TW202414520A - Stage apparatus, transfer apparatus, and article manufacturing method - Google Patents

Abstract

The invention provides a stage apparatus, a transfer apparatus, and an article manufacturing method. The stage apparatus for holding a substrate includes: a coarse moving stage; a coarse movement actuator for driving the coarse movement stage along a predetermined plane; a fine movement stage that holds the substrate; a fine movement actuator for adjusting the position and orientation of the fine movement stage with respect to the coarse movement stage; and an electromagnetic actuator for transmitting, in a non-contact manner, a thrust force supplied to the coarse movement stage by the coarse movement actuator to the fine movement stage. The electromagnetic actuator includes: a movable iron core fixed to the fine movement stage; a fixed iron core fixed on the coarse moving stage; and a coil wound on the fixed iron core. The shortest distance between the substrate held by the fine stage and the coil is greater than the shortest distance between the substrate and the fixed core.

Description

Stage device, transfer device and article manufacturing method

The present invention relates to a stage device, a transfer device and an article manufacturing method.

A transfer device for transferring an original pattern to a substrate may include: a coarse motion stage driven by a coarse motion actuator; and a fine motion stage disposed on the coarse motion stage and holding the substrate. A fine motion actuator for adjusting the position and posture of the fine motion stage relative to the coarse motion stage may be disposed between the coarse motion stage and the fine motion stage. In addition, an electromagnetic actuator for transmitting the thrust provided to the coarse motion stage by the coarse motion actuator to the fine motion stage in a non-contact manner may also be disposed between the coarse motion stage and the fine motion stage. [Prior art document] [Patent document] Patent document 1: Japanese Patent Publication No. 2005-109522 Patent document 2: Japanese Patent Publication No. 8-130179

[Problem to be solved by the invention] When the micro-motion stage is accelerated, a torque is applied to the micro-motion stage. If the micro-motion actuator is operated to offset such a torque, the heat generated by the micro-motion actuator will increase. This heat will cause the micro-motion stage to deform, and this deformation will lead to a decrease in the overlap accuracy. The purpose of the present invention is to provide a technology that is conducive to reducing the torque acting on the micro-motion stage. [Technical means for solving the problem] The first aspect of the present invention relates to a stage device for holding a substrate, the stage device comprising: a coarse motion stage; a coarse motion actuator for driving the coarse motion stage along a predetermined plane; a fine motion stage for holding the substrate; a fine motion actuator for adjusting the position and posture of the fine motion stage relative to the coarse motion stage; and an electromagnetic actuator for transmitting the thrust provided to the coarse motion stage by the coarse motion actuator to the fine motion stage in a non-contact manner, the electromagnetic actuator comprising: a movable iron core fixed to the fine motion stage; a fixed iron core fixed to the coarse motion stage; and a coil wound on the fixed iron core, the shortest distance between the substrate held by the fine motion stage and the coil being greater than the shortest distance between the substrate and the fixed iron core. The second aspect of the present invention relates to a transfer device for transferring a pattern of an original plate to a substrate, the transfer device having the stage device of the first aspect. The third aspect of the present invention relates to a method for manufacturing an article, the method comprising: a transfer step for transferring a pattern of an original plate to a substrate by the transfer device of the second aspect; and a step for obtaining an article from the substrate after the transfer step. [Effect of the invention] According to the present invention, a technique for reducing the torque acting on the micro-motion stage can be provided.

