TW202341207A - Backlit module and illuminated keyswitch structure - Google Patents
Backlit module and illuminated keyswitch structure Download PDFInfo
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- TW202341207A TW202341207A TW112108773A TW112108773A TW202341207A TW 202341207 A TW202341207 A TW 202341207A TW 112108773 A TW112108773 A TW 112108773A TW 112108773 A TW112108773 A TW 112108773A TW 202341207 A TW202341207 A TW 202341207A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/056—Diffuser; Uneven surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/06—Reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/062—Light conductor
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- Push-Button Switches (AREA)
- Planar Illumination Modules (AREA)
- Input From Keyboards Or The Like (AREA)
- Position Input By Displaying (AREA)
Abstract
Description
本發明係關於一種按鍵結構,具體而言,本發明係關於一種發光按鍵結構及其背光模組。The present invention relates to a key structure. Specifically, the present invention relates to a luminous key structure and its backlight module.
目前為提升發光按鍵的亮度,已有單顆按鍵於其底板下方配置專屬光源向上發光的結構。然而,此類結構通常具有發光不均勻的問題,例如鍵帽中央字符過亮,而角落字符過暗。At present, in order to improve the brightness of the luminous buttons, a single button is equipped with a structure with a dedicated light source under the base plate to emit upward light. However, such structures usually have the problem of uneven lighting, for example, the characters in the center of the keycap are too bright and the characters in the corners are too dark.
此外,鍵帽輪廓光暈也是背光結構提供鍵帽邊界識別的功能之一。但是,前述配置會讓鍵帽輪廓光暈也有不均勻或過暗情況,以致於鍵盤上的鍵帽字符與鍵帽邊界都不易辨識,難以達到一致性的發光均勻度。In addition, the keycap outline halo is also one of the functions of the backlight structure to provide keycap boundary recognition. However, the aforementioned configuration will cause the keycap outline halo to be uneven or too dark, making it difficult to identify the keycap characters and keycap boundaries on the keyboard, making it difficult to achieve consistent lighting uniformity.
再者,為了散熱或定位,按鍵通常會具有貫穿底板及其下膜片或板件的散熱孔或定位孔。然而,開設散熱孔或定位孔也會形成漏光之處,因此也需要遮光設計。Furthermore, for heat dissipation or positioning, the buttons usually have heat dissipation holes or positioning holes that penetrate the base plate and its lower diaphragm or plate. However, opening heat dissipation holes or positioning holes will also cause light leakage, so light-shielding design is also required.
本發明之一目的在於提供一種背光模組及發光按鍵結構,其具有經設計的膠層分布,有效地將光線橫向引導再出光,以改善鍵帽中間字符爆亮的問題,進而提升發光均勻性。One object of the present invention is to provide a backlight module and a light-emitting key structure with a designed glue layer distribution that effectively guides light laterally and then emits light, thereby improving the problem of characters in the middle of the keycap being bright and thereby improving the uniformity of light emission. .
本發明之另一目的在於提供一種背光模組及發光按鍵結構,其藉由經設計的膠層分布與光學膜片組,在光線橫向傳遞過程中盡可能回收光線避免漏光,以提升發光亮度及均勻性。Another object of the present invention is to provide a backlight module and luminous button structure, which uses designed glue layer distribution and optical film set to recover as much light as possible during the lateral transmission of light to avoid light leakage, thereby improving luminous brightness and Uniformity.
於一實施例,本發明提供一種背光模組,其包含:遮光片、導光片、反射層、頂膠及底膠,其中遮光片具有第一塗層,用以實質反射光線;導光片設置於遮光片之一側,導光片具有光源孔;反射層設置於導光片相對於遮光片之另一側,反射層具有開口與光源孔連通;頂膠用於連接遮光片及導光片且位於光源孔周圍;底膠用於連接導光片及反射層且位於光源孔周圍,其中第一塗層覆蓋於光源孔正上方,且在遮光片、導光片及反射層之堆疊方向上,頂膠及底膠至少其中一個與第一塗層重疊。In one embodiment, the present invention provides a backlight module, which includes: a light shielding sheet, a light guide sheet, a reflective layer, a top glue and a bottom glue, wherein the light shielding sheet has a first coating to substantially reflect light; the light guide sheet It is arranged on one side of the light shielding sheet, and the light guide sheet has a light source hole; the reflective layer is arranged on the other side of the light guide sheet relative to the light shielding sheet, and the reflective layer has an opening connected with the light source hole; the top glue is used to connect the light shielding sheet and the light guide film and is located around the light source hole; the primer is used to connect the light guide sheet and the reflective layer and is located around the light source hole, where the first coating covers directly above the light source hole and in the stacking direction of the light shielding sheet, light guide sheet and reflective layer On the coating, at least one of the top glue and the bottom glue overlaps the first coating layer.
於一實施例,本發明之背光模組用於投射光線至背光模組上方之底板之中央孔,其中遮光片更具有第二塗層,第二塗層用以實質遮擋光線,第二塗層較第一塗層更接近底板,且第二塗層於底板之垂直投影位於中央孔之範圍內。In one embodiment, the backlight module of the present invention is used to project light to the central hole of the base plate above the backlight module. The light-shielding sheet further has a second coating. The second coating is used to substantially block the light. The second coating It is closer to the base plate than the first coating layer, and the vertical projection of the second coating layer to the base plate is within the range of the central hole.
於一實施例,頂膠或底膠於遮光片之垂直投影位於第一塗層之範圍內。In one embodiment, the vertical projection of the top glue or bottom glue on the light shielding sheet is located within the range of the first coating layer.
於一實施例,頂膠或底膠環繞光源孔設置,且第一塗層覆蓋於光源孔正上方之部分之直徑大於頂膠之直徑。In one embodiment, the top glue or the bottom glue is arranged around the light source hole, and the diameter of the part of the first coating layer directly above the light source hole is larger than the diameter of the top glue.
於一實施例,頂膠與導光片之光源孔之孔緣間具有頂淨空區,且底膠與導光片之光源孔之孔緣間具有底淨空區。In one embodiment, there is a top clear area between the top glue and the edge of the light source hole of the light guide sheet, and there is a bottom clear area between the bottom glue and the edge of the light source hole of the light guide sheet.
於一實施例,底淨空區大於頂淨空區。In one embodiment, the bottom clearance area is larger than the top clearance area.
於一實施例,導光片具有複數出光部,且複數出光部不設置在頂淨空區及底淨空區。In one embodiment, the light guide sheet has a plurality of light emitting parts, and the plurality of light emitting parts are not disposed in the top clearance area and the bottom clearance area.
於另一實施例,本發明提供一種發光按鍵結構,其包含:底板、遮光片、導光片、反射層、頂膠及底膠,其中底板具有內肋,內肋定義中央孔;遮光片設置於底板下方;導光片設置於遮光片相對於底板之另一側,導光片具有光源孔;反射層設置於導光片相對於遮光片之另一側,反射層具有開口與光源孔連通;頂膠設置於導光片之頂面且位於光源孔周圍;底膠設置於導光片之底面且位於光源孔周圍,其中在底板、遮光片、導光片及反射層之堆疊方向上,頂膠及底膠至少其中一個與內肋重疊。In another embodiment, the present invention provides a light-emitting key structure, which includes: a bottom plate, a light shielding sheet, a light guide sheet, a reflective layer, a top glue and a bottom glue, wherein the bottom plate has an inner rib defining a central hole; the light shielding plate is provided Under the base plate; the light guide sheet is disposed on the other side of the light shielding sheet relative to the base plate, and the light guide sheet has a light source hole; the reflective layer is disposed on the other side of the light guide sheet relative to the light shielding sheet, and the reflective layer has an opening communicating with the light source hole. ; The top glue is disposed on the top surface of the light guide sheet and is located around the light source hole; the bottom glue is disposed on the bottom surface of the light guide sheet and is located around the light source hole, where in the stacking direction of the base plate, light shielding sheet, light guide sheet and reflective layer, At least one of the top glue and bottom glue overlaps the inner rib.
