TW202335144A - Wafer conveying device and method for automatically adjusting pressure and flow - Google Patents

Abstract

The invention relates to a wafer conveying device and method for automatically adjusting pressure and flow. The main structure includes a driving component. The driving component is provided with a wafer pick-and-place component, a wafer information recording component, and a suction state adjustment component. , the wafer pick-and-place component is provided with at least one suction component. Through this, the user can first receive and record the relevant data of the wafer through the wafer information recording component, and use this relevant data to let the suction state adjustment component adjust and control the suction state of the suction component, so as to use the suction component to suck the wafer. This is to prevent the flow rate or pressure from being inaccurate when sucking the wafer due to different states of the wafer.

Description

Wafer transport device and method for automatically adjusting pressure and flow rate

The present invention provides a wafer transport device and a method that can automatically adjust the suction force according to the wafer and automatically adjust the pressure and flow rate.

According to reports, in the semiconductor industry, wafers are a very important product. The so-called wafers are thin slices of cylindrical semiconductor crystals, which are mainly used as carrier substrates in integrated circuits.

Since the technology of integrated circuits is quite sophisticated, the related manufacturing tools and production tools are also very particular. If slight errors occur during the manufacturing process, it may have a considerable impact on the final product.

In addition to the need to pay attention during manufacturing and production, transportation, inspection, and movement are also parts that require considerable attention. If there are no errors during manufacturing, but crystals are caused during transportation, inspection, and movement, Damage to the wafer will also cause undesirable conditions for the wafer. For example, during the movement, the wafer may be displaced, scratched or even dropped due to insufficient suction force, or the suction force may be too strong. , leading to surface damage or breakage of the wafer.

And because wafers may have different weights, warps, and thicknesses due to manufacturing requirements or acceptable errors during manufacturing, the same suction process is applied to wafers with different weights, warps, and thicknesses. If the force is used to absorb and drive, the above situation is more likely to occur.

Therefore, how to solve the above conventional problems and deficiencies is an urgent research and improvement direction that the applicant of the present invention and related manufacturers engaged in this industry want to research and improve.

Therefore, in view of the above shortcomings, the inventor of the present invention collected relevant information, evaluated and considered many aspects, and used his many years of experience in this industry, and through continuous trials and modifications, he designed such a device that can automatically adjust the suction pressure. He is also the inventor and patentee of a wafer conveying device and method for automatically adjusting pressure and flow.

The main purpose of the present invention is to receive the wafer data through the wafer information recording component, and use the suction state adjustment component to change the pressure and flow rate during suction according to the wafer data.

In order to achieve the above object, the main structure of the present invention includes: a driving component, a wafer picking and placing component provided on the driving component, a suction component provided on the wafer picking and placing component, and a wafer pick-up and placing component provided on the driving component. a circular information recording component, and a suction state adjusting component provided on the driving component.

With the above structure, before the driving component drives the wafer, the wafer information recording component can first receive and record the relevant data of the wafer, and the suction state adjustment component will adjust and control the suction component based on this data. The pressure and flow rate are adjusted to achieve the effect of adjusting the suction force.

In this way, the driving component can drive the wafer pick-and-place component to move to the wafer, and the suction state adjustment component can control the movement of the suction component to suck and fix the wafer, thereby allowing the driving component to drive the wafer to move to the desired location. at the required location.

And because this case automatically adjusts the suction force of the suction component according to the relevant data of the wafer, it can accommodate wafers of various sizes (weight, warpage, and thickness), thereby reducing the chance of damage to the wafer. .

Through the above technology, the problem that the conventional wafer transport device cannot change the suction force, which may cause damage to the wafer, can be overcome, and the practical advancement of the above advantages can be achieved.

1: Drive components

11:Lifting driving mechanism

12: Horizontal driving mechanism

2: Wafer pick and place components

3: Pick up components

4: Wafer information recording component

5: Absorption status adjustment component

51:Data processing components

52: Suction volume adjustment component

6: Wafer status detection component

The first figure is a three-dimensional perspective view of a preferred embodiment of the present invention.

The second figure is a schematic structural block diagram of a preferred embodiment of the present invention.

The third figure is a step flow chart of a preferred embodiment of the present invention.

The fourth figure is a schematic diagram of information reception according to the preferred embodiment of the present invention.

The fifth figure is a schematic diagram of the suction of the preferred embodiment of the present invention.

