統100主要包括用於設置待測物Ak的檢測平台B、對應於檢測平台B設置的光源裝置10、對應於檢測平台B設置的影像擷取裝置20、連接至影像擷取裝置20的控制裝置30、以及連接至控制裝置30的瑕疵篩選模組40。The multiple re-inspection automated optical review system 100 mainly includes a testing platform B for setting up the test object Ak, a light source device 10 corresponding to the testing platform B, an image capture device 20 corresponding to the testing platform B, a control device 30 connected to the image capture device 20, and a defect screening module 40 connected to the control device 30.

所述的光源裝置10提供複數光源至檢測範圍上的待測物Ak。所述的「檢測範圍」係指待測物Ak上對應於影像擷取裝置20拍攝方向的感興趣區域,例如但不限定於待測物Ak的全幅區域、待測物Ak的部分區域、或是待測物Ak基於檢測資訊對應的瑕疵位置等,該等實施例於本發明中不予以限制。The light source device 10 provides a plurality of light sources to the object Ak under test within the detection range. The "detection range" refers to the region of interest on the object Ak corresponding to the shooting direction of the image capture device 20, such as but not limited to the full-frame region of the object Ak under test, a partial region of the object Ak under test, or a defect position of the object Ak under test corresponding to the detection information, etc. Such embodiments are not limited in the present invention.

所述的影像擷取裝置20通過控制裝置30由檢測資訊儲存裝置DB獲取對應待測物Ak的檢測資訊,拍攝待測物Ak上對應的瑕疵區域,以獲得瑕疵區域影像。於一實施例中,請一併參閱「圖2」,係為本發明中影像擷取裝置的方塊示意圖,如圖所示:影像擷取裝置20包括移動裝置21以及設置於移動裝置21上的攝像頭22,移動裝置21通過檢測資訊接收瑕疵座標,移動攝像頭22至待測物Ak的瑕疵位置,對待測物Ak的瑕疵進行拍攝。於一實施例中,移動裝置21例如可以是X-Y線性載台、機械手臂或其他類此的裝置,於本發明中不予以限制。於一實施例中,攝像頭22例如可以是面掃描攝影機(Area Scan Camera)、或線掃描設影機(Line Scan Camera),於本發明中不予以限制。於本發明中,為了取得兩種基於不同特性光源所呈現的影像,影像擷取裝置20於光源裝置10提供第一光源時拍攝待測物Ak以獲得一第一影像,並於光源裝置10提供第二光源時拍攝待測物Ak以獲得一第二影像。於一實施例中,第一影像包括一紅光成分影像、一綠光成分影像、一藍光成分影像或一白光成分影像;第二影像包括一螢光成分影像。The image capture device 20 obtains the detection information corresponding to the object Ak from the detection information storage device DB through the control device 30, and shoots the corresponding defect area on the object Ak to obtain the defect area image. In one embodiment, please refer to "Figure 2", which is a block diagram of the image capture device in the present invention, as shown in the figure: the image capture device 20 includes a moving device 21 and a camera 22 arranged on the moving device 21. The moving device 21 receives the defect coordinates through the detection information, moves the camera 22 to the defect position of the object Ak to be tested, and shoots the defect of the object Ak. In one embodiment, the moving device 21 may be, for example, an X-Y linear stage, a robot arm, or other similar devices, which are not limited in the present invention. In one embodiment, the camera 22 may be, for example, an area scan camera or a line scan camera, which are not limited in the present invention. In the present invention, in order to obtain two images presented based on light sources with different characteristics, the image capture device 20 photographs the object to be tested Ak to obtain a first image when the light source device 10 provides a first light source, and photographs the object to be tested Ak to obtain a second image when the light source device 10 provides a second light source. In one embodiment, the first image includes a red light component image, a green light component image, a blue light component image, or a white light component image; the second image includes a fluorescent component image.

