TW202418663A - Electrical connector apparatus and method - Google Patents
Electrical connector apparatus and method Download PDFInfo
- Publication number
- TW202418663A TW202418663A TW112133324A TW112133324A TW202418663A TW 202418663 A TW202418663 A TW 202418663A TW 112133324 A TW112133324 A TW 112133324A TW 112133324 A TW112133324 A TW 112133324A TW 202418663 A TW202418663 A TW 202418663A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrical connector
- ghz
- connector
- electrical
- connectors
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/75—Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Description
本實施例大體上係關於一種電連接器設備/總成,以及針對一電連接器展示之特定實施例。The present embodiments generally relate to an electrical connector apparatus/assembly, and specific embodiments are shown with respect to an electrical connector.
意欲於以112 G/224 G操作之典型連接器可能需要一更大寬度之晶粒封裝基板來容納。然而,增加晶粒封裝基板之大小之此做法可能增加插入損耗及/或使晶粒封裝基板在回流期間更易捲曲、翹曲及/或損失共面性。因此,需要改良晶粒封裝基板大小,減小連接器之寬度,最小化共面性問題及/或最小化插入損耗。Typical connectors intended to operate at 112G/224G may require a larger width die package substrate to accommodate. However, increasing the size of the die package substrate may increase insertion loss and/or make the die package substrate more susceptible to curling, warping and/or loss of coplanarity during reflow. Therefore, there is a need to improve the size of the die package substrate, reduce the width of the connector, minimize coplanarity issues and/or minimize insertion loss.
本發明係關於克服或至少改良先前技術之缺點。 其他技術特徵之簡要描述 The present invention is concerned with overcoming or at least improving the shortcomings of the prior art. Brief description of other technical features
美國專利第7,927,144號;第3,587,028號;第11,539,169號;第4,571,014號;第4,720,770號;第6,435,913號;第6,506,076號;第6,981,898號;及第4,632,476號以及美國公開案第US20200212631號;第US20200280145號;第US20220368084號;第US20090203259號;第US20050215120號;及第US20210265785號之全文特此以引用的方式併入。The entire text of U.S. Patent Nos. 7,927,144; 3,587,028; 11,539,169; 4,571,014; 4,720,770; 6,435,913; 6,506,076; 6,981,898; and 4,632,476 and U.S. Publication Nos. US20200212631; US20200280145; US20220368084; US20090203259; US20050215120; and US20210265785 are hereby incorporated by reference.
先前申請案之交叉參考Cross-reference to previous applications
本申請案主張2022年9月2日申請之美國臨時專利申請案第63/403,561號、2023年1月26日申請之美國臨時專利申請案第63/481,702號及2023年6月30日申請之美國臨時專利申請案第63/511,451號之優先權,該等案之全部內容的全文特此以引用的方式併入本文中。This application claims priority to U.S. Provisional Patent Application No. 63/403,561 filed on September 2, 2022, U.S. Provisional Patent Application No. 63/481,702 filed on January 26, 2023, and U.S. Provisional Patent Application No. 63/511,451 filed on June 30, 2023, the entire text of which is hereby incorporated by reference into this document.
可參考各個圖進一步理解實施例。參考附圖,一實施例提供一或多個電連接器總成20。總成20可包含至少一或多個電連接器30。在一些實施例中,該等電連接器可包含約12.5 mm之一寬度、約224 Gbps之操作及/或約75 mm之一封裝大小。對之數目可為在小於半吋中有64對或大於每平方英吋256對之一密度。在一些實施例中,一電連接器可經定大小及定形狀使得複數個電連接器可配裝於不大於約75 mm×75 mm至約85 mm×85 mm之一晶粒封裝基板之單側上,複數個電連接器可共同地承載至少1024個差分信號對,且複數個電連接器以約56 GHz至約70 GHz之頻寬傳輸約224 Gbps Pam4信號,其中FEXT (遠端串擾)不超過約-40 dB。在各項實施例中,一電連接器可經定大小及定形狀使得複數個電連接器可配裝於不大於約75 mm×75 mm至約85 mm×85 mm之一晶粒封裝基板之單側上,複數個電連接器共同地承載至少1024個差分信號對,且複數個電連接器以約56 GHz至約70 GHz之頻寬傳輸約224 Gbps Pam4信號,其中NEXT (近端串擾)不超過約-50 dB。在一些實施例中,具有各不大於約75 mm至110 mm之側之晶粒封裝基板包含約80 mm±5 mm、91 mm±5 mm、95 mm±5 mm、100 mm±5 mm及105 mm±5 mm,複數個電連接器共同地承載至少1024個差分信號對,且複數個電連接器以約56 GHz至約70 GHz之頻寬傳輸約224 Gbit/sec PAM-4信號,其中FEXT不超過約-40 dB。The embodiments may be further understood with reference to the various figures. Referring to the accompanying figures, one embodiment provides one or more electrical connector assemblies 20. The assembly 20 may include at least one or more electrical connectors 30. In some embodiments, the electrical connectors may include a width of about 12.5 mm, an operation of about 224 Gbps, and/or a package size of about 75 mm. The number of pairs may be 64 pairs in less than half an inch or a density greater than 256 pairs per square inch. In some embodiments, an electrical connector may be sized and shaped such that a plurality of electrical connectors may be mounted on a single side of a die package substrate no larger than approximately 75 mm×75 mm to approximately 85 mm×85 mm, the plurality of electrical connectors may collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit approximately 224 Gbps Pam4 signals at a bandwidth of approximately 56 GHz to approximately 70 GHz with a FEXT (far end crosstalk) no greater than approximately -40 dB. In various embodiments, an electrical connector may be sized and shaped such that a plurality of electrical connectors may be mounted on a single side of a die package substrate of no greater than approximately 75 mm×75 mm to approximately 85 mm×85 mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit approximately 224 Gbps Pam4 signals at a bandwidth of approximately 56 GHz to approximately 70 GHz with a NEXT (near-end crosstalk) of no more than approximately -50 dB. In some embodiments, a die package substrate having sides each no greater than about 75 mm to 110 mm includes about 80 mm±5 mm, 91 mm±5 mm, 95 mm±5 mm, 100 mm±5 mm, and 105 mm±5 mm, a plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit about 224 Gbit/sec PAM-4 signals at a bandwidth of about 56 GHz to about 70 GHz, with a FEXT no greater than about -40 dB.
現參考附圖,圖1至圖4B繪示根據本發明之一態樣的一電連接器總成20之一實例性實施例。電連接器總成20包含一電連接器30及/或經組態以與電連接器30配接之複數個電纜連接器40。電連接器30可包含或連接至一電路基板50,諸如,例如,晶粒封裝基板50a、一印刷電路板50b。如一項實施例中所展示,連接器30可定位/配裝於電路基板50 (例如50a、50b)之單側上。然而,在一些實施例中,連接器30可定位於兩側上。參考圖5及圖6,電連接器30可包含一配接介面或電纜頭組織器60 (例如蛋架配接介面或屏蔽件)。配接介面60可包含界定複數個腔63的複數個互鎖板62。連接器30可包含或經組態以與一或多個電纜連接器40配接。各腔63經定大小用於接受或配接至電纜連接器40。電連接器30可包含一或多個插頭連接器70。電連接器30或插頭連接器70進一步包含一或多個電接觸件71及/或一或多個接地接觸元件72。各電接觸件71定位於腔63內,與互鎖板62電絕緣,且經組態以與電纜連接器40之一接觸件42 (例如插座)配接。接觸件42可為非壓縮類型之接觸件,諸如樑至樑或樑至葉片對樑至墊。如美國專利第10,439,330號中所描述,一塑膠或介電網及可選按鈕可定位於兩個緊鄰接觸件42之間,其之全文特此以引用的方式併入。接觸件42可為導電的。各差分信號對之接觸件可間隔約0.3 mm至約0.4 mm,包含約0.3 mm、約0.35 mm、約0.4 mm及其等之間的所有長度。差分對至對間距可為約1.4 mm、約1.5 mm、約1.6 mm、約1.7 mm或約1.8 mm及其等之間的所有長度。差分信號對之列至列間距可為約1.3 mm、約1.4 mm、約1.5 mm、約1.6 mm、約1.7 mm或約1.8 mm。在一差分信號對陣列中,一些列可不均勻地間隔,諸如針對一些列間距係約1.3 mm且其他鄰近列之間的約1.7 mm中心線至中心線間距。接地接觸元件72之各者可電接地且經組態以與至少一個板62 (例如直接地、間接地,第一板、第二板)配接。插頭連接器70 (例如接地接觸元件、電接觸件)可焊接至電路基板50 (例如50a、50b)。在如圖7中所展示的一些實施例中,可使用1024對解決方案。在如圖8中所展示的其他實施例中,可使用一1192或1280對解決方案。Now referring to the accompanying drawings, Figures 1 to 4B illustrate an exemplary embodiment of an electrical connector assembly 20 according to one aspect of the present invention. The electrical connector assembly 20 includes an electrical connector 30 and/or a plurality of cable connectors 40 configured to mate with the electrical connector 30. The electrical connector 30 may include or be connected to a circuit substrate 50, such as, for example, a die package substrate 50a, a printed circuit board 50b. As shown in one embodiment, the connector 30 may be positioned/mounted on a single side of the circuit substrate 50 (e.g., 50a, 50b). However, in some embodiments, the connector 30 may be positioned on both sides. Referring to Figures 5 and 6, the electrical connector 30 may include a mating interface or a cable head organizer 60 (e.g., an egg rack mating interface or a shield). The mating interface 60 may include a plurality of interlocking plates 62 defining a plurality of cavities 63. The connector 30 may include or be configured to mate with one or more cable connectors 40. Each cavity 63 is sized to receive or mate to a cable connector 40. The electrical connector 30 may include one or more plug connectors 70. The electrical connector 30 or the plug connector 70 further includes one or more electrical contacts 71 and/or one or more grounding contact elements 72. Each electrical contact 71 is positioned within a cavity 63, electrically insulated from the interlocking plates 62, and configured to mate with one of the contacts 42 (e.g., a socket) of the cable connector 40. The contacts 42 may be non-compression type contacts, such as beam to beam or beam to blade versus beam to pad. A plastic or dielectric mesh and optional button may be positioned between two adjacent contacts 42 as described in U.S. Patent No. 10,439,330, the entirety of which is hereby incorporated by reference. The contacts 42 may be conductive. The contacts for each differential signal pair may be spaced about 0.3 mm to about 0.4 mm, including about 0.3 mm, about 0.35 mm, about 0.4 mm, and all lengths therebetween. The differential pair-to-pair spacing may be about 1.4 mm, about 1.5 mm, about 1.6 mm, about 1.7 mm, or about 1.8 mm, and all lengths therebetween. The row-to-row spacing of the differential signal pairs may be about 1.3 mm, about 1.4 mm, about 1.5 mm, about 1.6 mm, about 1.7 mm, or about 1.8 mm. In an array of differential signal pairs, some rows may be unevenly spaced, such as about 1.3 mm for some rows and about 1.7 mm centerline-to-centerline spacing between other adjacent rows. Each of the ground contact elements 72 may be electrically grounded and configured to mate with at least one board 62 (e.g., directly, indirectly, a first board, a second board). The plug connector 70 (e.g., ground contact element, electrical contact) may be soldered to the circuit substrate 50 (e.g., 50a, 50b). In some embodiments as shown in FIG. 7, a 1024-pair solution may be used. In other embodiments as shown in FIG. 8, a 1192 or 1280-pair solution may be used.
在一些實施方案中,互鎖板62之至少一者(例如第一板)可為導電的且在電纜連接器40與電路基板50或其部分之間提供一接地連接。通常,互鎖板62可為導電的或絕緣的。如圖9及圖10中所展示,至少一個互鎖板62包含與電路基板50間隔開的一終端64及用於電接觸電纜連接器40之一導電外屏蔽元件43的一配接端65。為了往復降低/控制阻抗,自電路基板50 (例如封裝50a、50b)至板62/屏蔽件43之終端64的一間距或距離D可減小達板62或腔63之一長度L。自電路基板至終端64的長度或距離D之剩餘部分可為至少一個串擾源。界定腔63的板62覆蓋或重疊至封裝或基板50之電纜連接器40之長度之約85%至95%以最小化距離D。如圖9中的一項實施例中所展示,界定腔63的板62覆蓋/重疊至該封裝之電纜連接器40之長度L之約90%以減小串擾,而剩餘部分或距離D可為至該基板之電纜連接器40之長度L之約10%。圖11中展示至封裝之電纜之阻抗輪廓之一項實施例,所展示模擬在6 ps (20%至80%上升時間)下具有92 Ω +/-5 Ω之一TDR信號。In some embodiments, at least one of the interlocking plates 62 (e.g., the first plate) can be conductive and provide a ground connection between the cable connector 40 and the circuit substrate 50 or a portion thereof. In general, the interlocking plates 62 can be conductive or insulating. As shown in FIGS. 9 and 10 , at least one interlocking plate 62 includes a terminal 64 spaced from the circuit substrate 50 and a mating end 65 for electrically contacting a conductive outer shield element 43 of the cable connector 40. To reciprocally reduce/control impedance, a spacing or distance D from the circuit substrate 50 (e.g., package 50a, 50b) to the terminal 64 of the plate 62/shield 43 can be reduced by a length L of the plate 62 or cavity 63. The remainder of the length or distance D from the circuit substrate to the terminal 64 can be a source of at least one crosstalk. The plate 62 defining the cavity 63 covers or overlaps about 85% to 95% of the length of the cable connector 40 to the package or substrate 50 to minimize the distance D. As shown in one embodiment in FIG. 9 , the plate 62 defining the cavity 63 covers/overlaps about 90% of the length L of the cable connector 40 to the package to reduce crosstalk, and the remainder or distance D can be about 10% of the length L of the cable connector 40 to the substrate. An example of an impedance profile of the cable to the package is shown in FIG. 11 , showing a TDR signal simulated with 92 Ω +/- 5 Ω at 6 ps (20% to 80% rise time).
