TW202426158A - Laser bonding of glass substrates - Google Patents
Laser bonding of glass substrates Download PDFInfo
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- 239000011521 glass Substances 0.000 title claims abstract description 526
- 239000000758 substrate Substances 0.000 title claims abstract description 502
- 238000000034 method Methods 0.000 claims abstract description 148
- 230000003287 optical effect Effects 0.000 claims abstract description 136
- 238000003466 welding Methods 0.000 claims abstract description 66
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims description 115
- 239000002184 metal Substances 0.000 claims description 115
- 239000011888 foil Substances 0.000 claims description 108
- 238000010521 absorption reaction Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 24
- 239000005388 borosilicate glass Substances 0.000 claims description 22
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052783 alkali metal Inorganic materials 0.000 claims description 19
- 239000005368 silicate glass Substances 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000002585 base Substances 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000005385 borate glass Substances 0.000 claims description 11
- 150000001340 alkali metals Chemical class 0.000 claims description 10
- -1 alkali metal aluminum silicate Chemical class 0.000 claims description 9
- 239000002241 glass-ceramic Substances 0.000 claims description 9
- 239000005350 fused silica glass Substances 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 229910001020 Au alloy Inorganic materials 0.000 claims description 5
- 229910000906 Bronze Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 229910001080 W alloy Inorganic materials 0.000 claims description 5
- 239000010974 bronze Substances 0.000 claims description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 5
- DEPUMLCRMAUJIS-UHFFFAOYSA-N dicalcium;disodium;dioxido(oxo)silane Chemical compound [Na+].[Na+].[Ca+2].[Ca+2].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O DEPUMLCRMAUJIS-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000003353 gold alloy Substances 0.000 claims description 5
- 239000005365 phosphate glass Substances 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052779 Neodymium Inorganic materials 0.000 claims description 3
- 239000005387 chalcogenide glass Substances 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 239000005383 fluoride glass Substances 0.000 claims description 3
- GCFDVEHYSAUQGL-UHFFFAOYSA-J fluoro-dioxido-oxo-$l^{5}-phosphane;tin(4+) Chemical compound [Sn+4].[O-]P([O-])(F)=O.[O-]P([O-])(F)=O GCFDVEHYSAUQGL-UHFFFAOYSA-J 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- SITVSCPRJNYAGV-UHFFFAOYSA-L tellurite Chemical compound [O-][Te]([O-])=O SITVSCPRJNYAGV-UHFFFAOYSA-L 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- QUBMWJKTLKIJNN-UHFFFAOYSA-B tin(4+);tetraphosphate Chemical compound [Sn+4].[Sn+4].[Sn+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QUBMWJKTLKIJNN-UHFFFAOYSA-B 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000006117 anti-reflective coating Substances 0.000 claims description 2
- 238000003860 storage Methods 0.000 description 4
- 239000012780 transparent material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/08—Joining glass to glass by processes other than fusing with the aid of intervening metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
本申請案依據專利法規主張2022年11月29日提出之美國臨時申請案第63/428479號之優先權權益,其內容藉由參照其全文的方式在此被依賴且併入。This application claims the benefit of priority under patent law to U.S. Provisional Application No. 63/428,479, filed on November 29, 2022, the contents of which are hereby relied upon and incorporated by reference in their entirety.
本說明書大體上關於接合至玻璃的玻璃,及具體地關於玻璃基板的邊緣的雷射接合。This specification generally relates to glass bonding to glass, and specifically to laser bonding of edges of glass substrates.
焊接玻璃物件越來越流行用於廣泛的應用。在特定應用中,會期望形成大的單塊物件,其可藉由將相對小的玻璃基板的邊緣接觸並將玻璃基板焊接在一起來生產。然而,由於光的折射,會難以遞送聚焦雷射束至玻璃基板的特定部分(例如,邊緣)以充分地焊接玻璃基板。Welding glass objects is becoming increasingly popular for a wide range of applications. In certain applications, it may be desirable to form a large monolithic object, which can be produced by contacting the edges of relatively small glass substrates and welding the glass substrates together. However, due to the refraction of light, it can be difficult to deliver a focused laser beam to specific portions of the glass substrates (e.g., the edges) to adequately weld the glass substrates.
因此,存在著對於生產藉由將玻璃基板的邊緣焊接在一起而形成的焊接玻璃物件的替代方法的需求。Therefore, there exists a need for an alternative method of producing welded glass articles formed by welding the edges of glass substrates together.
根據第一態樣A1,一種雷射接合玻璃基板的方法可包括:在第一玻璃基板的第一邊緣與第二玻璃基板的第二邊緣之間安置第一吸收層,第一玻璃基板與第二玻璃基板各自包含主要相對表面,第一玻璃基板與第二玻璃基板的主要相對表面被個別的第一與第二邊緣所圍界;將第一玻璃基板的第一邊緣與第二玻璃基板的第二邊緣接觸第一吸收層以形成第一界面;在第一玻璃基板與第二玻璃基板的光學地上游處安置折射光學元件,折射光學元件與第一玻璃基板和第二玻璃基板的至少一者形成光學接觸;及藉由在折射光學元件的入射側上引導雷射束來執行第一焊接步驟,使得雷射束在第一界面上以第一入射側角折射,以將第一玻璃基板接合至第二玻璃基板並形成第一接合位置。According to a first aspect A1, a method for laser bonding glass substrates may include: disposing a first absorption layer between a first edge of a first glass substrate and a second edge of a second glass substrate, the first glass substrate and the second glass substrate each including a major opposing surface, the major opposing surfaces of the first glass substrate and the second glass substrate being bounded by respective first and second edges; contacting the first edge of the first glass substrate and the second edge of the second glass substrate to the first absorption layer to form a first interface; disposing a refractive optical element optically upstream of the first glass substrate and the second glass substrate, the refractive optical element forming an optical contact with at least one of the first glass substrate and the second glass substrate; and performing a first welding step by directing a laser beam on an incident side of the refractive optical element so that the laser beam is refracted at a first incident side angle on the first interface to bond the first glass substrate to the second glass substrate and form a first bonding position.
第二態樣A2包括根據第一態樣A1的方法,其中雷射束被引導正交於第一玻璃基板和第二玻璃基板。A second aspect A2 comprises the method according to the first aspect A1, wherein the laser beam is directed orthogonal to the first glass substrate and the second glass substrate.
第三態樣A3包括根據第二態樣A2的方法,其中折射光學元件是稜鏡,此稜鏡具有大於或等於70°及小於或等於85°的底角。A third aspect A3 comprises a method according to the second aspect A2, wherein the refractive optical element is a prism having a base angle greater than or equal to 70° and less than or equal to 85°.
第四態樣A4包括根據第二態樣A2的方法,其中折射光學元件是繞射光柵,此繞射光柵具有大於或等於30°的繞射角。A fourth aspect A4 comprises the method according to the second aspect A2, wherein the refractive optical element is a diffraction grating having a diffraction angle greater than or equal to 30°.
第五態樣A5包括根據第一態樣A1的方法,其中雷射束以相對於第一玻璃基板和第二玻璃基板大於0°的角度被引導。A fifth aspect A5 includes a method according to the first aspect A1, wherein the laser beam is directed at an angle greater than 0° relative to the first glass substrate and the second glass substrate.
第六態樣A6包括根據第五態樣A5的方法,其中折射光學元件是稜鏡,此稜鏡具有大於或等於30°及小於或等於60°的底角。A sixth aspect A6 comprises a method according to the fifth aspect A5, wherein the refractive optical element is a prism having a base angle greater than or equal to 30° and less than or equal to 60°.
第七態樣A7包括根據第五態樣A5的方法,其中折射光學元件是繞射光柵,此繞射光柵具有大於或等於20°的繞射角。A seventh aspect A7 comprises the method according to the fifth aspect A5, wherein the refractive optical element is a diffraction grating having a diffraction angle greater than or equal to 20°.
第八態樣A8包括根據第一至第七態樣A1-A7的任一者的方法,其中第一入射側角大於或等於0°及小於或等於45°。The eighth aspect A8 includes a method according to any one of the first to seventh aspects A1-A7, wherein the first incident side angle is greater than or equal to 0° and less than or equal to 45°.
第九態樣A9包括根據第一至第八態樣A1-A8的任一者的方法,其中在第一焊接步驟期間,雷射束相對於折射光學元件的入射側移位。A ninth aspect A9 comprises a method according to any one of the first to eighth aspects A1-A8, wherein during the first welding step, the laser beam is displaced relative to the incident side of the refractive optical element.
第十態樣A10包括根據第一至第九態樣A1-A9的任一者的方法,其中折射光學元件是稜鏡,此稜鏡包含安置在入射側上的塗層。A tenth aspect A10 comprises a method according to any one of the first to ninth aspects A1-A9, wherein the refractive optical element is a prism comprising a coating disposed on the incident side.
第十一態樣A11包括根據第十態樣A10的方法,其中塗層包含抗反射塗層。The eleventh aspect A11 includes the method according to the tenth aspect A10, wherein the coating comprises an anti-reflective coating.
第十二態樣A12包括根據第一至第九態樣A1-A9的任一者的方法,其中折射光學元件是繞射光柵,此繞射光柵具有結構化表面。A twelfth aspect A12 comprises a method according to any one of the first to ninth aspects A1-A9, wherein the refractive optical element is a diffraction grating having a structured surface.
第十三態樣A13包括根據第一至第十二態樣A1-A12的任一者的方法,其中折射光學元件包含熔融矽石。The thirteenth aspect A13 includes a method according to any one of the first to twelfth aspects A1-A12, wherein the refractive optical element comprises fused silica.
第十四態樣A14包括根據第一至第十三態樣A1-A13的任一者的方法,其中第一接合位置具有在給定波長且在物件厚度為0.5 mm的大於或等於70%的透射率。A fourteenth aspect A14 includes a method according to any one of the first to thirteenth aspects A1-A13, wherein the first bonding location has a transmittance greater than or equal to 70% at a given wavelength and at an object thickness of 0.5 mm.
第十五態樣A15包括根據第一至第十四態樣A1-A14的任一者的方法,其中接觸步驟包含沿著垂直於第一界面的平面對齊第一玻璃基板與第二玻璃基板的主要相對表面。A fifteenth aspect A15 comprises a method according to any one of the first to fourteenth aspects A1-A14, wherein the contacting step comprises aligning major opposing surfaces of the first glass substrate and the second glass substrate along a plane perpendicular to the first interface.
第十六態樣A16包括根據第一至第十五態樣A1-A15的任一者的方法,其中第一吸收層包含金屬膜、金屬箔、無機特化玻璃、玻璃料、或前述物的組合。The sixteenth aspect A16 comprises a method according to any one of the first to fifteenth aspects A1-A15, wherein the first absorption layer comprises a metal film, a metal foil, an inorganic specialized glass, a glass frit, or a combination thereof.
第十七態樣A17包括根據第十六態樣A16的方法,其中金屬膜包含銅、鋁、不鏽鋼、鉻、鉬、鎳、錫氧化物、矽氧化物、錫磷酸鹽、錫氟磷酸鹽、硫屬玻璃、亞碲酸鹽玻璃、硼酸鹽玻璃、或前述物的組合。The seventeenth aspect A17 includes a method according to the sixteenth aspect A16, wherein the metal film comprises copper, aluminum, stainless steel, chromium, molybdenum, nickel, tin oxide, silicon oxide, tin phosphate, tin fluorophosphate, chalcogenide glass, tellurite glass, borate glass, or a combination of the foregoing.
第十八態樣A18包括根據第十六態樣A16或第十七態樣A17的方法,其中金屬箔包含鋁、鋁合金、不鏽鋼、鎳、鎳合金、銀、銀合金、鈦、鈦合金、鎢、鎢合金、金、金合金、銅、銅合金、青銅、鐵、或前述物的組合。The eighteenth aspect A18 comprises a method according to the sixteenth aspect A16 or the seventeenth aspect A17, wherein the metal foil comprises aluminum, an aluminum alloy, stainless steel, nickel, a nickel alloy, silver, a silver alloy, titanium, a titanium alloy, tungsten, a tungsten alloy, gold, a gold alloy, copper, a copper alloy, bronze, iron, or a combination of the foregoing.
第十九態樣A19包括根據第十六至第十八態樣A16-A18的任一者的方法,其中無機特化玻璃包含氟化玻璃材料、錫摻雜玻璃材料、過渡金屬摻雜玻璃材料、或前述物的組合。The nineteenth aspect A19 comprises a method according to any one of the sixteenth to eighteenth aspects A16-A18, wherein the inorganic specialized glass comprises a fluoride glass material, a tin-doped glass material, a transition metal-doped glass material, or a combination of the foregoing.
第二十態樣A20包括根據第十六至第十九態樣A16-A19的任一者的方法,其中玻璃料是包含至少一吸收離子的低溫玻璃料,至少一吸收離子包含鐵、銅、釩、與釹的至少一者。The twentieth aspect A20 comprises a method according to any one of the sixteenth to nineteenth aspects A16-A19, wherein the glass frit is a low temperature glass frit comprising at least one absorbing ion, the at least one absorbing ion comprising at least one of iron, copper, vanadium, and neodymium.
第二十一態樣A21包括根據第一至第二十態樣A1-A20的任一者的方法,其中第一吸收層具有大於或等於20 nm及小於或等於1 µm的厚度。The twenty-first aspect A21 includes the method according to any one of the first to twentieth aspects A1-A20, wherein the first absorption layer has a thickness greater than or equal to 20 nm and less than or equal to 1 µm.