於一實施例,遮光片具有第一塗層及第二塗層,第一塗層用以實質反射光線,第二塗層用以實質遮擋光線,第二塗層較第一塗層更接近底板,該第一塗層於底板之垂直投影與中央孔重疊且延伸至內肋,第二塗層於底板之垂直投影位於中央孔之範圍內。In one embodiment, the light-shielding sheet has a first coating layer and a second coating layer. The first coating layer is used to substantially reflect light. The second coating layer is used to substantially block light. The second coating layer is closer to the base plate than the first coating layer. , the vertical projection of the first coating on the bottom plate overlaps with the central hole and extends to the inner rib, and the vertical projection of the second coating on the bottom plate is within the range of the central hole.
於一實施例,底板更具有至少一橋接肋部,至少一橋接肋部定義至少一周邊孔,且第一塗層於底板之垂直投影更與至少一橋接肋部重疊。In one embodiment, the base plate further has at least one bridging rib, the at least one bridging rib defines at least one peripheral hole, and the vertical projection of the first coating layer on the base plate further overlaps the at least one bridging rib.
於一實施例,導光片具有複數出光部,且複數出光部與至少一周邊孔對應設置。In one embodiment, the light guide sheet has a plurality of light emitting parts, and the plurality of light emitting parts are arranged corresponding to at least one peripheral hole.
於一實施例,頂膠及底膠至少其中一個與內肋及第一塗層在堆疊方向上重疊。In one embodiment, at least one of the top glue and the bottom glue overlaps the inner rib and the first coating layer in the stacking direction.
於一實施例,導光片具有複數出光部,且複數出光部於底板之垂直投影與內肋不重疊。In one embodiment, the light guide sheet has a plurality of light exit parts, and the vertical projection of the plurality of light exit parts on the bottom plate does not overlap with the inner rib.
於又另一實施例,本發明提供一種背光模組,其包含:遮光片、驅動電路板、導光片、發光件、頂膠及底膠,其中遮光片具有第一塗層用以實質反射光線;驅動電路板設置於遮光片下方;導光片設置於遮光片及驅動電路板之間,導光片具有光源孔及複數出光部;發光件藉由黏著層固定於驅動電路板且位於光源孔中;頂膠設置於導光片之頂面且位於光源孔周圍;底膠設置於導光片之底面且位於光源孔周圍,其中在遮光片、導光片及驅動電路板之堆疊方向上,頂膠及底膠至少其中一個與黏著層不重疊。In yet another embodiment, the present invention provides a backlight module, which includes: a light-shielding sheet, a driving circuit board, a light guide sheet, a light-emitting component, a top glue and a bottom glue, wherein the light-shielding sheet has a first coating layer for substantial reflection. Light; the drive circuit board is arranged under the light shield; the light guide sheet is arranged between the light shield and the drive circuit board, and the light guide sheet has a light source hole and a plurality of light emitting parts; the light-emitting component is fixed to the drive circuit board through an adhesive layer and is located at the light source hole; the top glue is set on the top surface of the light guide sheet and is located around the light source hole; the bottom glue is set on the bottom surface of the light guide sheet and is located around the light source hole, in the stacking direction of the light shielding sheet, light guide sheet and drive circuit board , at least one of the top glue and bottom glue does not overlap with the adhesive layer.
於一實施例,背光模組更包含通孔,通孔貫穿遮光片、導光片及驅動電路板,其中遮光片具有第二塗層用以實質遮擋該光線,第一塗層較第二塗層更接近導光片,第一塗層及第二塗層圍繞通孔設置,且第一塗層較第二塗層自通孔向內退縮以形成調節區。In one embodiment, the backlight module further includes a through hole that penetrates the light shielding sheet, the light guide sheet and the drive circuit board. The light shielding sheet has a second coating layer to substantially block the light. The first coating layer is thicker than the second coating layer. The layer is closer to the light guide sheet, the first coating layer and the second coating layer are arranged around the through hole, and the first coating layer retreats inward from the through hole than the second coating layer to form an adjustment area.
本發明之背光模組更包含:通孔及反射層,反射層設置於驅動電路板及導光片之間;通孔貫穿遮光片、導光片、反射層及驅動電路板。本發明之背光模組於通孔周圍更設置通孔頂膠及通孔底膠至少其中一個,其中通孔頂膠設置於導光片之上;通孔底膠設置於導光片之下。The backlight module of the present invention further includes: a through hole and a reflective layer, the reflective layer is arranged between the drive circuit board and the light guide sheet; the through hole penetrates the light shielding sheet, the light guide sheet, the reflective layer and the drive circuit board. The backlight module of the present invention is further provided with at least one of a through-hole top glue and a through-hole bottom glue around the through hole, wherein the through-hole top glue is disposed above the light guide sheet; and the through-hole bottom glue is disposed under the light guide sheet.
於一實施例,通孔頂膠及通孔底膠至少其中一個在堆疊方向上與第一塗層重疊。In one embodiment, at least one of the through-hole top glue and the through-hole bottom glue overlaps the first coating layer in the stacking direction.
於一實施例,通孔頂膠或通孔底膠與導光片於通孔之孔緣間分別具有頂通孔淨空區或底通孔淨空區。In one embodiment, the through-hole top glue or the through-hole bottom glue and the light guide sheet respectively have a top through-hole clear area or a bottom through-hole clear area between the edges of the through holes.
於一實施例,黏著層為可透光,且反射層的一部分位於光源孔內,使反射的光線可經由黏著層及/或反射層,由光源孔之孔壁進入導光片側向傳遞。In one embodiment, the adhesive layer is light-transmissive, and a part of the reflective layer is located in the light source hole, so that the reflected light can enter the light guide plate from the wall of the light source hole through the adhesive layer and/or the reflective layer and be transmitted laterally.
於一實施例,背光模組更包含第四塗層圍繞通孔設置於驅動電路板上,用以實質遮擋光線。In one embodiment, the backlight module further includes a fourth coating layer disposed on the driving circuit board around the through hole to substantially block light.
於一實施例,導光片的該些出光部位於光源孔與通孔之間,且導光片的該些出光部位於底膠與通孔底膠之間。In one embodiment, the light exit portions of the light guide sheet are located between the light source hole and the through hole, and the light exit portions of the light guide sheet are located between the primer and the through hole primer.
於一實施例,本發明之背光模組更包含複數出光部及邊膠,邊膠沿鍵帽的側邊設置,複數出光部於遮光片之垂直投影位於頂膠及邊膠之間或者位於底膠及邊膠之間。In one embodiment, the backlight module of the present invention further includes a plurality of light-emitting parts and edge glues. The edge glues are arranged along the sides of the keycaps. The vertical projection of the plurality of light-emitting parts on the light-shielding sheet is located between the top glue and the side glue or at the bottom. between glue and edge glue.
相較於習知技術,本發明之背光模組及發光按鍵結構藉由經設計的膠層分布及塗層設計,可有效地將光線橫向引導再出光,並在光線橫向傳遞過程中盡可能回收光線避免漏光,以提升發光亮度及均勻性。再者,本發明之背光模組及發光按鍵結構藉由經設計的膠層分布及遮光片的塗層設計可有效降低散熱孔或定位孔的漏光。Compared with the conventional technology, the backlight module and luminous button structure of the present invention can effectively guide and re-emit light laterally through the designed glue layer distribution and coating design, and recover as much light as possible during the lateral transmission of light. Avoid light leakage to improve luminous brightness and uniformity. Furthermore, the backlight module and luminous button structure of the present invention can effectively reduce light leakage from heat dissipation holes or positioning holes through designed glue layer distribution and light shielding sheet coating design.