Hereinafter, the implementation method will be described in detail with reference to the accompanying drawings. In addition, the following implementation method does not limit the invention involved in the scope of the patent application, and all combinations of the features described in the implementation method are not necessary components of the invention. Two or more of the multiple features described in the implementation method can be combined arbitrarily. In addition, the same figure mark is used to mark the same or similar components, and repeated description is omitted. In the following description, the direction is described according to the XYZ coordinate system. The XY plane defined by the X-axis and the Y-axis is typically a horizontal plane, and the Z-axis is typically parallel to the vertical direction. The XY direction is a direction parallel to the XY plane. The X-axis direction is a direction parallel to the X-axis, the Y-axis direction is a direction parallel to the Y-axis, and the Z-axis direction is a direction parallel to the Z-axis. FIG1 exemplarily shows the structure of an exposure device of an implementation method. The exposure device can be understood as an example of an alignment device for aligning a first object (e.g., substrate) and a second object (e.g., original plate) relative to each other, or a transfer device for transferring a pattern of an original plate (magnification mask) to a substrate (wafer). A stage plate 692 can be arranged on a floor 691 via a stand, and a wafer stage device 500 can be arranged thereon. In addition, a barrel plate 696 can be arranged on a floor 691 via a stand 698. The projection optical system 687 and the magnification mask plate 694 can be supported by the barrel plate 696. A magnification mask stage device 695 can be arranged on the magnification mask plate 694. An illumination optical system 699 can be arranged above the magnification mask plate 694. The illumination optical system 699 can project the image of the zoom mask carried by the zoom mask stage of the zoom mask stage device 695 onto the wafer carried by the wafer stage of the wafer stage device 500, thereby transferring the pattern of the zoom mask onto the wafer. The exposure device can also be configured as a scanning exposure device. The wafer stage device 500 can be understood as a first positioning mechanism for positioning a substrate used as a first object, or as a stage device for holding a substrate. The zoom mask stage device 695 can be understood as a second positioning mechanism for positioning a zoom mask used as a second object. At least one of the first positioning mechanism and the second positioning mechanism may include an electromagnetic device or an electromagnetic actuator described below. The above-mentioned exposure device or transfer device can be used in an article manufacturing method for manufacturing articles such as semiconductor devices. The article manufacturing method may include: a transfer process of transferring the original pattern to the substrate by the above-mentioned exposure device or transfer device; and a process of obtaining the article by processing the substrate that has undergone the transfer process. The processing of the substrate may include, for example, etching, film forming, cutting, etc. The overall structure of the wafer stage device 500 is shown in FIG2 as an example. The XY slider 104 can be freely slidably arranged on the stage base 105 in the XY direction. On the XY slider 104, the force in the X-axis direction can be transmitted through the X slider 102, and the force in the Y-axis direction can be transmitted through the Y slider 103. The micro-motion stage device 101 can be mounted on the XY slider 104. Coarse linear motors 106 for driving the X-axis direction and the Y-axis direction may be provided on both sides of the X-slide 102 and the Y-slide 103, respectively. FIG. 3 exemplarily shows a state in which the fine-motion stage (fine-motion top plate) 101-1 of the fine-motion stage device 101 is moved upward for convenience in the wafer stage device 500. The fine-motion stage 101-1 holds the wafer. The fine-motion stage 101-1 can also be understood as a structure having a chuck for holding the wafer. The fine-motion base 101-2 can be fixed on the XY slide 104. On the fine-motion base 101-2, four fine-motion ZLMs (first fine-motion actuators) 101-6 for precise positioning of the Z tilt can be provided. In addition, two fine motion XLMs (second fine motion actuators) 101-4 for precise positioning of the X axis and around the Z axis may be provided on the fine motion base 101-2. In addition, two fine motion YLMs (third fine motion actuators) 101-5 for precise positioning of the Y axis and around the Z axis may be provided on the fine motion base 101-2. In the central portion of the fine motion base 101-2, a fine motion electromagnet 101-3 may be provided that functions to transmit the acceleration forces in the X axis and Y axis directions provided to the XY slider 104 to the fine motion base 101-2. Here, the fine motion base 101-2 may be understood as a coarse motion stage. Alternatively, the XY slider 104 and the fine motion base 101-2 may also be understood as a coarse motion stage. In addition, the coarse motion linear motor 106 can be understood as a coarse motion actuator that drives the fine motion base 101-2 used as a coarse motion stage along the XY plane, that is, the prescribed plane. In addition, the fine motion ZLM101-6, the fine motion XLM101-4, and the Y fine motion YLM101-5 can be understood as fine motion actuators for adjusting the position and posture of the fine motion stage 101-1 relative to the fine motion base 101-2 used as a coarse motion stage. In addition, the fine motion electromagnet 101-3 can be understood as an electromagnetic actuator for transmitting the thrust provided by the coarse motion linear motor 106 used as a coarse motion actuator to the fine motion base 101-2 used as a coarse motion stage to the fine motion stage 101-1 in a non-contact manner. FIG4 shows the structure of the fine motion stage device 101, especially the detailed structure examples of the fine motion YLM101-5 and the fine motion ZLM101-6. In addition, FIG4 shows a state where a part of the magnetic yoke is removed. The fine motion YLM101-5 can be composed of a linear motor. The fine motion YLM101-5 can include a fine motion YLM coil base 101-52, a fine motion YLM coil 101-51, a fine motion YLM magnet 101-53, a fine motion YLM magnetic yoke 101-54, and a fine motion LM gasket 101-70. The fine motion YLM coil base 101-52 can be fixed on the fine motion base 101-2, and the fine motion YLM coil 101-51 can be fixed thereon. The fine motion YLM coil 101-51 can be an oblong coil having a straight line portion extending in the vertical direction, and four fine motion YLM magnets 101-53 are arranged in a manner facing the straight line portion with a gap therebetween. Two YLM yokes 101-54 for allowing magnetic flux to pass can be arranged in a manner of sandwiching these magnets. The magnetization direction of the magnet can be in the X-axis direction, the magnets adjacent in the Y-axis direction can be of opposite polarity, and the magnets arranged in the X-axis direction can be of the same polarity. The fine motion LM gasket 101-70 can be used to resist the attractive force acting on a pair of magnets and the yoke to maintain their position. The magnet, the yoke, and the gasket can be fixed to the fine motion base 101-2. By flowing current in the YLM coil 101-51, a force proportional to the current can be generated in the direction orthogonal to the straight line portion, that is, in the Y-axis direction. In addition, a torque around the Z-axis can be generated by flowing currents in opposite directions in the two micro-motion YLM101-5. The micro-motion ZLM101-6 can be composed of a linear motor. The micro-motion ZLM101-6 can include a micro-motion ZLM coil base 101-62, a micro-motion ZLM coil 101-61, a micro-motion ZLM magnet 101-63, a micro-motion ZLM magnetic yoke 101-64, and a micro-motion LM gasket 101-70. The micro-motion ZLM coil base 101-62 can be fixed on the micro-motion base 101-2, and the micro-motion ZLM coil 101-61 can be fixed thereon. The fine motion ZLM coil 101-61 can be an oblong coil having a straight line portion extending in the horizontal direction, and four fine motion ZLM magnets 101-63 are arranged in a manner facing the straight line portion with a gap therebetween. Two ZLM yokes 101-64 for allowing magnetic flux to pass can be arranged in a manner of sandwiching these magnets. The magnetization direction of the magnet can be in the X-axis direction, the magnets adjacent in the Z-axis direction can be of opposite polarity, and the magnets arranged in the X-axis direction can be of the same polarity. The fine motion LM gasket 101-70 can be used to resist the attractive force acting on a pair of magnets and the yoke and maintain their position. The magnet, the yoke, and the gasket can be fixed to the fine motion top plate 101. By allowing current to flow in the ZLM coil 101-61, a force proportional to the current can be generated in the direction orthogonal to the straight line portion, that is, in the Z-axis direction. In addition, by combining the directions of the currents flowing in the four micro-motion ZLM101-6, a torque around the X-axis and a torque around the Y-axis can be generated. The micro-motion XLM101-4 has the same structure as the micro-motion YLM101-5, and has a configuration in which the micro-motion YLM101-5 is rotated 90 degrees. Thus, a force in the X-axis direction and a torque around the Z-axis can be generated. In addition, four pin units 101-39 can also be provided, which can function as temporary placement when recovering wafers from the micro-motion stage 101 and when placing wafers on the micro-motion stage 101-1. In order to temporarily place the wafer stably, the number of pin units 101-39 is preferably 3 or more, but the handover can be achieved if the minimum number is 1. The pin unit 101-39 has a lifting mechanism for raising and lowering the pins for temporarily placing or mounting the wafer. The pin unit 101-39 may have the following functions: driving the pins so that the upper ends of the pins protrude from the upper surface of the fine motion stage 101-1 in a first state; and driving the pins so that the upper ends of the pins retreat downward from the upper surface of the fine motion stage 101-1 in a second state. In the action of placing the wafer onto the fine motion stage 101-1, the pin unit 101-39 receives the wafer from the unillustrated transport mechanism in the first state, and then, in the process of transitioning to the second state, delivers the wafer on the pins to the fine motion stage 101-1. In the action of delivering the wafer placed on the fine motion stage 101-1 to the unillustrated transport mechanism, the pin unit 101-39 changes the pin from the second state to the first state. In this process, the pin unit 101-39 receives the wafer placed on the fine motion stage 101-1 by the pin, and delivers it to the unillustrated transport mechanism in the first state. The fine motion stage device 101 may not have the pin unit 101-39. In this case, the fine motion stage 101-1 is driven to the upper position by the fine motion ZLM 101-6, so that the wafer can be delivered to the unillustrated transport mechanism. FIG. 5 exemplarily shows the coarse motion stage device, especially the detailed structure of the X slider 102, the Y slider 103, and the XY slider 104. The XY slider 104 may include an XY slider lower part 104-3, an XY slider middle part 104-2, and an XY slider upper part 104-1. The XY slider lower part 104-3 may be supported on the stage base 105 so as to slide freely in the XY direction, and the XY slider middle part 104-2 and the XY slider upper part 104-1 may be arranged thereon. The X slider 102 may include an X beam 102-1, two X legs 102-2, and two X yaw guides 102-3. The two X yaw guides 102-3 may be fixed on two sides of the stage base 105. The two X legs 102-2 may be connected by the X beam 102-1. The X-leg 102-2 on one side faces the side surface of the X-yaw guide 102-3 on one side and the upper surface of the stage base 105 with a gap therebetween, and is supported to be able to slide freely in the X-axis direction. The X-leg 102-2 on the other side faces the side surface of the X-yaw guide 102-3 on the other side and the upper surface of the stage base 105 with a gap therebetween, and is supported to be able to slide freely in the X-axis direction. Thus, the X-beam 102-1 and the two X-legs 102-2 can be configured to be able to slide freely in the X-axis direction. In addition, the two side surfaces of the X-beam 102-1 face the inner side surface of the XY slider middle component 104-2 with a small gap therebetween and can slide freely, and the XY slider 104 can be restricted to slide freely in the XY direction. The Y slider 103 may include a Y beam 103-1, a Y foot 103-2, and a Y yaw guide 103-3. Two Y yaw guides 103-3 are fixed on two sides of the stage base 105, and the two Y feet 103-2 may be connected by the Y beam 103-1. The Y foot 103-2 on one side faces the side of the Y yaw guide 103-3 on