第二十二態樣A22包括根據第一至第二十一態樣A1-A21的任一者的方法,其中方法進一步包含:在第二玻璃基板的第二邊緣與第三玻璃基板的第三邊緣之間安置第二吸收層,第三玻璃基板包含主要相對表面,第三玻璃基板的主要相對表面被第三邊緣所圍界;將第二玻璃基板的第二邊緣與第三玻璃基板的第三邊緣接觸第二吸收層以形成第二界面;在第二玻璃基板與第三玻璃基板的光學地上游處安置折射光學元件;及藉由在折射光學元件的入射側上引導雷射束來執行第二焊接步驟,使得雷射束在第二界面上以第二入射側角折射,以將第二玻璃基板接合至第三玻璃基板並形成第二接合位置。The twenty-second aspect A22 comprises a method according to any one of the first to twenty-first aspects A1-A21, wherein the method further comprises: disposing a second absorption layer between a second edge of a second glass substrate and a third edge of a third glass substrate, the third glass substrate comprising a main opposing surface, the main opposing surface of the third glass substrate being bounded by the third edge; contacting the second edge of the second glass substrate and the third edge of the third glass substrate to the second absorption layer to form a second interface; disposing a refractive optical element optically upstream of the second glass substrate and the third glass substrate; and performing a second welding step by directing a laser beam on an incident side of the refractive optical element so that the laser beam is refracted at a second incident side angle on the second interface to bond the second glass substrate to the third glass substrate and form a second bonding position.
第二十三態樣A23包括根據第一至第二十二態樣A1-A22的任一者的方法,其中雷射束包含波長,使得第一玻璃基板、第二玻璃基板、與折射光學元件對於雷射束的波長為實質上透明。The twenty-third aspect A23 includes a method according to any one of the first to twenty-second aspects A1-A22, wherein the laser beam comprises a wavelength such that the first glass substrate, the second glass substrate, and the refractive optical element are substantially transparent to the wavelength of the laser beam.
第二十四態樣A24包括根據第一至第二十三態樣A1-A23的任一者的方法,其中雷射束包含波長,使得第一吸收層對於雷射束的波長為實質上不透明。The twenty-fourth aspect A24 comprises a method according to any one of the first to twenty-third aspects A1-A23, wherein the laser beam comprises a wavelength such that the first absorption layer is substantially opaque to the wavelength of the laser beam.
第二十五態樣A25包括根據第一至第二十四態樣A1-A24的任一者的方法,其中雷射束包含脈衝式雷射,脈衝式雷射是奈秒脈衝式雷射、皮秒脈衝式雷射、或飛秒脈衝式雷射。The twenty-fifth aspect A25 includes a method according to any one of the first to twenty-fourth aspects A1-A24, wherein the laser beam comprises a pulsed laser, and the pulsed laser is a nanosecond pulsed laser, a picosecond pulsed laser, or a femtosecond pulsed laser.
第二十六態樣A26包括根據第二十五態樣A25的方法,其中脈衝式雷射包含:脈衝能量,大於或等於0.1 µJ及小於或等於1000 µJ;波長,大於或等於300 nm及小於或等於2000 nm;重複率,大於或等於1 kHz及小於或等於1000 kHz;及光點尺寸,大於或等於5 µm及小於或等於50 µm。A twenty-sixth aspect A26 comprises the method according to the twenty-fifth aspect A25, wherein the pulsed laser comprises: a pulse energy greater than or equal to 0.1 µJ and less than or equal to 1000 µJ; a wavelength greater than or equal to 300 nm and less than or equal to 2000 nm; a repetition rate greater than or equal to 1 kHz and less than or equal to 1000 kHz; and a spot size greater than or equal to 5 µm and less than or equal to 50 µm.
第二十七態樣A27包括根據第二十五態樣A25或第二十六態樣A26的方法,其中脈衝式雷射包含脈衝寬度小於或等於10 ps。A twenty-seventh aspect A27 includes the method according to the twenty-fifth aspect A25 or the twenty-sixth aspect A26, wherein the pulsed laser comprises a pulse width less than or equal to 10 ps.
第二十八態樣A28包括根據第一至第二十七態樣A1-A27的任一者的方法,其中第一玻璃基板與第二玻璃基板包含折射率大於或等於1.5及小於或等於2.4。The twenty-eighth aspect A28 includes a method according to any one of the first to twenty-seventh aspects A1-A27, wherein the first glass substrate and the second glass substrate include a refractive index greater than or equal to 1.5 and less than or equal to 2.4.
第二十九態樣A29包括根據第一至第二十八態樣A1-A28的任一者的方法,其中第一玻璃基板與第二玻璃基板包含玻璃或玻璃陶瓷,玻璃或玻璃陶瓷包含硼酸鹽玻璃、矽硼酸鹽玻璃、磷酸鹽系玻璃、碳化矽玻璃、鈣鈉矽酸鹽玻璃、鋁矽酸鹽玻璃、鹼金屬鋁矽酸鹽玻璃、硼矽酸鹽玻璃、鹼金屬硼矽酸鹽玻璃、鋁硼矽酸鹽玻璃、鹼金屬鋁硼矽酸鹽玻璃、鹼金屬鋁矽酸鹽玻璃、熔融矽石、或低膨脹玻璃。The twenty-ninth aspect A29 includes a method according to any one of the first to twenty-eighth aspects A1-A28, wherein the first glass substrate and the second glass substrate comprise glass or glass ceramics, and the glass or glass ceramics comprise borate glass, silica borate glass, phosphate glass, silicon carbide glass, sodium calcium silicate glass, aluminum silicate glass, alkali metal aluminum silicate glass, borosilicate glass, alkali metal borosilicate glass, aluminum borosilicate glass, alkali metal aluminum borosilicate glass, alkali metal aluminum silicate glass, fused silica, or low expansion glass.
第三十態樣A30包括根據第二十九態樣A29的方法,其中低膨脹玻璃包含二氧化鈦矽酸鹽玻璃。The 30th aspect A30 comprises a method according to the 29th aspect A29, wherein the low expansion glass comprises titanium dioxide silicate glass.
第三十一態樣A31包括根據第一至第三十態樣A1-A30的任一者的方法,其中第一玻璃基板與第二玻璃基板具有大於或等於0.5 mm的厚度。The thirty-first aspect A31 includes the method according to any one of the first to thirtieth aspects A1-A30, wherein the first glass substrate and the second glass substrate have a thickness greater than or equal to 0.5 mm.
根據第三十二態樣A32,一種物件可包含:第一玻璃基板,包含第一邊緣;第二玻璃基板,包含第二邊緣,第一玻璃基板與第二玻璃基板各自包含主要相對表面,第一玻璃基板與第二玻璃基板的主要相對表面被個別的第一邊緣與第二邊緣所圍界;及第一界面焊接,在第一玻璃基板的第一邊緣與第二玻璃基板的第二邊緣之間。According to the thirty-second aspect A32, an object may include: a first glass substrate including a first edge; a second glass substrate including a second edge, the first glass substrate and the second glass substrate each including a major opposing surface, the major opposing surfaces of the first glass substrate and the second glass substrate being bounded by the respective first edge and the second edge; and a first interface weld between the first edge of the first glass substrate and the second edge of the second glass substrate.
第三十三態樣A33包括根據第三十二態樣A32的物件,其中第一界面焊接包含焊接線,焊接線具有大於或等於5 µm及小於或等於1 mm的寬度及在焊接線之間的距離為大於或等於1 µm及小於或等於1000 µm。The thirty-third aspect A33 comprises an article according to the thirty-second aspect A32, wherein the first interface weld comprises weld lines having a width greater than or equal to 5 µm and less than or equal to 1 mm and a distance between the weld lines greater than or equal to 1 µm and less than or equal to 1000 µm.
第三十四態樣A34包括根據第三十二態樣A32或第三十三態樣A33的物件,其中物件進一步包含第三玻璃基板及在第三玻璃基板的第三邊緣與第二玻璃基板的第二邊緣之間的第二界面焊接,第三玻璃基板包含主要相對表面,第三玻璃基板的主要相對表面被第三邊緣所圍界。A thirty-fourth aspect A34 comprises an object according to the thirty-second aspect A32 or the thirty-third aspect A33, wherein the object further comprises a third glass substrate and a second interface weld between a third edge of the third glass substrate and a second edge of the second glass substrate, the third glass substrate comprising a major opposing surface, the major opposing surface of the third glass substrate being bounded by the third edge.
第三十五態樣A35包括根據第三十二至第三十四態樣A32-A34的任一者的物件,其中物件進一步包含吸收層,在第一玻璃基板與第二玻璃基板的邊緣之間,界面焊接的至少一部分包含吸收層。A thirty-fifth aspect A35 includes the article of any one of aspects A32-A34, wherein the article further comprises an absorbing layer, and at least a portion of the interface weld between the edges of the first glass substrate and the second glass substrate comprises the absorbing layer.
第三十六態樣A36包括根據第三十五態樣A35的物件,其中吸收層包含金屬膜、金屬箔、無機特化玻璃、玻璃料、或前述物的組合。The thirty-sixth aspect A36 comprises the object according to the thirty-fifth aspect A35, wherein the absorption layer comprises a metal film, a metal foil, an inorganic specialized glass, a glass frit, or a combination thereof.
第三十七態樣A37包括根據第三十二態樣A32的物件,其中物件進一步包含第一金屬箔與第二金屬箔,第一金屬箔接觸第一邊緣與第一玻璃基板的主要相對表面,第二金屬箔接觸第二邊緣與第二玻璃基板的主要相對表面,其中第一界面焊接包含第一金屬箔與第二金屬箔。Aspect 37 A37 comprises an object according to aspect 32 A32, wherein the object further comprises a first metal foil and a second metal foil, the first metal foil contacts the first edge and the major opposing surface of the first glass substrate, the second metal foil contacts the second edge and the major opposing surface of the second glass substrate, wherein the first interface weld comprises the first metal foil and the second metal foil.
第三十八態樣A38包括根據第三十二至第三十七態樣A32-A37的任一者的物件,其中第一玻璃基板與第二玻璃基板包含玻璃或玻璃陶瓷,玻璃或玻璃陶瓷包含硼酸鹽玻璃、矽硼酸鹽玻璃、磷酸鹽系玻璃、碳化矽玻璃、鈣鈉矽酸鹽玻璃、鋁矽酸鹽玻璃、鹼金屬鋁矽酸鹽玻璃、硼矽酸鹽玻璃、鹼金屬硼矽酸鹽玻璃、鋁硼矽酸鹽玻璃、鹼金屬鋁硼矽酸鹽玻璃、鹼金屬鋁矽酸鹽玻璃、熔融矽石、或低膨脹玻璃。The thirty-eighth aspect A38 includes an object according to any one of the thirty-second to thirty-seventh aspects A32-A37, wherein the first glass substrate and the second glass substrate comprise glass or glass ceramics, and the glass or glass ceramics comprise borate glass, silica borate glass, phosphate glass, silicon carbide glass, sodium calcium silicate glass, aluminum silicate glass, alkali metal aluminum silicate glass, borosilicate glass, alkali metal borosilicate glass, aluminum borosilicate glass, alkali metal aluminum borosilicate glass, alkali metal aluminum silicate glass, fused silica, or low expansion glass.