Figure 6 is a schematic diagram of the movement of the preferred embodiment of the present invention.

The seventh figure is a perspective view of yet another preferred embodiment of the present invention.

Figure 8 is a perspective view of another preferred embodiment of the present invention.

In order to achieve the above-mentioned objects and effects, the technical means and structures adopted by the present invention are described in detail below with respect to the preferred embodiments of the present invention, so as to facilitate a complete understanding.

Please refer to the first to sixth figures, which are three-dimensional perspective views to moving schematic diagrams of preferred embodiments of the present invention. It can be clearly seen from the figures that the present invention includes:

A driving assembly 1, the driving assembly 1 has a lifting driving mechanism 11 and a horizontal driving mechanism 12 connected to the lifting driving mechanism 11;

A wafer pick-and-place component 2 provided on the driving assembly 1. The wafer pick-and-place component 2 in this embodiment takes a receiving tray provided on the horizontal driving mechanism 12 as an example;

A plurality of suction components 3 are provided on the wafer pick-and-place component 2. The suction component 3 in this embodiment uses a suction nozzle as an example;

A wafer information recording component 4 provided on the driving component 1. The wafer information recording component 4 described in this embodiment takes the processor provided in the driving component 1 as an example; and

A suction state adjustment component 5 is provided on the driving component 1 and is connected to the suction component 3 and the wafer information recording component 4. The suction state adjustment component 5 has a data processing component 51 and an information connection with the data processing component 51 As for the suction volume adjusting component 52, the data processing component 51 also takes a processor as an example, and the suction volume adjusting component 52 is one of a flow control valve or a pressure proportional valve.

Through the above description, the structure of this technology can be understood. According to the corresponding cooperation of this structure, the advantage of automatically adjusting the pressure and flow rate according to the condition of the wafer can be achieved. The detailed explanation will be explained below.

The wafer transportation method of the present invention that automatically adjusts pressure and flow rate is as follows:

(a) Use one of the wafer information recording elements 4 in the driving assembly 1 to receive the relevant data of the wafer;

(b) The driving component 1 drives a wafer pick-and-place component 2 to move to the wafer;

(c) The wafer information recording element 4 allows a suction state adjustment component 5 to adjust and control the suction states of the plurality of suction components 3 through the relevant data of the wafer to absorb the wafer; and

(d) The driving component 1 drives the wafer pick-and-place component 2 to the target position of the wafer.

It can be known from the above steps that in this embodiment, before the user wants to use the driving assembly 1 to move the wafer, the wafer status detection element 6 can first detect the relevant data of the wafer, such as the serial number and weight. , warpage, and thickness, and the wafer state detection element 6 takes an inspection machine that can detect the state of the wafer as an example, such as an optical inspection machine.

The wafer information recording component 4 will be connected to the wafer status detection component 6 to receive relevant data of the wafer (such as serial number, weight, warpage, and thickness), and send this relevant data to the suction status adjustment component 5 In the data processing element 51, the driving component 1 will drive the wafer pick-and-place component 2 to move to the wafer to be moved, and carry the wafer through the wafer pick-and-place component 2. At this time, the suction state is adjusted The suction volume adjustment component 52 in the component 5 will control the pressure and flow rate sucked by the suction component 3. Since the suction volume adjustment component 52 is one of the flow control valve or the pressure proportional valve, it can be controlled mechanically. method to quickly and accurately adjust the pressure and flow rate (for example, changing the flow rate of the suction element 3 through a flow control valve, or adjusting the suction pressure of the suction element 3 through a pressure proportional valve) to change the suction state of the wafer, that is, adjusting the suction state. The strength, and because this case uses a mechanical control method, it can also reduce the structural cost.

After that, the driving assembly 1 can drive the wafer to the required position, and during the movement, it can also move vertically through the lifting mechanism 11 in the driving assembly 1, and through the horizontal driving mechanism 12 To carry out horizontal movement to match various types of movement conditions, the lifting mechanism 11 uses a servo motor to drive the sleeve to expand and contract as an example, while the horizontal driving mechanism 12 uses multiple rotatable arms to interact with each other. Connect and drive rotation via servo motor as an example.