one side and the upper surface of the stage base 105 with a gap therebetween, and is supported to be able to slide freely along the Y axis direction. The Y foot 103-2 on the other side faces the side of the Y yaw guide 103-3 on the other side and the upper surface of the stage base 105 with a gap therebetween, and is supported to be able to slide freely along the Y axis direction. Thus, the integrated body of the Y beam 103-1 and the two Y legs 103-2 can be configured to slide freely along the X-axis direction. In addition, the two side surfaces of the Y beam 103-1 face the inner side surface of the upper part 104-1 of the XY slider with a small gap and slide freely, and the XY slider 104 can be restricted to slide freely in the XY direction. FIG. 6 exemplarily shows the detailed structure of the coarse linear motor 106. The coarse linear motor 106 may include a plurality of linear motor coils 106-1, a coil support plate 106-2, a support column 106-3, a coil base 106-4, two linear motor magnets 106-5, a magnetic yoke 106-6, two pads 106-7, and an arm 106-8. The plurality of linear motor coils 106-1 may be a two-phase coil unit in which the phases of the adjacent linear motor coils 106-1 differ by 90 degrees from each other. The plurality of linear motor coils 106-1 may be fixed to the coil support plate 106-2 and fixed to the coil base 106-4 via the support 106-3. The coil base 106-4 may be fixed to the stage plate 692 or supported to slide freely in the coil arrangement direction through the stage plate 692. In the structure in which the coil base 106-4 is supported to slide freely, the reaction of acceleration can be absorbed. The two linear motor magnets 106-5 may be four-pole magnet units, respectively, and they may be configured to sandwich the linear motor coil 106-1 from the top and bottom through a gap. A yoke 106-6 may be arranged on the back of each linear motor magnet 106-5. A gasket 106-7 may be used to resist the attraction force and maintain the gap between the two linear motor magnets 106-5. A structure composed of the linear motor magnet 106-5, the yoke 106-6, and the gasket 106-7 may be fixed to the X leg 102-2 or the Y leg 103-2 via the arm 106-8. The structure may provide thrust in the X-axis direction and the Y-axis direction to the integrated object of the X beam and the two X legs or the integrated object of the Y beam and the two Y legs. In addition, in this structure, by passing a sinusoidal wave current corresponding to the position through the coil of the two-phase coil facing the magnet, a force can be continuously generated. FIG7 exemplarily shows the arrangement of multiple irradiation areas on a wafer 700, i.e., an irradiation area layout diagram. Irradiation areas 701 having dimensions Sx and Sy in the X-axis direction and the Y-axis direction, respectively, can be arranged on the wafer 700. Multiple irradiation areas 701 are subjected to scanning exposure, for example, along a step/scan trajectory. During scanning exposure, the fine-motion stage 101-1 can be driven to scan in the Y-axis direction by a scanning amount of 1/projection magnification of the scanning amount of the magnification mask stage in synchronization with the magnification mask stage. In addition, if the scanning exposure is completed, the fine-motion stage 101-1 can perform a U-turn in the Y-axis direction while stepping in the X-axis direction to perform scanning exposure of the next irradiation area. Electromagnets are used for the acceleration of the fine motion stage 101-1, and linear motors are used for the position control, thereby achieving high-precision position control and low heat generation at the same time. When the fine motion stage 101-1 is accelerated, a torque can be applied to the fine motion stage 101-1. If the fine motion ZLM101-6 is operated to offset such a torque, the heat generated by the fine motion ZLM101-6 will increase. This heat will cause deformation of the fine motion stage 101-1, and this deformation will lead to a decrease in the overlap accuracy. In order to suppress the heat generated by the fine motion ZLM101-6, it is effective to reduce the torque acting on the fine motion stage 101-1 when the fine motion stage 101-1 is accelerated. In order to reduce the torque acting on the fine motion stage 101-1 when the fine motion stage 101-1 is accelerated, it is effective to reduce the distance between the fine motion XLM101-4, the fine motion YLM101-5, the fine motion ZLM101-6 and the center of gravity of the fine motion stage 101-1. To this end, it is advantageous to reduce the height of the fine motion electromagnet 101-3 on the fine motion base 101-2. FIG8, FIG9, and FIG10 exemplarily show the structure of the fine motion electromagnet 101-3 assembled in the exposure device or the wafer stage device 500 of the first embodiment. The fine motion electromagnet 101-3 of the first embodiment has a structure that is advantageous in reducing the torque acting on the fine motion stage 101-1 when the fine motion stage 101-1 is accelerated. The fine motion electromagnet 101-3 may include a fixed core (first component) SC, a support component 101-30 supporting the fixed core SC, a movable core (second component) MC, a support component 101-31 supporting the movable core MC, and a coil 101-36. The support component 101-30 fixes the fixed core SC to the fine motion base 101-2 as a coarse motion stage, and the support component 101-31 fixes the movable core MC to the fine motion stage 101-1. The coil 101-36 is wound around the fixed core SC. The central axis of the coil 101-36 may be parallel to the XY plane (the plane on which the fine motion base 101-2 as a coarse motion stage moves). The fixed core SC has a first end face facing the movable core MC, and the distance between the center axis of the wafer 700 held by the fine motion stage 101-1 and the coil 101-36 can be greater than the distance between the wafer 700 held by the fine motion stage 101-1 and the center of the first end face. In the examples of FIG8, FIG9, and FIG10, four supporting members 101-30 can be fixed on the fine motion base 101-2, and the fixed core SC is arranged thereon respectively, and the coil 101-36 is wound around each fixed core SC. The fixed core SC and the movable core MC face each other with a small gap therebetween. Here, the shortest distance Hcw between the wafer (substrate) 700 held by the fine-motion stage 101-1 and the coil 101-36 is greater than the shortest distance Hew between the wafer (substrate) 700 held by the fine-motion stage 101-1 and the fixed iron core SC. Such a configuration can be achieved, for example, by making the fixed iron core SC have a crank shape in a cross section perpendicular to the XY plane and parallel to the central axis of the coil 101-36. By setting Hcw>Hew, the fixed iron core SC can be configured to be lowered vertically downward compared to the configurations of Figures 4 and 35. As a result, the height of the fine-motion electromagnet 101-3 on the fine-motion base 101-2 can be reduced. Here, in the configurations shown in FIG8, FIG9, and FIG10, when the fine motion stage 101-1 of mass m is accelerated at an acceleration a, the torque M acting on the fine motion stage 101-1 is M=m·a·(hg+hu+he). On the other hand, in the configurations shown in FIG4 and FIG35, when the fine motion stage 101-1 of mass m is accelerated at an acceleration a, the torque M acting on the fine motion stage 101-1 is M=m·a·(hg+hu+he +hc). Therefore, in the configurations shown in FIG8, FIG9, and FIG10, compared with the configurations shown in FIG4 and FIG35, the torque M acting on the fine motion stage 101-1 of mass m is reduced by m·a·hc. Thus, the fine motion ZLM101-6 is actuated to offset the torque, thereby reducing the heat generated by the fine motion ZLM101-6. This is beneficial to suppress the deformation of the fine motion stage 101-1, thereby suppressing the reduction of the overlapping accuracy. hg is the distance in the Z-axis direction between the center of gravity G of the structure composed of the fine motion stage 101-1 and the components that move with the fine motion stage 101-1 (the movable iron core MC and the supporting member 101-31, etc.) and the lower surface of the fine motion stage 101-1 (the surface on the side of the fine motion base 101-2). hu is the distance in the Z-axis direction between the lower surface of the fine motion stage 101-1 and the upper end of the fine motion electromagnet 101-3 (the end on the side of the fine motion stage 101-1). he is the distance in the Z-axis direction between the upper end of the fixed core SC and the point of action of the fine-motion electromagnetic iron 101-3. hc is the distance in the Z-axis direction between the upper end of the coil 101-36 (the end on the fine-motion stage 101-1 side) and the upper end of the fixed core SC. FIG34 shows an example of the structure of the fixed core SC. In the example of FIG34, the fixed core SC is composed of a layered body of a plurality of electromagnetic steel plates, and the layered direction is the Z-axis direction. Each electromagnetic steel plate is covered with an insulating film. In FIG. 34 , the direction of the magnetic flux in the magnetic circuit is indicated by a black arrow, and the magnetic flux flows through a three-dimensional path. The magnetic flux flowing in the Z-axis direction is indicated by a thick black arrow. Since the direction of the thick black arrow is parallel to the normal direction of the electromagnetic steel plate, the eddy current generated by the change in the current flows along the surface of the electromagnetic steel plate, and there is no structure to suppress it. Therefore, as shown by the thick white arrow, a large eddy current is generated. As a result, the fixed iron core SC generates heat, and the heat is transmitted to the fine motion stage 101-1, and the fine motion stage 101-1 is deformed, which will lead to a decrease in the overlap accuracy. In addition, since the magnetic flux in the Z-axis direction indicated by the thick black arrow has a direction parallel to the normal direction of the electromagnetic steel plate, it will lead to disadvantages such as large magnetic resistance, reduced magnetic flux value, and reduced attraction. Hereinafter, an improved example of the fine motion electromagnet 101-3 assembled in the exposure device or the wafer stage device 500 of the first embodiment will be described. FIG11 exemplarily shows the structure of the improved example of the fine motion electromagnet 101-3 of the first embodiment. The fine motion electromagnet 101-3 may include a fixed iron core (first component) SC, a supporting component 101-30 supporting the fixed iron core SC, a movable iron core (second component) MC, a supporting component 101-31 supporting the movable iron core MC, and a coil 101-36. The fixed iron core (first component) SC may include a first element 101-32, a second element 101-33, a third element 101-34, and a fourth element 101-35. The movable iron core (second component) MC may include the element 101-38, but may include one or more other elements in addition to the element 101-38. The fixed iron core (first component) SC may have a first end face E1, and the movable iron core (second component) MC may have a second end face E2 facing the first end face E1 across a gap. In this example, the first end face E1 is provided at each of the second element 101-33, the third element 101-34, and the fourth element 101-35, and the second end face E2 is provided at the element 101-38. The fixed iron core (first component) SC may be composed of a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film. From another perspective, the first element 101-32, the second element 101-33, the third element 101-34, and the fourth element 101-35 constituting the fixed iron core (first component) SC may be respectively constituted by a layered body of a plurality of electromagnetic steel plates. The movable iron core (second component) MC may be constituted by a layered body of a plurality of electromagnetic steel plates. From another perspective, at least one element constituting the movable iron core (second component) MC, namely the element 101-38, may be constituted by a layered body of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film. The magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap (the space between the first end face E1 and the second end face E2) may include at least one changing portion CP in which the stacked direction of the plurality of electromagnetic steel plates changes at right angles. The changing portion CP may include a contact portion of a first portion (e.g., the first element 101-32) whose stacked direction is a first direction (e.g., the Z-axis direction) and a second portion (e.g., the third element 101-34) whose stacked direction is a second direction (e.g., the X-axis direction) perpendicular to the first direction. The variable part CP may include a portion where a first portion (e.g., the first element 101-32) whose layer direction is a first direction and a second portion (e.g., the third element 101-34) whose layer direction is a second direction orthogonal to the first direction face each other via a solid component. The solid component may