本發明主要涉及黏著劑(例如透光膠層)的膠合功能與光學性質在一個複雜光路系統(帶有背光模組的發光鍵盤與發光按鍵)的複雜應用,本發明設計在搭配膠層與相關光學元件的調整,可以達到單鍵乃至於整盤按鍵在背光模組單位出光量的極致發光效益,以及發光均勻度的提升。因此,理解本發明各實施例的發明思路有其必要,請容詳細解說本發明的背光模組、發光按鍵和發光鍵盤如何在兼顧多變數多限制的前提下進行最佳化設計。The present invention mainly relates to the complex application of the gluing function and optical properties of an adhesive (such as a light-transmitting adhesive layer) in a complex optical path system (a luminous keyboard and luminous buttons with a backlight module). The invention is designed to match the adhesive layer and related The adjustment of the optical components can achieve the ultimate luminous efficiency of the unit light output of the backlight module for a single key or even the entire set of keys, as well as improve the uniformity of the luminescence. Therefore, it is necessary to understand the inventive ideas of each embodiment of the present invention. Please explain in detail how to optimize the design of the backlight module, luminous keys and luminous keyboard of the present invention while taking into account multiple variables and restrictions.
在電子裝置如筆電和鍵盤追求極致超薄化的趨勢下,發光按鍵和背光模組被迫在狹小空間內高度積集化,加上光源小型化、發光功率降低、光學材料的逐年改變,這導致採用不同光源、不同光學元件的些微變動都會造成發光效果的巨大變動,使得按鍵背光設計必須考量複雜的技術問題,無法透過簡單的設計選擇解決問題。As electronic devices such as laptops and keyboards pursue extreme thinness, luminous buttons and backlight modules are forced to be highly integrated in a small space. In addition, light sources are miniaturized, luminous power is reduced, and optical materials change year by year. This results in the use of different light sources and slight changes in different optical components resulting in huge changes in the luminous effect. The key backlight design must consider complex technical issues and cannot solve the problem through simple design choices.
首先,不同入光位置、不同尺寸或不同數量/方向發光面的光源在與導光片搭配時具有高度差異,容易造成光學膜片浮起導致漏光。再者,光源及光學膜片(遮光片、導光片、反射片和光源電路板)之間的相對位置若不固定,也會造成光耦合不穩定。但是,單純藉由膠層固定光源及光學膜片的相對位置,會落入嚴重影響光學效果的技術陷阱。例如,如果透光膠層的折射率較空氣更接近於導光片,膠層將更容易破壞導光片的全反射,使得導光片容易從膠層的佈設處出光。舉例來說,若在1平方公分的鍵帽範圍內、超薄按鍵高度如2 mm、1.8 mm背光模組的前提下設置專屬的光源,並使用膠層圍繞光源設置在導光片上接著向內反射的遮光片與反射片/燈板,這將導致大量剛由光源出光的大量光線直接或間接穿過膠層,在導光片光源孔內外周圍、以及遮光片與反射片/燈板之間反覆穿出或穿入導光片,導致不必要的光線的損耗、降低朝向鍵帽輪廓側向傳遞的光通量,此對低亮度光源背光應用的影響甚鉅,因為鍵帽光暈和角落字符將會極為黯淡。如果只將膠層布置在鍵帽輪廓、而不布置在光源周圍,各光學膜層的厚度、孔位、膠層印刷在滾壓、打件與加熱製程前後的公差,可能會導致光源偏移、擠壓、頂抵脫落等問題。此外,膠層與光源距離、膠層與導光片光源孔距離、光源與導光片光源孔距離、膠層和遮光/反射的光學元件的相對位置,也會造成光效的差異。First of all, light sources with different light entrance positions, different sizes, or different numbers/directions of light-emitting surfaces have highly different heights when matched with the light guide sheet, which can easily cause the optical film to float and cause light leakage. Furthermore, if the relative positions between the light source and the optical films (shielding sheet, light guide sheet, reflective sheet and light source circuit board) are not fixed, optical coupling may also be unstable. However, simply fixing the relative positions of the light source and the optical film through an adhesive layer will fall into a technical trap that seriously affects the optical effect. For example, if the refractive index of the light-transmitting adhesive layer is closer to that of the light guide sheet than that of air, the adhesive layer will more easily destroy the total reflection of the light guide sheet, making it easier for the light guide sheet to emit light from where the adhesive layer is arranged. For example, if a dedicated light source is set up within a keycap area of 1 square centimeter and an ultra-thin key height such as 2 mm or 1.8 mm backlight module is used, and an adhesive layer is used to surround the light source and placed on the light guide sheet and then inward. The reflective light shielding sheet and reflective sheet/light panel will cause a large amount of light just emitted by the light source to directly or indirectly pass through the adhesive layer, both inside and outside the light source hole of the light guide sheet, and between the light shielding sheet and the reflective sheet/light panel. Repeatedly passing through or into the light guide causes unnecessary light loss and reduces the luminous flux transmitted sideways toward the keycap outline. This has a huge impact on low-brightness light source backlight applications, because the keycap halo and corner characters will It would be extremely bleak. If the adhesive layer is only arranged on the keycap outline and not around the light source, the thickness, hole position, and tolerance of the adhesive layer printing before and after the rolling, punching, and heating processes of each optical film layer may cause the light source to shift. , extrusion, push-off and other problems. In addition, the distance between the adhesive layer and the light source, the distance between the adhesive layer and the light source hole of the light guide sheet, the distance between the light source and the light source hole of the light guide sheet, and the relative positions of the adhesive layer and light-shielding/reflective optical elements will also cause differences in light effects.
相對的,位在散熱孔或結構孔(封閉孔或開放孔)的膠層運用與否、設置位置與光學元件(吸光/反射/全反射/擴散/折射等)的搭配設計,與光源附近的膠層運用出現不同的變化與效應。例如,讓背光模組的遮光片與反光片/燈板黏合在散熱孔或結構孔,也就是讓膠層應用在導光片邊緣之外,可能因為膠層的光耦合效果而造成漏光嚴重。如果不利用膠層黏合邊緣,讓導光片孔壁直接出光又可能造成漏光嚴重。換言之,膠層位置與光學元件之間必須予以優化搭配,才能降低在散熱孔或結構孔的漏光。In contrast, whether the adhesive layer is used in the heat dissipation holes or structural holes (closed holes or open holes), the setting position and the matching design of the optical elements (light absorption/reflection/total reflection/diffusion/refraction, etc.), and the location near the light source Different changes and effects occur when the glue layer is used. For example, if the light shielding sheet and reflector/light panel of the backlight module are bonded to the heat dissipation holes or structural holes, that is, if the adhesive layer is applied outside the edge of the light guide sheet, serious light leakage may occur due to the optical coupling effect of the adhesive layer. If the edges are not bonded with an adhesive layer, allowing light to escape directly from the hole wall of the light guide plate may cause serious light leakage. In other words, the position of the adhesive layer and the optical components must be optimized to reduce light leakage in the heat dissipation holes or structural holes.