於一實施例中,請參閱「圖3」,係為本發明中光學架構的方塊示意圖,如圖所示:光源裝置10包括白光光源11、以及激發光源12,白光光源11係用於提供白光至檢測範圍上的待測物Ak,使影像擷取裝置20獲得瑕疵區域影像的白光成分影像,亦或是紅光成分影像、綠光成分影像、藍光成分影像;激發光源12用於提供激發光至待測物Ak上以產生螢光,使影像擷取裝置20獲得瑕疵區域影像的螢光成分影像。於使用激發光源12的實施例中,影像擷取裝置20的攝像頭22上將配置激發光濾鏡23,用於將激發光濾除後僅通過待測物Ak所產生的螢光,以對待測物Ak進行檢測。於一實施例中,影像擷取裝置20例如可以是全彩攝影機,用於取得待測物Ak的紅光成分影像、綠光成分影像、藍光成分影像及/或白光成分影像。In one embodiment, please refer to "Figure 3", which is a block diagram of the optical structure of the present invention, as shown in the figure: the light source device 10 includes a white light source 11 and an excitation light source 12. The white light source 11 is used to provide white light to the object Ak to be tested in the detection range, so that the image capture device 20 obtains a white light component image of the defect area image, or a red light component image, a green light component image, and a blue light component image; the excitation light source 12 is used to provide excitation light to the object Ak to be tested to generate fluorescence, so that the image capture device 20 obtains a fluorescent component image of the defect area image. In the embodiment using the excitation light source 12, an excitation light filter 23 is disposed on the camera head 22 of the image capture device 20, which is used to filter the excitation light and only pass the fluorescence generated by the object Ak to be tested, so as to detect the object Ak. In one embodiment, the image capture device 20 can be, for example, a full-color camera, which is used to obtain a red light component image, a green light component image, a blue light component image and/or a white light component image of the object Ak to be tested.

於一實施例中,在白光光源11、以及激發光源12兩種光源間切換時,激發光濾鏡23可以經由切換裝置24切換,於啟動激發光源12(白光光源11關閉)時將激發光濾鏡23移動至影像擷取裝置20的攝像頭22與待測物Ak之間的光路上,於啟動白光光源11(激發光源12關閉)時,將激發光濾鏡23由影像擷取裝置20的攝像頭22與待測物Ak之間的光路之間移開。於一實施例中,待測物Ak可以通過輸送裝置(圖未示),輸送至檢測範圍,以對待測物Ak進行照明及拍攝,所述的輸送裝置例如可以是但不限定於多軸機械手臂、線性載台、輸送帶、移載裝置或其他類此的裝置,於本發明中不予以限制。除上述的光源外,光源裝置10可以進一步包括RGB光源、黃光光源、雷射光源等,於本發明中不予以限制;光源類型例如可以包括環形光源、同軸光源、背光源、側向光源、或可調整光源(例如位置及角度)等,於本發明中不予以限制。In one embodiment, when switching between the white light source 11 and the excitation light source 12, the excitation light filter 23 can be switched by the switching device 24. When the excitation light source 12 is started (the white light source 11 is turned off), the excitation light filter 23 is moved to the optical path between the camera 22 of the image capture device 20 and the object to be measured Ak. When the white light source 11 is started (the excitation light source 12 is turned off), the excitation light filter 23 is moved away from the optical path between the camera 22 of the image capture device 20 and the object to be measured Ak. In one embodiment, the object Ak can be transported to the detection range through a conveyor device (not shown) to illuminate and photograph the object Ak. The conveyor device can be, for example, but is not limited to a multi-axis robotic arm, a linear stage, a conveyor belt, a transfer device or other similar devices, which are not limited in the present invention. In addition to the above-mentioned light sources, the light source device 10 may further include RGB light sources, yellow light sources, laser light sources, etc., which are not limited in the present invention; the light source types may include, for example, ring light sources, coaxial light sources, backlight sources, lateral light sources, or adjustable light sources (such as position and angle), etc., which are not limited in the present invention.