根據第三十九態樣A39,一種雷射接合玻璃基板的方法可包含:將第一玻璃基板的第一主要相對表面接觸第一金屬箔,第一接觸位置被創造在第一主要相對表面的至少一部分與第一金屬箔之間;藉由在第一接觸位置的至少一部分上引導雷射束來執行第一焊接步驟,以將第一玻璃基板的第一主要相對表面接合至第一金屬箔並形成第一接合位置;將第一玻璃基板的第二主要相對表面接觸第一金屬箔,第一主要相對表面與第二主要相對表面被第一邊緣所圍界,第二接觸位置被創造在第二主要相對表面的至少一部分與第一金屬箔之間;在第一玻璃基板的光學地上游處安置折射光學元件,折射光學元件形成光學接觸第一玻璃基板;藉由在折射光學元件的入射側上引導雷射束來執行第二焊接步驟,使得雷射束在第二接觸位置的至少一部分上以第一入射側角折射,以將第一玻璃基板的第二主要相對表面接合至第一金屬箔並形成第二接合位置;將第二玻璃基板的第三主要相對表接觸第二金屬箔,第三接觸位置被創造在第三主要相對表面的至少一部分與第二金屬箔之間;藉由在第三接觸位置的至少一部分上引導雷射束來執行第三焊接步驟,以將第二玻璃基板的第三主要相對表面接合至第二金屬箔並形成第三接合位置;將第二玻璃基板的第四主要相對表面接觸第二金屬箔,第三主要相對表面與第四主要相對表面被第二邊緣所圍界,第四接觸位置被創造在第四主要相對表面的至少一部分與第二金屬箔之間;在第二玻璃基板的光學地上游處安置折射光學元件,折射光學元件形成光學接觸第二玻璃基板;藉由在折射光學元件的入射側上引導雷射束來執行第四焊接步驟,使得雷射束在第四接觸位置的至少一部分上以第二入射側角折射,以將第二玻璃基板的第四主要表面接合至第二金屬箔並形成第四接合位置;將第一金屬箔與第二金屬箔接觸以創造第五接觸位置,第一玻璃基板的第一主要相對表面與第二主要相對表面沿著垂直於第五接觸位置的平面對齊第二玻璃基板的第三主要相對表面與第四主要相對表面;及執行第五焊接步驟以接合第一金屬箔與第二金屬箔並形成第五接合位置。According to the thirty-ninth aspect A39, a method for laser bonding glass substrates may include: contacting a first main opposing surface of a first glass substrate to a first metal foil, wherein a first contact position is created between at least a portion of the first main opposing surface and the first metal foil; performing a first welding step by directing a laser beam on at least a portion of the first contact position to bond the first main opposing surface of the first glass substrate to the first metal foil and form a first bonding position; contacting a second main opposing surface of the first glass substrate to the first metal foil, wherein the first main opposing surface and the second main opposing surface are bounded by a first edge, and the second contact position is The method comprises the steps of: placing a refractive optical element at an optical upstream of the first glass substrate, the refractive optical element forming an optical contact with the first glass substrate; performing a second welding step by directing a laser beam on an incident side of the refractive optical element so that the laser beam is refracted at a first incident side angle on at least a portion of the second contact position to bond the second major opposing surface of the first glass substrate to the first metal foil and form a second bonding position; contacting a third major opposing surface of the second glass substrate to the second metal foil, the third contact position being created on at least one of the third major opposing surfaces; and placing a refractive optical element at an optical upstream of the first glass substrate, the refractive optical element forming an optical contact with the first glass substrate. The method further comprises: performing a third welding step by directing a laser beam on at least a portion of the third contact location to bond the third major opposing surface of the second glass substrate to the second metal foil and form a third bonding location; contacting a fourth major opposing surface of the second glass substrate to the second metal foil, the third major opposing surface and the fourth major opposing surface being bounded by a second edge, and a fourth contact location being created between at least a portion of the fourth major opposing surface and the second metal foil; placing a refractive optical element optically upstream of the second glass substrate, the refractive optical element optically contacting the second glass substrate; and performing a third welding step by directing a laser beam on at least a portion of the third contact location to bond the third major opposing surface of the second glass substrate to the second metal foil and form a third bonding location. A fourth welding step is performed by directing a laser beam on an incident side of the optical element so that the laser beam is refracted at a second incident side angle on at least a portion of a fourth contact location to bond the fourth major surface of the second glass substrate to the second metal foil and form a fourth bonding location; the first metal foil is contacted with the second metal foil to create a fifth contact location, and the first major opposing surface and the second major opposing surface of the first glass substrate are aligned with the third major opposing surface and the fourth major opposing surface of the second glass substrate along a plane perpendicular to the fifth contact location; and a fifth welding step is performed to bond the first metal foil and the second metal foil and form the fifth bonding location.
第四十態樣A40包括根據第三十九態樣A39的方法,其中第一金屬箔與第二金屬箔各自具有大於或等於5 µm及小於或等於50 µm的厚度。The fortieth aspect A40 comprises the method according to the thirty-ninth aspect A39, wherein the first metal foil and the second metal foil each have a thickness greater than or equal to 5 μm and less than or equal to 50 μm.
第四十一態樣A41包括根據第三十九態樣A39或第四十態樣A40的方法,其中第一金屬箔與第二金屬箔的至少一者包含鋁、鋁合金、不鏽鋼、鎳、鎳合金、銀、銀合金、鈦、鈦合金、鎢、鎢合金、金、金合金、銅、銅合金、青銅、鐵、或前述物的組合。The forty-first aspect A41 comprises a method according to the thirty-ninth aspect A39 or the fortieth aspect A40, wherein at least one of the first metal foil and the second metal foil comprises aluminum, an aluminum alloy, stainless steel, nickel, a nickel alloy, silver, a silver alloy, titanium, a titanium alloy, tungsten, a tungsten alloy, gold, a gold alloy, copper, a copper alloy, bronze, iron, or a combination of the foregoing.
根據第四十二態樣A42,一種雷射接合玻璃基板的方法可包含:將第一玻璃基板的第一邊緣接觸第二玻璃基板的第二邊緣,第一玻璃基板與第二玻璃基板各自包含主要相對表面,第一玻璃基板與第二玻璃基板的主要相對表面被個別的第一邊緣與第二邊緣所圍界;將第一非透明基板接觸第一玻璃基板與第二玻璃基板的每一者的主要相對表面中的一者,使得第一非透明基板覆蓋第一玻璃基板與第二玻璃基板兩者,與第一玻璃基板的至少一部分形成第一接觸位置,及與第二玻璃基板的至少一部分形成第二接觸位置;藉由在第一接觸位置的至少一部分上引導雷射束來執行第一焊接步驟,以將第一玻璃基板接合至第一非透明基板並形成第一接合位置;藉由在第二接觸位置的至少一部分上引導雷射束來執行第二焊接步驟,以將第二玻璃基板接合至第一非透明基板並形成第二接合位置;將第二非透明基板接觸第一玻璃基板與第二玻璃基板的每一者的另一個主要相對表面,使得第二非透明基板覆蓋第一玻璃基板與第二玻璃基板兩者,與第一玻璃基板的至少一部分形成第三接觸位置,及與第二玻璃基板的至少一部分形成第四接觸位置;在第一玻璃基板與第二玻璃基板的光學地上游處安置折射光學元件,折射光學元件形成光學接觸第一玻璃基板或第二玻璃基板;藉由在折射光學元件的入射側上引導雷射束來執行第三焊接步驟,使得雷射束在第三接觸位置的至少一部分上以第一入射側角折射,以將第一玻璃基板接合至第二非透明基板並形成第三接合位置;及藉由在折射光學元件的入射側上引導雷射束來執行第四焊接步驟,使得雷射束在第四接觸位置的至少一部分上以第二入射側角折射,以將第二玻璃基板接合至第二非透明基板並形成第四接合位置。According to a forty-second aspect A42, a method for laser bonding glass substrates may include: contacting a first edge of a first glass substrate to a second edge of a second glass substrate, wherein the first glass substrate and the second glass substrate each include a major opposing surface, and the major opposing surfaces of the first glass substrate and the second glass substrate are bounded by respective first edges and second edges; contacting a first non-transparent substrate to one of the major opposing surfaces of each of the first glass substrate and the second glass substrate, such that the first non-transparent substrate covers the first glass substrate; The method comprises: forming a first contact position with at least a portion of the first glass substrate and a second contact position with at least a portion of the second glass substrate; performing a first welding step by directing a laser beam on at least a portion of the first contact position to bond the first glass substrate to the first non-transparent substrate and form a first bonding position; and performing a second welding step by directing a laser beam on at least a portion of the second contact position to bond the second glass substrate to the first non-transparent substrate and form a second bonding position. position; contacting the second non-transparent substrate to the other main opposing surface of each of the first glass substrate and the second glass substrate, so that the second non-transparent substrate covers both the first glass substrate and the second glass substrate, forms a third contact position with at least a portion of the first glass substrate, and forms a fourth contact position with at least a portion of the second glass substrate; placing a refractive optical element at an optical upstream of the first glass substrate and the second glass substrate, the refractive optical element forming an optical contact with the first glass substrate or the second glass substrate; by A third welding step is performed by directing a laser beam on the incident side of the refractive optical element so that the laser beam is refracted at a first incident side angle on at least a portion of a third contact position to bond the first glass substrate to the second non-transparent substrate and form a third bonding position; and a fourth welding step is performed by directing a laser beam on the incident side of the refractive optical element so that the laser beam is refracted at a second incident side angle on at least a portion of a fourth contact position to bond the second glass substrate to the second non-transparent substrate and form a fourth bonding position.
第四十三態樣A43包括根據第四十二態樣A42的方法,其中第一非透明材料與第二非透明材料的至少一者包含鋁、銅、或前述物的組合。The forty-third aspect A43 comprises a method according to the forty-second aspect A42, wherein at least one of the first non-transparent material and the second non-transparent material comprises aluminum, copper, or a combination thereof.
第四十四態樣A44包括根據第四十二態樣A42或第四十三態樣A43的方法,其中第一非透明基板與第二非透明基板的至少一者具有小於或等於50 µm的厚度。The forty-fourth aspect A44 includes the method according to the forty-second aspect A42 or the forty-third aspect A43, wherein at least one of the first non-transparent substrate and the second non-transparent substrate has a thickness less than or equal to 50 μm.
本文所述的雷射接合方法的額外特徵與優點將在之後的實施方式中闡述,及部分地對於本領域的通常知識者會是從說明書顯而易見的或藉由實行包括之後的實施方式、申請專利範圍、及隨附圖式之本文所述的實施例而認知。Additional features and advantages of the laser bonding method described herein will be described in the following embodiments, and in part will be apparent to a person of ordinary skill in the art from the description or will be recognized by practicing the embodiments described herein including the following embodiments, the scope of the patent application, and the accompanying drawings.
將理解到前面的概略說明與之後的詳細說明敘述各種實施例及意欲提供理解所要求保護的標的的本質與特性的概觀或架構。隨附圖式被包括以提供進一步理解各種實施例,且被併入與構成說明書的一部分。圖式繪示本文所述的各種實施例,且與說明書一起用於解釋所要求保護的標的的原理與操作。It will be understood that the foregoing general description and the following detailed description describe various embodiments and are intended to provide an overview or framework for understanding the nature and characteristics of the claimed subject matter. The accompanying drawings are included to provide a further understanding of the various embodiments and are incorporated into and constitute a part of the specification. The drawings illustrate various embodiments described herein and together with the specification serve to explain the principles and operation of the claimed subject matter.
現在將詳細地參照沿著它們各自的邊緣雷射接合玻璃基板的方法的各種實施例。根據實施例,一種接合玻璃基板的方法包含:在第一玻璃基板的第一邊緣與第二玻璃基板的第二邊緣之間安置第一吸收層,第一玻璃基板與第二玻璃基板各自包含主要相對表面,第一玻璃基板與第二玻璃基板的主要相對表面被個別的第一與第二邊緣所圍界;將第一玻璃基板的第一邊緣與第二玻璃基板的第二邊緣接觸第一吸收層以形成第一界面;在第一玻璃基板與第二玻璃基板的光學地上游處安置折射光學元件,折射光學元件形成光學接觸第一玻璃基板與第二玻璃基板的至少一者;及藉由在折射光學元件的入射側上引導雷射束來執行第一焊接步驟,使得雷射束在第一界面上以第一入射側角折射,以將第一玻璃基板接合至第二玻璃基板並形成第一接合位置。Reference will now be made in detail to various embodiments of methods of laser bonding glass substrates along their respective edges. According to an embodiment, a method for bonding glass substrates includes: disposing a first absorbing layer between a first edge of a first glass substrate and a second edge of a second glass substrate, the first glass substrate and the second glass substrate each including a major opposing surface, the major opposing surfaces of the first glass substrate and the second glass substrate being bounded by respective first and second edges; contacting the first edge of the first glass substrate and the second edge of the second glass substrate to the first absorbing layer to form a first interface; disposing a refractive optical element optically upstream of the first glass substrate and the second glass substrate, the refractive optical element forming an optical contact with at least one of the first glass substrate and the second glass substrate; and performing a first welding step by directing a laser beam on an incident side of the refractive optical element so that the laser beam is refracted at a first incident side angle on the first interface to bond the first glass substrate to the second glass substrate and form a first bonding location.
根據其他實施例,一種物件包含:第一玻璃基板,包含第一邊緣;第二玻璃基板,包含第二邊緣,第一玻璃基板與第二玻璃基板各自包含主要相對表面,第一玻璃基板與第二玻璃基板的主要相對表面被個別的第一與第二邊緣所圍界;及在第一玻璃基板的第一邊緣與第二玻璃基板的第二邊緣之間的第一界面焊接。According to other embodiments, an article includes: a first glass substrate including a first edge; a second glass substrate including a second edge, the first glass substrate and the second glass substrate each including a major opposing surface, the major opposing surfaces of the first glass substrate and the second glass substrate being bounded by the respective first and second edges; and a first interface weld between the first edge of the first glass substrate and the second edge of the second glass substrate.