請參考圖1A,圖1A為本發明一實施例之發光鍵盤之堆疊示意圖。於一實施例中,本發明之發光鍵盤KB包括複數按鍵KS(如方鍵SK或倍數鍵MK)與背光模組BL,其中每個按鍵KS包括鍵帽12、升降機構14、一部分的開關電路層16、復位件18與一部分的底板10;對發光鍵盤KB而言,背光模組BL包括遮光片210、導光片220與驅動電路板240,而驅動電路板240還可包括反射層230及發光件250設置於其上。Please refer to FIG. 1A , which is a stacking diagram of a light-emitting keyboard according to an embodiment of the present invention. In one embodiment, the luminous keyboard KB of the present invention includes a plurality of keys KS (such as square keys SK or multiple keys MK) and a backlight module BL, wherein each key KS includes a
請參考圖1B及圖2,圖1B為本發明一實施例之發光按鍵結構之爆炸示意圖;圖2為本發明一實施例之發光按鍵結構之剖面示意圖。就單鍵範圍的整體架構,於一實施例,本發明之發光按鍵結構1包含底板10、鍵帽12、升降機構14、開關電路層16、復位件18、遮光片210、導光片220、反射層230、驅動電路板240及發光件250。鍵帽12設置於底板10上方,並具有可透光部122(例如一或多個透光字符)。升降機構14連接於底板10及鍵帽12之間,以支撐鍵帽12相對於底板10上/下移動。開關電路層16設置於鍵帽12下方,且較佳位於底板10上。開關電路層16具有開關162(於圖1B以圓圈表示)。開關電路層16具有多層結構,開關電路形成於其中的一層或多層,且鍵帽12被按壓時,開關電路層16的開關162會被導通。復位件18設置於鍵帽12及底板10之間,用以提供回復力,以使鍵帽12被按壓後可相對於底板10向上移動回復至未按壓前的位置。於此實施例,復位件18可實施為彈性體(rubber dome)且對應開關162設置。鍵帽12被按壓向下移動以擠壓復位件18時,復位件18可觸發開關162,但不以此為限。開關162可由觸發部所觸發,且觸發部可設置於復位件18、升降機構14或鍵帽12等。依據實際應用,復位件18可實施為任何可提供回復力以驅使鍵帽12被按壓後復位的元件,例如彈簧、磁性件等,且發光按鍵結構1的開關不限於開關電路層16形式的開關162,可因應鍵帽12的按壓而被觸發的任何合宜開關皆適用於本發明,例如機械開關、磁性開關、光開關等。於此實施例,升降機構14實施為剪刀腳升降機構,其具有相互樞接的兩個支架,且各支架的兩端分別可活動地連接底板10及鍵帽12,但不以此為限。依據實際應用,升降機構14可實施為蝴蝶式升降機構、懸臂式升降機構等。以上由底板10、鍵帽12、升降機構14、開關電路層16及復位件18構成為發光按鍵結構1的按鍵單元。Please refer to FIG. 1B and FIG. 2 . FIG. 1B is an exploded schematic diagram of the luminous button structure according to one embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the luminous button structure according to one embodiment of the present invention. Regarding the overall structure of the single-key range, in one embodiment, the luminous
如圖2所示,遮光片210設置於底板10下方,且遮光片210較佳具有第一塗層212及第二塗層214。第一塗層212用以實質反射光線(例如發光件250所發射的光線),第二塗層214用以實質遮擋光線。導光片220設置於遮光片210相對於底板10之另一側(例如下側),且導光片220具有光源孔222對應底板10的中央孔102。反射層230設置於導光片220相對於遮光片210之另一側(例如下側),且反射層230具有開口232與光源孔222連通。發光件250藉由黏著層252固定於驅動電路板240並與驅動電路板240的光源電路電連接。黏著層252可為僅用於將發光件250固定於驅動電路板240的非導電膠層,並非將發光件250固定並電連接驅動電路板240的錫膏或其他導電層。驅動電路板240設置於導光片220的下方,使得發光件250可由反射層230的開口232下方伸入進而位於導光片220的光源孔222中。於一實施例,發光件250可為微型發光二極體,其可具有五面發光的光型,例如主要為頂面發光(例如80%的光自頂面射出),其餘光線係自四個側面出光,但不以此為限。以上由遮光片210、導光片220、反射層230、驅動電路板240及發光件250構成為發光按鍵結構1的背光單元(或模組)。此外,黏著層252可以為可透光,且反射層230的一部份環繞發光件250設在光源孔222內,使反射的光線可經由黏著層252及/或光源孔222內的反射層230,而由光源孔222之孔壁進入導光片220側向傳遞。As shown in FIG. 2 , the light-shielding
請參考圖3及圖3A至圖3D,其中圖3為本發明一實施例之發光按鍵結構之部分元件(例如底板10、遮光片210、導光片220、驅動電路板240(含反射層230))之堆疊的平面示意圖,且圖3A至圖3D為圖3之各元件之平面示意圖。如圖3及圖3A所示,底板10可由金屬板件沖壓製成,使得底板10具有彼此連接的複數肋部(例如內肋104、橋接肋106及周邊肋108)進而定義複數孔洞(例如中央孔102及周邊孔102’)。具體而言,底板10的周邊肋108設置於底板10的最外圍,且周邊肋108可為框形肋或為複數肋首尾相互連接成環狀,以使得底板10具有框形架構,但不限於此。當複數按鍵整合於鍵盤時,各按鍵的底板10可藉由周邊肋108相互連接而形成單一底板。內肋104設置於底板10的中央或中央附近,用以定義中央孔102,使得內肋104包圍中央孔102,且中央孔102實質對應鍵帽12的中央或中央附近;複數橋接肋106用以連接內肋104及周邊肋108,並於內肋104及周邊肋108之間定義複數周邊孔102’,使得周邊孔102’實質對應鍵帽12的周圍部分或角落部分。中央孔102及周邊孔102’係容許發光件250發射的光線通過,以照射鍵帽12而自可透光部122射出。Please refer to FIG. 3 and FIG. 3A to FIG. 3D. FIG. 3 shows some components of the light-emitting key structure (such as the
具體而言,如圖3及圖3B所示,遮光片210為可透光的膜片(例如對苯二甲酸酯(PET)),且膜片上具有遮光材料形成的第一塗層212及第二塗層214。於此實施例,第一塗層212及第二塗層214具有不同的光穿透率,使得第一塗層212可反射大部分的光,且可能容許小部分的光通過或吸收小部分的光,而第二塗層214實質遮擋或吸收大部分的光,且可能容許小部分的光通過或反射小部分的光。舉例而言,第一塗層212可為白油墨層,第二塗層214可為黑油墨層,且各可藉由例如印刷方式形成,但不以此為限。再者,第二塗層214較第一塗層212更接近底板10(即第一塗層212較第二塗層214接近導光片220),使得向上照射的光線先大部分被第一塗層212反射,而通過第一塗層212的少部分光線再被第二塗層214吸收,藉此有效將光線從垂直向上的方向引導成橫向傳遞。於一實施例,如圖2所示,第一塗層212及第二塗層214較佳設置於遮光片210的不同面,例如第一塗層212設置於遮光片210的下表面(即接近導光片220的一側),且第二塗層214設置於遮光片210的上表面(即接近底板10的一側),但不以此為限。於另一實施例(未繪示),第一塗層212及第二塗層214可設置於遮光片210的同一面,例如第一塗層212設置於遮光片210的上表面,且第二塗層214設置於遮光片210的上表面及/或第一塗層212的上表面上;或者,第二塗層214設置於遮光片210的下表面,且第一塗層212設置於遮光片210的下表面及/或第二塗層214的下表面上,藉此亦可使得向上行進的光線先大部分被第一塗層212反射,而通過第一塗層212的少部分光線再被第二塗層214吸收。Specifically, as shown in FIG. 3 and FIG. 3B , the light-shielding