所述的瑕疵篩選模組40用於判斷瑕疵影像是否為真實瑕疵影像。為了有效率地進行檢測,本發明中瑕疵篩選模組40進行多重複檢,先判斷第一影像是否為真實瑕疵影像,產生第一複判結果後,根據第一複判結果,判斷第二影像是否為真實瑕疵影像,產生第二複判結果,藉此減少二次檢測的次數。於一實施例中,請一併參閱「圖4」,係為本發明中瑕疵篩選模組的方塊示意圖,如圖所示:瑕疵篩選模組40可以包括處理器41、及儲存裝置42,於儲存裝置42內儲存經訓練過後的卷積神經網路模型CV,通過處理器31載入儲存裝置32內的卷積神經網路模型 CV將瑕疵影像輸入至卷積神經網路模型CV 以判斷是否為真實瑕疵影像。所述的「真實瑕疵影像」係依據自動化光學檢測系統A的檢測資訊進行判別,例如自動化光學檢測系統A的檢測資訊判定對應目標區域具有瑕疵,則卷積神經網路模型CV係訓練為用於分析瑕疵區域影像中是否包括瑕疵;若自動化光學檢測系統A的檢測資訊判定對應目標區域為特定的瑕疵種類(例如灰塵、外層瑕疵、內層瑕疵),則卷積神經網路模型CV係訓練為用於分析瑕疵區域影像中是否具有對應瑕疵種類的瑕疵;藉此判定瑕疵影像是否為真實瑕疵影像,以完成影像復判。於另一實施例中,卷積神經網路模型CV係訓練成用於檢測目標影像與參考影像的差異性,判斷目標影像是否為真實瑕疵影像,以產生複判結果;例如瑕疵篩選模組40係先通過提供第一光源至待測物Ak,比較第一影像與一參考影像,先判斷第一影像是否為真實瑕疵影像產生該第一複判結果;接續,瑕疵篩選模組40再根據該第一複判結果,比較該第二影像與該參考影像,判斷該第二影像是否為真實瑕疵影像,以產生該第二複判結果。The defect screening module 40 is used to determine whether the defect image is a real defect image. In order to perform the inspection efficiently, the defect screening module 40 in the present invention performs multiple re-inspections, first determining whether the first image is a real defect image and generating a first re-inspection result, and then determining whether the second image is a real defect image based on the first re-inspection result and generating a second re-inspection result, thereby reducing the number of secondary inspections. In one embodiment, please refer to "Figure 4", which is a block diagram of the defect screening module in the present invention, as shown in the figure: the defect screening module 40 may include a processor 41 and a storage device 42, and the trained convolution neural network model CV is stored in the storage device 42. The convolution neural network model CV in the storage device 32 is loaded by the processor 31 and the defect image is input to the convolution neural network model CV to determine whether it is a real defect image. The "real defect image" is judged based on the detection information of the automated optical inspection system A. For example, if the detection information of the automated optical inspection system A determines that the corresponding target area has defects, the convolution neural network model CV is trained to analyze whether the defect area image includes defects; if the detection information of the automated optical inspection system A determines that the corresponding target area is a specific defect type (such as dust, outer layer defects, inner layer defects), the convolution neural network model CV is trained to analyze whether the defect area image has defects of the corresponding defect type; thereby determining whether the defect image is a real defect image to complete the image re-judgment. In another embodiment, the convolutional neural network model CV is trained to detect the difference between the target image and the reference image, and to determine whether the target image is a real defect image to generate a re-judgment result; for example, the defect screening module 40 first provides a first light source to the object to be tested Ak, compares the first image with a reference image, and first determines whether the first image is a real defect image to generate the first re-judgment result; then, the defect screening module 40 compares the second image with the reference image based on the first re-judgment result, and determines whether the second image is a real defect image to generate the second re-judgment result.

所述的「參考影像」例如可以是但不限定於母片影像、或是設計圖影像,例如計算機輔助製造圖檔(CAM),於本發明中不予以限制。The "reference image" may be, for example, but is not limited to a master image or a design image, such as a computer-aided manufacturing drawing (CAM), which is not limited in the present invention.

所述的「根據第一複判結果,比較第二影像與該參考影像」,係指由第一複判結果中判定為真實瑕疵影像的缺陷,影像擷取裝置20才會再針對這些相應缺陷位置拍攝第二影像(螢光成分影像),因此瑕疵篩選模組40才會再基於第二影像(螢光成分影像)進行複判;若判定為非真實瑕疵影像,則相應位置的瑕疵則不進行拍攝,因此瑕疵篩選模組40僅對判定為瑕疵的缺陷進行複判,藉此降低檢測時間及運算量。因為螢光檢測所需要的時間相比白光檢測較久,所以本發明先使用白光複檢判斷過濾假性缺陷,才讓過濾後的缺陷進行螢光複檢,藉由降低螢光複檢的次數而降低螢光複檢的時間。例如影像有100個缺陷、白光濾掉80個假缺陷,剩下20個才進行螢光檢測,針對這20個缺陷處激發螢光拍照,並根據螢光影像比對參考影像判斷缺陷。這樣比起原本需要螢光複檢100個缺陷次數,整體的檢測時間降低許多(白光檢測的時間很短,主要耗時的是螢光檢測,所以白光檢測100組缺陷加上螢光檢測20組缺陷遠遠小於螢光檢測100組缺陷所需的時間。The aforementioned “comparing the second image with the reference image based on the first re-judgment result” means that only if the defects are determined to be real defect images in the first re-judgment result, the image capture device 20 will capture the second image (fluorescent component image) for the corresponding defect positions, and therefore the defect screening module 40 will re-judge based on the second image (fluorescent component image); if it is determined to be a non-real defect image, the defects at the corresponding positions will not be captured, and therefore the defect screening module 40 will only re-judge the defects determined to be defects, thereby reducing the detection time and the amount of calculation. Because the time required for fluorescence inspection is longer than that for white light inspection, the present invention first uses white light re-inspection to determine and filter out false defects, and then conducts fluorescence re-inspection on the filtered defects. By reducing the number of fluorescence re-inspections, the time for fluorescence re-inspection is reduced. For example, if there are 100 defects in the image, 80 false defects are filtered out by white light, and only 20 are left for fluorescence inspection. Fluorescence is excited to take pictures of these 20 defects, and the defects are determined based on the fluorescent image compared with the reference image. Compared with the original need to re-inspect 100 defects by fluorescence, the overall inspection time is much shorter (the time for white light inspection is very short, and the main time-consuming part is the fluorescence inspection, so the time required to inspect 100 sets of defects by white light plus 20 sets of defects by fluorescence is much shorter than the time required to inspect 100 sets of defects by fluorescence.