根據一些實施例,一種接合玻璃基板的方法,此方法包含:將第一玻璃基板的第一主要相對表面接觸第一金屬箔,第一接觸位置被創造在第一主要相對表面的至少一部分與第一金屬箔之間;藉由在第一接觸位置的至少一部分上引導雷射束來執行第一焊接步驟,以將第一玻璃基板的第一主要相對表面接合至第一金屬箔並形成第一接合位置;將第一玻璃基板的第二主要相對表面接觸第一金屬箔,第一主要相對表面與第二主要相對表面被第一邊緣所圍界,第二接觸位置被創造在第二主要相對表面的至少一部分與第一金屬箔之間;在第一玻璃基板的光學地上游處安置折射光學元件,折射光學元件形成光學接觸第一玻璃基板;藉由在折射光學元件的入射側上引導雷射束來執行第二焊接步驟,使得雷射束在第二接觸位置的至少一部分上以第一入射側角折射,以將第一玻璃基板的第二主要表面接合至第一金屬箔並形成第二接合位置;將第二玻璃基板的第三主要相對表接觸第二金屬箔,第三接觸位置被創造在第三主要相對表面的至少一部分與第二金屬箔之間;藉由在第三接觸位置的至少一部分上引導雷射束來執行第三焊接步驟,以將第二玻璃基板的第三主要相對表面接合至第一第二箔並形成第三接合位置;將第二玻璃基板的第四主要相對表面接觸第二金屬箔,第三主要相對表面與第四主要相對表面被第二邊緣所圍界,第四接觸位置被創造在第四主要相對表面的至少一部分與第二金屬箔之間;在第二玻璃基板的光學地上游處安置折射光學元件,折射光學元件形成光學接觸第二玻璃基板;藉由在折射光學元件的入射側上引導雷射束來執行第四焊接步驟,使得雷射束在第四接觸位置的至少一部分上以第二入射側角折射,以將第二玻璃基板的第四主要表面接合至第二金屬箔並形成第四接合位置;將第一金屬箔與第二金屬箔接觸以創造第五接觸位置,第一玻璃基板的第一主要相對表面與第二主要相對表面沿著垂直於第五接觸位置的平面對齊第二玻璃基板的第三主要相對表面與第四主要相對表面;及執行第五焊接步驟以接合第一金屬箔與第二金屬箔並形成第五接合位置。According to some embodiments, a method for bonding glass substrates includes: contacting a first major opposing surface of a first glass substrate to a first metal foil, wherein a first contact location is created between at least a portion of the first major opposing surface and the first metal foil; performing a first welding step by directing a laser beam on at least a portion of the first contact location to bond the first major opposing surface of the first glass substrate to the first metal foil and form the first bonding location; contacting a second major opposing surface of the first glass substrate to the first metal foil, wherein the first major opposing surface and the second major opposing surface are bounded by a first edge, wherein a second contact location is formed between the first major opposing surface and the first metal foil; The invention relates to a method for manufacturing a second welding step in which a laser beam is directed to the first glass substrate and a second major opposing surface is formed between at least a portion of the second major opposing surface and the first metal foil; a refractive optical element is disposed optically upstream of the first glass substrate, the refractive optical element forms an optical contact with the first glass substrate; a second welding step is performed by directing a laser beam on the incident side of the refractive optical element so that the laser beam is refracted at the first incident side angle on at least a portion of the second contact position to bond the second major surface of the first glass substrate to the first metal foil and form a second bonding position; a third major opposing surface of the second glass substrate is contacted to the second metal foil, and a third contact position is created on at least a portion of the third major opposing surface and a second metal foil; performing a third welding step by directing a laser beam on at least a portion of the third contact location to bond the third major opposing surface of the second glass substrate to the first second foil and form a third bonding location; contacting a fourth major opposing surface of the second glass substrate to the second metal foil, the third major opposing surface and the fourth major opposing surface being bounded by a second edge, and a fourth contact location being created between at least a portion of the fourth major opposing surface and the second metal foil; placing a refractive optical element optically upstream of the second glass substrate, the refractive optical element forming an optical contact with the second glass substrate; and performing a third welding step by directing a laser beam on at least a portion of the third contact location to bond the third major opposing surface of the second glass substrate to the first second foil and form a third bonding location. The invention relates to a method for performing a fourth welding step by directing a laser beam on an incident side of the optical element so that the laser beam is refracted at a second incident side angle on at least a portion of a fourth contact location to bond the fourth major surface of the second glass substrate to the second metal foil and form a fourth bonding location; contacting the first metal foil with the second metal foil to create a fifth contact location, wherein the first major opposing surface and the second major opposing surface of the first glass substrate are aligned with the third major opposing surface and the fourth major opposing surface of the second glass substrate along a plane perpendicular to the fifth contact location; and performing a fifth welding step to bond the first metal foil with the second metal foil and form the fifth bonding location.
根據其他實施例,一種接合玻璃基板的方法,此方法包含:將第一玻璃基板的第一邊緣接觸第二玻璃基板的第二邊緣,第一玻璃基板與第二玻璃基板各自包含主要相對表面,第一玻璃基板與第二玻璃基板的主要相對表面被個別的第一邊緣與第二邊緣所圍界;將第一非透明基板接觸第一玻璃基板與第二玻璃基板的每一者的主要相對表面中的一者,使得第一非透明基板覆蓋第一玻璃基板與第二玻璃基板兩者,與第一玻璃基板的至少一部分形成第一接觸位置,及與第二玻璃基板的至少一部分形成第二接觸位置;藉由在第一接觸位置的至少一部分上以第一入射側角引導雷射束來執行第一焊接步驟,以將第一玻璃基板接合至第一非透明基板並形成第一接合位置;藉由在第二接觸位置的至少一部分上以第二入射側角引導雷射束來執行第二焊接步驟,以將第二玻璃基板接合至第一非透明基板並形成第二接合位置;將第二非透明基板接觸第一玻璃基板與第二玻璃基板的每一者的另一個主要相對表面,使得第二非透明基板覆蓋第一玻璃基板與第二玻璃基板兩者,與第一玻璃基板的至少一部分形成第三接觸位置,及與第二玻璃基板的至少一部分形成第四接觸位置;在第一玻璃基板與第二玻璃基板的光學地上游處安置折射光學元件,折射光學元件形成光學接觸第一玻璃基板或第二玻璃基板;藉由在折射光學元件的入射側上引導雷射束來執行第三焊接步驟,使得雷射束在第三接觸位置的至少一部分上以第一入射側角折射,以將第一玻璃基板接合至第二非透明基板並形成第三接合位置;及藉由在折射光學元件的入射側上引導雷射束來執行第四焊接步驟,使得雷射束在第四接觸位置的至少一部分上以第二入射側角折射,以將第二玻璃基板接合至第二非透明基板並形成第四接合位置。According to other embodiments, a method for bonding glass substrates includes: contacting a first edge of a first glass substrate to a second edge of a second glass substrate, the first glass substrate and the second glass substrate each including a major opposing surface, the major opposing surfaces of the first glass substrate and the second glass substrate being bounded by respective first edges and second edges; contacting a first non-transparent substrate to one of the major opposing surfaces of each of the first glass substrate and the second glass substrate, such that the first non-transparent substrate covers the first glass substrate and the second glass substrate. The method comprises: forming a first contact position with at least a portion of the first glass substrate and a second contact position with at least a portion of the second glass substrate; performing a first welding step by directing a laser beam at a first incident side angle on at least a portion of the first contact position to bond the first glass substrate to the first non-transparent substrate and form the first bonding position; and performing a second welding step by directing a laser beam at a second incident side angle on at least a portion of the second contact position to bond the second glass substrate to the first non-transparent substrate and form the first bonding position. forming a second bonding position; contacting the second non-transparent substrate to the other main opposing surface of each of the first glass substrate and the second glass substrate, so that the second non-transparent substrate covers both the first glass substrate and the second glass substrate, forming a third contact position with at least a portion of the first glass substrate, and forming a fourth contact position with at least a portion of the second glass substrate; placing a refractive optical element at an optical upstream of the first glass substrate and the second glass substrate, the refractive optical element forming an optical contact with the first glass substrate or the second glass substrate ; performing a third welding step by directing a laser beam on the incident side of the refractive optical element so that the laser beam is refracted at a first incident side angle on at least a portion of a third contact position to bond the first glass substrate to the second non-transparent substrate and form a third bonding position; and performing a fourth welding step by directing a laser beam on the incident side of the refractive optical element so that the laser beam is refracted at a second incident side angle on at least a portion of a fourth contact position to bond the second glass substrate to the second non-transparent substrate and form a fourth bonding position.
雷射接合玻璃基板與由其所形成的物件的各種實施例在此將具體參照隨附圖式來說明。Various embodiments of laser bonding glass substrates and objects formed therefrom will be described in detail with reference to the accompanying drawings.
範圍在此可被表示為從「約」一特定數值,及/或至「約」另一特定數值。當此種範圍被表示時,另一實施例包括從此一特定數值及/或至此另一特定數值。類似地,當數值藉由使用前綴語「約」被表示為約略值時,將理解到此特定數值形成另一實施例。將進一步理解到範圍的每一者的端點在關於其他端點及獨立於其他端點兩者上是重要的。Ranges may be expressed herein as from "about" a particular value, and/or to "about" another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when a value is expressed as an approximation by use of the prefix "about," it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoints and independently of the other endpoints.
在此使用的指向用語-例如,上、下、右、左、前、後、頂、底-是僅參照所描繪的圖示所得的,且不意欲暗示絕對定向。The directional terms used herein - e.g., up, down, right, left, front, back, top, bottom - are made with reference only to the diagrams depicted and are not intended to imply an absolute orientation.
除非另外明確地敘明,絕不意欲本文所述的任何方法被解釋為要求其步驟以特定順序來執行,或要求特定定向的任何設備。因此,當方法請求項並未確實地描述其步驟所依循的順序,或任何設備請求項並未確實地描述對於個別部件的順序或定向,或並未另外在申請專利範圍或說明書中明確敘明步驟受限於特定順序,或設備的部件的特定順序或定向並未被敘明,則絕不意欲在任何方面推斷順序或定向。此狀態適用於對於解釋的任何可能的非敘明基礎,包括:關於步驟的佈置、操作流程、部件的順序、或部件的定向的邏輯事項;由文法結構或標點所衍生的直白意義,及本說明書中所述的實施例的數目或類型。Unless otherwise expressly stated, it is in no way intended that any method described herein be construed as requiring that its steps be performed in a specific order, or that any equipment require a specific orientation. Therefore, when a method claim does not exactly describe the order in which its steps are followed, or any equipment claim does not exactly describe the order or orientation of individual components, or is not otherwise expressly stated in the patent scope or specification, If steps are limited to a specific order, or a specific order or orientation of components of the device is not stated, no order or orientation is in any way intended to be inferred. This status applies to any possible nondeclarative basis for explanation, including: logical matters concerning the arrangement of steps, flow of operations, sequence of components, or orientation of components; literal meaning derived from grammatical structure or punctuation, and The number or type of embodiments described in the specification.
在此使用時,除非上下文清楚地另外指明,單數形式「一(a)」、「一(an)」與「該」包括複數的指示物。因此,除非上下文清楚地另外指明,例如,參照「一」部件包括具有兩個或更多個此部件的態樣。As used herein, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a" component includes aspects having two or more such components unless the context clearly dictates otherwise.
在此使用時,「實質上透明」意指一波長的雷射束傳遞通過材料而實質上沒有被吸收或散射。例如,在實施例中,對於一波長的雷射束實質上透明的材料可為在給定波長與物件厚度為1 cm處展現出大於或等於90%的透射率的材料。As used herein, "substantially transparent" means that a laser beam of one wavelength is transmitted through the material without being substantially absorbed or scattered. For example, in an embodiment, a material that is substantially transparent to a laser beam of one wavelength may be a material that exhibits a transmittance greater than or equal to 90% at a given wavelength and an object thickness of 1 cm.
在此使用時,「實質上不透明」意指材料在此波長的雷射為實質上不是透明的。例如,在實施例中,對於一波長的雷射束為實質上不透明的材料可為在給定波長與在物件厚度為50 µm處展現出小於或等於10%的透射率的材料。As used herein, "substantially opaque" means that the material is not substantially transparent to laser light of this wavelength. For example, in an embodiment, a material that is substantially opaque to a laser beam of a wavelength may be a material that exhibits a transmittance of less than or equal to 10% at a given wavelength and at an object thickness of 50 μm.
在此使用時,「光學接觸」意指在兩個表面之間的空氣間隙小於光的波長除以4(即,間隙<(光的波長/4))。例如,在實施例中,「光學接觸」意指兩個表面之間的空氣間隙小於0.1 µm。在此使用時,「光學接觸」也意指兩個表面之間的間隙以折射率匹配流體來填充,折射率匹配流體具有折射率在玻璃基板及/或折射光學元件的0.1之內。As used herein, "optical contact" means that the air gap between two surfaces is less than the wavelength of light divided by 4 (i.e., gap < (wavelength of light/4)). For example, in an embodiment, "optical contact" means that the air gap between two surfaces is less than 0.1 μm. As used herein, "optical contact" also means that the gap between two surfaces is filled with a refractive index matching fluid having a refractive index within 0.1 of the glass substrate and/or the refractive optical element.
在此使用時,「光點尺寸」指稱根據ISO 11146的脈衝式雷射的尺寸。脈衝式雷射的光點尺寸等同於光束直徑。As used herein, "spot size" refers to the size of a pulsed laser according to ISO 11146. The spot size of a pulsed laser is equivalent to the beam diameter.
大的單塊玻璃物件可被使用在裝置中,諸如窗口與用於招牌的大面積顯示器。現在參照第1圖與第2圖,此玻璃物件100可藉由將相對小的玻璃基板104的邊緣102接觸並將玻璃基板104焊接在一起以形成界面焊接106來產生。然而,當雷射束以相對於玻璃基板104成一角度被傳遞時,雷射束被折射且雷射束的強度被降低。因此,會難以傳遞聚焦雷射束至玻璃基板的特定部分(例如,邊緣)以充足地將玻璃基板焊接在一起。Large single piece glass articles may be used in devices such as windows and large area displays for signage. Referring now to FIGS. 1 and 2 , the
本文揭示的是緩和前述問題的雷射接合玻璃基板的方法,使得玻璃基板可沿著它們的個別邊緣被焊接。明確地,本文揭示的雷射接合玻璃基板的方法利用折射光學元件以在界面上將雷射束折射於足以達成充分焊接的強度。雷射束的強度可基於吸收層的吸收,吸收層的吸收將致使吸收層的溫度超過玻璃的熔化溫度。在一些實施例中,功率密度是以雷射光點為~10微米之至少10-20 mW。Disclosed herein is a method of laser bonding glass substrates that alleviates the aforementioned problems, such that the glass substrates can be welded along their individual edges. Specifically, the method of laser bonding glass substrates disclosed herein utilizes refractive optics to refract a laser beam at an interface to an intensity sufficient to achieve adequate welding. The intensity of the laser beam can be based on absorption by an absorbing layer, which will cause the temperature of the absorbing layer to exceed the melting temperature of the glass. In some embodiments, the power density is at least 10-20 mW with a laser spot of ~10 microns.