在此須注意,在以下圖式中(例如圖3、圖3B、圖4、圖5或圖7中,左斜影線所示的區域為第一塗層212(或212’)所設置的區域,右斜影線所示的區域為第二塗層214所設置的區域。當一個區域同時呈現左斜影線及右斜影線則表示該區域中第一塗層212(或212’)及第二塗層214重疊設置,且第一塗層212較第二塗層214更接近導光片220。It should be noted here that in the following figures (for example, FIG. 3 , FIG. 3B , FIG. 4 , FIG. 5 or FIG. 7 ), the area indicated by the left oblique hatch is the area where the first coating 212 (or 212 ′) is provided. , the area shown by the right oblique hatch is the area where the
於一實施例,第一塗層212及第二塗層214係對應中央孔102設置,使得第一塗層212於底板10之垂直投影較佳與中央孔102重疊且延伸至內肋104,而第二塗層214於底板10之垂直投影較佳位於中央孔102之範圍內。舉例而言,第一塗層212較佳具有第一中央塗層部212a,而第二塗層214較佳具有第二中央塗層部214a,且第一中央塗層部212a及第二中央塗層部214a較佳彼此重疊且與底板10的中央孔102對應。如圖3及圖3B所示,以圓形的中央孔102為例,第一中央塗層部212a的直徑較佳大於中央孔102的直徑,且中央孔102較佳大於第二中央塗層部214a的直徑。在實際應用中,第一塗層212及第二塗層214可具有對應底板10的肋部的圖案,使得底板10與遮光片210上下疊置時,遮光片210的可透光區218(即可透光膜片未設置第一塗層212及第二塗層214的部分)的形狀較佳與底板10的周邊孔102’實質相同。如圖3B所示,第二塗層214除了具有位於中央孔102內之第二中央塗層部214a外,還可具有與底板10的周邊肋108部分對應的部分。第一塗層212除了具有覆蓋於中央孔102正上方之第一中央塗層部212a外,還具有與底板10的周邊肋108、橋接肋106及內肋104對應(或重疊)的部分,以界定形狀、數目與周邊孔102’對應的可透光區218,但不以此為限。依據實際應用,第一塗層212(或第二塗層214)於底板10之垂直投影較佳更與至少一橋接肋部106重疊,但不以此為限。如圖4所示,於另一實施例,遮光片210’的第二塗層214的配置與圖3B類似,即第二塗層214包含位於中央孔102內之第二中央塗層部214a及對應周邊肋108的部分。於圖4之實施例中,第一塗層212’包含上述的第一中央塗層部212a及對應周邊肋108的部分,使得可透光區218’為一個連續區域,其於底板10的垂直投影涵蓋橋接肋106及周邊孔102’。如圖所示,第一塗層212’對應周邊肋108的部分較佳較第二塗層214對應周邊肋108的部分突出接近中央孔102(即寬度較寬),但不此以為限;於其他實施例,第一塗層212’對應周邊肋108的部分可與第二塗層214對應周邊肋108的部分相同或相對於中央孔102退縮(即寬度較窄)。In one embodiment, the
如圖3及圖3C所示,導光片220可為由任何合宜的光學材料(例如光學聚合物)製成的薄板或薄片,且光源孔222為貫穿導光片220厚度方向(即Z軸方向)的貫孔,使得發光件250可位於光源孔222中,且第一塗層212之第一中央塗層部212a及第二塗層214之第二中央塗層部214a於光源孔222正上方。導光片220還具有複數出光部228,用以破壞全反射讓光線朝向射出。複數出光部228較佳對應周邊孔102’設置,但不以此為限。出光部228可設置於任何需要出光的合宜位置。如圖3C所示,頂膠262設置於導光片220之頂面且位於光源孔222周圍。具體而言,頂膠262用於連接遮光片210及導光片220且位於中央孔102周圍,使得遮光片210、導光片220及發光件250可藉由頂膠262定位,提升光耦合的穩定性。再者,頂膠262可由具有透光性且折射率較空氣接近導光片220的黏著材料形成,使得自第一中央塗層部212a反射的光線,可以較高的比例進入導光片220,進而在導光片220中進行全反射。此外,頂膠262與導光片220之光源孔222之孔緣間具有頂淨空區272,即光源孔222周圍未設置頂膠262的區域。As shown in FIG. 3 and FIG. 3C , the
如圖3及圖3D所示,反射層230相對於遮光片210設置於導光片220之另一側(例如下方),且用以將自導光片220的底面漏出的光反射回到導光片220。具體而言,反射層230可為反射材料形成的反射膜片(例如金屬箔片)、或非反射膜片上塗佈反射材料、或摻雜反光粒子的塑料膜片(例如摻雜反光粒子的PET膜片)所形成之反射片,但不限於此。於一實施例,反射層230可為塗佈於驅動電路板240之上表面的反射塗層,例如白油墨層,且反射層230的反射率較佳大於80%,但不以此為限。反射層230的開口232可為貫穿形成反射層230之膜片的通孔,或者是驅動電路板240之上表面上設置發光件250且未塗佈反射塗層的區域。如圖3D所示,底膠264設置於反射層230之頂面(即導光片220之底面)且位於光源孔222周圍。具體而言,底膠264用於連接導光片220及反射層230且位於中央孔102周圍,使得導光片220、反射層230及發光件250可藉由底膠264定位,提升光耦合的穩定性。再者,底膠264可由具有透光性且折射率較空氣接近導光片220的黏著材料形成,使得自反射層230反射的光線,可以較高的比例進入導光片220,進而在導光片220中進行全反射。再者,頂膠262及底膠264可以相同或不同的黏著材料形成,例如但不限於水膠。此外,底膠264與導光片220之光源孔222(或開口232)之孔緣間具有底淨空區274,即光源孔222周圍未設置底膠264的區域。如圖3D所示,當反射層230為形成於驅動電路板240上表面的反射塗層時,開口232為驅動電路板240上無底膠264、無反射層230的區域,且驅動電路板240上還包含主線路242及子線路244。舉例而言,兩條主線路242分別提供高/低電位,且兩條子線路244分別自兩條主線路242延伸,使得發光件250藉由子線路244電連接至主線路242。再者,反射層230下方可設置有吸光層(未繪示),用以吸收穿透吸光層的少量光線。As shown in FIG. 3 and FIG. 3D , the
再次參考圖2,進一步說明頂膠262、底膠264的布局設計。如圖2所示,頂膠262及底膠264至少其中一個與第一塗層212在底板10、遮光片210、導光片220及反射層230之堆疊方向(例如Z軸方向)上重疊,例如僅頂膠262、僅底膠264、或頂膠262及底膠264兩者在堆疊方向與第一塗層212重疊。於一實施例,如圖所示,頂膠262或底膠264於遮光片210之垂直投影可位於第一塗層212之範圍內。如上所述,頂膠262或底膠264環繞光源孔222設置,使得頂膠262與導光片220之光源孔222之孔緣2222間具有頂淨空區272,且底膠264與導光片220之光源孔222之孔緣2222間具有底淨空區274。於此實施例,頂淨空區272及底淨空區274係分別為導光片220在光源孔222周圍未設置頂膠262的頂面區域及未設置底膠264的底面區域。從另一觀點而言,頂淨空區272及底淨空區274可分別為在導光片220之光源孔222周圍遮光片210未設置頂膠262的下表面區域及反射層230(或驅動電路板240)未設置底膠264的上表面區域。藉此,可避免頂膠262或底膠264進入光源孔222干擾出光,或避免與固定發光件250之黏著層252重疊,增加不必要的堆疊高度。換言之,藉由頂淨空區272及/或底淨空區274的設置,頂膠262及底膠264至少其中一個與固定發光件250之黏著層252在堆疊方向(例如Z軸方向)上不重疊,可有效避免的堆疊高度不必要增加。較佳地,頂膠262及底膠264兩者皆與黏著層252在堆疊方向上不重疊。Referring to Figure 2 again, the layout design of the
於一實施例,底淨空區264較佳大於頂淨空區262,即底膠264與光源孔222的孔源2222之距離大於頂膠262與光源孔222的孔源2222的距離。藉此,避免底膠264、反射層230傳導光線向上出光,以降低光線自中央區域(例如中央孔102)再次出光,並可增加中央回收光線,增加橫向傳遞光線比例。In one embodiment, the