在一些實施方案中,板62或腔63之終端64可與封裝/基板50隔開(例如預定距離D)。終端64或板62可在距離D處與插頭連接器之接地接觸元件72鄰接/定位/配接。接觸元件72或其部分可在距離D處將板62或其部分(例如終端64)與基板50隔開。在所展示的一項實施例中,接地接觸元件72自電路基板50 (例如50a、50b)延伸/突出。接地接觸元件72可包含一或多個臂/葉片。例如,該接地接觸元件可包含至少一個臂、至少兩個臂、至少三個臂、至少四個臂或者四個或更多個臂。當配接至配接介面(例如(若干)板)時,(若干)臂之數目的增加可增加接觸面積/寬度。如一項實施例中所展示,接地接觸元件72可包含向上且遠離彼此延伸以界定一狹槽73來接納(若干)板62 (例如第一板)之終端64的兩個臂72a、72b (例如至少兩個橫向偏移的懸臂樑)。該兩個臂可自接地接觸元件或主體之剩餘部分分叉。兩個臂72a可沿著接納(若干)板62的狹槽73之長度或平面彼此偏移達一距離。儘管該等臂可能未沿著該狹槽之長度重疊或交叉,但應理解,在一些實施例中,該等臂之一部分可重疊。狹槽或者接地接觸元件72之一或多個部分(例如(若干)臂)可界定用於限制板62在狹槽內或朝向電路基板之進一步軸向行進的一止擋件或垂直止擋機構。止擋件可將配接介面、板或腔定位於距離D處。此外,第一及第二臂72a、72b可為彼此相對於狹槽73之平面之鏡像。第一臂72a嚙合一個腔/板之內部且第二臂72b嚙合鄰近腔/板之內部。在所展示的一項實施例中,兩個接地接觸元件72可嚙合鄰近且平行的板62 (例如第一板),且不嚙合界定接納電纜連接器40的腔63的鄰近第二板。然而,在一些實施例中,一或多個接地接觸元件72可嚙合一或多個第二板及/或與一或多個第一板組合。在所展示的一項實施例中,各臂72a、72b可經彈簧加載或偏置以推動朝向狹槽73或經嚙合板62。此外,各臂或該臂之自由遠端可張開/彎曲遠離該狹槽或經嚙合板。如一項實施例中所展示,臂72可由空氣或自由空間環繞,而不與一塑膠或絕緣構件接觸。在接地接觸元件72之配接端與信號接觸件71之配接端之間沒有塑膠。71及72之配接端可不受限制或不由(若干)塑膠或絕緣構件環繞。臂72 (例如配接端)可在該臂之基座處之插頭連接器70之塑膠上方懸空,突出及/或延伸(例如不在塑膠內部)。此外,沿著在臂72b之配接端與臂72b之一緊鄰配接端之間延伸的一線可不存在塑膠或絕緣材料。圖12中繪示屏蔽返回路徑或接地接觸元件之S參數之一項實例。圖12中所展示的模擬實施例在6 ps (20%至80%上升時間)下以92 Ω +/-5 Ω進行。在一些實施方案中,(若干)接觸件可包含一或多個焊球/焊料塊74。在所展示的一項實施例中,接地接觸元件72包含至少一個焊料塊74。應理解,接地接觸元件72可包含一或多個焊料塊。例如,至少一個焊料塊、至少兩個焊料塊或至少三個焊料塊。在一些實施例中,兩個或更多個焊料塊可彼此緊鄰(例如線性對準)。在一些實施例中,接觸件之焊接可為多種長度之一或多個長形墊。在一些實施方案中,電/信號接觸件71可垂直於接地接觸元件72。In some embodiments, the terminal 64 of the plate 62 or cavity 63 may be spaced apart from the package/substrate 50 (e.g., a predetermined distance D). The terminal 64 or plate 62 may be adjacent to/positioned/matched with the ground contact element 72 of the plug connector at a distance D. The contact element 72 or a portion thereof may space the plate 62 or a portion thereof (e.g., the terminal 64) from the substrate 50 at a distance D. In one embodiment shown, the ground contact element 72 extends/protrudes from the circuit substrate 50 (e.g., 50a, 50b). The ground contact element 72 may include one or more arms/blades. For example, the ground contact element may include at least one arm, at least two arms, at least three arms, at least four arms, or four or more arms. When mating to a mating interface (e.g., board(s), the increase in the number of arm(s) can increase the contact area/width. As shown in one embodiment, the ground contact element 72 can include two arms 72a, 72b (e.g., at least two laterally offset cantilever beams) extending upward and away from each other to define a slot 73 to receive the terminal 64 of the board(s) 62 (e.g., the first board). The two arms can branch from the remaining portion of the ground contact element or body. The two arms 72a can be offset from each other by a distance along the length or plane of the slot 73 that receives the board(s) 62. Although the arms may not overlap or cross along the length of the slot, it should be understood that in some embodiments, a portion of the arms can overlap. One or more portions (e.g., arms) of the slot or ground contact element 72 may define a stop or vertical stop mechanism for limiting further axial travel of the plate 62 within the slot or toward the circuit substrate. The stop may position the mating interface, plate, or cavity at a distance D. Additionally, the first and second arms 72a, 72b may be mirror images of each other relative to the plane of the slot 73. The first arm 72a engages the interior of one cavity/plate and the second arm 72b engages the interior of an adjacent cavity/plate. In one embodiment shown, the two ground contact elements 72 may engage adjacent and parallel plates 62 (e.g., a first plate) and not engage an adjacent second plate defining a cavity 63 that receives the cable connector 40. However, in some embodiments, one or more ground contact elements 72 may engage one or more second plates and/or be combined with one or more first plates. In one embodiment shown, each arm 72a, 72b may be spring loaded or biased to push toward the slot 73 or through the engagement plate 62. In addition, each arm or the free distal end of the arm may be opened/bent away from the slot or through the engagement plate. As shown in one embodiment, the arm 72 may be surrounded by air or free space without contacting a plastic or insulating member. There is no plastic between the mating end of the ground contact element 72 and the mating end of the signal contact 71. The mating ends of 71 and 72 may not be constrained or surrounded by (several) plastic or insulating members. Arm 72 (e.g., mating end) may be suspended above, protruding and/or extending (e.g., not inside the plastic) of the plug connector 70 at the base of the arm. In addition, there may be no plastic or insulating material along a line extending between the mating end of arm 72b and an adjacent mating end of arm 72b. An example of S parameters for a shielded return path or ground contact element is shown in FIG. 12. The simulated embodiment shown in FIG. 12 was performed at 92 Ω +/- 5 Ω at 6 ps (20% to 80% rise time). In some embodiments, the (several) contacts may include one or more solder balls/solder blocks 74. In one embodiment shown, the ground contact element 72 includes at least one solder mass 74. It should be understood that the ground contact element 72 may include one or more solder masses. For example, at least one solder mass, at least two solder masses, or at least three solder masses. In some embodiments, two or more solder masses may be adjacent to each other (e.g., linearly aligned). In some embodiments, the welding of the contact piece may be one or more elongated pads of multiple lengths. In some embodiments, the electrical/signal contact 71 may be perpendicular to the ground contact element 72.
在一較佳實施例中,互鎖板62係藉由任何合適方法(諸如,例如,金屬衝壓)形成的金屬板。在其他實施例中,互鎖板62藉由其他手段形成,包含聚合物材料之模製及/或加工、金屬之模製及/或加工或者用一聚合物材料包覆成型之一金屬框架之建構。在一些實施例中,可電鍍一塑膠框架/基座。In a preferred embodiment, the interlocking plate 62 is a metal plate formed by any suitable method, such as, for example, metal stamping. In other embodiments, the interlocking plate 62 is formed by other means, including molding and/or machining of polymer materials, molding and/or machining of metals, or construction of a metal frame overmolded with a polymer material. In some embodiments, a plastic frame/base may be electroplated.
在一些實施方案中,互鎖/互連板62包含複數個第一板62a及複數個第二板62b,如圖5及圖6中所展示。(若干)板62可包含一或多個凹槽66及/或一或多個狹槽67。該等凹槽(若被使用)可與該等狹槽(若被使用)互鎖以界定腔63。第一板62a可包含與複數個第一凹槽66a對準的複數個第一狹槽67a。第二板62b可包含與複數個第二凹槽66b對準的複數個第二狹槽67b。藉由將第一狹槽67a與第二凹槽66b互鎖且將第二狹槽67b與第一凹槽66a互鎖,第二板62b相對於第一板62a橫向定位及互連,使得當被組裝時,複數個第一板及第二板界定複數個腔63。狹槽/凹槽嚙合部66、67或配接介面60提供繞著一或多個電纜連接器40之一完全封閉或360度屏蔽/圓周。360°屏蔽或板減少腔內的電纜連接器之間的串擾。此可防止或減少腔壁中之間隙/孔/路徑以減少串擾。狹槽/凹槽嚙合部之壁可鄰接或重疊相對狹槽/凹槽嚙合部之邊緣以減小間隙。如圖13中所展示,複數個電連接器可傳輸約70 GHz信號,其中FEXT (遠端串擾)不超過約-40 dB。圖13中所展示的模擬實施例在6 ps (20%至80%上升時間)下以92 Ω+/-5 Ω進行。In some embodiments, the interlocking/interconnecting plates 62 include a plurality of first plates 62a and a plurality of second plates 62b, as shown in FIGS. 5 and 6. The plate(s) 62 may include one or more grooves 66 and/or one or more slots 67. The grooves (if used) may interlock with the slots (if used) to define the cavity 63. The first plate 62a may include a plurality of first slots 67a aligned with the plurality of first grooves 66a. The second plate 62b may include a plurality of second slots 67b aligned with the plurality of second grooves 66b. By interlocking the first slots 67a with the second grooves 66b and the second slots 67b with the first grooves 66a, the second plate 62b is laterally positioned and interconnected relative to the first plate 62a so that when assembled, the plurality of first plates and the second plates define a plurality of cavities 63. The slot/recess closures 66, 67 or mating interface 60 provide a fully enclosed or 360 degree shield/circumference around one of the one or more cable connectors 40. The 360° shield or plate reduces crosstalk between the cable connectors within the cavity. This can prevent or reduce gaps/holes/paths in the cavity wall to reduce crosstalk. The walls of the slot/recess joints may abut or overlap the edges of the opposing slot/recess joints to reduce the gap. As shown in FIG. 13 , the plurality of electrical connectors can transmit about 70 GHz signals with FEXT (far end crosstalk) not exceeding about -40 dB. The simulation embodiment shown in FIG. 13 was performed at 92 Ω +/- 5 Ω at 6 ps (20% to 80% rise time).
在一些實施方案中,配接介面60可包含一殼體68。若被使用,則殼體68可包含定位於內周邊中的複數個凹槽69。(若干)凹槽69可維持腔63/板62之間距及/或為一或多個板62提供剛性。凹槽69可接納第一板62a及第二板62b之端。In some embodiments, the mating interface 60 may include a housing 68. If used, the housing 68 may include a plurality of grooves 69 positioned in the inner periphery. The groove(s) 69 may maintain the spacing of the cavity 63/plate 62 and/or provide rigidity to the one or more plates 62. The grooves 69 may receive the ends of the first plate 62a and the second plate 62b.
在一些實施方案中,電連接器30可在電纜連接器40之間包含一或多個間隙/空間32以減少串擾。在一些實施例中,列之間的更大空間或距離可降低PKG之NEXT。在所展示的一項實施例中,間隙32可由不含電纜連接器40之複數個板62界定的一或多列腔63界定。在電纜連接器40之陣列內沒有一或多列電纜連接器40或間隙32可減少電纜連接器40之間的串擾。如一項實施例中所展示,沒有電纜連接器40的一或多列/間隙32可由複數個較小腔(例如較小貫通開口)或(若干)較近間隔板界定。較小列或間隙32 (若被使用)可由以小於剩餘平行板的一距離間隔之至少兩個鄰近且平行的板(例如第一板62a及/或第二板62b)界定。凹槽66及狹槽67可定位於各自板62上以界定多種列至列間距/距離D之(若干)間隙32。儘管未展示,但第一板及第二板兩者之相交板62可以一較小距離(例如列至列)間隔以界定一較小列。此外,如圖14中所展示,複數個電連接器可傳輸約70 GHz信號,其中NEXT (近端串擾)不超過約-50 dB。圖14中所展示的模擬實施例係在6 ps (20%至80%上升時間)下以92 Ω +/-5 Ω進行。In some embodiments, the electrical connector 30 may include one or more gaps/spaces 32 between the cable connectors 40 to reduce crosstalk. In some embodiments, greater space or distance between rows can reduce the NEXT of the PKG. In one embodiment shown, the gaps 32 can be defined by one or more rows of cavities 63 defined by a plurality of plates 62 that do not contain cable connectors 40. The absence of one or more rows of cable connectors 40 or gaps 32 within an array of cable connectors 40 can reduce crosstalk between the cable connectors 40. As shown in one embodiment, the one or more rows/gaps 32 without cable connectors 40 can be defined by a plurality of smaller cavities (e.g., smaller through openings) or (several) closer spacer plates. Smaller rows or gaps 32 (if used) can be defined by at least two adjacent and parallel plates (e.g., first plate 62a and/or second plate 62b) spaced a distance less than the remaining parallel plates. Grooves 66 and slots 67 can be positioned on respective plates 62 to define gap(s) 32 of a variety of row-to-row spacings/distances D. Although not shown, the intersecting plates 62 of both the first plate and the second plate can be spaced a smaller distance (e.g., row-to-row) to define a smaller row. In addition, as shown in FIG. 14, a plurality of electrical connectors can transmit approximately 70 GHz signals with NEXT (near end crosstalk) not exceeding approximately -50 dB. The simulation embodiment shown in FIG. 14 was performed at 92 Ω +/- 5 Ω at 6 ps (20% to 80% rise time).
在一些實施方案中,總成/連接器或其部分(例如配接介面、插頭連接器及/或電纜連接器)可為依6 ps及20%至80%上升時間以92 Ω +/-5 Ω進行之一224 Gbps Pam4信號,如一項實施例中所模擬。在一些實施例中,頻寬可為約70 GHz至50 GHz。在一些實施例中,頻寬可為約56 GHz。在各項實施例中,FEXT可為約-30 dB至約-45 dB。例如,低於或等於-30 dB、低於或等於-35 dB、低於或等於-40 dB及/或低於或等於-45 dB。在一些實施例中,插入損耗可介於約0 dB至約-5 dB之間。例如,介於0 dB與-1 dB之間、介於-1 dB與-2 dB之間、介於-2 dB與-3 dB之間、介於-3 dB與-4 dB之間及/或介於-4 dB與-5 dB之間。頻寬可為約50 GHz至約80 GHz。例如,50 GHz、55 GHz、60 GHz、65 GHz、70 GHz、75 GHz及/或80 GHz。在各項實施例中,NEXT可為約-40 dB至約-60 dB。例如,低於或等於-40 dB、低於或等於-45 dB、低於或等於-50 dB、低於或等於-55 dB及/或低於或等於-60 dB。在一些實施例中,插入損耗可介於約0 dB至約-5 dB之間。例如,介於0 dB與-1 dB之間、介於-1 dB與-2 dB之間、介於-2 dB與-3 dB之間、介於-3 dB與-4 dB之間及/或介於-4 dB與-5 dB之間。頻寬可為約50 GHz至約70 GHz。例如,50 GHz、55 GHz、60 GHz、65 GHz及/或70 GHz。In some embodiments, the assembly/connector or a portion thereof (e.g., a mating interface, a plug connector, and/or a cable connector) may be a 224 Gbps Pam4 signal at 6 ps and 20% to 80% rise time at 92 Ω +/-5 Ω, as simulated in one embodiment. In some embodiments, the bandwidth may be approximately 70 GHz to 50 GHz. In some embodiments, the bandwidth may be approximately 56 GHz. In various embodiments, the FEXT may be approximately -30 dB to approximately -45 dB. For example, less than or equal to -30 dB, less than or equal to -35 dB, less than or equal to -40 dB, and/or less than or equal to -45 dB. In some embodiments, the insertion loss may be between approximately 0 dB and approximately -5 dB. For example, between 0 dB and -1 dB, between -1 dB and -2 dB, between -2 dB and -3 dB, between -3 dB and -4 dB, and/or between -4 dB and -5 dB. The bandwidth may be about 50 GHz to about 80 GHz. For example, 50 GHz, 55 GHz, 60 GHz, 65 GHz, 70 GHz, 75 GHz, and/or 80 GHz. In various embodiments, NEXT may be about -40 dB to about -60 dB. For example, less than or equal to -40 dB, less than or equal to -45 dB, less than or equal to -50 dB, less than or equal to -55 dB, and/or less than or equal to -60 dB. In some embodiments, the insertion loss may be between about 0 dB and about -5 dB. For example, between 0 dB and -1 dB, between -1 dB and -2 dB, between -2 dB and -3 dB, between -3 dB and -4 dB, and/or between -4 dB and -5 dB. The bandwidth may be about 50 GHz to about 70 GHz. For example, 50 GHz, 55 GHz, 60 GHz, 65 GHz, and/or 70 GHz.