be, for example, an insulating film that covers a plurality of electromagnetic steel plates respectively. In the improved example of FIG. 11 , the variable part CP is provided in the fixed iron core (first component) SC. In addition, in the improved example of FIG. 11 , the variable part CP includes a portion where the fixed iron core (first component) SC and the movable iron core (second component) MC face each other via a gap. The latter configuration may also be understood as the following configuration: the first portion of the first portion and the second portion constituting the variable part CP is provided in the fixed iron core (first component) SC, and the second portion is provided in the movable iron core (second component) MC. The variable portion CP may be provided in addition to the movable iron core (second component) MC, or may be provided only in the movable iron core (second component) MC. The fixed iron core (first component) SC and the movable iron core (second component) MC may each be composed of at least one laminated iron core. Alternatively, at least one of the fixed iron core (first component) SC and the movable iron core (second component) MC may be composed of a plurality of laminated iron cores. Such a plurality of laminated iron cores may be arranged close to each other and fixed by a fixed component. In addition, the laminated iron core may be formed by laminating electromagnetic steel plates of the same shape. The first element 101-32, the second element 101-33, the third element 101-34, and the fourth element 101-35 can be composed of a laminated iron core. The first element 101-32, the second element 101-33, the third element 101-34, and the fourth element 101-35 can be integrated by using an adhesive material, or can be integrated by fastening using a clamping member. In this example, at least one variable portion CP is provided on the fixed iron core (first component) SC, and the coil 101-36 is wound around the fixed iron core (first component) SC. The coil 101-36 can be wound around a portion of the fixed iron core (first component) SC that is different from the portion where the variable portion CP is arranged. By causing current to flow in the coil 101-36, an attractive force is generated between the first end face E1 and the second end face E2. In the improved example of FIG11, the first element 101-32 has an E-shaped shape, and the coil 101-36 is wound around the central tooth of the first element 101-32. The variable portion CP is set so that the magnetic flux passing through the magnetic circuit composed of the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap does not flow through the plurality of electromagnetic steel plates constituting the fixed iron core (first component) SC and the movable iron core (second component) MC in their layered direction. Alternatively, the variable part CP, the fixed iron core (first component) SC, and the movable iron core (second component) MC may be arranged so that the magnetic flux passing through the fixed iron core (first component) SC and the movable iron core (second component) MC flows along the surface direction of each electromagnetic steel plate. Alternatively, the variable part CP may be arranged so that the magnetic resistance of the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap is smaller than that in the case where there is no variable part CP. Alternatively, the variable part CP may be arranged so that the eddy current generated in the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap is smaller than that in the case where there is no variable part CP. The magnetic circuit formed by the iron core including the variable part CP is conducive to increasing the degree of freedom of the shape of the magnetic circuit. In addition, by constituting the iron core such as the fixed iron core (first component) SC and the movable iron core (second component) MC by multiple elements, it is possible to easily manufacture the iron core having a complex shape, and it is also possible to easily install and replace the coil. In particular, the configuration in which multiple elements are fastened by a clamping member is conducive to facilitating the replacement of the coil. FIG12 exemplarily shows the configuration of another improved example of the micro-motion electromagnet 101-3 of the first embodiment. Matters not mentioned here can be based on the configuration of the improved example shown in FIG11. The micro-motion electromagnet 101-3 may include a fixed core (first component) SC, a support component 101b-30 supporting the fixed core SC, a movable core (second component) MC, a support component (not shown) supporting the movable core MC, and a coil 101-36. The fixed core (first component) SC may include a first element 101b-32, a second element 101b-33, a third element 101b-34, and a fourth element 101b-35. The movable core (second component) MC may include the element 101-38, but may include one or more other elements in addition to the element 101-38. As in the example of FIG8 , the fixed iron core (first component) SC has a first end face, and the movable iron core (second component) MC may have a second end face facing the first end face with a gap therebetween. In this example, the first end face is provided at each of the second element 101b-33, the third element 101b-34, and the fourth element 101b-35, and the second end face is provided at the element 101-38. In the improved example of FIG12 , the second element 101b-33, the third element 101b-34, and the fourth element 101b-35 have a crank shape in a cross section perpendicular to the XY plane and parallel to the central axis of the coil 101-36, and the first element 101b-32 has a rectangular parallelepiped shape. FIG. 13, FIG. 14, and FIG. 15 exemplarily show the structure of the fine motion electromagnet 101-3 assembled in the exposure device or the wafer stage device 500 of the second embodiment. Matters not mentioned in the second embodiment can be based on the first embodiment. The fine motion electromagnet 101-3 of the second embodiment has a structure that is conducive to reducing the torque acting on the fine motion stage 101-1 when the fine motion stage 101-1 is accelerated. The fine motion electromagnet 101-3 may include a fixed iron core (first component) SC, a support component 101-30 supporting the fixed iron core SC, a movable iron core (second component) MC, a support component 101-31 supporting the movable iron core MC, and a coil 101-36. Support member 101-30 fixes the fixed core SC to the fine motion base 101-2 serving as a coarse motion stage, and support member 101-31 fixes the movable core MC to the fine motion stage 101-1. Coil 101-36 is wound around the fixed core SC. The center axis of coil 101-36 may be arranged at an angle inclined relative to the XY plane (the plane on which the fine motion base 101-2 serving as a coarse motion stage moves). Similarly, at least the portion of the fixed core SC around which coil 101-36 is wound may include a portion extending in a direction inclined relative to the XY plane. The fixed core SC preferably includes a variable portion CP as in the improved example of the first embodiment. FIG. 16, FIG. 17, and FIG. 18 exemplarily show the structure of the fine motion electromagnet 101-3 assembled in the exposure device or the wafer stage device 500 of the third embodiment. Matters not mentioned in the third embodiment may be in accordance with the first embodiment. The fine motion electromagnet 101-3 of the third embodiment has a structure that is conducive to reducing the torque acting on the fine motion stage 101-1 when the fine motion stage 101-1 is accelerated. The fine motion electromagnet 101-3 may include a fixed iron core (first component) SC, a support component 101-30 supporting the fixed iron core SC, a movable iron core (second component) MC, a support component 101-31 supporting the movable iron core MC, and a coil 101-36. The support member 101-30 fixes the fixed iron core SC to the fine motion base 101-2 serving as a coarse motion stage, and the support member 101-31 fixes the movable iron core MC to the fine motion stage 101-1. The coil 101-36 is wound around the fixed iron core SC. The center axis of the coil 101-36 can be arranged at an angle perpendicular to the XY plane (the plane in which the fine motion base 101-2 serving as a coarse motion stage moves). In a cross section perpendicular to the XY plane and parallel to the center axis of the coil 101-36, the fixed iron core SC may include a portion having an L shape. The fine motion base 101-2 may also have an opening, and a portion of the fine motion electromagnet 101-3 may also be arranged in the opening. Hereinafter, an improved example of the fine-motion electromagnet 101-3 assembled in the exposure device or the wafer stage device 500 of the third embodiment will be described. Matters not mentioned here can be implemented according to the improved example of the first embodiment. FIG. 19 and FIG. 20 exemplarily show the structure of the improved example of the fine-motion electromagnet 101-3 of the third embodiment. In addition, FIG. 20 exemplarily shows the structure of the fine-motion electromagnet 101-3 in a state where the fine-motion base 101-2 is removed. In this improved example, four openings 301-21 are provided in the fine-motion base 101-2, and a portion of each fine-motion electromagnet 101-3 can be arranged in the corresponding opening 301-21. A portion of each of the four fine-motion electromagnets 101-3 can also be arranged under the fine-motion base 101-2. Each fine motion solenoid 101-3 can be supported by the fine motion base 101-2 via a supporting member 301-30. Such a structure is conducive to reducing the height of the fine motion solenoid 101-3 on the fine motion base 101-2 and reducing the size of the fine motion solenoid 101-3 in the XY direction. The fine motion solenoid 101-3 may include a fixed iron core (first member) SC, a supporting member 301-30 supporting the fixed iron core SC, a movable iron core (second member) MC, a supporting member 101-31 supporting the movable iron core MC, and a coil 301-36. The fixed core (first component) SC may include a first element 301-32, a second element 301-33, a third element 301-34, and a fourth element 301-35. The movable core (second component) MC may include the element 101-38, but may include one or more other elements in addition to the element 101-38. The fixed core (first component) SC may have a first end face E1, and the movable core (second component) MC may have a second end face E2 facing the first end face E1 across a gap. In this example, the first end face E1 is provided at each of the second element 301-33, the third element 301-34, and the fourth element 301-35, and the second end face E2 is provided at the element 101-38. The fixed core (first component) SC may be composed of a plurality of layers of electromagnetic steel plates. The plurality of electromagnetic steel plates may be covered with insulating films, respectively. From another point of view, the first element 301-32, the second element 301-33, the third element 301-34, and the fourth element 301-35 constituting the fixed core (first component) SC may be composed of a plurality of layers of electromagnetic steel plates, respectively. The movable core (second component) MC may be composed of a plurality of layers of electromagnetic steel plates. From another point of view, at least one element constituting the movable core (second component) MC, namely the element 101-38, may be composed of a plurality of layers of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film. The magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap (the space between the first end face E1 and the second end face E2) may include at least one changing portion CP in which the stacked direction of the plurality of electromagnetic steel plates changes at right angles. The changing portion CP may include a contact portion of a first portion (e.g., first element 301-32) whose stacked direction is a first direction (e.g., Y-axis direction) and a second portion (e.g., third element 301-34) whose stacked direction is a second direction (e.g., X-axis direction) orthogonal to the first direction. The change portion CP may include a portion where a first portion (e.g., first element 301-32) whose layer direction is a first direction and a second portion (e.g., third element 301-34) whose layer direction is a second direction orthogonal to the first direction face each other via a solid component. The solid component may be, for example, an insulating film that covers a plurality of electromagnetic steel plates. In the examples of FIGS. 19 and 20, the change portion CP is provided in the fixed core (first component) SC. In addition, in the examples of FIGS. 19 and 20, the change portion CP includes a portion where the fixed core (first component) SC and the movable core (second component) MC face each other via a gap. The latter structure can also be understood as the following structure: the first part of the first part and the second part constituting the variable part CP is arranged on the fixed iron core (first component) SC, and the second part is arranged on the