再者,由於第一塗層212之第一中央塗層部212a係與中央孔102重疊且延伸至內肋104並與頂膠262及/或底膠264重疊,使得鄰近光源孔222的頂淨空區272及底淨空區274也與第一中央塗層部212a重疊或進一步與內肋104重疊。換言之,頂膠262及底膠264至少其中一個(較佳為兩者)與第一中央塗層部212a及內肋104在堆疊方向(例如Z軸方向)上重疊,使得淨空區272及底淨空區274也與第一中央塗層部212a重疊。於一實施例,第一塗層212覆蓋於光源孔222正上方之部分(即第一中央塗層部212a)之直徑較佳大於頂膠262之直徑。具體而言,如圖2A所示,第一中央塗層部212a較佳實質完全延伸至內肋104的下方,使得第一中央塗層部212a具有較大的反射面積,以利於將中央的光線橫向導引,但不以此為限。Furthermore, since the first
如圖2所示,導光片220具有複數出光部228,用以將光線導引向上自導光片220射出。舉例而言,複數出光部228設置於導光片220的底面,且較佳與周邊孔102’對應設置。出光部228可為任何合宜的微光學結構,使得光線傳遞至出光部228會向上散射出光。具體而言,複數出光部228於底板10之垂直投影較佳與內肋104不重疊,以形成出光部淨空區226。於此實施例,出光部淨空區226較佳對應內肋104及中央孔102於導光片220的垂直投影範圍。從另一觀點而言,複數出光部228較佳不設置在頂淨空區272及底淨空區274,以降低中央孔102再次出光,並可增加中央回收光線,增加橫向傳遞光線比例。As shown in FIG. 2 , the
請參考圖2及圖2A,進一步說明本發明之發光按鍵結構之光線橫向傳遞及回收。如圖2及2A所示,由於第一塗層212較第二塗層214接近導光片220且覆蓋於光源孔222正上方,發光件250向上朝中央孔102照射的光線碰到第一塗層212(即第一中央塗層部212a)時,因為頂淨空區272的存在,光線的大部分被第一塗層212反射進入導光片220。由於導光片220在出光部淨空區226(例如對應中央孔102及內肋104的區域)未設置出光部228,使得進入導光片220的光線在導光片220中不斷地反射而橫向傳遞。即使部分光線被反射至頂膠262(或底膠264)而向外射出導光片220時,也因為頂膠262(或底膠264)與第一塗層212及反射層230在堆疊方向上相互重疊,使得光線可再次被反射進入導光片220,有效達到光線的回收及橫向傳遞,不僅可降低中央孔102的出光量(即免除鍵帽12中央字符爆亮的問題),也可提升周邊的出光量(即提升發光的均勻性)。此外,設置於中央孔102範圍內的第二塗層214(即第二中央塗層部214a)的大小,可依據中央孔102的出光需求調整,以至少部分遮擋通過第一塗層212的光線,進一步調節發光均勻性。再者,由於出光部228對應周邊孔102’設置且第一塗層212可進一步對應橋接肋106設置,自導光片220向橋接肋106照射的光線,也可被第一塗層212反射再次進入導光片220,進而行進至出光部228而朝周邊孔102’射出。藉此,有效提升周邊孔102’的出光量,增進發光均勻性。Please refer to FIG. 2 and FIG. 2A to further illustrate the lateral transmission and recovery of light in the luminous key structure of the present invention. As shown in FIGS. 2 and 2A , since the
再者,如圖2A所示,反射層230在離發光件250較遠處可增設反射層微結構238,用以將光線導引向上。當反射層微結構238設置於與導光片220之出光部228重疊時,可用以增加出光量。當反射層微結構238設置於與導光片220之非出光部重疊時(例如與底板10的橋接肋106重疊時),可促進光線回收。Furthermore, as shown in FIG. 2A , a
請參考圖5,圖5為本發明另一實施例之發光按鍵結構之部分元件之堆疊的平面示意圖。如圖5所示,發光按鍵結構(或背光模組)更包含至少一邊膠268,且邊膠268較佳沿鍵帽12的側邊設置。複數出光部於遮光片210之垂直投影較佳位於頂膠262及邊膠268之間或者位於底膠264及邊膠268之間。具體而言,出光部位於導光片220及反側層230之間。舉例而言,複數出光部可形成於導光片220下表面之出光部228,或者形成於反射層230之上表面的反射微結構238,用以將光線導引向上。邊膠268可設置於遮光片210與驅動電路板240之間、於遮光片210與導光片220之間、驅動電路板240與導光片220之間、及/或遮光片210與反射層230之間,用以加強元件間的黏著性。於此實施例,邊膠268較佳平行鍵帽12的側邊設置,且邊膠268位於鍵帽12之垂直投影的外側,但不以此為限。Please refer to FIG. 5 , which is a schematic plan view of the stacking of some components of a light-emitting key structure according to another embodiment of the present invention. As shown in FIG. 5 , the luminous key structure (or backlight module) further includes at least one side of
請參考圖6及圖7,圖6為本發明另一實施例之發光按鍵結構之剖面示意圖,且圖7為本發明另一實施例之發光按鍵結構之部分元件之堆疊的平面示意圖。如圖6及圖7所示,發光按鍵結構更具有通孔103。通孔103貫穿底板10、遮光片210、導光片220、反射層230及驅動電路板240,以作為發光按鍵結構的散熱孔或定位孔。對應於通孔103的設置,發光按鍵結構更包含通孔頂膠262a及通孔底膠264a。通孔頂膠262a設置於導光片220之上且位於通孔103周圍。通孔底膠264a設置於導光片220之下且位於通孔103周圍。舉例而言,通孔103較佳設置於鄰近鍵帽12的外側,或是設置於相鄰按鍵之間的鍵隙區中。第一塗層212(例如第一周邊塗層部212b)及第二塗層214(例如第二周邊塗層部214b)圍繞通孔103設置,且第一塗層212較第二塗層214自通孔103向內退縮以形成調節區216。Please refer to FIGS. 6 and 7 . FIG. 6 is a schematic cross-sectional view of a light-emitting key structure according to another embodiment of the present invention, and FIG. 7 is a schematic plan view of stacking some components of the light-emitting key structure according to another embodiment of the present invention. As shown in FIG. 6 and FIG. 7 , the light-emitting key structure further has a through
具體而言,第一塗層212可包含第一中央塗層部212a及第一周邊塗層部212b,並可藉由同一印刷製程形成於遮光片210下表面分別對應中央孔102及通孔103的位置。第二塗層214可包含第二中央塗層部214a及第二周邊塗層部214b,並可藉由同一印刷製程形成於遮光片210上表面分別對應中央孔102及通孔103的位置,但不以此為限。第二周邊塗層部214b較佳延伸至通孔103的孔緣。如圖7所示,第二周邊塗層部214b的孔緣214b1與通孔103的孔緣一致。第一周邊塗層部212b與遮光片210於通孔103的孔緣之間具有間隙,以形成調節區216。如圖7所示,第一周邊塗層部212b的孔緣212b1與通孔103的孔緣(或第二周邊塗層部214b的孔緣214b1)之間具有間隙,且第一周邊塗層部212b更相對於通孔103於底板10之孔緣105內縮。換言之,第一周邊塗層部212b並未延伸至通孔103的孔緣,也未延伸至底板10之孔緣105(即未設置於調節區216),使得第二周邊塗層部214b較第一周邊塗層部212b朝通孔103方向突出,即第二周邊塗層部214b的孔徑小於第一周邊塗層部212b的孔徑。藉此,未設置第一周邊塗層部212b的調節區216減少將光線反射再次進入通孔103的機會,且第二周邊塗層部214b可遮擋自調節區216向上射出的光線,以降低通孔103的漏光。