在一些實施方案中,總成20或電連接器30可包含用於一或多個電纜90之一彎管/電纜組織器80。在一些實施例中,彎管/電纜組織器80可包含一應變消除件81。若被使用,則應變消除件81可為一熱熔體。如圖3A及圖15中所展示,彎管組織器80可與一垂直電纜90a或一直角電纜90b一起使用。電連接器30或總成20之總高度可小於15 mm。具有彎管組織器80的直角電纜90b可界定約15 mm之一高度。具有彎管組織器80的垂直電纜90a可界定約10 mm之一高度。In some embodiments, the assembly 20 or electrical connector 30 may include an elbow/cable organizer 80 for one or more cables 90. In some embodiments, the elbow/cable organizer 80 may include a strain relief 81. If used, the strain relief 81 may be a hot melt. As shown in Figures 3A and 15, the elbow organizer 80 can be used with a vertical cable 90a or a right angle cable 90b. The overall height of the electrical connector 30 or assembly 20 can be less than 15 mm. The right angle cable 90b with the elbow organizer 80 can define a height of approximately 15 mm. The vertical cable 90a with the elbow organizer 80 can define a height of approximately 10 mm.
在一些實施方案中,一或多個電纜90可連接至一或多個電纜連接器40。儘管電纜90在所展示的一項實施例中被展示為一雙絞電纜,但應理解,多種電纜可被使用且仍然在本發明之範疇內。例如,在一些實施例中可使用一同軸電纜。電纜90可包含一屏蔽件,諸如一纏繞屏蔽件或一擠出屏蔽件或任何類型之接地、參考或EMI屏蔽件。該屏蔽件可關於中心電絕緣體之一經曝露表面剝開,可部分地剝開,但不限於大於0 mm至約1 mm至2 mm、或0 mm、或2 mm或更大、或0 mm至0.5 mm之一長度。該等連接器之任一者可包含導電或電損耗的磁性吸收材料。In some embodiments, one or more cables 90 may be connected to one or more cable connectors 40. Although the cable 90 is shown as a twisted pair cable in one embodiment shown, it should be understood that a variety of cables may be used and still be within the scope of the present invention. For example, a coaxial cable may be used in some embodiments. The cable 90 may include a shield, such as a wrap shield or an extrusion shield or any type of ground, reference or EMI shield. The shield may be peeled off about one of the exposed surfaces of the central electrical insulator, may be partially peeled off, but is not limited to a length greater than 0 mm to about 1 mm to 2 mm, or 0 mm, or 2 mm or more, or 0 mm to 0.5 mm. Either of the connectors may include electrically conductive or electrically lossy magnetically absorbent material.
在一些實施方案中,總成20或電連接器可包含一或多個保持支架95。如圖16A及圖16B中所展示,一保持支架95之一項實例可為一或多個彈簧指。若被使用,則該保持裝置可確保配接部件及/或允許維修。該保持支架之另一實例可為閂鎖。In some embodiments, the assembly 20 or electrical connector may include one or more retaining brackets 95. As shown in Figures 16A and 16B, one example of a retaining bracket 95 may be one or more spring fingers. If used, the retaining device can ensure mating components and/or allow maintenance. Another example of the retaining bracket may be a latch.
在一些實施方案中,電路基板50可具有一佈線判定密度。例如,如圖17中所展示,PKG或晶粒基板封裝可自一350 um節距開始以最小化FEXT且將該節距壓小至200 um作為一路由通路。0.35之BGA節距可判定佈線密度(例如224 Gbps)。可能存在64對區塊之一PCB實施例。PCB版本可比晶粒基板封裝更寬及更深約5 mm,如圖15中所展示。此外,圖18中展示PKG對PCB實施例之一項實施例。該等設計被展示為經旋轉用於垂直佈線。PKG可為2個層且PCB可為4/8個層。In some embodiments, the circuit substrate 50 may have a routing density that determines the density. For example, as shown in FIG. 17, the PKG or die substrate package may start with a 350 um pitch to minimize FEXT and reduce the pitch to 200 um as a routing path. A BGA pitch of 0.35 may determine the routing density (e.g., 224 Gbps). There may be a PCB embodiment with 64 pairs of blocks. The PCB version may be approximately 5 mm wider and deeper than the die substrate package, as shown in FIG. 15. In addition, an embodiment of a PKG to PCB embodiment is shown in FIG. 18. The designs are shown as rotated for vertical routing. The PKG may be 2 layers and the PCB may be 4/8 layers.
在一些實施方案中,電連接器總成可包含一較低RA高度選項。例如,電纜組織器可小於8 mm,具有相容性。如圖19A至圖19C中所展示,組態可為呈一夾層組態之一堆疊撓性件(flex) 98。如所展示的一項實例可為堆疊且一個焊接至連接器的四個3層撓性膜。撓性件98可轉換為一或多個電纜以獲得更長長度。In some embodiments, the electrical connector assembly may include a lower RA height option. For example, the cable organizer may be less than 8 mm, with compatibility. As shown in Figures 19A-19C, the configuration may be a stacked flex 98 in a sandwich configuration. An example as shown may be four 3-layer flex films stacked and one welded to the connector. The flex 98 may be converted to one or more cables to obtain longer lengths.
在一些實施方案中,電連接器總成20、電連接器30、配接介面60、160、基板50及/或插頭連接器70、170可包含將配接介面160與插頭連接器170耦合的一或多個鎖定機構82或者其部分。在圖20至圖23中所展示的一項實施例中,鎖定機構82可為與電連接器30/連接器170/配接介面160之外周邊(例如外殼體、壁)隔開或自其向內定位或定位於其內的一中間或內部鎖定機構。鎖定機構82可包含一或多個閂鎖、夾子或摩擦鎖82a (例如中間、內部)。一或多個夾子82a被展示為在插頭連接器170、配接介面160及/或電連接器30 (例如外周邊)之內部或內側/內。儘管夾子82a被展示為在電/插頭連接器30、170及/或配接介面160之內部,但應理解,在一些實施例中,外部夾子(例如定位於外周邊、壁上)可與(若干)內部夾子/鎖定機構組合使用。一或多個夾子82a自插頭連接器170及/或基板50之底部及/或外周邊之間隔內部向上突出。該等夾子可自在配接介面160 (例如基座、接地構件)或插頭連接器170之外周邊壁(例如相對壁)之間或內延伸的一中間或內壁82ab向上突出。在所展示的一項實施例中,兩個間隔開的夾子82a可在一橫向方向(例如相對方向,向內朝向內部面板82b之相對側)上彈簧加載至夾子82a及/或內壁82ab之平面。夾子82a將摩擦力施加至配接介面160之鎖定機構82或其部分(例如內部面板82b、掣子82ba)以減少或防止配接介面160與插頭連接器170之間的軸向分離。配接介面160之鎖定機構82或其部分可為可釋放地嚙合一或多個夾子82a的一或多個插座/掣子82ba及/或內部面板82b。當被組裝時,夾子82a嚙合配接介面160之內部面板82b或其部分(例如上缺口/掣子/插座82ba)。插頭連接器170之夾子82a干擾配接介面160或內部/中間面板82b之軸向分離。內部面板82b可定位於電纜連接器40及/或腔32 (例如電纜連接器之列)之間的間隙32中。內部面板82b可在其上邊緣中包含一或多個缺口/掣子82ba。若使用兩個缺口82ba,則該等缺口可沿著面板82b之長度彼此間隔開。鎖定機構82之一或多個部分可在配接介面160與插頭連接器170之間反轉。例如,應理解,在一些實施例中,配接介面160可包含夾子且插頭連接器170可包含內部面板。In some embodiments, the electrical connector assembly 20, the electrical connector 30, the mating interface 60, 160, the substrate 50 and/or the plug connector 70, 170 may include one or more locking mechanisms 82 or portions thereof that couple the mating interface 160 to the plug connector 170. In one embodiment shown in FIGS. 20-23 , the locking mechanism 82 may be an intermediate or internal locking mechanism that is spaced from or positioned inwardly from or within the outer periphery (e.g., housing, wall) of the electrical connector 30/connector 170/mating interface 160. The locking mechanism 82 may include one or more latches, clips, or friction locks 82a (e.g., intermediate, internal). One or more clips 82a are shown as being inside or inside/inside the plug connector 170, the mating interface 160, and/or the electrical connector 30 (e.g., the outer perimeter). Although the clips 82a are shown as being inside the electrical/plug connector 30, 170, and/or the mating interface 160, it should be understood that in some embodiments, external clips (e.g., located on the outer perimeter, on the wall) can be used in combination with (several) internal clip/locking mechanisms. The one or more clips 82a protrude upward from the inside of the gap at the bottom and/or outer perimeter of the plug connector 170 and/or the substrate 50. The clips may project upwardly from a middle or inner wall 82ab extending between or within an outer peripheral wall (e.g., opposing wall) of the mating interface 160 (e.g., base, grounding member) or the plug connector 170. In one embodiment shown, two spaced apart clips 82a may be spring loaded in a lateral direction (e.g., opposing direction, inwardly toward opposing sides of the inner panel 82b) to the plane of the clips 82a and/or the inner wall 82ab. The clips 82a apply frictional force to the locking mechanism 82 of the mating interface 160 or a portion thereof (e.g., inner panel 82b, detent 82ba) to reduce or prevent axial separation between the mating interface 160 and the plug connector 170. The locking mechanism 82 of the mating interface 160, or a portion thereof, may be one or more sockets/detents 82ba and/or an inner panel 82b that releasably engage one or more clips 82a. When assembled, the clip 82a engages the inner panel 82b of the mating interface 160, or a portion thereof (e.g., an upper notch/detent/socket 82ba). The clip 82a of the plug connector 170 interferes with the axial separation of the mating interface 160 or the inner/middle panel 82b. The inner panel 82b may be positioned in the gap 32 between the cable connector 40 and/or the cavity 32 (e.g., a row of cable connectors). The inner panel 82b may include one or more notches/detents 82ba in its upper edge. If two notches 82ba are used, the notches may be spaced apart from one another along the length of the panel 82b. One or more portions of the locking mechanism 82 may be reversed between the mating interface 160 and the plug connector 170. For example, it should be understood that in some embodiments, the mating interface 160 may include a clip and the plug connector 170 may include an inner panel.
在圖20至圖25中所展示的一項實施例中,配接介面160可包含界定接納至少一列或一或多個電纜連接器40的至少一列R1之腔63的複數個互鎖板62。互鎖板62可包含至少兩個第三板/相對/平行板62c,該等第三板/相對/平行板62c藉由橫向於該第三板之一或多個第四板/平行板62d互連。第四板62d可在該列腔或第三板62c之相對端處界定相對端板。各列R1可包含第三及第四板。配接介面160可包含由第三及第四板界定的複數列R1。腔63可具有由第三及第四板62c、62d界定的一貫通開口(例如敞開頂部及敞開底部)。在一些實施例中,第三板62c可包含當被組裝時接納自第四板62d之外周邊(例如相對端/側)延伸的一或多個突起62da之一或多個貫通孔徑62ca。如圖24、圖25及圖25B中的一項實施例中所展示,(若干)第三板62c可包含一或多個貫通孔徑或長形狹槽62ca (例如在配接端65朝向終端64之間的方向上)。如圖24、圖25及圖25A中所展示,各第四板62d可在相對側/邊緣上包含嚙合相對第三板62c之對應長形狹槽62ca的一或多個突起或長形突起62da。第三板62c及/或第四板62d之一或多者之配接端65可包含用以與一或多個電纜90或電纜連接器40配接或輪廓吻合的複數個彎曲邊緣。若被使用,則相對/平行第三板62c之另一者可長於且延伸超過彎曲邊緣,如圖24及圖25中所展示。在一些實施例中,可鄰近孔徑/突起之嚙合部使用焊膏。由第三及第四板62c、62d界定的腔可接納電纜連接器40。端板或第四板62d可自第三板或列R1之相對端向內隔開以界定一凹槽200b。凹槽200b可包含用以接納或插入配接介面160之剩餘部分(例如基座、接地構件)之舌狀構件200a的一底部開口。可衝壓及/或電鍍第三/第四板62c、62d (例如接地、金屬)。在一些實施例中,板62可經膏狀焊料列印、焊料電鍍及/或雷射焊接在一起。腔或第三及/或第四板可與一或多個熱葉片組裝在一起,其中具有一或多個電纜連接器40。當被組裝時,由第三及第四板62c、62d界定的一列R1之腔經定位為鄰近於一或多列R1之腔。鄰近腔/列R1之鄰近第三板62c可經定位為彼此平行及/或接觸,如圖20、圖20A及圖21中所展示。如圖20中的一項實施例中所展示,鎖定機構82或其部分、內壁82ab、間隙32、內部面板82b、缺口82ba及/或夾子82a可將兩個鄰近列R1彼此隔開。In one embodiment shown in FIGS. 20-25 , the mating interface 160 may include a plurality of interlocking plates 62 defining a cavity 63 that receives at least one row R1 of at least one or more cable connectors 40. The interlocking plates 62 may include at least two third plates/opposite/parallel plates 62c that are interconnected by one or more fourth plates/parallel plates 62d transverse to the third plates. The fourth plate 62d may define opposing end plates at opposing ends of the row of cavities or third plates 62c. Each row R1 may include a third and fourth plate. The mating interface 160 may include a plurality of rows R1 defined by a third and fourth plate. The cavity 63 may have a through opening (e.g., an open top and an open bottom) defined by the third and fourth plates 62c, 62d. In some embodiments, the third plate 62c may include one or more through apertures 62ca that receive one or more protrusions 62da extending from the outer periphery (e.g., opposite ends/sides) of the fourth plate 62d when assembled. As shown in one embodiment in Figures 24, 25, and 25B, the third plate(s) 62c may include one or more through apertures or elongated slots 62ca (e.g., in a direction between the mating end 65 toward the terminal 64). As shown in Figures 24, 25, and 25A, each fourth plate 62d may include one or more protrusions or elongated protrusions 62da on the opposite sides/edges that engage the corresponding elongated slots 62ca of the opposite third plate 62c. The mating end 65 of one or more of the third plate 62c and/or the fourth plate 62d may include a plurality of curved edges for mating or contouring with one or more cables 90 or cable connectors 40. If used, the other of the opposite/parallel third plate 62c may be longer than and extend beyond the curved edges, as shown in Figures 24 and 25. In some embodiments, solder paste may be used adjacent to the aperture/protrusion nipple. The cavity defined by the third and fourth plates 62c, 62d may receive the cable connector 40. The end plate or fourth plate 62d may be spaced inwardly from the opposite end of the third plate or row R1 to define a recess 200b. The groove 200b may include a bottom opening of the tongue member 200a for receiving or inserting the remaining portion of the mating interface 160 (e.g., base, ground member). The third/fourth plates 62c, 62d (e.g., ground, metal) may be stamped and/or plated. In some embodiments, the plates 62 may be solder paste printed, solder plated, and/or laser welded together. The cavity or third and/or fourth plates may be assembled with one or more heat blades, with one or more cable connectors 40 therein. When assembled, the cavities of a row R1 defined by the third and fourth plates 62c, 62d are positioned adjacent to the cavities of one or more rows R1. The adjacent third plates 62c of the adjacent cavities/rows R1 may be positioned parallel to and/or in contact with each other, as shown in Figures 20, 20A, and 21. As shown in one embodiment in FIG. 20 , the locking mechanism 82 or portions thereof, the inner wall 82ab, the gap 32, the inner panel 82b, the notch 82ba and/or the clip 82a can separate two adjacent rows R1 from each other.