movable iron core (second component) MC. The variable part CP can be provided in addition to the movable iron core (second component) MC, or can be provided only on the movable iron core (second component) MC. In the examples of Figures 19 and 20, the second element 301-33, the third element 301-34 and the fourth element 301-3 have an L-shaped shape, and the first element 301-32 has a rectangular shape. Figure 21 exemplifies the structure of other improved examples of the micro-motion electromagnet 101-3 of the third embodiment. The micro-motion electromagnet 101-3 may include a fixed core (first component) SC, a support component 201a-30 supporting the fixed core SC, a movable core (second component) MC, a support component 101-31 supporting the movable core MC, and a coil 201a-36. The fixed core (first component) SC may include a first element 201a-32, a second element 201a-33, a third element 201a-34, and a fourth element 201a-35. The movable core (second component) MC may include the element 101-38, but may also include one or more other elements in addition to the element 101-38. The fixed iron core (first component) SC may have a first end face E1, and the movable iron core (second component) MC may have a second end face E2 facing the first end face E1 across a gap. In this example, the first end face E1 is provided at each of the second element 201a-33, the third element 201a-34, and the fourth element 201a-35, and the second end face E2 is provided at the element 101-38. In the improved example of FIG. 21, the first element 201a-32 has an E-shaped shape, and the coil 201a-36 is wound around the central tooth of the first element 201a-32. In addition, in the improved example of FIG. 21, the second element 201a-33, the third element 201a-34, and the fourth element 201a-35 have a rectangular parallelepiped shape. Hereinafter, the assembly method or manufacturing method of the micro-motion electromagnet 101-3 of the improved example of FIG. 21 will be described with reference to FIG. 27 to FIG. 31. FIG. 27 shows the state in which the micro-motion electromagnet 101-3 of the improved example of FIG. 21 is decomposed. The first element 201a-32 and the supporting member 201a-30 can be combined by adhesive, clamping, fitting, etc. In addition, the coil 201a-36 and the coil base 201a-42 can be combined by adhesive material, etc. In addition, the second element 201b-33, the third element 201b-34 and the fourth element 201b-35 can be combined by adhesive material, clamping, fitting, etc. through the end component gasket 201a-40. As shown in FIG. 28 , the first element 201a-32 can be inserted into the opening 201a-21 of the fine-motion base 101-2, and the combination of the first element 201a-32 and the supporting member 201a-30 can be positioned on the fine-motion base 101-2. Furthermore, the supporting member 201a-30 can be fixed to the fine-motion base 101-2. The fixing of the supporting member 201a-30 relative to the fine-motion base 101-2 can be achieved, for example, by screw tightening, adhesive, clamping, fitting, etc. Next, as shown in FIG. 29 , the combination of the coil 201a-36 and the coil base 201a-42 can be positioned on the fine-motion base 101-2, and the coil base 201a-42 can be fixed to the fine-motion base 101-2. The fixing of the coil base 201a-42 relative to the fine-motion base 101-2 can be achieved, for example, by screw tightening, adhesive, clamping, fitting, etc. Next, as shown in FIG. 30 , the end component base 201a-41 can be fixed to the fine-motion base 101-2, for example, by screw tightening, adhesive, clamping, fitting, etc. Next, as shown in FIG. 31 , the second element 201b-33, the third element 201b-34, the fourth element 201b-35, and the combination of the second element 201b-33, the third element 201b-34, and the fourth element 201b-35 can be fixed to the end component base 201a-41. This can be achieved by fixing the end component pad 201a-40 to the end component base 201a-41 by screw tightening, adhesive, clamping, fitting, etc. The state shown in FIG. 28 can be returned to by the reverse sequence to the above, and a new coil 201a-36 can be fixed to the fine-motion base 101-2 as shown in FIG. 29, and then the coil 201a-36 can be replaced by the sequence shown in FIG. 30 and FIG. 31. When a fixed core SC is formed by combining a plurality of elements, there is a risk that particles may be generated due to a slight relative offset between the two elements along the boundary surface at the boundary between the two elements (e.g., the boundary between the second element 201a-33 and the first element 201a-32). As a countermeasure, a device for preventing the particles from being coated may be applied to the boundary surface, or a recovery plate may be provided near the boundary surface, or a capture magnet may be provided near the boundary surface. In addition, when the end component gasket 201a-40 is fixed to the end component base 201a-41, a thin gasket may be inserted between the two to maintain the first element 201a-32 and the second element 201a-33, the third element 201a-34, and the fourth element 201a-35 in a non-contact state. The following describes the exposure device and the micro-motion electromagnet 101-3 of the fourth embodiment. Matters not mentioned in the fourth embodiment can be handled in accordance with the first to third embodiments. FIG. 22 exemplarily shows the structure of the micro-motion electromagnet 101-3 of the fourth embodiment. The micro-motion electromagnet 101-3 may include a fixed core (first component) SC, a supporting component 301a-30 supporting the fixed core SC, a movable core (second component) MC, a supporting component 301a-31 supporting the movable core MC, and a coil 301a-36. The fixed core (first component) SC may include a first element 301a-32, a second element 301a-37, a third element 301a-33, a fourth element 301a-34, and a fifth element 301a-35. The movable core (second component) MC may include the element 301a-38, but may include one or more other elements in addition to the element 301a-38. The fixed core (first component) SC may have a first end face E1, and the movable core (second component) MC may have a second end face E2 facing the first end face E1 across a gap. In this example, the first end face E1 is provided at each of the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35, and the second end face E2 is provided at the element 301a-38. The fixed core (first component) SC may be formed by a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be covered with insulating films, respectively. From another viewpoint, the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35 constituting a part of the fixed core (first component) SC may be formed by a laminated core of a plurality of electromagnetic steel plates. In addition, the first element 301a-32 and the second element 301a-37 constituting another part of the fixed core (first component) SC may be formed by a wound core formed by winding electromagnetic steel plates. In addition, when the winding core is used as a component constituting the fixed core (first component) SC, the winding core has a structure in which a plurality of electromagnetic steel plates are stacked. The movable core (second component) MC may be composed of a laminated core in which a plurality of electromagnetic steel plates are stacked. From another viewpoint, at least one element constituting the movable core (second component) MC, namely, the element 301a-38, may be composed of a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film. The magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap (the space between the first end face E1 and the second end face E2) may include the changing parts CP and CP' where the stacking direction of the stacked body of the plurality of electromagnetic steel plates changes at right angles. The changing part CP may include a contact part of a first part (e.g., the fifth element 301a-38) whose stacking direction is the first direction (e.g., the Z-axis direction) and a second part (e.g., the second element 301a-37) whose stacking direction is the second direction (e.g., the X-axis direction) orthogonal to the first direction. The changing portion CP may include a portion where a first portion (e.g., the fifth element 301a-38) whose layer direction is the first direction and a second portion (e.g., the second element 301a-37) whose layer direction is the second direction orthogonal to the first direction face each other through a solid component. The solid component may be, for example, an insulating film that covers a plurality of electromagnetic steel plates. The changing portion CP' includes a portion where the layer direction slowly changes from the first direction (e.g., the X-axis direction) to the second direction orthogonal to the first direction (e.g., the Z-axis direction). The changing portion CP' including the portion where the layer direction slowly changes may be a portion of the winding core. The fixed core (first component) SC includes a first portion P1 whose layer direction is a first direction (e.g., X-axis direction) and a second portion P2 whose layer direction is a second direction (e.g., Z-axis direction), and the layer direction slowly changes between the first portion P1 and the second portion P2. The changing portion CP' is a portion between the first portion P1 and the second portion P2. In the example of FIG. 22 , the changing portions CP and CP' are provided in the fixed core (first component) SC. At least one of the changing portions CP and CP' may be provided in addition to the movable core (second component) MC, or may be provided only in the movable core (second component) MC. Alternatively, one of the fixed core (first member) SC and the movable core (second member) MC may be composed of at least one laminated core, the other of the fixed core (first member) SC and the movable core (second member) MC may be composed of a wound core, and the variable portion may be composed of the wound core. The first element 301a-32, the second element 301a-37, the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35 may be integrated by using an adhesive material, or may be integrated by being fastened using a clamping member. In this example, the variable portions CP and CP' are provided on the fixed core (first member) SC, and the coil 301a-36 is wound around the fixed core (first member) SC. The coil 301a-36 can be wound around a portion of the fixed core (first member) SC that is different from the portion where the change portion CP, CP' is arranged. By flowing a current through the coil 301a-36, an attractive force is generated between the first end face E1 and the second end face E2. In the example of FIG22, the first element 301a-32 and the second element 301a-37 have a U-shape, and the coil 301a-36 is wound around a portion where one tooth of the first element 301a-32 and one tooth of the second element 301a-37 are integrated. The changing parts CP and CP' may be arranged so that the magnetic flux passing through the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap does not flow through the plurality of electromagnetic steel plates forming the fixed iron core SC and the movable iron core MC in their layer direction. Alternatively, the changing parts CP and CP', the fixed iron core (first component) SC and the movable iron core (second component) MC may be arranged so that the magnetic flux passing through the fixed iron core SC and the movable iron core MC flows along the surface direction of each electromagnetic steel plate. Alternatively, the changing parts CP and CP' may be arranged so that the magnetic resistance of the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap is smaller than that in the case where the changing parts CP and CP' are not provided. Alternatively, the change parts CP and CP' may be arranged so that the eddy current generated in the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap is smaller than that in the case where there is no change part CP and CP'. In the example of FIG. 22, the stacking direction (Z-axis direction) of the third element 301a-33, the fourth element 301a-34 and the fifth element 301a-35 having the first end face E1 is the same as the stacking direction (Z-axis direction) of the element 301a-38 having the second end face E2. This will help reduce the magnetic resistance near the gap and increase the magnetic flux. Alternatively, the configuration example of FIG. 22 may be replaced by setting the stacking direction of the third element 301a-33, the fourth element 301a-34 and the fifth element 301a-35 to the X-axis direction. Such a structure will help reduce the magnetic resistance near the boundary between the third element 301a-33, the fourth element 301a-34 and the fifth element 301a-35 and the first element 301a-32 and the second element 301a-37, thereby increasing the magnetic flux. FIG23 exemplarily shows the structure of a modified example of the micro-motion electromagnet 101-3 of the fourth embodiment. Matters not mentioned as a modified example can be in accordance with the structure of the fourth embodiment shown in FIG22. The micro-motion electromagnet 101-3 may include a fixed iron core (first member) SC, a supporting member 