再者,發光按鍵結構可選擇性包含第三塗層(未繪示),其中第三塗層設置於調節區216,且用以實質遮擋或吸收光線。具體而言,依據實際需求,調節區216可設置穿透率較低的第三塗層,以減少通過調節區216向上射出的光線,進一步降低通孔103的漏光。第三塗層的光穿透率較佳小於第一塗層212的光穿透率,且第三塗層可與第二塗層214為相同或不同的遮光材料。舉例而言,第三塗層可為黑油墨層。類似地,反射層230亦可相對於通孔103的孔緣退縮,使得反射層230與通孔103的孔緣之間形成調節區234。調節區234可設置反射率較低(或吸光率較高)的第四塗層(未繪示),以減少被調節區234向上反射的光線,並減少光線側斜向反射前進,進一步降低通孔103的漏光。第四塗層的反射率較佳小於反射層230的反射率,且第四塗層可與第二塗層214為相同或不同的遮光材料。舉例而言,第四塗層可為黑油墨層。藉此,未設置反射層230(或設置第四塗層)的調節區234減少將光線反射再次進入通孔103的機會,以降低通孔103的漏光。不過,第四塗層也可以是驅動電路板240背側(底側)的吸光包材(例如包覆層280),因為反射層230退縮的調節區234而向上顯露並吸光;或者,調節區234不需要源自反射層230的退縮,第四塗層直接設置在反射層230上圍繞通孔103,也可形成吸光的調節區234。換言之,第四塗層不論是位在反射層230或驅動電路板240上,都可以降低漏光問題。甚至,如有必要,遮光片210與驅動電路板240二者在通孔103周圍的孔緣可透過通孔膠(未顯示)彼此黏著於通孔103內。Specifically, the
通孔頂膠262a及通孔底膠264a至少其中一個在堆疊方向(例如Z軸方向)上與第一塗層212(例如第一周邊塗層部212b)重疊,且通孔頂膠262a及通孔底膠264a與導光片220於通孔103之孔緣間較佳分別具有頂通孔淨空區276及底通孔淨空區278。具體而言,通孔頂膠262a及通孔底膠264a設置於通孔103周圍,可引導特定比例的光線改為垂直方向傳導,降低從通孔103漏光的光量。再者,第一塗層212(即第一周邊塗層部212b)於導光片220的垂直投影較佳完全覆蓋通孔頂膠262a(及通孔底膠264a),且通孔頂膠262a(及通孔底膠264a)較佳是完全落在第一塗層212(即第一周邊塗層部212b)與第二塗層214(即第二周邊塗層部214b)的垂直投影內。藉此,可有效降低光線經通孔頂膠262a(及通孔底膠264a)進入通孔103的光量,有效降低通孔103的漏光。At least one of the through-
頂通孔淨空區276及底通孔淨空區278係分別為導光片220在通孔103周圍未設置通孔頂膠262a的頂面區域及未設置通孔底膠264a的底面區域,且頂通孔淨空區276及底通孔淨空區278較佳在堆疊方向(例如Z軸方向)上相互對應。藉此,可避免通孔頂膠262a或通孔底膠264a進入通孔103干擾散熱或定位,也可降低光線經通孔頂膠262a(及通孔底膠264a)進入通孔103的光量,有效降低通孔103的漏光。於一實施例,頂通孔淨空區276及底通孔淨空區278可選擇性設置反射率較低(或吸光率較高)的第五塗層(未繪示),以減少光線進入通孔103的機會,進一步降低通孔103的漏光。第五塗層可與第二塗層214為相同或不同的遮光材料。舉例而言,第五塗層可為黑油墨層。The top through-
如圖6所示,於此實施例,發光按鍵結構可更包含包覆層280。包覆層280設置於驅動電路板240下方,且延伸至通孔103的投影範圍。包覆層280可平面延伸至少局部覆蓋於通孔103下方,且可藉由加工而局部伸入通孔103中。包覆層280較佳具有較高的光吸收率,以吸收通孔103中的光線,降低通孔103的漏光。於一實施例,包覆層280可伸入通孔103中,且進一步與第二塗層214(即第二周邊塗層部214b)相互接合或黏合。於一實施例,第二周邊塗層部214b的孔徑(例如孔緣214b1在X軸方向上的長度)較佳小於通孔103位於底板10的孔徑(例如孔緣105在X軸方向上的長度)、小於通孔103位於導光片220的孔徑、並小於通孔103位於驅動電路板240的孔徑。對應通孔103,包覆層280的孔徑較佳小於通孔103位於底板10的孔徑(例如孔緣105在X軸方向上的長度)、小於通孔103位於導光片220的孔徑、小於通孔103位於驅動電路板240的孔徑、並小於通孔103位於反射層230的孔徑。As shown in FIG. 6 , in this embodiment, the light-emitting key structure may further include a
在此須注意,當本發明之發光按鍵結構應用於鍵帽字符落在四周角落的狀況時,只需少量或甚至不需要發光件250直接向上出光,底板10的中央孔102的尺寸可縮減或甚至可不開設中央孔102,但不以此為限。於另一實施例,可增加遮光片210的第一塗層212覆蓋於發光件250正上方的部分(即第一中央塗層部212a)的尺寸,或第一塗層212採用金屬層,以提高反射率,進而增加光線橫向傳遞的光量,提升鍵帽周邊(即四周角落)的亮度。It should be noted here that when the light-emitting key structure of the present invention is applied to the situation where the keycap characters are located in the surrounding corners, only a small amount or even no need for the light-emitting
圖8A至圖8D為本發明一實施例之膠層布局之平面示意圖,其中右斜影線表示頂膠262的塗佈區域,且左斜影線表示底膠264的塗佈區域。如圖8A所示,於第一實施例,頂膠262及底膠264皆具有環繞光源孔222的封閉式環形塗佈區。如圖8B所示,於第二實施例,頂膠262具有環繞光源孔222的封閉式環形塗佈區,且底膠264具有局部環繞光源孔222的開放式環形塗佈區。舉例而言,在扇形區263中,僅於導光片220的頂面設置頂膠262,而於導光片220的底面不設置底膠264。如圖8C所示,於第三實施例,頂膠262具有環繞光源孔222的封閉式環形塗佈區,且底膠264具有局部環繞光源孔222的開放式環形塗佈區,並在對應開放式環形塗佈區的開放處具有局部塗佈區。舉例而言,在扇形區263中,僅於導光片220的頂面設置頂膠262,而於導光片220的底面不設置底膠264,且在與扇形區263至少局部重疊的補強區266中,進一步於導光片220的底面設置底膠264。如圖8D所示,於第四實施例,頂膠262及底膠264皆具有環繞光源孔222的封閉式環形塗佈區,其中頂膠262與光源孔222的孔緣之間具有無膠的頂淨空區272,且底膠264與光源孔222的孔緣之間具有無膠的底淨空區274。8A to 8D are schematic plan views of the glue layer layout according to an embodiment of the present invention, in which the right oblique hatching represents the coating area of the
本發明已由上述實施例加以描述,然而上述實施例僅為例示目的而非用於限制。熟此技藝者當知在不悖離本發明精神下,於此特別說明的實施例可有例示實施例的其他修改。因此,本發明範疇亦涵蓋此類修改且僅由所附申請專利範圍限制。The present invention has been described by the above-mentioned embodiments. However, the above-mentioned embodiments are only for illustrative purposes and not for limitation. Those skilled in the art will appreciate that other modifications of the illustrated embodiments may be made to the embodiments specifically described herein without departing from the spirit of the invention. Accordingly, the scope of the present invention also encompasses such modifications and is limited only by the scope of the appended claims.