在一些實施方案中,配接介面160可包含板(例如第三板、第四板等)、一插座基座160a及/或一接地構件160b。在一些實施例中,插座基座160a可為但不限於模製塑膠,及/或接地構件160b可為但不限於衝壓金屬(例如導電)。在一些實施例中,基座160a或配接介面160可包含一或多個內部面板82b及/或(若干)鎖定機構82或其部分。基座160a可包含具有界定一貫通開口68b的一(若干)外周邊壁68a的殼體68。內部面板82b可在外周邊內側或內且在外周邊壁68a之相對壁之間延伸及/或與貫通開口68b相交。接地構件160b可包含界定一貫通開口68d的一外周邊壁68c。接地構件160b之外周邊壁68c可包含一通道68e (例如U形的倒置通道)。接地構件外周邊壁68c可與基座外周邊壁68a配接。通道68e或接地構件壁68c可接納基座外周邊壁68a之上邊緣。配接介面160可包含一或多個舌槽嚙合部200。接地構件160b之相對壁68c可包含鄰近基座160a之相對壁的一或多個舌狀構件或配接表面200a。舌狀構件200a沿著基部160a/接地構件160b之至少一個壁定位且可藉由一狹槽68f (例如垂直、縱向)沿著(若干)壁與各鄰近舌狀構件200a間隔開。儘管未展示,但狹槽68f之寬度可自舌部之自由遠端朝向接地構件之近端或上邊緣增加。例如,該狹槽可包含大於一下狹槽部分的一上狹槽部分。舌狀構件可在外周邊壁68a之內部且與配接介面之第三及/或第四板62c、62d之一或多列R1/相對端之一或多個凹槽200b配接/嚙合。儘管未展示,但舌狀構件或其等部分可與基座壁68a之內表面向內間隔開。板62c、62b可接觸接地構件160b之一或多個壁68c (例如相對壁、一個壁、兩個壁、三個壁等)及/或鄰近板/列(例如62c、62b)。In some embodiments, the mating interface 160 may include a plate (e.g., a third plate, a fourth plate, etc.), a socket base 160a, and/or a grounding member 160b. In some embodiments, the socket base 160a may be, but is not limited to, molded plastic, and/or the grounding member 160b may be, but is not limited to, stamped metal (e.g., conductive). In some embodiments, the base 160a or the mating interface 160 may include one or more internal panels 82b and/or (several) locking mechanisms 82 or portions thereof. The base 160a may include a housing 68 having one (several) outer peripheral walls 68a defining a through opening 68b. The inner panel 82b may extend inside or inside the outer perimeter and between opposing walls of the outer peripheral wall 68a and/or intersect the through opening 68b. The grounding member 160b may include an outer peripheral wall 68c defining a through opening 68d. The outer peripheral wall 68c of the grounding member 160b may include a channel 68e (e.g., an inverted U-shaped channel). The grounding member outer peripheral wall 68c may mate with the base outer peripheral wall 68a. The channel 68e or grounding member wall 68c may receive the upper edge of the base outer peripheral wall 68a. The mating interface 160 may include one or more tongue-and-groove engagement portions 200. The opposing wall 68c of the grounding member 160b may include one or more tongue-shaped members or mating surfaces 200a adjacent to the opposing wall of the base 160a. The tongue-shaped member 200a is positioned along at least one wall of the base 160a/grounding member 160b and may be spaced apart from each adjacent tongue-shaped member 200a along the wall(s) by a slot 68f (e.g., vertically, longitudinally). Although not shown, the width of the slot 68f may increase from the free distal end of the tongue toward the proximal end or upper edge of the grounding member. For example, the slot may include an upper slot portion that is larger than a lower slot portion. The tongue-shaped member may be internal to the outer peripheral wall 68a and mate/engage with one or more grooves 200b of one or more rows R1/opposite ends of the third and/or fourth plates 62c, 62d of the mating interface. Although not shown, the tongue-shaped member or portions thereof may be spaced inwardly from the inner surface of the base wall 68a. The plates 62c, 62b may contact one or more walls 68c (eg, opposing walls, one wall, two walls, three walls, etc.) and/or adjacent plates/rows (eg, 62c, 62b) of the grounding member 160b.
在一些實施方案中,界定一或多列R1之腔63的板62c、62d可藉由一或多個閂鎖嚙接地構件160b及/或基座160a。在圖20至圖24中所展示的一項實施例中,閂鎖可為板62 (例如第三板及第四板)與接地構件160b及/或基座160a之間的一或多個舌槽嚙合部200。應理解,在板62與接地構件160b之間可使用多種嚙合部或閂鎖。基座/接地構件之一或多個相對舌狀物200a嚙合由第三及第四板界定的一或多列R1之腔63之相對凹槽200b或端或者由其等接納,及/或在被組裝時將鄰近列R1之第三板62d定位為彼此接觸。若被使用,則鄰近接地構件160b之相對壁的舌狀物200a及/或凹槽200b可鄰近內部面板82b之相對端。第三板62c或凹槽200b之端(例如列R1之一部分)可在舌狀物200a或其部分(例如狹槽68f)及/或基座壁68a之間延伸以可滑動地嚙合其等之間的舌槽嚙合部。在一些實施例中,可使用一閂鎖鎖定機構300來軸向鎖定舌槽嚙合部200或其等之間的配接介面部分。在圖20至圖25中所展示的一項實施例中,閂鎖鎖定機構300可為接地構件160b與板62 (例如62c、62d)及/或(若干)列R1之間的一可釋放嚙合部。如在圖20A中更清楚地展示,一或多個第三板62c可包含鄰近一或多列R1之相對端且自其等向外突出的一或多個突起300a,該一或多個突起300a與遠離或橫向自鄰近舌狀物200a延伸至其等之間的狹槽68f中的一或多個突起300b可釋放地配接。若被使用,則(若干)突起300b可使鄰近舌狀物200a之間的狹槽68f之一部分變窄。若被使用,則閂鎖鎖定機構300 (例如突起300a、300b、開口等)在嚙合舌槽嚙合部200時可在軸向嚙合/行進(例如滑動)達一段距離後嚙合。例如,舌槽嚙合部之間的相對滑動導致含有電纜連接器40的配接介面之該列腔/板之一或多個突起300a與配接介面之接地構件及/或基座之一或多個突起300b之嚙合(例如軸向)。此外,當配接介面160經組裝至插頭連接器170時,(若干)夾子82a (若被使用)可在內部面板82b與該內部面板之一或兩側上的(若干)列R1之腔/連接器之鄰近第三板62c之間向上延伸。若如一項實施例中所展示般使用兩個夾子82a,則該等夾子可沿著基座160a之內部面板82b之相對側延伸或與其等配接。In some embodiments, the plates 62c, 62d defining the cavities 63 of one or more rows R1 may engage the grounding member 160b and/or the base 160a by one or more latches. In one embodiment shown in FIGS. 20-24 , the latches may be one or more tongue-and-groove engagements 200 between the plates 62 (e.g., the third and fourth plates) and the grounding member 160b and/or the base 160a. It should be understood that a variety of engagements or latches may be used between the plates 62 and the grounding member 160b. One or more opposing tongues 200a of the base/grounding member engage or are received by opposing grooves 200b or ends of the cavities 63 of one or more rows R1 defined by the third and fourth plates, and/or position the third plates 62d of the adjacent rows R1 to contact each other when assembled. If used, the tongue 200a and/or groove 200b adjacent to the opposing wall of the grounding member 160b may be adjacent to the opposing end of the inner panel 82b. The end of the third plate 62c or groove 200b (e.g., a portion of row R1) may extend between the tongue 200a or a portion thereof (e.g., the slot 68f) and/or the base wall 68a to slidably engage the tongue-and-groove engagement therebetween. In some embodiments, a latch locking mechanism 300 may be used to axially lock the tongue-and-groove engagement 200 or a mating interface portion therebetween. In one embodiment shown in FIGS. 20-25 , the latching locking mechanism 300 may be a releasable engagement between the ground member 160 b and the plates 62 (e.g., 62 c, 62 d) and/or the row(s) R1. As more clearly shown in FIG. 20A , the one or more third plates 62 c may include one or more protrusions 300 a proximate opposite ends of and protruding outwardly from the one or more rows R1 that releasably mate with one or more protrusions 300 b in the slot 68 f extending distally or laterally from the adjacent tongue 200 a therebetween. If used, the protrusion(s) 300 b may narrow a portion of the slot 68 f between the adjacent tongues 200 a. If used, the latch locking mechanism 300 (e.g., protrusions 300a, 300b, openings, etc.) may engage after axial engagement/travel (e.g., sliding) for a distance when engaging the tongue-and-groove engagement portion 200. For example, relative sliding between the tongue-and-groove engagement portions results in engagement (e.g., axial) of one or more protrusions 300a of the array of cavities/plates of the mating interface of the cable connector 40 with one or more protrusions 300b of the grounding member and/or base of the mating interface. Additionally, when the mating interface 160 is assembled to the plug connector 170, the clips 82a (if used) may extend upwardly between the interior panel 82b and the adjacent third plate 62c of the row(s) of cavities/connectors R1 on one or both sides of the interior panel. If two clips 82a are used as shown in one embodiment, the clips may extend along or mate with opposite sides of the interior panel 82b of the base 160a.
在一些實施方案中,電連接器30及/或電纜連接器40可包含差分信號對之屏蔽件(例如60、160),而插頭連接器70、170不提供差分信號對之屏蔽件。如圖1、圖21及圖26中所展示,插頭連接器70、170缺乏其自身的分開之圓周屏蔽件或蛋架屏蔽件(例如串擾)。僅電連接器30及/或電纜連接器40包含差分信號對之圓周蛋架屏蔽件(例如串擾)或配接介面60、160。In some embodiments, the electrical connector 30 and/or the cable connector 40 may include a shield for a differential signal pair (e.g., 60, 160), while the plug connector 70, 170 does not provide a shield for a differential signal pair. As shown in FIG. 1, FIG. 21, and FIG. 26, the plug connector 70, 170 lacks its own separate circumferential shield or egg-cage shield (e.g., crosstalk). Only the electrical connector 30 and/or the cable connector 40 includes a circumferential egg-cage shield (e.g., crosstalk) or a mating interface 60, 160 for a differential signal pair.
在一些實施方案中,電連接器總成20、電連接器30、配接介面60、160、基板50及/或插頭連接器70、170可包含將配接介面160與插頭連接器170 (例如殼體、基板)耦合之一或多個鎖定機構182或其部分。在圖26至圖29中所展示的一項實施例中,鎖定機構182可為定位於電連接器30/連接器170/配接介面160之外周邊(例如外殼體、壁)內的一外部鎖定機構。鎖定機構182可包含一或多個閂鎖或夾子182a (例如外部)。一或多個夾子182a被展示為在插頭連接器170、配接介面160及/或電連接器30之外部(例如外周邊)。儘管夾子182a被展示為在電/插頭連接器30、170及/或配接介面160之外部,但應理解,在一些實施例中,內部夾子(例如定位於外周邊、壁上)可與(若干)外部夾子/鎖定機構組合使用。一或多個夾子182a自配接介面160之底部向下突出或包含於電連接器30之殼體168中。夾子182a可自一或多個外壁168a (例如相對)向下突出以可釋放地嚙合插頭連接器170 (例如殼體178、外壁178a、插座179)。插頭連接器170之殼體178及/或外壁178a內的一或多個插座179可以可釋放地接納一或多個夾子182a。插座179可自晶粒封裝基板50 (例如50a、50b)突出或嚙合晶粒封裝基板50。在所展示的一項實施例中,兩個間隔開的夾子182a可在該等夾子182a之平面之一橫向方向(例如相反方向,向內朝向連接器)上彈簧加載。夾子182a可包含可釋放地嚙合插座179或殼體178之一或多個孔徑179a的一或多個突起182b。應理解,夾子182a及插座179可反轉且仍然在本發明之範疇內。In some embodiments, the electrical connector assembly 20, electrical connector 30, mating interface 60, 160, substrate 50 and/or plug connector 70, 170 may include one or more locking mechanisms 182 or portions thereof that couple the mating interface 160 to the plug connector 170 (e.g., housing, substrate). In one embodiment shown in FIGS. 26-29 , the locking mechanism 182 may be an external locking mechanism positioned within the outer periphery (e.g., housing, wall) of the electrical connector 30/connector 170/mating interface 160. The locking mechanism 182 may include one or more latches or clips 182a (e.g., external). One or more clips 182a are shown as being external (e.g., on the outer periphery) of the plug connector 170, the mating interface 160, and/or the electrical connector 30. Although the clips 182a are shown as being external to the electrical/plug connector 30, 170, and/or the mating interface 160, it should be understood that in some embodiments, internal clips (e.g., located on the outer periphery, on the wall) may be used in combination with (several) external clip/locking mechanisms. The one or more clips 182a protrude downwardly from the bottom of the mating interface 160 or are included in the housing 168 of the electrical connector 30. The clips 182a may protrude downwardly from one or more outer walls 168a (e.g., opposite) to releasably engage the plug connector 170 (e.g., housing 178, outer wall 178a, receptacle 179). One or more receptacles 179 within the housing 178 and/or outer wall 178a of the plug connector 170 may releasably receive the one or more clips 182a. The receptacles 179 may protrude from or engage the die package substrate 50 (e.g., 50a, 50b). In one embodiment shown, two spaced apart clips 182a may be spring loaded in a direction transverse to the plane of the clips 182a (e.g., opposite directions, inward toward the connector). The clip 182a may include one or more protrusions 182b that releasably engage one or more apertures 179a of the socket 179 or housing 178. It should be understood that the clip 182a and socket 179 may be reversed and still be within the scope of the present invention.
在一些實施方案中,插頭連接器170 (例如殼體)及/或電路基板50可包含一或多個加強件180。加強件180可支撐插頭連接器70、170之一或多個部分。如圖26至圖29中的一項實施例中所展示,一或多個加強件180可附接至電路基板50之板側及/或嚙合殼體178之一或多個部分(例如底部178b、外壁178a)。一個加強件可在如所展示的一些實施例中嚙合三個外壁178a,或在一些實施例中嚙合單個外壁或該外壁之整個周邊。所展示實施例包含兩個相對加強件。該加強件可包含嚙合殼體178 (例如壁)的一或多個向上突出構件/突片181。突片181可包含接納於殼體178之插座177內的一或多個支柱181a及/或具有接納殼體178之一經偏置突片178c的孔徑181ba之一或多個支柱181b。在一些實施例中,該加強件可支撐底部/基板壁178b或殼體178之一外周邊或邊緣。該加強件或其部分可由一導電材料、非導電材料或兩者製成。在一些實施例中,該加強件可為不銹鋼。應理解,該加強件可具有多種形狀、大小、數量、位置及構造且仍然在本發明之範疇內。In some embodiments, the plug connector 170 (e.g., housing) and/or the circuit substrate 50 may include one or more reinforcements 180. The reinforcements 180 may support one or more portions of the plug connectors 70, 170. As shown in one embodiment in FIGS. 26 to 29, one or more reinforcements 180 may be attached to the board side of the circuit substrate 50 and/or one or more portions (e.g., bottom 178b, outer wall 178a) of the housing 178. One reinforcement may be engaged with three outer walls 178a in some embodiments as shown, or with a single outer wall or the entire periphery of the outer wall in some embodiments. The embodiment shown includes two opposing reinforcements. The reinforcement may include one or more upwardly protruding members/tabs 181 that engage the housing 178 (e.g., wall). The tab 181 may include one or more posts 181a received in the socket 177 of the housing 178 and/or one or more posts 181b having an aperture 181ba that receives an offset tab 178c of the housing 178. In some embodiments, the reinforcement may support the bottom/baseboard wall 178b or an outer perimeter or edge of the housing 178. The reinforcement or portions thereof may be made of a conductive material, a non-conductive material, or both. In some embodiments, the reinforcement may be stainless steel. It should be understood that the reinforcement may have a variety of shapes, sizes, quantities, locations, and configurations and still be within the scope of the present invention.