現在參照第3圖與第4圖,雷射接合玻璃基板的方法200在方塊202處開始,以在第一玻璃基板302的第一邊緣302a與第二玻璃基板304的第二邊緣304a之間安置第一吸收層300。第一玻璃基板302與第二玻璃基板304各自包含主要相對表面302b、304b。第一玻璃基板302與第二玻璃基板304的主要相對表面302b、304b藉由個別的第一與第二邊緣302a、304a所圍界。3 and 4, the method 200 of laser bonding glass substrates begins at block 202 by disposing a first
仍參照第3圖與第4圖,方法200繼續於方塊204,以將第一玻璃基板302的第一邊緣302a與第二玻璃基板304的第二邊緣304a接觸第一吸收層300以形成第一界面306。在實施例中,此接觸步驟包含將第一玻璃基板302與第二玻璃基板304的主要相對表面302b、304b沿著垂直於第一界面306的平面對齊。Still referring to FIGS. 3 and 4 , the method 200 continues at block 204 to contact the
第一吸收層300吸收被引導於其上的雷射束並確保達到第一與第二玻璃基板302、304的熔化溫度。在實施例中,第一吸收層300可包含金屬膜、金屬箔、無機特化玻璃、玻璃料、或前述物的組合。在實施例中,金屬膜可包含銅、鋁、不鏽鋼、鉻、鉬、鎳、錫氧化物、矽氧化物、錫磷酸鹽、錫氟磷酸鹽、硫屬玻璃、亞碲酸鹽玻璃、硼酸鹽玻璃、或前述物的組合。在實施例中,金屬箔可包含鋁、鋁合金、不鏽鋼、鎳、鎳合金、銀、銀合金、鈦、鈦合金、鎢、鎢合金、金、金合金、銅、銅合金、青銅、鐵、或前述物的組合。在第一吸收層包含可為反射性的金屬箔的實施例中,吸收可透過藉由脈衝式聚焦雷射束所誘發的電漿來產生。在實施例中,無機特化玻璃可包含氟化玻璃材料、錫摻雜玻璃材料、過渡金屬摻雜玻璃材料、或前述物的組合。在實施例中,玻璃料可包含低溫玻璃料,諸如在美國專利第8,063,560 B2與9,281,132號中所述的玻璃料,其內容藉由參照方式而在此併入。例如,在實施例中,低溫玻璃料可包含至少一吸收離子,至少一吸收離子包含鐵、銅、釩、與釹的至少一者。The
在實施例中,第一吸收層300可由對於雷射束的選定波長為實質上不透明的材料所形成。In an embodiment, the
在實施例中,第一吸收層300可具有厚度大於或等於20 nm及小於或等於1 µm。在實施例中,第一吸收層300可具有厚度大於或等於20 nm、大於或等於50 nm、或甚至大於或等於100 nm。在實施例中,第一吸收層300可具有厚度小於或等於1 µm、小於或等於750 nm、小於或等於500 nm、或甚至小於或等於250 nm。在實施例中,第一吸收層300可具有厚度大於或等於20 nm及小於或等於1 µm、大於或等於20 nm及小於或等於750 nm、大於或等於20 nm及小於或等於500 nm、大於或等於20 nm及小於或等於250 nm、大於或等於50 nm及小於或等於1 µm、大於或等於50 nm及小於或等於750 nm、大於或等於50 nm及小於或等於500 nm、大於或等於50 nm及小於或等於250 nm、大於或等於100 nm及小於或等於1 µm、大於或等於100 nm及小於或等於750 nm、大於或等於100 nm及小於或等於500 nm、或甚至大於或等於100 nm及小於或等於250 nm、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, the
在實施例中,第一玻璃基板302與第二玻璃基板304可包含折射率大於或等於1.5及小於或等於2.4。在實施例中,第一玻璃基板302與第二玻璃基板304可包含折射率大於或等於1.5、大於或等於1.7、或甚至大於或等於1.9。在實施例中,第一玻璃基板302與第二玻璃基板304可包含折射率小於或等於2.4或甚至小於或等於2.2。在實施例中,第一玻璃基板302與第二玻璃基板304可包含折射率大於或等於1.5及小於或等於2.4、大於或等於1.5及小於或等於2.2、大於或等於1.7及小於或等於2.4、大於或等於1.7及小於或等於2.2、大於或等於1.9及小於或等於2.4、或甚至大於或等於1.9及小於或等於2.2、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, the
在實施例中,第一玻璃基板302與第二玻璃基板304可包含玻璃或玻璃陶瓷。作為非限制性實例,第一玻璃基板302與第二玻璃基板304可包含硼酸鹽玻璃、矽硼酸鹽玻璃、磷酸鹽系玻璃、碳化矽玻璃、鈣鈉矽酸鹽玻璃、鋁矽酸鹽玻璃、鹼金屬鋁矽酸鹽玻璃、硼矽酸鹽玻璃、鹼金屬硼矽酸鹽玻璃、鋁硼矽酸鹽玻璃、鹼金屬鋁硼矽酸鹽玻璃、鹼金屬鋁矽酸鹽玻璃、熔融矽石、或低膨脹玻璃。在實施例中,低膨脹玻璃可包含二氧化鈦矽酸鹽玻璃。In an embodiment, the
在實施例中,第一玻璃基板302與第二玻璃基板304可由對雷射束的選定波長為實質上透明的材料所形成。在實施例中,第一玻璃基板302與第二玻璃基板304可對於大於或等於300 nm及小於或等於1250 nm或甚至大於或等於350 nm及小於或等於1000 nm的光波長為實質上透明。In an embodiment, the
在實施例中,第一玻璃基板302與第二玻璃基板304可具有厚度大於或等於0.5 mm。在實施例中,第一玻璃基板302與第二玻璃基板304可具有厚度大於或等於0.5 mm、大於或等於1 mm、大於或等於10 mm、或甚至大於或等於20 mm。在實施例中,第一玻璃基板302可包含厚度小於或等於100 mm、小於或等於75 mm、或甚至小於或等於50 mm。在實施例中,第一玻璃基板302可包含厚度大於或等於0.5 mm及小於或等於100 mm、大於或等於0.5 mm及小於或等於75 mm、大於或等於0.5 mm及小於或等於50 mm、大於或等於1 mm及小於或等於100 mm、大於或等於1 mm及小於或等於75 mm、大於或等於1 mm及小於或等於50 mm、大於或等於10 mm及小於或等於100 mm、大於或等於10 mm及小於或等於75 mm、大於或等於10 mm及小於或等於50 mm、大於或等於20 mm及小於或等於100 mm、大於或等於20 mm及小於或等於75 mm、或甚至大於或等於20 mm及小於或等於50 mm、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, the
仍然參照第3圖與第4圖,方法200繼續於方塊206,以在第一玻璃基板302與第二玻璃基板304的光學地上游處安置折射光學元件310。在此,「光學地上游」應意指坐落在與雷射束312行進的行進路徑相反的方向上。折射光學元件310形成光學接觸第一玻璃基板302與第二玻璃基板304的至少一者。在折射光學元件310及第一玻璃基板302與第二玻璃基板304的至少一者之間的折射光學接觸之間形成光學接觸確保在其間的間隙對光傳播不起作用。Still referring to FIGS. 3 and 4 , the method 200 continues at block 206 by positioning a refractive
仍然參照第3圖與第4圖,方法200繼續於方塊208,以藉由在折射光學元件310的入射側310a上引導雷射束312來執行第一焊接步驟,使得雷射束312在第一界面306上以第一入射側角θ
1被折射以將第一玻璃基板302接合至第二玻璃基板304並形成第一接合位置314。
Still referring to Figures 3 and 4, method 200 continues at block 208 to perform a first welding step by directing the
在實施例中,折射光學元件310可包含熔融矽石。In an embodiment, refractive
在實施例中,折射光學元件310可為如第4圖中所示的稜鏡310b。稜鏡310b包含底角θ
2。在實施例中,稜鏡310b可包含安置在入射側310a上的塗層(未示出)。在實施例中,此塗層可包含抗反射塗層。
In an embodiment, the refractive
現在參照第5圖,在實施例中,折射光學元件310可為如所示的繞射光柵310c。在實施例中,繞射光柵310c的入射側310a可具有結構化表面。5, in an embodiment, the refractive
為了產生充足焊接所必要的雷射束強度,考量到折射光學元件的製造限制,雷射束312在第一界面306上被折射的折射角θ
0應儘可能地接近90°。例如,稜鏡310b的底角θ
2影響第一入射側角θ
1,其影響折射角θ
0。較大的底角θ
2造成較大的入射側角θ
1,其中0°的底角θ
2造成90°的第一入射側角θ
1。如所示,第一入射側角θ
1是雷射束312與垂直於折射光學元件310的入射側310a的平面之間的角度。然而,由於製造限制,會難以產生具有相對大的底角(例如,大於60°)的稜鏡310b。在實施例中,第一入射側角θ
1可大於或等於0°及小於或等於45°。在實施例中,第一入射側角θ
1可大於或等於0°、大於或等於5°、大於或等於10°、或甚至大於或等於15°。在實施例中,第一入射側角θ
1可小於或等於45°、小於或等於30°、或甚至小於或等於20°。在實施例中,第一入射側角θ
1可大於或等於0°及小於或等於45°、大於或等於0°及小於或等於30°、大於或等於0°及小於或等於20°、大於或等於5°及小於或等於45°、大於或等於5°及小於或等於30°、大於或等於5°及小於或等於20°、大於或等於10°及小於或等於45°、大於或等於10°及小於或等於30°、大於或等於10°及小於或等於20°、大於或等於15°及小於或等於45°、大於或等於15°及小於或等於30°、或甚至大於或等於15°及小於或等於20°、或由這些端點的任一者所形成的任何與所有的子範圍。
In order to produce the necessary laser beam intensity for sufficient welding, the refraction angle θ0 at which the
在實施例中,如第4圖與第5圖中所示,雷射束312可被引導正交於第一玻璃基板302與第二基板304。In an embodiment, as shown in FIGS. 4 and 5 , the
在雷射束312被引導正交於第一玻璃基板302與第二玻璃基板304及折射光學元件310是如第4圖中所示的稜鏡310b的實施例中,稜鏡310b可具有底角θ
2大於或等於70°及小於或等於85°以確保達成相對高的入射側角。在雷射束312被引導正交於第一玻璃基板302與第二玻璃基板304及折射光學元件310是稜鏡310b的實施例中,稜鏡310b可具有底角θ
2大於或等於70°及小於或等於85°、大於或等於70°及小於或等於80°、大於或等於75°及小於或等於85°、或甚至大於或等於75°及小於或等於89°、或由這些端點的任一者所形成的任何與所有的子範圍。
In an embodiment where the
在實施例中,其中雷射束312被引導正交於第一玻璃基板302與第二玻璃基板304及折射光學元件310是如第5圖中所示的繞射光柵310c,繞射光柵310c可具有繞射光柵角大於或等於30°以確保達成相對高的入射側角。在實施例中,其中雷射束312被引導正交於第一玻璃基板302與第二玻璃基板304及折射光學元件310是繞射光柵310c,繞射光柵310c可具有繞射光柵角大於或等於30°或甚至大於或等於35。在實施例中,其中雷射束312被引導正交於第一玻璃基板302與第二玻璃基板304及折射光學元件310是繞射光柵310c,繞射光柵310c可具有繞射光柵角小於或等於45°或甚至小於或等於40°。在實施例中,其中雷射束312被引導正交於第一玻璃基板302與第二玻璃基板304及折射光學元件310是繞射光柵310c,繞射光柵310c可具有繞射光柵角大於或等於30°及小於或等於45°、大於或等於30°及小於或等於40°、大於或等於35°及小於或等於45°、或甚至大於或等於35°及小於或等於40°、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment where the
現在參照第6圖與第7圖,在實施例中,雷射束312可被引導相對於第一玻璃基板302與第二玻璃基板304成大於0°的角度(即,非正交於第一玻璃基板302與第二玻璃基板304)。6 and 7 , in one embodiment, the
在雷射束312被引導相對於第一玻璃基板302與第二玻璃基板304成大於0°的角度及折射光學元件310是如第6圖中所示的稜鏡310b的實施例中,稜鏡310b可具有底角θ
2大於或等於30°及小於或等於60°以確保達成相對高的入射側角。在雷射束312被引導相對於第一玻璃基板302與第二玻璃基板304成大於0°的角度及折射光學元件310是稜鏡310b的實施例中,稜鏡310b可具有底角θ
2大於或等於30°及小於或等於60°、大於或等於30°及小於或等於55°、大於或等於30°及小於或等於50°、大於或等於35°及小於或等於60°、大於或等於35°及小於或等於55°、大於或等於35°及小於或等於50°、大於或等於40°及小於或等於60°、大於或等於40°及小於或等於55°、或甚至大於或等於40°及小於或等於50°、或由這些端點的任一者所形成的任何與所有的子範圍。
In an embodiment where the
在雷射束312被引導相對於第一玻璃基板302與第二玻璃基板304成大於0°的角度及折射光學元件310是如第7圖中所示的繞射光柵310c的實施例中,繞射光柵310c可具有繞射光柵角大於或等於20°以確保達成相對高的入射側角。在實施例中,其中雷射束312被引導相對於第一玻璃基板302與第二玻璃基板304成大於0°的角度及折射光學元件310是如第7圖中所示的繞射光柵310c,繞射光柵310c可具有繞射光柵角大於或等於20°、大於或等於25°、或甚至大於或等於30°。在實施例中,其中雷射束312被引導相對於第一玻璃基板302與第二玻璃基板304成大於0°的角度及折射光學元件310是如第7圖中所示的繞射光柵310c,繞射光柵310c可具有繞射光柵角小於或等於45°或甚至小於或等於40°。在實施例中,其中雷射束312被引導相對於第一玻璃基板302與第二玻璃基板304成大於0°的角度及折射光學元件310是如第7圖中所示的繞射光柵310c,繞射光柵310c可具有繞射光柵角大於或等於20°及小於或等於45°、大於或等於20°及小於或等於40°、大於或等於25°及小於或等於45°、大於或等於25°及小於或等於40°、大於或等於30°及小於或等於45°、或甚至大於或等於30°及小於或等於40°、或由這些端點的任一者所形成的任何與所有的子範圍。In embodiments where the
在實施例中,雷射束312可包含一波長,使得第一玻璃基板302、第二玻璃基板304、與折射光學元件310對於雷射束312的此波長為實質上透明。在實施例中,雷射束312可包含一波長,使得第一吸收層300對於雷射束312的此波長為實質上不透明。例如,在實施例中,脈衝式雷射可具有波長大於或等於300 nm及小於或等於2000 nm。在實施例中,脈衝式雷射可具有波長大於或等於300 nm、大於或等於350 nm、大於或等於400 nm、大於或等於450 nm、或甚至大於或等於500 nm。在實施例中,脈衝式雷射可具有波長小於或等於2000 nm、小於或等於1500 nm、小於或等於1250 nm、或甚至小於或等於1000 nm。在實施例中,脈衝式雷射可具有波長大於或等於300 nm及小於或等於2000 nm、大於或等於300 nm及小於或等於1500 nm、大於或等於300 nm及小於或等於1250 nm、大於或等於300 nm及小於或等於1000 nm、大於或等於350 nm及小於或等於2000 nm、大於或等於350 nm及小於或等於1500 nm、大於或等於350 nm及小於或等於1250 nm、大於或等於350 nm及小於或等於1000 nm、大於或等於400 nm及小於或等於2000 nm、大於或等於400 nm及小於或等於1500 nm、大於或等於400 nm及小於或等於1250 nm、大於或等於400 nm及小於或等於1000 nm、大於或等於450 nm及小於或等於2000 nm、大於或等於450 nm及小於或等於1500 nm、大於或等於450 nm及小於或等於1250 nm、大於或等於450 nm及小於或等於1000 nm、大於或等於500 nm及小於或等於2000 nm、大於或等於500 nm及小於或等於1500 nm、大於或等於500 nm及小於或等於1250 nm、或甚至大於或等於500 nm及小於或等於1000 nm、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, the