301b-30 supporting the fixed iron core SC, a movable iron core (second member) MC, a supporting member 301b-31 supporting the movable iron core MC, and a coil 301b-36. The fixed core (first component) SC may include a first element 301b-32 and a second element 301b-33. The movable core (second component) MC may include a third element 301b-37 and a fourth element 301b-38. The fixed core (first component) SC may have a first end face E1, and the movable core (second component) MC may have a second end face E2 facing the first end face E1 across a gap. In this example, the first end face E1 is provided at each of the first element 301b-32 and the second element 301b-33, and the second end face E2 is provided at each of the third element 301b-37 and the fourth element 301b-38. The fixed core (first component) SC may be formed of a laminate of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with an insulating film. From another viewpoint, the first element 301b-32 and the second element 301b-33 constituting a part of the fixed iron core (first component) SC may be constituted by a layered body of a plurality of electromagnetic steel plates. In addition, when the winding core is used as a component constituting the fixed iron core (first component) SC, it also has a form of a structure in which a plurality of electromagnetic steel plates are stacked. The movable iron core (second component) MC may be constituted by a layered body of a plurality of electromagnetic steel plates. From another viewpoint, the third element 301b-37 and the fourth element 301b-38 constituting the movable iron core (second component) MC may be constituted by a layered body of a plurality of electromagnetic steel plates. The plurality of electromagnetic steel plates may be respectively covered with insulating films. The magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap (the space between the first end face E1 and the second end face E2) may include a changing portion CP', CP" in which the layered direction of the layered body of the plurality of electromagnetic steel plates changes at right angles. In this example, the changing portion CP' is provided in the fixed iron core (first component) SC, and the changing portion CP" is provided in the movable iron core (second component) MC. The changing portion CP' includes a portion in which the layered direction slowly changes from a first direction (for example, the X-axis direction) to a second direction (for example, the Z-axis direction) orthogonal to the first direction. The changing portion CP' including the portion in which the layered direction slowly changes may be a portion of the winding iron core. The fixed iron core (first component) SC includes a first portion P1 whose stacking direction is a first direction (e.g., X-axis direction) and a second portion P2 whose stacking direction is a second direction (e.g., Z-axis direction), and the stacking direction slowly changes between the first portion P1 and the second portion P2. The changing portion CP' is a portion between the first portion P1 and the second portion P2. The movable iron core (second component) MC includes a third portion P3 whose stacking direction is a first direction (e.g., X-axis direction) and a fourth portion P4 whose stacking direction is a second direction (e.g., Y-axis direction), and the stacking direction slowly changes between the third portion P3 and the fourth portion P4. The change portion CP" is a portion between the third portion P3 and the fourth portion P4. By allowing current to flow in the coil 301b-36, an attractive force is generated between the first end face E1 and the second end face E2. In the example of Figure 23, the first element 301b-32 and the second element 301b-33 have a U-shape, and the coil 301b-36 is wound around one tooth of the first element 301a-32 and one tooth of the second element 301a-37 to be integrated. The change portions CP' and CP" can be arranged so that the magnetic flux passing through the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap will not flow through the multiple electromagnetic steel plates constituting the fixed iron core SC and the movable iron core MC in their layered direction. Alternatively, the variable parts CP', CP", the fixed iron core (first component) SC, and the movable iron core (second component) MC may be arranged so that the magnetic flux passing through the fixed iron core SC and the movable iron core MC flows along the surface direction of each electromagnetic steel plate. Alternatively, the variable parts CP', CP" may be arranged so that the magnetic resistance of the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap is smaller than that in the case where there is no variable part CP', CP". Alternatively, the variable parts CP', CP" may be arranged so that the eddy current generated in the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap is smaller than that in the case where there is no variable part CP', CP". In the example of Figure 23, the first element 301b at the first end face E1 -32 and the second element 301b-33 have the same layer direction (X-axis direction) as the third element 301b-37 and the fourth element 301b-38 at the second end face E2. This helps to reduce the magnetic resistance near the gap and increase the magnetic flux. In addition, in the example of FIG. 23, the fixed iron core (first component) SC, the movable iron core In the magnetic circuit formed by (second member) MC and the gap, the layer direction does not change drastically, which is beneficial to reduce the magnetic resistance and increase the magnetic flux. FIG24 shows an exemplary structure of the support member 301b-31 supporting the movable iron core MC. The support member 301b-31 may have a star wheel shape in order to support the movable iron core MC which may be formed by the winding iron core. Here, refer to FIG32 illustrates a wound iron core. FIG32(a) illustrates a wound iron core. FIG32(b) shows a wound iron core obtained by cutting the wound iron core illustrated in FIG32(a) by wire cutting or the like. Such a wound iron core is also called a cut core. The wound iron core can be manufactured by winding a ring material around a core not shown. As illustrated in FIG33, the ring material can be manufactured by FIG33. The original coil is transported in the direction of the plate passing, and is cut into the desired width by a cutter including a circular knife installed on the way to obtain a ring material. The width is determined by the interval between the circular knives of the cutter. As shown in (a) of Figure 32, the winding iron core is a layered body of multiple electromagnetic steel plates, and one winding iron core has multiple layering directions. In other words, the winding iron core can be It is used as a component constituting the aforementioned changing part. The stacking direction is the direction that passes through the focus area in the winding iron core in a direction perpendicular to the electromagnetic steel plate. The width direction is the direction determined by the cutting machine and is also the axial direction. The axial direction is the direction parallel to any part of the largest surface of each electromagnetic steel plate. In one aspect, the electromagnetic device of the present invention may have a stacked iron core or a winding iron core. A plurality of core components and a coil that generates a magnetic flux in the core component. Here, the stacking direction of a certain laminated core may be orthogonal to the width direction of a certain winding core, or the stacking direction of a certain laminated core may be orthogonal to another laminated core, or the width direction of a certain winding core may be orthogonal to another winding core. The control system of the wafer stage device 500 is described below. FIG. 25 exemplarily shows the structure of the control system of the wafer stage device 500. The moving target providing unit 5101 provides a moving target. The position curve generator 5102 generates a position curve representing the relationship between time and the position of the fine motion stage 101-1 at that time, based on the moving target provided by the moving target providing unit 5101. In addition, the position curve generator 5102 generates a target position based on the generated position curve. The acceleration curve generator 5103 generates an acceleration curve representing the relationship between time and the acceleration of the fine motion stage 101-1 at that time, based on the moving target provided by the moving target providing unit 5101. In addition, the acceleration curve generator 5103 generates a target acceleration based on the generated acceleration curve. FIG. 26 illustrates an example of a position curve generated by the position curve generator 5102 and an acceleration curve generated by the acceleration curve generator 5103. The fine motion position sensor 5156 measures the position of the fine motion stage 101-1. The fine motion position control system 5121 generates an operation amount through PID calculation or the like, corresponding to the deviation between the target position provided by the position curve generated by the position curve generator 5102 and the current position provided by the fine motion position sensor 5156. The current amplifier 5122 supplies the current corresponding to the operation amount generated by the fine motion position control system 5121 to the fine motion XLM101-4 and the fine motion YLM101-5. Thus, the fine motion stage 101-1 is subjected to feedback control. The coarse motion position sensor 5135 measures the position of the fine motion base 101-2. The coarse motion position control system 5133 generates an operation amount through PID calculation or the like, corresponding to the deviation between the target position provided by the position curve generated by the position curve generator 5102 and the current position provided by the coarse motion position sensor 5135. The current amplifier 5131 supplies a current corresponding to the operation amount generated by the coarse motion position control system 5133 and the target acceleration provided by the acceleration curve generator 5103 to the coarse motion linear motor 106. As a result, the fine motion base 101-2 is subjected to feedback control and feedforward control. The target acceleration generated by the acceleration curve generator 5103 is also supplied to the electromagnet current control system 5515, and the electromagnet current control system 5515 controls the fine motion electromagnet 101-3 according to the target acceleration. When the fine motion stage 101-1 (fine motion stage device 101) is accelerated, the fine motion electromagnet 101-3 mainly provides force to the fine motion stage 101-1. The fine motion XLM101-4 and the fine motion YLM101-5 can be controlled to generate a thrust for reducing a small position deviation between the target position and the measured current position. As a result, the heat generated by the fine motion XLM101-4 and the fine motion YLM101-5 will be reduced. The coarse motion position control system 5133 moves the position of the fine motion base 101-2 according to the position curve generated by the position curve generator 5102. The fine motion electromagnet 101-3 is conducive to generating a large attraction with very small heat. However, it is necessary to maintain the gap between the first end face E1 and the second end face E2 of the fine motion electromagnet 101-3. That is, in order for the fine motion electromagnet 101-3 to continuously provide the desired force to the fine motion stage 101-1, it is necessary to move the stator (fixed iron core and coil) of the fine motion electromagnet 101-3 in accordance with the movement of the fine motion stage 101-1 to maintain the gap. In addition, the heat generated by the fine motion ZLM can be reduced by reducing the height of the fine motion electromagnet 101-3 on the fine motion base 101-2. According to the above structure, high-precision position control of the fine motion stage 101-1, reduction of heat generation and reduction of overlap error can be achieved. The coarse motion position control system 5133 realizes the above matters. The coarse motion position, that is, the position of the fine motion base 101-2 is measured by the coarse motion position sensor 5135 represented by the encoder, and the coarse motion linear motor 106 is driven by the coarse motion position control system 5133 based on the deviation from the target position. As a result, the position of the fine motion stage 101-1 (the mover of the fine motion electromagnet 101-3) and the position of the fine motion base 101-2 (the stator of the fine motion electromagnet 101-3) are controlled based on the output of the position curve generator 5102 to maintain the gap. The fine motion position sensor 5156 that measures the position of the fine motion stage 101-1 can also be replaced by a sensor that measures the relative position of the fine motion stage 101-1 and the fine motion base 101-2. The invention is not limited to the above-mentioned implementation method, and various modifications and changes can be made within the scope of the concept of the invention.