請續一併參閱「圖5」,係為本發明中影像擷取裝置及光源裝置的控制方塊示意圖,如圖所示:為了提升複判系統對於瑕疵及缺陷特徵的辨識率,所述的控制裝置30根據檢測資訊控制光源裝置10的光學輸出特性以及影像擷取裝置20的外在參數及/或內在參數,強化瑕疵區域影像中的瑕疵特徵,以便於瑕疵篩選模組40更精確的執行複判程序。Please continue to refer to "Figure 5", which is a schematic diagram of the control block of the image capture device and the light source device in the present invention, as shown in the figure: In order to improve the recognition rate of defects and defect characteristics of the re-inspection system, the control device 30 controls the optical output characteristics of the light source device 10 and the external parameters and/or internal parameters of the image capture device 20 according to the detection information, and strengthens the defect characteristics in the defect area image, so that the defect screening module 40 can perform the re-inspection procedure more accurately.

具體而言,由於不同的缺陷特徵對於不同的類型的光源分別有較佳的表現,控制裝置30於檢測資訊中獲得瑕疵種類以及瑕疵位置後,控制裝置30係依據瑕疵種類調整提供至檢測範圍待測物Ak光源的光學輸出特性,先後或同時調整影像擷取裝置20的內部參數或外部參數;所述的「光學輸出特性」例如可以包括但不限定於光源強度、照射角度、光類型(例如漫射光、平行光、準直光等)、或頻譜等;所述的「內部參數」例如可以是但不限定於影像擷取裝置20的光圈大小、焦距、對焦位置、曝光時間、ISO值、色溫值、飽和度、影像預處理等、或其他類此的可調整內部參數;所述的「外部參數」例如可以是但不限定於影像擷取裝置20的拍攝位置、拍攝角度、濾鏡的切換、與待測物Ak間的距離、與光源之間的對應位置關係等、或其他類此的外部參數。Specifically, since different defect characteristics are better represented by different types of light sources, after the control device 30 obtains the defect type and defect position in the detection information, the control device 30 adjusts the optical output characteristics of the light source Ak provided to the object to be detected in the detection range according to the defect type, and adjusts the internal parameters or external parameters of the image capture device 20 successively or simultaneously; the "optical output characteristics" may include, but are not limited to, light source intensity, irradiation angle, light type (e.g., diffuse light, parallel light, collimated light, etc.), and the like. direct light, etc.), or spectrum, etc.; the "internal parameters" may be, for example, but are not limited to, the aperture size, focal length, focus position, exposure time, ISO value, color temperature value, saturation, image preprocessing, etc. of the image capture device 20, or other such adjustable Internal parameters; the "external parameters" may be, for example, but are not limited to the shooting position of the image capture device 20, the shooting angle, filter switching, the distance from the object under test Ak, the corresponding positional relationship with the light source, etc., or other similar external parameters.

瑕疵種類於光學環境中的表現,以下係舉例說明之,惟下面的列舉內容僅為本發明的其中一可實施態樣,並非用於限制本發明的範圍,在此先行敘明。The manifestation of defect types in the optical environment is described below by way of example. However, the following examples are only one possible implementation of the present invention and are not intended to limit the scope of the present invention. This is explained in advance.

若瑕疵特徵相對於周遭之色調、飽和度、亮度反差較大的區域容易經由影像處理程序(如二值化法)中被辨識,可以提供均勻光(或環境光)至待測物Ak的表面,使待測物Ak之可視平面上每一處的亮度呈均勻分布。所述的瑕疵特徵類型例如可以是但不限定於金屬變色、料件表面變色、黑線、積墨、漏底材、亮點、花斑、髒污、刮傷等。If the defect characteristics are easily identified through image processing procedures (such as binarization) in areas with large contrast in hue, saturation, and brightness compared to the surroundings, uniform light (or ambient light) can be provided to the surface of the object under test Ak , so that the brightness of each place on the viewing plane of the object Ak is uniformly distributed. The type of defect characteristics may be, for example, but are not limited to metal discoloration, material surface discoloration, black lines, ink accumulation, leakage of substrate, bright spots, spots, dirt, scratches, etc.