在實施例中,脈衝式雷射可具有波長大於或等於300 nm及小於或等於1100 nm、大於或等於300 nm及小於或等於900 nm、大於或等於300 nm及小於或等於700 nm、大於或等於325 nm及小於或等於1100 nm、大於或等於325 nm及小於或等於900 nm、大於或等於325 nm及小於或等於700 nm、大於或等於350 nm及小於或等於1100 nm、大於或等於350 nm及小於或等於900 nm、或甚至大於或等於350 nm及小於或等於700 nm、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, the pulsed laser may have a wavelength greater than or equal to 300 nm and less than or equal to 1100 nm, greater than or equal to 300 nm and less than or equal to 900 nm, greater than or equal to 300 nm and less than or equal to 700 nm, greater than or equal to 325 nm and less than or equal to 1100 nm, greater than or equal to 325 nm and less than or equal to 900 nm, greater than or equal to 325 nm and less than or equal to 700 nm, greater than or equal to 350 nm and less than or equal to 1100 nm, greater than or equal to 350 nm and less than or equal to 900 nm, or even greater than or equal to 350 nm and less than or equal to 700 nm, or any and all sub-ranges formed by any of these endpoints.
在實施例中,雷射束312可包含脈衝式雷射。在實施例中,脈衝式雷射可為奈秒脈衝式雷射、皮秒脈衝式雷射、或飛秒脈衝式雷射。在脈衝式雷射是奈秒脈衝式雷射的實施例中,此方法可包括吸收層。在脈衝式雷射是皮秒脈衝式雷射的實施例中,此方法可不包括吸收層,由於可透過多光子吸收來達成吸收。In an embodiment, the
在實施例中,脈衝式雷射可包含脈衝能量大於或等於2.8 µJ及小於或等於1000 µJ。在實施例中,脈衝式雷射可包含脈衝能量大於或等於2.8 µJ、大於或等於10 µJ、大於或等於25 µJ、或甚至大於或等於50 µJ。在實施例中,脈衝式雷射可包含脈衝能量小於或等於1000 µJ、小於或等於750 µJ、小於或等於500 µJ、或甚至小於或等於250 µJ。在實施例中,脈衝式雷射可包含脈衝能量大於或等於2.8 µJ及小於或等於1000 µJ、大於或等於2.8 µJ及小於或等於750 µJ、大於或等於2.8 µJ及小於或等於500 µJ、大於或等於2.8 µJ及小於或等於250 µJ、大於或等於10 µJ及小於或等於1000 µJ、大於或等於10 µJ及小於或等於750 µJ、大於或等於10 µJ及小於或等於500 µJ、大於或等於10 µJ及小於或等於250 µJ、大於或等於25 µJ及小於或等於1000 µJ、大於或等於25 µJ及小於或等於750 µJ、大於或等於25 µJ及小於或等於500 µJ、大於或等於25 µJ及小於或等於250 µJ、大於或等於50 µJ及小於或等於1000 µJ、大於或等於50 µJ及小於或等於750 µJ、大於或等於50 µJ及小於或等於500 µJ、或甚至大於或等於50 µJ及小於或等於250 µJ、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, the pulsed laser may include a pulse energy greater than or equal to 2.8 µJ and less than or equal to 1000 µJ. In an embodiment, the pulsed laser may include a pulse energy greater than or equal to 2.8 µJ, greater than or equal to 10 µJ, greater than or equal to 25 µJ, or even greater than or equal to 50 µJ. In an embodiment, the pulsed laser may include a pulse energy less than or equal to 1000 µJ, less than or equal to 750 µJ, less than or equal to 500 µJ, or even less than or equal to 250 µJ. In an embodiment, the pulsed laser may include a pulse energy greater than or equal to 2.8 µJ and less than or equal to 1000 µJ, greater than or equal to 2.8 µJ and less than or equal to 750 µJ, greater than or equal to 2.8 µJ and less than or equal to 500 µJ, greater than or equal to 2.8 µJ and less than or equal to 250 µJ, greater than or equal to 10 µJ and less than or equal to 1000 µJ, greater than or equal to 10 µJ and less than or equal to 750 µJ, greater than or equal to 10 µJ and less than or equal to 500 µJ, greater than or equal to 10 µJ and less than or equal to 250 µJ, greater than or equal to 25 µJ and less than or equal to 1000 µJ, greater than or equal to 25 µJ and less than or equal to 750 µJ. µJ, greater than or equal to 25 µJ and less than or equal to 500 µJ, greater than or equal to 25 µJ and less than or equal to 250 µJ, greater than or equal to 50 µJ and less than or equal to 1000 µJ, greater than or equal to 50 µJ and less than or equal to 750 µJ, greater than or equal to 50 µJ and less than or equal to 500 µJ, or even greater than or equal to 50 µJ and less than or equal to 250 µJ, or any and all sub-ranges formed by any of these endpoints.
在實施例中,脈衝式雷射可包含重複率大於或等於1 kHz及小於或等於1000 kHz。在實施例中,脈衝式雷射可包含重複率大於或等於1 kHz、大於或等於10 kHz、或甚至大於或等於25 kHz。在實施例中,脈衝式雷射可包含重複率小於或等於1000 kHz、小於或等於750 kHz、小於或等於500 kHz、小於或等於250 kHz、小於或等於100 kHz、或甚至小於或等於50 kHz。在實施例中,脈衝式雷射可包含重複率大於或等於1 kHz及小於或等於1000 kHz、大於或等於1 kHz及小於或等於750 kHz、大於或等於1 kHz及小於或等於500 kHz、大於或等於1 kHz及小於或等於250 kHz、大於或等於1 kHz及小於或等於100 kHz、大於或等於1 kHz及小於或等於50 kHz、大於或等於10 kHz及小於或等於1000 kHz、大於或等於10 kHz及小於或等於750 kHz、大於或等於10 kHz及小於或等於500 kHz、大於或等於10 kHz及小於或等於250 kHz、大於或等於10 kHz及小於或等於100 kHz、大於或等於10 kHz及小於或等於50 kHz、大於或等於25 kHz及小於或等於1000 kHz、大於或等於25 kHz及小於或等於750 kHz、大於或等於25 kHz及小於或等於500 kHz、大於或等於25 kHz及小於或等於250 kHz、大於或等於25 kHz及小於或等於100 kHz、或甚至大於或等於25 kHz及小於或等於50 kHz、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, the pulsed laser may include a repetition rate greater than or equal to 1 kHz and less than or equal to 1000 kHz. In an embodiment, the pulsed laser may include a repetition rate greater than or equal to 1 kHz, greater than or equal to 10 kHz, or even greater than or equal to 25 kHz. In an embodiment, the pulsed laser may include a repetition rate less than or equal to 1000 kHz, less than or equal to 750 kHz, less than or equal to 500 kHz, less than or equal to 250 kHz, less than or equal to 100 kHz, or even less than or equal to 50 kHz. In an embodiment, the pulsed laser may include a repetition rate greater than or equal to 1 kHz and less than or equal to 1000 kHz, greater than or equal to 1 kHz and less than or equal to 750 kHz, greater than or equal to 1 kHz and less than or equal to 500 kHz, greater than or equal to 1 kHz and less than or equal to 250 kHz, greater than or equal to 1 kHz and less than or equal to 100 kHz, greater than or equal to 1 kHz and less than or equal to 50 kHz, greater than or equal to 10 kHz and less than or equal to 1000 kHz, greater than or equal to 10 kHz and less than or equal to 750 kHz, greater than or equal to 10 kHz and less than or equal to 500 kHz, greater than or equal to 10 kHz and less than or equal to 250 kHz, greater than or equal to 10 kHz and less than or equal to 100 kHz, greater than or equal to 10 kHz and less than or equal to 50 kHz, greater than or equal to 25 kHz and less than or equal to 1000 kHz, greater than or equal to 25 kHz and less than or equal to 750 kHz, greater than or equal to 25 kHz and less than or equal to 500 kHz, greater than or equal to 25 kHz and less than or equal to 250 kHz, greater than or equal to 25 kHz and less than or equal to 100 kHz, or even greater than or equal to 25 kHz and less than or equal to 50 kHz, or any and all sub-ranges formed by any of these endpoints.
在實施例中,脈衝式雷射可具有光點尺寸大於或等於5 µm及小於或等於50 µm。在實施例中,脈衝式雷射可具有光點尺寸大於或等於5 µm或甚至大於或等於10 µm。在實施例中,脈衝式雷射可具有光點尺寸小於或等於50 µm、小於或等於35 µm、或甚至小於或等於20 µm。在實施例中,脈衝式雷射可具有光點尺寸大於或等於5 µm及小於或等於50 µm、大於或等於5 µm及小於或等於35 µm、大於或等於5 µm及小於或等於20 µm、大於或等於10 µm及小於或等於50 µm、大於或等於10 µm及小於或等於35 µm、或甚至大於或等於10 µm及小於或等於20 µm、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, the pulsed laser may have a spot size greater than or equal to 5 μm and less than or equal to 50 μm. In an embodiment, the pulsed laser may have a spot size greater than or equal to 5 μm or even greater than or equal to 10 μm. In an embodiment, the pulsed laser may have a spot size less than or equal to 50 μm, less than or equal to 35 μm, or even less than or equal to 20 μm. In embodiments, the pulsed laser may have a spot size greater than or equal to 5 µm and less than or equal to 50 µm, greater than or equal to 5 µm and less than or equal to 35 µm, greater than or equal to 5 µm and less than or equal to 20 µm, greater than or equal to 10 µm and less than or equal to 50 µm, greater than or equal to 10 µm and less than or equal to 35 µm, or even greater than or equal to 10 µm and less than or equal to 20 µm, or any and all sub-ranges formed by any of these endpoints.