在一些實施方案中,總成20、電纜連接器40及/或配接介面60、160可包含一或多個保持構件190。一或多個保持構件190可對準或保持配接介面160之一或多個部分之間的嚙合(例如導電、非導電)。在一些實施例中,保持構件190可(例如水平地、垂直地)保持及/或對準板62、腔63、蛋架屏蔽件或配接介面或其等之間的部分。在一些實施例中,保持構件190可保持及/或對準(例如水平地、垂直地)蛋架屏蔽件、腔63、板62與殼體168。在圖26至圖29中所展示的一項實施例中,保持構件190可為嚙合殼體168 (例如(若干)壁)之一或多個長形狹槽/孔徑192及/或板62/腔63/蛋架屏蔽件之一或多個狹槽/孔徑193的一或多個長形構件或桿191 (例如水平)。該保持構件或其部分可由一導電材料、非導電材料或兩者製成。應理解,保持構件/機構可具有多種形狀、大小、數量、位置及構造且仍然在本發明之範疇內。In some embodiments, the assembly 20, the cable connector 40, and/or the mating interface 60, 160 may include one or more retaining members 190. The one or more retaining members 190 may align or maintain engagement (e.g., conductive, non-conductive) between one or more portions of the mating interface 160. In some embodiments, the retaining member 190 may retain and/or align (e.g., horizontally, vertically) the plate 62, the cavity 63, the egg crate shield, or the mating interface, or portions thereof. In some embodiments, the retaining member 190 may retain and/or align (e.g., horizontally, vertically) the egg crate shield, the cavity 63, the plate 62, and the housing 168. In one embodiment shown in FIGS. 26-29 , the retaining member 190 may be one or more elongated members or rods 191 (e.g., horizontal) that engage one or more elongated slots/apertures 192 of the housing 168 (e.g., wall(s)) and/or one or more slots/apertures 193 of the plate 62/cavity 63/egg crate shield. The retaining member or portions thereof may be made of a conductive material, non-conductive material, or both. It should be understood that the retaining members/mechanisms may have a variety of shapes, sizes, quantities, locations, and configurations and still be within the scope of the present invention.
在一些實施方案中,一或多個板62之一或多個端65可電接觸電纜連接器40之一導電外屏蔽元件43。如圖24、圖25及圖25A中所展示,第三板62c及/或第二板62d之一或多者之配接端65可包含用以與一或多個電纜90或電纜連接器40 (例如外屏蔽元件43)配接或輪廓吻合的複數個彎曲邊緣。在一些實施例中,配接端65可與外屏蔽元件43直接接觸。如圖26至29中所展示,第三板62c之一或多者之配接端65可包含用以與一或多個電纜90或電纜連接器40 (例如外屏蔽元件43)或其部分配接或輪廓吻合的複數個平坦邊緣。另外,在一些實施例中,配接介面160及/或連接器30可在一或多個導電嚙合部處包含環氧樹脂65a。例如,如圖26至圖29中的一項實施例中所展示,可在平面形狀的配接端65或(若干)板62之一或多個部分(例如配接端)與外屏蔽元件43之間使用環氧樹脂65a (例如導電)。In some embodiments, one or more ends 65 of one or more plates 62 may electrically contact a conductive outer shield element 43 of a cable connector 40. As shown in FIGS. 24, 25, and 25A, the mating end 65 of one or more of the third plates 62c and/or the second plates 62d may include a plurality of curved edges for mating or contouring with one or more cables 90 or cable connectors 40 (e.g., outer shield element 43). In some embodiments, the mating end 65 may directly contact the outer shield element 43. As shown in FIGS. 26-29, the mating end 65 of one or more of the third plates 62c may include a plurality of flat edges for mating or contouring with one or more cables 90 or cable connectors 40 (e.g., outer shield element 43) or portions thereof. Additionally, in some embodiments, the mating interface 160 and/or the connector 30 may include an epoxy 65a at one or more conductive nipples. For example, as shown in one embodiment in FIGS. 26-29 , an epoxy 65a (e.g., conductive) may be used between a planar-shaped mating end 65 or one or more portions of the plate(s) 62 (e.g., the mating end) and the outer shielding element 43.
在一些實施方案中,圖30及圖31繪示圖26至圖29中所展示的電連接器之一項實施例之差分FD Next功率和及差分FD FEXT功率和。如圖30中所展示,複數個電連接器可傳輸約70 GHz信號,其中NEXT (近端串擾)不超過約-50 dB。圖30中所展示的模擬實施例係總功率和(所有雜訊源之工業標準總和)。此外,如圖31中所展示,複數個電連接器可傳輸約70 GHz信號,其中FEXT (遠端串擾)不超過約-30 dB。圖31中所展示的模擬實施例係總功率和(所有雜訊源之工業標準總和)。In some embodiments, FIG. 30 and FIG. 31 illustrate the differential FD Next power sum and the differential FD FEXT power sum of one embodiment of the electrical connector shown in FIG. 26 to FIG. 29. As shown in FIG. 30, a plurality of electrical connectors can transmit approximately 70 GHz signals, where NEXT (near-end crosstalk) does not exceed approximately -50 dB. The simulation embodiment shown in FIG. 30 is the total power sum (the industry standard sum of all noise sources). In addition, as shown in FIG. 31, a plurality of electrical connectors can transmit approximately 70 GHz signals, where FEXT (far-end crosstalk) does not exceed approximately -30 dB. The simulation embodiment shown in FIG. 31 is the total power sum (the industry standard sum of all noise sources).
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含至少每平方英吋257個差分對、至少每平方英吋256個至264個差分對、至少每平方英吋139個至263個差分對、至少每平方英吋138個至145個差分對及/或至少每平方英吋88個至137個差分對。In some embodiments, the assembly/connector 20, 30 or a portion thereof (e.g., a mating interface, a plug connector, a circuit substrate and/or a cable connector) may include at least 257 differential pairs per square inch, at least 256 to 264 differential pairs per square inch, at least 139 to 263 differential pairs per square inch, at least 138 to 145 differential pairs per square inch and/or at least 88 to 137 differential pairs per square inch.
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含至少每平方英吋257個單端接腳、至少每平方英吋256個至264個單端接腳、至少每平方英吋139個至263個單端接腳、至少每平方英吋138個至145個單端接腳及/或至少每平方英吋88個至137個單端接腳。In some embodiments, the assembly/connector 20, 30 or a portion thereof (e.g., a mating interface, a plug connector, a circuit substrate and/or a cable connector) may include at least 257 single-ended pins per square inch, at least 256 to 264 single-ended pins per square inch, at least 139 to 263 single-ended pins per square inch, at least 138 to 145 single-ended pins per square inch and/or at least 88 to 137 single-ended pins per square inch.
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含至少每線性吋127個差分對、至少每線性吋128個差分對及/或至少每線性吋129個差分對。In some embodiments, the assembly/connector 20, 30 or a portion thereof (e.g., a mating interface, a plug connector, a circuit substrate and/or a cable connector) may include at least 127 differential pairs per linear inch, at least 128 differential pairs per linear inch and/or at least 129 differential pairs per linear inch.
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含約30 AWG、31 AWG、32 AWG、33 AWG、34 AWG、35 AWG及/或36 AWG之導體。該等導體之一個範圍可為但不限於約30 AWG至約36 AWG、約30 AWG至約34 AWG及約32 AWG至約36 AWG。亦考慮約33 AWG及/或約34 AWG。In some embodiments, the assembly/connector 20, 30 or a portion thereof (e.g., a mating interface, a plug connector, a circuit substrate, and/or a cable connector) may include conductors of about 30 AWG, 31 AWG, 32 AWG, 33 AWG, 34 AWG, 35 AWG, and/or 36 AWG. A range of such conductors may be, but is not limited to, about 30 AWG to about 36 AWG, about 30 AWG to about 34 AWG, and about 32 AWG to about 36 AWG. About 33 AWG and/or about 34 AWG are also contemplated.
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含約92歐姆+/-9歐姆、或+/-5%及/或+/-10%。In some embodiments, the assembly/connector 20, 30 or portions thereof (e.g., the mating interface, plug connector, circuit substrate, and/or cable connector) may include approximately 92 ohms +/- 9 ohms, or +/- 5% and/or +/- 10%.
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含在約25 GHz下超過約55 dB之IL至XT離距。In some embodiments, the assembly/connector 20, 30 or portions thereof (eg, a mating interface, a plug connector, a circuit substrate, and/or a cable connector) may include an IL to XT distance exceeding about 55 dB at about 25 GHz.
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含在約60 GHz下超過約40 dB之IL至XT離距。In some embodiments, the assembly/connector 20, 30 or portions thereof (eg, a mating interface, a plug connector, a circuit substrate, and/or a cable connector) may include an IL to XT distance exceeding about 40 dB at about 60 GHz.
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含60 GHz之頻寬。In some embodiments, the assembly/connector 20, 30 or portions thereof (eg, a mating interface, a plug connector, a circuit substrate, and/or a cable connector) may include a bandwidth of 60 GHz.
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含無歪斜的邊緣耦合連接器(連接器中之完全對稱路徑)。In some embodiments, the assembly/connector 20, 30 or portions thereof (eg, a mating interface, a plug connector, a circuit substrate, and/or a cable connector) may include an edge-coupled connector without skew (a perfectly symmetrical path in the connector).
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含電纜、夾層及/或卡邊緣連接器。In some embodiments, the assembly/connector 20, 30 or portions thereof (eg, a mating interface, a plug connector, a circuit substrate, and/or a cable connector) may include a cable, a mezzanine, and/or a card edge connector.
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含晶粒封裝基板中之單個軌道佈線。In some embodiments, the assembly/connector 20, 30 or a portion thereof (e.g., a mating interface, a plug connector, a circuit substrate, and/or a cable connector) may include a single track trace in a die package substrate.
在一些實施方案中,總成/連接器20、30或其部分(例如配接介面、插頭連接器、電路基板及/或電纜連接器)可包含一SMT/BGA/表面安裝件。在一些實施例中,可使用一通孔安裝。插頭連接器及電纜連接器可彼此分離,諸如可重複分離及重新連接。插頭連接器可為由一晶粒封裝基板之一主表面承載的一垂直連接器。垂直連接器可經組態以在垂直於一晶粒封裝基板之主表面的一方向上接納電纜連接器。In some embodiments, the assembly/connector 20, 30 or a portion thereof (e.g., a mating interface, a plug connector, a circuit substrate, and/or a cable connector) may include a SMT/BGA/surface mount. In some embodiments, a through-hole mount may be used. The plug connector and the cable connector may be separable from each other, such as being repeatedly separable and reconnectable. The plug connector may be a vertical connector carried by a major surface of a die package substrate. The vertical connector may be configured to receive the cable connector in a direction perpendicular to the major surface of a die package substrate.
在一些實施方案中,ASIC可能缺乏(若干)螺絲孔及/或(若干)通孔。In some implementations, the ASIC may lack screw hole(s) and/or through hole(s).
在一些實施方案中,一或多個連接器可每連接器承載至少64個差分信號對。一項實例係八列電導體,每列具有八個差分信號對。其他實例係四列電導體或六列電導體。四列實施例亦可每列具有八個差分信號對。六列實施例亦可每列具有八個差分信號對。兩列實施例亦可每列具有八個差分信號對。所有實施例亦可每列具有多於八個差分信號對或每列具有少於八個差分信號對但具有至少一個信號對。針對一約90 mm×90 mm晶粒封裝基板,差分信號對密度可為約320個差分信號對、約640個差分信號對、約960個差分信號對、約1280個差分信號對或者多於一個差分信號對與至少約840個差分信號對、或多於一個差分信號對與至少約769個差分信號對或一些其他數目個差分信號對。換言之,至少二十八列的每列八個差分信號對的連接器可配裝於約90 mm×約90 mm晶粒封裝基板之外周邊周圍。每列連接器八個差分信號對的至少十三列、至少十四列、至少十五列、至少十六列、至少十七列、至少十八列及/或至少十九列可配裝於約90 mm×約90 mm晶粒封裝基板之外周邊周圍。任何晶粒封裝基板之一晶粒或排除區可為約40 mm×約40 mm。換言之,各具有每列至少八個差分信號對之至少八列的至少四個或至少五個電連接器可沿著一約90 mm×約90 mm晶粒封裝基板之一側配裝。具有八列之八個差分信號對的各電連接器可具有約13 mm×約13 mm、約13.7 mm×約13.7 mm、約14 mm×約14 mm、約15 mm×約15 mm等的一配接佔位面積。In some embodiments, one or more connectors may carry at least 64 differential signal pairs per connector. One example is eight rows of conductors, each row having eight differential signal pairs. Other examples are four rows of conductors or six rows of conductors. Four row embodiments may also have eight differential signal pairs per row. Six row embodiments may also have eight differential signal pairs per row. Two row embodiments may also have eight differential signal pairs per row. All embodiments may also have more than eight differential signal pairs per row or less than eight differential signal pairs per row but at least one signal pair. For an approximately 90 mm×90 mm die package substrate, the differential signal pair density may be approximately 320 differential signal pairs, approximately 640 differential signal pairs, approximately 960 differential signal pairs, approximately 1280 differential signal pairs, or more than one differential signal pair and at least approximately 840 differential signal pairs, or more than one differential signal pair and at least approximately 769 differential signal pairs, or some other number of differential signal pairs. In other words, at least twenty-eight rows of eight differential signal pairs per row of connectors may fit around the outer periphery of the approximately 90 mm×approximately 90 mm die package substrate. At least thirteen rows, at least fourteen rows, at least fifteen rows, at least sixteen rows, at least seventeen rows, at least eighteen rows, and/or at least nineteen rows of eight differential signal pairs per row of connectors may fit around the outer periphery of the approximately 90 mm×approximately 90 mm die package substrate. A die or keep-out area of any die package substrate may be about 40 mm by about 40 mm. In other words, at least four or at least five electrical connectors each having at least eight rows of at least eight differential signal pairs per row may be assembled along a side of an approximately 90 mm by approximately 90 mm die package substrate. Each electrical connector having eight differential signal pairs in eight rows may have a mating footprint of about 13 mm by about 13 mm, about 13.7 mm by about 13.7 mm, about 14 mm by about 14 mm, about 15 mm by about 15 mm, etc.