若瑕疵特徵具備立體特徵,可以提供側向的平行光至待測物Ak的表面,讓光路徑係與待測物Ak的可視平面之間具有一介於0度至90度(但不等於0度及90度)之間的入射角,使影像中的不平整區域產生陰影。所述的缺陷特徵例如可以是但不限定於豎紋、刀紋、砂光紋等造成待測物Ak表面不平整的瑕疵。If the defect features have three-dimensional characteristics, lateral parallel light can be provided to the surface of the object to be measured Ak, so that there is an angle between 0 degrees and 90 degrees (but not equal to 0 degrees) between the light path system and the visual plane of the object Ak. and 90 degrees), causing uneven areas in the image to be shadowed. The defective features may be, for example, but are not limited to defects such as vertical lines, knife lines, sanding lines, etc. that cause unevenness on the surface of the object Ak.

如所述的瑕疵特徵係為待測物Ak內部的瑕疵或是所屬的瑕疵特別能夠反射特定波長的光,可以提供背光源至待測物Ak的背面,或是提供可切換頻譜的光源用以照射待測物Ak,使影像中的瑕疵被凸顯出來。所述的瑕疵特徵例如可以是但不限定於斑紋(Mura)、或是亮點、碎亮點等。The defect characteristics described above are defects inside the object Ak under test or the defects are particularly capable of reflecting light of a specific wavelength. A backlight source can be provided to the back of the object Ak under test, or a light source with a switchable spectrum can be provided. The object under test Ak is illuminated to highlight the defects in the image. The defect features may be, for example, but are not limited to spots (Mura), bright spots, broken bright spots, etc.

除以上揭示的實施態樣外,本發明配合不同的瑕疵特徵亦可以組合各式不同的光源以凸顯影像中的缺陷特徵。經凸顯過瑕疵特徵的瑕疵區域影像,最後傳送至瑕疵篩選模組40複判是否為真實瑕疵影像。In addition to the above disclosed embodiments, the present invention can also combine various light sources to highlight the defect features in the image in accordance with different defect features. The defect area image with the defect features highlighted is finally transmitted to the defect screening module 40 to re-judge whether it is a real defect image.

請續一併參閱「圖6」,係為本發明中多重複檢方法的流程示意圖(一),如圖所示:首先,輸送裝置將欲實施複檢的待測物Ak傳送至檢測範圍上,控制裝置40由外部接收對應待測物的檢測資訊(步驟S01);接續,控制裝置40提供第一光源至一檢測範圍上的待測物Ak上(步驟S02);接續,由影像擷取裝置20根據檢測資訊,拍攝待測物上對應的瑕疵區域,以獲得第一影像(步驟S03),其中第一影像包括一紅光成分影像、一綠光成分影像、一藍光成分影像或一白光成分影像;接續,瑕疵篩選模組40依據第一影像產生第一複判結果(步驟S04);於獲得第一複判結果後,由控制裝置40根據第一複判結果提供第二光源至檢測範圍上的待測物Ak上,並由影像擷取裝置20根據第一複判結果,拍攝待測物Ak上對應的瑕疵區域,以獲得第二影像(步驟S05),其中第二影像包括螢光成分影像;最後,瑕疵篩選模組40判斷第二影像(例如螢光成分影像)是否為真實瑕疵影像,產生第二複判結果(步驟S06),其中步驟S04中被判定並非真實瑕疵影像的區域先行濾除,藉此省去了非真實瑕疵影像螢光檢測的時間,另一方面亦省去了步驟S06二次複判的運算量。Please continue to refer to "Figure 6", which is a schematic diagram of the process of the multiple re-inspection method in the present invention (I), as shown in the figure: First, the transport device transmits the test object Ak to be re-inspected to the detection range, and the control device 40 receives the detection information corresponding to the test object from the outside (step S01); then, the control device 40 provides a first light source to the test object Ak on a detection range (step S02); then, the image capture device 20 photographs the corresponding defect area on the test object according to the detection information to obtain a first image (step S03), wherein the first image includes a red light component image, a green light component image, a blue light component image or a white light component image; then, the defect screening module 40 generates a first re-judgment according to the first image. After obtaining the first re-judgment result, the control device 40 provides a second light source to the object Ak within the detection range according to the first re-judgment result, and the image capture device 20 photographs the corresponding defect area on the object Ak according to the first re-judgment result to obtain a second image (step S05), wherein the second image includes a fluorescent component image; finally, the defect screening module 40 determines whether the second image (e.g., the fluorescent component image) is a real defect image, and generates a second re-judgment result (step S06), wherein the area determined not to be a real defect image in step S04 is first filtered out, thereby saving the time for fluorescent detection of non-real defect images, and on the other hand, also saving the calculation amount of the second re-judgment in step S06.