SC: Fixed iron core (1st component) MC: Movable iron core (2nd component) 101-1: Micro-motion stage 101-2: Micro-motion base 101-36: Coil

[FIG. 1] A diagram showing an exemplary configuration of an exposure device according to an embodiment. [FIG. 2] A diagram showing an exemplary configuration of a wafer stage device according to an embodiment. [FIG. 3] A diagram showing an exemplary configuration of a wafer stage device according to an embodiment. [FIG. 4] A diagram showing an exemplary configuration of a fine-motion stage device according to an embodiment. [FIG. 5] A diagram showing an exemplary configuration of a coarse-motion stage device according to an embodiment. [FIG. 6] A diagram showing an exemplary configuration of a coarse-motion linear motor according to an embodiment. [FIG. 7] A diagram showing an exemplary irradiation area layout diagram. [FIG. 8] A diagram showing an exemplary configuration of a fine-motion electromagnet assembled in an exposure device or a wafer stage device according to the first embodiment. [FIG. 9] A diagram showing, by way of example, the configuration of a micro-motion electromagnet assembled in an exposure device or a wafer stage device according to the first embodiment. [FIG. 10] A diagram showing, by way of example, the configuration of a micro-motion stage device assembled in an exposure device or a wafer stage device according to the first embodiment. [FIG. 11] A diagram showing, by way of example, the configuration of an improved example of a micro-motion electromagnet assembled in an exposure device or a wafer stage device according to the first embodiment. [FIG. 12] A diagram showing, by way of example, the configuration of another improved example of a micro-motion electromagnet assembled in an exposure device or a wafer stage device according to the first embodiment. [FIG. 13] A diagram showing, by way of example, the configuration of a micro-motion electromagnet assembled in an exposure device or a wafer stage device according to the second embodiment. [FIG. 14] A diagram showing, by way of example, the configuration of a fine-motion electromagnet assembled in an exposure device or a wafer stage device according to the second embodiment. [FIG. 15] A diagram showing, by way of example, the configuration of a fine-motion stage device assembled in an exposure device or a wafer stage device according to the second embodiment. [FIG. 16] A diagram showing, by way of example, the configuration of a fine-motion electromagnet assembled in an exposure device or a wafer stage device according to the third embodiment. [FIG. 17] A diagram showing, by way of example, the configuration of a fine-motion electromagnet assembled in an exposure device or a wafer stage device according to the third embodiment. [FIG. 18] A diagram showing, by way of example, the configuration of a fine-motion stage device assembled in an exposure device or a wafer stage device according to the third embodiment. [FIG. 19] A diagram showing an exemplary structure of a modified example of a micro-motion electromagnet assembled in an exposure device or a wafer stage device according to the third embodiment. [FIG. 20] A diagram showing an exemplary structure of a modified example of a micro-motion electromagnet assembled in an exposure device or a wafer stage device according to the third embodiment. [FIG. 21] A diagram showing an exemplary structure of another modified example of a micro-motion electromagnet assembled in an exposure device or a wafer stage device according to the third embodiment. [FIG. 22] A diagram showing an exemplary structure of a micro-motion electromagnet assembled in an exposure device or a wafer stage device according to the fourth embodiment. [FIG. 23] A diagram showing an exemplary structure of a modified example of a micro-motion electromagnet assembled in an exposure device or a wafer stage device according to the fourth embodiment. [Figure 24] A diagram showing, by way of example, the structure of a support member for a movable iron core in a modified example of the micro-motion electromagnet of the fourth embodiment. [Figure 25] A diagram showing, by way of example, the structure of a control system for a wafer stage device in one embodiment. [Figure 26] A diagram showing, by way of example, a position curve and an acceleration curve. [Figure 27] A diagram for illustrating an assembly method or a manufacturing method of a modified example of the micro-motion electromagnet of the third embodiment. [Figure 28] A diagram for illustrating an assembly method or a manufacturing method of a modified example of the micro-motion electromagnet of the third embodiment. [Figure 29] A diagram for illustrating an assembly method or a manufacturing method of a modified example of the micro-motion electromagnet of the third embodiment. [Figure 30] A diagram for illustrating an assembly method or a manufacturing method of a modified example of the micro-motion electromagnet of the third embodiment. [Figure 31] A diagram for explaining an assembly method or a manufacturing method of an improved example of the fine motion electromagnet of the third embodiment. [Figure 32] A diagram for illustrating a winding iron core by way of example. [Figure 33] A diagram for illustrating a manufacturing method of a winding iron core by way of example. [Figure 34] A diagram for illustrating eddy currents generated in an iron core having a complex three-dimensional shape. [Figure 35] A diagram for illustrating a torque acting on the fine motion stage when the fine motion stage is accelerated.