例如,在本發明之一些實施例中,一電連接器可經定大小及定形狀使得複數個該電連接器配裝於不大於約75 mm×75 mm至約85 mm×85 mm之晶粒封裝基板之單側上,該複數個電連接器共同地承載至少1024個差分信號對,及/或該複數個電連接器以約56 GHz至約70 GHz之頻寬傳輸約224 Gbps Pam4信號,其中FEXT (遠端串擾)不超過約-40 dB。For example, in some embodiments of the present invention, an electrical connector may be sized and shaped such that a plurality of the electrical connectors fit on a single side of a die package substrate of no greater than approximately 75 mm×75 mm to approximately 85 mm×85 mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and/or the plurality of electrical connectors transmit approximately 224 Gbps Pam4 signals at a bandwidth of approximately 56 GHz to approximately 70 GHz with a FEXT (Far End Crosstalk) of no more than approximately -40 dB.
在一些實施例中,一電連接器可經定大小及定形狀使得複數個電連接器配裝於不大於約75 mm×75 mm至約85 mm×85 mm之晶粒封裝基板之單側上,該複數個電連接器共同地承載至少1024個差分信號對,及/或該複數個電連接器以約56 GHz至約70 GHz之頻寬傳輸約224 Gbps Pam4信號,其中NEXT (近端串擾)不超過約-50 dB。In some embodiments, an electrical connector may be sized and shaped such that a plurality of electrical connectors fit on a single side of a die package substrate of no greater than approximately 75 mm×75 mm to approximately 85 mm×85 mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and/or the plurality of electrical connectors transmit approximately 224 Gbps Pam4 signals at a bandwidth of approximately 56 GHz to approximately 70 GHz with a NEXT (near-end crosstalk) of no more than approximately -50 dB.
另外,在一些實施例中,該複數個電連接器可以約60 GHz傳輸信號,其中FEXT不超過約-45 dB。在各項實施例中,該複數個電連接器可以約50 GHz傳輸信號,其中NEXT不超過約-45 dB。在一些實施例中,該複數個電連接器中之各電連接器可包括一蛋架配接介面。在各項實施例中,該電連接器可經組態以與一電纜連接器配接。Additionally, in some embodiments, the plurality of electrical connectors may transmit signals at approximately 60 GHz with a FEXT no greater than approximately -45 dB. In various embodiments, the plurality of electrical connectors may transmit signals at approximately 50 GHz with a NEXT no greater than approximately -45 dB. In some embodiments, each electrical connector in the plurality of electrical connectors may include an egg-crate mating interface. In various embodiments, the electrical connector may be configured to mate with a cable connector.
在一些實施例中,一電連接器可包含一配接介面,該配接介面具有在其中界定複數個腔的複數個互連板。In some embodiments, an electrical connector can include a mating interface having a plurality of interconnect plates defining a plurality of cavities therein.
另外,在一些實施例中,該連接器可包含配接於該複數個腔內之複數個電纜連接器。在各項實施例中,該複數個板之各板可包含與複數個凹槽對準的複數個狹槽。在一些實施例中,該複數個板可界定該複數個腔之一第一腔之一圓周,而在其中沒有任何間隙。在各項實施例中,該複數個板可界定沒有該複數個電纜連接器之任一者的一列腔。在一些實施例中,該複數個板可延伸達至一基板之該電纜連接器之長度之約90%。在各項實施例中,該電連接器可包含一基板及一接地接觸元件,該接地接觸元件將該複數個板定位於距該基板之一距離處。在一些實施例中,該電連接器可包含一晶粒封裝基板,該晶粒封裝基板不大於約75 mm×75 mm至約85 mm×85 mm,複數個電連接器共同地承載至少1024個差分信號對,及/或該複數個電連接器以約56 GHz至約70 GHz之頻寬傳輸約224 Gbps Pam4信號,其中FEXT (遠端串擾)不超過約-40 dB或NEXT (近端串擾)不超過約-50 dB。在各項實施例中,該複數個電連接器可以約60 GHz傳輸信號,其中FEXT不超過約-45 dB。在一些實施例中,該複數個電連接器可以約50 GHz傳輸信號,其中NEXT不超過約-45 dB。Additionally, in some embodiments, the connector may include a plurality of cable connectors mated within the plurality of cavities. In various embodiments, each of the plurality of plates may include a plurality of slots aligned with the plurality of grooves. In some embodiments, the plurality of plates may define a circumference of a first cavity of the plurality of cavities without any gaps therein. In various embodiments, the plurality of plates may define a row of cavities without any of the plurality of cable connectors. In some embodiments, the plurality of plates may extend to approximately 90% of the length of the cable connector up to a substrate. In various embodiments, the electrical connector may include a substrate and a ground contact element that positions the plurality of plates at a distance from the substrate. In some embodiments, the electrical connector may include a die package substrate that is no larger than about 75 mm×75 mm to about 85 mm×85 mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and/or the plurality of electrical connectors transmit about 224 Gbps Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz with a FEXT (far end crosstalk) no greater than about -40 dB or a NEXT (near end crosstalk) no greater than about -50 dB. In various embodiments, the plurality of electrical connectors may transmit signals at about 60 GHz with a FEXT no greater than about -45 dB. In some embodiments, the plurality of electrical connectors may transmit signals at about 50 GHz with a NEXT no greater than about -45 dB.
另外,在一些實施例中,經組態以附接至一晶粒封裝之一電連接器可包含至少每平方英吋256個差分對之一密度。Additionally, in some embodiments, an electrical connector configured to attach to a die package may include a density of at least 256 differential pairs per square inch.
在各項實施例中,該電連接器可傳輸約224 Gbps Pam4信號,其中串擾不超過約-40 dB。在一些實施例中,該連接器可以約56 GHz至約70 GHz之頻寬傳輸。In various embodiments, the electrical connector can transmit about 224 Gbps Pam4 signals with crosstalk no greater than about -40 dB. In some embodiments, the connector can transmit at a bandwidth of about 56 GHz to about 70 GHz.
另外,在一些實施例中,一電連接器可包含一配接介面。在各項實施例中,該連接器可包含一插頭連接器,該插頭連接器具有經組態以與該配接介面配接的至少一個接地接觸元件。In addition, in some embodiments, an electrical connector may include a mating interface. In various embodiments, the connector may include a plug connector having at least one ground contact element configured to mate with the mating interface.
在一些實施例中,該接地接觸元件可包含與該配接介面配接的至少一個臂。在各項實施例中,該接地接觸元件可包含與該配接介面配接的至少兩個臂。在一些實施例中,該接地接觸元件可包含與該配接介面配接的至少三個臂。在各項實施例中,該接地接觸元件可包含與該配接介面配接的至少四個臂。在一些實施例中,該接地接觸元件包括與該配接介面配接的四個或更多個臂。在各項實施例中,該接地接觸元件可包含至少一個焊料塊。在一些實施例中,該接地接觸元件可包含彼此緊鄰的至少兩個焊料塊。在各項實施例中,該接地接觸元件可包含彼此緊鄰的至少三個焊料塊。In some embodiments, the ground contact element may include at least one arm that mates with the mating interface. In various embodiments, the ground contact element may include at least two arms that mate with the mating interface. In some embodiments, the ground contact element may include at least three arms that mate with the mating interface. In various embodiments, the ground contact element may include at least four arms that mate with the mating interface. In some embodiments, the ground contact element includes four or more arms that mate with the mating interface. In various embodiments, the ground contact element may include at least one solder mass. In some embodiments, the ground contact element may include at least two solder masses that are adjacent to each other. In various embodiments, the ground contact element may include at least three solder masses that are adjacent to each other.
在一些實施例中,一電連接器可包含一配接介面、一插頭連接器及/或一電纜連接器之至少一者。在各項實施例中,該連接器可包含依6 ps及 20%至80%上升時間之一224 Gbps Pam4信號。In some embodiments, an electrical connector may include at least one of a mating interface, a plug connector, and/or a cable connector. In various embodiments, the connector may include a 224 Gbps Pam4 signal at 6 ps and a 20% to 80% rise time.
在一些實施例中,該連接器可包含FEXT及/或插入損耗之至少一者。在各項實施例中,該FEXT可低於或等於-30 dB。在一些實施例中,該FEXT可低於或等於-35 dB。在各項實施例中,該FEXT可低於或等於-40 dB。在一些實施例中,該FEXT可低於或等於-45 dB。在各項實施例中,該插入損耗可介於0 dB與-1 dB之間。在一些實施例中,該插入損耗可介於-1 dB與-2 dB之間。在各項實施例中,該插入損耗可介於-2 dB與-3 dB之間。在一些實施例中,該插入損耗可介於-3 dB與-4 dB之間。在各項實施例中,該插入損耗可介於-4 dB與-5 dB之間。在一些實施例中,該連接器可處於50 GHz、55 GHz、60 GHz、65 GHz、70 GHz、75 GHz及/或80 GHz。In some embodiments, the connector may include at least one of FEXT and/or insertion loss. In various embodiments, the FEXT may be less than or equal to -30 dB. In some embodiments, the FEXT may be less than or equal to -35 dB. In various embodiments, the FEXT may be less than or equal to -40 dB. In some embodiments, the FEXT may be less than or equal to -45 dB. In various embodiments, the insertion loss may be between 0 dB and -1 dB. In some embodiments, the insertion loss may be between -1 dB and -2 dB. In various embodiments, the insertion loss may be between -2 dB and -3 dB. In some embodiments, the insertion loss may be between -3 dB and -4 dB. In various embodiments, the insertion loss may be between -4 dB and -5 dB. In some embodiments, the connector may be at 50 GHz, 55 GHz, 60 GHz, 65 GHz, 70 GHz, 75 GHz, and/or 80 GHz.
在各項實施例中,該電連接器可包含NEXT及/或插入損耗之至少一者。在一些實施例中,該NEXT可低於或等於-40 dB。在各項實施例中,該NEXT可低於或等於-45 dB。在各項實施例中,該NEXT可低於或等於-50 dB。在一些實施例中,該NEXT可低於或等於-55 dB。在各項實施例中,該NEXT可低於或等於-60 dB。在一些實施例中,該插入損耗可介於0 dB與-1 dB之間。在各項實施例中,該插入損耗可介於-1 dB與-2 dB之間。在一些實施例中,該插入損耗可介於-2 dB與-3 dB之間。在一些實施例中,該插入損耗可介於-3 dB與-4 dB之間。在各項實施例中,該插入損耗可介於-4 dB與-5 dB之間。在一些實施例中,該連接器可處於50 GHz、55 GHz、60 GHz、65 GHz及/或70 GHz。In various embodiments, the electrical connector may include at least one of NEXT and/or insertion loss. In some embodiments, the NEXT may be less than or equal to -40 dB. In various embodiments, the NEXT may be less than or equal to -45 dB. In various embodiments, the NEXT may be less than or equal to -50 dB. In some embodiments, the NEXT may be less than or equal to -55 dB. In various embodiments, the NEXT may be less than or equal to -60 dB. In some embodiments, the insertion loss may be between 0 dB and -1 dB. In various embodiments, the insertion loss may be between -1 dB and -2 dB. In some embodiments, the insertion loss may be between -2 dB and -3 dB. In some embodiments, the insertion loss may be between -3 dB and -4 dB. In various embodiments, the insertion loss may be between -4 dB and -5 dB. In some embodiments, the connector may be at 50 GHz, 55 GHz, 60 GHz, 65 GHz, and/or 70 GHz.
另外,在一些實施例中,一電連接器可包含一外周邊。在各項實施例中,該連接器可包含一鎖定機構,該鎖定機構定位於該電連接器之該外周邊內。In addition, in some embodiments, an electrical connector may include an outer periphery. In various embodiments, the connector may include a locking mechanism, which is positioned within the outer periphery of the electrical connector.
在一些實施例中,該電連接器可包含一配接介面及一插頭連接器,其中該鎖定機構可定位於該配接介面及/或該插頭連接器之至少一者之一外周邊內。在各項實施例中,該鎖定機構可包含至少一個夾子。在一些實施例中,該鎖定機構可包含至少兩個夾子。在各項實施例中,該鎖定機構可包含至少一個缺口。在一些實施例中,該鎖定機構可包含至少兩個缺口。在各項實施例中,該鎖定機構可定位於腔之鄰近列之間的至少一個間隙內。在一些實施例中,該電連接器可包含複數個電纜連接器,其中該鎖定機構可定位於該複數個電纜連接器之鄰近電纜連接器之間。在各項實施例中,該電連接器可包含複數個腔,其中該鎖定機構可定位於該複數個腔之鄰近腔之間。在一些實施例中,該鎖定機構可在內部與該電連接器之該外周邊之一或多個壁間隔開。在各項實施例中,該連接器可經組態以附接至具有至少每平方英吋256個差分對之一密度之一晶粒封裝。In some embodiments, the electrical connector may include a mating interface and a plug connector, wherein the locking mechanism may be positioned within an outer periphery of at least one of the mating interface and/or the plug connector. In various embodiments, the locking mechanism may include at least one clip. In some embodiments, the locking mechanism may include at least two clips. In various embodiments, the locking mechanism may include at least one notch. In some embodiments, the locking mechanism may include at least two notches. In various embodiments, the locking mechanism may be positioned within at least one gap between adjacent rows of cavities. In some embodiments, the electrical connector may include a plurality of cable connectors, wherein the locking mechanism may be positioned between adjacent cable connectors of the plurality of cable connectors. In various embodiments, the electrical connector may include a plurality of cavities, wherein the locking mechanism may be positioned between adjacent cavities of the plurality of cavities. In some embodiments, the locking mechanism may be spaced internally from one or more walls of the outer periphery of the electrical connector. In various embodiments, the connector may be configured to attach to a die package having a density of at least 256 differential pairs per square inch.
在一些實施例中,一電連接器可包含複數個差分信號對。在各項實施例中,該電連接器可包含複數個接地接觸元件,各接地接觸元件經組態以接納一配接連接器之一蛋架屏蔽件之一各自部分,其中該電連接器缺乏蛋架串擾屏蔽件,經定大小及定形狀使得複數個電連接器各分別配裝於具有各不大於約75 mm至96 mm (包含約80 mm±5 mm及91 mm±5 mm)之側的晶粒封裝基板之單側上,該複數個電連接器共同地承載至少1024個差分信號對,且該複數個電連接器以約56 GHz至約70 GHz之頻寬傳輸約224 Gbit/sec PAM-4信號,其中FEXT不超過約-40 dB。In some embodiments, an electrical connector may include a plurality of differential signal pairs. In various embodiments, the electrical connector may include a plurality of ground contact elements, each ground contact element configured to receive a respective portion of an egg-crate shield of a mating connector, wherein the electrical connector lacks an egg-crate crosstalk shield, is sized and shaped so that the plurality of electrical connectors are each respectively mounted on a single side of a die package substrate having sides each no larger than about 75 mm to 96 mm (including about 80 mm ± 5 mm and 91 mm ± 5 mm), the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit about 224 Gbit/sec PAM-4 signals at a bandwidth of about 56 GHz to about 70 GHz, wherein the FEXT does not exceed about -40 dB.
另外,在一些實施例中,該電連接器進一步包含承載該等差分信號對之一第一殼體,且該複數個接地接觸件之至少兩者或更多者各界定至少兩個橫向偏移的懸臂樑,其中該至少兩個橫向偏移的懸臂樑之各者具有一各自自由端。在各項實施例中,該等差分信號對經表面安裝至該晶粒封裝基板。在一些實施例中,該等差分信號對可各包括第一及第二衝壓且成形電導體。在一些實施例中,該電連接器可進一步包含導電或非導電的磁性吸收材料或電損耗材料。在各項實施例中,該複數個差分信號對經電連接、實體連接或兩者至該晶粒封裝基板上之對應各自墊。Additionally, in some embodiments, the electrical connector further comprises a first housing carrying the differential signal pairs, and at least two or more of the plurality of ground contacts each define at least two laterally offset cantilever beams, wherein each of the at least two laterally offset cantilever beams has a respective free end. In various embodiments, the differential signal pairs are surface mounted to the die package substrate. In some embodiments, the differential signal pairs may each include a first and a second stamped and formed conductor. In some embodiments, the electrical connector may further comprise a conductive or non-conductive magnetically absorbing material or an electrically lossy material. In various embodiments, the plurality of differential signal pairs are electrically connected, physically connected, or both to corresponding respective pads on the die package substrate.