1:發光按鍵結構 10:底板 102:中央孔 102’:周邊孔 103:通孔 105:孔緣 104:內肋 106:橋接肋 108:周邊肋 12:鍵帽 122:可透光部 14:升降機構 16:開關電路層 162:開關 18:復位件 210、210’:遮光片 212、212’:第一塗層 212a:第一中央塗層部 212b:第一周邊塗層部 212b1:孔緣 214:第二塗層 214a:第二中央塗層部 214b:第二周邊塗層部 214b1:孔緣 216:調節區 218、218’:可透光區 220:導光片 222:光源孔 2222:孔緣 226:出光部淨空區 228:出光部 230:反射層 232:開口 234:調節區 238:反射層微結構 240:驅動電路板 242:主線路 244:子線路 250:發光件 252:黏著層 262:頂膠 262a:通孔頂膠 263:扇形區 264:底膠 264a:通孔底膠 266:補強區 268:邊膠 272:頂淨空區 274:底淨空區 276:頂通孔淨空區 278:底通孔淨空區 280:包覆層 BL:背光模組 KB:發光鍵盤 KS:按鍵 SK:方鍵 MK:倍數鍵 1: Illuminated button structure 10: Bottom plate 102:Central hole 102’: Peripheral hole 103:Through hole 105: Kong Yuan 104:Inner ribs 106:Bridge rib 108: Peripheral ribs 12:Keycap 122: Translucent part 14:Lifting mechanism 16: Switch circuit layer 162: switch 18:Reset piece 210, 210’: shading film 212, 212’: first coating 212a: First central coating section 212b: First peripheral coating part 212b1: hole edge 214: Second coating 214a: Second central coating section 214b: Second peripheral coating part 214b1: hole edge 216:Adjustment area 218, 218’: Translucent area 220:Light guide sheet 222:Light source hole 2222: hole edge 226: Clearance area of light output part 228: Light department 230: Reflective layer 232:Open your mouth 234:Adjustment area 238: Reflective layer microstructure 240:Driver circuit board 242: Main line 244:Subline 250:Lighting parts 252:Adhesive layer 262: Top glue 262a: Through-hole top glue 263: sector area 264: Primer 264a: Through-hole primer 266: Reinforcement area 268:Edge glue 272: Top clearance area 274: Bottom clearance area 276: Clearance area of top through hole 278: Bottom through hole clearance area 280: Cladding BL: Backlight module KB: Illuminated Keyboard KS: button SK: square key MK: multiple key
圖1A為本發明一實施例之發光鍵盤之堆疊示意圖。 圖1B為本發明一實施例之發光按鍵結構之爆炸示意圖。 圖2為本發明一實施例之發光按鍵結構之剖面示意圖。 圖2A為本發明一實施例之發光按鍵結構之光線傳遞之示意圖。 圖3為本發明一實施例之發光按鍵結構之部分元件之堆疊的平面示意圖。 圖3A至圖3D為圖3之各元件之平面示意圖。 圖4為本發明另一實施例之遮光片之平面示意圖。 圖5為本發明另一實施例之發光按鍵結構之部分元件之堆疊的平面示意圖。 圖6為本發明另一實施例之發光按鍵結構之剖面示意圖。 圖7為本發明另一實施例之發光按鍵結構之部分元件之堆疊的平面示意圖。 圖8A至圖8D為本發明一實施例之膠層布局之平面示意圖。 FIG. 1A is a schematic diagram of a stack of light-emitting keyboards according to an embodiment of the present invention. FIG. 1B is an exploded schematic diagram of a light-emitting key structure according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of a light-emitting key structure according to an embodiment of the present invention. FIG. 2A is a schematic diagram of light transmission of a light-emitting key structure according to an embodiment of the present invention. 3 is a schematic plan view of the stacking of some components of the light-emitting key structure according to an embodiment of the present invention. 3A to 3D are schematic plan views of various components of FIG. 3 . FIG. 4 is a schematic plan view of a light-shielding sheet according to another embodiment of the present invention. 5 is a schematic plan view of the stacking of some components of a light-emitting key structure according to another embodiment of the present invention. FIG. 6 is a schematic cross-sectional view of a light-emitting key structure according to another embodiment of the present invention. 7 is a schematic plan view of the stacking of some components of a light-emitting key structure according to another embodiment of the present invention. 8A to 8D are schematic plan views of the glue layer layout according to an embodiment of the present invention.
10:底板 10: Bottom plate
102:中央孔 102:Central hole
102’:周邊孔 102’: Peripheral hole
104:內肋 104:Inner ribs
106:橋接肋 106:Bridge rib
108:周邊肋 108: Peripheral ribs
12:鍵帽 12:Keycap
122:可透光部 122: Translucent part
14:升降機構 14:Lifting mechanism
16:開關電路層 16: Switch circuit layer
162:開關 162: switch
18:復位件 18:Reset piece
210:遮光片 210:shading film
212:第一塗層 212: First coating
214:第二塗層 214: Second coating
220:導光片 220:Light guide sheet
222:光源孔 222:Light source hole
2222:孔緣 2222: hole edge
226:出光部淨空區 226: Clearance area of light output part
228:出光部 228: Light department
230:反射層 230: Reflective layer
232:開口 232:Open your mouth
240:驅動電路板 240:Driver circuit board
250:發光件 250:Lighting parts
252:黏著層 252:Adhesive layer
262:頂膠 262: Top glue
264:底膠 264: Primer
272:頂淨空區 272: Top clearance area
274:底淨空區 274: Bottom clearance area
Claims (25)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN202320663637.3U CN220041671U (en) | 2022-03-31 | 2023-03-29 | Backlight module and luminous button structure |
US18/192,848 US11947150B2 (en) | 2022-03-31 | 2023-03-30 | Backlit module and illuminated keyswitch structure |
US18/592,794 US12204135B2 (en) | 2022-03-31 | 2024-03-01 | Backlit module and illuminated keyswitch structure |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US202263325623P | 2022-03-31 | 2022-03-31 | |
US63/325,623 | 2022-03-31 | ||
CN202210556007.6A CN114999851A (en) | 2022-05-19 | 2022-05-19 | Key backlight structure and light-emitting key structure |
US202263368272P | 2022-07-13 | 2022-07-13 | |
US63/368,272 | 2022-07-13 |
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TW112108773A TWI846373B (en) | 2022-03-31 | 2023-03-09 | Backlit module and illuminated keyswitch structure |
TW112109798A TWI852409B (en) | 2022-03-31 | 2023-03-16 | Backlight keyswitch and backlight module thereof |
TW112111307A TWI859784B (en) | 2021-08-25 | 2023-03-25 | Illuminant circuit board, backlight moudule nad lightingkeyboard |
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TW112109798A TWI852409B (en) | 2022-03-31 | 2023-03-16 | Backlight keyswitch and backlight module thereof |
TW112111307A TWI859784B (en) | 2021-08-25 | 2023-03-25 | Illuminant circuit board, backlight moudule nad lightingkeyboard |
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Cited By (1)
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TWI871920B (en) * | 2024-02-17 | 2025-02-01 | 宏碁股份有限公司 | Key structure of keyboard |
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TWI866759B (en) * | 2024-01-26 | 2024-12-11 | 群光電能科技股份有限公司 | Backlight module for keyboard |
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TWM460297U (en) * | 2013-01-22 | 2013-08-21 | Darfon Electronics Corp | Back light structure and keyboard with back light |
CN105321758B (en) * | 2014-05-28 | 2017-10-13 | 群光电能科技股份有限公司 | structure of keyboard backlight module |
CN105118722B (en) * | 2015-07-22 | 2017-07-25 | 苏州达方电子有限公司 | Luminous module and luminous keyboard |
US20170186571A1 (en) * | 2015-12-24 | 2017-06-29 | Jiangsu Transimage Technology Co., Ltd | Backlight keyboard |
TWI665703B (en) * | 2017-09-19 | 2019-07-11 | 達方電子股份有限公司 | Backlight apparatus used in illuminated keyboard |
CN107768171A (en) * | 2017-09-29 | 2018-03-06 | 苏州达方电子有限公司 | Back lighting device for illuminated keyboard |
CN110794505B (en) * | 2018-08-01 | 2020-11-17 | 光宝电子(广州)有限公司 | Light guide plate and input device |
TWI681431B (en) * | 2018-08-13 | 2020-01-01 | 群光電子股份有限公司 | Illuminated keyboard |
CN211555751U (en) * | 2019-05-20 | 2020-09-22 | 光宝电子(广州)有限公司 | Shear piece and key structure |
TWI697021B (en) * | 2019-09-12 | 2020-06-21 | 群光電能科技股份有限公司 | Illuminated keyboard and backlight module thereof |
TWI725894B (en) * | 2020-07-13 | 2021-04-21 | 達方電子股份有限公司 | Backlight module and lighting keyboard |
TWM606487U (en) * | 2020-09-17 | 2021-01-11 | 華碩電腦股份有限公司 | Illuminated keyboard |
CN114256017B (en) * | 2020-09-24 | 2024-09-20 | 淮安达方电子有限公司 | Backlight module and illuminated keyboard |
TWI742907B (en) * | 2020-11-03 | 2021-10-11 | 達方電子股份有限公司 | Backlight apparatus used in illuminated keyboard |
CN217690911U (en) * | 2022-05-19 | 2022-10-28 | 淮安达方电子有限公司 | Key backlight structure and luminous key structure |
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TWI871920B (en) * | 2024-02-17 | 2025-02-01 | 宏碁股份有限公司 | Key structure of keyboard |
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TWI852409B (en) | 2024-08-11 |
CN114999851A (en) | 2022-09-02 |
TW202341205A (en) | 2023-10-16 |
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TWI859784B (en) | 2024-10-21 |
TWI846373B (en) | 2024-06-21 |
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