在實施例中,脈衝式雷射可包含脈衝寬度小於或等於10 ps、小於或等於7 ps、或甚至小於或等於5 ps。在實施例中,脈衝式雷射可包含脈衝寬度大於或等於0.1 ps、大於或等於0.5 ps、或甚至大於或等於1 ps。在實施例中,脈衝式雷射可包含脈衝寬度大於或等於0.1 ps及小於或等於10 ps、大於或等於0.1 ps及小於或等於7 ps、大於或等於0.1 ps及小於或等於5 ps、大於或等於0.5 ps及小於或等於 10 ps、大於或等於0.5 ps及小於或等於7 ps、大於或等於0.5 ps及小於或等於5 ps、大於或等於1 ps及小於或等於10 ps、大於或等於1 ps及小於或等於7 ps、或甚至大於或等於1 ps及小於或等於5 ps、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, the pulsed laser may include a pulse width less than or equal to 10 ps, less than or equal to 7 ps, or even less than or equal to 5 ps. In an embodiment, the pulsed laser may include a pulse width greater than or equal to 0.1 ps, greater than or equal to 0.5 ps, or even greater than or equal to 1 ps. In an embodiment, the pulsed laser may include a pulse width greater than or equal to 0.1 ps and less than or equal to 10 ps, greater than or equal to 0.1 ps and less than or equal to 7 ps, greater than or equal to 0.1 ps and less than or equal to 5 ps, greater than or equal to 0.5 ps and less than or equal to 10 ps, greater than or equal to 0.5 ps and less than or equal to 7 ps, greater than or equal to 0.5 ps and less than or equal to 5 ps, greater than or equal to 1 ps and less than or equal to 10 ps, greater than or equal to 1 ps and less than or equal to 7 ps, or even greater than or equal to 1 ps and less than or equal to 5 ps, or any and all sub-ranges formed by any of these endpoints.
在某些應用中,諸如大的 拼裝顯示器,其中在拼塊之間的邊界為不可見的,此對於由將玻璃基板接合在一起所形成的物件是期望的,以視覺上看起來透明,使得接合為不可見的。因此,在實施例中,第一接合位置314可具有在給定波長及在0.5 mm的物件厚度之透射率大於或等於70%、大於或等於80%、大於或等於90%、或甚至大於或等於95%。In certain applications, such as large tiled displays, where the boundaries between tiles are not visible, it is desirable for the article formed by bonding glass substrates together to appear visually transparent so that the bonding is not visible. Therefore, in embodiments, the
現在參照第8圖,在實施例中,在第一焊接步驟期間,雷射束312可相對於折射光學元件310的入射側310a移位,使得形成的物件320具有在第一玻璃基板302的第一邊緣302a與第二玻璃基板304的第二邊緣304a之間的第一界面焊接322。在實施例中,第一界面焊接322包含在焊接步驟期間被熔化與焊接在一起的第一玻璃基板302的材料與第二玻璃基板304的材料。在實施例中,第一界面焊接322的至少一部分也可包含被熔化及與第一玻璃基板302和第二玻璃基板304焊接的吸收層(未示出)的材料。在實施例中,吸收層可融化進入第一玻璃基板302與第二玻璃基板304並藉由形成氧化物而變得透明。Referring now to FIG. 8 , in an embodiment, during a first welding step, the
在實施例中,第一界面焊接322可包含焊接線,具有寬度大於或等於5 µm及小於或等於1 mm。在實施例中,焊接線可具有寬度大於或等於5 µm、大於或等於15 µm、或甚至大於或等於25 µm。在實施例中,焊接線可具有寬度小於或等於1 mm、小於或等於750 µm、小於或等於500 µm、小於或等於250 µm、或甚至小於或等於100 µm。在實施例中,焊接線可具有寬度大於或等於5 µm及小於或等於1 mm、大於或等於5 µm及小於或等於750 µm、大於或等於5 µm及小於或等於500 µm、大於或等於5 µm及小於或等於250 µm、大於或等於5 µm及小於或等於100 µm、大於或等於15 µm及小於或等於1 mm、大於或等於15 µm及小於或等於750 µm、大於或等於15 µm及小於或等於500 µm、大於或等於15 µm及小於或等於250 µm、大於或等於15 µm及小於或等於100 µm、大於或等於25 µm及小於或等於1 mm、大於或等於25 µm及小於或等於750 µm、大於或等於25 µm及小於或等於500 µm、大於或等於25 µm及小於或等於250 µm、或甚至大於或等於25 µm及小於或等於100 µm、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, the
在實施例中,第一界面焊接322的焊接線之間的距離可大於或等於1 µm及小於或等於1000 µm。在實施例中,焊接線之間的距離可大於或等於1 µm、大於或等於10 µm、大於或等於25 µm、或甚至大於或等於50 µm。在實施例中,焊接線之間的距離可小於或等於1000 µm、小於或等於750 µm、小於或等於500 µm、小於或等於250 µm、或甚至小於或等於100 µm。在實施例中,焊接線216之間的距離可大於或等於1 µm及小於或等於1000 µm、大於或等於1 µm及小於或等於750 µm、大於或等於1 µm及小於或等於500 µm、大於或等於1 µm及小於或等於250 µm、大於或等於1 µm及小於或等於100 µm、大於或等於10 µm及小於或等於1000 µm、大於或等於10 µm及小於或等於750 µm、大於或等於10 µm及小於或等於500 µm、大於或等於10 µm及小於或等於250 µm、大於或等於10 µm及小於或等於100 µm、大於或等於25 µm及小於或等於1000 µm、大於或等於25 µm及小於或等於750 µm、大於或等於25 µm及小於或等於500 µm、大於或等於25 µm及小於或等於250 µm、大於或等於25 µm及小於或等於100 µm、大於或等於50 µm及小於或等於1000 µm、大於或等於50 µm及小於或等於750 µm、大於或等於50 µm及小於或等於500 µm、大於或等於50 µm及小於或等於250 µm、或甚至大於或等於50 µm及小於或等於100 µm、或由這些端點的任一者所形成的任何與所有的子範圍。在實施例中,焊接線可均勻地分隔開(即,具有在其間的相同距離)或不均勻地分隔開(即,具有在其間不同的距離)。In an embodiment, the distance between the weld lines of the
回去參照第1圖並現在參照第9圖,方法200可任選地繼續於方塊210,以在第二玻璃基板304的第二邊緣304a與第三玻璃基板330的第三邊緣330a之間安置第二吸收層400。第三玻璃基板330包含主要相對表面330b。第三玻璃基板330的主要相對表面330b被第三邊緣330a所圍界。方法200可任選地繼續於方塊212,以用第二吸收層400將第二玻璃基板304的第二邊緣304a接觸第三玻璃基板330的第三邊緣330a,以形成第二界面402。方法200可任選地繼續於方塊214,以在第二玻璃基板304與第三玻璃基板330的光學地上游處安置折射光學元件310。方法200可任選地繼續於216,以藉由在折射光學元件的入射側310a上引導雷射束來執行第二焊接步驟,使得雷射束312在第二界面402上以第二側入射角θ
3被折射,以將第二玻璃基板304接合至第三玻璃基板330並形成第二接合位置404。
Referring back to FIG. 1 and now to FIG. 9 , the method 200 may optionally continue at block 210 to position a second
現在參照第10圖,在實施例中,在第二焊接步驟期間,雷射束312可相對於折射光學元件310的入射側310a移位,使得物件410被形成具有在第三玻璃基板330的第三邊緣330a與第二玻璃基板304的第二邊緣304a之間的第二界面焊接412。10 , in an embodiment, during the second welding step, the
在實施例中,方法200的方塊210-216可包括如在此之前關於方塊202-208所述的實質上類似或相同的吸收層、玻璃基板、光學元件、雷射束參數、及入射側角。在實施例中,額外的玻璃基板可被焊接至本文所述的第一、第二、或第三玻璃基板302、304、330,直到達成期望的物件結構。In an embodiment, blocks 210-216 of method 200 may include substantially similar or identical absorber layers, glass substrates, optical elements, laser beam parameters, and incident side angles as previously described with respect to blocks 202-208. In an embodiment, additional glass substrates may be bonded to the first, second, or
現在參照第11圖與第12圖,雷射接合玻璃基板的替代方法500開始於方塊502,以將第一玻璃基板600的第一主要相對表面600a接觸第一金屬箔602。第一接觸位置604被創造在第一主要相對表面602a的至少一部分與第一金屬箔602之間。11 and 12, an alternative method 500 for laser bonding glass substrates begins at block 502 by contacting a first major opposing
方法500繼續於方塊504,以藉由在第一接觸位置604的至少一部分上引導雷射束606來執行第一焊接步驟,以將第一玻璃基板600的第一主要相對表面600a接合至第一金屬箔602並形成第一接合位置608。The method 500 continues at block 504 by performing a first bonding step by directing a
回去參照第10圖並現在參照第13圖,方法500繼續於方塊506,以將第一玻璃基板600的第二主要相對表面600b接觸第一金屬箔602。第一與第二主要相對表面600a、600b被第一邊緣600c所圍界。第二接觸位置622被創造在第二主要相對表面600b的至少一部分與第一金屬箔602之間。Referring back to FIG. 10 and now to FIG. 13 , the method 500 continues at block 506 by contacting the second major opposing
方法500繼續於方塊508,以在第一玻璃基板600的上游處光學地安置折射光學元件620。折射光學元件620形成光學接觸第一玻璃基板600。The method 500 continues at block 508 by optically positioning a refractive
方法500繼續於方塊510,以藉由在折射光學元件的入射側620a上引導雷射束606來執行第二焊接步驟,使得雷射束606在第二接觸位置622的至少一部分上以第一入射側角θ
4被折射,以將第一玻璃基板600的第二主要相對表面600b接合至第一金屬箔602並形成第二接合位置624。
The method 500 continues at block 510 to perform a second welding step by directing the
回去參照第10圖並現在參照第14圖,方法500繼續於方塊512,以對於第二玻璃基板630和第二金屬箔632重複方塊502-510。明確地,方法500繼續以將第二玻璃基板630的第三主要相對表面630a接觸第二金屬箔632。第三接觸位置634被創造在第三主要相對表面630a的至少一部分與第二金屬箔632之間。方法500繼續以藉由在第三接觸位置634的至少一部分上引導雷射束606來執行第三焊接步驟,以將第二玻璃基板630的第三主要相對表面630a接合至第二金屬箔632並形成第三接合位置636。方法500繼續以將第二玻璃基板630的第四主要相對表面630b接觸第二金屬箔632。第三與第四主要相對表面630a、630b被第二邊緣630c所圍界。第四接觸位置638被創造在第四主要相對表面630b的至少一部分與第二金屬箔632之間。方法500繼續在第二玻璃基板630的光學地上游處安置折射光學元件(未示出)。折射光學元件形成光學接觸第二玻璃基板630。方法500繼續以藉由在折射光學元件(未示出)的入射側上引導雷射束(未示出)來執行第四焊接步驟,使得雷射束在第四接觸位置638的至少一部分上以第二入射角(未示出)被折射,以將第二玻璃基板630的第四主要相對表面630b接合至第二金屬箔632並形成第四接合位置640。Referring back to FIG. 10 and now to FIG. 14 , the method 500 continues at block 512 to repeat blocks 502-510 for a
在實施例中,方法500的方塊502-512可包括如在此之前關於方法200所述的實質上類似或相同的玻璃基板、金屬箔、雷射束參數、光學元件、與入射側角。在實施例中,第一金屬箔602與第二金屬箔632各自可具有厚度大於或等於5 µm及小於或等於50 µm。在實施例中,第一金屬箔602與第二金屬箔632各自可具有厚度大於或等於5 µm、大於或等於10 µm、或甚至大於或等於20 µm。在實施例中,第一金屬箔602與第二金屬箔632各自可具有厚度小於或等於50 µm、小於或等於40 µm、或甚至小於或等於30 µm。在實施例中,第一金屬箔602與第二金屬箔632各自可具有厚度大於或等於5 µm及小於或等於50 µm、大於或等於5 µm及小於或等於40 µm、大於或等於5 µm及小於或等於30 µm、大於或等於10 µm及小於或等於50 µm、大於或等於10 µm及小於或等於40 µm、大於或等於10 µm及小於或等於30 µm、大於或等於20 µm及小於或等於50 µm、大於或等於20 µm及小於或等於40 µm、或甚至大於或等於20 µm及小於或等於30 µm、或由這些端點的任一者所形成的任何與所有的子範圍。In an embodiment, blocks 502-512 of method 500 may include substantially similar or identical glass substrates, metal foils, laser beam parameters, optical elements, and incident side angles as described hereinbefore with respect to method 200. In an embodiment,
方法繼續於方塊514,以將第一金屬箔602與第二金屬箔632接觸以創造第五接觸位置650。在此接觸步驟期間,第一玻璃基板600的第一與第二主要相對表面600a、600b沿著垂直於第五接觸位置650的平面對齊第二玻璃基板630的第三與第四主要相對表面630a、630b。The method continues at block 514 by contacting the
方法繼續於方塊516,以執行第五焊接步驟,以將第一金屬箔602與第二金屬箔632接合並形成第五接合位置652。在實施例中,使用雷射束或焊料槍及像是錫或類似物的焊料金屬,可發生第五焊接步驟。現在參照第15圖,第五焊接步驟可繼續沿著第五接觸位置650以形成具有第一界面焊接662的物件660。在實施例中,第一界面焊接662包含第一金屬箔602的材料及第二金屬箔632的材料。在實施例中,額外的玻璃基板可被焊接至如本文所述的第一與第二玻璃基板600與630,直到達成期望的物件結構。The method continues at block 516 to perform a fifth welding step to bond the
現在參照第16圖與第17圖,及雷射接合玻璃基板的替代方法700開始於方塊702,以將第一玻璃基板的第一邊緣800a接觸第二玻璃基板802的第二邊緣802a。第一玻璃基板800與第二玻璃802各自包含主要相對表面800b、802b。第一玻璃基板800與第二玻璃基板802的主要相對表面800b、802b被個別的第一與第二邊緣800a、802a所圍界。Referring now to FIGS. 16 and 17 , an alternative method 700 of laser bonding glass substrates begins at block 702 by contacting a
方法700繼續於方塊704,以將第一非透明基板804接觸第一與第二玻璃基板800、802的每一者的主要相對表面800b、802b的一者,使得第一非透明基板804覆蓋第一與第二玻璃基板800、802兩者,與第一玻璃基板800的至少一部分形成第一接觸位置806,及與第二玻璃基板802的至少一部分形成第二接觸位置808。The method 700 continues at block 704 by contacting a first
方法700繼續於方塊706,以藉由在第一接觸位置806的至少一部分上引導雷射束(未示出)來執行第一焊接步驟,以將第一玻璃基板800接合至第一非透明基板804並形成第一接合位置810。方法700繼續於方塊708,以藉由在第二接觸位置808的至少一部分上引導雷射束812來執行第二焊接步驟,以將第二玻璃基板802接合至第一非透明基板804並形成第二接合位置814。The method 700 continues at block 706 to perform a first welding step by directing a laser beam (not shown) at at least a portion of the
回去參照第16圖並現在參照第18圖,方法700繼續於方塊710,以將第二非透明基板820接觸第一與第二玻璃基板800、802的每一者的主要相對表面800b、802b的另一者,使得第二非透明基板820重疊於第一與第二玻璃基板800、802兩者,與第一玻璃基板800的至少一部分形成第三接觸位置822,及與第二玻璃基板802的至少一部分形成第四接觸位置824。Referring back to FIG. 16 and now to FIG. 18 , the method 700 continues at block 710 by contacting a second
方法700繼續於方塊712,以在第一玻璃基板800和第二玻璃基板802的光學地上游處安置折射光學元件830。折射光學元件830形成光學接觸第一玻璃基板800或第二玻璃基板802。The method 700 continues at block 712 by positioning a refractive
方法700繼續於方塊714,以藉由在折射光學元件830的入射側(未示出)上引導雷射束(未示出)來執行第三焊接步驟,使得雷射束在第三接觸位置822的至少一部分上以第一入射側角(未示出)被折射,以將第一玻璃基板800接合至第二非透明基板820並形成第三接合位置832。The method 700 continues at block 714 to perform a third welding step by directing a laser beam (not shown) on an incident side (not shown) of the refractive