In this way, the user can use the relevant data of the wafer to let the suction state adjustment component 5 automatically adjust the pressure and flow rate of the suction element 3 to suit various types of wafers, such as when the wafer is thinner and heavier. When the wafer is light or the warpage is low, the pressure and flow rate are reduced to reduce the suction force to prevent damage to the surface of the wafer due to excessive force, or when the wafer is thicker and heavier , or when the warpage is high, increase the pressure and flow to enhance the suction force to prevent the wafer from falling or slipping due to insufficient suction force when moving.

Please also refer to the seventh figure, which is a perspective view of yet another preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is similar to the above-mentioned embodiment. Only in this embodiment , different types of driving components 1 will be used as examples to show that the form of the driving component 1 is not limited, and this driving component 1 also has a lower lifting mechanism 11 and a horizontal lifting mechanism 11 disposed on the lifting mechanism 11 . Driving mechanism 12.

Please also refer to the eighth figure, which is a perspective view of another preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is similar to the above-mentioned embodiment. Only in this embodiment, the crystal The wafer status detection component 6 is a LORD PORT machine that can place the wafer carrier, and the wafer information recording component 4 is provided outside the driving component 1 and is connected to the control host of the driving component 1, thereby indicating the wafer status detection The types of the component 6 and the wafer information recording component 4 are not limited.

However, the above descriptions are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, any simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be treated in the same way. It is included in the patent scope of the present invention and is hereby stated.

In summary, the wafer transport device and method for automatically adjusting pressure and flow of the present invention can indeed achieve its effect and purpose when used. Therefore, the present invention is an invention with excellent practicality and is in compliance with the invention patent. The application requirements are submitted in accordance with the law. We hope that the review committee will approve the invention as soon as possible to protect the inventor's hard work. If the review committee of the Jun Bureau has any doubts, please feel free to write a letter for instructions. The inventor will try his best to cooperate. .

1: Drive components

11:Lifting driving mechanism

12: Horizontal driving mechanism

2: Wafer pick and place components

3: Pick up components

4: Wafer information recording component

5: Absorption status adjustment component

51:Data processing components

52: Suction volume adjustment component

Claims (10)

A wafer transport device that automatically adjusts pressure and flow, which mainly includes: One driven component; A wafer pick-and-place component, the wafer pick-and-place component is provided on the driving component; A plurality of suction components, these suction components are provided on the wafer pick-and-place component and are used for suctioning wafers; A wafer information recording component, which is connected to the driving component for receiving and recording relevant data of the wafer; and A suction state adjustment component is connected to the driving component and is connected to the suction components and the wafer information recording component to control the suction status of the suction components through the relevant data of the wafer. For the wafer transport device that automatically adjusts pressure and flow rate as described in item 1 of the patent application, the suction state adjustment component has a data processing component and a suction volume adjustment component that is information-connected to the data processing component. For example, in the wafer transport device that automatically adjusts pressure and flow as described in item 2 of the patent application, the suction volume adjustment component is one of a flow control valve or a pressure proportional valve. For example, in the wafer transport device that automatically adjusts pressure and flow rate as described in item 1 of the patent application, the wafer information recording element is used to connect a wafer status detection element. For example, in the wafer transport device that automatically adjusts pressure and flow as described in item 1 of the patent application, the driving component has a lifting mechanism and a horizontal driving mechanism connected to the lifting mechanism. A wafer transportation method that automatically adjusts pressure and flow, the steps include: (a) Use a wafer information recording element in a driving assembly to receive wafer-related information; (b) The driving component drives a wafer pick-and-place component to move to the wafer; (c) The wafer information recording element allows a suction state adjustment component to adjust and control the suction states of a plurality of suction components through the relevant data of the wafer to absorb the wafer; and (d) The driving component drives the wafer pick-and-place component to the target position of the wafer. For the wafer transport method that automatically adjusts pressure and flow rate as described in item 6 of the patent application, the suction state adjustment component has a data processing component and a suction volume adjustment component that is information-connected to the data processing component. For example, in the wafer transport method for automatically adjusting pressure and flow described in item 7 of the patent application, the suction volume adjustment component is one of a flow control valve or a pressure proportional valve. For example, in the wafer transport method for automatically adjusting pressure and flow rate described in item 6 of the patent application, the wafer information recording element is used to connect a wafer status detection element. For example, in the wafer transportation method for automatically adjusting pressure and flow described in item 6 of the patent application, the driving component has a lifting mechanism and a horizontal driving mechanism connected to the lifting mechanism.

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