綜上所述,本發明採用非在線式架構,本發明的分離式複判架構僅自外部接收第三方AOI設備的初檢資訊,以進行複檢。可相容於各種規格之自動光學檢測設備的檢測資訊,並取得齊一化複檢影像與檢測資訊。此外,本發明的白光結合螢光的複檢流程,相對於先前技術僅包括一道白光或螢光的複檢流程,可以更提升複檢的準確度。此外,本發明僅需針對白光複檢程序所過濾的缺陷進行螢光檢測,大幅降低螢光複檢次數,相較於習知的複檢設備必須根據檢測列表的所有缺陷候選逐一進行螢光複檢(螢光檢測所需時間約為白光檢測的數倍),本發明可有效節省整體檢測的時間。此外,所述的控制裝置可以根據檢測資訊控制光源裝置的光學輸出特性以及影像擷取裝置的外在參數及/或內在參數,強化瑕疵區域影像中的瑕疵特徵,以便於瑕疵篩選模組更精確的執行複判程序。In summary, the present invention adopts a non-online architecture. The separate re-inspection architecture of the present invention only receives the initial inspection information of the third-party AOI equipment from the outside for re-inspection. It is compatible with the inspection information of various specifications of automatic optical inspection equipment and obtains unified re-inspection images and inspection information. In addition, the re-inspection process of the present invention, which combines white light with fluorescence, can improve the accuracy of re-inspection compared to the re-inspection process of the previous technology that only includes one white light or fluorescent light. In addition, the present invention only needs to perform fluorescence inspection on the defects filtered by the white light re-inspection procedure, which greatly reduces the number of fluorescence re-inspections. Compared with the known re-inspection equipment that must perform fluorescence re-inspection one by one according to all defect candidates in the inspection list (the time required for fluorescence inspection is about several times that of white light inspection), the present invention can effectively save the time of the overall inspection. In addition, the control device can control the optical output characteristics of the light source device and the external parameters and/or internal parameters of the image capture device according to the detection information, and strengthen the defect characteristics in the defect area image, so that the defect screening module can perform the re-judgment procedure more accurately.

以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能以此限定本發明實施之範圍,即凡依本發明申請專利範圍所作之均等變化與修飾,皆應仍屬本發明之專利涵蓋範圍內。The present invention has been described in detail above. However, what is described above is only a preferred embodiment of the present invention and should not be used to limit the scope of implementation of the present invention. In other words, all equivalent changes and modifications made according to the scope of the patent application of the present invention should still fall within the scope of the patent of the present invention.

100:多重複檢之自動化光學複判系統 A:自動化光學檢測系統 Ak:待測物 DB:檢測資訊儲存裝置 B:檢測平台 10:光源裝置 11:白光光源 12:激發光源 20:影像擷取裝置 21:移動裝置 22:攝像頭 23:激發光濾鏡 24:切換裝置 30:控制裝置 40:瑕疵篩選模組 41:處理器 42:儲存裝置 CV:卷積神經網路模型 S01~S06:步驟 100: Automated optical re-judgment system for multiple re-inspections A: Automated optical inspection system Ak: Object to be inspected DB: Inspection information storage device B: Inspection platform 10: Light source device 11: White light source 12: Excitation light source 20: Image capture device 21: Moving device 22: Camera 23: Excitation light filter 24: Switching device 30: Control device 40: Defect screening module 41: Processor 42: Storage device CV: Convolutional neural network model S01~S06: Steps

圖1,係為本發明多重複檢之自動化光學複判系統的方塊示意圖。FIG1 is a block diagram of the automated optical multiple-review system of the present invention.

圖2,係為本發明中影像擷取裝置的方塊示意圖。FIG. 2 is a block diagram of the image capture device of the present invention.

圖3,係為本發明中光學架構的方塊示意圖。FIG. 3 is a block diagram of the optical structure of the present invention.

圖4,係為本發明中瑕疵篩選模組的方塊示意圖。FIG. 4 is a block diagram of the defect screening module of the present invention.