在一些實施例中,一電連接器可包含一配接介面,該配接介面具有一殼體及該殼體中界定複數個腔的複數個板。在各項實施例中,該電連接器可包含至少一個保持構件,該保持構件保持其間的該複數個板之至少一者及/或將該複數個板與該殼體保持在一起。In some embodiments, an electrical connector may include a mating interface having a housing and a plurality of plates defining a plurality of cavities in the housing. In various embodiments, the electrical connector may include at least one retaining member that retains at least one of the plurality of plates therebetween and/or holds the plurality of plates together with the housing.
另外,在一些實施例中,至少一個保持構件可保持其間的該複數個板。在各項實施例中,至少一個保持構件可將該複數個板與該殼體保持在一起。在一些實施例中,至少一個保持構件既可保持其間的該複數個板又可將該複數個板與該殼體保持在一起。在各項實施例中,至少一個保持構件可為嚙合一或多個狹槽的一長形構件。在一些實施例中,至少一個保持構件可為導電的或非導電的。Additionally, in some embodiments, at least one retaining member can retain the plurality of panels therebetween. In various embodiments, at least one retaining member can retain the plurality of panels with the housing. In some embodiments, at least one retaining member can both retain the plurality of panels therebetween and retain the plurality of panels with the housing. In various embodiments, at least one retaining member can be an elongated member incorporating one or more slots. In some embodiments, at least one retaining member can be conductive or non-conductive.
在一些實施例中,一電連接器可包含一外周邊。在各項實施例中,該電連接器可包含定位於該電連接器之該外周邊中的一鎖定機構。In some embodiments, an electrical connector may include an outer periphery. In various embodiments, the electrical connector may include a locking mechanism positioned in the outer periphery of the electrical connector.
另外,在一些實施例中,該電連接器可包含一配接介面及一插頭連接器,其中該鎖定機構可定位於該配接介面及/或該插頭連接器之至少一者之一外周邊中。在各項實施例中,該鎖定機構可包含至少一個夾子。在一些實施例中,該鎖定機構可包含至少兩個夾子。在各項實施例中,該鎖定機構可包含可釋放地嚙合至少一個夾子的至少一個插座。在一些實施例中,該電連接器可包含定位於該外周邊內的另一鎖定機構。Additionally, in some embodiments, the electrical connector may include a mating interface and a plug connector, wherein the locking mechanism may be positioned within an outer periphery of at least one of the mating interface and/or the plug connector. In various embodiments, the locking mechanism may include at least one clip. In some embodiments, the locking mechanism may include at least two clips. In various embodiments, the locking mechanism may include at least one socket that releasably engages at least one clip. In some embodiments, the electrical connector may include another locking mechanism positioned within the outer periphery.
在一些實施例中,一電連接器可包含一插頭連接器,該插頭連接器具有一殼體。在各項實施例中,該電連接器可包含耦合至該殼體之至少一個加強件。In some embodiments, an electrical connector may include a plug connector having a housing. In various embodiments, the electrical connector may include at least one reinforcing member coupled to the housing.
另外,在一些實施例中,至少一個加強件可附接至一晶粒封裝基板之一板側。在各項實施例中,該電連接器可包含在一水平平面中彼此隔開的該等加強件之至少兩者。在一些實施例中,至少一個加強件可為導電的或非導電的。在各項實施例中,至少一個加強件可包含至少一個突出突片。Additionally, in some embodiments, at least one reinforcement member may be attached to a side of a die package substrate. In various embodiments, the electrical connector may include at least two of the reinforcement members spaced apart from each other in a horizontal plane. In some embodiments, at least one reinforcement member may be conductive or non-conductive. In various embodiments, at least one reinforcement member may include at least one protruding tab.
另外,在一些實施例中,一電連接器可包括用於自一約75 mm至約95 mm晶粒封裝基板之一側獲取至少513個、至少600個、至少700個、至少800個、至少900個、至少1000個及/或至少1024個差分信號對之一構件,該晶粒封裝基板具有至少約40 mm 2排除區。 Additionally, in some embodiments, an electrical connector may include a component for accessing at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000 and/or at least 1024 differential signal pairs from a side of an approximately 75 mm to approximately 95 mm die package substrate having a keep-out area of at least approximately 40 mm2 .
另外,在一些實施例中,一電連接器可包括用於自一75 mm至95 mm晶粒封裝基板之一側獲取至少513個、至少600個、至少700個、至少800個、至少900個、至少1000個及/或至少1024個差分信號對之一構件。Additionally, in some embodiments, an electrical connector may include a component for accessing at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000 and/or at least 1024 differential signal pairs from a side of a 75 mm to 95 mm die package substrate.
另外,在一些實施例中,一電連接器可包括用於自本文中所揭示的任何大小之晶粒封裝基板之一側獲取至少513個、至少600個、至少700個、至少800個、至少900個、至少1000個及/或至少1024個差分信號對之一構件,該晶粒封裝基板具有至少約40 mm 2排除區。 Additionally, in some embodiments, an electrical connector may include a component for accessing at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000 and/or at least 1024 differential signal pairs from a side of a die package substrate of any size disclosed herein, the die package substrate having a keep-out area of at least about 40 mm2 .
另外,在一些實施例中,一電連接器可包括用於自本文中所揭示的任何大小之晶粒封裝基板之一側獲取至少513個、至少600個、至少700個、至少800個、至少900個、至少1000個及/或至少1024個差分信號對之一構件。Additionally, in some embodiments, an electrical connector may include a component for obtaining at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000 and/or at least 1024 differential signal pairs from a side of a die package substrate of any size disclosed herein.
雖然本文中已描述及繪示若干實施例,但一般技術者將容易地設想用於執行功能及/或獲得結果及/或本文中所描述的一或多個優點之多種其他手段及/或結構,且此等變化型態及/或修改之各者被視為在本文中所描述的實施例之範疇內。更一般地,熟習此項技術者將容易明白,本文中所描述的所有參數、尺寸、材料及組態意謂著係實例性的,且實際參數、尺寸、材料及/或組態將取決於對於其使用教示之特定應用或若干特定應用。熟習此項技術者將認知或能夠僅使用常規實驗確認本文中所描述的特定實施例之諸多等效物。因此,應理解,前述實施例僅以實例之方式呈現且在所附發明申請專利範圍及其等等效物之範疇內,實施例可以除如具體地描述及主張的方式之外的方式實踐。本發明之實施例係關於本文中所描述的各個別特徵、系統、物件、材料及/或方法。另外,若兩個或更多個此等特徵、系統、物件、材料及/或方法不相互矛盾,則此等特徵、系統、物件、材料及/或方法之任何組合包含於本發明之範疇內。Although several embodiments have been described and illustrated herein, a person of ordinary skill will readily conceive of a variety of other means and/or structures for performing the functions and/or obtaining the results and/or one or more advantages described herein, and each of these variations and/or modifications is considered to be within the scope of the embodiments described herein. More generally, a person skilled in the art will readily appreciate that all parameters, dimensions, materials, and configurations described herein are meant to be exemplary, and that actual parameters, dimensions, materials, and/or configurations will depend on the specific application or applications for which their use is taught. A person skilled in the art will recognize or be able to ascertain, using no more than routine experimentation, many equivalents to the specific embodiments described herein. Therefore, it should be understood that the foregoing embodiments are presented by way of example only and within the scope of the attached invention application and its equivalents, the embodiments may be practiced in ways other than as specifically described and claimed. The embodiments of the present invention are related to each individual feature, system, object, material and/or method described herein. In addition, if two or more of these features, systems, objects, materials and/or methods are not mutually inconsistent, any combination of these features, systems, objects, materials and/or methods is included in the scope of the present invention.
如本文中所定義及使用,所有定義應被理解為支配字典定義、以引用的方式併入之文件中的定義及/或所定義術語之普通含義。As defined and used herein, all definitions should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms.
如本文在說明書及發明申請專利範圍中所使用,不定冠詞「一」及「一個」應被理解為意謂「至少一個」,除非明確地相反指示。As used herein in the specification and patent application, the indefinite articles "a" and "an" should be understood to mean "at least one" unless explicitly indicated otherwise.
如本文在說明書及發明申請專利範圍中所使用,片語「及/或」應被理解為意謂如此連結的元件之「任一者或兩者」,即,在一些情況下聯合存在且在其他情況下分離存在的元件。用「及/或」列出之多個元件應以相同方式進行解釋,即,如此連結的元件之「一或多者」。亦可視情況存在除由「及/或」子句具體地識別的元件之外的其他元件,無論是否與具體地識別之彼等元件相關或不相關。因此,作為一非限制性實例,當結合諸如「包括」的開放式語言使用時,對「A及/或B」之一引用可在一項實施例中指代僅A (視情況包含除B之外的元件);在另一實施例中指代僅B (視情況包含除A之外的元件);在又一實施例中指代A及B兩者(視情況包含其他元件);等。As used herein in the specification and the scope of the invention, the phrase "and/or" should be understood to mean "either or both" of the elements so connected, that is, elements that exist in conjunction in some cases and separately in other cases. Multiple elements listed with "and/or" should be interpreted in the same manner, that is, "one or more" of the elements so connected. Other elements may also be present in addition to the elements specifically identified by the "and/or" clause, whether related or unrelated to the specifically identified elements, as the case may be. Thus, as a non-limiting example, when used in conjunction with open language such as "comprising," a reference to "A and/or B" may refer to only A in one embodiment (including elements other than B, as the case may be); to only B in another embodiment (including elements other than A, as the case may be); to both A and B in yet another embodiment (including other elements, as the case may be); etc.
如本文在說明書及發明申請專利範圍中所使用,「或」應被理解為具有相同於如上文所定義的「及/或」之含義。例如,當分離一清單中之品項時,「或」或「及/或」應被解釋為係包含性的,即,包含至少一個,但亦包含數個或一系列元件之多於一者,且視情況包含額外的未列品項。僅明確地相反指示的術語,諸如「…之僅一者」或「…之恰好一者」或當在發明申請專利範圍中使用時之「由…組成」將指代包含數個或一系列元件之恰好一個元件。一般而言,如本文中所使用,術語「或」僅應被解釋為在排他性術語(諸如「任一」、「…之一者」、「…之僅一者」或「…之恰好一者」)之前時指示排他性替代詞(即「一個或另一個,但非兩個」)。當在發明申請專利範圍中使用時,「本質上由…組成」應具有其如在專利法領域中所使用之普通含義。As used herein in the specification and the claims, "or" should be understood to have the same meaning as "and/or" as defined above. For example, when isolating items in a list, "or" or "and/or" should be interpreted as inclusive, i.e., including at least one, but also including more than one of a plurality or series of elements, and including additional unlisted items as appropriate. Only terms that clearly indicate the contrary, such as "only one of..." or "exactly one of..." or "consisting of..." when used in the claims will refer to exactly one element of a plurality or series of elements. In general, as used herein, the term "or" should be interpreted as indicating exclusive alternatives (i.e., "one or the other, but not both") only when preceding exclusive terms such as "either," "one of," "only one of," or "exactly one of." When used in the context of an invention claim, "consisting essentially of" shall have its ordinary meaning as used in the art of patent law.
如本文在說明書及發明申請專利範圍中所使用,關於一或多個元件之一清單的片語「至少一個」應被理解為意謂選自該元件清單中的元件之任何一或多者的元件,但不一定包含該元件清單內具體地列出的每個元件之至少一者且不排除該元件清單中的元件之任何組合。此定義亦允許可視情況存在除片語「至少一個」所指的元件清單內具體地識別之元件之外的元件,無論是否與具體地識別的彼等元件相關或不相關。因此,作為一非限制性實例,「A及B之至少一者」(或等效地,「A或B之至少一者」,或等效地「A及/或B之至少一者」)在一項實施例中可指代至少一個、視情況包含多於一個A且不存在B (及視情況包含除B之外的元件);在另一實施例中指代至少一個、視情況包含多於一個B且不存在A (及視情況包含除A之外的元件);在又一實施例指代至少一個、視情況包含多於一個A及至少一個、視情況包含多於一個B (及視情況包含其他元件);等。As used herein in the specification and the scope of the invention, the phrase "at least one" in relation to a list of one or more elements should be understood to mean an element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each element specifically listed in the list of elements and not excluding any combination of elements in the list of elements. This definition also allows for the presence of elements other than the elements specifically identified in the list of elements to which the phrase "at least one" refers, whether related or unrelated to the specifically identified elements, as the case may be. Thus, as a non-limiting example, "at least one of A and B" (or equivalently, "at least one of A or B", or equivalently "at least one of A and/or B") may refer to at least one, optionally including more than one A, and no B (and optionally including elements other than B) in one embodiment; at least one, optionally including more than one B, and no A (and optionally including elements other than A) in another embodiment; at least one, optionally including more than one A and at least one, optionally including more than one B (and optionally including other elements) in yet another embodiment; etc.
亦應理解,除非明確地相反指示,否則在本文中所主張的包含多於一個步驟或動作之任何方法中,該方法之步驟或動作之次序不一定限於敘述該方法之步驟或動作的次序。It should also be understood that, in any method claimed herein that includes more than one step or action, the order of the steps or actions of the method is not necessarily limited to the order in which the steps or actions of the method are described, unless explicitly indicated to the contrary.
在發明申請專利範圍以及上述說明書中,所有過渡片語(諸如「包括」、「包含」、「攜帶」、「具有」、「含有」、「涉及」、「持有」、「由...組成」及類似者)應被理解為係開放式的,即,意謂包含但不限於。僅過渡片語「由...構成」及「本質上由...構成」應分別係封閉式或半封閉式過渡片語,如美國專利局專利審查程序手冊第2111.03節中所闡述。In the scope of the invention application and the above description, all transitional phrases (such as "include", "comprising", "carrying", "having", "containing", "involving", "having", "consisting of" and the like) shall be understood as open-ended, i.e., meaning including but not limited to. Only the transitional phrases "consisting of" and "consisting essentially of" shall be closed or semi-closed transitional phrases, respectively, as set forth in Section 2111.03 of the Manual of Patent Examining Procedure of the United States Patent Office.
應理解,實施例之應用不限於描述中所闡述或圖式中所繪示的構造細節及組件配置。本發明能夠有其他實施例且能夠以各種方式實踐或實行。除非另有限制,否則術語「連接」、「耦合」、「與···連通」及「安裝」及其等變化型態在本文中被廣泛使用且涵蓋直接及間接的連接、耦合及安裝。另外,術語「連接」及「耦合」及其等變化型態不限於實體或機械連接或耦合。It should be understood that the application of the embodiments is not limited to the structural details and component configurations described in the description or shown in the drawings. The present invention is capable of other embodiments and can be practiced or implemented in various ways. Unless otherwise limited, the terms "connected", "coupled", "in communication with", and "mounted" and their variations are used extensively herein and cover direct and indirect connections, couplings, and mountings. In addition, the terms "connected" and "coupled" and their variations are not limited to physical or mechanical connections or couplings.