方法700繼續於方塊716,以藉由在折射光學元件830的入射側830a上引導雷射束812來執行第四焊接步驟,使得雷射束812在第四接觸位置824的至少一部分上以第二入射側角θ
5被折射,以將第二玻璃基板802接合至第二非透明基板820並形成第四接合位置844與物件836。
Method 700 continues at block 716 to perform a fourth welding step by directing the
在實施例中,方法700可包括與在此之前關於方法200所述的實質上類似或相同的玻璃基板、雷射束參數、光學元件、及入射側角。在實施例中,第一非透明基板804與第二非透明基板820的至少一者包含鋁、銅、或前述物的組合。在實施例中,第一非透明材料與第二非透明材料的至少一者具有厚度小於或等於50 µm、小於或等於40 µm、小於或等於30 µm、小於或等於20 µm、或甚至小於或等於10 µm。In an embodiment, method 700 may include glass substrates, laser beam parameters, optical elements, and incident side angles substantially similar or identical to those described hereinabove with respect to method 200. In an embodiment, at least one of first
在實施例中,額外的玻璃基板可被焊接至本文所述的第一或第二玻璃基板800、802,直到達成期望的物件結構。In an embodiment, additional glass substrates may be welded to the first or
在不背離所要求保護的標的之精神與範疇下,可對本文所述的實施例進行各種修改與變化,對於本領域的通常知識者是明顯的。因此,意欲本說明書涵蓋本文所述的各種實施例的修改與變動,只要此修改與變動落入隨附申請專利範圍及其等效物的範疇內。Various modifications and variations of the embodiments described herein may be made without departing from the spirit and scope of the subject matter claimed for protection, which will be apparent to those of ordinary skill in the art. Therefore, it is intended that this specification covers modifications and variations of the various embodiments described herein, as long as such modifications and variations fall within the scope of the attached patent application and its equivalents.
100:玻璃物件 102:邊緣 104:玻璃基板 106:界面焊接 200:方法 202,204,206,208,210,212,214,216:方塊 300:第一吸收層 302:第一玻璃基板 302a:第一邊緣 302b:主要相對表面 304:第二玻璃基板 304a:第二邊緣 304b:主要相對表面 306:第一界面 310:折射光學元件 310a:入射側 310b:稜鏡 310c:繞射光柵 312:雷射束 314:第一接合位置 320:物件 322:第一界面焊接 330:第三玻璃基板 330a:第三邊緣 330b:主要相對表面 400:第二吸收層 402:第二界面 404:第二接合位置 410:物件 412:第二界面焊接 500:方法 502,504,506,508,510,512,514,516:方塊 600:第一玻璃基板 600a:第一主要相對表面 600b:第二主要相對表面 600c:第一邊緣 602:第一金屬箔 602a:第一主要相對表面 604:第一接合位置 606:雷射束 608:第一接合位置 620:折射光學元件 620a:入射側 622:第二接觸位置 624:第二接合位置 630:第二玻璃基板 630a:第三主要相對表面 630b:第四主要相對表面 630c:第二邊緣 632:第二金屬箔 634:第三接觸位置 636:第三接合位置 638:第四接觸位置 640:第四接合位置 650:第五接觸位置 652:第五接合位置 660:物件 662:第一界面焊接 700:方法 702,704,706,708,710,712,714,716:方塊 800:第一玻璃基板 800a:第一邊緣 800b:主要相對表面 802:第二玻璃基板 802a:第二邊緣 802b:主要相對表面 804:第一非透明基板 806:第一接觸位置 808:第二接觸位置 810:第一接合位置 812:雷射束 814:第二接合位置 820:第二非透明基板 822:第三接觸位置 824:第四接觸位置 830:折射光學元件 830a:入射側 832:第三接合位置 836:物件 844:第四接合位置 θ 0:折射角 θ 1:第一入射側角 θ 2:底角 θ 3:第二側入射角 θ 4:第一入射側角 θ 5:第二入射側角 100: Glass object 102: Edge 104: Glass substrate 106: Interface welding 200: Method 202, 204, 206, 208, 210, 212, 214, 216: Block 300: First absorbing layer 302: First glass substrate 302a: First edge 302b: Main opposing surface 304: Second glass substrate 304a: Second edge 304b: Main opposing surface 306: First interface 310: Refractive optical element 310a: Incident side 310b: Prism 310c: Diffraction grating 312: Laser beam 314: First bonding location 320: Object 3 22: first interface welding 330: third glass substrate 330a: third edge 330b: main opposing surface 400: second absorption layer 402: second interface 404: second bonding location 410: object 412: second interface welding 500: method 502, 504, 506, 508, 510, 512, 514, 516: block 600: first glass substrate 600a: first main opposing surface 600b: second main opposing surface 600c: first edge 602: first metal foil 602a: first main opposing surface 604: first bonding location 606: laser beam 608: first bonding position 620: refractive optical element 620a: incident side 622: second contact position 624: second bonding position 630: second glass substrate 630a: third major opposing surface 630b: fourth major opposing surface 630c: second edge 632: second metal foil 634: third contact position 636: third bonding position 638: fourth contact position 640: fourth bonding position 650: fifth contact position 652: fifth bonding position 660: object 662: first interface welding 700: method 702, 704, 706, 708, 710, 711 2,714,716: Block 800: First glass substrate 800a: First edge 800b: Main opposing surface 802: Second glass substrate 802a: Second edge 802b: Main opposing surface 804: First non-transparent substrate 806: First contact position 808: Second contact position 810: First bonding position 812: Laser beam 814: Second bonding position 820: Second non-transparent substrate 822: Third contact position 824: Fourth contact position 830: Refractive optical element 830a: Incident side 832: Third bonding position 836: Object 844: Fourth bonding position θ 0 : Refraction angle θ 1 : First incident side angle θ 2 : Bottom angle θ 3 : Second side incident angle θ 4 : First incident side angle θ 5 : Second incident side angle
第1圖圖解地描繪根據本文所述的一或多個實施例之物件的頂部、平面視圖;FIG. 1 diagrammatically depicts a top, plan view of an object according to one or more embodiments described herein;
第2圖描繪第1圖的物件的側部、平面視圖;Figure 2 depicts a side, plan view of the object of Figure 1;
第3圖是根據本文所述的一或多個實施例之雷射接合玻璃基板的方法的流程圖;FIG. 3 is a flow chart of a method for laser bonding glass substrates according to one or more embodiments described herein;
第4圖根據本文所述的一或多個實施例圖解地描繪第3圖的方法的步驟,其中折射光學元件是稜鏡而雷射束被引導正交於第一玻璃基板與第二玻璃基板;FIG. 4 schematically depicts the steps of the method of FIG. 3 , wherein the refractive optical element is a prism and the laser beam is directed orthogonally to the first glass substrate and the second glass substrate according to one or more embodiments described herein;
第5圖根據本文所述的一或多個實施例圖解地描繪第3圖的方法的步驟,其中折射光學元件是繞射光柵而雷射束被引導正交於第一玻璃基板與第二玻璃基板;FIG. 5 schematically depicts the steps of the method of FIG. 3 , wherein the refractive optical element is a diffraction grating and the laser beam is directed orthogonally to the first glass substrate and the second glass substrate according to one or more embodiments described herein;
第6圖根據本文所述的一或多個實施例圖解地描繪第3圖的方法的步驟,其中折射光學元件是稜鏡而雷射束被引導成相對於第一玻璃基板與第二玻璃基板為大於0°的角度;FIG. 6 schematically depicts the steps of the method of FIG. 3 , wherein the refractive optical element is a prism and the laser beam is directed at an angle greater than 0° relative to the first glass substrate and the second glass substrate according to one or more embodiments described herein;
第7圖根據本文所述的一或多個實施例圖解地描繪第3圖的方法的步驟,其中折射光學元件是繞射光柵而雷射束被引導成相對於第一玻璃基板與第二玻璃基板為大於0°的角度;FIG. 7 schematically depicts the steps of the method of FIG. 3 according to one or more embodiments described herein, wherein the refractive optical element is a diffraction grating and the laser beam is directed at an angle greater than 0° relative to the first glass substrate and the second glass substrate;
第8圖圖解地描繪根據本文所述的一或多個實施例之範例物件的側部、平面視圖;FIG. 8 diagrammatically depicts a side, plan view of an example article according to one or more embodiments described herein;
第9圖圖解地描繪第3圖的方法的任選步驟;FIG. 9 schematically illustrates optional steps of the method of FIG. 3;
第10圖圖解地描繪根據本文所述的一或多個實施例之另一範例物件的側部、平面視圖;FIG. 10 diagrammatically depicts a side, plan view of another example article according to one or more embodiments described herein;
第11圖是根據本文所述的一或多個實施例之雷射接合玻璃基板的替代方法的流程圖;FIG. 11 is a flow chart of an alternative method for laser bonding glass substrates according to one or more embodiments described herein;
第12圖圖解地描繪第11圖的方法的步驟;FIG. 12 schematically depicts the steps of the method of FIG. 11 ;
第13圖圖解地描繪第11圖的方法的步驟;FIG. 13 schematically depicts the steps of the method of FIG. 11 ;
第14圖圖解地描繪第11圖的方法的步驟;FIG. 14 schematically depicts the steps of the method of FIG. 11 ;
第15圖圖解地描繪根據本文所述的一或多個實施例之替代範例物件的側部、平面視圖;FIG. 15 diagrammatically depicts a side, plan view of an alternative example article according to one or more embodiments described herein;
第16圖是根據本文所述的一或多個實施例之雷射接合玻璃基板的另一替代方法的流程圖;FIG. 16 is a flow chart of another alternative method for laser bonding glass substrates according to one or more embodiments described herein;
第17圖圖解地描繪第16圖的方法的步驟;及Figure 17 diagrammatically depicts the steps of the method of Figure 16; and
第18圖圖解地描繪第16圖的方法的步驟。FIG. 18 diagrammatically depicts the steps of the method of FIG. 16 .
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None
300:第一吸收層 300: First absorption layer
302:第一玻璃基板 302: First glass substrate
302a:第一邊緣 302a: First edge
302b:主要相對表面 302b: Main relative surface
304:第二玻璃基板 304: Second glass substrate
304a:第二邊緣 304a: Second edge
304b:主要相對表面 304b: Main relative surface
306:第一界面 306: First interface
310:折射光學元件 310: Refractive optical element
310a:入射側 310a: Incident side
310b:稜鏡 310b: Prism
312:雷射束 312: Laser beam
314:第一接合位置 314: First engagement position
θ1:第一入射側角 θ 1 : first incident side angle
θ2:底角 θ 2 : base angle
Claims (44)
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US202263428479P | 2022-11-29 | 2022-11-29 | |
US63/428,479 | 2022-11-29 |
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US6998776B2 (en) | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
US9281132B2 (en) | 2008-07-28 | 2016-03-08 | Corning Incorporated | Method for sealing a liquid within a glass package and the resulting glass package |
WO2014182776A1 (en) * | 2013-05-10 | 2014-11-13 | Corning Incorporated | Laser welding transparent glass sheets using low melting glass or thin absorbing films |
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