圖5,係為本發明中影像擷取裝置及光源裝置的控制方塊示意圖。FIG. 5 is a schematic diagram of the control block of the image capture device and the light source device in the present invention.

圖6,係為本發明中多重複檢方法的流程示意圖。FIG. 6 is a schematic diagram of the process of the multiple re-testing method of the present invention.

A:自動化光學檢測系統 A:Automated optical inspection system

DB:檢測資訊儲存裝置 DB: Detection information storage device

100:多重複檢之自動化光學複判系統 100: Automated optical re-examination system for multiple re-examinations

Ak:待測物 Ak: Object to be tested

B:檢測平台 B: Testing platform

10:光源裝置 10: Light source device

20:影像擷取裝置 20: Image capture device

30:控制裝置 30: Control device

40:瑕疵篩選模組 40: Defect screening module

Claims (19)

一種多重複檢之自動化光學複判系統,由外部接收一檢測資訊與對應該檢測資訊的一待測物,該系統包括: 一光源裝置,提供複數光源至一檢測範圍上的該待測物; 一影像擷取裝置,根據該檢測資訊,拍攝該待測物上對應的一瑕疵區域,以獲得一第一影像與一第二影像;以及 一瑕疵篩選模組,判斷該第一影像是否為真實瑕疵影像,並產生一第一複判結果,並根據該第一複判結果,判斷該第二影像是否為真實瑕疵影像,產生一第二複判結果。 An automated optical re-inspection system for multiple re-inspections receives a detection information and a test object corresponding to the detection information from the outside, and the system includes: A light source device, providing multiple light sources to the test object in a detection range; An image capture device, photographing a corresponding defect area on the test object according to the detection information to obtain a first image and a second image; and A defect screening module, judging whether the first image is a real defect image and generating a first re-inspection result, and judging whether the second image is a real defect image according to the first re-inspection result and generating a second re-inspection result. 如請求項1所述的自動化光學複判系統,其中該第一影像包括一紅光成分影像、一綠光成分影像、一藍光成分影像或一白光成分影像;其中該第二影像包括一螢光成分影像。An automated optical review system as described in claim 1, wherein the first image includes a red light component image, a green light component image, a blue light component image, or a white light component image; and wherein the second image includes a fluorescent component image. 如請求項2所述的自動化光學複判系統,其中該光源裝置包括一激發光源,提供激發光至該待測物上以產生螢光; 其中該影像擷取裝置,根據該第一複判結果,拍攝該待測物上的對應瑕疵區域,以獲得該螢光成分影像; 其中該瑕疵篩選模組判斷該螢光成分影像是否為真實瑕疵影像,以產生該第二複判結果。 The automated optical review system as described in claim 2, wherein the light source device includes an excitation light source, providing excitation light to the object to be tested to generate fluorescence; wherein the image capture device, based on the first review result, photographs the corresponding defect area on the object to be tested to obtain the fluorescence component image; wherein the defect screening module determines whether the fluorescence component image is a real defect image to generate the second review result. 如請求項1所述的自動化光學複判系統,其中該檢測資訊係自外部的一自動光學檢查設備產生。An automated optical review system as described in claim 1, wherein the detection information is generated from an external automated optical inspection device. 如請求項1所述的自動化光學複判系統,其中瑕疵篩選模組包括一卷積神經網路模型,以判斷該第一影像及/或該第二影像是否為真實瑕疵影像。An automated optical review system as described in claim 1, wherein the defect screening module includes a convolutional neural network model to determine whether the first image and/or the second image is a real defect image. 如請求項1所述的自動化光學複判系統,其中該瑕疵篩選模組比較該第一影像與一參考影像,判斷該第一影像是否為真實瑕疵影像,以產生該第一複判結果。The automated optical review system as described in claim 1, wherein the defect screening module compares the first image with a reference image to determine whether the first image is a true defect image to generate the first review result. 如請求項6所述的自動化光學複判系統,其中該瑕疵篩選模組根據該第一複判結果,比較該第二影像與該參考影像,判斷該第二影像是否為真實瑕疵影像,以產生該第二複判結果。An automated optical review system as described in claim 6, wherein the defect screening module compares the second image with the reference image based on the first review result to determine whether the second image is a real defect image to generate the second review result. 如請求項1所述的自動化光學複判系統,其中該檢測資訊包括瑕疵位置資訊或/及瑕疵類別資訊。An automated optical review system as described in claim 1, wherein the detection information includes defect location information and/or defect category information. 如請求項1所述的自動化光學複判系統,更進一步包括一控制裝置,根據該檢測資訊控制該光源裝置的光學輸出特性以及該影像擷取裝置的外在參數及/或內在參數,以強化該瑕疵區域影像中的瑕疵特徵。