101-2: Micro-motion base

101-30: Support components

101-31: Support components

101-36: Coil

101-39: Sales unit

SC: Fixed iron core (first component)

MC: Movable core (second component)

Claims (26)

A stage device is used to hold a substrate. The stage device is characterized in that it includes: a coarse motion stage; a coarse motion actuator for driving the coarse motion stage along a specified plane; a fine motion stage for holding the substrate; a fine motion actuator for adjusting the position and posture of the fine motion stage relative to the coarse motion stage; and an electromagnetic actuator for transmitting the thrust provided to the coarse motion stage by the coarse motion actuator to the fine motion stage in a non-contact manner. The electromagnetic actuator includes: a movable iron core fixed to the fine motion stage; a fixed iron core fixed to the coarse motion stage; and a coil wound on the fixed iron core, wherein the shortest distance between the substrate held by the fine motion stage and the coil is greater than the shortest distance between the substrate and the fixed iron core. A stage device as described in claim 1, wherein the central axis of the coil is parallel to the plane. The stage device as described in claim 2, wherein the fixed iron core has a first end face facing the movable iron core, and the distance between the substrate held by the fine motion stage and the center axis of the coil is greater than the distance between the substrate held by the fine motion stage and the center of the first end face. A stage device as described in claim 1, wherein, in a cross section perpendicular to the plane and parallel to the central axis of the coil, the fixed core includes a portion having a crank shape. A stage device as described in claim 1, wherein the central axis of the coil is arranged at an angle inclined relative to the plane. A stage device as described in claim 1, wherein, in a cross section perpendicular to the plane and parallel to the central axis of the coil, the fixed core includes a portion having an L-shape. A stage device as described in claim 6, wherein the central axis of the coil is arranged at an angle perpendicular to the plane. The stage device as described in claim 7, wherein, the coarse motion stage has an opening, and a portion of the fixed iron core is disposed in the opening. A stage device as described in claim 1, wherein the central axis of the coil is arranged at an angle perpendicular to the plane. A stage device as described in any one of claims 1 to 9, wherein the fixed iron core and the movable iron core form a magnetic circuit, the magnetic circuit includes a laminate composed of a plurality of electromagnetic steel plates, and the laminate includes a changing portion in which the stacking direction of the plurality of electromagnetic steel plates changes at right angles. The stage device as described in claim 10, wherein the change portion includes a contact portion of a first portion whose stacking direction is a first direction and a second portion whose stacking direction is a second direction orthogonal to the first direction. The stage device as described in claim 10, wherein the change portion includes a first portion whose stacking direction is a first direction and a second portion whose stacking direction is a second direction orthogonal to the first direction, facing each other through a solid component. The stage device as described in claim 10, wherein the variable portion is provided on at least one of the fixed iron core and the movable iron core. The stage device as described in claim 10, wherein the change portion includes a first portion whose stacking direction is a first direction and a second portion whose stacking direction is a second direction orthogonal to the first direction, facing each other through a gap. The stage device as described in claim 14, wherein the first part is provided on the fixed iron core, and the second part is provided on the movable iron core. The stage device as described in claim 10, wherein the fixed iron core and the movable iron core are each composed of at least one laminated iron core. The stage device as described in claim 10, wherein, at least one of the fixed iron core and the movable iron core is composed of a plurality of laminated iron cores. A carrier device as described in claim 17, wherein the plurality of laminated iron cores are arranged close to each other and fixed by a fixing member. The stage device as described in claim 10, wherein the changing portion includes a portion where the stacking direction slowly changes from a first direction toward a second direction orthogonal to the first direction. The carrier device as described in claim 11, wherein the variable portion is formed by a wound iron core. The stage device as described in claim 10, wherein, one of the fixed iron core and the movable iron core includes at least one laminated iron core, the other of the fixed iron core and the movable iron core includes a wound iron core, the variable portion is formed by the wound iron core. The stage device as described in claim 10, wherein, the fixed iron core and the movable iron core are respectively constituted by winding iron cores, the axial direction of the winding iron core constituting the fixed iron core and the axial direction of the winding iron core constituting the movable iron core are orthogonal to each other, the winding iron core constituting the fixed iron core and the winding iron core constituting the movable iron core respectively constitute the changing portion. The carrier device as described in claim 10, wherein the variable portion is provided on the fixed iron core, and the coil is wound around the fixed iron core. A stage device as described in claim 23, wherein the coil is wound around a portion of the fixed core that is different from a portion where the changing portion is disposed. A transfer device is used to transfer the pattern of an original plate to a substrate. The transfer device is characterized in that it has a stage device as described in claim 1. A method for manufacturing an article, characterized in that it includes: a transfer process of transferring the pattern of the original plate to a substrate by the transfer device described in claim 25; and a process of obtaining an article from the substrate subjected to the transfer process.

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