出於繪示之目的,已呈現本發明之若干實施例之前述描述。此並不意欲為窮舉性的或將本發明限於所揭示的精確步驟及/或形式,且顯然,鑑於上述教示,諸多修改及變化型態係可能的。The foregoing description of several embodiments of the present invention has been presented for purposes of illustration. This is not intended to be exhaustive or to limit the invention to the precise steps and/or forms disclosed, and obviously, many modifications and variations are possible in light of the above teachings.
20:電連接器總成 30:電連接器 32:間隙/空間 40:電纜連接器 42:接觸件 43:導電外屏蔽元件/屏蔽件 50:電路基板/封裝 50a:晶粒封裝基板 50b:印刷電路板 60:配接介面或電纜頭組織器 62:互鎖板/互連板 62a:第一板 62b:第二板 62c:第三板/相對/平行板 62ca:貫通孔徑或長形狹槽 62d:第四板/平行板/板 62da:突起 63:腔 64:終端 65:配接端 65a:環氧樹脂 66:狹槽/凹槽嚙合部 66a:第一凹槽 66b:第二凹槽 67:狹槽/凹槽嚙合部 67a:第一狹槽 67b:第二狹槽 68:殼體 68a:基座外周邊壁 68b:貫通開口 68c:接地構件外周邊壁 68d:貫通開口 68e:通道 68f:狹槽 69:凹槽 70:插頭連接器 71:電接觸件/信號接觸件 72:接地接觸元件 72a:第一臂 72b:第二臂 73:狹槽 74:焊球/焊料塊 80:彎管/電纜組織器 81:應變消除件 82:鎖定機構 82a:閂鎖、夾子或摩擦鎖 82ab:中間或內壁 82b:內部面板 82ba:上缺口/掣子/插座 90:電纜 90a:垂直電纜 90b:直角電纜 95:保持支架 98:堆疊撓性件 160:配接介面 160a:插座基座 160b:接地構件 168:殼體 168a:外壁 170:插頭連接器 177:插座 178:殼體 178a:外壁 178b:底部/基板壁 178c:經偏置突片 179:插座 179a:孔徑 180:加強件 181:向上突出構件/突片 181a:支柱 181b:支柱 181ba:孔徑 182:鎖定機構 182a:閂鎖或夾子 182b:突起 190:保持構件 191:長形構件或桿 192:長形狹槽/孔徑 193:狹槽/孔徑 200:舌槽嚙合部 200a:舌狀構件或配接表面/舌狀物 200b:凹槽 300:閂鎖鎖定機構 300a:突起 300b:突起 D:間距或距離 L:長度 R1:列 20: electrical connector assembly 30: electrical connector 32: gap/space 40: cable connector 42: contact 43: conductive outer shielding element/shielding element 50: circuit substrate/package 50a: die package substrate 50b: printed circuit board 60: mating interface or cable head organizer 62: interlocking plate/interconnecting plate 62a: first plate 62b: second plate 62c: third plate/opposite/parallel plate 62ca: through hole or elongated slot 62d: fourth plate/parallel plate/plate 62da: protrusion 63: cavity 64: terminal 65: mating end 65a: epoxy resin 66: slot/groove joint 66a: first groove 66b: second groove 67: slot/groove joint 67a: first slot 67b: second slot 68: housing 68a: base peripheral wall 68b: through opening 68c: grounding member peripheral wall 68d: through opening 68e: channel 68f: slot 69: groove 70: plug connector 71: electrical contact/signal contact 72: grounding contact element 72a: first arm 72b: second arm 73: slot 74: solder ball/solder block 80: elbow/cable organizer 81: strain relief 82: locking mechanism 82a: latch, clip or friction lock 82ab: center or inner wall 82b: inner panel 82ba: upper notch/detent/socket 90: cable 90a: vertical cable 90b: right-angle cable 95: retaining bracket 98: stacking flexibility 160: mating interface 160a: socket base 160b: grounding member 168: housing 168a: outer wall 170: plug connector 177: socket 178: housing 178a: outer wall 178b: bottom/base wall 178c: offset tab 179: socket 179a: aperture 180: reinforcement 181: upwardly projecting member/tab 181a: support 181b: support 181ba: aperture 182: locking mechanism 182a: latch or clip 182b: projection 190: retaining member 191: elongated member or rod 192: elongated slot/aperture 193: slot/aperture 200: tongue-and-groove engagement 200a: tongue-shaped member or mating surface/tongue 200b: groove 300: latch locking mechanism 300a: projection 300b: projection D: spacing or distance L: length R1: row
在圖式中,貫穿不同視圖,類似元件符號通常指代相同部件。再者,圖式不一定按比例繪製,而是通常將重點放在繪示本發明之原理上。In the drawings, like reference numerals generally refer to the same parts throughout the different views. Furthermore, the drawings are not necessarily drawn to scale, emphasis instead generally being placed upon illustrating the principles of the invention.
圖1係繪示一電連接器之一項實施例的一電連接器總成之一項實施例之一透視圖。FIG. 1 is a perspective view of an embodiment of an electrical connector assembly of an embodiment of an electrical connector.
圖2係圖1之電連接器總成之一分解視圖。FIG. 2 is an exploded view of the electrical connector assembly of FIG. 1 .
圖3A係圖1之複數個電連接器之一透視圖。FIG. 3A is a perspective view of one of the plurality of electrical connectors of FIG. 1 .
圖3B係圖3A之一垂直電纜之一側視圖。FIG. 3B is a side view of a vertical cable of FIG. 3A .
圖3C係圖3A之一直角電纜之一側視圖。FIG. 3C is a side view of the right angle cable of FIG. 3A .
圖4A係圖3A之直角電纜及電連接器之一透視圖。FIG. 4A is a perspective view of the right angle cable and electrical connector of FIG. 3A .
圖4B係圖4A之直角電纜之一透視圖。FIG. 4B is a perspective view of the right-angle cable of FIG. 4A .
圖5係圖1之電連接器之配接介面之一實施例之一透視圖。FIG. 5 is a perspective view of an embodiment of a mating interface of the electrical connector of FIG. 1 .
圖6係圖5之配接介面之一分解視圖。FIG. 6 is an exploded view of the mating interface of FIG. 5 .
圖7係繪示1024對的電連接器總成之一透視圖。FIG. 7 is a perspective view showing a 1024-pair electrical connector assembly.
圖8係繪示1192及/或1280對的電連接器總成之一透視圖。FIG. 8 is a perspective view of the electrical connector assembly of the pair 1192 and/or 1280.
圖9係繪示環繞電纜連接器及/或與基板隔開達一定距離之配接介面或板的電連接器之一透視圖。FIG. 9 is a perspective view of an electrical connector that surrounds a cable connector and/or a mating interface or board that is spaced a distance from a substrate.
圖10係其中剖開配接表面的電連接器之一透視圖。FIG. 10 is a perspective view of an electrical connector with the mating surface cut away.
圖11係繪示一項實施例中之至包裝之電纜之阻抗輪廓的一圖表。FIG. 11 is a graph showing the impedance profile of the cable to package in one embodiment.
圖12係繪示一項實施例之屏蔽返回路徑轉變影響的一圖表。FIG. 12 is a graph illustrating the effects of shielding return path transitions according to one embodiment.
圖13係繪示一項實施例之差分FD NEXT功率和的一圖表。FIG. 13 is a graph showing the differential FD NEXT power sum according to one embodiment.
圖14係繪示一項實施例之差分FD FEXT功率和的一圖表。FIG. 14 is a graph showing the differential FD FEXT power sum of one embodiment.
圖15繪示64對區塊之一PKG及PCB實施例。FIG. 15 shows a PKG and PCB implementation example of 64 pairs of blocks.
圖16A及圖16B繪示一保持支架之一實施例。16A and 16B illustrate an embodiment of a retaining bracket.
圖17係PKG基板佈線之一部分。Figure 17 shows a portion of the PKG substrate layout.
圖18係PKG對PCB之一實施例,設計經旋轉用於垂直佈線。FIG. 18 is an example of a PKG on a PCB, the design being rotated for vertical routing.
圖19A至圖19C係繪示小於8 mm之一高度的夾層之一實施例之視圖。19A to 19C are views showing an embodiment of a sandwich having a height less than 8 mm.
圖20係其中移除電纜連接器之部分以繪示一鎖定機構的電連接器之另一實施例。FIG. 20 is another embodiment of an electrical connector in which a portion of the cable connector is removed to illustrate a locking mechanism.
圖20A係繪示配接介面之部分之間的嚙合之閂鎖鎖定機構的圖20之一放大截面視圖。FIG. 20A is an enlarged cross-sectional view of the latch locking mechanism of FIG. 20 showing engagement between portions of the mating interface.
圖21係圖20之一分解視圖。FIG. 21 is an exploded view of FIG. 20 .
圖22係繪示經組裝插座基座及接地構件的配接介面之一透視圖。FIG. 22 is a perspective view showing a mating interface of an assembled socket base and a grounding member.
圖22A係圖22之一放大透視圖。FIG. 22A is an enlarged perspective view of FIG. 22 .
圖23係圖22之一分解視圖。FIG. 23 is an exploded view of FIG. 22 .
圖24係接納一列或複數個連接器的配接介面之一列腔之一透視圖。FIG. 24 is a perspective view of a row of cavities of a mating interface that receives one or more connectors.
圖25係圖24之一分解視圖。FIG. 25 is an exploded view of FIG. 24 .
圖25A及圖25B係圖25之放大透視圖。FIG. 25A and FIG. 25B are enlarged perspective views of FIG. 25 .
圖26係其中移除電纜連接器之部分以繪示一配接介面且剖開插頭連接器之部分的電連接器之另一實施例。FIG. 26 is another embodiment of an electrical connector in which a portion of a cable connector is removed to illustrate a mating interface and a portion of a plug connector is cut away.
圖27係其中剖開配接介面之殼體之部分且移除插頭連接器之殼體之部分以繪示一加強件及一保持構件之一實施例的圖26之電連接器之一透視圖。27 is a perspective view of the electrical connector of FIG. 26 with a portion of the housing of the mating interface cut away and a portion of the housing of the plug connector removed to illustrate an embodiment of a reinforcement member and a retaining member.
圖28係其中配接介面及電纜連接器與插頭連接器分解開、移除配接介面之殼體之部分的圖26之電連接器之一透視圖。28 is a perspective view of the electrical connector of FIG. 26 with the mating interface and the cable connector and the plug connector disassembled and a portion of the housing of the mating interface removed.
圖29係接納連接器之一部分列或複數個連接器的圖26之配接介面之一列腔之一分解視圖。29 is an exploded view of a row of cavities of the mating interface of FIG. 26 that receives a partial row of connectors or a plurality of connectors.
圖30係繪示圖26中所展示的一項實施例之差分FD NEXT功率和的一圖表。FIG. 30 is a graph illustrating the differential FD NEXT power sum of an embodiment shown in FIG. 26 .
圖31係繪示圖26中所展示的一項實施例之差分FD FEXT功率和的一圖表。FIG. 31 is a graph illustrating the differential FD FEXT power sum of an embodiment shown in FIG. 26 .
20:電連接器總成 20:Electrical connector assembly
30:電連接器 30:Electrical connector
32:間隙/空間 32: Gap/Space
40:電纜連接器 40: Cable connector
50:電路基板/封裝 50: Circuit board/package
50a:晶粒封裝基板 50a: Chip packaging substrate
60:配接介面或電纜頭組織器 60: Mating interface or cable head organizer
62:互鎖板/互連板 62: Interlocking board/interconnecting board
62a:第一板 62a: First board
62b:第二板 62b: Second board
63:腔 63: Cavity
64:終端 64:Terminal
65:配接端 65:Mating end
70:插頭連接器 70: Plug connector
72:接地接觸元件 72: Ground contact element
72a:第一臂 72a: First arm
72b:第二臂 72b: Second arm
73:狹槽 73: Slot
74:焊球/焊料塊 74: Solder ball/solder block
90:電纜 90: Cable
D:間距或距離 D: Spacing or distance
Claims (83)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263403561P | 2022-09-02 | 2022-09-02 | |
| US63/403,561 | 2022-09-02 | ||
| US202363481702P | 2023-01-26 | 2023-01-26 | |
| US63/481,702 | 2023-01-26 | ||
| US202363511451P | 2023-06-30 | 2023-06-30 | |
| US63/511,451 | 2023-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202418663A true TW202418663A (en) | 2024-05-01 |
Family
ID=90098656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112133324A TW202418663A (en) | 2022-09-02 | 2023-09-01 | Electrical connector apparatus and method |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4581705A1 (en) |
| CN (1) | CN119790548A (en) |
| MX (1) | MX2025002532A (en) |
| TW (1) | TW202418663A (en) |
| WO (1) | WO2024050137A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026015816A1 (en) * | 2024-07-12 | 2026-01-15 | Samtec, Inc. | Electrical connector apparatus and method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7553187B2 (en) * | 2006-01-31 | 2009-06-30 | 3M Innovative Properties Company | Electrical connector assembly |
| US7497736B2 (en) * | 2006-12-19 | 2009-03-03 | Fci Americas Technology, Inc. | Shieldless, high-speed, low-cross-talk electrical connector |
| CN107112666B (en) * | 2015-01-11 | 2019-04-23 | 莫列斯有限公司 | Board Connector Assemblies, Connectors and Bypass Cable Assemblies |
| US10201074B2 (en) * | 2016-03-08 | 2019-02-05 | Amphenol Corporation | Backplane footprint for high speed, high density electrical connectors |
-
2023
- 2023-09-01 TW TW112133324A patent/TW202418663A/en unknown
- 2023-09-01 WO PCT/US2023/031924 patent/WO2024050137A1/en not_active Ceased
- 2023-09-01 EP EP23861378.0A patent/EP4581705A1/en active Pending
- 2023-09-01 CN CN202380063249.4A patent/CN119790548A/en active Pending
-
2025
- 2025-02-28 MX MX2025002532A patent/MX2025002532A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP4581705A1 (en) | 2025-07-09 |
| CN119790548A (en) | 2025-04-08 |
| MX2025002532A (en) | 2025-06-02 |
| WO2024050137A1 (en) | 2024-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11715914B2 (en) | High speed, high density electrical connector with shielded signal paths | |
| US7722399B2 (en) | Connector apparatus | |
| US7727025B2 (en) | Modular electrical connector with enhanced plug interface | |
| US8221162B2 (en) | Electrical connector | |
| CN106067611B (en) | Electrical connector with ground shield | |
| TWI568102B (en) | Communication connector of high frequency signal with improved crosstalk performance | |
| CN110741513A (en) | Electrical Connector System | |
| US7621760B1 (en) | Electrical connector | |
| WO2017023756A1 (en) | Configurable, high-bandwidth connector | |
| CN102106042B (en) | Electrical connectors and assemblies having socket members | |
| TWM517932U (en) | Continuous grounding to improve crosstalk high frequency connector | |
| US20060035530A1 (en) | High speed differential transmission structures without grounds | |
| US10530106B2 (en) | Modular plug connector with multilayer PCB for very high speed applications | |
| TW202418663A (en) | Electrical connector apparatus and method | |
| TW202516796A (en) | Electrical connector apparatus and method | |
| WO2026015816A1 (en) | Electrical connector apparatus and method | |
| CN107645105A (en) | High-frequency signal transmission connector with crosstalk improving function | |
| CN119834007A (en) | Electrical connector apparatus and method | |
| TW202510426A (en) | Electrical connector apparatus and method |