The automated optical review system as described in claim 1 further includes a control device for controlling the optical output characteristics of the light source device and the external parameters and/or internal parameters of the image capture device according to the detection information to enhance the defect characteristics in the defect area image. 如請求項9所述的自動化光學複判系統,其中該光源裝置所得調整的該光學輸出特性包括光源強度、照射角度、或頻譜。An automated optical review system as described in claim 9, wherein the adjusted optical output characteristics of the light source device include light source intensity, illumination angle, or spectrum. 如請求項1所述的自動化光學複判系統,其中該自動化光學複判系統係非在線式架構。An automated optical review system as described in claim 1, wherein the automated optical review system is a non-online architecture. 一種多重複檢之自動化光學複判方法,包括: 由外部接收一檢測資訊與對應該檢測資訊的一待測物; 提供第一光源至一檢測範圍上的該待測物上,由影像擷取裝置根據該檢測資訊,拍攝該待測物上對應的一瑕疵區域,以獲得一第一影像,並產生一第一複判結果;以及 提供第二光源至該檢測範圍上的該待測物上,由影像擷取裝置根據該第一複判結果,拍攝該待測物上對應的該瑕疵區域,以獲得一第二影像,並判斷該第二影像是否為真實瑕疵影像,產生一第二複判結果。 An automated optical re-interpretation method for multiple re-inspections includes: Receiving a detection information and a test object corresponding to the detection information from an external device; Providing a first light source to the test object in a detection range, and using an image capture device to photograph a corresponding defective area on the test object according to the detection information to obtain a first image and generate a first re-interpretation result; and Providing a second light source to the test object in the detection range, and using an image capture device to photograph the corresponding defective area on the test object according to the first re-interpretation result to obtain a second image, and determining whether the second image is a real defective image to generate a second re-interpretation result. 如請求項12所述的自動化光學複判方法,其中該第一影像包括一紅光成分影像、一綠光成分影像、一藍光成分影像或一白光成分影像;其中該第二影像包括一螢光成分影像。An automated optical review method as described in claim 12, wherein the first image includes a red light component image, a green light component image, a blue light component image, or a white light component image; and wherein the second image includes a fluorescent component image. 如請求項12所述的自動化光學複判方法,其中若檢測資訊標示該待測物的瑕疵相對於周遭之色調、飽和度、亮度反差較大的區域,係提供均勻光或環境光至該待測物的表面。In the automated optical review method as described in claim 12, if the detection information indicates that the defect of the object to be tested is in an area with a larger contrast in color tone, saturation, and brightness relative to the surroundings, uniform light or ambient light is provided to the surface of the object to be tested. 如請求項12所述的自動化光學複判方法,其中若檢測資訊標示該待測物的瑕疵具備立體特徵,係提供側向的平行光至該待測物的表面。In the automated optical review method of claim 12, if the detection information indicates that the defect of the object to be tested has three-dimensional characteristics, side parallel light is provided to the surface of the object to be tested. 如請求項12所述的自動化光學複判方法,其中若檢測資訊標示該待測物的瑕疵為內部的瑕疵,係提供背光源至該待測物的背面。In the automated optical review method of claim 12, if the detection information indicates that the defect of the object to be tested is an internal defect, a backlight source is provided to the back side of the object to be tested. 如請求項12所述的自動化光學複判方法,其中若檢測資訊標示該待測物的瑕疵特別能夠反射特定波長的光,係提供可切換頻譜的光源用以照射該待測物。In the automated optical review method as described in claim 12, if the detection information indicates that the defect of the object to be tested is particularly capable of reflecting light of a specific wavelength, a light source with a switchable frequency spectrum is provided to illuminate the object to be tested. 如請求項12所述的自動化光學複判方法,其中於拍攝該待測物時,控制裝置根據該檢測資訊控制該光源裝置的光學輸出特性以及該影像擷取裝置的外在參數及/或內在參數,以強化該瑕疵區域影像中的瑕疵特徵。An automated optical review method as described in claim 12, wherein when photographing the object to be tested, the control device controls the optical output characteristics of the light source device and the external parameters and/or internal parameters of the image capture device according to the detection information to enhance the defect characteristics in the image of the defect area. 如請求項18所述的自動化光學複判方法,其中該光源裝置所得調整的該光學輸出特性包括光源強度、照射角度、或頻譜。An automated optical review method as described in claim 18, wherein the adjusted optical output characteristics of the light source device include light source intensity, illumination angle, or spectrum.
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